U.S. patent application number 12/382799 was filed with the patent office on 2009-09-10 for active matrix substrate, method for fabricating active matrix substrate, display device, liquid crystal display device, and television device.
This patent application is currently assigned to Sharp Kabushiki Kaisha. Invention is credited to Kenji Enda, Tomoki Noda, Masanori Takeuchi, Toshihide Tsubata, Toshifumi Yagi.
Application Number | 20090225247 12/382799 |
Document ID | / |
Family ID | 36587888 |
Filed Date | 2009-09-10 |
United States Patent
Application |
20090225247 |
Kind Code |
A1 |
Yagi; Toshifumi ; et
al. |
September 10, 2009 |
Active matrix substrate, method for fabricating active matrix
substrate, display device, liquid crystal display device, and
television device
Abstract
An active matrix substrate includes a substrate, a TFT formed on
the substrate, a storage capacitor element formed on the substrate,
an interlayer insulating film covering the storage capacitor
element, and a pixel electrode formed on the interlayer insulating
film. The storage capacitor element includes a storage capacitor
line, an insulating film formed on the storage capacitor line, and
two or more storage capacitor electrodes opposed to the storage
capacitor line with the insulating film interposed therebetween.
The two or more storage capacitor electrodes are electrically
connected via associated contact holes formed in the interlayer
insulating film to the pixel electrode and electrically continuous
with a drain electrode of the TFT.
Inventors: |
Yagi; Toshifumi; (Mie,
JP) ; Noda; Tomoki; (Mie, JP) ; Tsubata;
Toshihide; (Mie, JP) ; Takeuchi; Masanori;
(Mie, JP) ; Enda; Kenji; (Mie, JP) |
Correspondence
Address: |
NIXON & VANDERHYE, PC
901 NORTH GLEBE ROAD, 11TH FLOOR
ARLINGTON
VA
22203
US
|
Assignee: |
Sharp Kabushiki Kaisha
Osaka
JP
|
Family ID: |
36587888 |
Appl. No.: |
12/382799 |
Filed: |
March 24, 2009 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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11792563 |
Jun 7, 2007 |
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PCT/JP2005/022935 |
Dec 14, 2005 |
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12382799 |
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Current U.S.
Class: |
349/39 |
Current CPC
Class: |
G02F 1/136259 20130101;
G02F 1/136213 20130101 |
Class at
Publication: |
349/39 |
International
Class: |
G02F 1/1343 20060101
G02F001/1343 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 16, 2004 |
JP |
2004-364498 |
Oct 7, 2005 |
JP |
2005-295015 |
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80. An active matrix substrate comprising: a substrate; first and
second active elements formed on the substrate; first and second
storage capacitor elements formed on the substrate; an interlayer
insulating film covering the first and second storage capacitor
elements; and first and second pixel electrodes formed on the
interlayer insulating film to be adjacent to each other, a data
signal line being connected via the first active element to the
first pixel electrode, the data signal line being connected via the
second active element to the second pixel electrode, wherein the
first and second storage capacitor elements include a shared
storage capacitor line and an insulating film formed on the storage
capacitor line, the first storage capacitor element has a first
electrode opposed to the storage capacitor line with the insulating
film interposed therebetween, the first electrode is electrically
connected via a contact hole formed in the interlayer insulating
film to the first pixel electrode, the second storage capacitor
element has a second electrode opposed to the storage capacitor
line with the insulating film interposed therebetween, the second
electrode is electrically connected via a contact hole formed in
the interlayer insulating film to the second pixel electrode, and
between the first and second electrodes, a third electrode opposed
to the storage capacitor line with the insulating film interposed
therebetween is provided.
81. The active matrix substrate of claim 80, wherein the first
electrode is connected to a drain electrode of the first active
element via a connection electrode, the second electrode is
connected to a drain electrode of the second active element via a
connection electrode, and the third electrode is at least one of an
electrode electrically connected to the first pixel electrode via a
contact hole formed in the interlayer insulating film, and an
electrode electrically connected to the second pixel electrode via
a contact hole formed in the interlayer insulating film.
82. The active matrix substrate of claim 80, wherein the first,
second, and third electrodes are arranged in a row along the
storage capacitor line.
83. The active matrix substrate of claim 80, wherein in each pixel,
the storage capacitor line is in a rectangular shape when viewed in
plan.
84. The active matrix substrate of claim 80, wherein the first and
second pixel electrodes are formed in different shapes from each
other.
