U.S. patent application number 12/119466 was filed with the patent office on 2009-12-24 for transponder incorporated into an electronic device.
Invention is credited to Curt Carrender.
Application Number | 20090320139 12/119466 |
Document ID | / |
Family ID | 36460434 |
Filed Date | 2009-12-24 |
United States Patent
Application |
20090320139 |
Kind Code |
A1 |
Carrender; Curt |
December 24, 2009 |
TRANSPONDER INCORPORATED INTO AN ELECTRONIC DEVICE
Abstract
An electronic device. The device comprises a metalization layer
and an integrated circuit chip incorporated into the device wherein
the integrated circuit chip is capacitively coupled to the
metalization layer. The device comprises a first substrate having
the metalization layer formed on the substrate, a cap layer
covering at least the entire metalization layer and at least a
portion of the first substrate not covered by the metalization
layer. The integrated circuit chip is coupled to the first
substrate, and is placed in proximity and in non-physical contact
with the metalization layer. A conductive layer is attached to the
integrated circuit chip. The conductive layer has at least a
portion placed in a non-physical contact with the metalization
layer. The integrated circuit chip is capacitively coupled to the
metalization layer through the conductive layer and the
metalization layer.
Inventors: |
Carrender; Curt; (Morgan
Hill, CA) |
Correspondence
Address: |
BLAKELY SOKOLOFF TAYLOR & ZAFMAN LLP
1279 OAKMEAD PARKWAY
SUNNYVALE
CA
94085-4040
US
|
Family ID: |
36460434 |
Appl. No.: |
12/119466 |
Filed: |
May 12, 2008 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10996294 |
Nov 22, 2004 |
7385284 |
|
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12119466 |
|
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Current U.S.
Class: |
726/26 ;
369/272.1 |
Current CPC
Class: |
G08B 13/2437 20130101;
H01L 2924/01047 20130101; H01L 2924/01027 20130101; H01L 2224/24227
20130101; H01L 2924/14 20130101; G06K 19/0723 20130101; H01L 24/24
20130101; H01L 2924/15165 20130101; H01L 2924/01075 20130101; H01L
2224/24227 20130101; H01L 2924/15153 20130101; H01L 2924/01005
20130101; H01L 2924/01006 20130101; H01L 2224/7665 20130101; G06K
19/07788 20130101; H01L 2924/01033 20130101; H01L 2224/82039
20130101; H01L 2924/15165 20130101; H01L 24/82 20130101; G08B
13/2445 20130101; H01L 2924/15155 20130101; G08B 13/2417 20130101;
H01L 2224/95085 20130101; H01L 2924/15165 20130101; H01L 2924/15153
20130101 |
Class at
Publication: |
726/26 ;
369/272.1 |
International
Class: |
G06F 21/24 20060101
G06F021/24 |
Claims
1. A method for authenticating a machine readable medium
comprising: reading, by a playback device, an encrypted first code
from a radio frequency identification integrated circuit, the a
radio frequency identification integrated circuit coupled to a
machine readable medium placed inside the playback device;
authenticating, by the playback device, the machine readable medium
using the encrypted first code and a second code stored on the
machine readable medium.
2. The method of claim 1 further comprising disabling playback of
the machine readable medium if the machine readable medium fails
the authenticating.
3. The method of claim 1 further comprising ejecting the machine
readable medium from the playback device if the machine readable
medium fails the authenticating.
4. The method of claim 1 wherein the machine readable medium is a
disk.
5. The method of claim 4 wherein the radio frequency identification
integrated circuit is coupled to a center ring of the disk.
6. The method of claim 4 wherein the disk is balanced despite the
radio frequency identification integrated circuit coupled to the
disk.
7. The method of claim 6 wherein the disk further comprises one or
more weight balancing components.
8. The method of claim 1 wherein the machine readable medium is a
DVD.
9. The method of claim 1 wherein reading the encrypted first code
uses a 13.56 MHz radio frequency signal.
10. The method of claim 1 wherein reading the encrypted first code
uses a radio frequency signal between 800 MHz to 3 GHz.
11. The method of claim 1 further comprising decrypting the first
code prior to the authenticating.
12. The method of claim 1 wherein the second code is encrypted.
13. A method for authenticating a machine readable medium
comprising: placing the machine readable medium in a playback
device; reading a first code from a radio frequency identification
integrated circuit, the a radio frequency identification integrated
circuit coupled to the machine readable medium; comparing the first
code to a second code stored on the machine readable medium.
14. The method of claim 13 further comprising disabling playback of
the machine readable medium if the machine readable medium is not
authenticated by the comparing.
15. The method of claim 13 wherein the machine readable medium
comprises a disk.
16. The method of claim 13 wherein the radio frequency
identification integrated circuit is coupled to a center ring of a
disk.
17. The method of claim 13 wherein the first code is encrypted.
18. The method of claim 13 wherein reading the first code uses a
13.56 MHz radio frequency signal.
19. The method of claim 13 wherein reading the encrypted first code
uses a radio frequency signal between 800 MHz to 3 GHz.
20. A playback device for reading a machine readable medium, the
device comprising: a laser, a reader to read a first code from a
radio frequency identification integrated circuit, the radio
frequency identification integrated circuit coupled to the machine
readable medium; and electronics to authenticate the machine
readable medium using the first code and a second code stored on
the machine readable medium.
21. The device of claim 20 wherein the electronics disables
playback of the machine readable medium if the machine readable
medium is not authenticated.
22. A disk comprising: a radio frequency identification integrated
circuit, the radio frequency identification integrated circuit
storing a first code; a metallization layer storing video
information and a second code, wherein the disk is balanced during
playback despite the radio frequency identification integrated
circuit.
23. The disk of claim 22 further comprising one or more weight
balancing components.
24. The disk of claim 22 wherein the radio frequency identification
integrated circuit is configured for interrogation by a 13.56 MHz
radio frequency signal.
25. The disk of claim 22 wherein the radio frequency identification
integrated circuit is configured for interrogation by a radio
frequency signal between 800 MHz to 3 GHz.
Description
RELATED APPLICATION
[0001] This application is a continuation of co-pending U.S.
application Ser. No. 10/996,294 filed Nov. 22, 2004, entitled
"Transponder Incorporated Into An Electronic Device" which is
hereby incorporated herein by this reference in its entirety.
FIELD
[0002] The present invention relates generally an electronic device
that incorporates a radio frequency (RF) transponder and method of
tagging an electronic device using an RE system.
BACKGROUND
[0003] Systems for remote identification of objects are being used
for many purposes, such as identifying an item or object in a
warehouse, retailers, stores, dealerships, parking lots, airports,
train stations and/or at any particular location. Such systems use
Radio Frequency (RF) signals to communicate information between a
RE reader apparatus and an RF transponder attached to the item or
the object. The RE transponder includes a memory component that can
store particular information, such as identification information
(e.g., price, identification, serial number, product information,
etc. . . . ) about the object or the item. The RF transponder also
includes an antenna to facilitate the communication between the RE
reader and the RE transponder. Some systems include both "read" and
"write" functions; thus, the RF reader can read information
previously stored in the RF transponder's memory and the RF
transponder can also write new information into the memory in
response to signals from the RF reader.
[0004] Each RF transponder has an individual code containing
information related to and identifying the associated object/item.
