U.S. patent application number 12/244416 was filed with the patent office on 2009-10-01 for compressor assembly having electronics cooling system and method.
This patent application is currently assigned to EMERSON CLIMATE TECHNOLOGIES, INC.. Invention is credited to Robert C. Stover.
Application Number | 20090241592 12/244416 |
Document ID | / |
Family ID | 40526568 |
Filed Date | 2009-10-01 |
United States Patent
Application |
20090241592 |
Kind Code |
A1 |
Stover; Robert C. |
October 1, 2009 |
COMPRESSOR ASSEMBLY HAVING ELECTRONICS COOLING SYSTEM AND
METHOD
Abstract
A refrigeration system having a compressor, a condenser, an
evaporator, an accumulator, and electronics for controlling the
compressor. The accumulator collects gaseous and liquid refrigerant
passing from the evaporator to the compressor. The electronics are
mounted to the accumulator to transfer heat from the electronics to
the refrigerant located within the accumulator to cool the
electronics.
Inventors: |
Stover; Robert C.; (Sidney,
OH) |
Correspondence
Address: |
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 828
BLOOMFIELD HILLS
MI
48303
US
|
Assignee: |
EMERSON CLIMATE TECHNOLOGIES,
INC.
Sidney
OH
|
Family ID: |
40526568 |
Appl. No.: |
12/244416 |
Filed: |
October 2, 2008 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
60998048 |
Oct 5, 2007 |
|
|
|
Current U.S.
Class: |
62/503 ;
165/104.33; 62/505 |
Current CPC
Class: |
F04B 39/12 20130101;
F04B 53/08 20130101; F25B 31/006 20130101; F25B 43/006 20130101;
F04B 39/06 20130101; F25B 2400/051 20130101 |
Class at
Publication: |
62/503 ; 62/505;
165/104.33 |
International
Class: |
F25B 45/00 20060101
F25B045/00; F25B 31/00 20060101 F25B031/00; F28D 15/00 20060101
F28D015/00 |
Claims
1. A system comprising: a compressor; an accumulator in
communication with said compressor and having refrigerant located
therein; and compressor electronics mounted to said accumulator and
cooled by said refrigerant located therein.
2. The system of claim 1, wherein said electronics are mounted to a
bottom surface of said accumulator.
3. The system of claim 1, wherein said electronics are mounted to
circumferentially surround said accumulator.
4. The system of claim 3, wherein said electronics are housed by an
annular housing that circumferentially surrounds said
accumulator.
5. The system of claim 1, wherein said accumulator is an
annular-shaped housing defining a cylinder, and said electronics
are mounted in said cylinder.
6. The system of claim 1, wherein said electronics are mounted
within said accumulator.
7. The system of claim 1, wherein said accumulator includes a base
and a cylindrical housing having a flattened surface attached to
said base, said electronics being mounted to said flattened
surface.
8. The system of claim 1, wherein said compressor electronics
includes an inverter.
9. A system comprising: a compressor; a high pressure zone heat
exchanger and a low pressure zone heat exchanger in communication
with said compressor; an accumulator disposed between said low
pressure zone heat exchanger and said compressor that receives low
temperature refrigerant from said low pressure zone heat exchanger;
and compressor electronics mounted to said accumulator and cooled
by said low temperature refrigerant located therein.
10. The system of claim 9, wherein said electronics are mounted to
a bottom surface of said accumulator.
11. The system of claim 9, wherein said electronics are mounted to
circumferentially surround said accumulator.
12. The system of claim 11, wherein said electronics are housed by
an annular housing that circumferentially surrounds said
accumulator.
13. The system of claim 9, wherein said accumulator is an
annular-shaped housing defining a cylinder, and said electronics
are mounted in said cylinder.
14. The system of claim 9, wherein said electronics are mounted
within said accumulator.
15. The system of claim 9, wherein said accumulator includes a base
and a cylindrical housing having a flattened surface attached to
said base, said electronics being mounted to said flattened
surface.
16. The system of claim 9, wherein heat generated by said
electronics is transferred to said low temperature refrigerant in
said accumulator.
17. The system of claim 9, wherein said compressor electronics
includes an inverter.
