U.S. patent application number 12/170610 was filed with the patent office on 2009-10-01 for heat-dissipating device with curved vapor chamber.
Invention is credited to Chieh-Ping Chen, I-Ying Lee, George Anthony Meyer, IV, Chien-Hung Sun.
Application Number | 20090242169 12/170610 |
Document ID | / |
Family ID | 41115360 |
Filed Date | 2009-10-01 |
United States Patent
Application |
20090242169 |
Kind Code |
A1 |
Meyer, IV; George Anthony ;
et al. |
October 1, 2009 |
HEAT-DISSIPATING DEVICE WITH CURVED VAPOR CHAMBER
Abstract
A heat-dissipating device includes a vapor chamber shown as a
flat long plate, a heat-dissipating plate superposed on the vapor
chamber, and a first fin set. The middle portion of the vapor
chamber is designed as a heated section, two sides of which
respectively have a condensing section. Two curvedly extending
sections are respectively disposed between the heated section and
the condensing sections. Each condensing section is extended to a
higher position of the heated section through the bending of each
extending section. The heat-dissipating plate is horizontally
attached onto the two condensing sections, thus that a
section-differential space formed between the heat-dissipating
plate and the heated section accommodates the first fin set
thermally contacted with the heated section of the vapor
chamber.
Inventors: |
Meyer, IV; George Anthony;
(San Jose, CA) ; Sun; Chien-Hung; (Zhongli City,
TW) ; Lee; I-Ying; (Zhongli City, TW) ; Chen;
Chieh-Ping; (Zhongli City, TW) |
Correspondence
Address: |
HDLS Patent & Trademark Services
P.O. BOX 220746
CHANTILLY
VA
20153-0746
US
|
Family ID: |
41115360 |
Appl. No.: |
12/170610 |
Filed: |
July 10, 2008 |
Current U.S.
Class: |
165/80.3 |
Current CPC
Class: |
F28D 15/0233
20130101 |
Class at
Publication: |
165/80.3 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 27, 2008 |
TW |
097205250 |
Claims
1. A heat-dissipating device with a vapor chamber in curved
configuration, including: a chamber, which is shown as a flat long
plate, a middle portion of which is designed as a heated section,
and two sides of which respectively have a condensing section,
while two curvedly extending sections are respectively disposed
between the heated section and the condensing sections and each
condensing section is extended to a higher position of the heated
section through a bending of each extending section; a
heat-dissipating plate, which is superposed on the vapor chamber
and is horizontally attached onto the two condensing sections,
whereby a section-differential space formed between the
heat-dissipating plate and the heated section accommodates the
first fin set thermally contacted with the heated section of the
vapor chamber; and a first fin set, which is accommodated in the
section-differential space and thermally contacted with the heated
section of the vapor chamber.
2. The heat-dissipating device of vapor chamber according to claim
1, wherein the two condensing sections of the vapor chamber are
formed as a symmetrical configuration.
3. The heat-dissipating device of vapor chamber according to claim
1, further including a plurality of the aforementioned vapor
chambers arranged in parallel.
4. The heat-dissipating device of vapor chamber according to claim
3, wherein the first fin set is arranged across the heated sections
of the vapor chambers.
5. The heat-dissipating device of vapor chamber according to claim
1, wherein a second fin set is further arranged on the
heat-dissipating plate.
6. The heat-dissipating device of vapor chamber according to claim
1, wherein a distance is kept between a top part of the first fin
set and the heat-dissipating plate.
7. The heat-dissipating device of vapor chamber according to claim
1, wherein a top part of the first fin set is thermally contacted
with the heat-dissipating plate.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention generally relates to a
heat-dissipating device, in particular, to a heat-dissipating
device having a vapor chamber in curved configuration.
[0003] 2. Description of Prior Art
[0004] Applying a thermal dissipater to dissipate heat generated
from electronic component is a well-known technique. Traditionally
thermal dissipater is mainly constructed by a thermally conducting
base contacted with a heat source and a plurality of cooling fins
arranged on the thermally conducting base. Through a surface area
of each cooling fin, the entirely cooling area of the thermal
dissipater is thus enhanced. The cooling effectiveness provided by
a thermal dissipater is usually preferred, when the quantity of the
cooling fin is increased or the cooling area of a single cooling
fin is enlarged, under the condition that same material has a same
cooling coefficient.
