U.S. patent application number 12/127752 was filed with the patent office on 2009-10-22 for perforated substrates for forming housings.
Invention is credited to Douglas Weber.
Application Number | 20090260871 12/127752 |
Document ID | / |
Family ID | 40942522 |
Filed Date | 2009-10-22 |
United States Patent
Application |
20090260871 |
Kind Code |
A1 |
Weber; Douglas |
October 22, 2009 |
Perforated Substrates for Forming Housings
Abstract
A housing for an electronic device as well as methods for
forming the housing are disclosed. The housing can be formed from a
substrate having perforations to assist in adhering components
internal to the housing. The substrate is typically a multi-layer
substrate having at least two layers. In one embodiment, an inner
layer of the multi-layer substrate can be provided with
perforations. The perforations can them be used to adhere internal
features to the multi-layer substrate. The internal features can be
used for attaching parts or components to the multi-layer
substrate, thereby securing the parts or components to the
multi-layer substrate and thus the housing.
Inventors: |
Weber; Douglas; (Arcadia,
CA) |
Correspondence
Address: |
TECHNOLOGY & INNOVATION LAW GROUP, PC
ATTN: 101, 19200 STEVENS CREEK BLVD., SUITE 240
CUPERTINO
CA
95014
US
|
Family ID: |
40942522 |
Appl. No.: |
12/127752 |
Filed: |
May 27, 2008 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61046260 |
Apr 18, 2008 |
|
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|
Current U.S.
Class: |
174/535 ;
156/303.1; 216/56; 413/2; 413/8; 428/133; 428/99 |
Current CPC
Class: |
B29C 2045/14327
20130101; B29C 45/1657 20130101; B29C 45/14811 20130101; Y10T
428/24008 20150115; B23P 19/04 20130101; B29C 45/14311 20130101;
H05K 5/02 20130101; H05K 5/0217 20130101; B29C 45/14344 20130101;
B32B 2457/00 20130101; B32B 2038/047 20130101; B32B 38/04 20130101;
B29K 2705/00 20130101; B32B 37/02 20130101; B32B 2553/00 20130101;
Y10T 428/24289 20150115; Y10T 29/4998 20150115; B29C 45/1671
20130101; B29L 2031/3481 20130101 |
Class at
Publication: |
174/535 ;
428/133; 428/99; 156/303.1; 216/56; 413/2; 413/8 |
International
Class: |
H05K 7/14 20060101
H05K007/14; B32B 3/06 20060101 B32B003/06; B32B 37/02 20060101
B32B037/02; B32B 3/10 20060101 B32B003/10; B21D 51/16 20060101
B21D051/16; C23F 1/02 20060101 C23F001/02; H05K 5/00 20060101
H05K005/00 |
Claims
1. A method for forming an enclosure for a consumer electronic
product, said method comprising: obtaining an inner layer and an
outer layer; imposing a plurality of perforations to the inner
layer; combining the perforated inner layer with the outer layer to
form a multi-layer substrate; forming the enclosure for the
consumer electronic product from the multi-layer substrate; and
molding internal features onto the perforated inner layer of the
enclosure.
2. A method as recited in claim 1, wherein the inner layer and the
outer layers are metal layers.
3. A method as recited in claim 1, wherein said imposing of the
perforations to the inner layer comprises: passing the inner layer
through a rolling press, whereby perforations are imposed to the
inner layer.
4. A method as recited in claim 1, wherein said imposing of the
perforations to the inner layer comprises: chemically removing
portions of the inner layer to such that perforations are imposed
to the inner layer.
5. A method as recited in claim 4, wherein said chemically removing
comprises chemical etching.
6. A method as recited in claim 1, wherein the perforations in the
inner layer extend through the inner layer.
7. A method as recited in claim 1, wherein said combining of the
perforated inner layer with the outer layer comprises: layering the
inner layer over the outer layer to provide a layered arrangement;
and rolling the layer arrangement through a rolling press.
8. A method as recited in claim 1, wherein said combining of the
perforated inner layer with the outer layer comprises: cladding
together the perforated inner layer with the outer layer.
9. A method as recited in claim 1, wherein said combining of the
perforated inner layer with the outer layer comprises: bonding
together the perforated inner layer with the outer layer.
10. A method as recited in claim 1, wherein molding internal
features onto the perforated inner layer of the enclosure.
