U.S. patent application number 12/302618 was filed with the patent office on 2009-11-19 for temperature managing for electronic components.
Invention is credited to Torbjorn Nilsson.
Application Number | 20090283248 12/302618 |
Document ID | / |
Family ID | 38801705 |
Filed Date | 2009-11-19 |
United States Patent
Application |
20090283248 |
Kind Code |
A1 |
Nilsson; Torbjorn |
November 19, 2009 |
Temperature Managing For Electronic Components
Abstract
A method and arrangement for managing the temperature of an
electronic component. A reservoir holds a tempering liquid. A
pressurizing device pressurizes the liquid, and provides the liquid
to a spraying device, which sprays the liquid onto the electronic
component. A heat remover cools the liquid when thermal energy is
to be removed from the component, and a heating device heats the
liquid when thermal energy is to be provided to the component when
powering up the component in low temperatures.
Inventors: |
Nilsson; Torbjorn; (Vallda,
SE) |
Correspondence
Address: |
ERICSSON INC.
6300 LEGACY DRIVE, M/S EVR 1-C-11
PLANO
TX
75024
US
|
Family ID: |
38801705 |
Appl. No.: |
12/302618 |
Filed: |
June 2, 2006 |
PCT Filed: |
June 2, 2006 |
PCT NO: |
PCT/SE2006/000657 |
371 Date: |
November 26, 2008 |
Current U.S.
Class: |
165/104.33 |
Current CPC
Class: |
H01L 23/345 20130101;
H01L 2924/0002 20130101; H01L 23/4735 20130101; H01L 2924/0002
20130101; H01L 23/427 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/104.33 |
International
Class: |
F28D 15/00 20060101
F28D015/00 |
Claims
1-11. (canceled)
12. An arrangement for managing a temperature of an electronic
component, said arrangement comprising: a reservoir for holding a
tempering liquid; a pressurizing device connected to the reservoir
for pressurizing the tempering liquid; a spraying device for
receiving the pressurized liquid from the reservoir and spraying
the liquid onto the electronic component so as to create a thermal
coupling between the sprayed liquid and the component; a heat
remover for cooling the tempering liquid when thermal energy is to
be removed from the component, wherein the tempering liquid is in
at least one of a liquid, a vapor, or a mist form after spraying;
and a heating device in the reservoir for heating the tempering
liquid before spraying when thermal energy is to be provided to the
component when powering up the component in low temperatures.
13. The temperature managing arrangement according to claim 12,
wherein the spraying device sprays the liquid at a temperature and
in a form which causes thermal energy to be removed from the
component according to a two-phase cooling.
14. The temperature managing arrangement according to claim 12,
wherein the tempering liquid is an electrically insulating
fluid.
15. The temperature managing arrangement according to claim 12,
wherein the heating device heats the tempering liquid to a
temperature approximately at the middle of a temperature range
specified by a manufacturer for the electronic component to be
provided with thermal energy.
16. The temperature managing arrangement according to claim 12,
wherein the spraying device sprays the tempering liquid on a
cooling flange or a cooling surface thermally coupled to the
electronic component to be heated or cooled by the liquid.
17. The temperature managing arrangement according to claim 12,
wherein the spraying device sprays the tempering liquid on an
electronic component in the form of a circuit board or a rack
provided with a plurality of circuit boards.
18. The temperature managing arrangement according to claim 12,
wherein the spraying device includes a first spraying device type
for use when the temperature managing arrangement operates as a
cooling arrangement and a second spraying device type for use when
the temperature managing arrangement operates as a heating
arrangement.
19. A method of managing a temperature of an electronic component,
said method comprising the steps of: holding a tempering liquid in
a reservoir; pressurizing the tempering liquid utilizing a
pressurizing device connected to the reservoir; providing the
pressurized liquid from the reservoir to a spraying device;
spraying the liquid onto the electronic component so as to create a
thermal coupling between the sprayed liquid and the component;
cooling the tempering liquid utilizing a heat remover when thermal
energy is to be removed from the component, wherein the tempering
liquid is in at least one of a liquid, a vapor, or a mist form
after spraying; and heating the tempering liquid before spraying
utilizing a heating device in the reservoir when thermal energy is
to be provided to the component when powering up the component in
low temperatures.