[0005] In addition, a specifically heat-conducting element
possessed of a heat-transferring function is sometimes applied in a
heat-dissipating field by means of a phase-changing circulation
occurred between vapor and liquid phases such as heat pipe or vapor
chamber. Especially for a heat pipe, since of the merits of easy
manufacture and less space occupation in terms of a flat plate
configuration, through an extension of pipe length, a heat
generated from CPU can be horizontally transferred to a cooling
area and then thermally dissipated by other cooling mechanisms such
as fin or fan. On the other hand, a vapor chamber is sometimes
applied in a replacement of the thermally conducting base of the
aforementioned cooler through arranging a plurality of cooling fins
thereon.
[0006] However, according to the prior vapor chamber, due to a flat
characteristic of a long plate, only two surfaces with larger area
can be applied for the heated and condensed purposes, so the
distance between the heated surface and the condensed surface is so
small that the vapor chamber is sometimes unable to develop its
coherent effectiveness in the occasion of air-conditioning
application, because enough temperature difference can not be
generated through such small distance to provide sufficiently
thermal transfer.
[0007] Accordingly, aiming to solving the aforementioned
shortcomings, after a substantially devoting study, in cooperation
with the application of relatively academic principles, the
inventor has at last proposed the present invention
"Heat-Dissipating Device of Curved Vapor Chamber" that is designed
reasonably to possess the capability to improve the prior arts
significantly.
SUMMARY OF THE INVENTION
[0008] The invention is mainly to provide a heat-dissipating device
of vapor chamber in curved configuration, by which an internally
phase-changing route is changed by effectively generating an
accommodating space to thereby provide an externally
heat-transferring route additionally.
[0009] Secondly, the invention is to provide a heat-dissipating
device of vapor chamber in curved configuration, including a vapor
chamber shown as a flat long plate, a heat-dissipating plate
superposed on the vapor chamber, and a first fin set. The middle
portion of the vapor chamber is designed as a heated section, two
sides of which respectively have a condensing section. Two curvedly
extending sections are respectively disposed between the heated
section and the condensing sections. Each condensing section is
extended to a higher position of the heated section through the
bending of each extending section. The heat-dissipating plate is
horizontally attached onto the two condensing sections, thus that a
section-differential space formed between the heat-dissipating
plate and the heated section accommodates the first fin set
thermally contacted with the heated section of the vapor chamber.
According to above structure, a heat-dissipating device of vapor
chamber in curved configuration is thus obtained to meet the
aforementioned objects.
BRIEF DESCRIPTION OF DRAWING
[0010] The features of the invention believed to be novel are set
forth with particularity in the appended claims. The invention
itself, however, may be best understood by reference to the
following detailed description of the invention, which describes
several exemplary embodiments of the invention, taken in
conjunction with the accompanying drawings, in which:
[0011] FIG. 1 is a perspective explosive view according to the
first embodiment of the present invention;
[0012] FIG. 2 is a perspective assembled view according to the
first embodiment of the present invention viewed from another
angle;
[0013] FIG. 3 is a planar sectional view of the first embodiment of
the present invention;
[0014] FIG. 4 is an illustration of the first embodiment of the
present invention under a using status; and
[0015] FIG. 5 is an illustration of the second embodiment of the
present invention under a using status.
DETAILED DESCRIPTION OF THE INVENTION
[0016] In cooperation with attached drawings, the technical
contents and detailed description of the invention are described
thereinafter according to several preferable embodiments, being not
used to limit its executing scope. Any equivalent variation and
modification made according to appended claims is all covered by
the claims claimed by the present invention.
[0017] Please refer to FIG. 1 and FIG. 2, which respectively are a
perspective explosive view and a perspective assembled view from
another angle according to the first embodiment of the present
invention. The invention is to provide a heat-dissipating device of
vapor chamber in curved configuration, including a vapor chamber 1,
a heat-dissipating plate 2, and a first fin set.
[0018] The vapor chamber 1 is a heat-conducting element providing a
heat-transferring function through a vapor-liquid phase variation,
an internal wall of which has a capillary wick, and which is
internally shown as a sealed vacuum and is filled with working
fluid. The vapor chamber 1 is shown as a long flat plate, a middle
portion of which has a heated section 10, and two sides of which
respectively has a condensing section 11. Respectively, two
extending sections 12 shown as a curved configuration are arranged
between the heated section 10 and the two condensing sections 11.
