U.S. patent application number 12/548755 was filed with the patent office on 2009-12-17 for apparatus and method for applying conductive paste onto electronic component.
This patent application is currently assigned to SAMSUNG ELECTRO-MECHANICS CO.. Invention is credited to Jae Taek KIM.
Application Number | 20090307902 12/548755 |
Document ID | / |
Family ID | 37854267 |
Filed Date | 2009-12-17 |
United States Patent
Application |
20090307902 |
Kind Code |
A1 |
KIM; Jae Taek |
December 17, 2009 |
APPARATUS AND METHOD FOR APPLYING CONDUCTIVE PASTE ONTO ELECTRONIC
COMPONENT
Abstract
An apparatus and a method for applying a conductive paste, for
forming electrodes, onto an electronic component, such as a micro
chip device. The apparatus includes a first jig unit provided with
paste holes, which are filled with the conductive paste; and a
second jig unit being movable and provided with extruding pins,
which are inserted into the paste holes of the first jig unit, for
allowing the conductive paste to be applied onto the electronic
component. The conductive paste is applied onto the electronic
component, while the electronic component is loaded onto or
unloaded from the first jig unit. The apparatus and the method
allow the conductive paste for forming electrodes to be precisely
applied onto the electronic component, easily adjust the amount of
the applied conductive paste, prevent the spreading of the
conductive paste or the incorrect application of the conductive
paste, allow jig units, for applying the conductive paste onto the
electronic component, to be used for a long time without
replacement or washing, cause the reduction of the maintenance
costs of the apparatus, and facilitate the formation of electrodes
having various shapes on the electronic component.
Inventors: |
KIM; Jae Taek; (Busan,
KR) |
Correspondence
Address: |
MCDERMOTT WILL & EMERY LLP
600 13TH STREET, N.W.
WASHINGTON
DC
20005-3096
US
|
Assignee: |
SAMSUNG ELECTRO-MECHANICS
CO.
Kyungki-Do
KR
|
Family ID: |
37854267 |
Appl. No.: |
12/548755 |
Filed: |
August 27, 2009 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
11513219 |
Aug 31, 2006 |
7597232 |
|
|
12548755 |
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Current U.S.
Class: |
29/846 |
Current CPC
Class: |
Y10T 225/245 20150401;
H05K 1/092 20130101; Y10T 29/53209 20150115; Y10T 29/53204
20150115; H05K 2203/0113 20130101; H01G 13/006 20130101; Y10T
29/49155 20150115; H05K 2203/0338 20130101; H05K 3/403 20130101;
Y10T 29/532 20150115 |
Class at
Publication: |
29/846 |
International
Class: |
H05K 3/10 20060101
H05K003/10 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 14, 2005 |
KR |
10-2005-0085722 |
Claims
1-7. (canceled)
8. A method for applying a conductive paste onto an electronic
component comprising: filling paste holes of a first jig unit with
the conductive paste; loading the electronic component onto the
first jig unit; moving extruding pins of a second jig unit, which
are inserted into the paste holes of the first jig unit, upward to
apply the conductive paste onto the electronic component; and
unloading the electronic component, with the conductive paste
applied thereonto, from the first jig unit.
9. The method according to claim 8, wherein the electronic
component is loaded onto or unloaded from the first jig unit under
the condition that the electronic component is disposed above the
upper surface or below the lower surface of the first jig unit in a
horizontally laid state, or is disposed by the side of the first
jig unit in a vertically erected state.
10. The method according to claim 8, wherein the paste holes of the
first jig unit and the extruding pins of the second jig unit have
the same shape, and form electrodes having various shapes, each of
which is one selected from the group consisting of a circle, a
rectangle, a polygon, a star, and a bar, on the electronic
component.
Description
RELATED APPLICATION
[0001] The present application is based on, and claims priority
from, Korean Application Number 2005-85722 filed on Sep. 14, 2005,
the disclosure of which is hereby incorporated by reference herein
in its entirety.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to an apparatus and a method
for applying a conductive paste, for forming electrodes, onto an
electronic component, especially a (micro) chip device, and more
particularly to an apparatus and a method for applying a conductive
paste onto an electronic component to allow the conductive paste to
be precisely applied onto the electronic component and to precisely
adjust the amount of the applied conductive paste.
[0004] 2. Description of the Related Art
[0005] In a manufacturing process of an electronic component, for
example, a micro chip device, such as a multi layer ceramic
capacitor (MLCC), a method for forming external electrodes on the
chip device by applying a conductive paste for the external
electrodes onto the chip device and baking the conductive paste has
been widely used.