11. A method as recited in claim 10, wherein the internal features
serve to mechanically constrain internal parts to the enclosure of
the consumer electronic device.
12. An assembly comprising: a multi-layer substrate having at least
a first layer and a second layer; a plurality of perforations
provided in the first layer; and at least one structural feature
adhered to the first layer at least in part by one or more of the
perforations.
13. An assembly as recited in claim 12, wherein the assembly
further comprises: at least one attachment member, wherein the at
least one structural feature is secured to the first layer at least
in part by the at least one attachment member provided in the one
or more of the perforations.
14. An assembly as recited in claim 13, wherein the at least one
structural feature and the at least one attachment member are
concurrently molded.
15. An assembly as recited in claim 12, wherein the assembly
further comprises: a molded piece, the molded piece being adhered
to the multi-layer metal sheet, wherein the at least one structural
feature assists with adhering the molded piece to the multi-layer
substrate.
16. A portable electronic device, comprising: an electronic
component; and a housing, the housing being arranged to house the
electronic component, wherein the housing includes at least a
multi-layer substrate having at least a first layer and a second
layer, a plurality of perforations provided in the first layer, and
at least one internal feature adhered to the first layer at least
in part by one or more of the perforations.
17. A portable electronic device of claim 16, wherein the at least
one of the first layer and the second layer is a metal layer.
18. A portable electronic device of claim 16, wherein the first
layer and the second layer are both metal layers.
19. A housing for a portable electronic device, comprising: a
multi-layer substrate having at least a first layer and a second
layer; a plurality of perforations provided in the first layer; and
at least one internal feature formed on or attached to the first
layer at least in part by one or more of the perforations.
20. A housing of claim 19, wherein the at least one internal
feature secures a molded structure to the multi-layer
substrate.
21. A housing of claim 19, wherein the at least one internal
feature secures an electronic component within the housing.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority to U.S. Provisional Patent
Application No. 61/046,260, filed Apr. 18, 2008, entitled
"Perforated Substrates for Forming Housings", which is herein
incorporated herein by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to forming housing for
electronic devices.
[0004] 2. Description of the Related Art
[0005] The manufacture of devices that include metal parts often
includes the formation of features, e.g., complex mechanical
structures, on surfaces of the metal parts. In order to ensure the
structural integrity of such features, the features are often
affixed to the surfaces of the metal parts using an adhesive
material. By way of example, an internal feature has been obtained
and glued in an appropriate location on a surface of a metal parts
or housings.
[0006] Alternatively, internal features have been welded to the
surface of metal parts or housings. Utilizing a welding process to
attach internal features to metal parts is limiting in terms of the
number and the complexity of the internal features that is possible
using a welding technique. Furthermore, the cosmetic quality of a
metal part may be degraded as a result of a welding process. For
instance, the heat associated with a welding process may alter the
shape and/or the color of a metal part.
[0007] Internal features may also be formed using an injection
molding process. When a manufacturing process includes an injection
molding process, a through-hole may be formed in a metal part or
housing, and a plastic or a resin may be injected through the
through-hole. The plastic or resin may form a feature on one side
of the metal part, e.g., a metal sheet, while additional plastic or
resin may form an undercut on the other side of the metal sheet.
The undercut, in cooperation with the plastic or resin that hardens
in the through-hole, may effectively serve to anchor or otherwise
hold the feature in place. Often, the side of a metal sheet on
which an undercut is located may be arranged to be exposed. That
is, the side of a metal sheet on which an undercut is located may
be an external surface of an apparatus or device. As such, the
presence of an undercut on the side of the metal sheet may be
aesthetically undesirable, e.g., when the metal sheet is arranged
to serve a cosmetic purpose.
SUMMARY OF THE INVENTION
[0008] The invention pertains to a housing for an electronic device
as well as methods for forming the housing. The housing can be
formed from a substrate (material) having perforations to assist in
adhering components internal to the housing. The substrate is
typically a multi-layer substrate having at least two layers. In
one embodiment, an inner layer of the multi-layer substrate can be
provided with perforations. The perforations can them be used to
adhere internal features (e.g., internal structures or attachment
structures) to the multi-layer substrate. The internal features can
be used for attaching parts or components to the multi-layer
substrate, thereby securing (e.g., anchoring) the parts or
components to the multi-layer substrate and thus the housing.