85. The active matrix substrate of claim 80, wherein the first and
second pixel electrodes formed to have different area sizes from
each other.
86. The active matrix substrate of claim 80, wherein a gap between
the first and second pixel electrodes overlaps at least a part of a
gap between the first electrode and the second electrode.
87. A display device comprising: the active matrix substrate of
claim 80; a counter electrode opposed to the active matrix
substrate; and a display medium layer placed in the gap between the
active matrix substrate and the counter electrode, wherein the same
electrical potential is applied to the storage capacitor line and
the counter electrode.
88. A liquid crystal display device comprising: the active matrix
substrate of claim 80; a counter substrate whose one surface is
formed with a counter electrode opposed to the active matrix
substrate; and a liquid crystal layer placed in the gap between the
active matrix substrate and the counter substrate.
89. The liquid crystal display device of claim 88, wherein the same
electrical potential is applied to the storage capacitor line and
the counter electrode.
90. The liquid crystal display device of claim 89, wherein the
liquid crystal layer is a vertical alignment type liquid crystal
layer containing nematic liquid crystal material having a negative
dielectric anisotropy.
91. The liquid crystal display device of claim 90 driven in a
normally black mode.
92. The liquid crystal display device of claim 88, wherein
different electrical potentials are applied to the storage
capacitor line and the counter electrode.
93. The liquid crystal display device of claim 92, wherein the
liquid crystal layer is a twist-aligned liquid crystal layer
containing nematic liquid crystal material having a positive
dielectric anisotropy.
94. The liquid crystal display device of claim 93 driven in a
normally white mode.
95. A television device comprising the display device of claim
87.
96. A television device comprising the liquid crystal display
device of claim 88.
Description
TECHNICAL FIELD
[0001] The present invention relates to active matrix substrates,
methods for fabricating active matrix substrates, display devices,
liquid crystal display devices, and television devices, and more
particularly relates to active matrix (hereinafter, referred to
also as "AM") substrates, for example, having pixels each provided
with a thin-film transistor for driving a liquid crystal layer and
a storage capacitor element, and AM type liquid crystal devices
each including such an AM substrate.
BACKGROUND ART
[0002] AM substrates have been widely used for AM type display
devices, such as liquid crystal display devices and EL
(electroluminescence) display devices. A known AM type liquid
crystal display device using such an AM substrate includes a
plurality of scanning signal lines formed on the substrate, a
plurality of data signal lines crossing the scanning signal lines,
thin-film transistors (hereinafter, referred to also as "TFTs")
located at the intersections of the above-mentioned signal lines,
and other elements. An image signal is transmitted to each of pixel
portions of the AM type liquid crystal display device by the
switching function of the associated TFTs. Furthermore, the pixel
portion may be provided with a storage capacitor element (see, for
example, Patent Document 1).
[0003] Such a storage capacitor element prevents self-discharge of
a liquid crystal layer during a period during which a TFT is in the
off state or degradation of the image signal quality due to the
off-state current of the TFT and is used not only for storage of
the image signal during the period during which the TFT is in the
off state but also as a path through which various modification
signals are applied to the storage capacitor element to drive
liquid crystal. A liquid crystal display device including a storage
capacitor element can achieve low power consumption and high image
quality.
[0004] An example of the known AM substrate configuration will be
described hereinafter with reference to the drawings. FIG. 24 is a
schematic plan view illustrating the configuration of a portion of
an AM substrate corresponding to a pixel including a storage
capacitor element. The AM substrate is used for a known AM type
liquid crystal display device. FIG. 25 is a schematic
cross-sectional view illustrating the cross section of the AM
substrate taken along the line A-A' in FIG. 24.
[0005] As illustrated in FIGS. 24 and 25, the AM substrate is
provided with a plurality of pixel electrodes 51 arranged in a
matrix form, scanning signal lines 52 for supplying scanning
signals, and data signal lines 53 for supplying data signals. The
data signal lines 53 extend along the lateral edges of the pixel
electrodes 51, and the scanning signal lines 52 cross the data
signal lines 53. TFTs 54 are located, as switching elements
connected to the pixel electrodes 51, at the intersections of the
scanning signal lines 52 and the data signal lines 53. Each
scanning signal line 52 is connected to gate electrodes 62 of the
associated TFTs 54, and the drive of each TFT 54 is controlled by a
scanning signal fed to the associated gate electrode 62. Each data
signal line 53 is connected to source electrodes 66a of the
associated TFTs 54, and a data signal is fed to the source
electrode 66a of the associated TFT 54. Furthermore, a drain
electrode 66b is connected through a connection electrode 55 to one
of electrodes (an upper storage capacitor electrode 55a) of a
storage capacitor element, and the electrode of the storage
capacitor element is further connected via an associated contact
hole 56 formed in an interlayer insulating film 68 to the
associated pixel electrode 51. A storage capacitor (common) line 57
is formed on a transparent insulating substrate (insulating
substrate) 61, and the storage capacitor (common) line 57 functions
as the other electrode (lower storage capacitor electrode) of the
storage capacitor element.