20. The method according to claim 19, wherein the step of heating
the tempering liquid includes heating the tempering liquid to a
temperature approximately at the middle of a temperature range
specified by a manufacturer for the electronic component to be
heated.
21. The method according to claim 19, wherein the step of spraying
the liquid onto the electronic component includes spraying the
tempering liquid on a cooling flange or a cooling surface thermally
coupled to the electronic component to be heated or cooled by the
liquid.
22. The method according to claim 19, wherein the step of spraying
the liquid onto the electronic component includes spraying the
tempering liquid on an electronic component in the form of a
circuit board or a rack provided with a plurality of circuit
boards.
Description
TECHNICAL FIELD
[0001] The present invention relates in general to a spray
tempering arrangement capable of both cooling and heating
electronic components.
BACKGROUND OF THE INVENTION
[0002] Today liquid cooling is well known in the art of cooling
electronics. As air cooling systems continue to be pushed to new
performance levels, so has their cost, complexity, and weight.
Liquid cooing is replacing air cooling and enables the performance
of electronics to grow exponentially.
[0003] A preferred method of liquid cooling is the so-called
two-phase cooling. A two-phase cooling occurs when the coolant
changes from one phase to another, e.g. from liquid to vapor. Due
to the increased energy required for a phase change, two-phase
cooling systems often offers the ability to provide more compact
and higher performance cooling systems than single-phase systems.
As a contrast, a single-phase cooling occurs when the coolant
remains in the same phase during the whole cooling process, e.g.
remains liquefied or vaporized during the whole cooling
process.
[0004] An exemplary two-phase cooling method is spray cooling.
Common spray cooling system uses at least one pump for supplying
fluid to at least one nozzle that transforms the fluid into
droplets. These droplets impinge on the surface of the component to
be cooled so as to typically create a thin liquid film. Energy is
transferred from the surface of the component to the thin liquid
film as the liquid evaporates. Since the fluid may be dispensed at
or near its saturation point, the absorbed heat causes the thin
film to turn to vapor. This vapor is then condensed, often by means
of a heat exchanger, or condenser, and returned to a reservoir
and/or the pump.
[0005] However, even if the cooling ability of a spray cooling
system may be satisfactory the opposite problem is not approached.
Today there is a problem to get electronics to start, or start
properly, in low temperatures. This may e.g. be the case during
power up in winter conditions or on high altitudes. In addition, an
operative electronic component may also be exposed to environment
temperatures and/or operative conditions that lower the working
temperature of the operative component to an unsatisfactory
level.
[0006] However, some alternatives exist to deal with low
temperature in electronic components: [0007] Foil or resistors or
other type of electrical heaters can be arranged close to the
electronic components. However this requires a certain amount of
volume, extra cabling and it has to be designed into the system
from the start. In addition, the trend is dense packaging of the
electronic components, not to insert a number of extra components.
[0008] Heated air can be arranged to flow around the electronics.
However, this requires extra volume for air channels, fan and
heater. It will also add extra weight to the system. [0009] Heated
liquid can be arranged to flow in radiators or convectors near the
electronics. However, this requires extra volume for piping,
radiators/convectors and pump. It will also add extra weight to the
system. [0010] The electronic components can be selected from
components that are specified for particularly low temperatures.
However, this is only possible to a certain degree, e.g. depending
on the limited availability of such components with the required
functions. The components are also costly and rarer than normal
components.
[0011] Hence there is a need for an improved temperature managing
arrangement which utilizes the advantages of a two-phase cooling
method or at least a single-phase cooling method for cooling
electronic components, which arrangement avoids at least one of the
disadvantages associated with starting and/or operating electronic
components in low temperatures as mentioned above.
SUMMARY OF THE INVENTION
[0012] The present invention represents an improvement compared to
prior art by providing a spray tempering arrangement capable of
both heating and cooling electronic components.