18. A refrigeration system comprising: a compressor for compressing
a refrigerant; a first heat exchanger in communication with said
compressor for condensing said refrigerant; a second heat exchanger
in communication with said compressor for expanding said
refrigerant; an accumulator disposed between said second heat
exchanger and said compressor; and compressor electronics mounted
to said accumulator and cooled by said refrigerant that is expanded
by said second heat exchanger.
19. The system of claim 18, wherein said electronics are mounted to
a bottom surface of said accumulator.
20. The system of claim 18, wherein said electronics are mounted to
circumferentially surround said accumulator.
21. The system of claim 20, wherein said electronics are housed by
an annular housing that circumferentially surrounds said
accumulator.
22. The system of claim 18, wherein said accumulator is an
annular-shaped housing defining a cylinder, and said electronics
are mounted in said cylinder.
23. The system of claim 18, wherein said electronics are mounted
within said accumulator.
23. The system of claim 18, wherein said accumulator includes a
base and a cylindrical housing having a flattened surface attached
to said base, said electronics being mounted to said flattened
surface.
24. The system of claim 18, wherein said compressor electronics
includes an inverter.
Description
FIELD
[0001] The present disclosure relates to a refrigeration system
having various electronic components that may be cooled using
refrigerant from the refrigeration system.
BACKGROUND
[0002] The statements in this section merely provide background
information related to the present disclosure and may not
constitute prior art.
[0003] A compressor may use electronics to control the compressor
motor, to modulate compressor capacity, to monitor various
electrical systems of the compressor, and the like. During
operation, however, the electronics may generate heat. If too much
heat is generated, the electronics may overheat and fail.
SUMMARY
[0004] A system including a compressor, an accumulator in
communication with the compressor and having refrigerant located
therein, and compressor electronics mounted to the accumulator and
cooled by the refrigerant located therein.
[0005] The electronics may be mounted to a bottom surface of the
accumulator.
[0006] The electronics may be mounted to circumferentially surround
the accumulator.
[0007] The electronics may be housed by an annular housing that
circumferentially surrounds the accumulator.
[0008] The accumulator may be an annular-shaped housing defining a
cylinder, and the electronics may be mounted in the cylinder.
[0009] The electronics may be mounted within the accumulator.
[0010] The accumulator may include a base and a cylindrical housing
having a flattened surface attached to the base, with the
electronics being mounted to the flattened surface.
[0011] The compressor electronics may include an inverter.
[0012] A system may also include a compressor, a high pressure zone
heat exchanger and a low pressure zone heat exchanger in
communication with the compressor, an accumulator disposed between
the low pressure zone heat exchanger and the compressor that
receives low temperature refrigerant from the low pressure zone
heat exchanger, and compressor electronics mounted to the
accumulator and cooled by the low temperature refrigerant located
therein.
[0013] The electronics may be mounted to a bottom surface of the
accumulator.
[0014] The electronics may be mounted to circumferentially surround
the accumulator.
[0015] The electronics may be housed by an annular housing that
circumferentially surrounds the accumulator.
[0016] The accumulator may be an annular-shaped housing defining a
cylinder, and the electronics may be mounted in the cylinder.
[0017] The electronics may be mounted within the accumulator.
[0018] The accumulator may include a base and a cylindrical housing
having a flattened surface attached to the base, with the
electronics being mounted to the flattened surface.
[0019] Heat generated by the electronics may be transferred to the
low temperature refrigerant in the accumulator.
[0020] The compressor electronics may include an inverter.
[0021] A refrigeration system includes a compressor for compressing
a refrigerant, a first heat exchanger in communication with the
compressor for condensing the refrigerant, and a second heat
exchanger in communication with the compressor for expanding the
refrigerant. An accumulator may be disposed between the second heat
exchanger and the compressor. Compressor electronics may be mounted
to the accumulator and cooled by the refrigerant that is expanded
by the second heat exchanger.
[0022] The electronics may be mounted to a bottom surface of the
accumulator.
[0023] The electronics may be mounted to circumferentially surround
the accumulator.
[0024] The electronics may be housed by an annular housing that
circumferentially surrounds the accumulator.