[0006] As illustrated in FIG. 25, the gate electrode 62 is formed
on the transparent insulating substrate (insulating substrate) 61
made of glass, plastic, or any other material so as to be connected
to the associated scanning signal line 52. The scanning signal line
52 and the gate electrode 62 are formed of a metal film made of
titanium, chromium, aluminum, molybdenum, or any other metal, an
alloy of these metals, or a layered film of these metals. The
storage capacitor (common) line 57 functioning as the other
electrode (lower storage capacitor electrode) of the storage
capacitor element is formed of the same material as the scanning
signal line 52 and the gate electrode 62. A gate insulating film 63
covering the storage capacitor (common) line 57, the scanning
signal line 52 and the gate electrode 62 is formed of an insulating
film made of silicon nitride, silicon oxide, or any other material.
A high-resistance semiconductor layer 64 made of amorphous silicon,
polysilicon or any other material and a low-resistance
semiconductor layer made of n.sup.+ amorphous silicon further doped
with impurities, such as phosphorus, are formed on the gate
insulating film 63 to overlap the gate electrode 62. The
low-resistance semiconductor layer is changed into a source
electrode 66a and a drain electrode 66b.
[0007] Each data signal line 53 is formed so as to be connected to
the associated source electrodes 66a. Furthermore, the connection
electrode 55 is formed so as to be connected to the associated
drain electrode 66b and extends continuously with one of the
electrodes of the storage capacitor element, i.e., the upper
storage capacitor electrode 55a. The upper storage capacitor
electrode 55a is connected via the contact hole 56 to the pixel
electrode 51. The data signal line 53, the connection electrode 55
and the upper storage capacitor electrode 55a are formed of the
same material, such as a metal film made of titanium, chromium,
aluminum, molybdenum, or any other metal, an alloy of these metals,
or a layered film of these metals.
[0008] The pixel electrode 51 is formed of a transparent conductive
film made of, for example, indium tin oxide (ITO), indium zinc
oxide (IZO), zinc oxide, or tin oxide. The contact hole 56 passes
through the interlayer insulating film 68 covering the TFT 54, the
scanning signal line 52, the date signal line 53, and the
connection electrode 55. As a material of the interlayer insulating
film 68, use is made of, for example, an acrylic resin, silicon
nitride, silicon oxide, or any other material. An AM substrate
configured as illustrated in FIGS. 24 and 25 is disclosed, for
example, in Patent Document 2.
[0009] For an AM substrate of such a configuration, in order to
simplify a fabrication process and reduce the production cost, the
storage capacitor (common) line (lower storage capacitor electrode)
57 is formed in the same process step as the scanning signal line
52, and the upper storage capacitor electrode 55a is formed in the
same process step as the data signal line 53 and the connection
electrode 55. Furthermore, in a case where, as illustrated in FIG.
25, the pixel electrode 51 covers the interlayer insulating film
68, this allows the pixel electrode 51 to overlap the signal lines
52 and 53. This overlapping increases the aperture ratio of a pixel
and further has the effect of shielding electric fields from the
signal lines 52 and 53 to the pixel electrode 51. In the
above-mentioned case, the contact hole 56 is formed in a part of
the interlayer insulating film 68 on a pattern forming the storage
capacitor (common) line 57 or a pattern forming the scanning signal
line 52. This provides connection between the pixel electrode 51
and the upper storage capacitor electrode 55a, and the upper
storage capacitor electrode 55a is connected through the connection
electrode 55 to the drain electrode 66b, thereby providing
connection between the pixel electrode 51 and the drain electrode
66b. The location at which the contact hole 56 is formed is not
limited within a region of the interlayer insulating film 68
located on the upper storage capacitor electrode 55a and may be
within a region thereof located on the connection electrode 55. As
illustrated in FIG. 24, the contact hole 56 is preferably formed
within the region of the interlayer insulating film 68 located on
the upper storage capacitor electrode 55a formed on a pattern
forming the storage capacitor (common) line 57. The reason for this
is that if the contact hole 56 is formed within the above-mentioned
region, this prevents a reduction in the aperture ratio from being
further caused.
