U.S. patent application number 12/496930 was filed with the patent office on 2010-01-14 for heat sink.
This patent application is currently assigned to Samsung Electronics Co., Ltd.. Invention is credited to Jae-Chan Lee, Hyun-Jong OH, Dong-Woo Shin, Jin-Kyu Yang, Chan-Hyung Yun.
Application Number | 20100006260 12/496930 |
Document ID | / |
Family ID | 41504067 |
Filed Date | 2010-01-14 |
United States Patent
Application |
20100006260 |
Kind Code |
A1 |
OH; Hyun-Jong ; et
al. |
January 14, 2010 |
HEAT SINK
Abstract
A heat sink includes a base plate and at least one elastic
plate. The base plate is connected to a heat generator such as a
semiconductor chip. One end portion of the elastic plate is
connected to the base plate and the elastic plate has a zigzag
structure to ensure desired elasticity. The elastic plate
dissipates the heat generated from the heat generator.
Inventors: |
OH; Hyun-Jong; (Seoul,
KR) ; Yun; Chan-Hyung; (Asan-si, KR) ; Shin;
Dong-Woo; (Cheonan-si, KR) ; Yang; Jin-Kyu;
(Seoul, KR) ; Lee; Jae-Chan; (Cheonan-si,
KR) |
Correspondence
Address: |
STANZIONE & KIM, LLP
919 18TH STREET, N.W., SUITE 440
WASHINGTON
DC
20006
US
|
Assignee: |
Samsung Electronics Co.,
Ltd.
Suwon-si
KR
|
Family ID: |
41504067 |
Appl. No.: |
12/496930 |
Filed: |
July 2, 2009 |
Current U.S.
Class: |
165/80.2 |
Current CPC
Class: |
H01L 23/4093 20130101;
H01L 23/3672 20130101; H01L 2924/0002 20130101; H01L 2924/0002
20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/80.2 |
International
Class: |
F28F 3/00 20060101
F28F003/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 11, 2008 |
KR |
2008-67409 |
Claims
1. A heat sink comprising: a base plate connected to a heat
generator; and at least one elastic plate to dissipate a heat
generated from the heat generator, the elastic plate including an
end portion connected to the base plate, and the elastic plate
having a zigzag structure.
2. The heat sink of claim 1, the hear generator includes at least
one semiconductor chip.
3. The heat sink of claim 1, wherein two elastic plates are
connected to end portions of the base plate, respectively.
4. The heat sink of claim 1, further comprising: at least one
supporting plate for connecting an end portion of the elastic plate
to the base plate.
5. The heat sink of claim 1, wherein the elastic plate includes a
bent portion having an angulated shape or a round shape.
6. The heat sink of claim 1, further comprising: at least one
incision groove between adjacent elastic plates.
7. The heat sink of claim 1, further comprising: a fixing member
for fixing the elastic plate to the heat generator.
8. The heat sink of claim 7, wherein the fixing member includes at
least one clip or at least one adhesion layer.
9-17. (canceled)
18. A heat sink comprising: a base plate connected to a
semiconductor chip; and one or more elastic plates extended from
the base plate, having a zigzag structure between end portions of
the base plate to dissipate a heat generated from the semiconductor
chip, and having elasticity in and between the plates to reduce a
force exerted on the elastic plates.
19. The heat sink of claim 18, further comprising: one or more
second elastic plates extending from the base plate and having a
zigzag structure between second end portions of the base plate to
dissipate a heat generated from the semiconductor chip, and having
elasticity in and between the plates to reduce a force exerted on
the elastic plates, wherein one of the one or more elastic plates
is connected to one of the end portions of the base plate, one of
the one or more elastic plates is connected to one of the second
end portions of the base plate, and the one or more elastic plates
and the one or more second elastic plates are spaced apart by a gap
formed between the other one of the end portions and the other one
of the second end portions of the base plate.
20. The heat sink of claim 18, wherein: the one or more elastic
plates comprises a first elastic plate connected to one of the end
portions of the base plate and disposed toward the other one of the
end portions of the base plate, a second elastic plate extended
from the first elastic plate at an angle with the first elastic
plate and disposed toward the one of the end portions of the base
plate, and a third elastic plate extended from the second elastic
plate at another angle with the second elastic plate and disposed
toward the other end of the end portions of the base plate; and the
first, the second, and the third elastic plates are disposed
between the gap and the one of the end portions of the base
plate.
21-22. (canceled)
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority under 35 USC .sctn.119 to
Korean Patent Application No. 2008-67409, filed on Jul. 11, 2008 in
the Korean Intellectual Property Office (KIPO), the contents of
which are herein incorporated by reference in their entirety.
BACKGROUND
[0002] 1. Field of the Invention
[0003] Example embodiments relate to a heat sink, a method of
manufacturing a heat sink and a memory module including a heat
sink. More particularly, example embodiments relate to a heat sink
to dissipate a heat generated from a heat generator, a method of
manufacturing the heat sink and a memory module including the heat
sink.
[0004] 2. Description of the Related Art
[0005] Generally, a memory module includes a printed circuit board,
a semiconductor chip provided on the printed circuit board and a
heat sink disposed on the semiconductor chip. The heat sink usually
has a fin-shaped structure. The weight of the memory module
increases because of the heat sink.
