U.S. patent application number 12/233607 was filed with the patent office on 2009-12-31 for method for manufacturing pixel structure.
This patent application is currently assigned to AU OPTRONICS CORPORATION. Invention is credited to Kuo-Lung Fang, Ming-Yuan Huang, Ta-Wen Liao, Han-Tu Lin, Chih-Hung Shih, Chia-Chi Tsai, Chih-Chun Yang.
Application Number | 20090325331 12/233607 |
Document ID | / |
Family ID | 41447947 |
Filed Date | 2009-12-31 |
United States Patent
Application |
20090325331 |
Kind Code |
A1 |
Yang; Chih-Chun ; et
al. |
December 31, 2009 |
METHOD FOR MANUFACTURING PIXEL STRUCTURE
Abstract
A method for manufacturing a pixel structure is provided. First,
a gate and a gate insulating layer are sequentially formed on the
substrate. A channel layer and a second metal layer are
sequentially formed on the gate insulating layer. The second metal
layer is patterned to form a source and a drain by using a
patterned photoresist layer formed thereon, wherein the source and
the drain are disposed on a portion of the channel layer. The gate,
the channel, the source and the drain form a thin film transistor.
A passivation layer is formed on the patterned photoresist layer,
the gate insulating layer and the thin film transistor. Then, the
patterned photoresist layer is removed, such that the passivation
layer thereon is removed simultaneously to form a patterned
passivation layer and the drain is exposed. A pixel electrode is
formed on the patterned passivation layer and the drain.
Inventors: |
Yang; Chih-Chun; (Hsinchu
County, TW) ; Huang; Ming-Yuan; (Taipei County,
TW) ; Lin; Han-Tu; (Taichung County, TW) ;
Shih; Chih-Hung; (Yilan County, TW) ; Liao;
Ta-Wen; (Miaoli County, TW) ; Fang; Kuo-Lung;
(Hsinchu, TW) ; Tsai; Chia-Chi; (Kaohsiung City,
TW) |
Correspondence
Address: |
JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
7 FLOOR-1, NO. 100, ROOSEVELT ROAD, SECTION 2
TAIPEI
100
TW
|
Assignee: |
AU OPTRONICS CORPORATION
Hsinchu
TW
|
Family ID: |
41447947 |
Appl. No.: |
12/233607 |
Filed: |
September 19, 2008 |
Current U.S.
Class: |
438/22 ;
257/E21.409; 438/158; 438/609 |
Current CPC
Class: |
H01L 27/1288 20130101;
H01L 27/1248 20130101 |
Class at
Publication: |
438/22 ; 438/158;
438/609; 257/E21.409 |
International
Class: |
H01L 21/00 20060101
H01L021/00; H01L 21/84 20060101 H01L021/84; H01L 21/44 20060101
H01L021/44 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 27, 2008 |
TW |
97124271 |
Claims
1. A method for manufacturing a pixel structure, comprising:
providing a substrate; forming a gate on the substrate; forming a
gate insulating layer on the substrate to cover the gate; forming a
channel layer on the gate insulating layer over the gate; forming a
second metal layer on the channel layer; forming a patterned
photoresist layer on the second metal layer, and removing a portion
of the second metal layer by using the patterned photoresist layer
as a mask to form a source and a drain on the channel layer at two
sides of the gate, wherein the gate, the channel layer, the source,
and the drain constitute a thin film transistor; forming a
passivation layer on the patterned photoresist layer, the gate
insulating layer, and the thin film transistor; removing the
patterned photoresist layer, wherein the passivation layer on the
patterned photoresist layer is removed simultaneously to form a
patterned passivation layer and to expose the source and the drain;
and forming a pixel electrode on the patterned passivation layer
and the drain.
2. The method for manufacturing the pixel structure according to
claim 1, wherein the step of forming the gate comprises: forming a
first metal layer on the substrate; and patterning the first metal
layer to form the gate.
3. The method for manufacturing the pixel structure according to
claim 2, wherein the step of patterning the first metal layer
comprises performing a laser ablation process or performing a
photolithography and etching process.
4. The method for manufacturing the pixel structure according to
claim 1, wherein the step of forming the channel layer comprises:
forming a semiconductor layer on the gate insulating layer; and
patterning the semiconductor layer to form the channel layer.
5. The method for manufacturing the pixel structure according to
claim 4, wherein the step of patterning the semiconductor layer
comprises performing a laser ablation process or performing a
photolithography and etching process.