[0010] For the storage capacitor element of the AM substrate
illustrated in FIGS. 24 and 25, when conductive foreign particles
(dust or particles) or a pin hole 99 exist in a part of the gate
insulating film 63 between the storage capacitor line (lower
storage capacitor electrode) 57 and the upper storage capacitor
electrode 55a, this causes a short circuit between the storage
capacitor line (lower storage capacitor electrode) 57 and the upper
storage capacitor electrode 55a. Thus, the pixel in which a short
circuit has occurred is found as a point defect on a display image.
This should be improved. Furthermore, also when poor etching or
poor photolithography cause a short circuit between the data signal
line 53 and the upper storage capacitor electrode 55a which are
formed in the same process step due to defects, such as an
unnecessarily left part 98 of a film, a point defect likewise
occurs and cannot be repaired. This should be devised.
[0011] For example, a liquid crystal display panel using vertically
alignment (VA) liquid crystal, such as a multi-domain vertical
alignment (MVA) liquid crystal, is set such that, under the
condition that no voltage is applied to a liquid crystal, an
associated pixel is displayed in black. In a case where a short
circuit is caused between the data signal line 53 and the upper
storage capacitor electrode 55a, a data signal is fed to the pixel
electrode 51 without passing through the TFT 54. This prevents the
data signal fed to the pixel electrode 51 from being able to be
controlled by a scanning signal. In view of the above, the pixel is
not displayed in black even on the condition that no voltage is
applied to the liquid crystal but recognized as a bright dot. The
bright dot generated when the whole area of the panel is displayed
in black is more conspicuous than a black dot or a dark dot
generated when the whole area thereof is displayed in white. As a
result, the display quality is significantly affected by the bright
dot. Techniques for repairing such point defects are disclosed in,
for example, Patent Documents 3 through 5.
[0012] In recent years, pixels have increased in size with an
increase in the screen areas of thin television sets. Accordingly,
a defective pixel has come to be large enough to be unignorable
from the viewpoint of the display quality. A technique has been
developed in which, in order to reduce the size of a defective
pixel, the size of a point defect is decreased by dividing one
pixel into a plurality of subpixels. In this technique, a pattern
becomes complicated by dividing one pixel into a plurality of
subpixels, resulting in the reduced aperture ratio of the pixel.
For example, for a 26-inch wide extended graphics array (WXGA)
display, the aperture ratio of a pixel is reduced approximately 4%
through 5%.
[0013] The structure of a liquid crystal display device in which
adjacent pixels share a storage capacitor line to increase the
aperture ratio of each pixel is disclosed in, for example, Patent
Documents 6 and 7. More specifically, even when a pixel is divided
into, for example, two subpixels, the existence of conductive
foreign particles or a pin hole in a part of an insulating layer
between a storage capacitor line (lower storage capacitor
electrode) and an upper storage capacitor electrode causes a short
circuit therebetween. The subpixel in which a short circuit occurs
is recognized as a point defect on a display image. However, as
compared with a case where a pixel is not divided, the area of the
point defect is reduced to half. As a result, the display quality
is insignificantly affected by the point defect.
[0014] FIG. 26 is a plan view schematically illustrating the
configuration of a portion of an AM substrate corresponding to a
pixel divided into a plurality of subpixels. FIG. 27 is a schematic
cross-sectional view of the AM substrate taken along the line B-B'
in FIG. 26. In FIGS. 26 and 27, the same components as those
illustrated in FIGS. 24 and 25 are denoted by the same reference
numerals.