[0025] The accumulator may be an annular-shaped housing defining a
cylinder, and the electronics may be mounted in the cylinder.
[0026] The electronics may be mounted within the accumulator.
[0027] The accumulator may include a base and a cylindrical housing
having a flattened surface attached to the base, with the
electronics being mounted to the flattened surface.
[0028] The compressor electronics may include an inverter.
[0029] Further areas of applicability will become apparent from the
description provided herein. It should be understood that the
description and specific examples are intended for purposes of
illustration only and are not intended to limit the scope of the
present disclosure.
DRAWINGS
[0030] The drawings described herein are for illustration purposes
only and are not intended to limit the scope of the present
disclosure in any way.
[0031] FIG. 1 is a schematic representation of an exemplary
refrigeration system;
[0032] FIG. 2 is a cross-sectional view of an accumulator having
electronics mounted thereto;
[0033] FIG. 3 is a cross-sectional view of an accumulator having
electronics mounted thereto;
[0034] FIG. 4 is a cross-sectional view of an accumulator having
electronics mounted thereto;
[0035] FIG. 5 is a cross-sectional view of an accumulator having
electronics mounted thereto; and
[0036] FIG. 6 is a cross-sectional view of an accumulator having
electronics mounted thereto.
DETAILED DESCRIPTION
[0037] The following description is merely exemplary in nature and
is not intended to limit the present disclosure, application, or
uses. It should be understood that throughout the drawings,
corresponding reference numerals indicate like or corresponding
parts and features.
[0038] FIG. 1 is a schematic illustration of an exemplary
refrigeration system 10. Refrigeration system 10 may generally
include a compressor 12, a condenser 14, an evaporator 16, and a
system accumulator 18. Disposed between condenser 14 and evaporator
16 may be a restricted orifice or expansion valve 20.
[0039] Refrigeration system 10 uses the cooling effect of
evaporation to lower the temperature of the surroundings near one
heat exchanger (i.e., the evaporator 16) and it uses the heating
effect of high pressure, high temperature gas to raise the
temperature of the surroundings near another heat exchanger (i.e.,
the condenser 14). This is generally accomplished by releasing a
refrigerant under pressure (usually in the liquid phase) into a low
pressure region to cause the refrigerant to expand into a low
temperature mixture of liquid and vapor. Commonly, this low
pressure region comprises an evaporator coil 22, that may be formed
in the evaporator 16. Once in the evaporator coil 22, the
refrigerant mixture may be exposed to high temperature ambient air
of the region desired to be cooled. Evaporation of refrigerant from
liquid to gas absorbs heat from the ambient air and thereby cools
it.
[0040] Release of refrigerant into the low pressure evaporator coil
22 is usually metered by expansion valve 20. There are a wide
variety of different types of restricted orifices and expansion
valves in use today, ranging from simple non-adjustable capillary
tubes to electrically adjustable valves, such as pulse width
modulated valves and stepper motor valves.
[0041] The refrigerant released by evaporator 16 may be compressed
back into a high pressure state by compressor 12 and may be
condensed into a liquid phase by condenser 14 so that it may be
used again. In some systems, compressor 12 may be variable speed or
variable capacity, so that compressor 12 also controls the rate at
which refrigerant flows through the restricted orifice or expansion
valve 20. Compressor 12 may be a scroll compressor, a vane
compressor, a piston compressor, or any other type of compressor
known to one skilled in the art.
[0042] Accumulator 18 may be located between evaporator 16 and
compressor 12, near a suction inlet (not shown) of compressor 12.
Accumulator 18 may capture excess liquid refrigerant in system 10
before it is allowed to reach compressor 12. If an excess of liquid
refrigerant reaches compressor 12 it may damage bearings and other
surfaces within compressor 12 and cause compressor 12 to fail.
[0043] As stated above, compressor 12 may be a variable speed or
variable capacity compressor. Additionally, compressor 12 may
include various diagnostic and protection systems. To vary the
speed and/or the capacity of compressor 12, as well as run the
diagnostic and protection systems, various electronic components 24
for control, diagnosis, and protection of the of compressor 12 may
be used. Electronic components 24 may include various devices such
as an inverter, controller, the protection system, and the
diagnostic system.