6. The method for manufacturing the pixel structure according to
claim 1, wherein the step of forming the gate insulating layer
comprises forming a silicon nitride layer through a chemical vapor
deposition (CVD) process.
7. The method for manufacturing the pixel structure according to
claim 1, wherein the step of forming the pixel electrode comprises:
forming a conductive layer on the patterned passivation layer and
the remaining second metal layer; and patterning the conductive
layer to form the pixel electrode.
8. The method for manufacturing the pixel structure according to
claim 7, wherein the step of forming the conductive layer comprises
forming an indium tin oxide (ITO) layer or an indium zinc oxide
(IZO) layer by performing a sputtering process.
9. The method for manufacturing the pixel structure according to
claim 7, wherein the step of patterning the conductive layer
comprises performing a laser ablation process or performing a
photolithography and etching process.
10. A method for manufacturing the pixel structure, comprising:
providing a substrate; forming a gate on the substrate; forming a
gate insulating layer on the substrate to cover the gate; forming a
semiconductor layer on the gate insulating layer over the gate;
forming a second metal layer on the semiconductor layer; forming a
patterned photoresist layer on the second metal layer, and removing
a portion of the second metal layer and a portion of the
semiconductor layer by using the patterned photoresist layer as a
mask to form a channel layer, a source, and a drain on the gate
insulating layer over the gate simultaneously, wherein the source
and the drain are disposed on a portion of the channel layer, and
the gate, the channel layer, the source, and the drain constitute a
thin film transistor; forming a passivation layer on the patterned
photoresist layer, the gate insulating layer, and the thin film
transistor; removing the patterned photoresist layer, wherein the
passivation layer on the patterned photoresist layer is removed
simultaneously to form a patterned passivation layer and to expose
the source and the drain; and forming a pixel electrode on the
patterned passivation layer and the drain.
11. The method for manufacturing the pixel structure according to
claim 10, wherein the step of forming the gate comprises: forming a
first metal layer on the substrate; and patterning the first metal
layer to form the gate.
12. The method for manufacturing the pixel structure according to
claim 11, wherein the step of patterning the first metal layer
comprises performing a laser ablation process or performing a
photolithography and etching process.
13. The method for manufacturing the pixel structure according to
claim 10, wherein the step of forming the gate insulating layer
comprises forming a silicon nitride layer through a chemical vapor
deposition (CYD) process.
14. The method for manufacturing the pixel structure according to
claim 10, wherein the step of forming the pixel electrode
comprises: forming a conductive layer on the patterned passivation
layer, the source and the drain; and patterning the conductive
layer to form the pixel electrode.
15. The method for manufacturing the pixel structure according to
claim 14, wherein the step of forming the conductive layer
comprises forming an indium tin oxide (ITO) layer or an indium zinc
oxide (IZO) layer by performing a sputtering process.
16. The method for manufacturing the pixel structure according to
claim 14, wherein the step of patterning the conductive layer
comprises performing a laser ablation process or performing a
photolithography and etching process.
17. The method for manufacturing the pixel structure according to
claim 10, wherein the step of forming the patterned photoresist
layer is completed through a half-tone photolithography etching
process (PEP) or a gray-tone PEP.
18. The method for manufacturing the pixel structure according to
claim 10, wherein the step of simultaneously forming the channel,
the source and the drain comprises: forming the semiconductor layer
on the gate insulating layer; forming the second metal layer on the
semiconductor layer; forming the patterned photoresist layer on the
second metal layer over the gate, wherein the patterned photoresist
layer comprises a first photoresist block and a second photoresist
block disposed at two sides of the first photoresist block, and a
thickness of the first photoresist block is less than a thickness
of the second photoresist block; performing a first etching process
on the second metal layer and the semiconductor layer by using the
patterned photoresist layer as the mask; reducing a thickness of
the patterned photoresist layer until the first photoresist block
is removed completely; and performing a second etching process on
the second metal layer by using the remaining second photoresist
block as the mask, such that the remaining second metal layer
constitutes the source and the drain while the remaining
semiconductor layer constitutes the channel layer.