[0006] When the memory module falls on a ground, cracks may be
generated at a joining portion between the printed circuit board
and the semiconductor chip because the memory module has a
relatively high weight due to the heat sink. Thus, the memory
module may be easily damaged or broken.
[0007] Meanwhile, the fin-shaped heat sink usually has a relatively
low heat dissipating efficiency because this heat sink has a small
heat dissipating area although the fin-shaped heat sink has a
relatively large size. When the heat sink does not sufficiently
dissipate the heat generated from the semiconductor chip, the
temperature of the memory module may increase, thereby causing the
abnormal operation of the memory module.
SUMMARY
[0008] Example embodiments provide a heat sink for preventing
damage to a memory module including the heat sink while increasing
a heat dissipating efficiency thereof.
[0009] Example embodiments provide a method of manufacturing a heat
sink having an improved heat dissipating efficiency and preventing
damage to a memory module including the heat sink.
[0010] Example embodiments provide a memory module including a heat
sink having an improved heat dissipating efficiency and preventing
damage to the memory module.
[0011] Additional aspects and utilities of the present general
inventive concept will be set forth in part in the description
which follows and, in part, will be obvious from the description,
or may be learned by practice of the general inventive concept
[0012] According to the foregoing and other aspects and utilities
of the present general inventive concept, there is provided a heat
sink including a base plate and at least one elastic plate. The
base plate may be connected to a heat generator. The elastic plate
may dissipate the heat generated from the heat generator and
transmitted through the base plate. One end portion of the elastic
plate may be connected to the base plate. The elastic plate may
have a zigzag shape to ensure desired elasticity.
[0013] The heat generator may include at least one semiconductor
chip.
[0014] Two elastic plates may be connected to end portions of the
base plate, respectively.
[0015] The heat sink may further include at least one supporting
plate for connecting an end portion of the elastic plate with the
base plate.
[0016] The elastic plate may include a bent portion having an
angulated shape or a round shape.
[0017] At least one incision groove may be provided between
adjacent elastic plates.
[0018] A fixing member may be provided to fix the elastic plate
with the heat generator. The fixing member may include at least one
clip or at least one adhesion layer.
[0019] According to the foregoing and other aspects and utilities
of the present general inventive concept, there may also be
provided a method of manufacturing a heat sink. In the method of
manufacturing the heat sink, a flat plate is prepared. A base plate
and at least one elastic plate may be formed by bending the flat
plate. The base plate may be connected to a heat generator. The
elastic plate may dissipate the heat generated from the heat
generator and transmitted through the base plate. One end portion
of the elastic plate may be connected to the base plate. The
elastic plate may have a zigzag structure.
[0020] Two elastic plates may be connected to end portions of the
base plate, respectively.
[0021] At least one supporting plate may be additionally formed to
connecting an end portion of the elastic plates with the base
plate.
[0022] At least one incision groove may be formed between adjacent
elastic plates.
[0023] According to the foregoing and/or other aspects and
utilities of the present general inventive concept, there may also
be provided a memory module. The memory module includes a printed
circuit board, at least one semiconductor chip, a heat sink and a
fixing member. The printed circuit board may include a connecting
pin. The semiconductor chips may be provided on the printed circuit
board and may be electrically connected to the printed circuit
board. The heat sink may include a base plate and at least one
elastic plate. The base plate may cover the semiconductor chip and
the elastic plate may dissipate the heat generated from the
semiconductor chip and transferred through the base plate. One end
portion of the elastic plate may be connected to the base plate.
The elastic plate may have a zigzag shape to ensure elasticity. The
fixing member may fix the heat sink to the semiconductor chip.
[0024] The fixing member may include at least one clip for fixing
the heat sink with the semiconductor chip.
[0025] The fixing member may include at least one adhesion layer
provided between the semiconductor chip and the heat sink.
[0026] The memory module may further include at least one
supporting plate for connecting an end portion of the elastic plate
to the base plate.
[0027] The heat sink may include the base plate and the at least
one elastic plate having the zigzag structure. When the memory
module includes the heat sink, the elastic plate of the heal sink
may relieve external impact to prevent the memory module from being
damaged. Further, the heat sink includes the elastic plate ensuring
a large heat dissipating area, so that the heat sink may have a
high heat dissipating efficiency. Accordingly, the malfunction of
the memory module due to the increase of temperature may be
prevented. Additionally, the base plate and the elastic plate may
be simultaneously formed by bending the flat plate, so that a
productivity of the heat sink may be enhanced. Furthermore, the
memory module including the heat sink may have relatively small
dimensions because the heat sink may have a considerably reduced
height.
[0028] According to still another aspect the foregoing and/or other
aspects and utilities of example embodiments the present general
inventive concept, there is may also be provided a heat sink
including a base plate to be connected to a semiconductor chip, and
one or more elastic plates extending from the base plate, having a
zigzag structure between end portions of the base plate to
dissipate heat generated from the semiconductor chip, and having
elasticity in and between the plates to reduce a force exerted on
the elastic plates.
[0029] The heat sink may further include one or more second elastic
plates extending from the base plate and having a zigzag structure
between second end portions of the base plate to dissipate heat
generated from the semiconductor chip and having elasticity in and
between the plates to reduce a force exerted on the elastic plates.