[0009] The invention may be implemented in numerous ways,
including, but not limited to, as a method, system, device, or
apparatus. Example embodiments of the present invention are
discussed below.
[0010] As a method for forming an enclosure for a consumer
electronic product, one embodiment can, for example, include at
least the acts of: obtaining an inner layer and an outer layer;
imposing a plurality of perforations to the inner layer; combining
the perforated inner layer with the outer layer to form a
multi-layer substrate; forming the enclosure for the consumer
electronic product from the multi-layer substrate; and molding
internal features onto the perforated inner layer of the
enclosure.
[0011] As an assembly, one embodiment of the invention can, for
example, include at least: a multi-layer substrate having at least
a first layer and a second layer; a plurality of perforations
provided in the first layer; and at least one structural feature
adhered to the first layer at least in part by one or more of the
perforations.
[0012] As a portable electronic device, one embodiment of the
invention can, for example, include at least an electronic
component, and a housing arranged to house the electronic
component. The housing can include at least a multi-layer substrate
having at least a first layer and a second layer, a plurality of
perforations provided in the first layer, and at least one internal
feature adhered to the first layer at least in part by one or more
of the perforations.
[0013] As a housing for a portable electronic device, one
embodiment of the invention can, for example include at least: a
multi-layer substrate having at least a first layer and a second
layer; a plurality of perforations provided in the first layer; and
at least one internal feature formed on or attached to the first
layer at least in part by one or more of the perforations.
[0014] Various aspects and advantages of the invention will become
apparent from the following detailed description taken in
conjunction with the accompanying drawings which illustrate, by way
of example, the principles of the invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The invention will be readily understood by the following
detailed description in conjunction with the accompanying drawings,
in which:
[0016] FIG. 1A is a cross-sectional side-view diagrammatic
representation of a housing structure according to one embodiment
of the invention.
[0017] FIG. 1B is a cross-sectional side-view diagrammatic
representation of a housing structure according to another
embodiment of the invention.
[0018] FIG. 1C is a cross-sectional side-view diagrammatic
representation of a housing structure according to another
embodiment of the invention.
[0019] FIG. 1D is a cross-sectional side-view diagrammatic
representation of a housing structure according to another
embodiment of the invention.
[0020] FIG. 1E is a cross-sectional side-view diagrammatic
representation of a housing structure according to another
embodiment of the invention.
[0021] FIG. 1F is a cross-sectional side-view diagrammatic
representation of a housing structure according to another
embodiment of the invention.
[0022] FIG. 1G is a cross-sectional side-view diagrammatic
representation of a housing structure according to another
embodiment of the invention.
[0023] FIGS. 2A-2D are partial top views of multi-layer substrates
according to one embodiment of the invention.
[0024] FIG. 3 is a flow diagram of an enclosure manufacturing
process according to one embodiment of the invention.
DETAILED DESCRIPTION OF THE INVENTION
[0025] Exemplary embodiments of the present invention are discussed
below with reference to the various figures. However, those skilled
in the art will readily appreciate that the detailed description
given herein with respect to these figures is for explanatory
purposes, as the invention extends beyond these embodiments.
[0026] The invention pertains to a housing for an electronic device
as well as methods for forming the housing. The housing can be
formed from a substrate (material) having perforations to assist in
adhering components internal to the housing. The substrate is
typically a multi-layer substrate having at least two layers. In
one embodiment, an inner layer of the multi-layer substrate can be
provided with perforations. The perforations can them be used to
adhere internal features (e.g., internal structures or attachment
structures) to the multi-layer substrate. The internal features can
be used for attaching parts or components to the multi-layer
substrate, thereby securing (e.g., anchoring) the parts or
components to the multi-layer substrate and thus the housing.
[0027] In one embodiment, internal features can be adhered to an
exposed surface of a multi-layer substrate. One or more internal
features may be formed or attached to the multi-layer substrate.
Examples of internal features include, but are not limited to:,
structural members, frames, screw bosses, bridges, snaps, flexures,
flanges, shelves, tapers, cavities, and/or pockets.
[0028] In one embodiment, a multi-layer substrate having at least
one metal layer may be a portion or a component of a housing of an
electronic device. A multi-layer substrate that is a portion of a
housing of an electronic device may be a bezel section, a front
section, and/or a back section of the housing.