[0044] Electronic inverter, which may also be referred to as a
variable frequency drive (VFD), receives electrical power from a
power supply and delivers electrical power to compressor 12. By
modulating the frequency of electrical power delivered to the
electric motor of compressor 12, inverter may thereby modulate and
control the speed, and consequently the capacity, of compressor 12.
To modulate the frequency of electric power, inverter may include
solid state electronics to modulate the frequency of electrical
power. Generally, inverter more specifically comprises a converter
that converts the inputted electrical power from AC to DC, and then
inverter converts the electrical power from DC back to AC at a
desired frequency.
[0045] A controller such as Assignee's U.S. Pat. No. 6,302,654,
which is hereby incorporated by reference in its entirety, may
control compressor capacity or monitor operating conditions of the
compressor. The controller may generally include a control block,
memory analog-to-digital converters, a communication interface, and
a plurality of terminals connected to various sensors that monitor
parameters of the compressor. The control block, which includes
processing circuitry, may control compressor capacity. The
analog-to-digital converter may be used to convert analog signals
sent by the various sensors to a digital signal before input into
the controller. The communication interface may provide
communication with the control block from an outside source or
server via, for example, an internet or intranet connection.
[0046] The compressor protection or diagnostic system may include a
controller, such as that described above, and a power interruption
system. The processing circuitry of the diagnostic system is
monitored by a plurality of sensors, and diagnoses operating
conditions and faults under both normal and abnormal fault
conditions by receiving and analyzing motor, compressor, and system
parameters. The processing circuitry diagnoses conditions of the
motor, compressor, or system by analyzing trends and relationships
among sensed data. In addition, the diagnostic data may be used to
control compressor modulation based on system conditions detected
by the sensors or faults determined by the processing
circuitry.
[0047] The sensors generally provide diagnostics related to
compressor mechanical failures, motor failures, and electrical
component failures such as missing phase, reverse phase, motor
winding current imbalance, open circuit, low voltage, locked rotor
currents, excessive motor winding temperature, welded or open
contractors, and short cycling. The sensors may also monitor
compressor current and voltage to determine, and differentiate
between, mechanical failures, motor failures, and electrical
component failures. In addition, the sensors may monitor parameters
such as discharge temperature, suction and discharge pressure, oil
levels, vibration, capacity control, oil injection, and liquid
injection. Exemplary compressor protection and control diagnostic
systems are described in the assignee's commonly owned U.S. patent
application Ser. No. 11/059,646 filed on Feb. 16, 2005, and U.S.
Pat. No. 6,615,594 which are hereby incorporated by reference in
their entirety.
[0048] As the above compressor electronics 24 operate, heat will be
generated. If too much heat is generated, however, compressor
electronics 24 may overheat. If compressor electronics 24 overheat,
they could fail, the refrigeration system 10 may shut down, or may
be forced reduce capacity to allow compressor electronics 24 to
cool. Therefore providing a means of cooling the electronics is
desired.
[0049] Accumulator 18 may be disposed between evaporator 16 and
compressor 12. Accumulator 18, therefore, may be disposed in the
low pressure and low temperature region of refrigeration system 10.
In this regard, accumulator 18 may have a temperature that may be
close to that of the gaseous and liquid refrigerant located
therein. Because accumulator 18 may have a lower temperature
relative to other elements of refrigeration system 10, the gaseous
and liquid refrigerant located therein may be used to cool
compressor electronics 24 by mounting compressor electronics 24 to
accumulator 18.
[0050] FIG. 2 illustrates a configuration where accumulator 18 may
have compressor electronics 24 mounted thereto. Accumulator 18 may
be a generally cylindrical housing including an inlet pipe 26 in
communication with evaporator 16 and a discharge pipe 28 in
communication with compressor 12. An outer surface 30 of
accumulator 18 may be flattened to allow for electronics 24 to be
mounted thereto.