[0013] This is achieved by a temperature managing arrangement
comprising a reservoir arranged to operatively accumulate a
tempering liquid, a pressurizing device arranged to operatively
pressurise the tempering liquid and at least one spray module
arranged to operatively receive the pressurized liquid and which
comprises at least one spraying device, e.g. a nozzle, arranged to
operatively spray the liquid on at least one electronic component
so as to create a thermal coupling between the sprayed liquid and
the component. In addition, the temperature managing arrangement
comprises a heat remover arranged to operatively cool the tempering
liquid after spraying when thermal energy is to be removed from
said component (224). Here, the tempering liquid becomes at least
one of a liquid, a vapor or a mist after spraying, e.g. due to
sprinkling in the spraying device or heating by the electric
component. Further, the tempering managing arrangement comprises a
heating device arranged to operatively heat the tempering liquid
before spraying when thermal energy is to be provided to said
component. Here, the tempering liquid is in liquid form before
spraying.
[0014] Regarding a removal of thermal energy it is preferred that
the thermal energy is removed from said component according to a
two-phase cooling.
[0015] The tempering liquid is preferably an electrically
insulating fluid.
[0016] The heating device is preferably arranged to operatively
heat the tempering liquid to a temperature near or above the middle
of the temperature range specified by the manufacturer for the
electronic component to be provided with thermal energy.
[0017] Said at least one spraying device can be arranged to
operatively spray the tempering liquid on a first electronic
component in the form of a cooling flange or a cooling surface
thermally coupled to a second electronic component to be heated or
cooled by the liquid.
[0018] Said at least one spraying device can be arranged to
operatively spray the tempering liquid on an electronic component
in the form of a circuit board, or a rack provided with a plurality
of circuit boards.
[0019] Said at least one spraying device can be arranged to
operatively spray the tempering liquid on a first electronic
component in the form of a cooling flange or a cooling surface
thermally coupled to a second electronic to be heated or cooled by
the liquid.
[0020] Said spray module can comprise at least two types of
spraying devices, wherein a first spraying device type is arranged
to be operatively used when the temperature managing arrangement
operates as a cooling arrangement and a second spraying device type
is arranged to be operatively used when the temperature managing
arrangement operates as a heating system.
[0021] In addition, the present invention represents an improvement
compared to prior art by providing a method for temperature
managing using said temperature managing arrangement, which method
comprises the steps of accumulating a tempering liquid (242) in a
reservoir (140, 240); pressurizing the tempering liquid (242) by
means of a pressurizing device (110, 210); providing the
pressurized liquid (242) to at least one spray module (120, 220)
comprising at least one spraying device (222) arranged to spray the
liquid (242) on at least one electronic component (224) so as to
create a thermal coupling between the sprayed liquid (242) and the
component (224); cooling the tempering liquid (242), being in at
least one of a liquid, a vapor or a mist form after spraying, by
means of a heat remover (130, 230) when thermal energy is to be
removed from said component (224); and heating the tempering liquid
(242) by means of a heating device (145, 245) before spraying, when
thermal energy is to be provided to said component (224).
[0022] The steps must not necessarily be performed in the above
order.
[0023] According to the method, the tempering liquid is preferably
heated to a temperature near or above the middle of the temperature
range specified by the manufacturer for the electronic component to
be provided with thermal energy.
[0024] According to the method, at least one spraying device is
spraying the tempering liquid on a first electronic component in
the form of a cooling flange or a cooling surface thermally coupled
to a second electronic component to be heated or cooled by the
liquid.
[0025] According to the method, said at least one spraying device
can spray the tempering liquid on an electronic component in the
form of a circuit board, or a rack provided with a plurality of
circuit boards.
[0026] According to the method, said at least one spraying device
can spray the tempering liquid on a first electronic component in
the form of a cooling flange or a cooling surface thermally coupled
to a second electronic to be heated or cooled by the liquid.
[0027] Further advantages of the present invention and embodiments
thereof will appear from the following detailed description of the
invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0028] FIG. 1 is a schematic illustration of a temperature managing
arrangement in the form of an exemplifying spray tempering system
100 according to a first embodiment of the present invention.
