U.S. patent application number 12/239832 was filed with the patent office on 2009-10-29 for heat dissipation device.
This patent application is currently assigned to FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.. Invention is credited to HAI-GANG XIONG, ZHI-YONG ZHOU.
Application Number | 20090266513 12/239832 |
Document ID | / |
Family ID | 41213833 |
Filed Date | 2009-10-29 |
United States Patent
Application |
20090266513 |
Kind Code |
A1 |
XIONG; HAI-GANG ; et
al. |
October 29, 2009 |
HEAT DISSIPATION DEVICE
Abstract
A heat dissipation device adapted for removing heat from a
heat-generating electronic device, includes a base, a first fin
unit arranged on a top surface of the base. The base includes a
base plate, a spreader and a heat pipe group sandwiched between the
base plate and the spreader. The base plate defines therein an
opening. The heat pipe group has an inserting protrusion and a
receiving recession opposing the inserting protrusion. The
inserting protrusion protrudes upwardly from a top surface of the
heat pipe group and is embedded in the opening of the base plate.
The receiving recession recesses upwardly from a bottom surface of
the heat pipe group and receives therein the spreader.
Inventors: |
XIONG; HAI-GANG; (Shenzhen
City, CN) ; ZHOU; ZHI-YONG; (Shenzhen City,
CN) |
Correspondence
Address: |
PCE INDUSTRY, INC.;ATT. Steven Reiss
288 SOUTH MAYO AVENUE
CITY OF INDUSTRY
CA
91789
US
|
Assignee: |
FU ZHUN PRECISION INDUSTRY (SHEN
ZHEN) CO., LTD.
Shenzhen City
CN
FOXCONN TECHNOLOGY CO., LTD.
Tu-Cheng
TW
|
Family ID: |
41213833 |
Appl. No.: |
12/239832 |
Filed: |
September 29, 2008 |
Current U.S.
Class: |
165/80.3 ;
165/104.21; 165/104.33 |
Current CPC
Class: |
H01L 23/427 20130101;
H01L 2924/0002 20130101; H01L 2924/0002 20130101; H01L 2924/00
20130101 |
Class at
Publication: |
165/80.3 ;
165/104.33; 165/104.21 |
International
Class: |
F28F 7/00 20060101
F28F007/00; F28D 15/00 20060101 F28D015/00 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 28, 2008 |
CN |
200810066696.2 |
Claims
1. A heat dissipation device adapted for removing heat from a
heat-generating electronic device, comprising: a base comprising a
base plate, a spreader and a heat pipe group sandwiched between the
base plate and the spreader, the base plate defining an opening
therein, the heat pipe group having an inserting protrusion which
protrudes upwardly from a top surface of the heat pipe group and is
embedded in the opening of the base plate and having a receiving
recession which recesses upwardly from a bottom surface of the heat
pipe group, and the spreader being received in the receiving
recession; and a first fin unit arranged on a top surface of the
base.
2. The heat dissipation device as claimed in claim 1, wherein the
inserting protrusion has a top surface which is coplanar with a top
surface of the base plate.
3. The heat dissipation device as claimed in claim 1, wherein the
receiving recession is located under the inserting protrusion and
in complementary with the inserting protrusion.
4. The heat dissipation device as claimed in claim 1, wherein the
heat pipe group consists of a plurality of flexuous heat pipes
which have elongated portions arranged side by side to each other
to define an evaporating part thereof.
5. The heat dissipation device as claimed in claim 4, wherein the
inserting protrusion is formed on a top surface of the evaporating
part and opposite to the receiving recession which is formed on a
bottom surface of the evaporating part.
6. The heat dissipation device as claimed in claim 4, wherein the
heat pipe group further comprises four condensing parts extending
outwardly from the evaporating part along corresponding adjacent
edges of the base plate to surround the evaporating part.
7. The heat dissipation device as claimed in claim 1, wherein the
opening is located in a center of the base plate and has a same
rectangular shape as the inserting protrusion, and the base plate
has a protecting flange which extends perpendicularly and
downwardly from an edge thereof and surrounds the heat pipe group
under the base plate.
8. The heat dissipation device as claimed in claim 1, wherein the
spreader is received in the receiving recession of the heat pipe
group and has a bottom surface projecting downwardly from a bottom
surface of the heat pipe group.
9. The heat dissipation device as claimed in claim 1, wherein the
first fin unit is fixed to a top surface of the base plate and in a
directly contact with a top surface of the inserting protrusion of
the heat pipe group.
10. The heat dissipation device as claimed in claim 1, further
comprising a second fin unit which is attached to a bottom surface
of the heat pipe group at a location beside the spreader.
11. A heat dissipation device adapted for removing heat from a
heat-generating electronic device, comprising: a base comprising a
base plate, a spreader and a heat pipe group sandwiched between the
base plate and the spreader, the base plate defining therein an
opening, the heat pipe group having an inserting protrusion which
protrudes upwardly from a top surface of the heat pipe group and is
embedded in the opening of the base plate and having a receiving
recession which recesses upwardly from a bottom surface of the heat
pipe group, the spreader being received in the receiving recession;
and a first fin unit arranged on a top surface of the base; wherein
the receiving recession is located under the inserting protrusion
and in complementary with the inserting protrusion.
