U.S. patent application number 12/489457 was filed with the patent office on 2009-12-24 for burn-in socket with adapter for loading ic package.
This patent application is currently assigned to HON HAI PRECISION INDUSTRY CO., LTD.. Invention is credited to WEI-CHIH LIN.
Application Number | 20090317988 12/489457 |
Document ID | / |
Family ID | 41431690 |
Filed Date | 2009-12-24 |
United States Patent
Application |
20090317988 |
Kind Code |
A1 |
LIN; WEI-CHIH |
December 24, 2009 |
BURN-IN SOCKET WITH ADAPTER FOR LOADING IC PACKAGE
Abstract
A burn-in socket for receiving an IC package comprises a base
defining a cavity for receiving the IC package and an adapter
retained in the cavity. The adapter has two-pieces configuration
and comprises a loading board for loading the IC package and a
positioning board assembled upon the bottom plate of the loading
board for positioning the IC package.
Inventors: |
LIN; WEI-CHIH; (Tu-Cheng,
TW) |
Correspondence
Address: |
WEI TE CHUNG;FOXCONN INTERNATIONAL, INC.
1650 MEMOREX DRIVE
SANTA CLARA
CA
95050
US
|
Assignee: |
HON HAI PRECISION INDUSTRY CO.,
LTD.
Tu-Cheng
TW
|
Family ID: |
41431690 |
Appl. No.: |
12/489457 |
Filed: |
June 23, 2009 |
Current U.S.
Class: |
439/68 |
Current CPC
Class: |
G01R 31/2863 20130101;
G01R 1/0466 20130101; H05K 7/10 20130101 |
Class at
Publication: |
439/68 |
International
Class: |
H01R 12/00 20060101
H01R012/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 23, 2008 |
TW |
97211085 |
Claims
1. A burn-in socket for receiving an IC package, comprising: a base
defining a cavity for receiving the IC package; and an adapter
retained in the cavity and having a loading board and a positioning
board, the loading board having a bottom plate for loading the IC
package, the positioning board detachably assembled upon the bottom
plate of the loading board and defining an opening for positioning
the IC package.
2. The burn-in socket as claimed in claim 1, wherein the bottom
plate of the loading board defines a plurality of slots, the
positioning board is provided with a plurality of clasps on a
bottom surface thereof to engage with the slots of the loading
board to mount the positioning board on the bottom plate of the
loading board.
3. The burn-in socket as claimed in claim 2, wherein the loading
board has a plurality of latching arms extending downwardly to
retain the loading board on a bottom of the cavity of the base.
4. The burn-in socket as claimed in claim 3, wherein the loading
board has a plurality of rims around the bottom plate, the
positioning board is positioned by the rims.
5. The burn-in socket as claimed in claim 4, further comprising a
cover, an end of the cover is pivotally assembled to the base, and
an opposite end of the cover is pivotally assembled with a locking
member to lock the cover to the base.
6. The burn-in socket as claimed in claim 5, further comprising a
heat sink mounded on the cover.
7. The burn-in socket as claimed in claim 1, wherein the
positioning board can be changed with another suitable positioning
board for another IC package which has a different size with the IC
package.
8. A burn-in socket comprising: an insulative base defining a
plurality of contact passageways; a loading board discrete from but
attached upon the base, said loading board defining a plurality of
contact grooves in vertical alignment with the corresponding
contact passageways, respectively; a positioning board discrete
from but detachably attached upon the loading board, said
positioning board including a center opening defined by a
predetermined periphery for compliantly confinedly receive a
corresponding IC package in the center opening under condition that
said IC package is directly seated upon the loading board and
corresponding conductors of the IC package are mechanically and
electrically engaged with corresponding contacts, respectively.
9. The burn-in socket as claimed in claim 8, wherein said base
defines a cavity in which said loading board and said positioning
board and the IC package are disposed.
10. The burn-in socket as claimed in claim 9, further including a
cover pivotally mounted to one end of the base;
11. The burn-in socket as claimed in claim 10, wherein said cover
defines a center through hole through which a heat sink extends,
and said heat sink is seated upon the IC package.