[0029] FIG. 2 is a schematic illustration of a temperature managing
arrangement in the form of an exemplifying spray tempering system
200 according to a second embodiment of the present invention.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
A First Embodiment
Structural Elements
[0030] FIG. 1 is a schematic illustration of a closed loop
two-phase spray tempering system 100 according to a first
exemplifying embodiment of the present invention. The exemplifying
spray tempering system 100 comprises a pump 110, a spray module
120, a heat remover 130 and a reservoir 140 provided with a heating
device 145. The tempering system 100 also comprises a tube system
150 for connecting said components in a suitable manner, i.e. said
reservoir 140 to said pressurizing device 110 and further to said
spray module 120 and to said heat remover 130 and back again to
said pressurizing device 110.
[0031] The pump 110 is adapted to pressurize a suitable tempering
liquid (not shown in FIG. 1). Preferably the pump 110 is powered by
means of a direct-current motor for creating accurate and precise
pressures and flow rates. However, the pump 110 can be powered by
other means, e.g. an alternating current motor, a hydraulic motor
or any other suitable powering means. The pump 110 operates
according to any suitable method for pressurizing the tempering
liquid, e.g. according to a reciprocating method or a rotary method
in connection with displacement pumping or dynamic pumping.
[0032] The spray module 120 is provided with at least one nozzle.
Several spray modules 120 may be used within the spray tempering
system 100 and each spray module may comprise a plurality of
nozzles.
[0033] The heat remover 130 may be a heat exchanger or some other
suitable condensing means adapted to operatively condense the
mixture of liquid, mist (i.e. small droplets of the liquid floating
through air or some other gas) and vapor (i.e. the gas state of the
liquid) that is created within or in the vicinity of the spray
module 120 during cooling.
[0034] The reservoir 140 is adapted to accumulate the tempering
liquid of the tempering system 100. The reservoir is illustrated as
a separate unit in FIG. 1, being connected to the spray tempering
system by the tube system 150. This indicates that the reservoir
140 is formed as a separate chamber of suitable size. However, in
some embodiments a reservoir may be formed entirely by the tube
system 150, i.e. the tubes alone may provide enough volume to form
a suitable reservoir.
[0035] The heating device 145 is preferably arranged in the
liquid-filled part of the tempering system 100. As indicated in
FIG. 1 it is particularly preferred that the heating device 145 is
arranged in the reservoir 140 to operatively heat the tempering
liquid therein. The heating device 145 is preferably an immersion
heater or similar arranged within the tempering liquid. However,
other heat sources are clearly conceivable, e.g. a heat exchanger
or even a microwave emitter.
Function of and Co-Operation Between the Structural Elements
[0036] In operation the tempering liquid is pressurized by the pump
110 and subsequently moved to a series of system components via the
tube system 150. The tube system 150 is made of a material that is
compatible with the tempering liquid. The material can be rigid or
semi-rigid, or even flexible to allow for variable three
dimensional configurations.
[0037] The spray module 120 in the spray tempering system 100 is
arranged to operatively receive pressurized tempering liquid from
the pump 110. The nozzle or nozzles of the spray module 120 is/are
arranged to operatively spray the received tempering liquid onto at
least one electronic component (not shown in FIG. 1).
[0038] When the electronic components are cooled by the spray
module 120, a mixture of liquid, mist and vapor is created within
or in the vicinity of the spray module 120. The liquid and the mist
are essentially created by the spraying activity of the spray
module 120, whereas the vapor is essentially created from the
liquid being gasified by absorbing energy from the hot components
within or in the vicinity of the spray module 120.
[0039] The resulting mixture of liquid, mist and vapor is received
by the heat remover 130 via the tube system 150 of the spray
tempering system 100. It is preferred that the heat remover 130 is
arranged in the mixture filled and not the liquid filled part of
the spray tempering system 100. The heat remover 130 in FIG. 1 is
illustrated as a separate unit connected to the spray tempering
system 100 by the tube system 150. However, the heat remover 130
may alternatively be arranged in the spray module 120 or in the
reservoir 140 or in any other suitable position in the mixture
filled parts of the spray tempering system 100.