[0006] However, in case that the conductive paste for forming
external electrodes is applied onto the electronic component, such
as the micro chip device, as the chip device has been recently
miniaturized, the precision in applying the conductive paste onto
the chip device becomes an issue.
[0007] For example, FIG. 1 illustrates a conventional chip device,
and FIG. 2 illustrates a conventional highly dense chip device.
[0008] The highly dense chip device 110 of FIG. 2 is an array type,
and thus a plurality of external electrodes 112 are formed on one
chip device 110. That is, a plurality of chip units is integrated
into one highly dense chip device 110.
[0009] In order to satisfy the mounting requirement of the chip
device on a substrate, the amount of the applied conductive paste
has been increased, the performance of the chip device has been
improved, and further, the chip device has been developed to a
small size. There is a clear distinction between the highly dense
chip device 110 and the general chip device 100 of FIG. 1. For
example, the highly dense chip device 110 of FIG. 2 comprises four
circuits (not shown), and eight micro (external) electrodes 112,
each of which is formed at both sides of the corresponding one of
the circuits.
[0010] However, the general chip device 100 of FIG. 1, which is not
integrated, comprises one circuit, and two (external) electrodes
102, each of which is formed at both sides of the circuit.
[0011] One of important problems to be solved for achieving the
highly dense integration of the chip device is how to precisely
form electrodes on the micro chip device, and the precise formation
of the electrodes depends on the precision in applying a conductive
paste onto the micro chip device.
[0012] For example, conventional conductive paste applying methods
can be used to apply a conductive paste onto a micro chip device
having a size of 2 mm.times.1.2 mm (hereinafter, referred to as a
"2012 device"), which has been mainly used, so as to maintain the
precision in applying the conductive paste. However, the above
method cannot be substantially used to precisely apply a conductive
paste onto a micro chip device having a smaller size of 1.6
mm.times.0.8 mm (hereinafter, referred to as a "1608 device") and a
micro chip device having a smaller size of 1.0 mm.times.0.5 mm
(hereinafter, referred to as a "1005 device"), thus generating
problems in manufacturing micro chip devices.
[0013] FIGS. 3 and 4 illustrate conventional methods for applying a
conductive paste onto a chip device.
[0014] FIG. 3 illustrates a method for applying (transferring) a
conductive paste using wheels. In this method, a conductive paste
is applied onto an electronic component using wheels 120 made of
rubber or urethane.
[0015] As shown in FIG. 3, an electronic component, for example, a
chip device 110, is mounted on a carrier tape (not shown), and the
wheels 120, each of which is provided with grooves 124 filled with
a conductive paste 122, continuously contact the chip device 110
while rotating. Thereby, the conductive paste 122 is applied onto
the chip device 110 and it is possible to achieve mass production
of the chip device 110.
[0016] Further, FIG. 4 illustrates a method for applying a
conductive paste using a plate.
[0017] In this method of FIG. 4, a conductive paste 132 is applied
onto the micro chip device 110 using a flat plate 130. The flat
plate 130 is made of rubber or urethane, and is provided with
grooves 134 filled with the conductive paste 132.
[0018] The above method apply (transfer) the conductive paste 132
simultaneously onto several hundreds of devices by increasing the
size of the flat plate 130 and the size of a carrier plate for
fixing the components, for example, a jig.
[0019] However, the above conventional applying methods generate
several problems. For example, as shown in FIGS. 3 and 4, the
wheels 120 and the flat plate 130, which are made of rubber or
urethane, may be easily damaged by pressure applied thereto when
the conductive paste is applied onto the electronic component.
Thus, it is difficult to precisely apply the conductive paste onto
the electronic component.
[0020] Since the wheels and the flat plate have a limitation in
applying the conductive paste thereonto, the conventional applying
methods cannot be used to manufacture micro chip devices having a
size less than that of the 1608 device.
[0021] The amount of the applied conductive paste is limited due to
the surface tension of rubber or urethane. For example, only
approximately 50% of the total amount of the conductive paste
filling the grooves of the wheels or the flat plate is
substantially applied onto the chip device, thus causing problems,
such as cleaning of remaining paste, and in a serious case, the
replacement of the wheels or the flat plate with a new one.
[0022] The wheels and the flat plate, which are made of rubber or
urethane, are easily abraded by the pressure, thus having a
shortened life span.