12. The burn-in socket as claimed in claim 8, wherein said
positioning board is unitarily formed as one piece.
13. The burn-in socket as claimed in claim 8, wherein the loading
board defines a plurality of rims to form a boundary to confine
said positioning board therein.
14. The burn-in socket as claimed in claim 8, wherein said loading
board is unitarily formed as one piece.
15. The burn-in socket as claimed in claim 8, wherein said loading
board is detachable with regard to the base.
16. A burn-in socket for receiving an IC package, comprising: a
base defining a cavity for receiving the IC package; a plurality of
contacts disposed in the base for mechanical and electrical
engagement with corresponding conductors of the IC package; a
detachable adapter discrete from the base but retained in the
cavity and having a bottom plate for loading the IC package, a
positioning board located upon the bottom plate and defining an
opening for circumferentially positioning the IC package; wherein
said bottom plate defines a plurality of contact grooves in
vertical alignment with the corresponding contacts,
respectively;
17. The burn-in socket as claimed in claim 16, wherein said bottom
plate is formed on a loading board which attaches the adaptor to
the base.
18. The burn-in socket as claimed in claim 17, wherein said loading
board defines a plurality of rims to circumferentially confine the
positioning board therein.
19. The burn-in socket as claimed in claim 18, wherein said
positioning board is attached to the bottom plate.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a burn-in socket, and more
particularly to a burn-in socket with an adapter, which has a
loading board for loading an IC package and a positioning board
mounted upon the loading board for positioning the IC package.
DESCRIPTION OF RELATED ART
[0002] IC packages are miniaturized electronic devices, in which a
number of active and passive circuit elements are located on or
within a continuous body of material to perform the function of a
complete circuit. To ensure the functionality and reliability
during its service life, the IC package must be conducted with a
burn-in test before actual field application. The IC package in the
burn-in test usually undergoes an extended period of time at a high
temperature, so that any earlier failure of the IC package can be
detected accordingly. A so-called burn-in socket is provided, in
which the electronic packages are placed in an oven and operated
for a time at an elevated temperature, e.g., 140 degrees C., and
under a voltage source that is greater than the rated value; those
IC packages that continue to perform satisfactorily and
functionally are then approved for shipment.
[0003] A typically burn-in socket usually has a base with a
plurality of contacts therein and a cover mounted on the base and
being movable relative to the base. The base has a rectangular
configuration, and defines a receiving cavity for the IC package
and a plurality of contact passageways on the bottom of the
receiving cavity for receiving the contacts. The base is assembled
with a locking portion and a pivoting portion for pivotally
mounting the cover on the base, on two sides thereof respectively;
the cover is assembled with a latching portion engaging with the
locking portion disposed on the base to latch the cover on the
base. The base of above typically burn-in socket is integrally made
by inserting molding by using a mold, in fact, it is a simple
process. However, there are variable IC packages, and each has a
different dimension, correspondingly, different burn-in sockets are
needed for different electronic packages. To reduce a producing
time and accelerate developing speed, people usually modify the
mold used for a previous burn-in socket and then make another
suitable burn-in socket by the mold again. However, it still cost a
lot of money and time to modify the mold.
[0004] Hence, an improved burn-in socket is required to overcome
the above-mentioned disadvantages of the related art.
SUMMARY OF THE INVENTION
[0005] Accordingly, an object of the present invention is to
provide a burn-in socket with an adapter, which has a loading board
for loading an IC package and a positioning board mounted upon the
loading board for positioning the IC package.
[0006] To achieve the aforementioned objects, a burn-in socket for
receiving an IC package comprises a base defining a cavity for
receiving the IC package and an adapter retained in the cavity. The
adapter has a loading board and a positioning board, the loading
board has a bottom plate for loading the IC package, the
positioning board is detachably assembled upon the bottom plate of
the loading board and defines an opening for positioning the IC
package.