12. The heat dissipation device as claimed in claim 11, wherein the
inserting protrusion has a top surface which is coplanar with a top
surface of the base plate.
13. The heat dissipation device as claimed in claim 11, wherein the
heat pipe group consists of a plurality of flexuous heat pipes
which have elongated portions arranged side by side to each other
to define an evaporating part thereof.
14. The heat dissipation device as claimed in claim 13, wherein the
inserting protrusion is formed on a top surface of the evaporating
part and opposite to the receiving recession which is formed on a
bottom surface of the evaporating part.
15. The heat dissipation device as claimed in claim 14, wherein the
heat pipe group further comprises four condensing parts extending
outwardly from the evaporating part along corresponding adjacent
edges of the base plate to surround the evaporating part.
16. The heat dissipation device as claimed in claim 15, wherein the
opening is located in a center of the base plate and a the same
rectangular shape as the inserting protrusion, and the base plate
has a protecting flange which extends perpendicularly and
downwardly from an edge thereof and surrounds the heat pipe group
under the base plate.
17. The heat dissipation device as claimed in claim 16, wherein the
spreader is received in the receiving recession of the heat pipe
group and has a bottom surface projecting downwardly from a bottom
surface of the heat pipe group.
18. The heat dissipation device as claimed in claim 1, wherein the
first fin unit is fixed to a top surface of the base plate and in a
direct contact with a top surface of the inserting protrusion of
the heat pipe group.
19. The heat dissipation device as claimed in claim 18, further
comprising a second fin unit which is attached to a bottom surface
of the heat pipe group at a location beside the spreader.
Description
BACKGROUND
[0001] 1. Field of the Invention
[0002] The present invention relates generally to heat dissipation
devices, and more particularly to a heat dissipation device for
cooling a heat-generating electronic device.
[0003] 2. Description of Related Art
[0004] With advancement of computer technology, electronic devices
operate at a high speed. It is well known that the more rapidly the
electronic devices operate, the more heat they generate. If the
heat is not dissipated duly, the stability of the operation of the
electronic devices will be impacted severely. Generally, in order
to ensure the electronic device to run normally, a heat dissipation
device is used to dissipate the heat generated by the electronic
device.
[0005] Typically, the heat dissipation device comprises a base
formed from aluminum and contacting with the electronic device, a
plurality of fins arranged on the base and a plurality of bent heat
pipes embedded in the base. Heat absorbed by a central portion of
the base from the electronic device is evenly distributed over the
base and then transferred to the fins to be dissipated into ambient
air to positively cool down the heat electronic device. However,
the heat dissipating efficiency of the heat dissipation device is
determined by heat conductivity of the base; as a result, the base
made of a material having comparatively low conductivity such as
aluminum unduly affects a performance of the dissipating efficiency
of the heat dissipation device. To improve the heat dissipating
efficiency, the base may be made of a material with a comparatively
high conductivity such as copper; however, it would significantly
add cost and weight of the heat dissipation device to replace the
whole base with a copper base. Furthermore, to embed the heat pipes
in the base, the base has to be provided with corresponding
receiving grooves, thereby complicating the manufacture and
increasing the cost of the base.
[0006] What is needed, therefore, is a heat dissipation device
having an outstanding capability of heat dissipation whilst cost
and weight thereof do not increase too much.
SUMMARY
[0007] A heat dissipation device adapted for removing heat from a
heat-generating electronic device, includes a base, a first fin
unit arranged on a top surface of the base. The base includes a
base plate, a spreader and a heat pipe group sandwiched between the
base plate and the spreader. The base plate defines therein an
opening. The heat pipe group has an inserting protrusion which
protrudes upwardly from a top surface of the heat pipe group and is
embedded in the opening of the base plate, and a receiving
recession which recesses upwardly from a bottom surface of the heat
pipe group and receives therein the spreader.
[0008] Other advantages and novel features of the present invention
will become more apparent from the following detailed description
of an embodiment/embodiments when taken in conjunction with the
accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 is an exploded view of a heat dissipation device in
accordance with a first preferred embodiment of the present
invention.
[0010] FIG. 2 is an assembled view of the heat dissipation device
in FIG. 1, with a first fin unit of the heat dissipation device
being taken away for clarity.
[0011] FIG. 3 is an inverted, exploded view of FIG. 1.
[0012] FIG. 4 is an assembled view of FIG. 3.
DETAILED DESCRIPTION
[0013] Referring to FIG. 1, a heat dissipation device in accordance
with a preferred embodiment of the present invention is
illustrated. The heat dissipation device is adapted for removing
heat from a heat-generating electronic device (not shown) and
comprises a base 10 contacting with the heat-generating electronic
device, a first fin unit 20 arranged on a top of the base 10 and a
second fin unit 30 attached to a bottom of the base 10.