19. A method for manufacturing a pixel structure, comprising:
providing a substrate; forming a gate on the substrate; forming a
gate insulating layer on the substrate to cover the gate; forming a
channel layer on the gate insulating layer over the gate; forming a
second metal layer above the gate insulating layer; forming a
patterned photoresist layer on the second metal layer, and removing
a portion of the second metal layer by using the patterned
photoresist layer as a mask to form a source and a drain, wherein
the gate, the channel layer, the source, and the drain constitute a
thin film transistor; forming a passivation layer on the patterned
photoresist layer, the gate insulating layer, and the thin film
transistor; removing the patterned photoresist layer, wherein the
passivation layer on the patterned photoresist layer is removed
simultaneously to form a patterned passivation layer; and forming a
pixel electrode on the patterned passivation layer and the drain.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefit of Taiwan
application serial no. 97124271, filed on Jun. 27, 2008. The
entirety of the above-mentioned patent application is hereby
incorporated by reference herein and made a part of this
specification.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a method for manufacturing
a pixel structure, and in particular, to a method for manufacturing
a pixel structure, which utilizes a lift-off process to manufacture
a passivation layer.
[0004] 2. Description of Related Art
[0005] Displays are a communication interface between human and
information. Currently, flat panel displays are the main trend in
development. The flat panel displays may mainly have the following
categories: organic electroluminescence display, plasma display,
and thin film transistor liquid crystal display (TFT-LCD), in which
TFT-LCD is the most widely used. In general, a TFT-LCD is
constituted by a TFT array substrate, a color filter array
substrate, and a liquid crystal layer. The TFT array substrate
includes a plurality of scan lines, a plurality of data lines, and
a plurality of pixel structures arranged in an array. Each pixel
structure is electrically connected to the corresponding scan line
and data line.
[0006] FIGS. 1A to 1G are schematic views of a conventional method
for fabricating a pixel structure. Referring to FIG. 1A, first, a
substrate 10 is provided, and a gate 20 is formed on the substrate
10 using a first photolithography and etching process. Next,
referring to FIG. 1B, a gate insulating layer 30 is formed on the
substrate 10 to cover the gate 20. Afterwards, referring to FIG.
1C, a channel layer 40 above the gate 20 is formed on the gate
insulating layer 30 using a second photolithography and etching
process. In general, a material of the channel layer 40 is
amorphous silicon. Then, referring to FIG. 1D, a source electrode
50 and a drain electrode 60 are formed on partial regions of the
channel layer 40 and the gate insulating layer 30 using a third
photolithography and etching process. Observed from FIG. 1D, the
source electrode 50 and the drain electrode 60 respectively extend
onto the gate insulating layer 30 from both sides of the channel
layer 40, and expose a portion of the channel layer 40. Next,
referring to FIG. E, a passivation layer 70 is formed on the
substrate 10 to cover the gate insulating layer 30, the channel
layer 40, the source electrode 50, and the drain electrode 60.
Thereafter, referring to FIG. 1F, the passivation layer 70 is
patterned by a fourth photolithography and etching process to form
a contact hole H in the passivation layer 70. In FIG. 1F, the
contact hole H in the passivation layer 70 exposes a portion of the
drain electrode 60. Then, referring to FIG. 1G, a pixel electrode
80 is formed on the passivation layer 70 by a fifth
photolithography and etching process, and observed from FIG. 1G,
the pixel electrode 80 is electrically connected to the drain
electrode 60 through the contact hole H. After the pixel electrode
80 is formed, the fabrication of the pixel structure 90 is
completed.
[0007] In view of the above, the conventional pixel structure 90 is
mainly fabricated by the five photolithography and etching
processes. In other words, the pixel structure 90 must be
fabricated with the five photo-masks of the different patterns. The
photo-masks are of high price, and each photolithography and
etching process requires a photo-mask of a different pattern. If
the photolithography and etching processes cannot be simplified,
the fabrication cost of the conventional pixel structure cannot be
reduced.
[0008] Besides, with the increasing of the size of the TFT-LCD
panel, the size of the photo-mask for fabricating the TFT array
substrate is also enlarged, so the photo-mask of a larger size
becomes more expensive, and the fabrication cost of the
conventional pixel structure cannot be effectively lowered.
SUMMARY OF THE INVENTION
[0009] The present invention is directed to a method for
manufacturing a pixel structure capable of reducing the process
cost.
[0010] As embodied and broadly discussed herein, the present
invention provides a method for fabricating a pixel structure.
First, a gate is formed on a substrate, and a gate insulating layer
is formed on the substrate to cover the gate. Next, a channel layer
is formed on the gate insulating layer, and a second metal layer is
formed on the channel layer. Then, a patterned photoresist layer is
formed on the second metal layer, and a portion of the second metal
layer is removed by using the patterned photoresist layer as a
mask, so as to form a source and a drain on the channel layer at
two sides of the gate, wherein the gate, the channel layer, the
source, and the drain constitute a thin film transistor. After
that, a passivation layer is formed on the patterned photoresist
layer, the gate insulating layer, and the thin film transistor.