One of the one or more elastic plates may be connected to one of
the end portions of the base plate, one of the one or more elastic
plates may be connected to one of the second end portions of the
base plate, and the one or more elastic plates, and the one or more
second elastic plates may be spaced apart by a gap formed between
the other one of the end portions and the other one of the second
end portions of the base plate.
[0030] The one or more elastic plates may include a first elastic
plate connected to one of the end portions of the base plate and
disposed toward the other one of the end portions of the base
plate, a second elastic plate extended from the first elastic plate
at an angle with the first elastic plate and disposed toward the
one of the end portions of the base plate, and a third elastic
plate extending from the second elastic plate at another angle with
the second elastic plate and disposed toward the other end of the
end portions of the base plate. The first, the second, and the
third elastic plates may be disposed between the gap and the one of
the end portions of the base plate.
[0031] According to still another aspect the foregoing and/or other
aspects and utilities of example embodiments the present general
inventive concept, there is may also be provided a memory module
including a printed circuit a board, at least one semiconductor
chip disposed on the printed circuit board, a heat sink having a
base plate disposed to receive the heat from the at least one
semiconductor chip, and one or more elastic plates extended from
the base plate, having a zigzag structure between end portions of
the base plate to dissipate a heat generated from the semiconductor
chip, and having elasticity in and between the plates to reduce a
force exerted on the elastic plates, and a fixing member to fix the
heat sink with the semiconductor chip.
[0032] According to still another aspect the foregoing and/or other
aspects and utilities of example embodiments the present general
inventive concept, there is may also be provided an electronic
apparatus including a main board, and a memory module having a
printed circuit board connected to the main board, at least one
semiconductor chip disposed on the printed circuit board, a heat
sink including a base plate connected to the semiconductor chip,
and at least one elastic plate extending from the base plate,
having a zigzag structure between end portions of the base plate to
dissipate a heat generated from the semiconductor chip, and having
elasticity in and between the plates to reduce a force exerted on
the elastic plates, and a fixing member to fix the heat sink with
the semiconductor chip.
BRIEF DESCRIPTION OF THE DRAWINGS
[0033] These and/or other aspects and utilities of the present
general inventive concept will become apparent and more readily
appreciated from the following description of the embodiments,
taken in conjunction with the accompanying drawings of which:
[0034] FIG. 1 is a perspective view illustrating a memory module
according to an embodiment of the present general inventive
concept;
[0035] FIG. 2 is a cross-sectional view taken along a line of I-II
in FIG. 1;
[0036] FIG. 3 is a flow chart illustrating a method of
manufacturing a heat sink according to an embodiment of the present
general inventive concept;
[0037] FIGS. 4 to 6 are side views illustrating heat sinks
according to an embodiment of the present general inventive
concept;
[0038] FIG. 7 is a flow chart illustrating a method of
manufacturing a heat sink according to an embodiment of the present
general inventive concept;
[0039] FIG. 8 is a perspective view illustrating a memory module
according to an embodiment of the present general inventive
concept;
[0040] FIG. 9 is a cross-sectional view taken along a line of
III-IV in FIG. 8;
[0041] FIG. 10 is a flow chart illustrating a method of
manufacturing a heat sink according to an embodiment of the present
general inventive concept; and
[0042] FIG. 11 is a view illustrating a method of manufacturing a
heat sink according to an embodiment of the present general
inventive concept.
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0043] Example embodiments are described more fully hereinafter
with reference to the accompanying drawings, in which example
embodiments are illustrated. The general inventive concept may,
however, be embodied in many different forms and should not be
construed as limited to the example embodiments set forth herein.
Rather, these example embodiments are provided so that this
disclosure will be thorough and complete, and will fully convey the
scope of the general inventive concept to those skilled in the art.
In the drawings, the sizes and relative sizes of layers and regions
may be exaggerated for clarity.
[0044] Reference will now be made in detail to the embodiments of
the present general inventive concept, examples of which are
illustrated in the accompanying drawings, wherein like reference
numerals refer to the like elements throughout. The embodiments are
described below in order to explain the present general inventive
concept by referring to the figures.
[0045] It will be understood that when an element or layer is
referred to as being "on," "connected to" or "coupled to" another
element or layer, it may be directly on, connected or coupled to
the other element or layer or intervening elements or layers may be
present. In contrast, when an element is referred to as being
"directly on," "directly connected to" or "directly coupled to"
another element or layer, there are no intervening elements or
layers present. Like reference numerals may refer to like elements
throughout. As used herein, the term "and/or" includes any and all
combinations of one or more of the associated listed items.
[0046] It will be understood that, although the terms first,
second, third etc. may be used herein to describe various elements,
components, regions, layers and/or sections, these elements,
components, regions, layers and/or sections should not be limited
by these terms. These terms are only used to distinguish one
element, component, region, layer or section from another region,
layer or section. Thus, a first element, component, region, layer
or section discussed below could be termed a second element,
component, region, layer or section without departing from the
teachings of the invention.
[0047] Spatially relative terms, such as "beneath," "below,"
"lower," "above," "upper" and the like, may be used herein for ease
of description to describe one element or feature's relationship to
another element(s) or feature(s) as illustrated in the figures. It
will be understood that the spatially relative terms are intended
to encompass different orientations of the device in use or
operation in addition to the orientation depicted in the figures.