In a typical system, the RE reader sends an RE signal to the remote
RF transponder. The antenna in the RE transponder receives the
signal from the RF reader, backscatter-modulates the received
signal with data temporarily or permanently stored in the RF
transponder (such as data indicating the identity prices, and/or
contents of the object/item to which the transponder is attached),
produces a sequence of signals in accordance with the transponder's
individual code, and reflects this modulated signal back to the RF
reader to pass the information contained in the RF transponder to
the RF reader. The RF reader decodes these signals to obtain the
information from the transponder. Likewise, the transponder may
decode signals received from the reader and write information to
the transponder's memory.
[0005] Tagging an object or an item is an important application.
Tagging an object or an item includes at least identifying,
authenticating, recognizing, inventorying, checking-in,
checking-out, tracking, locating, detecting and sensing the
electronic device for many purposes. For instance, there have been
many attempts to tag an item such as a CD or a DVD. Such tagging
has been employing an RFID system. Attempts have been made to place
an RFID transponder on the cover or jacket of the CD or the DVD.
However, current tagging technology employing RFID systems do not
successfully read the items/objects 100% of the time, especially
without adding complex components to the items to booster the read
accuracy. Additionally, the transponder is only placed on the
jacket or cover of the item such as CDs/DVDs thus allowing for
possible removal or tampering of the RFID transponder and possibly
removing the CDs/DVDs from the covers. Such possible removal the
actual CDs or DVDs from the covers defeat the purpose of tagging.
Most importantly, the current tagging technology employs only a
short range detection (13.56 MHz) thus does not provide for a long
range detection.
[0006] Merchants, sellers, buyers, surveyors, retailers, libraries,
and the like who distribute, sell, or otherwise require information
for CDs or DVDs have the need to track and tag object/items. Thus,
many people and/or entities rely on such tracking and tagging
systems. Such tagging system reduces operation costs or needs for
manpower in tracking and tagging, increases security of the items,
increases efficiency in keeping a good inventory of the items on
premises, and increases reliability in the authentication of such
items, to name a few.
SUMMARY
[0007] Embodiments of the present invention pertain to an RFID
transponder incorporated directly into an electronic device and
methods tagging an electronic device using the RFID transponder
that is incorporated directly into the electronic device.
[0008] One embodiment of the invention pertains to a device that
comprises a metalization layer and an integrated circuit chip
incorporated into the device wherein the integrated circuit chip is
capacitively coupled to the metalization layer. The device
comprises a first substrate having the metalization layer formed on
the substrate, a cap layer covering at least the entire
metalization layer and at least a portion of the substrate not
covered by the metalization layer. The integrated circuit chip is
coupled to the first substrate, and is placed in proximity and in
non-physical contact with the metalization layer. A conductive
layer is attached to the integrated circuit chip. The conductive
layer has at least a portion placed in a non-physical contact with
the metalization layer. The integrated circuit chip is capacitively
coupled to the metalization layer through the conductive layer and
the metalization layer. The integrated circuit chip is an RFID chip
in one embodiment and the metalization layer acts as the antenna
that is coupled to the REID chip capacitively for an REID system.
The device can be a CD, CD-ROM, CD-R, CD)-RW, CD-I, DVD, DVD-ROM,
DVD-R, and DVD-RAM.
[0009] One embodiment of the invention pertains to a device that
comprises a metalization layer and an integrated circuit chip
incorporated into a label that is affixed to the device wherein the
integrated circuit chip is capacitively coupled to the metalization
layer. The device comprises a first substrate having the
metalization layer formed on the substrate. A cap layer covering at
least the entire metalization layer. At least a portion of the
substrate is not covered by the metalization layer. The label is
placed over the substrate. The integrated circuit chip is coupled
to the label. The integrated circuit chip is placed in proximity
and in non-physical contact with the metalization layer. A
conductive layer is attached to the integrated circuit chip. The
conductive layer has at least a portion placed in a non-physical
contact with the metalization layer. The integrated circuit chip is
capacitively coupled to the metalization layer through the
conductive layer and the metalization layer. The integrated circuit
chip is an REID chip in one embodiment and the metalization layer
acts as the antenna that is coupled to the RFID chip capacitively
for an RFID system. The device can be a CD, CD-ROM, CD-R, CD-RW,
CD-I, DVD, DVD-ROM, DVD-R, and DVD-RAM.
[0010] One embodiment of the invention pertains to a device that
comprises a metalization layer and an integrated circuit chip
incorporated into a center ring substrate that is affixed to the
center of the device wherein the integrated circuit chip is
capacitively coupled to the metalization layer. The device
comprises a first substrate having the metalization layer formed on
the substrate. A cap layer covers at least the entire metalization
layer. At least a central portion of the substrate is not covered
by the metalization layer. The center ring substrate is placed over
the central portion. The center ring substrate comprises the
integrated circuit chip disposed therein, a conductive layer
attached to the integrated circuit chip, and one or more weight
balancing components. The integrated circuit chip is placed such
that the integrated circuit chip is in proximity and in
non-physical contact with the metalization layer. The conductive
layer has at least a portion placed in a non-physical contact with
the metalization layer. The integrated circuit chip is capacitively
coupled to the metalization layer through the conductive layer and
the metalization layer. The integrated circuit chip is an REID chip
in one embodiment and the metalization layer acts as the antenna
that is coupled to the RFID chip capacitively for an RFID system.
The device can be a CD, CD-ROM, CD-R, CD-RW, CD-I, DVD, DVD-ROM,
DVD-R, and DVD-RAM.
[0011] Other embodiments of the present invention pertain to
methods which comprise providing an electronic device. The
electronic device comprises a first substrate having a metalization
layer formed on the substrate, a cap layer covering at least all of
the metalization layer and at least a portion of the substrate is
not covered by the metalization layer. The methods further comprise
providing an RFID transponder, which comprises identification
information for the electronic device, and providing an RFID reader
receptive of the RFID transponder. The RFID transponder is
incorporated into the electronic device.
[0012] The method similar to above wherein the RFID transponder
includes an integrated circuit chip coupled to the first substrate
and placed in proximity and in non-physical contact with the
metalization layer and a conductive layer attached to the
integrated circuit chip and having at least a portion placed in a
non-physical contact with the metalization layer. The integrated
circuit chip is capacitively coupled to the metalization layer
through the conductive layer and the metalization layer.
[0013] The method similar to above wherein the RFID transponder
includes a label placed over the substrate, an integrated circuit
chip coupled to the label, and a conductive layer attached to the
integrated circuit chip. The integrated circuit chip is placed in
proximity and in non-physical contact with the metalization layer.
The conductive layer has at least a portion placed in a
non-physical contact with the metalization layer. The integrated
circuit chip is capacitively coupled to the metalization layer
through the conductive layer and the metalization layer.
[0014] The method similar to above wherein the RFID transponder at
least a central portion of the substrate not covered by the
metalization layer and a center ring substrate placed over the
central portion. The center ring substrate comprises an integrated
circuit chip disposed therein. A conductive layer is attached to
the integrated circuit chip. One or more weight balancing
components are deposited on the center ring substrate. The
integrated circuit chip is placed such that the integrated circuit
chip is in proximity and in non-physical contact with the
metalization layer. The conductive layer has at least a portion
placed in a non-physical contact with the metalization layer. The
integrated circuit chip is capacitively coupled to the metalization
layer through the conductive layer and the metalization layer.