[0023] In order to solve the above problems, Japanese Patent
Laid-open Publication No. 1997-148723 discloses a solder ball
transfer jig. The solder ball transfer jig comprises a transfer
mask and a plate. The transfer mask is provided with discs each
having a recess on its top surface is carrying a solder ball to be
supplied to each of pads of a substrate, and holes each having an
elastic member inserted thereinto. The plate is provided with
projections inserted into the holes of the transfer mask for
pushing the solder balls against the pads of the substrate, and
moves below the transfer mask.
[0024] Since a conductive paste does not fill the transfer mask,
the above transfer jig cannot use the applying method, in which the
transfer jig is filled with the conductive paste. Further, the
transfer jig uses the discs and the elastic members, which are
separately prepared, thus having a complicated structure.
SUMMARY OF THE INVENTION
[0025] Therefore, the present invention has been made in view of
the above problems, and it is an object of the present invention to
provide an apparatus and a method for applying a conductive paste
onto an electronic component to allow the conductive paste, for
forming electrodes, to be precisely applied onto the electronic
component, to precisely adjust the amount of the applied conductive
paste, and to prevent the spreading of the conductive paste or the
incorrect application of the conductive paste when the conductive
paste forms the external electrodes, thus improving the quality of
the external electrodes formed by applying the conductive
paste.
[0026] It is another object of the present invention to provide an
apparatus and a method for applying a conductive paste onto an
electronic component to allow jig units, for applying the
conductive paste, to have a semi-permanent life span and thus be
used for a long time without replacement or washing, to reduce the
maintenance costs of the apparatus, and to facilitate the formation
of electrodes having various shapes.
[0027] In accordance with one aspect of the present invention, the
above and other objects can be accomplished by the provision of an
apparatus for applying a conductive paste to an electronic
component comprising a first jig unit provided with paste holes,
which are filled with the conductive paste; and a second jig unit
being movable and provided with extruding pins, which are inserted
into the paste holes of the first jig unit, for allowing the
conductive paste to be applied onto the electronic component.
[0028] Preferably, an interval between one surface of the first jig
unit contacting the electronic component and the upper surface of
each of the extruding pins of the second jig unit inserted into the
paste holes is varied according to the amount of the conductive
paste applied onto the electronic component.
[0029] Further, preferably, the electronic component has a
spherical shape, the first jig unit includes a spherical plane for
loading the spherical electronic component, and the paste holes are
straight or bent according to regions of the spherical plane.
[0030] Here, the electronic component is loaded onto or unloaded
from the first jig unit under the condition that the electronic
component is disposed above the upper surface or below the lower
surface of the first jig unit in a horizontally laid state, or is
disposed by the side of the first jig unit in a vertically erected
state.
[0031] The apparatus further comprises a third jig unit provided
with filling portions, which are inserted into the paste holes of
the first jig unit, allow the extruding pins of the second jig unit
to be inserted thereinto, and are filled with the conductive
paste.
[0032] The jig units are made of one selected from the group
consisting of metals, nonferrous metals, and high-strength
plastics.
[0033] In accordance with another aspect of the present invention,
there is provided a method for applying a conductive paste onto an
electronic component comprising filling paste holes of a first jig
unit with the conductive paste; loading the electronic component
onto the first jig unit; moving extruding pins of a second jig
unit, which are inserted into the paste holes of the first jig
unit, upward to apply the conductive paste onto the electronic
component; and unloading the electronic component, with the
conductive paste applied thereonto, from the first jig unit.
[0034] The electronic component is loaded onto or unloaded from the
first jig unit under the condition that the electronic component is
disposed above the upper surface or below the lower surface of the
first jig unit in a horizontally laid state, or is disposed by the
side of the first jig unit in a vertically erected state.
[0035] The paste holes of the first jig unit and the extruding pins
of the second jig unit have the same shape, and form electrodes
having various shapes, each of which is one selected from the group
consisting of a circle, a rectangle, a polygon, a star, and a bar,
on the electronic component.