For example, if the device in the figures is turned over, elements
described as "below" or "beneath" other elements or features would
then be oriented "above" the other elements or features. Thus, the
exemplary term "below" may encompass both an orientation of above
and below. The device may be otherwise oriented (rotated 90 degrees
or at other orientations) and the spatially relative descriptors
used herein interpreted accordingly.
[0048] The terminology used herein is for the purpose of describing
particular example embodiments only and is not intended to be
limiting of the invention. As used herein, the singular forms "a,"
"an" and "the" are intended to include the plural forms as well,
unless the context clearly indicates otherwise. It will be further
understood that the terms "comprises" and/or "comprising," when
used in this specification, specify the presence of stated
features, integers, steps, operations, elements, and/or components,
but do not preclude the presence or addition of one or more other
features, integers, steps, operations, elements, components, and/or
groups thereof.
[0049] Unless otherwise defined, all terms (including technical and
scientific terms) used herein have the same meaning as commonly
understood by one of ordinary skill in the art to which this
invention belongs. It will be further understood that terms, such
as those defined in commonly used dictionaries, should be
interpreted as having a meaning that is consistent with their
meaning in the context of the relevant art and will not be
interpreted in an idealized or overly formal sense unless expressly
so defined herein.
[0050] FIG. 1 is a perspective view illustrating a memory module
100 according to an embodiment of the present general inventive
concept and FIG. 2 is a cross-sectional view taken along a line of
I-II in FIG. 1.
[0051] Referring to FIGS. 1 and 2, the memory module 100 includes a
printed circuit board 110, a semiconductor chip 120, a connecting
member 130, a heat sink 140 and a fixing member 150.
[0052] The printed circuit board 110 includes a connecting pin 112
and a socket latch connecting portion 114. The connecting pin 112
may be provided at one peripheral portion of the printed circuit
board 110. For example, the connecting pin 112 may be disposed on
one side of the printed circuit board 110. The connecting pin 112
may be electrically connected to a RAM bank 191 on a main board 190
of an electronic apparatus 200. In example embodiments, the
connecting pin 112 may include various kinds of controlling pins,
address pins, data pins, power pins, etc. The main board 190 of the
electronic apparatus 200 may include a circuit to communicate with
the one or more semiconductor chips 120 through the connecting pin
112 and the RAM bank 191. The electronic apparatus 200 may have one
or more units to perform its function using data stored in the
semiconductor chip 120. The memory module 100 may be installed in
an inside of the electronic apparatus 200 or may be installed on a
housing of the electronic apparatus 200 to be connected to the main
board 190. The electronic apparatus 200 may be a computer system, a
portable electronic apparatus, a mobile communication apparatus,
etc. Since the electronic apparatus 200 is well known, detailed
descriptions thereof will be omitted.
[0053] The socket latch connecting portion 114 may be coupled to a
connector 192 of the main board 190 to prevent the printed circuit
board 110 including the connecting pins 112 from being separated
from the main board. That is, the socket latch connecting portion
114 may prevent the separation of the printed circuit board 110
relative to the main board having the RAM bank. The socket latch
connecting portion 114 may have a hemi circular shape, an
elliptical shape, a circular shape, etc., to correspond to the
connector 192. The connector 192 may be formed on a housing of the
electronic apparatus 200 such the connector 192 and the socket
latch connecting portion 114 may be connected when the memory
module 100 is installed to the main board 190 in the electronic
apparatus 200.
[0054] In example embodiments, at least one semiconductor chip 120
may be provided on the printed circuit board 110. For example, one
semiconductor chip 120 may be located on one surface of the printed
circuit board 110. Alternatively, two semiconductor chips 120 may
be disposed on both surfaces of the printed circuit board 120. For
example, a first semiconductor chip may be positioned on a first
surface of the printed circuit board 120 and a second semiconductor
chip may be disposed on a second surface of the printed circuit
board 120. Here, the first surface may be disposed opposite to the
second surface with respect to the printed circuit board 110, so
that the first semiconductor chip may correspond to the second
semiconductor chip. Further, more than two semiconductor chips may
be provided on one surface of the printed circuit board 110 or both
surfaces of the printed circuit board 110.
[0055] The connecting member 130 is disposed between the
semiconductor chip 120 and the printed circuit board 110. The
connecting member 130 may electrically connect the semiconductor
chip 120 to the printed circuit board 110. In example embodiments,
the connecting member 130 may include a solder ball, a conductive
bump, or the like. When two semiconductor chips are positioned on
both faces of the printed circuit board 110, two connecting members
may be positioned between the semiconductor chips and both faces of
the printed circuit board 110, respectively as illustrated in FIG.
2.
[0056] The heat sink 140 is disposed on the printed circuit board
120 to cover the semiconductor chip 120. For example, when the
semiconductor chip 120 is provided on the first surface of the
printed circuit board 110, the heat sink 140 may also be disposed
on the first surface of the printed circuit board 110 on which the
semiconductor chip 120 is positioned. Alternatively, more than two
heat sinks 140 may be disposed on both faces of the printed circuit
board 110 when more than two semiconductor chips are installed on
both faces of the printed circuit board 110. The heat sink 140 may
dissipate the heat generated from the semiconductor chip 120 toward
an outside.