[0015] Other embodiments are also described herein.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] FIGS. 1A-1B illustrate an exemplary device that can
incorporate an RFID transponder;
[0017] FIG. 2 illustrates an exemplary RFID transponder
incorporated into a device;
[0018] FIG. 3 illustrates an exemplary REID circuit chip in the
form of a functional block;
[0019] FIG. 4 illustrates another exemplary RFID circuit chip in
the form of a functional block;
[0020] FIG. 5 illustrates an exemplary RFID transponder
incorporated into a device;
[0021] FIGS. 6-12 illustrate exemplary configurations of a
conductive layer coupled to an RFID circuit chip;
[0022] FIGS. 13-14 illustrate an exemplary device that directly
incorporates an RFID transponder;
[0023] FIGS. 15-23 illustrate other exemplary devices that directly
incorporates an RFID transponder;
[0024] FIG. 24 illustrates an exemplary method of identifying a
device that incorporates an RFID transponder; and
[0025] FIG. 25 illustrates an exemplary playback system for use in
one exemplary aspect of the present invention.
DETAILED DESCRIPTION
[0026] Embodiments of the present invention pertain to an RFID
transponder (tag) incorporated into an electronic device and
methods tagging an electronic device using the RFID transponder
that is incorporated into the electronic device.
[0027] As mentioned above. REID devices are currently used for
remote identification of objects. The ability to remotely identify
or detect an item using an RFID system is important for many
purposes such as identifying/detecting an item or an object in a
warehouse, retailers, stores, libraries, dealerships, parking lots,
airports, train stations, and/or at many other locations. An RFID
system needs an REID reader and an RFID transponder (tag). An
antenna is typically formed on the RFID transponder as is know in
the art. Manufacturers have been unable to make or place an RFID
transponder directly on a device that has a metal structure
included therein because an antenna structure or loop cannot be
printed on the metal and still function properly. Thus,
manufacturers have been unable to incorporate a RFID transponder
directly on a CD (Compact Disc), CD-ROM (Compact Disc Read Only
Memory), CD-R (Compact Disc Recordable), CD-RW (Compact Disc
Rewritable), CD-I (Compact Disc Interactive), DVD (Digital Video
Disc or Digital Versatile Disc), DVD-ROM (Digital Video Disc Read
Only), DVD-R (Digital Video Disc Recordable), and DVD-RAM (Digital
Video Disc Rewritable), and other devices, electronic devices, or
discs that include a metal structure. One reason that the
manufacturers have been unable to incorporate a RFID transponder
directly on such devices is that the antenna for the RFID
transponder cannot be printed on the devices directly due to the
interference by the metal structures in these devices. An antenna
structure or loop gets detuned and fails to function properly when
placed in closed proximity with or printed directly on a metal
structure. It has been thought of that when an electrical field of
any transmitter such as an antenna approaches a conductor such as a
metal structure, the transmitter goes to zero at the surface of the
conductor and as such, the transmitter (antenna) gets detuned.
[0028] Embodiments of the present invention overcome the problem
discussed above. Embodiments of the present invention incorporate
an RFID transponder directly into an electronic device that has a
metal structure included therein. The RFID transponder is said to
be directly incorporated into the device because the RFID
transponder is not placed on a jacket, cover, or packaging of the
device. Instead, the RFID transponder, after the incorporation,
becomes part of the device and cannot be easily removed from the
device. In one aspect, the RFID transponder is incorporated
directly into the device by utilizing the metal structure of the
device as an antenna for the RFID transponder. The RFID transponder
may have more than one antenna and may use more than one metal
structure provided in the device for such antennas. Additionally,
the metal structure of the device that is utilized as the antenna
for the RFID transponder is capacitively coupled to an integrated
circuit chip of the RFID transponder. The REID transponder is
formed directly on the device while utilizing an already existing
metal structure on the device as an antenna structure. The RFID
transponder of the embodiments of the present invention can work in
a wide range of high frequency from low to high, including
frequency ranges from about 800 MHz to 3 GHz. The RFID transponder
thus allows for longer range detection.
[0029] In one embodiment, an electronic device is any one of a CD,
CD-ROM, CD-R, CD-RW, CD-I, DVD, DVD-ROM, DVD-R, or DVD-RAM. An RFID
transponder is formed directly on the device utilizing metalization
layer provided in each of these devices as the antenna for the RFID
transponder. The metalization layer thus, besides performing other
purposes for the device, also acts as the antenna for the REID
transponder. The RFID transponder includes an integrated circuit,
typically an REID integrated circuit (RFID IC) chip coupled to the
device. The RFID IC chip is capacitively coupled to the
metalization layer. The RFID IC chip is placed at a predetermined
distance (e.g., between about 0-3 mm) away from the metalization
layer of the device so that it is in a non-physical contact with
the metalization layer. The RFID IC chip may be first incorporated
into a strap which is then coupled to the surface of the device.
The REID IC chip is placed sufficiently close to the metalization
layer such that energies can easily be transferred between the RFID
IC chip and the metalization layer to form the RFID transponder.
This is referred to as "capacitive coupling" in the embodiments of
the present invention.
[0030] FIGS. 1A-1B illustrates an electronic device 100 that can
benefit from an RFID transponder (tag) formed in accordance to
embodiments of the present invention. The electronic device 100 an
be a CD, CD-ROM, CD-R, CD-RW, CD-I, DVD, DVD-ROM, DVD-R, and
DVD-RAM as shown in FIGS. 1A-1J. The device 100 includes a center
portion 102 and an opening 104. The opening 104 typically allows a
component from a reading machine (e.g., a CD player/recorder) to be
inserted therethrough for controlling and positioning the device
100. The center portion 102 is typically a plastic area or a non
conductive area of the device 100. The device 100 typically
includes several important layers shown in FIG. 1B. The device 100
includes a substrate 110, which could be the same material as the
center portion 102 and be made of plastic. On top of the device 100
is formed a metalization layer 120. The metalization layer 120
typically does not cover the center portion are 102 of the device
100. In one embodiment, the metalization layer includes information
coded thereon using reflective and non-reflective coatings. The
device 100 may also include a cap layer 140, typically a protective
and non-conductive layer that also functions to protect the
metalization layer 120. The cap layer 140 covers at least the
entire surface of the metalization layer 120. In some embodiments,
the cap layer 140 covers also the center portion 102. In other
embodiments, a label 150 is also included and placed over the
device 100. The label 150 typically contains visible information
that identifies and provides some information about the device,
such as the name of an album or a movie recorded on the device 100.
The label 150 may or may not cover the entire surface of the device
100 (except the opening 104).
[0031] FIG. 2 illustrates an embodiment of the invention that
pertains to a device 201 (e.g., a CD) directly incorporates an RFID
transponder on the device. The device 201 that comprises a
metalization layer 202 and an integrated circuit chip 208
incorporated into the device 201 wherein the integrated circuit
chip (e.g., an RFID IC chip) 208 is capacitively coupled to the
metalization layer 202. The device 201 comprises a first substrate
200 having the metalization layer 202 formed on a surface of the
substrate 200. A cap layer 204 covering at least the entire
metalization layer 202 is also included in the device 201. The cap
layer 204 may also cover the portion 206. As shown in FIG. 2, in
one embodiment, at least a portion 206 of the substrate 200 is not
covered by the metalization layer 202. Similar to previously shown
in FIG. 1A, the device 201 may include a center portion (which
could be the portion 206 shown in FIG. 2) that does not have the
metalization layer 202 formed thereon. In one embodiment, a label
212 providing visual information or display for the device 201 may
be included in the device 201 and is placed over the cap layer 204.
The label 212 may also cover the portion 206.
[0032] Still with FIG. 2, the integrated circuit chip 208 is
coupled to the first substrate 200, and is placed in proximity and
in non-physical contact with the metalization layer 202. The
integrated circuit chip 208 may be coupled to the portion 206,
directly on the substrate 200 or on the cap layer 204 if the cap
layer 204 covers the portion 206 of the substrate 200. In one
embodiment, the integrated circuit chip 208 is placed at a distance
between about 0 mm and about 3 mm to the metalization layer 202.
