U.S. patent application number 12/282278 was filed with the patent office on 2010-01-14 for device for cooling, in particular, electronic components.
Invention is credited to Steffen Grozinger, Henry Madsen, Henrik Olsen, Volker Velte.
Application Number | 20100005832 12/282278 |
Document ID | / |
Family ID | 38197979 |
Filed Date | 2010-01-14 |
United States Patent
Application |
20100005832 |
Kind Code |
A1 |
Grozinger; Steffen ; et
al. |
January 14, 2010 |
DEVICE FOR COOLING, IN PARTICULAR, ELECTRONIC COMPONENTS
Abstract
A device for cooling, in particular for cooling electronic
components, in particular a processor unit, having an evaporator
for absorbing heat in a coolant, in particular through evaporation,
having a gas cooler for cooling the coolant, in particular through
condensation, having a first coolant conduit for the communicating
connection of an evaporator outlet to a gas cooler inlet, and
having a second coolant conduit for the communicating connection of
a gas cooler outlet to an evaporator inlet, the first coolant
conduit is plugged onto the evaporator outlet and/or is plugged
into the gas cooler inlet with an excess length, and in that the
second coolant conduit is plugged onto the gas cooler outlet and/or
is plugged into the evaporator inlet with an excess length.
Inventors: |
Grozinger; Steffen;
(Vaihingen, DE) ; Velte; Volker; (Otisheim,
DE) ; Madsen; Henry; (Allerod, DK) ; Olsen;
Henrik; (Fredensborg, DK) |
Correspondence
Address: |
GREER, BURNS & CRAIN
300 S WACKER DR, 25TH FLOOR
CHICAGO
IL
60606
US
|
Family ID: |
38197979 |
Appl. No.: |
12/282278 |
Filed: |
March 8, 2007 |
PCT Filed: |
March 8, 2007 |
PCT NO: |
PCT/EP2007/002022 |
371 Date: |
May 28, 2009 |
Current U.S.
Class: |
62/515 |
Current CPC
Class: |
H01L 2924/0002 20130101;
F28D 15/0266 20130101; F28D 15/0275 20130101; H01L 23/467 20130101;
H01L 2924/0002 20130101; H01L 2924/00 20130101; H01L 23/427
20130101 |
Class at
Publication: |
62/515 |
International
Class: |
F25B 39/02 20060101
F25B039/02 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 9, 2006 |
DE |
10 2006 011 333.0 |
Claims
1. A device for cooling, in particular for cooling electronic
components, in particular a processor unit, comprising: an
evaporator for absorbing heat in a coolant, in particular through
evaporation; a gas cooler for cooling the coolant, in particular
through condensation; a first coolant conduit for the communicating
connection of an evaporator outlet to a gas cooler inlet; and a
second coolant conduit for the communicating connection of a gas
cooler outlet to an evaporator inlet, the first coolant conduit
being plugged onto the evaporator outlet and/or is plugged into the
gas cooler inlet with an excess length, and in that the second
coolant conduit is plugged onto the gas cooler outlet and/or is
plugged into the evaporator inlet with an excess length.
2. The device as recited in claim 1, characterized in that the gas
cooler or the evaporator has a distributing reservoir and a
collecting reservoir the gas cooler inlet or evaporator inlet being
situated on the distributing reservoir and the gas cooler outlet or
evaporator outlet being situated on the collecting reservoir, and
the distributing reservoir and the collecting reservoir having pipe
openings into which coolant pipes are plugged or onto which coolant
pipes are plugged, the coolant pipes being fashioned in particular
as flat pipes having corrugated ribs situated between them.
3. The device as recited in claim 1, characterized in that the
evaporator outlet or the gas cooler outlet has an outwardly
protruding collar onto which a pipe end of the first or second
coolant conduit is plugged, the outer dimensions, such as the outer
diameter, of the collar corresponding to the inner dimensions, such
as the inner diameter, of the pipe end.