[0015] As illustrated in FIGS. 26 and 27, a pixel electrode 51 is
divided into two subpixel electrodes 51L and 51R. A scanning signal
line 52 for supplying scanning signals is located in the vicinity
of the border between these subpixel electrodes 51L and 51R, and a
data signal line 53 for supplying data signals extends along the
lateral edges of the pixel electrode 51. TFTs 54L and 54R serving
as switching elements are located at the intersection of the
scanning signal line 52 and the data signal line 53 so as to be
connected to the subpixel electrodes 51L and 51R. The scanning
signal line 52 is interposed between the TFTs 54L and 54R when
viewed in plan. The scanning signal line 52 is connected to gate
electrodes 62L and 62R of the TFTs 54L and 54R. The drive of the
TFTs 54L and 54R is controlled by scanning signals fed to the gate
electrodes 62L and 62R. Furthermore, the data signal line 53 is
connected to source electrodes 66a of the TFTs 54L and 54R, and
thus data signals are fed to the source electrodes of the TFTs 54L
and 54R. Moreover, drain electrodes 66b are connected through
connection electrodes 55L and 55R to respective ones (upper storage
capacitor electrodes) 55La and 55Ra of electrodes of storage
capacitor elements and further connected via contact holes 56L and
56R formed in an interlayer insulating film 68 to the subpixel
electrodes 51L and 51R. A storage capacitor (common) line 57 is
formed on a transparent insulating substrate (insulating substrate)
61 and functions as the other electrodes (lower storage capacitor
electrodes) of the storage capacitor elements. In other words, the
respective upper storage capacitor electrodes 55La and 55Ra of
adjacent pixels share the storage capacitor (common) line 57 as the
other electrodes (lower storage capacitor electrodes) of the
storage capacitor elements. The AM substrate illustrated in FIGS.
26 and 27 can be fabricated through the similar process steps to
those through which the AM substrate illustrated in FIGS. 24 and 25
are fabricated.
[0016] For the AM substrate illustrated in FIGS. 26 and 27, the
storage capacitor (common) line 57 is formed in the vicinity of the
border between adjacent pixels to suppress a reduction in the
aperture ratio of each pixel. In order to ensure sufficient storage
capacity, the areas of the upper storage capacitor electrodes 55La
and 55Ra opposed to the storage capacitor (common) line 57 need to
be as large as possible. In view of the above, since the respective
upper storage capacitor electrodes 55La and 55Ra of adjacent pixels
are close to each other, it is likely to cause current leakage
failures between the upper storage capacitor electrodes 55La and
55Ra adjacent to each other.
[0017] In a case where a current leakage failure is caused, two
subpixel electrodes 51L and 51R sharing a storage capacitor
(common) line 57 become electrically continuous, resulting in
combined defects. In order to avoid this, a repair needs to be made
to defects to prevent a data signal for an adjacent pixel from
being fed to the pixel. For example, in order to prevent a data
signal from entering from an upper storage capacitor electrode 55La
of one (first pixel) of adjacent pixels into a subpixel electrode
51R of a second pixel adjacent to the first pixel, a part of the
subpixel electrode 51R of the second pixel located in a contact
hole 56R is removed. In this manner, the subpixel electrode 51R is
electrically isolated from the upper storage capacitor electrode
55Ra. Furthermore, in order to prevent a data signal from entering
through a drain electrode 66b of the second pixel and the upper
storage capacitor electrodes 55La and 55Ra into a subpixel
electrode 51L of the first pixel, a connection electrode 55R of the
second pixel is electrically isolated from the upper storage
capacitor electrode 55Ra. In view of the above, a subpixel of one
(second pixel) of the adjacent pixels is nonenergized, leading to a
point defect.
[0018] In other words, for an AM substrate in which a pixel is
divided into a plurality of subpixels, a point defect less
significantly affects the display quality than for an AM substrate
in which a pixel is not divided. The AM substrate in which a pixel
is divided into a plurality of subpixels may cause a current
leakage failure between adjacent upper storage capacitor electrodes
55La and 55Ra, resulting in an increase in the possibility of
bringing about a point defect. This should be improved.
Patent Document 1: Japanese Unexamined Patent Application
Publication No. 6-95157 (page 1) Patent Document 2: Japanese
Unexamined Patent Application Publication No. 9-152625 (pages 8
through 11 and 19, FIGS. 3 and 4)
Patent Document 3: Japanese Unexamined Patent Application
Publication No. 1-303415
Patent Document 4: Japanese Unexamined Patent Application
Publication No. 9-222615
Patent Document 5: Japanese Unexamined Patent Application
Publication No. 7-270824
Patent Document 6: Japanese Unexamined Patent Application
Publication No. 2004-62146
Patent Document 7: Japanese Unexamined Patent Application
Publication No. 2004-78157
DISCLOSURE OF THE INVENTION
Problems that the Invention is to Solve
[0019] An object of the present invention is to repair point
defects at an AM substrate. Another object of the present invention
is to improve production yields by repairing point defects.