BRIEF DESCRIPTION OF THE DRAWINGS
[0036] The above and other objects, features and other advantages
of the present invention will be more clearly understood from the
following detailed description taken in conjunction with the
accompanying drawings, in which:
[0037] FIG. 1 is a perspective view of a conventional chip
device;
[0038] FIG. 2 is a perspective view of a conventional highly dense
chip device;
[0039] FIG. 3 is a schematic view illustrating a conventional
method for applying a conductive paste onto a chip device;
[0040] FIG. 4 is a schematic view illustrating another conventional
method for applying a conductive paste onto a chip device;
[0041] FIG. 5 is schematic view illustrating an apparatus for
applying a conductive paste onto an electronic component in
accordance with one embodiment of the present invention;
[0042] FIGS. 6a and 6b are schematic views illustrating the
vertical disposition of the apparatus of the present invention and
a component, and more specifically: [0043] FIG. 6a is a view of the
apparatus in a state in which a component is disposed below the
lower surface of the apparatus; and [0044] FIG. 6b is a view of the
apparatus in a state in which a component is disposed above the
upper surface of the apparatus;
[0045] FIGS. 7a and 7b are schematic views illustrating the
horizontal disposition of the apparatus of the present invention
and a component, and more specifically, [0046] FIG. 7a is a view of
the apparatus in a state in which the apparatus is disposed at both
sides of a component; and [0047] FIG. 7b is a view of the apparatus
in a state in which the apparatus is disposed at one side of a
component;
[0048] FIGS. 8a to 8g are sectional views for illustrating a method
for applying a conductive paste onto an electronic component using
the apparatus of the present invention;
[0049] FIGS. 9a and 9b are views illustrating an apparatus for
applying a conductive paste onto an electronic component in
accordance with a modified embodiment of the present invention, and
more specifically, [0050] FIG. 9a is a plane view illustrating the
state of a spherical component, onto which a conductive paste is
applied; and [0051] FIG. 9b is a schematic view illustrating the
apparatus corresponding to the spherical component;
[0052] FIGS. 10a to 10c are views illustrating various shapes of
electrodes formed using the apparatus of the present invention, and
more specifically, [0053] FIG. 10a is a schematic view illustrating
electrodes having a circular shape; [0054] FIG. 10b is a schematic
view illustrating electrodes having circular and star shapes; and
[0055] FIG. 10c is a schematic view illustrating electrodes having
various shapes; and
[0056] FIG. 11 is a sectional view of an apparatus for applying a
conductive paste onto an electronic component, which employs a
multi-stage jig structure including at least three jig units, in
another modified embodiment of the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0057] Now, preferred embodiments of the present invention will be
described in detail with reference to the annexed drawings.
[0058] First, FIG. 5 illustrates an apparatus 1 for applying a
conductive paste onto an electronic component in accordance with
one embodiment of the present invention.
[0059] As shown in FIG. 5, the apparatus 1 of the present invention
comprises a first jig unit 10 and a second jig unit 30.
[0060] The first jig unit 10 is provided with paste holes 12, which
are filled with a conductive paste (P of FIG. 8) and allow
extruding pins 32 of the second jig unit 30 to be passed
therethrough.
[0061] Further, the second jig unit 30 is provided with the
extruding pins 32, which are inserted into the paste holes 12 of
the first jig unit 10, thus applying the conductive paste (P) onto
an electronic component (50 of FIG. 6).
[0062] Accordingly, as the electronic component 50, i.e., a micro
chip device, which is adjacent to the first jig unit 10, is loaded
onto the first jig unit 10 or unloaded from the first jig unit 10,
and the second jig unit 30 moves, a proper amount of the conductive
paste (P) is applied onto the electronic component 50. Here, the
applied conductive paste (P) forms external electrodes of the
electronic component 50.
[0063] In the apparatus 1, as shown in FIG. 5, the first jig unit
10 is a fixed unit, and the second jig unit 30 is a movable unit.
The number of the paste holes 12 of the first jig unit 10 or the
extruding pins 32 of the second jig unit 30 is equal to that of the
electrodes (52 of FIG. 8) of the electronic component 50.
[0064] Although not shown in the drawings, the first and second jig
units 10 and 30 substantially include a plurality of the paste
holes 12 and a plurality of the extruding pins 32. Accordingly, it
is possible to apply the conductive paste (P) simultaneously onto a
plurality of electronic components using a single first jig unit 10
and a single second jig unit 30 only by adjusting the loading
positions of the electronic components onto the first jig unit
10.
[0065] As shown in FIG. 5, an interval (G) between a surface of the
first jig unit 10 contacting the electronic component 50 and the
tip of each of the extruding pins 32 of the second jig unit 30
inserted into the paste holes 12 is varied according to the amount
of the conductive paste (P) applied onto the electronic component
50.
[0066] Accordingly, the interval (G), which corresponds to a
difference between the length (L) of the extruding pins 32 of the
second jig unit 20 and the depth (D) of the paste holes 12 of the
first jig unit 10, determines the amount of the conductive paste
(P), which is substantially applied onto the electronic component
50.