Then, the patterned photoresist layer is removed, so that the
passivation layer thereon is removed simultaneously to form a
patterned passivation layer and to expose the source and the drain.
Thereafter, a pixel electrode is formed on the patterned
passivation layer and the drain.
[0011] According to one embodiment of the present invention, the
step of forming the gate includes that, for example, a first metal
layer is formed on the substrate first, and then the first metal
layer is patterned to form the gate.
[0012] According to one embodiment of the present invention, the
step of patterning the first metal layer includes performing a
laser ablation process or performing a photolithography and etching
process.
[0013] According to one embodiment of the present invention, the
step of forming the channel layer includes that, for example, a
semiconductor layer is formed on the gate insulating layer, and
then the semiconductor layer is patterned to form the channel
layer.
[0014] According to one embodiment of the present invention, the
step of patterning the semiconductor layer includes performing a
laser ablation process or performing a photolithography and etching
process.
[0015] According to one embodiment of the present invention, the
step of forming the gate insulating layer includes, for example,
forming a silicon nitride layer through a chemical vapor deposition
(CVD) process.
[0016] According to one embodiment of the present invention, the
step of forming the pixel electrode includes, for example, forming
a conductive layer on the patterned passivation layer and the
remaining second metal layer. Then, the conductive layer is
patterned to form the pixel electrode.
[0017] According to one embodiment of the present embodiment, the
step of forming the conductive layer includes, for example, forming
an indium tin oxide (ITO) layer or an indium zinc oxide (IZO) layer
by performing a sputtering process.
[0018] According to one embodiment of the present invention, the
step of patterning the conductive layer includes performing a laser
ablation process or performing a photolithography and etching
process.
[0019] As embodied and broadly discussed herein, the present
invention provides a method for fabricating a pixel structure.
First, a gate is formed on a substrate. Next, a gate insulating
layer is formed on the substrate to cover the gate. A semiconductor
layer is formed on the gate insulating layer, and a second metal
layer is formed on the semiconductor layer. Then, a patterned
photoresist layer is formed on the second metal layer, a portion of
the second metal layer and a portion of the semiconductor layer are
removed by using the patterned photoresist layer as a mask, so as
to form a channel layer, a source, and a drain on the gate
insulating layer over the gate simultaneously, wherein the source
and the drain are disposed on a portion of the channel layer, and
the gate, the channel layer, the source, and the drain constitute a
thin film transistor. A passivation layer is formed on the
patterned photoresist layer, the gate insulating layer, and the
thin film transistor. The patterned photoresist layer is removed,
so that the passivation layer thereon is removed simultaneously to
form a patterned passivation layer and to expose the source and the
drain. After that, a pixel electrode is formed on the patterned
passivation layer and the drain.
[0020] According to one embodiment of the present invention, the
step of forming patterned photoresist layer is completed through a
half-tone photolithography etching process (PEP) or a gray-tone
PEP.
[0021] According to one embodiment of the present invention, the
step of forming the channel layer, the source, and the drain
includes steps as follows. First, a semiconductor layer is formed
on the gate insulating layer, and a second metal layer is formed on
the semiconductor layer. Next, the patterned photoresist layer is
formed on the second metal layer over the gate, wherein the
patterned photoresist layer includes a first photoresist block and
a second photoresist block disposed at two sides of the first
photoresist block, and a thickness of the first photoresist block
is less than a thickness of the second photoresist block. A first
etching process is performed on the second metal layer and the
semiconductor layer by using the patterned photoresist layer as the
mask. Then, a thickness of the photoresist layer is reduced until
the first photoresist block is removed completely. A second etching
process is performed on the second metal layer by using the
remaining second photoresist block as the mask, such that the
remaining second metal layer constitutes the source and the drain
while the remaining semiconductor layer constitutes the channel
layer.
[0022] The present invention utilizes a photoresist lift-off
process to manufacture the passivation layer. Compared with a
method for manufacturing a conventional pixel structure, the
present invention can simplify the manufacturing process and reduce
the process cost in respect of PEP.
[0023] In order to make the aforementioned and other objects,
features and advantages of the present invention more
comprehensible, several embodiments accompanied with figures are
described in detail below.
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] The accompanying drawings are included to provide a further
understanding of the invention, and are incorporated in and
constitute a part of this specification. The drawings illustrate
embodiments of the invention and, together with the description,
serve to explain the principles of the invention.
