U.S. patent application number 12/157372 was filed with the patent office on 2009-12-10 for socket connector with flexible orientation heat pipe.
This patent application is currently assigned to HON HAI PRECISION IND. CO., LTD.. Invention is credited to David Gregory Howell, Ming-Lun Szu, Albert Terhune, Darrell Wertz.
Application Number | 20090305527 12/157372 |
Document ID | / |
Family ID | 41279677 |
Filed Date | 2009-12-10 |
United States Patent
Application |
20090305527 |
Kind Code |
A1 |
Wertz; Darrell ; et
al. |
December 10, 2009 |
SOCKET CONNECTOR WITH FLEXIBLE ORIENTATION HEAT PIPE
Abstract
A socket connector, adapted for electrically connecting an IC
package and a printed circuit board, comprises a frame, an
insulative housing, a cover plate, a heat pipe retainer, two heat
pipes, a backplane, and a plurality of fastening members. The
insulative housing is located in and surround by the metal
substrate frame. The heat pipe retainer with the heat pipes are
seated on the IC package received in the insulative housing. The
cover plate is on the heat pipe retainer. The fastening member
fastens the frame, the cover plate and the backplane together and
to the printed circuit board. The heat pipe retainer is formed with
a post in a center thereof, and the cover plate is formed with a
hole receiving the post, so that the heat pipe retainer is flexibly
orientated and can rotates around the hole.
Inventors: |
Wertz; Darrell; (Chandler,
AZ) ; Howell; David Gregory; (Chandler, AZ) ;
Terhune; Albert; (Chandler, AZ) ; Szu; Ming-Lun;
(Tu-cheng, TW) |
Correspondence
Address: |
WEI TE CHUNG;FOXCONN INTERNATIONAL, INC.
1650 MEMOREX DRIVE
SANTA CLARA
CA
95050
US
|
Assignee: |
HON HAI PRECISION IND. CO.,
LTD.
|
Family ID: |
41279677 |
Appl. No.: |
12/157372 |
Filed: |
June 9, 2008 |
Current U.S.
Class: |
439/71 |
Current CPC
Class: |
H01L 23/427 20130101;
H01L 2023/4087 20130101; H01L 2924/0002 20130101; H01L 2023/4062
20130101; H01L 2924/0002 20130101; H01L 23/4006 20130101; H01L
2023/405 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
439/71 |
International
Class: |
H01R 12/00 20060101
H01R012/00; H05K 1/00 20060101 H05K001/00 |
Claims
1. A socket connector for electrically connecting an IC package and
a printed circuit boards comprising: an insulative housing defining
a space for the IC package; a heat pipe retainer assembled with at
least one heat pipe and mounted upon the IC package received in the
space of the insulative housing; a cover plate located upon the
heat pipe retainer and substantially covering the heat pipe
retainer and the at least one heat pipe; and wherein one of the
cover plate and the heat pipe retainer has a post, and the other
defines a hole rotatably receiving the post to flexibly orientate
the heat pipe retainer with the heat pipe.
2. The socket connector of claim 1, wherein the post is formed in a
center of the heat pipe retainer, and the hole is formed in a
center of the cover plate, the heat pipe retainer can rotates
around the hole, the heat pine retainer defines at least one groove
recessed from a top surface thereof, the at least one heat pipe is
accommodated in the at least one groove and extends under the cover
plate.
3. The socket connector of claim 2, further comprising a frame
which defines an opening and a plurality of fingers extending into
the opening, the insulative housing is located in the opening of
the frame and retained by the fingers.
4. The socket connector of claim 3, further comprising a backplane
under the printed circuit board and a plurality of fastening
members, each of the backplane, the printed circuit board, the
frame and the cover plate defines holes for the fastening passing
through to retain the backplane, the frame and the cover plate
together and to the printed circuit board.
5. The socket connector of claim 4, wherein the fastening member
has a screw and a screw nut engaging with the screw.
6. The socket connector of claim 2, wherein the heat pipe retainer
is completely located under the cover plate except the post.
7. The socket connector of claim 2, further comprising a plurality
of fastening members which retain the cover plate to the printed
circuit bard, the heat pipe extends out of the socket connector
from a position between two adjacent fastening members, so the two
adjacent fastening members can prevent the heat pipe retainer from
further rotating to orientate the heat pipe retainer.
8. A socket connector for electrically connecting an IC package and
a printed circuit board, comprising: an insulative housing defining
a space for receiving the IC package; a cover plate being upon the
insulative housing; a heat pipe retainer located below the cover
plate, the heat pipe retainer pivotally connecting with the cover
plate; and at least one heat pipe, which has a part assembled to
the heat pipe retainer and covered by the cover plate.