[0007] Other objects, advantages and novel features of the
invention will become more apparent from the following detailed
description of a preferred embodiment when taken in conjunction
with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] FIG. 1 is an assembled, perspective view of a burn-in socket
in accordance with the present invention;
[0009] FIG. 2 is a partially exploded, perspective view of the
burn-in socket in accordance with the present invention;
[0010] FIG. 3 is an exploded, perspective view of the burn-in
socket in accordance with the present invention;
[0011] FIG. 4 is an exploded, perspective view of an adapter of the
burn-in socket in accordance with the present invention, taken from
a bottom side; and
[0012] FIG. 5 is an assembled, perspective view of the adapter of
the burn-in socket in accordance with the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0013] Reference will now be made to the drawings to describe the
present invention in detail.
[0014] Referring to FIGS. 1-2, a burn-in socket in accordance to a
preferred embodiment of present invention mounted on a testing
printed circuit board (not shown) for receiving an integral circuit
(IC) package 6 comprises a base 1, an adapter 2 received in the
base 1, a heat sink 3 and a cover 4 pivotally assembled to the base
1.
[0015] Referring to FIG. 2 to FIG. 5, the base 1 has a rectangular
configuration and is formed with a bottom wall 11 and a plurality
of sidewalls 12 disposed on a periphery of the bottom wall 11, the
bottom wall 11 and the sidewall 12 corporately defines a
rectangular cavity 10 for receiving the IC package 6. The bottom
wall 11 is located under the cavity 10 and defines a plurality of
contact passageways 13 for receiving a plurality of contacts (not
shown). The base 1 is provided with two clumps 14 on two opposite
sides of an end thereof, and a pivot hole (not labeled) is defined
on an inner side surface of the clump 14 for a pin shaft 16 passing
therethough.
[0016] The cover 4 is integrally made from metallic material and
has two engaging portions 40 on two opposite sides of an end
thereof, each engaging portion 40 has a shaft hole 41 for the pin
shaft 16 passing through to pivot the cover 4 to the base 1. The
cover 4 has a locking member 42 arranged on an opposite end
thereof, which locks the cover 4 on the base 1 to remain in a close
state. The heat sink 3 is retained to the cover 4 by a linking
shaft 30 and rotates with the cover 4 relative to the base 1. The
cover 4 further defines a mouth 43 for the heat sink 3 passing
through.
[0017] The adapter 2 is received on the bottom of the cavity 10 of
the base 1 and comprises a loading board 20 and a positioning board
22 assembled upon the loading board 20. The loading board 20 is
formed with a bottom plate 201 for loading the IC package 6 and a
plurality of rims 202 located around the bottom plate 201 and
protruding upwardly. The bottom plate 201 defines a plurality of
contact grooves (not shown) corresponding to the contact
passageways 13 of the base 1. The bottom plate 201 further has a
plurality of slots 203 on four corners thereof. The loading board
20 has a plurality of latching arms 204 extending downwardly from
outside of four corners thereof to retain the loading board 20 in
the base 1.
[0018] The positioning board 22 has a piece-like shape and defines
an opening 220 on a center thereof to position the IC package 6.
The positioning board 22 has a plurality of clasps 221 extending
downwardly from a bottom surface thereof to engage with the slots
203 to retain the positioning board 22 upon the bottom plate 201 of
the loading board 20, the rims 202 of the loading board 20 position
the positioning board 22.
[0019] Referring to FIG. 2 and FIG. 5, when assembling, the contact
(not shown) are pre-assembled in the base 1; and then the
positioning board 22 is retained on the loading board 20; then the
assembled adapter 2 is put in the cavity 10 of the base 1; after
the heat sink 3 is assembled on the cover 4 by the linking shaft
30, the cover 4 is pivotally assembled to the base 1 by the pin
shaft 16, so the burn-in socket is completely assembled. The IC
package 6 is received in the cavity 10 and put on the adapter 2
when the cover 4 is in an opened position; then the cover 4 is
rotated to a closed position and locked on the close position by
the locking member 42 engaging with the base.
[0020] The adapter 2 of the burn-in socket of present invention is
two-pieces configuration, so people only need to change the
positioning board 22 of the adapter 2 to suit another IC package
(not shown) with a different size, so the burn-in socket can be
repeatedly used, thereby producing cost is reduced and efficiency
is improved.
[0021] However, the disclosure is illustrative only, changes may be
made in detail, especially in matter of shape, size, and
arrangement of parts within the principles of the invention.
* * * * *