U.S. patent application number 12/239839 was filed with the patent office on 2010-01-07 for heat dissipation device.
This patent application is currently assigned to FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.. Invention is credited to CHUN-CHI CHEN, MENG FU, DONG-BO ZHENG.
Application Number | 20100000715 12/239839 |
Document ID | / |
Family ID | 41463452 |
Filed Date | 2010-01-07 |
United States Patent
Application |
20100000715 |
Kind Code |
A1 |
ZHENG; DONG-BO ; et
al. |
January 7, 2010 |
HEAT DISSIPATION DEVICE
Abstract
A heat dissipation device includes a base, a sleeve coupling
with the base, and a fastener engaging with the base and the
sleeve. The base defines a hole extending therethrough. The sleeve
includes a first portion coupling with the hole of the base and a
second portion extending from an end of the first portion. The
second portion is located at a first side of the base. The fastener
includes a body portion extending through the sleeve and the base,
a head portion and a foot portion formed at two ends of the body
portion, respectively. The head portion is located at the first
side of the base. A spring member is compressed between the head
portion and the second portion. A compressed length of the spring
member is adjustable by adjusting a coupling length of the first
portion with the hole of the base.
Inventors: |
ZHENG; DONG-BO; (Shenzhen
City, CN) ; FU; MENG; (Shenzhen City, CN) ;
CHEN; CHUN-CHI; (Tu-Cheng, TW) |
Correspondence
Address: |
PCE INDUSTRY, INC.;ATT. Steven Reiss
288 SOUTH MAYO AVENUE
CITY OF INDUSTRY
CA
91789
US
|
Assignee: |
FU ZHUN PRECISION INDUSTRY (SHEN
ZHEN) CO., LTD.
Shenzhen City
CN
FOXCONN TECHNOLOGY CO., LTD.
Tu-Cheng
TW
|
Family ID: |
41463452 |
Appl. No.: |
12/239839 |
Filed: |
September 29, 2008 |
Current U.S.
Class: |
165/80.3 |
Current CPC
Class: |
H01L 23/467 20130101;
H01L 2924/0002 20130101; F28D 15/0275 20130101; H01L 23/4006
20130101; H01L 23/427 20130101; F28D 15/0266 20130101; H01L
2924/0002 20130101; F28F 1/32 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/80.3 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 4, 2008 |
CN |
200810068321.X |
Claims
1. A heat dissipation device comprising: a base defining a hole
extending therethrough; a sleeve coupling with the hole of the
base, a through hole extending through the sleeve; a fastener
comprising a body portion extending through the through hole of the
sleeve, a head portion extending upwardly from an end of the body
portion, a foot portion extending downwardly from another end of
the body portion, a spring member being compressed between the head
portion and the sleeve, a compressed length of the spring member
capable of being varied by adjusting a coupling length of the
sleeve with the hole of the base.
2. The heat dissipation device of claim 1, wherein the hole of the
base is a thread hole, and the sleeve comprises a thread portion
engaging in the thread hole of the base.
3. The heat dissipation device of claim 2, wherein the sleeve
comprises an abutting portion extending upwardly from an end of the
thread portion and located at a side of the base, the spring member
being compressed between the head portion of the fastener and the
abutting portion.
4. The heat dissipation device of claim 3, wherein the abutting
portion of the sleeve has a flat face supporting the spring
member.
5. The heat dissipation device of claim 3, wherein the abutting
portion of the sleeve has a regular-hexagonal-prism profile.
6. The heat dissipation device of claim 1, wherein the foot portion
of the fastener is machined with a plurality of threads
thereon.
7. The heat dissipation device of claim 1, wherein the body portion
of the fastener defines an annular groove therein to form a locking
portion between the head portion and the foot portion, the locking
portion being located at another side of the base, a collar
snapping with the body portion at the locking portion.
8. The heat dissipation device of claim 1, wherein the spring
member is helical and circles the body of the fastener.