9. The socket connector of claim 8, wherein the heat pipe retainer
defines at least one groove recessed from a top surface thereof,
the part of the heat pipe is accommodated in the groove and extends
out from an underside of the cover plate.
10. The socket connector of claim 9, further comprising a frame
which defines an opening and a plurality of fingers extending into
the opening, and the insulative housing is located in the opening
of the frame and retained by the fingers.
11. The socket connector of claim 10, further comprising a
backplane under the printed circuit board and a plurality of
fastening members each of the backplane, the printed circuit board,
the frame and the cover plate defines holes for the fastening
passing through to retain the backplane, the frame and the cover
plate together and to the printed circuit board.
12. The socket connector of claim 9, wherein further comprising a
plurality of fastening members which retain the cover plate to the
printed circuit board, the heat pipe extends laterally beyond the
cover plate from a place between two adjacent fastening members, so
the two adjacent fastening members can prevent the heat pipe
retainer from further rotating to orientate the heat pipe
retainer.
13. An electrical connector assembly comprising: a printed circuit
board; a frame securely mounted upon the printed circuit board; an
electrical connector mounted to the printed circuit board and
around the frame; an IC package mechanically and electrically
seated upon the electrical connector; a heat pipe assembly
mechanically and thermally seated upon the IC package; and a cover
seated upon the heat pipe assembly and assembled to the frame so as
to press the heat pipe assembly downwardly against the IC package
for heat transfer.
14. The electrical connector assembly as claimed in claim 20,
wherein said fastening device further extend through the printed
circuit board for securing said frame to the printed circuit
board.
15. The electrical connector assembly as claimed in claim 13,
wherein said frame essentially fully circumferentially surrounds
the connector.
16. The electrical connector assembly as claimed in claim 15,
wherein said frame includes retention devices to hold the IC
package in position regard to the connector.
17. The electrical connector assembly as claimed in claim 20, where
a back plate is position on an undersurface of the printed circuit
board, and said fastening devices are engaged with said back
plate.
18. The electrical connector assembly as claimed in claim 13,
wherein said frame defines a plurality of upward walls to protect
the inner connector, and a heat pipe of said heat pipe assembly
extends laterally beyond at least one of said upward walls via a
gap formed between the cover and said at least one of the upward
walls.
19. The electrical connector assembly as claimed in claim 18,
wherein there are two said heat pipes arranged in a diagonal
direction symmetrically.
20. The electrical connector assembly as claimed in claim 13,
wherein said cover is assembled to the frame via a plurality of
fastening devices.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a socket connector which is
used for connecting an electronic package, such as a central
processing unit (CPU), with a circuit substrate, such as a printed
circuit board (PCB).
[0003] 2. Description of the Prior Art
[0004] U.S. Pat. No. 7,008,239, issued on Mar. 7, 2006, discloses a
socket connector mounted on a printed circuit board (PCB). The
socket includes an insulative housing, a plurality of contacts,
four screw nuts and four screws, a lid and a heat guide pipe. The
insulative housing has a plurality of slots for receiving the
contacts and a border projecting therefrom and around the slots for
orientating an electronic component, such as an IC module. The
screw nuts connect the insulative housing to the PCB from a bottom
side of the PCB, the screws engage with the screw nuts from a top
side of the PCB. The lid is arranged between the screws and the
insulative housing. A head of each screw presses the lid to urge
the top surface of the IC module for positioning the IC module in
the insulative housing. The heat guide pipe is assembled on a top
surface of the lid and connects with a heat dissipation device for
further heat dissipation. However, since the lid which is assembled
with the heat guide pipe is firmly retained to the insulative
housing, an extending direction of the heat guide pipe is
determinate once the lid is assembled to the insulative housing. So
a field on the printed circuit board for a heat dissipation which
connects the heat pipe is limited.
[0005] Accordingly, a new socket connector that solves the above
problems is desirable.
SUMMARY OF THE INVENTION
[0006] Accordingly, an object of the present invention is to
provide a socket connector which has flexibly orientated heat
pipes.
[0007] To fulfill the above object, a socket connector for
electrically connecting an IC package and a printed circuit board,
comprises an insulative housing defining a space for the IC
package, a heat pipe retainer assembled with at least one heat pipe
and seated on the IC package received in the insulative housing;
and a cover plate located upon the heat pipe retainer and retained
to the printed circuit board. One of the cover plate and the heat
pipe retainer has a post, and the other defines a hole rotatably
receiving the post to flexibly orientate the heat pipe retainer
with the heat pipe.