[0057] In example embodiments, the heat sink 140 includes a base
plate 142 and an elastic plate 144. The base plate 142 is disposed
on the printed circuit board 110 to make contact with the
semiconductor chip 120. One end of the elastic plate 144 may be
connected to an end portion of the base plate 142. For example, the
elastic plate 144 may be integrally formed with the base plate 142.
Alternatively, two elastic plates 144-1 and 144-2 may be connected
to both end portions of the base plate 142, respectively. Here, the
heat sink 140 may be obtained by bending one flat plate to form the
base plate 142 and the elastic plates 144 as illustrated in FIG.
11. In other words, the base plate 142 and the elastic plates 144
may be integrally formed from one flat plate. Meanwhile, the
elastic plates 144-1 and 144-2 may be attached to the base plate
142 by a welding process, a brazing process, a molding process,
etc.
[0058] The elastic plate 144 may include a middle elastic portion
144e1 and an end elastic portion 144e2 disposed in a Z direction,
and may also include a first portion 144-1 and a second portion
144-2 disposed in a Y direction. A gap 114g may be formed between
the first portion 144-1 and the second portion 144-2 in the Y
direction and may be formed in an X direction. The first portion
144-1 and the second portion 144-2 may be spaced apart from each
other by a distance corresponding to the gap 114g such that a
portion of the fixing member 150 may be inserted into the heat sink
140 through the gap 144g. The portion of the fixing member 150 may
not contact the elastic plate 144. However, the present general
inventive concept is not limited thereto. It is possible that a
portion of fixing member 150 may contact a portion of the heat
sink. In this case, heat transfer from the heat sink 140 to the
fixing member 150 may be a minimum value not to affect a connecting
force of the fixing member 150.
[0059] The elastic plates 144e1 and 144e2 may have a plurality of
plates connected to have a zigzag structure as illustrated in FIGS.
1 and 2. The plurality of plates are elastic so that elastic
characteristic of the plates may also absorb the external force
exerted on the heat sink 140. The plates may have an angle in the X
direction between the adjacent plates. When an external force is
exerted to the heat sink 140, the angles between the plates are
decreased to absorb the external force.
[0060] In some example embodiments, a plurality of elastic plates
may be disposed on the base plate 142. For example, more than two
elastic plates may be provided on the base plate 142. Here, the
elastic plates may be connected to end portions of the base plate
142 as illustrated in FIGS. 1 and 2. Alternatively, more than three
elastic plates may be positioned on the base plate 142. Further,
the elastic plates may be connected to each other. The elastic
plates may be directly connected to the base plate 142 through a
molding process, a welding process, a brazing process or the like
process.
[0061] In example embodiments, the elastic plate 144 may have a
zigzag structure. For example, two elastic plates may be formed by
bending the flat plate in opposite directions at least two times as
illustrated in FIG. 11. The elastic plate 144 may include at least
one bent portion having an angulated shape so that a cross section
of the elastic plate 144 may substantially give a shape of Z. Thus,
the elastic plate 144 may ensure an elastic structure. With such an
elastic structure, the elastic plate 144 may absorb an external
impact (external force) applied to the memory module 100.
Therefore, damage to the connecting member 130 connecting the
printed circuit board 110 to the semiconductor chip 120 caused by
the external impact may be effectively reduced.
[0062] The elastic plate 144 may have a relatively large surface
area. Accordingly, the heat transferred from the semiconductor chip
120 to the base plate 142 may be effectively dissipated through the
elastic plate 144. In addition, the temperature of the
semiconductor chip 120 may be maintained to a desirable degree, so
that the memory module 100 having the semiconductor chip 120 may
properly operate.
[0063] In example embodiments, the heat sink 140 may include a
material having thermal conductivity. Examples of the material in
the heat sink 140 may include metal or plastic. For example, the
heat sink 140 may include metal such as copper (Cu), aluminum (Al),
platinum (Pt), etc.
[0064] The base plate 142 of the heat sink 140 may have a surface
area in a plane disposed on the X and Y directions to contact a
surface area of the semiconductor chip 120. The surface area of the
base plate 132 may be larger than the surface area of the
semiconductor chip 120 as illustrated in FIGS. 1 and 2.
[0065] Referring to FIGS. 1 and 2, the fixing member 150 fixes the
heat sink 140 to the printed circuit board 110 so that the heat
sink 140 makes contact with the semiconductor chip 120 on the
printed circuit board 110. In example embodiments, the fixing
member 150 may include at least one clip. The clip may fix the heat
sink 140 to the printed circuit board 110 by means of its
elasticity. For example, the clip of the fixing member 150 may be
bent to make contact with the base plate 142 of the heat sink 140,
such that the heat sink 140 may be firmly connected to the
semiconductor chip 120. In some example embodiments, the fixing
member 150 may include an adhesion layer. This adhesion layer may
be disposed between the semiconductor chip 120 and the base plate
142 of the heat sink 140. When two semiconductor chips are disposed
on both faces of the printed circuit board 110, the fixing member
150 may include two clips for fixing two semiconductor chips to the
printed circuit board 110, respectively.