The integrated circuit chip 208 is placed close enough to the
metalization layer 202 for a capacitive coupling between the
integrated circuit chip 208 and the metalization layer 202, but not
physically touching so as to cause the RFID transponder to not
work. In one embodiment, a conductive layer 210 is attached to the
integrated circuit chip 208. The conductive layer 210 has at least
a portion being positioned or placed in a non-physical contact with
the metalization layer 202. The integrated circuit chip 208 is
capacitively coupled to the metalization layer 202 through the
conductive layer 210 and the metalization layer 202. The integrated
circuit chip is an RFID chip, in one embodiment, and the
metalization layer 202 acts as an antenna that is coupled to the
RFID chip 208 capacitively for an RFID transponder. The device can
be a CD, CD-ROM, CD-R, CD-RW, CD-I, DVD, DVD-ROM, DVD-R, and
DVD-RAM.
[0033] The integrated circuit chip 208 may be deposited in a second
substrate 300 (FIG. 3), which is then coupled to the first
substrate 200. The second substrate 300 can be a plastic film,
plastic sheet, or other suitable materials. The integrated circuit
chip 208 may be a functional block 304 having a top surface 304-T
upon which a circuit element is situated (not shown). The circuit
element on the top surface may be an ordinary integrated circuit
(IC) for any particular function. The IC may be designed to receive
power from another circuit for the operation of an RFID
transponder. The IC may also be designed to receive power from an
energy source (e.g. battery) for the operation of the RFID tag. In
one embodiment, the functional block 304 has a trapezoidal
cross-section where the top of the block 304 is wider than the
bottom of the block 304. The functional block 304 may also have
other suitable/desired shapes. The functional block 304 may be
created from a host substrate and separated from this substrate.
Methods of such a functional block 304 are known in the art. The
functional block 304 may be a NanoBlock.TM., which is a trademark
of Alien Technology Corporation, Morgan Hill, Calif.
[0034] In one embodiment, the functional block 304 is placed in the
second substrate 300 using a Fluidic Self-Assembly (FSA) process.
Of course, other placement methods can be used. In one embodiment,
the second substrate 300 includes a receptor 302 configured to
receive the functional block 304. The receptor 302 may be a
recessed region formed into the second substrate 300. In the
embodiment where the functional block 304 has the trapezoidal
shape, the receptor 302 has a similar shape and/or size so that the
block 304 can be deposited therein. The receptor 302 thus is
configured with a complimentary shape for the particular shape of
the functional block 304 in one embodiment.
[0035] The functional block 304 may be deposited into the receptor
302 by an FSA method described in U.S. Pat. No. 5,545,291 which is
hereby incorporated by its reference in its entirety. In one
embodiment, the functional block 304 is recessed within the second
substrate 300 or placed below or at a surface 300-S of the second
substrate 300. The FSA process may be performed with a web material
in which a web material for the second substrate 300 is provided.
The web may contain a plurality of receptors 302. The web material
is advanced through a web process apparatus. A slurry solution
(e.g., an FSA slurry) containing a plurality of functional blocks
304 is dispensed over web material. The blocks 304 would then fall
into receptors 302 formed on the web material. The web material can
then be sliced, singulated, separated so to form a plurality of
substrates 300 each comprising one or more functional blocks
304.
[0036] In one embodiment, the functional block 304 includes one or
more contact pads 306 so that conductive elements can be connected
to the functional block 304. Multiple contact pads may be included
so that the functional block 304 can be coupled to more that one
antennas or other devices. The contact pads 306 can be formed on
top of the functional block 304. As shown in FIG. 3, a conductive
layer 308 is connected to the contact pads 306. In one embodiment,
an insulation layer (not shown) such as a planarization layer may
be included on top of the functional block 304 that has been
deposited in the receptor 302. The insulation layer may provide a
flat surface to the second substrate 300 as well as insulate
certain components on top of the functional block 304. The
insulation layer may include one to more vias (not shown) created
therethrough. Electrical interconnection to the contact pads 306
would be established through the vias. Forming the insulation layer
and the vias are well known in the art and can be done by methods
including laser drilling or photolithographic etching. The
conductive layer 308 can be formed of a suitable conductors and can
include metallic films, conductive polymers, or inks filled with
conductive particles. The conductive layer 308 can be formed by a
method such as a subtractive process (using etching/lithography or
laser ablation) on a metal film, or an additive process (such as
printing metal traces.
[0037] In one embodiment, the conductive layer 308 is a conductive
trace that extends from the functional block 304. For instance, the
contact pads 306 may be extended so that it also forms the
conductive layer 308. The contact pads 306 may also be integral
parts of the conductive layer 308.
[0038] FIG. 4 illustrates an embodiment where the integrated
circuit chip 208 is incorporated into a second substrate 400 and
recessed below a surface 400-S of the substrate 400. The structure
in FIG. 4 is similar to and is made similarly to the structure in
FIG. 3 in all aspects but that the structure in FIG. 4 shows a
functional block 404 recessed below the surface 400-S. Thus, the
second substrate 400 includes a receptor 402 having the functional
block 404 deposited therein as previously described. The functional
block 404 includes contact pads 406 formed on a surface 404-T of
the block 404, in one embodiment. A conductive layer 408 is coupled
to the contact pads 406 such that electrical interconnection can be
established to the functional block 404.
[0039] In one embodiment, the conductive layer 408 is a conductive
trace that extends from the functional block 404. For instance, the
contact pads 406 may be extended so that it also forms the
conductive layer 408. The contact pads 406 may also be integral
parts of the conductive layer 408.
[0040] In one embodiment, an insulation layer (not shown) such as a
planarization layer may be included on top of the functional block
404 that has been deposited in the receptor 402. The insulation
layer may provide a flat surface to the second substrate 400 as
well as insulate certain components on top of the functional block
404. The insulation layer is particularly helpful to provide a flat
and even surface since the functional block 404 is recessed below
the surface 400-S of the second substrate 400. The insulation layer
may include one to more vias (not shown) created therethrough.
Electrical interconnection to the contact pads 406 would be
established through the vias.
[0041] In a particular device, a metalization layer such as the
metalization layer 202 may be formed on a non-conductive or
insulation layer. FIG. 5 illustrates such an embodiment. In FIG. 5,
a device 501 similar to the device 201 includes a non-conductive
layer 512 on a substrate 500 upon which a metalization layer 502 is
formed. The metalization layer 502 is formed on the non-conductive
layer 512. The non-conductive layer 512 may cover the entire
surface of the substrate 500, or not. In one embodiment, the
metalization layer 502 is not formed over all of the surface of the
substrate 500 or the non-conductive layer 512 such that a portion
506 having no metalization layer 502 is provided for the device
501. As before, a cap layer 504 is provided and formed over the
metalization layer 502 and may also be formed over the portion 506.
Additionally, a label 514 providing visual information or display
for the device 501 may be included in the device 501 and is placed
over the cap layer 504 and may also be placed over the portion
506.