Means of Solving the Problems
[0020] The present invention solves the above-mentioned problems in
the following manner: Two or more upper storage capacitor
electrodes are opposed to a storage capacitor line, associated
contact holes are formed in an interlayer insulating film covering
the upper storage capacitor electrodes, and a pixel electrode on
the interlayer insulating film is electrically connected via the
contact holes to the upper storage capacitor electrodes.
[0021] The present invention will be specifically described with
reference to the drawings. FIG. 1 is a plan view schematically
illustrating an AM substrate 12 according to an aspect of the
present invention, and FIG. 2 is a cross-sectional view taken along
the line II-II in FIG. 1.
[0022] The AM substrate 12 of this aspect includes a substrate 31,
an active element (for example, a TFT 24) formed on the substrate
31, a storage capacitor element 20 formed on the substrate 31, an
interlayer insulating film 38 covering the storage capacitor
element 20, and a pixel electrode 21 formed on the interlayer
insulating film 38. The storage capacitor element 20 includes a
storage capacitor line 27 formed on the substrate 31, an insulating
film (e.g., a gate insulating film 33) covering the storage
capacitor line 27, and three upper storage capacitor electrodes
25a, 25b and 25c opposed to the storage capacitor line 27 with the
gate insulating film 33 interposed therebetween. The TFT 24
includes a gate electrode 32 extending along the row direction from
a scanning signal line 22 extending along the column direction, a
gate insulating film 33 covering the gate electrode 32, a
high-resistance semiconductor layer 34 formed on the gate electrode
32 with the gate insulating film 33 interposed therebetween, and a
source electrode 36a and a drain electrode 36b formed on the
high-resistance semiconductor layer 34. The source electrode 36a is
connected to a data signal line 23 extending along the row
direction, and the drain electrode 36b is connected through a
connection electrode 25 to the upper storage capacitor electrode
25b.
[0023] The three upper storage capacitor electrodes 25a, 25b and
25c are electrically connected via contact holes 26a, 26b and 26c
formed in the interlayer insulating film 38 to a pixel electrode
21. Thus, the three upper storage capacitor electrodes 25a, 25b and
25c become electrically continuous through the pixel electrode 21.
Thus, while a data signal fed through the connection electrode 25
to the upper storage capacitor electrode 25b is fed to the pixel
electrode 21, the data signal is fed also to the upper storage
capacitor electrodes 25a and 25c. In other words, the same
electrical potential is applied to the three upper storage
capacitor electrodes 25a, 25b and 25c.
[0024] Next, the process step of repairing a point defect will be
described. In a case where a short circuit is caused between a
storage capacitor line 27 and upper storage capacitor electrodes
25a and 25c due to conductive foreign particles and pin holes 99 in
a gate insulating film 33, the electrical potential supplied to the
storage capacitor line 27 is applied through the upper storage
capacitor electrodes 25a and 25c to a pixel electrode 21. Since the
same electrical potential is typically applied to a counter
electrode (not shown) opposed to the pixel electrode 21 and the
storage capacitor line 27, no voltage is applied between the pixel
electrode 21 and the counter electrode. In view of the above, while
such a pixel of a liquid crystal display device operating in a
normally white mode is recognized as a bright dot, such a pixel of
a liquid crystal display device operating in a normally black mode
is recognized as a black dot.
[0025] Furthermore, in a case where data signal lines 23 are
shorted to upper storage capacitor electrodes 25a and 25c due to
defects, such as unnecessarily left parts 98 of the films, a data
signal is fed to the pixel electrode 21 without passing through a
TFT 24. This prevents a data signal fed to the pixel electrode 21
from being able to be controlled by a scanning signal. On the
condition that no voltage is applied to the pixel electrode 21,
such a pixel of a liquid crystal display device operating in a
normally white mode is not displayed in white, and such a pixel of
a liquid crystal display device operating in a normally black mode
is not displayed in black.
[0026] In order to repair such point defects, parts of the pixel
electrode 21 in contact holes 26a and 26c formed on the shorted
upper storage capacitor electrodes 25a and 25c are removed by a
laser or any other method. This allows the shorted upper storage
capacitor electrodes 25a and 25c to be isolated from the pixel
electrode 21. This isolation can prevent an electrical potential
from being applied through the storage capacitor line 27 and the
upper storage capacitor electrodes 25a and 25c to the pixel
electrode 21. Accordingly, although the storage capacity of the
storage capacitor element becomes smaller than in normal cases, the
pixel can be driven at near normal levels.