4. The device as recited in claim 1, characterized in that the pipe
end of the first or second coolant conduit is widened relative to
the other (first or, respectively, second) coolant conduit, so that
the inner diameter of the collar essentially corresponds to or is
larger than an inner diameter of the other (first or, respectively,
second) coolant conduit.
5. The device as recited in claim 2, characterized in that the
distributing reservoir and/or the collecting reservoir is fashioned
so as to be pipe-shaped, in particular cylindrical.
6. The device as recited in claim 5, characterized in that the
first or the second coolant conduit is plugged into the pipe-shaped
distributing reservoir at a front side.
7. The device as recited in claim 5, characterized in that the
first or second coolant conduit is plugged into the pipe-shaped
distributing reservoir at a longitudinal side.
8. The device as recited in claim 5, characterized in that the
first or second coolant conduit is plugged onto the pipe-shaped
collecting reservoir at a front side.
9. The device as recited in claim 5, characterized in that the
first or second coolant conduit is plugged onto the pipe-shaped
collecting reservoir at a longitudinal side.
10. The device as recited in claim 5, characterized in that the
pipe openings are situated on the longitudinal side of the
pipe-shaped distributing reservoir or collecting reservoir.
11. The device as recited in claim 5, characterized in that the
first or second coolant conduit opens into the distributing
reservoir or collecting reservoir essentially opposite the pipe
openings.
12. The device as recited in claim 2, characterized in that the
first or second coolant conduit opens into the distributing
reservoir or collecting reservoir essentially at a right angle to
the pipe openings.
13. The device as recited in claim 1, characterized in that the
device has a conveyor device, such as a blower, for conducting a
medium, in particular a gas, in particular cooling air, through the
gas cooler.
14. The device as recited in claim 1, characterized in that the
device is provided for assembly in or on a heat-emitting component
in such a way that the gas cooler is situated geodetically higher
than the evaporator, so that the coolant flows automatically,
through evaporation, from the evaporator to the gas cooler, and
after condensation flows from the gas cooler to the evaporator.
15. The device as recited in claim 1, characterized in that the gas
cooler inlet is situated geodetically above the gas cooler
outlet.
16. The device as recited in claim 2, characterized in that the gas
cooler inlet is situated at a geodetically upper end of the gas
cooler or distributing reservoir.
17. The device as recited in claim 2, characterized in that the gas
cooler outlet is situated at a geodetically lower end of the gas
cooler or of the collecting reservoir.
18. The device as recited in claim 1, characterized in that the
evaporator outlet is situated geodetically above the evaporator
inlet.
19. The device as recited in claim 2, characterized in that the
evaporator inlet is situated at a geodetically lower end of the
evaporator or of the distributing reservoir.
20. The device as recited in claim 2, characterized in that the
evaporator outlet is situated at a geodetically upper end of the
evaporator or of the collecting reservoir.
21. The device as recited in claim 1, characterized in that the
evaporator is provided for assembly on a heat-emitting component.
Description
[0001] The present invention relates to a device for cooling, in
particular for cooling electronic components, as recited in the
preamble of patent claim 1.
[0002] Such a cooling device is known for example from WO
2005/055319 A2. The known system has an evaporator for absorbing
heat from an electronic component and a condenser for emitting the
heat to the surrounding environment. From an outlet of the
evaporator there extends a riser pipe that opens into the
condenser. In the riser pipe, bubbles of evaporated coolant rise
from the evaporator into the condenser, thus causing recirculation
of the coolant in the system. The end of the riser pipe is situated
above a fluid level that arises during operation.
[0003] In a device of the type described above, the object of the
present invention is to facilitate the circulation of a coolant in
the device.
[0004] This object is achieved by a cooling device having the
features of patent claim 1.