[0025] FIGS. 1A to 1G illustrate a processing flow of manufacturing
a conventional pixel structure.
[0026] FIGS. 2A to 2I are schematic views illustrating a method for
manufacturing a pixel structure according to a first embodiment of
the present invention.
[0027] FIGS. 3A to 3I are schematic views illustrating a method for
manufacturing the pixel structure according to a second embodiment
of the present invention.
DESCRIPTION OF EMBODIMENTS
First Embodiment
[0028] FIGS. 2A to 2I are schematic views illustrating a method for
manufacturing a pixel structure according to a first embodiment of
the present invention. Referring to FIG. 2A, a substrate 200 is
provided at first. A material of the substrate 200 includes glass,
plastic, and other solid or flexible materials. Next, a first metal
layer 210 is formed on the substrate 200, wherein the first metal
layer 210 is formed by performing a sputtering process, an
evaporation process, or other thin film deposition processes. Then,
a first mask M1 is provided over the first metal layer 210. The
first mask M1 exposes a portion of the first metal layer 210, and a
laser beam L1 is utilized to irradiate the first metal layer 210
through the first mask M1. More specifically, the first metal layer
210 irradiated by the laser beam L1 absorbs the energy of the laser
beam L1, and thereby the first metal layer 210 irradiated by the
laser beam L1 is ablated from a surface of the substrate 200. In
detail, the energy of the laser beam L1 used for ablating the first
metal layer 210 ranges from 10 mJ/cm.sup.2 to 500 mJ/cm.sup.2, for
example. In addition, a wavelength of the laser beam L1 ranges from
100 nm to 400 nm, for example.
[0029] After that, the portion of the first metal layer 210 exposed
by the first mask M1 is removed to form a gate 210' on the
substrate 200. It should be noted that, unlike prior arts which
utilize expensive masks to manufacture the gate 210', the present
embodiment utilizes the inexpensive mask M1 to complete the
manufacture of the gate 210', and thereby the process cost is
reduced. However, in the present invention, the manufacture of the
gate 210' is not limited to the above-mentioned. In other words,
the gate 210' may be manufactured by performing a photolithography
and etching process.
[0030] Thereafter, referring to FIG. 2B, a gate insulating layer
220 is formed on the substrate 200 to cover the gate 210'. The gate
insulating layer 220 is formed by performing a chemical vapor
deposition (CVD) process or other suitable thin film deposition
processes, for example. A material of the gate insulating layer 220
includes, for example, silicon oxide, silicon nitride, silicon
oxy-nitride, or other dielectric materials.
[0031] Then, referring to FIGS. 2C and 2D, a semiconductor layer
230 is formed on the gate insulating layer 220. In the present
embodiment, a material of the semiconductor layer 230 includes, for
example, amorphous silicon or other semiconductor materials. Next,
a second mask M2 is provided over the semiconductor layer 230 and
exposes a portion of the semiconductor layer 230. After that, a
laser beam L2 irradiates the semiconductor layer 230 through the
second mask M2 the semiconductor layer 230 irradiated by the laser
beam L2 absorbs the energy of the laser beam L2, and thereby the
semiconductor layer 230 irradiated by the laser beam L2 is ablated
from a surface of the gate insulating layer 220. At this time, a
channel layer 230' is formed on the gate insulating layer 220.
However, in the present invention, the manufacture of the gate 230'
is not limited to the above-mentioned. In other words, the gate
230' may be manufactured by performing a photolithography and
etching process.
[0032] Then, referring to FIG. 2E, a second metal layer 240 (now
shown) is formed on the gate insulating layer 220 and the channel
layer 230', and a patterned photoresist layer 260 is used as the
mask to pattern the second metal layer 240, so as to form a source
242 and a drain 244. The gate 210', the channel layer 230', the
source 242 and the drain 244 constitute a thin film transistor.
According to the present embodiment, a material of the source 242
and the drain 244 includes, for example, aluminum (Al), molybdenum
(Mo), titanium (Ti), neodymium (Nd) and nitride of any of the
aforementioned, such as MoN, TiN, stacked layers thereof, and any
alloy of the aforementioned or other conductive materials.
[0033] Referring to FIG. 2F, after the source 242 and the drain 244
are formed, a passivation layer 270 which completely covers the
patterned photoresist layer 260, the gate insulating layer 220, and
the thin film transistor is formed. According to the present
embodiment, a material of the passivation layer 270 includes, for
example, silicon nitride, silicon oxide, and the passivation layer
270 is formed by performing a physical vapor deposition (PVD)
process or the CVD process, for example.