[0066] The fixing member 150 may include a first portion 150a
disposed in the Z direction, one or more second portions 150b
extended from the first portion 150a in the Y direction, a third
portion 150c extended from the corresponding second portions 150b
in the Z direction to be inserted in the gap between the elastic
plates 144-1 and 144-2, and a fourth portion 150d formed on the
third portion 150c to press the base plate 142 toward the
semiconductor chip 120. The fourth portion 150d may be a distal end
and may be extended along the base plate to increase a connect
surface to provide a connection force to the base plate 142 and the
semiconductor chip 120. The fixing member 150 may include a
plurality of fixing member disposed in the X direction along the
memory module 100. The fixing member 150 may have an opening 150
open formed thereon to expose a portion of the heat sink 144 when
the fixing member 150 is disposed to cover at least a portion of
the heat sink 144 to connect the heat sink 144 to the semiconductor
chip 120 and/or the printed circuit board 110.
[0067] Before the fixing member 150 is inserted into the gap 144g,
the fourth portions 150d may be spaced apart from each other by a
first distance. When the fixing member 150 is inserted into the gap
144e and contacts the base plate 142, the fourth portions 150d may
be spaced apart from each other by a second distance longer than
the first distance to apply a connecting force to the base plate
142 and the semiconductor chip 120.
[0068] The third portion 150c of the fixing member 150 may have a
length to corresponding to a height of the elastic plate 144 from
the base plate 142. The second portion 150b of the fixing member
150 may have a portion to cover at least a portion of the elastic
plate 144. The second portion 150b of the fixing member 150 may
also have a portion formed with an opening to expose a large area
of the elastic plate 144 to increase a dissipation area and
efficiency of the heat sink 140.
[0069] When the heat sink 140 has elasticity, impact applied to the
heat sink 140 may be effectively absorbed even though the memory
module 100 falls on a ground. Accordingly, the memory module 100
may be efficiently prevented from being broken or damaged, and the
reliability of the memory module 100 may be improved by the heat
sink 140 having at least one elastic plate 144.
[0070] FIG. 3 is a flow chart illustrating a method of
manufacturing a heat sink according to an embodiment of the present
general inventive concept. The method illustrated in FIG. 3 may
provide a heat sink having a construction (structure) substantially
same as or substantially similar to that of the heat sink 140
illustrated in FIGS. 1 and 2.
[0071] Referring to FIG. 3, a flat plate including a material
having thermal conductivity is prepared in operation S110. The flat
plate may include plastic or metal such as copper, aluminum,
platinum, etc. Further, the flat plate may ensure desired
elasticity for at least one elastic plate.
[0072] In operation S120, the flat plate is bent to from a heat
sink. For example, the flat plate may be bent by a press process
using a mold. While bending the flat plate, the flat plate may be
transformed to the heat sink that includes a base plate and at
least one elastic plate integrally formed with the base plate. When
the heat sink is formed by bending one flat plate, the at least one
elastic plate may be connected to an end portion of the base
plate.
[0073] The base plate may be connected to a heat generator such as
a semiconductor chip in a memory module. The elastic plate may have
a zigzag shape and may provide required elasticity. A bent portion
of the elastic plate may have an angulated shape. Therefore, a
cross section of the elastic plate may have a shape of Z. The
elastic plate may prevent, reduce and/or absorb impact applied to
the memory module. Additionally, the heat sink including the
elastic plate may outwardly dissipate the heat transferred from the
semiconductor chip to the base plate.
[0074] According to example embodiments, the base plate and the
elastic plate may be simultaneously formed through bending one flat
plate as a single monolithic body or a single integrated body.
Accordingly, a time required for forming the heat sink may be
reduced and a productivity of the heat sink may be improved.
[0075] FIG. 4 is a side view illustrating a heat sink according to
an embodiment of the present general inventive concept.
[0076] Referring to FIG. 4, a heat sink 240 includes a base plate
242 and two elastic plates 244. The elastic plates 244 are
prolonged from end portions of the base plate 242,
respectively.
[0077] The base plate 242 and the elastic plates 244 may have
constructions (structure) and functions substantially same as or
substantially similar to those of the base plate 142 and the
elastic plate 144 illustrated in FIGS. 1 and 2. However, bent
portions of the elastic plates 244 may have round shapes and the
elastic plates 244 may have S-shaped cross sections. Further, a
method of manufacturing the heat sink 240 may be substantially the
same as or substantially similar to the method of manufacturing the
heat sink 140 described with reference to FIG. 3. Each of the
elastic plates 244 may include at least a bent portion having a
round shape and a cross section having a shape of S.
[0078] FIG. 5 is a side view illustrating a heat sink 340 according
to an embodiment of the present general inventive concept.
[0079] Referring to FIG. 5, a heat sink 340 includes a base plate
structure 342 and an elastic plate structure 344. The base plate
structure 342 includes a first base plate 342a and a second base
plate 342b. The elastic plate structure 344 includes a first
elastic plate 344a, a second elastic plate 344b, and a third
elastic plate 344c.
[0080] The first base plate 342a and the second base plate 342b are
disposed to be spaced apart from each other by a predetermined
distance. Each of the first and the second base plates 342a and
342b may make contact with a heat generator such as a semiconductor
chip of a memory module.
[0081] In example embodiments, the first elastic plate 344a may
connect the first base plate 342a to the second base plate 342b.