[0029] In one embodiment, the housing being formed from multi-layer
substrates can be a metal part, housing, or sheet having multiple
layers, where at least one of the layers is metal. The metal part,
housing, or sheet may serve a structural and/or a cosmetic purpose.
That is, an enclosure, housing, or sheet having multiple layers may
have a purely structural purpose, a purely aesthetic purpose, or
both a structural purpose and an aesthetic purpose. For ease of
discussion, a metal part, housing or sheet will generally be
described as a housing, although it should be appreciated that a
metal element may be substantially any suitable metal component
associated with a device or an apparatus, such as a housing, a
sheet, or an insert.
[0030] The invention can be utilized in a variety of different
devices (e.g., electronic devices) including, but not limited to
including, portable and highly compact electronic devices (i.e.,
portable electronic devices) with limited dimensions and space. In
one embodiment, a device may be a laptop computer, a tablet
computer, a media player, a mobile phone (e.g., cellular phone), a
personal digital assistant (PDA), substantially any handheld
electronic device, a computer mouse, a keyboard, a remote control,
substantially any computer accessory, and/or substantially any
computer peripheral. Typically, the electronic devices include at
least one electrical component inside its housing. The electrical
component can, for example, be an integrated circuit or circuit
board. Examples of integrated circuits include memory, processor
(microprocessor or controller), ASIC, and various others.
[0031] FIG. 1A is a cross-sectional side-view diagrammatic
representation of a housing structure 100 according to one
embodiment of the invention. The housing structure 100 includes a
multi-layer substrate 102. The multi-layer substrate 102 can, for
example, represent a material that is suitable for use as an
enclosure (e.g., housing) for an electronic device, such as a
consumer electronic device.
[0032] The multi-layer substrate 102 has an outer layer 104 and an
inner layer 106. The outer layer 104 can serve as the outer surface
of the enclosure and can be referred to as a cosmetic layer (or
cosmetic surface). The inner layer 106 is normally not visible once
the enclosure (e.g., housing) for the electronic device is
fabricated or assembled.
[0033] The inner layer 106 of the multi-layer substrate 100 also
includes first perforations 108 and second perforations 110. The
first perforations 108 and the second perforations 110 can be
staggered. Hence, as illustrated in FIG. 1A, the first perforations
108 are exposed in the cross-sectional view, while the second
perforations 110 are hidden (i.e., broken lines). As shown in FIG.
1A, the first perforations 108 and the second perforations 110 can
extend completely through the inner layer 106. However, in other
embodiments, the first perforations 108 and the second perforations
110 need not extend completely through the inner layer 106.
[0034] In one embodiment, the outer layer 104 and the inner layer
106 are separate metal layers that are pressed (e.g., clad)
together to form the multi-layer substrate 102. In an alternative
embodiment, the outer layer 104 and the inner layer 106 can be
laminated together, such as in a multi-layer sheet. In still
another embodiment, the outer layer 104 can be adhered to the inner
layer 106 using a bonding action or an adhesive.
[0035] The outer layer 104 and the inner layer 106 of the
multi-layer substrate 102 can be formed from the same or different
materials. In one embodiment, the outer layer 104 and the inner
layer 106 are both the same metal, such as stainless steel, cooper,
or aluminum. In another embodiment, the outer layer 104 and the
inner layer 106 can utilize different metals. For example, with
regard to FIG. 1A, the outer layer 104 can be stainless steel, and
the inner layer 106 can be aluminum. Since different metals can be
used, the properties or characteristics of the different layers 104
and 106 having different metals can be advantageously utilized to
form housings. For example, the outer layer 104 can be stainless
steel, and the inner layer 106 can be aluminum. In addition, one or
both of the outer layer 104 and the inner layer 106 can be a
non-metal material. However, the non-metal materials need to
withstand the subsequent processing of the multi-layer substrate to
form the enclosure. Since different metals or other materials can
be used, the properties or characteristics of the different layers
104 and 106 can be advantageously utilized to form housings.