[0014] Also referring to FIG. 3, the base 10 comprises a spreader
12, a base plate 14 and a heat pipe group 16 sandwiched between the
spreader 12 and the base plate 14. The spreader 12 is made of
material with excellent heat conductivity such as copper and
directly in contact with the heat-generating electronic device. It
is understood that the spreader 12 can be a thin plate with
different shapes according to different embodiments. In this
embodiment of the present invention, the spreader 12 is
rectangular.
[0015] The base plate 14 is rectangular and made of material with
outstanding heat conductivity such as aluminum and copper. The base
plate 14 defines a rectangular opening 140 in a center thereof and
has a protecting flange 142. The protecting flange 142 extends
perpendicularly and downwardly from an edge of the base plate 14
and is configured for surrounding and protecting the heat pipe
group 16 under the base plate 14. The base plate 14 defines three
mounting holes 144 which are located adjacent to the edge of the
base plate 14 and spaced from each other, for receiving a downward
extension of three fasteners to secure the base 10 on the
heat-generating electronic device.
[0016] The heat pipe group 16 consists of a plurality of flexuous
heat pipes 160 which have flat top surfaces and bottom surfaces
opposite and parallel to the flat top surfaces. The top surfaces of
the heat pipes 160 are attached to a bottom surface of the base
plate 14. The spreader 12 and the second fin unit 30 are attached
to the bottom surfaces of the heat pipes 160. All of the heat pipes
160 have elongated portions, which are arranged closely side by
side to each other in a center of bottom surface of the base plate
14 and function as an evaporating part 162 of the heat pipe group
16. The evaporating part 162 has an inserting protrusion 1622
projecting upwardly from a top surface thereof and defines a
receiving recession 1624 right under the inserting protrusion 1622.
Also referring to FIG. 2, the inserting protrusion 1622 is
rectangular and has a flat top surface coplanar with the top
surface of the base plate 14 when the inserting protrusion 1622 is
fitly embedded into the opening 140 of the base plate 14. The
receiving recession 1624 is in complementary with the inserting
protrusion 1622 and receives the spreader 12 therein. The heat pipe
group 16 comprises four condensing parts 164 which extend outwardly
from the evaporating part 162 and respectively extend along
corresponding adjacent edges of the base plate 14 to surround the
evaporating part 162.
[0017] In assembly of the base 10, the top surface of the heat pipe
group 16 is attached to the bottom surface of the base plate 14 by
conventional means such as welding or adhering, in which the heat
pipe group 16 is surrounded by the protecting flange 142 of the
base plate 14; the inserting protrusion 1622 of the evaporating
part 162 of the heat pipe group 16 is embedded into the opening 140
of the base plate 14; and an upper part of the spreader 12 is
received and welded in the receiving recession 1624 of the
evaporating part 162.
[0018] The first fin unit 20 is directly attached on a contacting
surface which is cooperatively formed by the top surface of the
base plate 14 and the flat top surface of the inserting part 1622
of the heat pipe group 16 by conventional means such as welding or
adhering. The first fin unit 20 comprises a plurality of first fins
22 which are perpendicularly arranged on the contacting surface and
parallel to the two opposite sides of the base plate 14 and the
elongated portion of the heat pipe group 16. Each of the first fins
22 has a flange 220 perpendicularly bent from a lower edge thereof.
All of the flanges 220 of the first fin unit 20 are closely
juxtaposed to each other, to thereby cooperatively define a
continuous flat bottom surface of the first fin unit 20 which is
fixed to the contacting surface of the base 10. The first fin unit
20 defines a plurality of cutouts 24 corresponding to the mounting
holes 144, respectively, for facilitating the extension of the
fasteners.
[0019] Referring to FIGS. 3-4, the second fin unit 30 comprises a
plurality of second fins 32 directly attached to the bottom surface
of the heat pipe group 16 at the condensing part 164 of the heat
pipe group 16 by conventional means such as welding or adhering.
The second fin unit 30 can have various shapes in different
embodiments and is preferred to be T-shaped in this embodiment. The
second fins 32 are perpendicular to the bottom surface of the heat
pipe group 16 and parallel to the first fins 22.
[0020] In use of the heat dissipation device, heat generated by the
heat-generating electronic device is transferred to the evaporating
part 162 of the heat pipe group 16 through the spreader 12, then
distributed to everywhere of the base plate 14 and the second fin
unit 30 via the condensing parts 164 of the heat pipe group 16, and
also directly conducted to the first fin unit 20 via the inserting
protrusion 1622 of the evaporating part 162 of the heat pipe group
16. The heat is thus distributed to the first and second fin unit
20, 30 efficiently to dissipate into ambient air timely.
[0021] It is to be understood, however, that even though numerous
characteristics and advantages of the present embodiments have been
set forth in the foregoing description, together with details of
the structures and functions of the embodiments, the disclosure is
illustrative only, and changes may be made in detail, especially in
matters of shape, size, and arrangement of parts within the
principles of the invention to the full extent indicated by the
broad general meaning of the terms in which the appended claims are
expressed.
* * * * *