U.S. patent application number 12/101076 was filed with the patent office on 2009-10-15 for heat dissipation module.
This patent application is currently assigned to ASIA VITAL COMPONENTS CO., LTD.. Invention is credited to CHING-HANG SHEN.
Application Number | 20090255658 12/101076 |
Document ID | / |
Family ID | 41163021 |
Filed Date | 2009-10-15 |
United States Patent
Application |
20090255658 |
Kind Code |
A1 |
SHEN; CHING-HANG |
October 15, 2009 |
HEAT DISSIPATION MODULE
Abstract
A heat dissipation module comprises an aluminum cooling block
and a copper base. The cooling block has a plurality of fins
extending outward radially from the periphery of the cooling block.
The base fits with the cooling block. A central recess is disposed
at the bottom of the cooling block with at least an elongated
through hole piercing the cooling block from the recess to the top
of the cooling block. The base fits with the recess and has at
least a support leg corresponding to the respective through hole to
insert into the respective through hole. The heat dissipation
module is less in cost and weight and enables the heat source to
transmit to the fins of the cooling block rapidly and
effectively.
Inventors: |
SHEN; CHING-HANG;
(Kaohsiung, TW) |
Correspondence
Address: |
G. LINK CO., LTD.
3550 BELL ROAD
MINOOKA
IL
60447
US
|
Assignee: |
ASIA VITAL COMPONENTS CO.,
LTD.
KAOHSIUNG
TW
|
Family ID: |
41163021 |
Appl. No.: |
12/101076 |
Filed: |
April 10, 2008 |
Current U.S.
Class: |
165/185 |
Current CPC
Class: |
H01L 2924/0002 20130101;
F28F 13/00 20130101; F28F 21/08 20130101; H01L 23/367 20130101;
H01L 23/3677 20130101; H01L 2924/0002 20130101; H01L 2924/00
20130101 |
Class at
Publication: |
165/185 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Claims
1. A heat dissipation module comprising: an aluminum cooling block
with a plurality of fins extending outward radially from a
periphery of said cooling block; and a copper base fitting with
said cooling block; wherein, a central recess is disposed at the
bottom of said cooling block to fit with said base, at least an
elongated through hole pierces said cooling block from said recess
to the top of said cooling block, at least a support leg extends
outward from said base to correspond to the respective through hole
such that said base is joined to said cooling block firmly in such
a way of the respective support leg inserting into the respective
through hole.
2. The heat dissipation module as defined in claim 1, wherein the
respective through hole has a periphery with a shape of circle,
triangle, rectangle or polygon and the respective support leg has a
cross-section with a shape corresponding to said periphery.
3. The cooling fin as defined in claim 1, wherein the respective
support leg is different from each in length.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention is related to a heat dissipation
module and particularly to a heat dissipation module, which is
capable of removing the heat effectively and lowering the cost
greatly.
[0003] 2. Brief Description of the Related Art
[0004] It is known that various electronic devices have been
developed with incessantly progress of technology. Taking the most
popular electronic device, the computer, as an example, the central
processing unit (CPU) on the main board runs in company with the
heat generation. The generated heat increases along with better
performance of the CPU. In order to keep running normally for the
computer, it is necessary to lower the temperature of the CPU.
Usually, the prior art to solve the problem of heat dissipation is
to add more heat sinks for removing the generated heat outward. The
conventional heat sink is made of copper or aluminum. The aluminum
heat sink is lighter and cheaper than the copper heat sink but the
heat transfer efficiency of the copper heat sink is better than the
aluminum heat sink.
[0005] In order to overcome the preceding problems, a heat sink
shown in FIG. 7 provides a cooling base 10a with a hollow aluminum
cylindrical member 12a and a solid copper cylindrical member 20a. A
plurality of fins 14a extends outward radially from the outer
circumferential side of cooling base 10a. The solid copper
cylindrical member 20a fits with the hollow cylindrical member 12a
to form a complete structure of the heat sink.
[0006] Although the improved heat sink shown in FIG. 7 has combined
the two different metals, aluminum and copper, to enhance the heat
transfer efficiency, the cost and weight of the heat sink is unable
to be lowered down significantly because of the solid copper
cylindrical member 20a.
SUMMARY OF THE INVENTION
[0007] In order to overcome the deficiencies of the prior art, an
object of the present invention is to provide a heat dissipation
module, which is capable of not only enhancing the heat transfer
efficiency but also lower the cost and the weight thereof
effectively.