[0005] The basic idea of the present invention is to reduce the
flow resistance for a coolant circulating in the device by
inserting a coolant conduit into the heat exchanger inlet at the
inlet side and plugging a coolant conduit onto the heat exchanger
outlet at the outlet side. This eliminates or at least reduces
bottlenecks and/or turbulence formation of the coolant, so that
circulation of the coolant is promoted in an economical and
constructively simple manner.
[0006] Advantageous specific embodiments are the subject matter of
the dependent claims, and/or are explained in more detail in the
following with reference to the drawings.
[0007] FIG. 1 shows a perspective view of a device for cooling
electronic components,
[0008] FIG. 2 shows an exploded view of a device for cooling
electronic components,
[0009] FIG. 3 shows a side view of a device for cooling electronic
components,
[0010] FIG. 4 shows a longitudinal section of a device for cooling
electronic components,
[0011] FIG. 5 shows a cross-section of a device for cooling
electronic components,
[0012] FIG. 6 shows a top view of a device for cooling electronic
components,
[0013] FIG. 7 shows a longitudinal section of a distributing
reservoir of a gas cooler,
[0014] FIG. 8 shows a side view of a device for cooling electronic
components,
[0015] FIG. 9 shows a perspective view of a clamping device for
pressing a cooling body against a heat-emitting component, and
[0016] FIG. 10 shows six side views of a clamping device for
pressing a cooling body against a heat-emitting component.
[0017] FIG. 1 shows a cooling device 110 that is provided for
cooling a heat-emitting component (not shown), preferably a
processor of a computing machine. Cooling device 10 has an
evaporator 120, a condenser 130, a first coolant conduit 140 and a
second coolant conduit that is covered in FIG. 1. First coolant
conduit 140 connects an evaporator outlet 150 to a covered
condenser inlet, and the second coolant conduit connects a covered
condenser outlet to a likewise covered evaporator inlet. Evaporator
120 is placed in a clamping device 160 that clamps cooling device
110 to the heat-emitting component.
[0018] Condenser 130 has a filling device 165 that is soldered onto
a pipe-shaped distributing reservoir of condenser 130. Condenser
130 is held between an essentially rectangular cover 170, having an
opening 180 and an axial blower 190.
[0019] Before use, the coolant circuit made up of evaporator 120,
condenser 130, and the first and second coolant conduits is first
evacuated via filling device 165, and is then filled with coolant;
the coolant used is preferably coolant R134a, known from the prior
art.
[0020] During operation, evaporator 120 transfers heat from the
heat-emitting component onto the coolant situated in the
evaporator, and this coolant evaporates at least partially and
flows into condenser 130 via first coolant conduit 140. Condenser
130 communicates heat from the coolant that it contains to air that
flows, driven by convection or by axial blower 190, through a
pipe-fin block of condenser 130 and through opening 180. In this
way, the coolant in condenser 130 is cooled and is at least
partially condensed. Subsequently, the coolant flows from condenser
130 back into the evaporator, via the second coolant conduit.
[0021] FIG. 2 shows, in an exploded view, a cooling device 210 that
corresponds essentially to cooling device 110 in FIG. 1. Cooling
device 210 has an evaporator 220, a condenser 230, a first coolant
conduit 240, and a second coolant conduit 245. First coolant
conduit 240 connects an evaporator outlet 250 to a covered
condenser inlet, and second coolant conduit 245 connects a covered
condenser outlet to a likewise covered condenser inlet.
[0022] Evaporator 220 is situated in a clamping device 260 with
which cooling device 210 in FIG. 2 is clamped downward onto the
heat-emitting component. For this purpose, clamping device 260 has
a first tensile element 262 and a second tensile element 263, as
well as a clamping web 264 that is situated between the first and
the second tensile element. In order to press cooling device 210
onto the heat-emitting component, first the first tensile element
262, fashioned as an eye and pointing downward in FIG. 2, is hooked
into a counterpiece, which is fashioned as a nose on the
heat-emitting component or on a frame part connected thereto, and
subsequently second tensile element 263, which is also formed as an
eye and points downward, is pressed downward and likewise hooked in
a counterpiece, so that via clamping web 264 there acts a clamping
force that acts on evaporator 220, which is situated in a
receptacle 266 of clamping web 264, said force pressing the
evaporator downward against the heat-emitting component. Thus, in
FIGS. 1 and 2 the clamping device is downwardly situated.
