U.S. patent application number 12/146542 was filed with the patent office on 2009-12-31 for heat absorbing device.
Invention is credited to Feng-Chang Wang.
Application Number | 20090321043 12/146542 |
Document ID | / |
Family ID | 41446000 |
Filed Date | 2009-12-31 |
United States Patent
Application |
20090321043 |
Kind Code |
A1 |
Wang; Feng-Chang |
December 31, 2009 |
HEAT ABSORBING DEVICE
Abstract
A heat absorbing device includes a converter, a heat
semi-conductor located on the converter, a cool guide plate placed
on the heat semi-conductor, and a moisture-proof cap provided with
a recessed accommodating space for receiving the heat converter and
the heat semi-conductor. The moisture-proof cap has an upper
opening that the cool guide plate is fitted closely in, and a
combining mouth formed in its bottom for the combining member of
the heat converter fitted closely therein, insulating the heat
semi-conductor from exterior air.
Inventors: |
Wang; Feng-Chang; (Hu Wei
Town, TW) |
Correspondence
Address: |
SINORICA, LLC
2275 Research Blvd., Suite 500
ROCKVILLE
MD
20850
US
|
Family ID: |
41446000 |
Appl. No.: |
12/146542 |
Filed: |
June 26, 2008 |
Current U.S.
Class: |
165/80.2 |
Current CPC
Class: |
H01L 23/3675 20130101;
H01L 2924/0002 20130101; H01L 2924/00 20130101; H01L 2924/0002
20130101 |
Class at
Publication: |
165/80.2 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Claims
1. A heat absorbing device comprising: a heat converter provided
with a main body, said main body having a heat absorbing member
formed in an upper portion and a combining member formed around its
circumference; a heat semi-conductor provided with a cooling
surface and a heat dissipating surface, said heat dissipating
surface contacting said heat absorbing member of said heat
converter; a cool guide plate made of a material possible to evenly
conducting heat and contacting said cooling surface of said heat
semi-conductor; and a moisture-proof cap made of a material
conducing less heat and provided with a recessed accommodating
space for receiving said heat converter and said heat
semi-conductor therein, said moisture-proof cap further provided
with an upper opening in said recessed accommodating space, said
cool guide plate fitted sealingly in said upper opening, said
moisture-proof can having a bottom formed with a combining mouth
for said combining member of said heat converter fitted sealingly
therein.
2. The heat absorbing device as claimed in claim 1, wherein said
cool guide plate has its circumference formed with an extended
stepped projection, and said extended stepped projection pushes
tightly just under an annular wall defining said upper opening of
said moisture-proof cap.
3. The heat absorbing device as claimed in claim 1, wherein a first
sealing element is deposited between said extended stepped
projection of said cool guide plate and said moisture-proof
cap.
4. The heat absorbing device as claimed in claim 1, wherein said
first sealing element is a sealing rubber ring.
5. The heat absorbing device as claimed in claim 1, wherein said
combining mouth of said moisture-proof cap is provided with an
extended annular edge, which overlaps sealingly to said combining
member of said heat converter.
6. The heat absorbing device as claimed in claim 5, wherein a
second sealing element is deposited between said combining member
of said heat converter and said annular edge of said moisture-proof
cap.
7. The heat absorbing device as claimed in claim 6, wherein said
second sealing element is a rubber.
8. The heat absorbing device as claimed in claim 1, wherein said
moisture-proof cap is provided with threaded holes of a preset
number, and said heat converter is provided with combining holes of
the same number as that of said threaded holes of said
moisture-proof cap, and said combining holes are aligned with said
threaded holes for bolts to fasten them respectively.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] This invention relates to a heat absorbing device.
[0003] 2. Description of the Prior Art
[0004] A conventional heat dissipating device 10 shown in FIG. 1
includes a heat semi-conductor 11 for performing hat change. The
heat semi-conductor 11 is provided with a cooling surface 111 to
contact with air, but if the air is too cool, moisture in the air
may condense thereon to become water drops. So water can be
detrimental to an electronic part, and in order to avoid contacting
with air, a heat guide plate 12 is attached around the heat
semi-conductor 11, having a hollow space in its interior for
receiving the semi-conductor 11, with the cooling surface 111 of
the semi-conductor 11 contacting with the heat guide plate 12 for
heat absorbing. At the same time, the heat guide plate 12 is
provided with a sealing rubber ring 121 for insulating the
semi-conductor 11 from contacting exterior air, and a heat
dissipater 13 is connected with the heat guide surface 112 to
dissipate heat.
[0005] However, the conventional heat dissipating device 10 has
disadvantages described below although the cooling surface 12 of
the semi-conductor 12 functions to insulate air.
[0006] 1. The heat guide plate 12 has too large a dimension for
wrapping around the semi-conductor 11, so it also absorbs heat at
the location not contacting the heat source, consequently cutting
down the effectiveness of the semi-conductor 11.