[0027] On the other hand, in a case where a short circuit is caused
between an upper storage capacitor electrode 25b connected to a
connection electrode 25 and a storage capacitor line 27 due to
conductive foreign particles and a pin hole, a part of the pixel
electrode 21 in a contact hole 26b formed on the shorted upper
storage capacitor electrodes 25b is removed by a laser or any other
method. This allows the shorted upper storage capacitor electrode
25b to be isolated from the pixel electrode 21. Furthermore, when
the connection electrode 25 is broken at the location K by a laser
or any other method, this can prevent a data signal line 23 from
being shorted through the TFT 24 to the storage capacitor line 27.
At the same time, the pixel electrode 21 is also isolated from the
TFT 24. Therefore, the pixel electrode 21 is allowed to become
electrically continuous with the storage capacitor line 27 by
melting the other upper storage capacitor electrodes 25a and 25c
(parts of the upper storage capacitor electrodes 25a and 25c other
than parts thereof located under the contact holes 26a and 26c)
using a laser or any other method. In this manner, the pixel
electrode 21 and the storage capacitor line 27 can be at the same
potential. In view of the above, for example, for a liquid crystal
display device operating in a normally black mode, its region
corresponding to the pixel electrode 21 is displayed in black, and
the above-mentioned defect can be repaired so as to be recognized
as a microdefect.
[0028] For the AM substrate 12 of this aspect, the area (first
area) of a region of the storage capacitor line 27 on which the
upper storage capacitor electrode 25b connected to the connection
electrode 25 is placed is smaller than the total area (second area)
of regions of the storage capacitor line 27 on which the upper
storage capacitor electrodes 25a and 25c prevented from being
connected to the connection electrode 25 are placed. The ratio
between the first area and the second area can be appropriately
selected according to the reliability of contact between the upper
storage capacitor electrodes 25a, 25b and 25c and the pixel
electrode 21, the probability of short circuits between the storage
capacitor line 27 and the upper storage capacitor electrodes 25a,
25b and 25c, and other factors.
[0029] In some cases, it may be more difficult to connect the pixel
electrode 21 to the upper storage capacitor electrodes 25a and 25c
via the contact holes 26a and 26c with excellent coverage than to
connect the pixel electrode 21 to the upper storage capacitor
electrode 25b via the contact hole 26b with excellent coverage.
Furthermore, the contact resistance between a metal film made of
aluminum or any other metal and forming upper storage capacitor
electrodes and a film made of ITO or the like and forming the pixel
electrode 21 may be large. In such cases, the upper storage
capacitor electrodes 25a and 25c may be prevented from functioning
as electrodes of storage capacitor elements. To cope with this, the
first area is set to be larger than the second area. In this way,
the ratio of the first area to the total area of the first and
second areas becomes high. As a result, a large storage capacity
can be secured according to the ratio of the first area.
[0030] For the AM substrate 12 of this aspect, the number of a
connection electrode 25 through which a TFT 24 is connected to an
upper storage capacitor electrode is one. Therefore, the aperture
ratio can be restrained from decreasing as compared with a case
where a connection electrode 25 is connected to all upper storage
capacitor electrodes 25a, 25b and 25c.
[0031] For the AM substrate 12 illustrated in FIG. 1, a TFT 24 is
connected through a connection electrode 25 to an upper storage
capacitor electrode 25b. However, no connection electrode for
providing connection between a TFT 24 and an upper storage
capacitor electrode has to be provided. When no connection
electrode is provided, this can further restrain the aperture ratio
from decreasing. For example, a contact hole may be formed in a
part of an interlayer insulating film 38 located on a drain
electrode 36b of a TFT 24, and a pixel electrode 21 may be
connected via the contact hole to the drain electrode 36b. In this
manner, the electrical potential of a data signal can be applied
through the pixel electrode 21 to upper storage capacitor
electrodes 25a, 25b and 25c.
[0032] Furthermore, the location of the contact hole 26b is not
limited within a region of the interlayer insulating film 38
located on the upper storage capacitor electrode 25b and can be
within a region thereof located on the connection electrode 25.
However, when, as illustrated in FIG. 1, the contact hole 26b is
formed in a region of the interlayer insulating film 38 located
within a pattern of a storage capacitor line 27 and on the upper
storage capacitor electrode 25b, this can restrain the aperture
ratio from decreasing.
[0033] In another aspect of the present invention, when the AM
substrate 12 of the present invention is used for a liquid crystal
display device operating in a MVA mode, a connection electrode 25
is formed to correspond to a region of the AM substrate 12 provided
with a slit (provided without any electrode layer) or a region of a
counter substrate provided with a rib (projection) projecting
toward a liquid crystal layer. This can restrain the aperture ratio
from decreasing due to provision of the connection electrode
25.