For example, one end portion of the first elastic plate 344a may be
connected to one end portion of the first base plate 342a and the
other end portion of the first elastic plate 344a may be connected
to one end portion of the second base plate 342b adjacent to the
end portion of the first base plate 342a. Additionally, the second
elastic plate 344b may be connected to the other end portion of the
first base plate 342a and the third elastic plate 344c may be
connected to the other end portion of the second base plate
342b.
[0082] The heat sink 340 illustrated in FIG. 5 may be formed by
bending one flat plate to form the first base plate 342a, the
second base plate 342b, the first elastic plate 344a, the second
elastic plate 344b and the third elastic plate 344c. For example,
the first to the third elastic plates 344a, 344b and 344c may be
integrally formed with the first and the second base plates 342a
and 342b by coupling the first to the third elastic plates 344a,
344b and 344c to the first and the second base plates 342a and
342b.
[0083] The base plate structure 342 and the elastic plate structure
344 may have constructions (structure) and functions substantially
same as or substantially similar to those of the base plate 142 and
the elastic plate 144 illustrated in FIGS. 1 and 2. Additionally, a
method of manufacturing the heat sink 340 may be substantially the
same as or substantially similar to the method of manufacturing the
heat sink 140 described with reference FIG. 3. However, one end
portion of the first elastic plate 344a may be connected to a first
end portion of the first base plate 342a, and the other end portion
of the first elastic plate 344a may be connected to a first end
portion of the second base plate 342b. Further, the second elastic
plate 344b may be connected to a second end portion of the first
base plate 342a and the third elastic plate 344c may be connected
to a second end portion of the second base plate 342b.
[0084] Since the first elastic plate 344a is spaced apart from the
second elastic plate 344b and the third elastic plate 344c by a
first gap and a second gap, the fixing member 150 of FIGS. 1 and 2
may have one or more third portions 150c extended from one or more
portions of the second portion 150b to be inserted into the
corresponding first and second gaps to push the corresponding base
plates 342a and 342b. It is also possible that the third portion
150c may be inserted into one of the first gap and the second gap
to correspond to one of the first and second base plates 342a and
342b.
[0085] FIG. 6 is a side view illustrating a heat sink 440 according
to an embodiment of the present general inventive concept.
[0086] Referring to FIG. 6, the heat sink 440 includes a base plate
442, elastic plates 444 and supporting plates 446. The supporting
plates 446 may make contact with the base plate 442 and the elastic
plates 444 may extend from end portions of the base plate 442.
[0087] The base plate 442 and the elastic plates 444 may have
constructions (structure) and functions substantially the same as
or substantially similar to those of the base plate 142 and the
elastic plate 144 described with reference to FIGS. 1 and 2.
[0088] The supporting plates 446 include a first portion extended
from the elastic plates 444 and a second portion connected to the
base plate 442. For example, the supporting plates 446 may be
prolonged from the end portions of the elastic plates 444 and may
be connected to the base plate 442, respectively. The supporting
plates 446 may have a length to corresponding to a height of the
elastic plates 444 with respect to the base plate 442. Since the
supporting plates 446 support the elastic plates 444, the heat sink
440 may have proper elasticity while improving the intensity of the
heat sink 440. Therefore, the heat sink 440 is prevented from being
broken or damaged by external impact (force).
[0089] FIG. 7 is a flow chart illustrating a method of
manufacturing a heat sink according to an embodiment of the present
general inventive concept. The method illustrated in FIG. 7 may
provide a heat sink having a construction (structure) substantially
same as or substantially similar to that of the heat sink 440
described with reference to FIG. 6.
[0090] Referring to FIG. 7, after a flat plate is prepared in
operation S410, the flat plate is bent by a press process using a
mold to form a heat sink including a base plate and elastic plates
connected to the base plate in operation S420.
[0091] The processes for forming the flat plate, the base plate and
the elastic plates may be substantially the same as or
substantially similar to the processes for forming the flat plate,
the base plate and the elastic plate described with reference to
FIG. 3.
[0092] Supporting plates for connecting end portions of the elastic
plates to the base plate are formed in operation S430. In example
embodiments, the supporting plates may be obtained by bending end
portions of the elastic plates and then fixing the end portions to
the base plate. In accordance with some example embodiment, the
supporting plates may be obtained by fixing an additional flat
plate to the end portions of the elastic plates and the base plate.
The supporting plates may be connected to the elastic plates and
the base plate by a welding process or using an adhesive agent.
[0093] When the supporting plates support the elastic plates, the
heat sink including the supporting plates may have sufficient
elasticity and improved structural stability. Thus, a memory module
including the heat sink may effectively dissipate the heat
generated from a semiconductor chip and may sufficiently endure
external impact.
[0094] FIG. 8 is a perspective view illustrating a memory module
500 according to an embodiment of the present general inventive
concept and FIG. 9 is a cross-sectional view taken along a line of
III-IV in FIG. 8.
[0095] Referring to FIGS. 8 and 9, the memory module 500 includes a
printed circuit board 510, one or more semiconductor chips 520, a
connecting member 530, a heat sink 540 and a fixing member 550.