[0023] Condenser 230 has a filling device 265 that is soldered onto
a pipe-shaped distributing reservoir 232 of condenser 230.
Condenser 230 is held between, on the one hand, an essentially
rectangular cover 270, having a frame 275 that encloses condenser
230 and an opening 280, and on the other hand an axial blower
290.
[0024] During operation, evaporator 220 transfers heat, via a
heat-conducting paste situated in a protective sheath 222 and a
cooling plate 224, to the coolant in the evaporator, which
evaporates at least partially. For improved heat transmission, the
cooling plate preferably has cooling elements, such as fibs, knobs,
or pins, that extend into the evaporator so that the coolant can
flow around them. A cover 226 seals evaporator 220, and
accommodates the cooling elements if necessary.
[0025] Via first coolant conduit 240, the coolant flows into
condenser 230. Condenser 230 transfers heat from the coolant to air
that, driven convectively or by axial blower 290, flows through a
pipe-fin block 234 of condenser 230 and through opening 280 of
cover 270. For this purpose, axial blower 290 has a blower wheel
having a hub 292, blades 294, and an outer ring 296 that rotates in
a blower housing 298, driven by an electric blower motor that is
covered by the hub.
[0026] The coolant flows through a covered condenser inlet into
distributing reservoir 232 of condenser 230, and is distributed to
flat pipes 236 of pipe-fin block 232 that are in turn soldered in
pipe openings of distributing reservoir 232. After a transfer of
heat to the air flowing around ribs 237, the cooled and possibly
condensed coolant is collected in collecting reservoir 238 and
subsequently flows via a condenser outlet and via second coolant
conduit 245 back into evaporator 220.
[0027] Condenser 230, and preferably also evaporator 230 and the
first and second coolant conduits, are made and soldered from a
metal, preferably aluminum, or an alloy, preferably an aluminum
alloy. Cover 270 and the individual parts of axial blower 290, with
the exception of the blower motor and/or the clamping device 260,
are preferably made of plastic, preferably by an injection molding
process.
[0028] FIG. 3 shows a cooling device 310 in a side view. Cooling
device 310 has an evaporator 320, a condenser 330, a first coolant
conduit 340 and a second coolant conduit 345. First coolant conduit
340 connects an evaporator outlet 350 to a condenser inlet that is
covered by a cover 370, and second coolant conduit 345 connects a
covered condenser outlet to an evaporator inlet 352. An axial
blower 390 is connected to condenser 330, and is situated close to
evaporator 320, so that there is no room to situate a clamping
device between axial blower 390 and evaporator 320.
[0029] During operation, evaporator 320 transfers heat, via a
cooling plate 324, from a heat-emitting component to a coolant
situated therein, which evaporates at least partially. A cover 326
seals evaporator 320, and accommodates cooling elements if
necessary.
[0030] Via first coolant conduit 340, the coolant flows into
condenser 330. Condenser 330 transmits heat from the coolant to air
that flows, driven convectively or by axial blower 390, through
condenser 330. After heat is transferred to the air, the cooled,
and possibly condensed, coolant flows into second coolant conduit
345 via a condenser outlet, and from there flows back into
evaporator 320. The circulation of the coolant is indicated by
arrows in FIG. 3.
[0031] In order to promote circulation of the coolant in the
desired manner, evaporator outlet 350 is situated geodetically
higher than evaporator inlet 352. Because vapor bubbles that may
form in the coolant ascend upward in the evaporator, this situation
supports passage of the vapor bubbles via evaporator outlet 350
into first coolant conduit 340, but the vapor bubbles are prevented
from entering second coolant conduit 345 via evaporator inlet
352.