[0036] FIG. 1B is a cross-sectional side-view diagrammatic
representation of a housing structure 120 according to one
embodiment of the invention. The housing structure 120 is similar
to the housing structure 100 illustrated in FIG. 1A with the
addition of internal features 122 attached to the multi-layer
substrate 102. The internal features 122 can be adhered to the
multi-layer substrate 102 through use of one or more embedded
members 124. As illustrated in the cross-sectional side view shown
in FIG. 1B, one or more of the embedded members 124 can be provided
in one or more of the first perforations 108 and used to adhere the
corresponding internal feature 122 to the multi-layer substrate 102
of the housing structure 120. In one implementation, the internal
features 122 are formed on the inner layer 106 of the multi-layer
substrate 102 and held securely to the inner layer 106 by the
embedded member 124 provided within the corresponding one or more
of the first perforations 108. In other words, the embedded member
124 provided within the corresponding one or more of the first
perforations 108 serves to mechanically retrain the internal
feature 122 to the multi-layer substrate, and thus the housing
structure 120. In one implementation, one or more of the internal
features 122 as well as the corresponding one or more embedded
members 124 can be concurrently formed by molding process. As a
particular example, for a given internal feature 122, the internal
feature 122 and the corresponding one or more embedded members 124
can be injection molded such that the internal feature 122 and the
corresponding one or more embedded members 124 can be integrally
formed. Accordingly, the internal features 122 can be secured to
the multi-layer substrate 102 by one or more corresponding embedded
members 124 that are provided within one or more of the
perforations 108,110. In one embodiment, the internal features 122
and the embedded members 124 are plastic or resin features that can
be molded (e.g., insert-molded, injection-molded) onto the inner
layer 106.
[0037] The internal features 122 can be utilized as binding
features or attachment features to assist in the assembly of a
housing that utilizes one or more other parts that are to be
attached or bounded to the housing structure 120. As illustrated in
FIG. 1B, the internal features 122 can be geometrically complex
internal features that are suitable for operation as binding
features or attachment features.
[0038] FIG. 1C is a cross-sectional side-view diagrammatic
representation of a housing structure 130 according to one
embodiment of the invention. The housing structure 130 is similar
to the housing structure 120 illustrated in FIG. 1B with the
addition of an additional piece 132 bound to the multi-layer
substrate 102. The additional piece 132 is adhered to the
multi-layer substrate 102 through use of the internal features 122.
The additional piece 132 can be a structural component or an
electronic component. The additional piece 132 can be attached to,
or effectively molded around, the internal features 122. If the
additional piece 132 a structural component that is molded, the
additional piece 132 can, for example, be formed by injection
molding. The additional piece 132 may, in one embodiment, be
arranged to include complex mechanical features (not shown) which
can be complementary to the features 122. Although FIG. 1C
illustrates the additional piece 132 being bound to the multi-layer
substrate 102, it should be understood that, in general, one or
more internal features can be bound to the multi-layer substrate
102 using one or more internal features 122.
[0039] FIG. 1D is a cross-sectional side-view diagrammatic
representation of a housing structure 140 according to one
embodiment of the invention. The housing structure 140 is similar
to the housing structure 100 illustrated in FIG. 1A. The
multi-layer substrate 102 has the outer layer 104 and the inner
layer 106. The inner layer 106 of the multi-layer substrate 102
also includes first perforations 108' and second perforations 110'
that are angled (e.g., tapered or trapezoidal) in shape. For
example, the shape of the perforations 108' and 110' have an
undercut profile as illustrated in FIG. 1D. Advantageously, the
angled perforations can provide greater holding capability as
compared to perforations that are straight (or not angled). The
first perforations 108' and the second perforations 110' can also
be staggered. As shown in FIG. 1D, the first perforations 108' and
the second perforations 110' can extend completely through the
inner layer 106. However, in other embodiments, the first
perforations 108' and the second perforations 110' need not extend
completely through the inner layer 106.