[0096] In example embodiments, the printed circuit board 510, the
semiconductor chip 520 and the connecting member 530 may have
constructions (structure) and functions substantially same as or
substantially similar to those of the printed circuit board 110,
the semiconductor chip 120 and the connecting member 130 described
with reference to FIGS. 1 and 2. Additionally, the heat sink 540
and the fixing member 550 may also have functions and constructions
(structure) substantially same as or substantially similar to those
of the heat sink 140 and the fixing member 150 with reference to
FIGS. 1 and 2. However, the heat sink 540 includes one or more
incision grooves 546 (546a and 546b) spaced apart from each other
in an X direction by a predetermined distance. The incision grooves
546 are positioned between adjacent elastic plates. The incision
grooves 546 may expose an upper surface of a base plate 542 of the
heat sink 540. When the fixing member 550 has at least one clip,
the clip may fix the base plate 542 to an exposed portion of the
base plate 542 and/or the printed circuit board 510 by the incision
groove 546.
[0097] The heat sink includes elastic plates 544 (544-1 and 544-2),
and the incision grooves 546 may be formed in at least one of the
elastic plates 544. At least a portion of the at least one elastic
plate 544 may be cut out in the X, the Y, and/or the Z directions
to form the incision grooves 546 to expose corresponding portions
of the base plate 542. Although FIG. 8 illustrates two cut out
portions to correspond to the incision grooves in the heat sink
540. The present general inventive concept is not limited thereto.
It is possible that one cutout portion may be made to form an
incision groove, and it is also possible that more than two cutout
portions may be made to form three incision grooves.
[0098] The fixing member 550 may have similar structure to fixing
member 150 of FIGS. 1 and 2. The second portion 150b, third portion
150c, and the fourth potion 150d of the fixing member 150 may be
inserted into the corresponding incision grooves 546 to provide a
fixing force (connecting force) to the base plate 542 and the
semiconductor chips or the printed circuit board 510. The fixing
member 550 may not have the third portion 150c and the fourth
portion 150d, but have the first portion 150a and the second
portion 150b. In this case, the second portion 150b of the fixing
member 550 is inserted into the incision grooves 546 to support the
base plate 542 with respect to the semiconductor chips 520 and the
printed circuit board 510.
[0099] FIG. 10 is a flow chart illustrating a method of
manufacturing a heat sink according to an embodiment of the present
general inventive concept. The method illustrated in FIG. 10 may
provide a heat sink having constructions (structure) substantially
same as or substantially similar to those of the heat sink 540
described with reference to FIG. 9.
[0100] Referring to FIG. 10, a flat plate is prepared in operation
S510, and then a heat sink including a base plate and elastic
plates connected to the base plate is formed by bending the flat
plate through a press process using a molding in operation
S520.
[0101] The processes for preparing the flat plate and for forming
the base plate and the elastic plates may be substantially the same
as or substantially similar to the processes for preparing the flat
plate and for forming the base plate 142 and the elastic plate
described with reference to FIG. 3.
[0102] Portions of the elastic plate are removed by predetermined
distances to form incision grooves between adjacent elastic plates
in operation S530. The incision grooves may be formed by a cutting
process. The incision grooves 546 may provide spaces for screw
combining for at least one clip of a fixing member which fixes the
heat sink to a printed circuit board in a memory module. When the
clip includes a screw combined through the incision groove, the
heat sink may firmly fix a semiconductor chip to the printed
circuit board.
[0103] After forming the incision grooves or before forming the
incision grooves, at least one supporting plate (not illustrated)
for connecting end portions of the elastic plates to the base plate
may be additionally formed. Further, the process for forming the
incision grooves may be omitted when the heat sink fixes the
semiconductor chip to the printed circuit board using an adhesive
layer.
[0104] According to example embodiments, a heat sink may include a
base plate and at least one elastic plate having a zigzag
structure. When a memory module includes the heat sink, the elastic
plate of the heal sink may relieve external impact to prevent the
memory module from being damaged. Further, the heat sink includes
the elastic plate ensuring a large heat dissipating area, so that
the heat sink may have a high heat dissipating efficiency.
Accordingly, the malfunction of the memory module due to the
increase of temperature may be prevented. Additionally, the base
plate and the elastic plate may be simultaneously formed by bending
a flat plate, so that a productivity of the heat sink may be
enhanced. Furthermore, the memory module including the heat sink
may have relatively small dimensions because the heat sink may have
a considerably reduced height.
[0105] The foregoing is illustrative of example embodiments and is
not to be construed as limiting thereof. Although a few example
embodiments have been described, those skilled in the art will
readily appreciate that many modifications are possible in example
embodiments without materially departing from the novel teachings
and advantages of the present general inventive concept.
Accordingly, all such modifications are intended to be included
within the scope of the general inventive concept as defined in the
claims. In the claims, means-plus-function clauses are intended to
cover the structures described herein as performing the recited
function and not only structural equivalents but also equivalent
structures. Therefore, it is to be understood that the foregoing is
illustrative of example embodiments and is not to be construed as
limited to the specific example embodiments disclosed, and that
modifications to the disclosed example embodiments, as well as
other example embodiments, are intended to be included within the
scope of the appended claims. The present general inventive concept
is defined by the following claims, with equivalents of the claims
to be included therein. Although a few embodiments of the present
general inventive concept have been shown and described, it will be
appreciated by those skilled in the art that changes may be made in
these embodiments without departing from the principles and spirit
of the general inventive concept, the scope of which is defined in
the appended claims and their equivalents.
* * * * *