9. The heat dissipation device of claim 1, wherein the foot portion
of the fastener has a diameter less than that of the body
portion.
10. A heat dissipation device comprising: a base; a sleeve having a
first portion engaging with the base and a second portion located
at a first side of the base; a fastener comprising a head portion
located at the first side of the base, a body portion extending
through the sleeve and the base, and a foot portion located at a
second side of the base, a spring member being compressed between
the head portion and the second portion of the sleeve, a compressed
length of the spring member capable of being adjusting by adjusting
a coupling length of the first portion of the sleeve with the
base.
11. The heat dissipation device of claim 10, wherein the base
defines a thread hole, the second portion of the sleeve is machined
with threads at a periphery thereof, the threads engaging with the
thread hole.
12. The heat dissipation device of claim 10, wherein the second
portion of the sleeve has a flat face supporting the spring
member.
13. The heat dissipation device of claim 12, wherein the second
portion of the sleeve has a regular-hexagonal-prism profile.
14. The heat dissipation device of claim 10 further comprising a
fin set, wherein the fin set is arranged on the base.
15. The heat dissipation device of claim 14 further comprising a
plurality of heat pipes connecting with base and the fin set,
wherein each of the heat pipes comprises an evaporating section
located between the base and the fin set, and a condensing section
remote from the base and contacting the fin set.
16. The heat dissipation device of claim 15, wherein the fin set
defines a plurality of slots radially extending from a bottom of
the fin set toward a top of the fin set, the evaporating sections
of the heat pipes being received in bottom ends of the slots, the
condensing sections of the heat pipes being in top ends of the
slots.
17. The heat dissipating device of claim 16, wherein the base
defines a cutout in a side thereof, corresponding to ends of the
evaporating sections of the heat pipes.
18. The heat dissipation device of claim 14, wherein the fin set
defines a cutout corresponding to the fastener.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a heat dissipation device,
and particularly to a heat dissipation device with a fastener for
fastening the heat dissipation device to an electronic device.
[0003] 2. Description of Related Art
[0004] It is well known that, during operation of a computer,
electronic devices such as central processing units (CPUs)
frequently generate large amounts of heat. The heat must be quickly
removed from the electronic device to prevent it from becoming
unstable or being damaged. Typically, heat dissipation device
including a heat sink is attached to an outer surface of the
electronic device to absorb heat from the electronic device. The
heat absorbed by the heat sink is then dissipated to ambient
air.
[0005] In order to keep the heat sink in intimate contact with the
electronic device, the heat dissipation device includes a fastener
engaging with a printed circuit board where the electronic device
is located to fasten the heat sink to the electronic device.
Generally, the heat sink comprises a base defining a through hole
therein. The fastener comprises a pole portion, a head portion
extending from an end of the pole portion and an engaging portion
extending from another end of the pole portion for engaging with
the printed circuit board. A spring circles the pole portion. When
fastening the heat sink to the electronic device, the engaging
portion of the fastener extends through the through hole of the
base of the heat sink and a corresponding aperture of the printed
circuit board to engage with a back plate located at a bottom side
of the printed circuit board. The spring is compressed between the
base and the head portion of the fastener and presses the heat sink
to the electronic device. However, when the engaging portion
engages with the back plate, a compressed length of the spring is
invariable; thus, a spring force produced by the compressed spring
is invariable and can not be adjust to meet different electronic
devices or a same electronic device under different circumstances
with different pressure requirements.
[0006] What is needed, therefore, is a heat dissipation device
capable of producing a fastening force which is adjustable to meet
different requirements.
SUMMARY OF THE INVENTION
[0007] The present invention relates to a heat dissipation device.
According to a preferred embodiment of the present invention, the
heat dissipation device comprises a base, a sleeve coupling with
the base, and a fastener engaging with the base and the sleeve. The
base defines a thread hole extending therethrough. The sleeve
comprises a first portion coupling with the hole of the base and a
second portion extending upwardly from an end of the first portion.