[0042] An RFID integrated circuit chip 508 similar to previously
described (e.g., REID integrated circuit chip 208) may be coupled
to the device 501 as shown in FIG. 5 or as previously described. As
illustrated, the integrated circuit chip 508 includes a conductive
layer 510 that has a portion that is in a non-physical contact with
the metalization layer 502. As before, the RFID integrated circuit
chip 508 is placed in a close proximity but in a non-physical
contact with the metalization layer 502. As shown in FIG. 5, the
RFID integrated circuit chip 508 is placed in the portion 506 that
does not include any metalization layer 502. A portion of the
conductive layer 510 may very well be placed in a physical contact
with the metalization layer 502. As before, the RFID integrated
circuit chip 508 is capacitively coupled to the metalization layer
502 such that the metalization 502 acts as an antenna for an RFID
transponder for the device 501. The REID integrated circuit chip
508 may be deposited in a second substrate which is then adhered to
the first substrate 500 as previously discussed.
[0043] The conductive layer that is coupled to the RFID integrated
circuit chip acts as a coupler for the transponder. The conductive
layer provides additional surface area for the REID integrated
circuit chip so that the metalization layer can capacitively couple
to the REID integrated circuit chip. The conductive layer for the
RFID transponder may have any configuration. The conductive layer
may be of a straight, curved, circular, loop, dipole structure,
folded, or folded-dipole structure, for examples.
[0044] FIGS. 6-12 illustrate a few of the exemplary configurations
for the conductive layers (e.g., 210, 308, 408, and 510) that are
coupled to, attached to, or formed on the REID integrated circuit
chip. FIG. 6 illustrates a conductive layer 602 having a loop
configuration or circular configuration. The conductive layer 602
is coupled to contact pads 606 that are formed on an RFID
integrated circuit chip 604. As illustrated, the RFID integrated
circuit chip 604 is deposited in a receptor 622 that is formed on a
substrate 600. The conductive layer 602 is formed on a surface
600-S of the substrate 600 and connected to the REID integrated
circuit chip 604 through the contact pads 606. In one embodiment,
the substrate 600 having the RFID integrated circuit chip 602
deposited therein and the conductive layer 602 formed thereon is
placed on a substrate portion of a device (such as portions 206 and
506). The substrate 600 is placed on the portion that does not
comprise a metal structure or a metalization layer as previously
discussed. The conductive layer 602 may be partially touching the
metalization layer of the device but will have a portion that is
not in physical contact with the metalization layer of the
device.
[0045] FIG. 7 illustrates a conductive layer 702 with a curved
configuration.
[0046] FIG. 8 illustrates a conductive layer 802 with a straight
configuration. FIG. 9 illustrates a conductive layer 902 with a
dipole structure configuration. FIG. 10 illustrates a conductive
layer 1002 with a folded dipole configuration. FIG. 11 illustrates
a conductive layer 1102 with a curved dipole configuration. FIG. 12
illustrates a conductive layer 1202 with another example of a
curved dipole configuration. It will be apparent to those skilled
in the art that other structures for the conductive layer might be
possible.
[0047] FIGS. 13-14 illustrate an exemplary embodiment where an REID
transponder 1306 is directly incorporated into an electronic device
such as a CD 1300. In the present embodiment, the CD 1300 includes
a center portion 1302 with no conductive material or no
metalization layer. The CD 1300 also includes an opening 1304. FIG.
14 illustrates a cross section of the CD 1300 which includes a
substrate 1320 which may be made of a plastic material. On the
substrate 1320, a metalization layer 1322 is formed. The
metalization layer 1322 is coded with information stored on the CD
1300 using methods known in the art. The CD 1300 also includes a
cap layer 1324 covering at least all of the metalization layer
1322. The metalization layer 1322 is not formed over the center
portion 1302 of the CD 1300. The RFID transponder 1306 can be
formed as previously described. In one embodiment, the RFID
transponder 1306 includes a second substrate having an REID IC chip
1308 deposited therein as previously described.
[0048] In the present embodiment, the RFID transponder 1306 is
placed mostly on the center portion 1302. The RFID transponder 1306
may be placed near the edge of the center portion 1302 as shown in
FIG. 13. The RFID transponder 1306 can be adhered to the center
portion 1302 using adhesive. Other techniques of coupling the RFID
transponder 1306 to the CD 1300 might be possible. The RFID
transponder 1306 is placed so that the RFID IC chip 1308 is not
placed over any part of the CD 1300 that comprises the metalization
layer 1322. Portion of the second substrate of the RFID transponder
1306 can touch or can be in a physical contact or overlap with a
part of the CD 1300 that comprises the metalization layer 1322
without affecting the function of the RFID transponder 1306 so long
as the RFID IC chip 1308 is not physically contacting the
metalization layer 1322. The RFID IC chip 1308 is only capacitively
coupled to the metalization layer 1322 of the CD 1300. The RFID
transponder 1306 utilizes the metalization layer 1322 of the CD
1300 as an antenna for the RFID transponder 1306.
[0049] In one embodiment, the CD 1300 is balanced with one or more
weight balancing components 1340. For a device such as a CD or a
DVD to work well, the weight of the device must be balanced to
allow the device to spin at high speeds. The weight balancing
components 1340 may be structures that have similar weights as the
RFID transponder 1306. The weight of the weight balancing
components 1340 though need not match the weight of the RFID
transponder 1306 for the CD 1300 to be well balanced. The weight
balancing components 1340 may be placed along the center portion
1302 in a predetermined fashion so as to achieve balance spinning
weight for the CD 1300. In some embodiments, the RFID IC chip 1308
may be created so small and/or thin that balancing may not be
necessary.
[0050] In one embodiment, a label, not shown may be placed over the
entire surface of the CD 1300 after the RFID transponder 1306 is
incorporated into the CD 1300. The label may cover all areas of the
CD 1300 except for the opening 1304. A label for a device such as
the CD 1300 is well known in the art. In some embodiments, the
label may be the layer that includes the desired weight balancing
components 1340 such that when the label is placed over the CD
1300, the weight would be balanced.
[0051] FIG. 15 illustrates another exemplary embodiment where an
RFD transponder 1306 is incorporated into an electronic device such
as a CD 1300. The embodiment in FIG. 15 is similar to the
embodiment show in FIG. 13 above in all aspects. In addition, in
this embodiment, the RFID transponder 1306 includes a conductive
layer 1310 which acts as a coupler or coupling extension for the
RFID transponder 1306 that provides an extension for the RFID
transponder IC chip 1308 so that the RFID IC chip 1308 can be
capacitively coupled to the metalization layer 1322 of the CD 1300.
The conductive layer 1310 can be formed on the second substrate of
the RFID transponder 1306 as previously described. Alternatively,
the conductive layer 1310 can be formed or molded into the CD 1300
along an area of the center portion 1302. When the RFID transponder
1306 is coupled or adhered to the CD 1300, the conductive layer
1310 is electrical interconnected to the RFID IC chip 1308. For
instance, the RFID IC chip 1308 may include contact pads (not
shown) such that when the RFID transponder 1306 is coupled or
embedded into the CD 1300, the conductive layer 1310 will be in a
physical contact with the contact pads.
[0052] As shown here, the conductive layer 1310 is placed on the CD
1300 such that at least a portion of the conductive layer 1310 is
not in a physical contact with the metalization layer.
[0053] As before, in one embodiment, the CD 1300 is balanced with
one or more weight balancing components 1340. The weight balancing
components 1340 may be placed along the center portion 1302 in a
predetermined fashion so as to achieve balance spinning weight for
the CD 1300. A label, not shown may be also placed over the entire
surface of the CD 1300 after the RFID transponder 1306 is
incorporated into the CD 1300 and the conductive layer 1310
establishing the contact with the RFID IC chip 1308. The label may
cover all areas of the CD 1300 except for the opening 1304. The
label may also include the weight balancing components 1340 as
previously discussed.