[0032] In addition, the circulation of the coolant is supported in
that first coolant conduit 340 has a diameter that is preferably
greater by about one-fourth than the diameter of second coolant
conduit 345. Advantageously, the diameter of first coolant conduit
340 is 10 mm, and the diameter of the second coolant conduit is 8
mm.
[0033] Likewise advantageous for the circulation of the coolant are
the at least horizontal course and mostly continuous upward
gradient of first coolant conduit 340 from evaporator outlet 350 to
the condenser inlet, as well as the continuous downward gradient of
second coolant conduit 345 from the condenser outlet to evaporator
inlet 352.
[0034] FIG. 4 shows a cooling device 410 in a longitudinal section.
Cooling device 410 has an evaporator 420, a condenser 430, a first
coolant conduit 440, and a second coolant conduit 445. First
coolant conduit 440 connects a evaporator outlet 450 to a condenser
inlet 455, and second coolant conduit 445 connects a condenser
outlet 458 to a condenser inlet that is situated in front of the
plane of the drawing and is therefore not shown in the drawing.
[0035] Via first coolant conduit 440, a coolant (shown in black)
moves from evaporator 420, via evaporator outlet 450, first coolant
conduit 440, and condenser inlet 455, into an essentially
cylindrical distributing reservoir 432 of condenser 430. Condenser
430 transmits heat from the coolant to air that flows through
pipe-fin block 434 of condenser 430. After a transfer of heat to
the air, the cooled and possibly condensed coolant is collected in
a collecting reservoir 438 and flows, via condenser outlet 458,
into second coolant conduit 445, and from there flows back into
evaporator 420.
[0036] In order to promote circulation of the coolant in the
desired manner, evaporator outlet 450 is situated geodetically
higher than the evaporator inlet. In addition, the circulation of
the coolant is supported in that first coolant conduit 440 has a
diameter that is preferably greater by about one-fourth than the
diameter of second coolant conduit 445. Advantageously, the
diameter of first coolant conduit 440 is 10 mm, and the diameter of
the second coolant conduit is 8 mm. Likewise advantageous for the
circulation of the coolant are the at least horizontal course and
mostly continuous upward gradient of first coolant conduit 440, as
well as the continuous downward gradient of second coolant conduit
445.
[0037] It is advantageous to reduce the flow resistance for the
coolant circulating in cooling device 410 by plugging first coolant
conduit 440 into condenser inlet 455 with an excess distance, and
plugging said conduit onto evaporator outlet 450. A similar
advantage is achieved by plugging second coolant conduit 445 into
the evaporator inlet with an excess distance and plugging said
conduit onto condenser outlet 458. This prevents, or at least
reduces, bottlenecks for the coolant and/or turbulence formation in
the coolant, so that the circulation of the coolant in the desired
direction is promoted in the most economical and constructively
simple manner. In some circumstances, a backflow of condensed
coolant into first coolant conduit 440, or of evaporated coolant
into second coolant conduit 445, is prevented or at least slowed by
the plugging in.
[0038] In some circumstances, a simple construction is obtained
through the provision of an outwardly protruding collar 451 on
evaporator outlet 450 and/or of an outwardly protruding collar 459
on condenser outlet 458. Preferably, collar 451 and collar 459 each
have an inner diameter similar to or larger than the first or,
respectively, second coolant conduit, so that no coolant bottleneck
results. The first and second coolant conduit then have, for the
plugging, a first widened pipe end 441 or, respectively, a second
widened pipe end 446, having inner dimensions that correspond to
the outer dimensions of collar 451 or, respectively, of collar
459.
[0039] FIG. 5 shows a cooling device 510 in a cross-section,
corresponding essentially to cooling device 410 in FIG. 4. Cooling
device 510 has an evaporator 520, a condenser 530, a first coolant
conduit (not situated in the plane of the drawing), and a second
coolant conduit 545. Second coolant conduit 545 connects a
condenser outlet 558 to an evaporator inlet 552; said second
conduit lies partly outside the plane of the drawing and is
therefore not shown in its entirety.