[0040] FIG. 1E is a cross-sectional side-view diagrammatic
representation of a housing structure 160 according to one
embodiment of the invention. The housing structure 160 is similar
to the housing structure 140 illustrated in FIG. 1D with the
addition of internal features 162 attached to the multi-layer
substrate 102. The internal features 162 can be adhered to the
multi-layer substrate 102 through use of one or more embedded
members 164. As illustrated in the cross-sectional side view shown
in FIG. 1E, one or more of the embedded members 164 can be provided
in one or more of the first perforations 108' and used to adhere
the corresponding internal feature 1 62 to the multi-layer
substrate 102 of the housing structure 160. In one implementation,
the internal features 162 are formed on the inner layer 106 of the
multi-layer substrate 102 and held securely to the inner layer 106
by embedded member 164 provided within the corresponding one or
more of the first perforations 108. For example, the internal
features 162 as well as the corresponding one or more embedded
members 164 can be formed by molding process. As a particular
example, for a given internal feature 162, the internal feature 162
and the corresponding one or more embedded members 164 can be
injection molded such that the internal feature 162 and the
corresponding one or more embedded members 164 can be integrally
formed. Accordingly, the internal features 162 can be secured to
the multi-layer substrate 102 by one or more corresponding embedded
members 164 that extend into one or more of the perforations 108',
110'.
[0041] FIG. 1F is a cross-sectional side-view diagrammatic
representation of a housing structure 180 according to one
embodiment of the invention. The housing structure 180 is similar
to the housing structure 160 illustrated in FIG. 1E with the
addition of one or more additional internal features 182 attached
to the multi-layer substrate 102. Like the internal features 162,
the one or more additional internal features 182 can be adhered to
the multi-layer substrate 102 through use of one or more embedded
members 184. As illustrated in the cross-sectional side view shown
in FIG. 1F, one or more of the embedded members 184 can be provided
in one or more of the first perforations 108' and used to adhere
the corresponding internal feature 1 82 to the multi-layer
substrate 102 of the housing structure 160. The various internal
features 162, 182 being utilized can have different geometries. For
example, the internal features 162 have one geometry, while the
internal feature has another different geometry.
[0042] FIG. 1G is a cross-sectional side-view diagrammatic
representation of a housing structure 190 according to one
embodiment of the invention. The housing structure 190 is similar
to the housing structure 140 illustrated in FIG. 1D although at
least an illustrated portion of the multi-layer substrate 102' of
the housing structure 1 90 is curved. The outer layer 104' and the
inner layer 106' are also curved. The inner layer 106' also
includes the perforations 108'. The housing structure 190
illustrated in FIG.1 G also has an internal features 192 adhered to
the multi-layer substrate 102' through use of one or more embedded
members 192.
[0043] FIGS. 2A-2D are partial top views of multi-layer substrates
according to one embodiment of the invention. The partial top views
illustrated in FIGS. 2A-2D illustrate inner-layers of the
multi-layer substrates having a plurality of perforations. The
perforations in the different multi-layer substrates have different
arrangements or shapes. The multi-layer substrates illustrated in
FIGS. 2A-2D are, for example, suitable for use as the multi-layer
substrate 102 in FIGS. 1A-1F.
[0044] FIG. 2A is a partial top view of a multi-layer substrate 200
according to one embodiment of the invention. The multi-layer
substrate 200 has a plurality of circular perforations 202. In this
embodiment, the circular perforations 202 are arranged in a uniform
pattern of offset rows. Further, in this embodiment, the circular
perforations 202 are uniformly provided across an inner-layer of
the multi-layer substrate 200.
[0045] FIG. 2B is a partial top view of a multi-layer substrate 220
according to another embodiment of the invention. The multi-layer
substrate 220 has a plurality of circular perforations 222 arranged
in a pattern. For example, the circular perforations 222 can be
provided on the inner-layer around the outer peripheral portion of
the multi-layer substrate 220. The pattern of these circular
perforations 222 provided on the multi-layer substrate 220 is in a
box configuration. It should be noted, however, that the pattern of
the circular perforations 222 can take any of a wide variety of
patterns.
[0046] FIG. 2C is a partial top view of a multi-layer substrate 240
according to another embodiment of the invention. The multi-layer
substrate 240 has a plurality of circular perforations 242 provided
at a first region 246 of the inner-layer of the multi-layer
substrate, and a plurality of circular perforations 244 provided at
a second region 248 of the inner-layer of the multi-layer
substrate. For example, as illustrated in FIG. 2C, the set of
perforations 242 can be provided at the first region 246 to
facilitate attachment of one and more internal features to that
location of the multi-layer substrate 240. Similarly, the set of
perforations 244 can be provided at the second region 248 to
facilitate attachment of one or more other internal features to
that location of the multi-layer substrate 240.