[0067] The amount of the conductive paste (P) is increased or
decreased by loading states of the electronic component 50, i.e., a
contact-type loading state, in which the electronic component 50
contacts the first jig unit 10, and a noncontact-type loading
state, in which the electronic component 50 does not contact the
first jig unit 10.
[0068] That is, the amount of the conductive paste (P) is adjusted
by controlling the loading state of the electronic component 50 in
the same apparatus. This does not require the manufacture of
various jig units, thus reducing the production costs of the
apparatus.
[0069] Although not shown in the drawings, the movement degree of
the second jig unit 30 is precisely adjusted using a
servomotor.
[0070] The first and second jig units 10 and 30 of the apparatus 1
of the present invention, as shown in FIG. 5, are made of one
selected from the group consisting of metals, nonferrous metals,
and high-strength (engineering) plastics. Compared to one
conventional paste applying method using wheels or a flat plate
made of urethane or rubber, as shown in FIG. 2 or 3, the apparatus
1 of the present invention has an elongated life span, increases
the precision in applying the conductive paste, and is scarcely
deformed when it is used.
[0071] Further, a third jig unit 70, which will be described later
with reference to FIG. 11, is made of the same material.
[0072] A tolerance between the paste holes 12 of the first jig unit
10 and the extruding pins 32 of the second jig unit 20 allows the
extruding pins 32 to move smoothly.
[0073] FIGS. 6a and 6b and FIGS. 7a and 7b illustrate various
dispositions of the apparatus 1 of the present invention and the
electronic component 50.
[0074] As shown in FIGS. 6a and 6b, the electronic component 50 is
loaded onto or unloaded from the first jig unit 10 under the
condition that the electronic component 50 is disposed above the
upper surface or below the lower surface of the first jig unit 10
of the apparatus 1, thus having the conductive paste (P) applied
thereto.
[0075] Further, as shown in FIGS. 7a and 7b, the electronic
component 50 may be horizontally disposed. For example, as shown in
FIG. 7a, one apparatus 1 is disposed at both sides of the
electronic component 50, so that the conductive paste (P) can be
applied simultaneously onto both surfaces of the electronic
component 50, or, as shown in FIG. 7b, one apparatus 1 is disposed
at one side of the electronic component 50, so that the conductive
paste (P) can be applied onto one surface of the electronic
component 50.
[0076] Accordingly, the apparatus 1 of the present invention can be
modified into various types according to usage conditions of the
apparatus 1.
[0077] Next, FIGS. 8a to 8g illustrate a method for applying a
conductive paste onto an electronic component using the apparatus 1
of the present invention by steps.
[0078] That is, as shown in FIG. 8a, the conductive paste (P) is
applied onto the upper surface of the first jig unit 10, provided
with the paste holes 12, of the apparatus 1 of the present
invention.
[0079] Thereafter, as shown in FIG. 8b, the conductive paste (P)
densely fills the paste holes 12 of the first jig unit 10 using a
transfer tool, such as a push rod (P').
[0080] Here, when the conductive paste (P) does not densely fill
the paste holes 12 but fine pores exist in the paste holes 12,
imbalance between the expected amount of the applied conductive
paste (P) and the real amount of the applied conductive paste (P)
occurs. Accordingly, the conductive paste (P) must densely fill the
paste holes 12.
[0081] Thereafter, as shown in FIG. 8c, the electronic component 50
is loaded onto the first jig unit 10 in the contact loading state,
in which the electronic component 50 contacts the upper surface of
the first jig unit 10, or in the noncontact loading state, in which
the electronic component does not contact the upper surface of the
first jig unit 10.
[0082] The contact or noncontact loading state is determined in
advance by the amount of the applied conductive paste (P).
[0083] Thereafter, as shown in FIG. 8d, the extruding pins 32 of
the second jig unit 30, which are inserted into the paste holes 12
of the first jig unit 10, move upward, thus allowing the conductive
paste (P), having a thickness corresponding to the remaining
interval (G) between the extruding pins 32 and the paste holes 12,
to be applied onto one surface of the electronic component 50
loaded onto the first jig unit 10.
[0084] Thereafter, as shown in FIG. 8e, the electronic component
50, which is provided with electrodes 52 formed by applying the
conductive paste (P) onto one surface thereof, is loaded from the
first jig unit 10. Then, as shown in FIGS. 8f and 8g, the
conductive paste (P) is applied onto the other surface of the
electronic component 50 through the above-described steps in the
same order. Thereby, the formation of the electrodes 52 on the
electronic component 50 is completed.