[0054] FIG. 16 illustrates another exemplary embodiment where an
RFID transponder 1306 is incorporated into an electronic device
such as a CD 1300. The embodiment in FIG. 16 is similar to the
embodiment show in FIG. 13 or 15 above in all aspects. In addition,
in this embodiment, the RFID transponder 1306 includes a conductive
layer 1310 which acts as a coupler for the RFID transponder 1306
that provides an extension for the RFID transponder IC chip 1308 so
that the RFID IC chip 1308 can easily be capacitively coupled to
the metalization layer 1322 of the CD 1300. The conductive layer
1310 shown in FIG. 16 has a straight configuration and includes an
area that is in physical contact with a portion of the CD that
comprises the metalization layer 1322. The conductive layer 1310
has a portion that is not in a physical contact with the
metalization layer. The conductive layer 1310 can be formed on the
second substrate of the RFID transponder 1306 as previously
described. As shown in FIG. 16, the RFID IC chip 1308 includes
contact pads 1312 that interconnect to the conductive layer
1310.
[0055] As before, in one embodiment, the CD 1300 is balanced with
one or more weight balancing components 1340 which may be placed in
locations that will balance the weight for the CD 1300. A label,
not shown may be also placed over the entire surface of the CD 1300
after the RFID transponder 1306 is incorporated into the CD 1300
and the conductive layer 1310 establishing the contact with the
REID IC chip 1308. The label may cover all areas of the CD 1300
except for the opening 1304. The label may also include the weight
balancing components 1340 as previously discussed.
[0056] FIG. 17 illustrates another exemplary embodiment where an
RFID transponder 1306 is incorporated into an electronic device
such as a CD 1300. The embodiment in FIG. 17 is similar to the
embodiment show in FIG. 13, 15, or 16 above in all aspects. In
addition, in this embodiment, the RFID transponder 1306 includes a
conductive layer 1310 which acts as a coupler for the RFID
transponder 1306 that provides an extension for the RFID
transponder IC chip 1308 so that the REID IC chip 1308 can easily
be capacitively coupled to the metalization layer 1322 of the CD
1300. The conductive layer 1310 shown in FIG. 17 has a dipole and
loop configuration and includes an area that is in physical contact
with a portion of the CD that comprises the metalization layer
1322. The conductive layer 1310 has a portion that is not in a
physical contact with the metalization layer. The conductive layer
1310 can be formed on the second substrate of the RFID transponder
1306 as previously described.
[0057] As before, in one embodiment, the CD 1300 is balanced with
one or more weight balancing components 1340 which may be placed in
locations that will balance the weight for the CD 1300. A label,
not shown may be also placed over the entire surface of the CD 1300
after the RFID transponder 1306 is incorporated into the CD 1300
and the conductive layer 1310 establishing the contact with the
RFID IC chip 1308. The label may cover all areas of the CD 1300
except for the opening 1304. The label may also include the weight
balancing components 1340 as previously discussed.
[0058] FIG. 18 illustrates an exemplary embodiment where an RFID
transponder 1316 is incorporated directly into an electronic device
such as a CD 1300. In the present embodiment, the CD 1300 includes
a center portion 1302 with no conductive material or no
metalization layer. The RFID transponder 1316 is formed on the
center portion 1302. The CD 1300 also includes an opening 1304,
FIG. 14 illustrates a cross section of the CD 1300 which includes a
substrate 1320 which may be made of a plastic material. On the
substrate 1320, a metalization layer 1322 is formed. The
metalization layer 1322 is coded with information stored on the CD
1300 using methods known in the art. The CD 1300 also includes a
cap layer 1324 covering at least all of the metalization layer
1322. The metalization layer 1322 is not formed over the center
portion 1302 of the CD 1300.
[0059] In the present embodiment, to form the RFID transponder
1316, an RFID IC chip 1308 is molded, embedded, placed, coupled, or
otherwise adhered to the center portion 1302. Adhesive may be used
to coupled the RFID IC chip 1308 to the center portion 1302. Other
techniques of coupling the RFID IC chip 1308 to the CD 1300 might
be possible. The RFID IC chip 1308 is not placed over any part of
the CD 1300 that comprises the metalization layer 1322. The RFID IC
chip 1308 is placed at a predetermined distance (e.g., between
about 0.3 mm) away from the area that comprises the metalization
layer 1322. A conductive layer 1310 is interconnected to the RFID
IC chip 1308, in one embodiment, connected to contact pads (not
shown) formed on the REID IC chip 1308. In the present embodiment,
the conductive layer 1310 is formed directly on the center portion
1302. The conductive layer 1310 may be embedded, placed, coupled,
or otherwise adhered to the center portion 1302. At least some
portions of the conductive layer 1310 are not in a physical contact
with or overlap with a part of the CD 1300 that comprises the
metalization layer 1322. The RFID IC chip 1308 is only capacitively
coupled to the metalization layer 1322 of the CD 1300 via the
conductive layer 1310. As before, the RFID transponder 1316
utilizes the metalization layer 1322 of the CD 1300 as the antenna
for the RFID transponder 1316.
[0060] In one embodiment, the CD 1300 is balanced with one or more
weight balancing components 1340. The weight balancing components
1340 may be placed along the center portion 1302 in a predetermined
fashion so as to achieve balance spinning weight for the CD 1300.
In one embodiment, a label, not shown may be placed over the entire
surface of the CD 1300 after the RFID transponder 1316 is formed on
the CD 1300. The label may cover all areas of the CD 1300 except
for the opening 1304. The label may also include the weight
balancing components 1340 as previously mentioned.
[0061] FIGS. 19-20 illustrate an exemplary embodiment where an RFID
transponder 1306 is directly incorporated into an electronic device
such as a CD 1300. In the present embodiment, the CD 1300 includes
a center portion 1302 with no conductive material or no
metalization layer. The CD 1300 also includes an opening 1304. FIG.
20 illustrates a cross section of the CD 1300 which includes a
substrate 1320 which may be made of a plastic material. Optionally,
on the substrate 1320, a non-conductive layer 1344 is provided. On
the substrate 1320 (or on the non-conductive layer 1344), a
metalization layer 1322 is formed. The metalization layer 1322 is
coded with information stored on the CD 1300 using methods known in
the art. The CD 1300 also includes a cap layer 1324 covering at
least all of the metalization layer 1322. The metalization layer
1322 is not formed over the center portion 1302 of the CD 1300.
[0062] In one embodiment, an RFID transponder 1306 is formed on or
included into a label 1330 of the CD 1300 (FIG. 20). In the present
embodiment, an RFID IC chip 1308 is embedded into the label 1330
using methods known in the art (e.g., FSA). The chip 1308 may also
be placed into the label 1330 using other methods. The label 1330
may be a second substrate as previously described and include a
receptor configured to receive the chip 1308. The chip 1308 may
also be adhered to the label 1330 using a convenient technique such
as using adhesive. A conductive layer 1310 is then formed on the
label 11130 and interconnected to the chip 1308. The chip 1308 may
include contact pads (not shown) that the conductive layer 1310 is
connected to. A planarization layer (not shown) may be placed over
the side label 1330 to provide a smooth surface and a protective
layer for the chip 1308. In an alternative embodiment, the
conductive layer 1310 is formed on the CD 1300 and is connected to
the chip 1308 when the label 1330 is placed over the CD 1300. The
label 1330 is then placed over the CD 1300. The label 1330 has a
portion 1331 that overlaps with the center portion 1302 when the
label 1330 is placed over the CD 1300. The chip 1308 and portions
of the conductive layer 1310 is formed in the portion 1331 such
that when the label 1330 is placed over the CD 1300, the chip 1308
is not in a physical contact with a part of the CD that comprises
the metalization layer 1322. Additionally, when the label 1330 is
placed over the CD 1300, a portion of the conductive layer 1310 is
also not in a physical contact with the part of the CD that
comprises the metalization layer 1322. In one embodiment, the
conductive layer 1310 has a circular configuration and does not
have a part that overlaps the part of the CD that comprises the
metalization layer 1322. The RFID transponder 1306 forms a
capacitive coupling to the metalization layer 1322 utilizing the
metalization layer 1322 as an antenna layer.