[0040] In collecting reservoir 558 of condenser 530, pipe openings
531 are provided into which flat pipes 536 are plugged and
soldered. Flat pipes 536 are divided by longitudinal dividing walls
539 into flow channels 535, such that flow channels 535 are
partially filled with coolant during condensation of the coolant,
and in which condensed coolant is likewise cooled.
[0041] In some circumstances, a simple construction is obtained
through the provision of an outwardly protruding collar 559 on
condenser outlet 558. Preferably, collar 459 has an inner diameter
similar to or greater than that of second coolant conduit 545, so
that no coolant bottleneck results. For the plugging, second
coolant conduit 545 then has a second widened pipe end 546 having
inner dimensions that correspond to the outer dimensions of collar
459.
[0042] FIG. 6 shows a cooling device 610 that is provided for the
cooling of a heat-emitting component (not shown), preferably a
processor of a computing machine. Cooling device 610 has an
evaporator 620, a condenser 630, a first coolant conduit 640, and a
second coolant conduit 645. Evaporator 620 is situated in a
clamping device 660 with which cooling device 610 is clamped onto
the heat-emitting component.
[0043] Condenser 630 has a filling device 665 that is soldered on a
pipe-shaped distributing reservoir 632 of condenser 630. Condenser
630 is held between a cover (not shown) and an axial blower
690.
[0044] Before use, the coolant circuit made up of evaporator 620,
condenser 630, and the first and second coolant conduits is first
evacuated via filling device 665, and is then filled with
coolant.
[0045] FIG. 7 shows section A-A from FIG. 6. Distributing reservoir
632 has a condenser inlet 655 for the insertion and soldering in of
first coolant conduit 640, and has a filling opening 656 for
soldering in of filling device 665. Filling device 665, which is
essentially cylindrical, is situated as a longitudinal support on
the side of pipe-shaped distributing reservoir 632.
[0046] In order to fill cooling device 610, a third coolant conduit
is connected to a valve housing 666 of filling device 665, which is
fashioned as a valve, by screwing a coupling element situated on
the end of the third coolant conduit onto valve housing 666. Here,
the coupling element displaces a valve insert 668 in a channel 669
in FIG. 7 to the left, into a filling position, such that a spring
element (not shown) inside valve insert 668, which is supported via
a stop element 667 on filling opening 656 of distributing reservoir
632 or on valve housing 666, is tensioned.
[0047] Cooling device 610 is first evacuated via channel 669, which
is released in the filling position by valve insert 668, and via
the third coolant conduit, and is subsequently filled with coolant
via the third coolant conduit and channel 669. Subsequently, the
coupling element is unscrewed from the filling device, such that
the spring element in valve insert 668, supported in some
circumstances by an excess pressure of the coolant in cooling
device 610, moves valve insert 668 in FIG. 7 to the right into a
closing position, in which valve insert 668 blocks channel 669,
sealing it by means of at least one sealing ring.
[0048] FIG. 8 shows cooling device 610 from FIG. 6 in a side view.
Pipe-fin network 634 is here situated between cylindrical
distributing reservoir 632 and a likewise cylindrical collecting
reservoir 638 of condenser 630. The filling device is situated at a
right angle to the pipe-fin network on the distributing reservoir.
This achieves both a space-saving construction and good
accessibility of the filling device.
[0049] FIG. 9 shows a clamping device 910 that is provided for a
pressing of a cooling body against a heat-emitting component, for
example against a processor of a computing machine, in a
perspective view. Clamping device 910 has a first tensile element
920 and a second tensile element 930, as well as a clamping web 940
situated between them. Clamping web 940 has a receptacle 950 for a
cooling body, as well as a covered first mounting element 960 and a
second mounting element 970.