[0007] 2. The sealing rubber ring 121 does seal up the heat
dissipater completely, so air may flow into the heat dissipater 13,
and if a gap occurs between the heat dissipater 13 and the sealing
rubber ring 121 because of aging or inflating, air still can flow
in to let moisture accumulate inside the heat guide plate 12,
potentially causing some damage to the circuit of the
semi-conductor 11.
SUMMARY OF THE INVENTION
[0008] The purpose of this invention is to offer a heat absorbing
device having excellent function of air insulating.
[0009] The features of the heat absorbing device are a heat
converter, a heat semi-conductor, a cool guide plate, and a
moisture-proof cap. The heat semi-conductor is placed on the heat
converter, and the cool guide plate is placed on the heat
semi-conductor. The moisture-proof cap has an accommodating space
for receiving the heat converter and the heat semi-conductor, an
upper opening for fitting sealingly the cool guide plate, and a
combining mouth in the bottom for the combining member of the heat
converter to be fitted sealingly in. Then the two ends of the
moisture-proof cap combined sealingly with the heat converter and
the cool guide plate to keep the heat semi-conductor completely
insulated from exterior air. In addition, the heat semi-conductor
is directly and evenly connected to a heat source via the cool
guide plate, it is boosted up in its efficacy.
BRIEF DESCRIPTION OF DRAWINGS
[0010] This invention will be better understood by referring to the
accompanying drawings, wherein
[0011] FIG. 1 is a cross-sectional view of a conventional heat
absorbing device;
[0012] FIG. 2 is a perspective view of a heat absorbing device in
the present invention;
[0013] FIG. 3 is an exploded perspective view of the heat absorbing
device in the present invention; and
[0014] FIG. 4 is a cross-sectional view of the heat absorbing
device in the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0015] A heat absorbing device in the present invention, as shown
in FIGS. 2 and 3, includes a heat converter 20, a heat
semi-conductor 30, a cool guide plate 40, an anti-moisture cap 50,
a first sealing element 60 and a second sealing element 70.
[0016] The heat converter 20 is composed of a nearly square main
body 21, and the main body 21 consists of a heat absorbing member
22 in an upper portion, and a linking member 23 around its bottom,
with a linking hole 24 bored respectively at its four corners for
receiving a bolt 25 therein.
[0017] The heat semi-conductor 30 has a cooling surface 31 and a
heat dissipating surface 32 oppositely.
[0018] The cool guide plate 40 is made of a heat evenly
transmitting material, having a stepped projection 41 around its
circumference
[0019] The moisture-proof cap 50 is made of a material transmitting
not so much heat, having a recessed accommodating space 51, an
upper opening 52, a linking mouth 53 formed in the bottom, an
annular edge 54 formed in the linking mouth 53, and a threaded hole
55 formed respectively at four corners of the bottom.
[0020] The first sealing element 60 is annular, made of a material
having sealing function.
[0021] In order to further understand the structural features,
operational technique and expected effect, how to use the invention
is to be described below.
[0022] As shown in FIG. 4, the heat absorbing surface 22 of the
heat converter 20 contacts the heat dissipating surface 32 of the
semi-conductor 30, and the cooling surface 31 of the heat
semi-conductor 30 contacts the cool guide plate 40. Then the
moisture-proof cap 50 is covered on the heat converter 20, with the
first sealing element 60, the cool guide plate 30 and the heat
converter 20 orderly placed in the accommodating space 51. Then the
cool guide plate 40 is just fitted in the upper opening 52, and the
first element 60 resting around the stepped projection 41 of the
cool guide plate 40 fits tightly around the upper opening 52,
enabling the stepped projection 41 to tightly contact the
moisture-proof cap 50. Meanwhile, the linking member 23 of the heat
converter 20 overlaps the annular edge 54 of the moisture-proof cap
50, and the second sealing element 70 is coated between the linking
member 23 and the annular edge 54. The second sealing element 70 is
a kind of sealing glue or a material having high sealing function.
At the same time, the threaded holes 55 of the moisture-proof cap
50 overlap with the linking holes 24 for the bolts 25 to fasten
them tightly. Thus the moisture cap 50, the cool guide plate 40 and
the heat converter 20 are all sealed airtight, preventing the
semi-conductor 30 from contacting exterior air at all.
[0023] In using, the heat semi-conductor 30 conducts heat, heating
up the heat dissipating surface 32 but cutting down the temperature
of the cooling surface, with the heat absorbing surface 22 of the
heat converter 20 takes off the heat energy produced by the heat
dissipating surface 32. Therefore, the cooling plate 40 performs
lowering temperature owing to the cooling surface 31, as the
cooling surface 31 contacts the cool guide plate 40. Moreover, the
cool guide plate 40 is connected to a heat source (not shown), it
dissipates heat produced thereby, with the cool guide plate 40
mixes temperature of the heat source with that of the cooling
surface 31, with the moisture-proof cap 50 performing insulation,
permitting the cooling surface 31 to work with the heat source for
stepping up the function of the heat absorbing device in the
invention.
[0024] While the preferred embodiment of the invention have been
described above, it will be recognized and understood that various
modifications may be made therein and the appended claims are
intended to cover all such modifications that may fall within the
spirit and scope of the invention.
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