[0008] Other objects, advantages and novel features of the present
invention will become more apparent from the following detailed
description when taken in conjunction with the accompanying
drawings, in which:
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 is an assembled, perspective view of a socket
connector receiving an IC package and mounted on a printed circuit
board, in accordance with the present invention;
[0010] FIG. 2 is similar to FIG. 1, taken from a bottom side;
[0011] FIG. 3 is a partially assembled, perspective view of the
socket connector in FIG. 1, wherein a top plate is removed from the
socket connector; and
[0012] FIG. 4 is an exploded, perspective view of the socket
connector in FIG. 1.
DESCRIPTION OF PREFERRED EMBODIMENTS OF THE INVENTION
[0013] Reference is now made to the drawings to describe the
invention in detail.
[0014] Referring to FIGS. 1-4, a socket connector 3 in accordance
with a preferred embodiment of the present invention is shown,
which is adapted for electrically connecting an IC package 1 and a
printed circuit board 2.
[0015] The socket connector 3 comprises an insulative housing 30, a
metal substrate frame 31, a cover plate 32, a heat pipe retainer
33, two heat pipes 34, a backplane 35, and a plurality of fastening
members. The insulative housing 30 is located in and surround by
the metal substrate frame 31. The heat pipe retainer 33 with the
heat pipes 34 are seated on the IC package 1 received in the
insulative housing 30. The cover plate 32 is covered on the heat
pipe retainer 33. The fastening member comprises an upper screw nut
36 and a lower screw 37 and fastens the frame 31, the cover plate
32 and the backplane 35 together and to the printed circuit board
2.
[0016] The insulative housing 30 defines a space 301 for the IC
package 2 and receives a plurality of terminals (not shown). The
frame 31 is stamped from a metal piece and in a rectangle shape,
the frame 31 is formed with a bottom plate 311 and four sidewalls
312. The bottom plate 311 comprises an opening 313 and four pieces
314 connecting bottom edges of two adjacent sidewalls 311 and
located in four corners of the opening 313. The insulative housing
30 is located in the opening 313 of the frame 31. The frame 31
further has a plurality of spring fingers 315, which upwardly and
inwardly extend from the pieces 314 into the opening 313 to press
and retain the insulative housing 30 in the opening 313. Each piece
314 defines a mounting hole 316.
[0017] The cover plate 32 is located upon the heat pipe retainer 33
and covers the insulating housing 30. The cover plate 32 is
piece-like and has four retaining holes 320 in four corners thereof
corresponding to the mounting holes 316 and a hole 321 in a center
thereof covers the insulative housing 30 and located. The heat pipe
retainer 33 is a metal clump and is formed with two grooves 331 for
accommodating the heat pipes 34 and a post 332 in a center thereof
for engaging with the hole 321 of the cover plate 32. The printed
circuit board 2 defines four assembling holes 20 corresponding to
the mounting holes 316.
[0018] The backplane 35 is rectangle piece-like and has four
through holes 351 corresponding to the mounting holes 316. The
backplane 35 is located on an inverse side of the printed circuit
board 2.
[0019] When assembly, firstly put the frame 31 on the printed
circuit board 2 with the mounting holes 316 aligning with the
assembling holes 20 of the printed circuit board 2, and put the
insulative housing 30 into the opening 313 of the frame 31 and the
IC package 2 into the space 301 of the insulative housing 30. Then,
locate the heat pipe retainer 33 assembled with the heat pipes 34
on the IC package 2, and put the cover plate 32 upon the heat pipe
retainer 33 with the post 332 inserting into the hole 321 and the
retaining holes 320 aligning with the mounting holes 316. Finally,
put the backplane 35 below the printed circuit board 2 and make the
screws 37 pass through the through holes 351 of the backplane 35,
the assembling holes 20 of the printed circuit board 2, the
mounting holes 316 of the frame 31, in turn, and make the screw
nuts 36 pass through the retaining holes 320 of the cover plate 32
and engage with the screws 37 from a top side of the printed
circuit board 2, so the socket connector 3 is mounted on the
printed circuit board 2.
[0020] What we should emphasize is that the heat pipe retainer 33
is pivotally assembled to the cover plate 32 by the hole 321
rotatably receiving the post 332, so the heat pipe retainer 33 with
the heat pipes 34 is flexibly orientated and can rotate around the
post 332, even the socket connector 3 is mounted on the printed
circuit board 2. Since the heat pipe 34 is located between two
adjacent screws 37 (referring to FIG. 2), so the two screws 37 can
prevent the heat pipe retainer 33 from further rotating to
orientate the heat pipe retainer 33. For this characteristic,
operator may have more options to configure the layout for the heat
pipes 34.
[0021] Furthermore, although the present invention has been
described with reference to particular embodiments, it is not to be
construed as being limited thereto. Various alterations and
modifications can be made to the embodiments without in any way
departing from the scope or spirit of the present invention as
defined in the appended claims.
* * * * *