[0040] The condensed liquid is collected in the reservoir 140 from
which the liquid is subsequently retrieved to be pressurized again
by the pump 110.
[0041] The spray-cooling function of the exemplifying spray
tempering system 100 in FIG. 1 has been discussed above in some
detail. The description will now proceed with a discussion of the
spray-heating capability of the spray tempering system 100 in FIG.
1.
[0042] The heating capability of the spray tempering system 100
requires a heating device. Hence, an exemplifying heating device
145 arranged in the reservoir 140 is schematically illustrated in
FIG. 1. It is particularly preferred that the heater 145 is
arranged in the reservoir 140 for operatively heating the tempering
liquid therein to a temperature within the temperature interval
specified by the manufacturer of the electronic component (e.g.
specified by the manufacturer of an integrated circuit). For
components with a specified temperature range of 0-70.degree. C.
the tempering liquid could e.g. be heated to a temperature within
the interval of 10-65.degree. C. or within the interval of
20-55.degree. C., or more preferably to a temperature near the
middle of the temperature range specified by the manufacturer. For
components with a specified temperature range of e.g. 0-70.degree.
C. this implies that the tempering liquid may be heated to a
temperature near 35.degree. C. However, due to losses in the tube
system 250 and in other components of the spray tempering system
100 it may be necessary to heat the tempering liquid even further,
e.g. heated an additional 5-20.degree. C.
[0043] The heated tempering liquid in the reservoir 140 is moved by
the pump 110 to the spray module 120. The spray module 120 is
arranged to operatively spray the received heated tempering liquid
onto at least one electronic component (not shown in FIG. 1). The
spraying is preferably accomplished by utilizing the same spraying
means (e.g. the same nozzle) that is used for spray-cooling the
electronic component as previously described.
[0044] When the electronic components are spray-heated by the spray
module 120, a heated mixture of liquid and mist (i.e. small
droplets floating through air or similar gas) is created by the
spraying activity within the spray module 120. However, since the
temperature of the electronic components are assumed to be below
the temperature of the sprayed mixture there will be no energy
transported from the components to the heated mixture when the
spray-heating capability of the system 100 is utilized.
Consequently, there is no creation of vapor. Instead the heated
mixture will be cooled by the electronic components in the spray
module 120, at the same time as the mixture will assume a liquid
state as it hits the components and objects in the spray module
120.
[0045] The liquefied mixture is received by the heat remover 130
and is then collected in the reservoir 140, wherein the liquid is
heated and subsequently retrieved to be pressurized again by the
pump 110. It should be added that the heat remover 130 may be idle
or even turned off when the heating capability of the spray
tempering system 100 is used, since there is substantially no mist
or vapor to condensate when the spray-heating capability is
utilized. In other words, the liquefied mixture (i.e. the tempering
liquid) is simply moved through the heat remover 130, or is
alternatively bypassing the heat remover 130 as schematically
illustrated by the bypass tube 151 in FIG. 1.
[0046] From the above it should be clear that the heated tempering
liquid enables the spray tempering system 100 to heat the
electronic components as well as cool the components as previously
described.
[0047] Heating of electronic components is particularly
advantageous when the components are powered up in cool
environments, e.g. during power up in winter conditions or on high
altitudes. A heating is also advantageous when an operative
electronic component is exposed to environment temperatures and/or
operational conditions that lower the working temperature of the
component to an unsatisfactory level. On the whole, the heating
ability of the spray tempering system 100 is generally advantageous
whenever the temperature of an electronic component falls below or
is near the allowed lower working temperature specified by the
manufacturer of the electronic component.
A Second Embodiment
Structural Elements
[0048] FIG. 2 is a schematic illustration of a closed loop
two-phase spray tempering system 100 according to a second
exemplifying embodiment of the present invention. The exemplifying
spray tempering system 200 comprises a pump 210, a filter 215, a
spray module 220, a heat remover 230 and a reservoir 240. The
tempering system 200 also comprises a tube system 250 for
connecting said components in a suitable manner, i.e. said
reservoir 240 to said pressurizing device 210 and further to said
spray module 220 and to said heat remover 230, and back again to
said pressurizing device 110.