[0008] Accordingly, a heat dissipation module according to the
present invention comprises an aluminum cooling block and a copper
base. The cooling block has a plurality of fins extending outward
radially from the periphery of the cooling block. The base fits
with the cooling block. A central recess is disposed at the bottom
of the cooling block with at least an elongated through hole
piercing the cooling block from the recess to the top of the
cooling block. The base fits with the recess and has at least a
support leg corresponding to the respective through hole to insert
into the respective through hole. The heat dissipation module is
less in cost and weight and enables the heat source to transmit to
the fins of the cooling block rapidly and effectively.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The detail structure, the applied principle, the function
and the effectiveness of the present invention can be more fully
understood with reference to the following description and
accompanying drawings, in which:
[0010] FIG. 1 is a perspective view of the first embodiment of a
heat dissipation module according to the present invention;
[0011] FIG. 2 is a disassembling perspective view of the heat
dissipation module shown in FIG. 1;
[0012] FIG. 3 is a sectional view along line A-A shown in FIG.
1;
[0013] FIG. 4 is a perspective view of the second embodiment of a
heat dissipation module according to the present invention;
[0014] FIG. 5 is a disassembling perspective view of the heat
dissipation module shown in FIG. 4;
[0015] FIG. 6 is a perspective view illustrating an applicable
example for the embodiments of the present invention; and
[0016] FIG. 7 is a sectional view of the conventional heat
dissipation.
DETAILED DESCRIPTION OF THE INVENTION
[0017] Referring to FIGS. 1 and 2, the first embodiment of a heat
dissipation module according to the present invention includes a
rectangular cooling block 11 and a base 12. The cooling block 11 is
made of aluminum and a plurality of fins 111 extend outward
radially from the periphery of the cooling block 11. The bottom of
the cooling block 11 has a central recess and at least an elongated
through hole 112 pierces the cooling block 11 from the top to the
bottom thereof. Further, the respective through hole 112 is
parallel to the axial line of the cooling blocks 11. The through
hole 112 has a rectangular-shaped periphery hole shown in FIGS. 1
and 2 and the respective rectangular through hole 112 is arranged
to space apart from each other near the four sides of the cooling
block 11.
[0018] The base 12, which is made of copper, is employed to fit
with the central recess of the cooling block 11 and provides a
plurality of elongated upright support legs 121 corresponding to
the through holes 112. That is, the number of the support legs 121
is the same as the number of the through holes 121. Further, the
support legs 121 are arranged to have different lengths.
[0019] The base 12 fits with the cooling block 11 in such a way of
the support legs 121 inserting into the through holes 112 and the
base 12 fitting with the central recess at the bottom of the
cooling block 11 such that the base 12 is joined to the cooling
block 11 as shown in FIG. 3 to perform heat conduction.
[0020] Referring to FIGS. 4 and 5, the second embodiment of the of
a heat dissipation module according to the present invention is
illustrated. The cooling block 21 is cylindrical and made of
aluminum with a plurality of fins 211 extending outward radially
from the circumferential side of the cooling block 11. The bottom
of the cooling block 21 has a circular central recess and at least
an elongated through hole 212 pierces the cooling block 21 from the
top to the bottom thereof. Further, the respective through hole is
parallel with the axial line of the cooling block 21. The
respective through hole 212 has a circular periphery and is
arranged in a way of spacing apart from each other near the
circumferential side of the cooling block 11.
[0021] The base 22, which is made of copper, is employed to fit
with the central recess of the cooling block 21 and provides a
plurality of elongated upright circular support legs 221
corresponding to the through holes 212. That is, the number of the
support legs 221 is the same as the number of the through holes
121. Further, the support legs 221 are arranged to have different
lengths.
[0022] The base 22 fits with the cooling block 21 in such a way of
the support legs 221 inserting into the through holes 212 and the
base 22 fitting with the central recess at the bottom of the
cooling block 21 to enable the heat conduction between the cooling
block 21 and the base 22 effectively.
[0023] The through holes (112, 212) of the cooling block (11, 21)
can be provided with a triangular or polygon periphery and the
support legs (121, 221) can be provided with a triangular or
polygon cross section respectively instead.
[0024] Referring to FIG. 6, when the heat dissipation module of the
present invention is in use, the cooling block 11, which has the
fins 111 and the through holes 112 to join the base and the support
legs (not shown), is attached to the main board 5 with the copper
base (not shown) contacting with the CPU 51 on the main board 5. In
this way, the heat generated by the running CPU 51 is transmitted
to the fins 111 on the aluminum cooling block 11 via the support
legs effectively and the heat is able to be dissipated with the
large surface areas of the fins 111 rapidly.
[0025] It is appreciated that the heat dissipation module according
to the present invention has the following advantages: [0026] (1)
The aluminum cooling block is joined to the copper base to form a
complete heat dissipation module instead of the conventional copper
heat sink for greatly lowering down the production cost directly.
[0027] (2) The through holes provided in the cooling block are
inserted with the support legs of the base such that the cooling
block can be attached to the base firmly.
[0028] While the invention has been described with referencing to
the preferred embodiments thereof, it is to be understood that
modifications or variations may be easily made without departing
from the spirit of this invention, which is defined by the appended
claims.
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