[0050] In order to press the cooling body onto the heat-emitting
component, first the cooling body in FIG. 9 is placed into the
receptacle from above. A lateral first projection of the cooling
body is here pushed under mounting element 960, fashioned as a
shoulder, after which a second projection of the cooling body,
situated opposite the first projection, is pressed under second
mounting element 970. This is enabled by an elastic retreat of rear
web part 945 of clamping web 940, and is facilitated by an oblique
ramp 975 of second mounting element 970. If an evaporator according
to one of FIGS. 1 to 8 is used as a cooling element, for example an
excess distance of the cooling plate relative to the cover of the
evaporator serves as a projection.
[0051] Advantageously, the cooling body has an upward stop for
clamping device 910, so that after the cooling body has been placed
into receptacle 950, clamping device 910 is fixed on the cooling
body. If an evaporator according to one of FIGS. 1 to 8 is used as
a cooling body, the first and/or second coolant conduit, connected
fixedly (in particular, soldered) to the evaporator, may for
example act as the stop.
[0052] The cooling body arrangement that is obtained in this way
is, finally, clamped onto the heat-emitting component or onto a
frame, e.g. an electronics circuit board, connected to said
component. For this purpose, first the first tensile element 920,
fashioned as a downward-pointing eye, is hooked into a nose on the
frame, and subsequently second tensile element 930 is pressed down
and also hooked into a nose. In order to facilitate the pressing
down, clamping device 910 has, in the area of second tensile
element 930, a receptacle 980 for a tool such as a screwdriver.
[0053] FIG. 10 shows six side views of a clamping device 1010 that
corresponds essentially to clamping device 910 in FIG. 9, from six
different sides. Clamping device 1010 has a first tensile element
1020 and a second tensile element 1030, as well as a clamping web
1040 situated between them. Clamping web 1040 has a receptacle 1050
for a cooling body, as well as a first mounting element 1060 and a
second mounting element 1070.
[0054] In order to press the cooling body against the heat-emitting
component, first the cooling body is placed into the receptacle in
the clamping direction. A lateral first projection of the cooling
body is pushed under mounting element 1060, fashioned as a
shoulder, and subsequently a second projection of the cooling body,
situated opposite the first projection, is pressed under second
mounting element 1070. This is enabled by an elastic retreat of
rear web part 1045 of clamping web 1040, and is facilitated by an
oblique ramp 1075 of second mounting element 1070.
[0055] Finally, the cooling body arrangement obtained in this way
is clamped onto the heat-emitting component or onto a frame, e.g.
an electronics circuit board, connected to said component. For this
purpose, first the first tensile element 1020, fashioned as a
downward-pointing eye, is hooked into a nose on the frame, and
subsequently second tensile element 1030 is pressed down and also
hooked into a nose. In order to facilitate the pressing down,
clamping device 1010 has, in the area of second tensile element
1030, a receptacle 1080 for a tool such as a screwdriver.
[0056] In addition, second tensile element 1030 is fashioned as a
clip that can be pivoted outward, preferably a metal clip, and has
a projection 1035 as a mounting aid. Second tensile element 1030
can thus easily be pivoted into the counterpiece provided for this
purpose (e.g. into a nose), either by itself or via projection
1035, in the pressed-down state, and subsequently released.
Clamping web 1040 is then tensioned, and produces a clamping force
that is transmitted to the heat-emitting component as a tensile
force via the tensile elements and as a pressure force via the
cooling body, so that a sufficient heat transfer from the
heat-emitting component to the cooling body is ensured.
[0057] The present invention has been described on the basis of a
cooling device for an electronic component as an example, but is
not limited to the described specific embodiments. It is expressly
noted that the present invention may also be used in other
applications. All subject matters described herein may be combined
with each other arbitrarily. Likewise, all features of each
described subject matter may be combined arbitrarily with all other
features of all other subject matters, or may be replaced
thereby.
* * * * *