[0051] By mounting compressor electronics 24 to accumulator 18,
heat 32 may be transferred through a wall 34 of accumulator 18 to
the excess liquid and gaseous refrigerant located in accumulator
18. Transfer of heat 32 to the refrigerant cools compressor
electronics 24, which assists in preventing compressor electronics
24 from overheating.
[0052] Accumulator 18 may be formed of any material that may
transfer heat 32 from compressor electronics 24 to the refrigerant
liquid and gas. In this regard, the material selected for
accumulator 18 may be a metal material such as a draw-quality or
spin-forming-quality steel. Stainless steel may be used in high
pressure applications and, aluminum and copper may be also used.
Regardless which material is selected, the material should be able
to withstand storage of the liquid and gaseous refrigerant, as well
as withstand system pressures.
[0053] FIG. 3 illustrates a configuration where compressor
electronics 24 may be mounted to a bottom surface 36 of accumulator
18. In contrast to the above configuration where compressor
electronics 24 are mounted to wall 34 of accumulator 18 and heat
may be transferred to both the liquid and gaseous refrigerant
located in accumulator 18, bottom surface 36 of accumulator 18
generally only has contact with liquid refrigerant (if present),
which generally may have a lower temperature than the gaseous
refrigerant. By mounting compressor electronics 24 to bottom
surface 36, therefore, compressor electronics 24 may be in contact
with a surface of accumulator 18 that has a lower temperature.
Because bottom surface 36 may have a lower temperature relative to
other regions of accumulator 18, cooling of compressor electronics
24 may be further enhanced. Moreover, only a minimum amount of
liquid refrigerant may be present in accumulator 18 to subject
compressor electronics 24 to a higher amount of energy transfer
between compressor electronics 24 and bottom surface 36 of
accumulator 18.
[0054] Now referring to FIG. 4, compressor electronics 24 may have
an annular housing 38 mounted to surround accumulator 18. Mounting
compressor electronics 24 circumferentially around accumulator 18
increases the surface area between compressor electronics 24 and
accumulator 18. By increasing the surface area between compressor
electronics 24 and accumulator 18, a larger amount of heat 32 may
be transferred between compressor electronics 24 and the gaseous
and liquid refrigerant located within accumulator 18 to further
cool compressor electronics.
[0055] FIG. 5 illustrates a configuration where accumulator 18 may
be annular-shaped cylinder 40 having an aperture 42 formed therein.
Compressor electronics 24 may be housed within aperture 42. Similar
to the configuration where compressor electronics 24
circumferentially surround accumulator 18, mounting compressor
electronics 24 in aperture 42 increases the surface area between
compressor electronics 24 and accumulator 18. By increasing the
surface area between compressor electronics 24 and accumulator 18,
a larger amount of heat 32 may be transferred between compressor
electronics 24 and the gaseous and liquid refrigerant located
within accumulator 18 to further cool compressor electronics.
Moreover, when accumulator 18 surrounds compressor electronics 24,
accumulator 18 may act as an electromagnetic shield for compressor
electronics 24.
[0056] Now referring to FIG. 6, compressor electronics 24 may be
mounted within accumulator 18. Mounting compressor electronics 24
within accumulator 18 provides the greatest amount of cooling for
compressor electronics due to compressor electronics 24 being in
direct contact with the refrigerant. To provide electrical
connections between compressor 12 and compressor electronics 24,
accumulator may be provided with hermetic terminals (not shown)
that allow for electrical communication between compressor 12 and
compressor electronics 24. Furthermore, compressor electronics 24
should be disposed in a housing 44 able to withstand exposure to
the liquid and gaseous refrigerant. Regardless, by increasing the
surface area between compressor electronics 24 and refrigerant
located within accumulator 18, a larger amount of heat 32 may be
transferred between compressor electronics 24 and the gaseous and
liquid refrigerant located within accumulator 18 to further cool
compressor electronics. Moreover, when accumulator 18 surrounds
compressor electronics 24, accumulator 18 may act as an
electromagnetic shield for compressor electronics 24.
[0057] The above detailed description is merely exemplary in nature
and, thus, variations that do not depart from the gist of the
present teachings are intended to be within the scope of the
present teachings. Such variations are not to be regarded as a
departure from the spirit and scope of the present teachings.
* * * * *