The second portion is located at a first side of the base. A
through hole extends through the sleeve. The fastener comprises a
body portion extending through the through hole of the sleeve, a
head portion extending upwardly from an end of the body portion, a
foot portion extending downwardly from another end of the body
portion. The head portion is located at the first side of the base.
The foot portion is located at a second side of the base. A spring
member is compressed between the head portion and the second
portion of the sleeve. A compressed length of the spring member is
capable of being varied by adjusting a coupling length of the first
portion of the sleeve with the thread hole of the base.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] Many aspects of the present embodiments can be better
understood with reference to the following drawings. The components
in the drawings are not necessarily drawn to scale, the emphasis
instead being placed upon clearly illustrating the principles of
the present embodiments. Moreover, in the drawings, like reference
numerals designate corresponding parts throughout the several
views.
[0009] FIG. 1 is an isometric, exploded view of a heat dissipation
device in accordance with a preferred embodiment of the present
invention.
[0010] FIG. 2 shows a fastener and a sleeve of the heat dissipation
device of FIG. 1.
[0011] FIG. 3 is a partially assembled view of FIG. 1.
[0012] FIG. 4 is an assembled view of FIG. 1.
[0013] FIG. 5 is a left side view of FIG. 4.
[0014] FIG. 6 is a left side view of FIG. 4, wherein the sleeve of
the heat dissipation device is threaded in to move downwardly a
distance, in comparison with the sleeve of the heat dissipation
device in FIG. 5.
DETAILED DESCRIPTION OF THE INVENTION
[0015] Referring to FIG. 1, a heat dissipation device of a
preferred embodiment is shown. The heat dissipation device
comprises a heat sink 10, two fasteners 20 for fastening the heat
sink 10 to an electronic device (not shown) mounted on a printed
circuit board (not shown) and two sleeves 25 engaging with the heat
sink 10 and the fasteners 20 for adjusting fastening force of the
fasteners 20 to the heat sink 10.
[0016] The heat sink 10 comprises a base 11, a fin set 15 arranged
on the base 11 and four heat pipes 18 connecting the base 11 and
the fin set 15. The base 11 is a substantially rectangular plate
having good heat conductivity. The base 11 defines two thread holes
112 in middles of two lateral opposite portions thereof. The base
11 defines four parallel grooves 118 for receiving the heat pipes
18. A cutout 115 is defined in a front side of the base 11,
adjacent to front ends of the four grooves 118. The fin set 15
comprises a plurality of fins 151 assembled together. Each of the
fins 151 extends a top flange (not labeled) and a bottom flange
(not labeled) from top and bottom edges thereof. The bottom flanges
of the fins 151 interconnect one by one to form a flat bottom face
(not labeled) contacting the base 11. The fin set 15 defines two
cutouts 153 corresponding to the thread holes 112, which avoid
interference between the fin set 15 and the fasteners 20 when the
fasteners 20 are used to secure the heat sink 10 to the printed
circuit board. The fin set 15 defines four receiving slots 158
extending through each fin 151 of the fin set 15. The four slots
158 radially extend from a middle of the bottom face of the fin set
15 toward a top portion of the fin set 15. The four slots 158 have
converged bottoms and diverged tops. The bottoms of the four slots
158 are opened to and in communication with corresponding grooves
118 of the base 11.
[0017] Each heat pipe 18 comprises an evaporating section (not
labeled), a condensing section (not labeled) parallel to the
evaporating section, and a connecting section (not labeled)
connecting the evaporating section and the condensing section. The
evaporating sections of the heat pipes 18 are received in the
corresponding grooves 118 of the base 11 and the bottoms of the
slots 158 of the fin set 15. The evaporating sections of the heat
pipes 18 are parallel to each other and converged in the base 18
and the bottom of the slots 158. The condensing sections of the
heat pipes 18 are parallel to each other and received in the tops
of the slots 158 of the fin set 15. The connecting sections of the
heat pipes 18 extend from the bottoms to the tops of the slots 158
of the fin set 15.