[0049] The pump 210, the spray module 220, the heat remover 230,
the reservoir 240 and the tube system 250 operates in the same or
similar way as the corresponding components described above in
connection with the first embodiment of the present invention.
[0050] Hence, e.g. the pump 210 is arranged to pressurize a
suitable tempering liquid 242 in the same or similar way as
described above in connection with the pump 110 in the first
embodiment.
[0051] Similarly, the spray module 220 is preferably provided with
at least one nozzle. More than one spray module 220 may be used
within the spray tempering system 200 and each spray module may
comprise a plurality of nozzles.
[0052] In addition, the heat remover 230 may be a heat exchanger or
some other suitable condensing means arranged to operatively
condense the resulting mixture to a liquid.
[0053] However, in the second embodiment the tempering liquid 242
is defined as being any well known electronic tempering liquids
such as e.g. Fluorinert.TM., which is the brand name for the line
of electronics coolant liquids sold commercially by 3M. This is an
electrically insulating, inert perfluorocarbon fluid which is used
in various cooling applications. Different molecular formulations
are available with a variety of boiling points, allowing it to be
used in "single phase" applications wherein it remains a fluid, or
for "two-phase" applications wherein the liquid boils to remove
additional heat via evaporative cooling. An example of one of the
formulations 3M uses would be for instance, FC-72, or
perfluorohexane (C.sub.6F.sub.14) which is used for low temperature
heat transfer applications due to its boiling point of 56.degree.
C. Fluorinert.TM. is often used in situations where air would not
carry away enough heat, or where airflow is so restricted that some
sort of forced pumping is required anyway. Generally it is
preferred that the tempering liquid 242 is in liquid form at the
temperature when the electronic component is switched on.
Function of and Co-Operation Between the Structural Elements
[0054] In operation the tempering liquid 242 is pressurized by the
pump 210 so as to be moved from the reservoir 240 via the tube
system 250 through the filter 215 and into the spray module
220.
[0055] Preferably the spray module 220 in the spray tempering
system 200 comprises a substantially closed space--e.g. a
substantially closed box--arranged to receive the pressurized
tempering liquid 242 from the pump 210. Internally the spray module
220 is arranged to operatively spray the received tempering liquid
242 onto at least one electronic component 224. The spraying is
preferably accomplished by means of a nozzle arrangement 221
provided with at least one nozzle 222. The nozzle 222 is arranged
so as to operatively direct a spray 223 of mist and/or droplets
onto the electronic component 224 when the spray module 220
receives pressurized tempering liquid 242 from the pump 210.
[0056] When the electronic component 224 is cooled by the spray 223
a mixture of liquid, mist (i.e. small droplets of the liquid
floating through air or some other gas) and vapor (i.e. the gas
state of the liquid) is created within the spray module 220. The
liquid and the mist are essentially created by the spraying
activity of the nozzle 222, whereas the vapor is essentially
created from the liquid being gasified by absorbing energy from the
hot component 224.
[0057] The resulting mixture of liquid, mist and vapor is cooled by
the heat remover 230 arranged in the spray module 220. The heat
remover 230 in FIG. 2 is arranged at an upper end of the spray
module 220 under the assumption that the vapor is rising within the
module 220. Other positions are clearly conceivable to meet other
distributions of the vapor within the module 220. It is preferred
that the heat remover 230 is a thermally conductive helix or some
other thermally conductive structure through which a coolant can be
circulated so as to condense the resulting mixture of liquid, mist
and vapor to a liquid 242. However, other well known cooling
arrangements are clearly conceivable. The circulation of the
coolant in the heat remover 230 is illustrated by two opposite
arrows at the top of FIG. 2.
[0058] The condensed liquid 242 flows downwards in the spray module
220 in FIG. 2 by means of gravity to a lower end of the module 220,
from where it is collected in the reservoir 240 via a part of the
tube system 250. The tempering liquid 242 is subsequently retrieved
from the reservoir 240 to be pressurized again by the pump 210.