[0063] In one embodiment, the RFID transponder 1306 can be formed
as previously described and then laminated or otherwise coupled to
the label 1330 (FIG. 21). In the present embodiment, the RFID
transponder 1306 includes a second substrate 1380 having an RFID IC
chip 1308 deposited therein. The RFID transponder 1306 also
includes a conductive layer 1310 formed on the second substrate
1380. The second substrate 1380 with all the necessary components
is then laminated or adhered to the label 1330 as shown in FIG. 21.
The label 1330 is then placed over the CD 1300. The label 1330 has
a portion 1331 that overlaps with the center portion 1302 when the
label 1330 is placed over the CD 1300. The RFID transponder 1306 is
laminated or adhered to the portion 1331 such that when the label
1330 is placed over the CD 1300, the chip 1308 is not in a physical
contact with a part of the CD that comprises the metalization layer
1322. Additionally, when the label 1330 is placed over the CD 1300,
a portion of the conductive layer 1310 is also not in a physical
contact with the part of the CD that comprises the metalization
layer 1322. In one embodiment, the conductive layer 1310 has a
circular configuration and does not have a part that overlaps the
part of the CD that comprises the metalization layer 1322. The RFID
transponder 1306 forms a capacitive coupling to the metalization
layer 1322 utilizing the metalization layer 1322 as an antenna
layer.
[0064] In one embodiment, the CD 1300 is balanced with one or more
weight balancing components 1340 as previously mentioned. The
weight balancing components 1340 may be placed on the label 1330)
for example, along the portion 1331 of the label 1330.
Alternatively, the weight balancing components 1340 may be placed
along the center portion 1302 in a predetermined fashion so as to
achieve balance spinning weight for the CD 1300 after the label
1300 is affixed thereto.
[0065] FIGS. 22-23 illustrate an exemplary embodiment where an RFID
transponder 1366 is incorporated into an electronic device such as
a CD 1300. In the present embodiment, the CD 1300 includes a center
portion 1302 with no conductive material or no metalization layer.
The CD 1300 also includes an opening 1304. FIG. 4 illustrates a
cross section of the CD 1300 which includes a substrate 1320 which
may be made of a plastic material. On the substrate 1320, a
metalization layer 1322 is formed. The metalization layer 1322 is
coded with information stored on the CD 1300 using methods known in
the art. The CD 1300 also includes a cap layer 1324 covering at
least all of the metalization layer 1322. The metalization layer
1322 is not formed over the center portion 1302 of the CD 1300.
[0066] As illustrated in FIG. 23, in one embodiment, an RFID
transponder 1366 includes a center ring structure or substrate 1350
which is placed on the center portion 1302 of the CD 1300. The
center ring structure 1350 includes an REID IC chip 1305
incorporated therein. In the present embodiment, the RFID IC chip
1308 is embedded into the center ring structure 1350 using methods
known in the art (e.g., FSA). The chip 1308 may also be placed into
the center ring structure 1350 using other methods. The center ring
structure 1350 is a second substrate that is adhered, coupled, or
otherwise attached to the substrate 1320 of the CD 1300 at the
center portion 1302. The center ring structure 1350 includes a
receptor (not labeled) that may be configured to receive the chip
1308. Alternatively, the chip 1308 may also be adhered to the
center ring structure 1350 using a convenient technique such as
using adhesive. A conductive layer 1310 is then formed on the
center ring structure 1350 and interconnected to and extended from
the chip 1308. The chip 1308 may include contact pads (not labeled)
that the conductive layer 1310 is connected to. The center ring
structure 1350 is placed over the CD 1300 at the center portion
1302. The center ring structure 1350 may cover the entire center
portion 1302 or may only cover a portion of the center portion
13002. The center ring structure 1350 is placed on the CD 1300 such
that the chip 1308 and portions of the conductive layer 1310 are
not in physical contacts with a part of the CD that comprises the
metalization layer 1322. In one embodiment, the conductive layer
1310 has a circular configuration and does not have a part that
overlaps the part of the CD that comprises the metalization layer
1322. The RFID transponder 1366 forms a capacitive coupling to the
metalization layer 1322 utilizing the metalization layer 1322 as an
antenna layer.
[0067] In one embodiment, the RFID transponder 1366 includes one or
more weight balancing components 1340 similar to previous
embodiments (FIGS. 22-23). The weight balancing components 1340 may
be placed or embedded directly into the center ring structure 1350.
Alternatively, the weight balancing components 1340 may be placed
along the center portion 1302 in a predetermined fashion so as to
achieve a balance spinning weight for the CD 1300 after the RFID
transponder 1366 is affixed thereto.
[0068] In one embodiment, a label, not shown may be placed over the
entire surface of the CD 1300 after the RFID transponder 1366 is
incorporated into the CD 1300. The label may cover all areas of the
CD 1300 except for the opening 1304.
[0069] FIG. 24 illustrates an exemplary method 2300 of processing
an electronic device in accordance to embodiments of the present
invention. The electronic device may be a CD 1300 or other
electronic device such as a CD, CD-ROM, CD-R, CD-RW, CD-I, DVD,
DVD-ROM, DVD-R, and DVD-RAM. Processing the device includes tagging
which may include, but is not limited to identifying,
authenticating, recognizing, inventorying, checking-in,
checking-out, tracking, locating, and sensing the electronic
device. In the embodiments of the present invention, tagging is
achieved using an RFID system comprises using an RFID reader and an
RFID transponder made in accordance to embodiments of the present
invention. At box 2302, an electronic device with identification
information for the electronic device is provided. As previously
described, the electronic device comprises a first substrate having
a metalization layer formed on the substrate, a cap layer covering
at least all of the metalization layer and at least a portion of
the substrate is not covered by the metalization layer. At box
2304, an RFID transponder according to embodiments of the present
invention is obtained. The RFID transponder is incorporated into
the device as previously described. The RFID tag includes an RFID
circuit chip that is capacitively coupled to the metalization layer
thus creating the RFID transponder. At box 2306, an RFID reader
receptive of the RFID transponder is provided. The RFID transponder
comprises the identification information and is incorporated into
the electronic device.
[0070] In another embodiment, a method similar to method 2300 is
provided. The method similar to method 2300 except that the RFID
transponder includes the integrated circuit chip coupled to the
first substrate and placed in proximity and in non-physical contact
with the metalization layer and a conductive layer attached to the
integrated circuit chip and having at least a portion placed in a
non-physical contact with the metalization layer. The integrated
circuit chip is capacitively coupled to the metalization layer
through the conductive layer and the metalization layer.
[0071] In another embodiment, a method similar to method 2300 is
provided. The method similar to method 2300 except that the RFID
transponder includes a label placed over the substrate, an
integrated circuit chip coupled to the label, and a conductive
layer attached to the integrated circuit chip. The integrated
circuit chip is placed in proximity and in non-physical contact
with the metalization layer. The conductive layer has at least a
portion placed in a non-physical contact with the metalization
layer. The integrated circuit chip is capacitively coupled to the
metalization layer through the conductive layer and the
metalization layer.