[0047] FIG. 2D is a partial top view of a multi-layer substrate 260
according to still another embodiment of the invention. The
multi-layer substrate 260 has a plurality of perforations 262. The
perforations 262 illustrated in FIG. 2D are plus-shaped. Hence, the
shape of the perforations can, in general, vary with
implementation. For example, the perforations can not only be
circular or plus-shaped but also square, oval, trapezoidal,
triangular, star-shaped and many more. The geometric complexity of
the shapes can range from relatively simple (e.g., circular, oval,
square) to relatively complex (e.g., plus-shaped, star-shaped).
Moreover, although all the perforations 262 illustrated in FIG. 2D
are plus-shaped, the perforations on the multi-layer sheet need not
be all the same shape but can be a mixture of different shapes.
[0048] FIG. 3 is a flow diagram of an enclosure manufacturing
process according to one embodiment of the invention. In the
enclosure manufacturing process 300 operates to produce a
multi-layer substrate that can be utilized as an enclosure for a
consumer electronic device. The multi-layer substrate can, for
example, represent the multi-layer structure 102, 102' of any of
the housing structures 100, 120, 130, 140, 160, 180 and 190
illustrated in FIGS. 1A-1G.
[0049] The enclosure manufacturing process 300 can initially obtain
302 an inner layer and an outer layer for the enclosure to be
manufactured. Next, perforations can be imposed 304 to the
inner-layer. The perforations are, in one embodiment, small holes
that extend through the inner layer. The diameter of the holes can,
in one implementation, be approximately 1-5 mm in diameter. In
another implementation, the diameter of the holes can be
approximately 2-3 mm in diameter. As noted above, the geometric
shape of the perforations can vary (e.g., circular, oval,
star-shaped, plus shaped, etc.). In one embodiment, the
perforations can be imposed 304, i.e., formed, by passing the inner
layer through a rolling press. In another embodiment, the
perforations can be imposed 304 by chemically removing portions of
the inner layer to yield the perforations. For example, chemical
removal of portions can be performed by a chemical etch process. In
still another embodiment, the perforations can be imposed 304,
i.e., formed, by being laser-etched. Alternatively, in another
embodiment, the inner layer can be obtained such that the
perforations are already formed therein.
[0050] The perforated inner-layer can then be combined 306 with the
outer layer to form a multi-layer substrate. The inner layer and
the outer layer can be pressed (e.g., clad) together, laminated
together, or adhered together. Thereafter, using the multi-layer
substrate, an enclosure for a consumer electronic device can be
formed 308 from the multi-layer substrate. In one implementation,
the enclosure can be formed 308 through a mechanical process, such
as stamping, punching, pressing and the like.
[0051] Once the enclosure for the consumer electronic device has
been formed 308, one or more internal features can be molded 310
onto the perforated inner-layer of the enclosure. Advantageously,
these one or more internal features can be molded to the
inner-layer with a single molding tool. In other words, multiple
internal features can be formed by a single molding tool all
without having to remove the enclosure to form the different
internal features. These one more internal features can be formed
singly or concurrently by use of the single molding tool. The
internal features formed within housing structures are utilized to
bind the other components to the housing structure, and thus the
consumer electronic device. For example, the internal features can
serve to mechanically constrain internal parts to the enclosure.
The other components and/or internal parts can be structural
components or electronic components. Following the molding 310 of
the one or more internal features to the enclosure, the enclosure
manufacturing process 310 can end.
[0052] Additional information on housings having multiple layers
can be found in: (i) U.S. patent application Ser. No. 11/964,652,
filed on Dec. 26, 2007, entitled "Methods and Systems for Forming a
Dual Layer Housing", which is incorporated herein by reference for
all purposes; (ii) U.S. Provisional Patent Application No.
60/949,780, filed on Jul. 13, 2007, entitled "Dual Layer Housing",
which is incorporated herein by reference for all purposes; and
(iii) U.S. Provisional Patent Application No. 61/023,375, filed on
Jan. 24, 2008, entitled "Method and Systems for Forming Housings
from Multi-layer Materials", which is incorporated herein by
reference for all purposes.
[0053] The many features and advantages of the present invention
are apparent from the written description. Further, since numerous
modifications and changes will readily occur to those skilled in
the art, the invention should not be limited to the exact
construction and operation as illustrated and described. Hence, all
suitable modifications and equivalents may be resorted to as
falling within the scope of the invention.
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