The two condensing sections 11 are located at higher positions of
the heated section 10 by the bending of the extending sections 12,
thus that the two condensing sections 11 can be formed as a
symmetric configuration.
[0019] The heat-dissipating plate 2 shown as a flat long
configuration is usually made of a material capable of excellently
thermal dissipation such as copper or aluminum. The
heat-dissipating plate 2 is at first superposed on the
aforementioned vapor chamber 1 and is then horizontally attached
onto the two condensing sections 11 of the vapor chamber 1 to form
a section-differential space 100 above the heated section 10 of the
vapor chamber 1. In addition, according to one preferable
embodiment of the invention, the area of the upper and lower
surfaces of the heat-dissipating plate 2 is larger than that of the
vapor chamber 1. Because a plurality of vapor chambers 1 can be
arranged in parallel, the contacting area between the vapor chamber
1 and the heat-dissipating plate 2 can be enlarged.
[0020] The first fin set 3 accommodated in the section-differential
space 100 is constructed by a plurality of cooling fins 30
horizontally interspaced and thermally contacted with respect to
the heated section 10 of the vapor chamber 1. When a plurality of
vapor chambers 1 are arranged in parallel, the first fin set 3 can
be arranged across the heated sections 10 of the vapor chambers 1
or a plurality of first fin sets 3 can be arranged separately with
respect to each heated section 10 of the vapor chambers 1 (not
shown in the figures). As shown in FIG. 3, according to the first
embodiment of the present invention, the top of the first fin set 3
is kept a distance from the lower surface of the heat-dissipating
plate 2 without any contact.
[0021] In addition, a second fin set 4 constructed by a plurality
of cooling fins 40 horizontally interspaced can be further arranged
on the aforementioned heat-dissipating plate 2 and thermally
contacted with the upper surface thereof.
[0022] Therefore, by assembling the aforementioned structures, a
heat-dissipating device of vapor chamber in cured configuration is
thus obtained.
[0023] Accordingly, as shown in FIG. 4, when the heat-dissipating
device is applied to an electronic element 5 such as CPU, the lower
surface of the heated section 10 of the vapor chamber 1 is attached
onto the upper surface of the electronic element 5. The thermally
conducting routes provided by the heat-dissipating device can be
divided into two ways as the follow:
[0024] Firstly, the two condensing sections 11 located at higher
side positions of the heated section 10 of the vapor chamber 1 can
provide a thermally conducting route in a horizontally extending
way; namely, when the heated section 10 of the vapor chamber 1 is
heated by the heat generated from the electronic element 5, the
vapor chamber 1 can quickly transfer the heat absorbed by the
heated section 10 toward the two condensing sections 11 and
dissipated by the heat-dissipating plate 2, making a phase-changing
circulation formed in the vapor chamber, and developing a thermally
conducting effectiveness that should be possessed by a vapor
chamber 1.
[0025] Secondly, the first fin set 3 located on the heated section
10 of the vapor chamber 1 can directly help the heat-dissipating
procedure of the heated section 10 of the vapor chamber 1 through
the cooling effectiveness provided by the cooling air in the
section-differential space 100 or as shown in FIG. 5, the top of
the first fin set 3 is thermally contacted with the lower surface
of the heat-dissipating plate 2 to transfer the absorbed heat
toward the middle section of the heat-dissipating plate 2; thereby,
a further cooling is provided by the second fin set 4, effectively
using every part of the heat-dissipating plate 2, which is capable
of providing a heat-dissipating function.
[0026] According to aforementioned description, the invention is a
novel structure for a vapor chamber indeed, which may positively
reach the expected usage objective for solving the drawbacks of the
prior arts, and which extremely possesses the innovation and
progressiveness to completely fulfill the applying merits of new
type patent, according to which the invention is thereby applied.
Please examine the application carefully and grant it as a formal
patent for protecting the rights of the inventor.
[0027] Moreover, the aforementioned description is only several
preferable embodiments according to the present invention, being
not used to limit the patent scope of the invention, so
equivalently structural variation made to the contents of the
present invention, for example, description and drawings, is all
covered by the claims claimed thereinafter.
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