[0072] In another embodiment, a method similar to method 2300 is
provided. The method similar to method 2300 except that the RFID
transponder is formed in a center ring substrate as previously
described. At least a central portion of the substrate not covered
by the metalization layer and a center ring substrate placed over
the central portion. The center ring substrate comprises an
integrated circuit chip disposed therein. A conductive layer is
attached to the integrated circuit chip. One or more weight
balancing components are deposited on the center ring substrate.
The integrated circuit chip is placed such that the integrated
circuit chip is in proximity and in non-physical contact with the
metalization layer. The conductive layer has at least a portion
placed in a non-physical contact with the metalization layer. The
integrated circuit chip is capacitively coupled to the metalization
layer through the conductive layer and the metalization layer.
[0073] In one embodiment, an electronic device such as a CD or DVD
is tagged using an RFID transponder that is incorporated directly
into the electronic device in accordance to exemplary embodiments
of the present invention. In one embodiment, a CD or DVD is tagged
using such RFID transponder.
[0074] In another embodiment, a device such as a CD or DVD that is
tagged using an RFID transponder that is incorporated directly into
the electronic device is checked in or out of a library using a
complimentary REID reader, wherein the RFID transponder includes
information or identification information about the device and
communicates/transmits the information the RFID reader, which
identifies the information accordingly and facilitates the checking
in and/or checking out of the item. In one embodiment, when the
device is returned to the library, the RFID reader picks up the
information from the RFID transponder incorporated on the device
and automatically identifies and facilitates the check in process
of the device at the library.
[0075] In one embodiment, the RFID transponder functions as a
security device for an electronic device that incorporates the RFID
transponder directly into the electronic device. The RFID
transponder sends a signal to a security gate which includes an
RFID reader and is positioned at a particular location as the
device passes through the gate. The RFID transponder allows the
device to be detected and/or checked out. Such security gate may be
included at a retailer selling the device, a rental store renting
the device, or a library maintaining the device.
[0076] In one embodiment, the RFID transponder enables automatic
check in and/or check out of an electronic device that incorporates
the RFID transponder directly into the electronic device. When an
REID reader is provided, the device with the RFID transponder can
be automatically detected for checking in and checking out
process.
[0077] In one embodiment, the RFID transponder facilitates sorting
of a device returned to a particular location such as a library or
a rental store. When an electronic device includes an RFID
transponder that is incorporated directly into the device, when the
device is return to appropriate location where an REID reader is
placed, the item is detected and automatically checked in. In one
embodiment, an REID-enable automatic sorter is provided. The
REID-enable automatic sorter picks up signal from the RFID
transponder on the device, automatically checks in the device, and
automatically sorts and/or places the device into an appropriate
location/container according to the information provided in the
RFID transponder.
[0078] In one embodiment, the RFID transponder facilitates
shelving, organizing, locating, identifying, or tracking, or other
similar task an electronic device that incorporates the RFID
transponder directly into the electronic device. An REID reader is
provided. The RFID reader can scan or pick up signals from the
device's REID transponder and enters or checks the location of the
device which facilitates shelving, organizing, locating,
identifying, tracking, or other similar task of the device.
[0079] Other aspects of the invention relate to content protection.
For example, an REID IC may be integrated with a device such as a
CD or DVD and may, (in addition to or an alternative to
identifying, through a contactless, wireless manner, the particular
CD or the content on the CD) provide a way to prevent successful
copying of the CD, DVD, or other machine readable medium. In this
example, the RFID IC is embedded within the CD itself and may be
read by a reader in the CD player. The RFID IC may transmit a code
(which may be encoded or encrypted) to the reader in the CD player
(or within the system which includes the CD player), and the CD
player can process this code to determine whether the CD is
authentic (and not a pirated copy). There are numerous possible
implementations for protecting the content of a CD or other machine
readable media with an RFID IC embedded within the storage medium
such as a CD.
[0080] One implementation may merely involve wireless by reading a
code or value from the RFID IC when the machine readable medium
(which contains the RFID IC) is placed into a playback device
(e.g., a CD player) and comparing this code or value to a code or
value read from the machine readable medium. If the codes or values
match, then the playback device "knows" that the machine readable
medium is authentic. If the codes or values do not match, then the
playback device "knows" that the machine readable medium is NOT
authentic and the playback device will refuse to playback (or
otherwise interact with) the medium and may cause the medium to be
ejected. The playback device would normally include a standard
playback device (e.g., a CD laser and head and associated
electronics and motors) and an RFID reader which transmits an
interrogation signal to the RFID IC in the machine readable medium
and which receives a response from the transponding RFID IC which
is embedded with the machine readable medium which is inserted into
the playback device.
[0081] FIG. 25 shows an example of a playback system for use in one
exemplary aspect of the invention. The playback system 2501 may be
a stand-alone CD player or DVD player or may be part of a larger
system (e.g., the playback system 2501 may be a CD/DVD drive in a
general purpose computer system). The playback system 2501 is
designed to receive a machine readable medium 2503 (which may be a
CD, DVD, etc.) which includes an REID IC 2502. The RFID IC 2502
includes one or more codes or values which identify the medium and
which can also be used to prevent successful copying of the content
stored on the medium. A drive system 2505 receives the medium 2503
and positions the medium 2503 relative to a read head (e.g., a CD
laser and detector head). The drive system 2505 is coupled to and
controlled by the control logic 2509. The control logic 2509
controls the drive system 2505 and also controls the operation of
and receives signals (e.g., codes or values) from the RFID reader
2507. These signals are obtained from the REID IC. The Input/Output
("I/O") control 2511 is coupled to the control logic 2509 in order
to provide an output and/or input to the playback system 2501. The
I/O control 2511 may receive audio or audiovisual data from the
medium 2503 and provide this data to speakers or a display device
or to another subsystem (e.g., portions of a computer or TV). The
control logic 2509 may perform the comparisons described above
(e.g., matching a code from the REID IC with a code stored in the
medium 2503) in order to verify that the medium is authentic. Other
alternative playback architectures may be implemented with an REID
reader which reads an RFID IC embedded with a machine readable
medium.
[0082] Another exemplary implementation may, rather than merely
determining whether a value read from the RFID IC matches a value
read from the machine readable medium which contains the RFID IC,
use an encoding scheme or encryption scheme to make copying
difficult. One or more values stored in the RFID IC may be encoded
and/or encrypted and one or more values stored on the machine
readable medium may also be encoded and/or encrypted, and the
playback device processes these values to determine whether the
content of the machine readable medium is authentic. For example,
if each CD or other medium from a particular source (e.g.,
Microsoft) has a serial number, that serial number may be encrypted
(e.g., with a private key of a public key/private key system) and
stored in the RFID IC. When the playback device reads the RFID IC,
it retrieves this encrypted serial number and decrypts this number
(e.g., with the source's public key) to obtain the unencrypted
("clear") serial number and compares this serial number from the
RFID IC to the serial number stored on the medium. If there is a
match then the medium is authentic and if there is no match then it
is not authentic. Numerous other encoding schemes or encryption
schemes which are known in the art may alternatively be
applied.
[0083] While the invention has been described in terms of several
embodiments, those of ordinary skill in the art will recognize that
the invention is not limited to the embodiments described. The
method and apparatus of the invention, but can be practiced with
modification and alteration within the spirit and scope of the
appended claims. The description is thus to be regarded as
illustrative instead of limiting.
[0084] Having disclosed exemplary embodiments, modifications and
variations may be made to the disclosed embodiments while remaining
within the spirit and scope of the invention as defined by the
appended claims.
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