[0018] Referring also to FIG. 2, each fastener 20 comprises a shaft
member 21 and a helical spring 23 circling the shaft member 21. The
shaft member 21 is integrally made of plastic or metal material.
The shaft member 21 comprises a body portion 210, a head portion
212 formed at a top end of the body portion 210, and a foot portion
218 formed at an opposite bottom end of the body portion 210. The
head portion 212 has a diameter larger than that of the body
portion 210. The body portion 210 has the diameter larger than that
of the foot portion 218. The head portion 212 defines an operating
groove (not labeled) for facilitating operation of a tool such as a
screwdriver to fasten the heat dissipation device to the printed
circuit board. The body portion 210 defines a circumferential
groove on a periphery thereof, thereby forming a locking portion
214 with a diameter less than that of the body portion 210. The
locking portion 214 is adjacent to the foot portion 218.
[0019] The sleeve 25 is a one-piece member and comprises an
abutting portion 250 and a thread portion 255 extending downwardly
from a bottom end of the abutting portion 250. A through hole 258
extends through the abutting portion 250 and the thread portion
255. In this embodiment, the abutting portion 250 has a
regular-hexagonal-prism profile. The abutting portion 250 has a
flat top face (not labeled) for supporting the spring 23. The
thread portion 255 has a cylinder profile. The thread portion 255
is machined with a plurality of threads on a circumferential
periphery thereof, for coupling with the thread hole 112 of the
base 11. The through hole 258 has an upper portion surrounded by
the abutting portion 250 and having a hexagonal profile, and a
lower portion surrounded by the thread portion 255 and having a
cylindrical profile.
[0020] Referring also to FIGS. 3-5, when the heat sink 10 is
assembled to the electronic device on the printed circuit board,
the heat sink 10 seats on the electronic device. The sleeves 25
engage with the base 11 of the heat sink 10 by the thread portions
255 of the sleeves 25 coupling with corresponding thread holes 112
of the base 11. The fasteners 20 have the foot portions 218
inserted into corresponding through holes 258 of the sleeves 25 and
extending downwardly beyond the thread holes 112 of the base 11.
The locking portions 214 of the fasteners 20 extend downwardly
beyond the base 11. A collar 27 allows the body portion 210 to
extend therethrough and snaps with the body portion 210 in the
locking portion 214 of each of the fasteners 20. The collar 27 is
therefore located under the base 11.
[0021] The foot portions 218 further extend through corresponding
through apertures defined in the printed circuit board and engage
with a back plate located under the printed circuit board. Here, as
shown by FIG. 5, the spring 23 between the head portion 212 of the
shaft 21 and the abutting portion 250 of the sleeve 25 is
compressed by a distance. The compressed spring 23 produces a
fastening force on the abutting portion 250 and presses the base 11
toward the electronic device. Therefore, the heat sink 10 is
intimately fastened to the electronic device on the printed circuit
board.
[0022] Referring also to FIG. 6, when the electronic device
requires a smaller fastening force produced by the compressed
spring 23, the thread portion 255 of the sleeve 25 is further
threaded into the thread hole 112 of the base 11. By this manner, a
coupling length of the thread portion 255 and the thread hole 112
of the base 11 is increased, the spring 23 between the head portion
212 of the fastener 20 and the abutting portion 250 of the sleeve
25 is expanded, in comparison with FIG. 5, and the compressed
distance of the spring 23 is decreased, whereby the spring 23
produces a smaller fastening force on the abutting portion 250 and
the base 11 toward the electronic device, in comparison with the
fastener 20 in the state of FIG. 5. So the electronic device has a
smaller engaging force acting thereon by the heat sink 10.
[0023] It is believed that the present embodiments and their
advantages will be understood from the foregoing description, and
it will be apparent that various changes may be made thereto
without departing from the spirit and scope of the invention or
sacrificing all of its material advantages, the examples
hereinbefore described merely being preferred or exemplary
embodiments of the invention.
* * * * *