[0059] The spray-cooling function of the exemplifying spray
tempering system 100 in FIG. 1 has now been discussed in some
detail and the description proceeds with a discussion of the
spray-heating capability of the spray tempering system 200 in FIG.
2.
[0060] The heating capability of the spray tempering system 200 in
FIG. 2 requires a heating device, i.e. similar to the first
embodiment discussed above with reference to FIG. 1. Hence, an
exemplifying heating device 245 is schematically illustrated in
FIG. 2. The heating device 245 is arranged in the reservoir 240 so
as to operatively heat the tempering liquid 242 therein. It is
preferred that the heating device 245 is an electrically powered
immersion heater or similar, even if other heat sources are
conceivable. The electrical feeding of the heating device 245 is
illustrated by two opposite arrows at the bottom of FIG. 2.
[0061] The heated tempering liquid 242 in the reservoir 240 is
moved by the pump 210 to the spray module 220. The spray module 220
is arranged to operatively spray the received heated tempering
liquid onto at least one electronic component 224. The spraying is
preferably accomplished by utilizing the same spraying means (e.g.
the same nozzle) that is used for spray-cooling the electronic
component as previously described.
[0062] When the electronic component 224 is heated by the spray 223
a heat mixture of liquid and mist (i.e. small droplets floating
through air or similar gas) is created in the spray module 220.
However, since the temperature of the electronic component 224 is
assumed to be below the temperature of the heat mixture, there will
be no thermal energy transported from the component 224 to the
mixture. Consequently, there is no creation of vapor. Instead the
heat mixture will be cooled by the electronic component 224 in the
spray module 220, at the same time as the mixture will assume a
liquid state as it hits the cold component 224 and other objects in
the spray module 220.
[0063] The liquefied mixture is received by the heat remover 230
and then collected in the reservoir 240, wherein the liquid 242 is
re-heated. In general it is preferred that the tempering liquid 242
is heated to a temperature that ensures to a suitable working
temperature specified by the manufacturer of the electronic
component 224 to be heated. However, as already mentioned above,
due to losses in the tube system 250 and in other components of the
spray tempering system 200 it may be necessary to heat the
tempering liquid 242 even further, e.g. heated an additional
5-20.degree. C.
[0064] From the above it should be clear that the heated tempering
liquid enables the spray tempering system 200 to heat the
electronic component 224 as well as cool the component 224 as
previously described.
[0065] It should be added that the invention is by no means limited
to one or several single electronic components 242. On the
contrary, the electronic component may be a full circuit board
comprising a plurality of different electronic and non-electronic
components. The electronic component may even be a rack provided
with a plurality of such circuit boards comprising a plurality of
different electronic and non-electronic components. A spray cooling
system designed to operate on circuit boards in a rack is described
in e.g. U.S. Pat. No. 5,718,117 granted to McDunn et. al. However,
the McDunn patent does not provide for a heating capability and in
particularly not a heating capability that is integrated in the
spray cooling system as in the present invention.
[0066] Furthermore, even if the spray tempering system 200 in FIG.
2 has been illustrated with a single nozzle 222 this does not
prevent other embodiment from utilizing two or several different
nozzle types. A first nozzle type may e.g. be adapted to be used
when the tempering system operates as a cooling system and a second
nozzle type may be adapted to be used when the system operates as a
heating system.
[0067] Moreover, even if the nozzle 222 in the spray module 220
delivers the spray 223 directly onto the electronic component 224
is should be emphasised that the spray may be delivered to a
cooling flange or some other cooling surface or cooling arrangement
that is thermally coupled to the electronic component in question,
i.e. the spray is delivered directly to the cooling arrangement and
possibly indirectly to the electronic component to be cooled or
heated. In that case, the cooling flange or other cooling surface
or cooling arrangement should be regarded as the "electronic
component".
[0068] The present invention has now been described with reference
to exemplifying embodiments. However, the invention is not limited
to the embodiments described. On the contrary, the full extent of
the invention is determined by the scope of the appended
claims.
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