[0085] FIGS. 9a and 9b illustrate an apparatus 1' for applying a
conductive paste onto an electronic component in accordance with a
modified embodiment of the present invention.
[0086] That is, as shown in FIG. 9a, in case that an electronic
component 50' has a spherical shape, a first jig unit 10' includes
a spherical plane 14' for loading the spherical electronic
component 50', and paste holes 12' having different shapes
according to regions of the spherical plane 14'. For example, as
shown in FIG. 9b, the paste hole 12' at the center of the spherical
plane 14' is straight, and other paste holes 12' are bent such that
the bending angles of the paste holes 12' are decreased from the
central region to the edge region of the spherical plane 14'.
[0087] Further, the lengths of extruding pins 32' of a second jig
unit 30' are increased from the central region to the edge region
of the second jig unit 30', corresponding to the shapes of the
paste holes 12' of the first jig unit 10'.
[0088] Accordingly, the apparatus 1' using the first and second jig
units 10' and 30' easily and precisely applies the conductive paste
onto the electronic component 50' having a spherical shape.
[0089] FIGS. 10a to 10c are views illustrating various shapes of
electrodes formed using the apparatus 1 of the present
invention.
[0090] As shown in FIGS. 10a to 10c, the paste holes 12 of the
first jig unit 10 and the extruding pins 32 of the second jig unit
30 have the same shape, and form electrodes 52 having various
shapes, such as a circle, a rectangle, a polygon, a star, and a
bar, on the electronic component 50.
[0091] Thereby, electrodes having various shapes can be formed on
the electronic component only by unifying the shapes of the paste
holes 12 of the first jig unit 10 and the shapes of the extruding
pins 32 of the second jig unit 30 of the apparatus 1.
[0092] Accordingly, the various shapes of the electrodes formed on
the electronic component allow the mounting design of the
electronic component on a substrate to be diversified.
[0093] FIG. 11 illustrates an apparatus 1'' for applying a
conductive paste onto an electronic component in accordance with
another modified embodiment of the present invention.
[0094] That is, as shown in FIG. 11, the apparatus 1'' having a
multi-stage jig structure further comprises a third jig unit 70
provided with filling portions 72, which are inserted into the
paste holes 12 of the first jig unit 10. The extruding pins 32 of
the second jig unit 30 are inserted into the filling portions 72 of
the third jig unit 70, and then the filling portions 72 of the
third jig unit 70 are filled with the conductive paste (P).
[0095] Since the filling portions 72 of the third jig unit 70 are
substantially filled with the conductive paste (P), the apparatus
1'' employing the third jig unit 70 is advantageous in that the
filling portions 72 of the third jig unit 70 are conveniently
cleaned. Accordingly, the apparatus 1'' prevents problems generated
due to the remaining conductive paste, compared to the apparatus 1
as shown in FIG. 5.
[0096] Further, the apparatus 1'' using the third jig unit 70
increases the precision in applying the conductive paste onto the
electronic component 50.
[0097] Accordingly, the apparatus 1, 1', or 1'' for applying a
conductive paste onto an electronic component in accordance with
the present invention allows a conductive paste, for forming
electrodes, to be effectively applied onto an electronic component,
for example, a micro chip device, and improves the precision in
applying the conductive paste. Thus, the apparatus 1, 1', or 1'' is
easily applicable to the micro chip device, and facilitates the
precise application of the conductive paste onto the micro chip
device.
[0098] As apparent from the above description, the present
invention provides an apparatus and a method for applying a
conductive paste onto an electronic component, which allows the
conductive paste, for forming electrodes, to be precisely applied
onto a micro chip device, easily adjusts the amount of the applied
conductive paste, and prevents the spreading of the conductive
paste or the incorrect application of the conductive paste, thus
improving the quality of the external electrodes formed by applying
the conductive paste.
[0099] Further, since jig units for applying the conductive paste
have a semi-permanent life span and are thus used for a long period
of time without replacement or washing, it is possible to reduce
the maintenance costs of the apparatus.
[0100] Particularly, it is possible to easily form various-shaped
electrodes on the electronic component.
[0101] Although the preferred embodiments of the present invention
have been disclosed for illustrative purposes, those skilled in the
art will appreciate that various modifications, additions and
substitutions are possible, without departing from the scope and
spirit of the invention as disclosed in the accompanying
claims.
* * * * *