[0034] Next, referring to FIG. 2G, the patterned photoresist layer
260 is removed, so that a portion of the passivation layer 270
disposed on the patterned photoresist layer 260 is removed
simultaneously to expose the source 242 and the drain 244. At this
time, the passivation layer 270 is patterned to form the patterned
passivation layer 270'. It should be noted that, the
above-mentioned step of simultaneously removing the patterned
photoresist layer 260 and the portion of the passivation layer 270
is a kind of lift-off process, and the passivation layer 270 can be
patterned effectively.
[0035] Afterward, referring to FIGS. 2H and 2I, a conductive layer
280 is formed on the source 242, the drain 244, and the passivation
layer 270'. According to the present embodiment, a material of the
conductive layer 280 includes, for example, indium tin oxide (ITO),
indium zinc oxide (IZO), or other conductive materials. Then, a
third mask M3 is provided over the conductive layer 280. The third
mask exposes a portion of the conductive layer 280. After that, a
laser beam L3 is utilized to irradiate the conductive layer 280
through the third mask M3. The conductive layer 280 irradiated by
the laser beam L3 absorbs the energy of the laser beam L3, and thus
is ablated from a portion of a surface of the patterned passivation
layer 270' and the source 242, so as to form a pixel electrode 280'
on the drain 244 and a portion of the passivation layer 270'.
However, in the present invention, the manufacture of the gate 280'
is not limited to the above-mentioned. In other words, the gate
280' may be manufactured by performing a photolithography and
etching process.
Second Embodiment
[0036] FIGS. 3A to 3I are schematic views illustrating a method for
manufacturing the pixel structure according to a second embodiment
of the present invention. According to the present embodiment, the
channel layer, the source, and the drain are simultaneously formed.
Detailed descriptions are provided below with reference to FIGS. 3C
to 3I. A processing flow shown by FIGS. 3A to 3B is the same as
that shown by FIGS. 2A to 2B, and a process flow shown by FIGS. 3F
to 3I is the same as that shown by FIGS. 2F to 2I, so detailed
descriptions are not repeated.
[0037] Referring to FIG. 3C, a semiconductor layer 230 and a second
metal layer 240 are formed on the gate insulating layer 220
sequentially. According to the present embodiment, a material of
the semiconductor layer 230 includes, for example, amorphous
silicon or other semiconductor materials.
[0038] Referring to FIG. 3D, a photoresist layer 290 is formed on
the second metal layer 240 over the gate 210' after the second
metal layer 240 is formed. As shown by FIG. 3D, the photoresist
layer 290 can be divided into a first photoresist block 290a and a
second photoresist block 290b at two sides of the first photoresist
block 290a. A thickness of the first photoresist block 290a is less
than a thickness of the second photoresist block 290b. Then, a
first etching process is performed on the second metal layer 240
and the semiconductor layer 230 by using the photoresist layer 290
as the mask.
[0039] After that, a thickness of the photoresist layer 290 is
reduced until the first photoresist block 290a is removed
completely, as shown by FIG. 3E, wherein a method of reducing the
thickness of the photoresist layer 290 includes, for example,
performing an ashing process. Referring to FIG. 3E, after the first
photoresist block 290a is completely removed, a second etching
process is performed on the second metal layer 240 by using the
remaining second photoresist block 290b' as the mask. According to
the present embodiment, the first etching process and the second
etching process include, for example, performing a wet etching
process. In other embodiments, a dry etching process may also be
performed.
[0040] In summary, the method for manufacturing the pixel structure
provided by the present invention has at least the following
advantages.
[0041] 1. The method for manufacturing the pixel structure provided
by the present invention does not require performing a
photolithography process for manufacturing the passivation layer.
Therefore, compared with a conventional PEP which needs to be
performed with high precision, the present invention is conducive
to reducing the process cost of manufacturing the mask.
[0042] 2. Fewer steps are involved in the manufacturing process of
the pixel structure in the present invention, so defects caused
during the long PEP for manufacturing the pixel structure (such as
photoresist coating, soft baking, hard baking, exposure,
development, etching, photoresist stripping, and the like) are
reduced.
[0043] Although the present invention has been described with
reference to the above embodiments, it will be apparent to one of
the ordinary skill in the art that modifications to the described
embodiment may be made without departing from the spirit of the
invention. Accordingly, the scope of the invention will be defined
by the attached claims not by the above detailed descriptions.
* * * * *