[0034] For the AM substrate 12 of this aspect, the planar shape of
each of upper storage capacitor electrodes 25a, 25b and 25c is a
quadrilateral but not restrictive. It may be a triangle, a
semicircle, a trapezoid, or any other shape. The three upper
storage capacitor electrodes 25a, 25b and 25c are placed on a gate
insulating film 33 to overlap a pattern of the storage capacitor
line 27. Since the upper storage capacitor electrodes are formed of
the same film as data signal lines 23, they are likely to be
shorted to the data signal lines 23 due to unnecessarily left parts
98 of the films. Therefore, as illustrated in FIG. 1, the upper
storage capacitor electrodes 25a and 25c near the data signal lines
23 are preferably isolated from the upper storage capacitor
electrode 25b connected to the connection electrode 25. These three
upper storage capacitor electrodes are obtained by dividing the
above-mentioned same film into three as illustrated in FIG. 1.
However, the number (N) into which the film is divided to obtain
upper storage capacitor electrodes is not restrictive and need only
be equal to or larger than two.
[0035] A storage capacitor line 27 is typically formed of the same
material as scanning signal lines 22 and a gate electrode 32.
However, a material of the storage capacitor line 27 is not
restrictive. For example, before and after the formation of the
scanning signal lines 22 and the gate electrode 32, a storage
capacitor line 27 may be formed using any other material (e.g., a
transparent conductive film made of ITO or the like).
[0036] For the AM substrate 12 of this aspect, an insulating film
forming part of a storage capacitor element 20 corresponds to only
a gate insulating film 33 as illustrated in FIG. 2. However, this
is not restrictive. For example, before or after the formation of
the gate insulating film 33, an insulating film other than the gate
insulating film 33 may be formed on the storage capacitor line 27.
In this way, a layered film including the gate insulating film 33
may be formed.
[0037] The AM substrate of the present invention can be utilized
for display devices, such as liquid crystal display devices and
organic and inorganic EL display devices. Still another aspect of
the present invention provides a display device. A display device
of the present invention includes the AM substrate of the present
invention, a counter electrode opposed to the AM substrate, and a
display medium layer placed in the gap between the AM substrate and
the counter electrode. The "display medium layer" herein means a
layer in which the amount of light is adjusted according to the
voltage applied to the layer or the current supplied thereto, and
examples of the display medium layer include a layer in which the
optical transmittance (optical reflectivity) of light from a light
source or ambient light is modulated and a self-luminous layer.
Specific examples of the display medium layer include, for example,
a liquid crystal layer, inorganic or organic EL layer, or other
layers.
[0038] The "counter electrode" herein means an electrode opposed to
a pixel electrode on the AM substrate, and examples of the counter
electrode include a common (whole-area) electrode and a stripe
electrode. For example, in a case of an organic EL display device,
an anode corresponds to the pixel electrode, and a cathode
corresponds to the counter electrode. The counter electrode may be
formed of an optically reflective conductive film made of aluminum,
silver, or any other material or a transparent conductive film made
of ITO, IZO, zinc oxide, tin oxide, or any other material.
[0039] Yet another aspect of the present invention provides a
liquid crystal display device. The liquid crystal display device of
the present invention includes the AM substrate of the present
invention, a counter substrate having a surface on which a counter
electrode opposed to the AM substrate is formed, and a liquid
crystal layer placed in the gap between the AM substrate and the
counter substrate. The counter substrate is typically a transparent
insulating substrate made of glass, plastic, or any other
material.
[0040] In the display device and the liquid crystal display device
of the present invention, the same electrical potential may be
applied to a storage capacitor line and a counter electrode. In an
organic EL display device, on condition that repair of a point
defect in an AM substrate provides electrical continuity between a
pixel electrode and a storage capacitor line, if the storage
capacitor line and the counter electrode are at the same potential,
no current will flow through an organic EL layer (typically, an
electron-transporting layer, light-emitting layer or a
hole-transporting layer). This prevents a light-emitting region
(pixel) from emitting light. In other words, since the
light-emitting region is displayed as a black dot, a point defect
is less likely to be conspicuous.
[0041] In the liquid crystal display device, on condition that
repair of a point defect in the AM substrate provides electrical
continuity between a pixel electrode associated with a defective
pixel and the storage capacitor line, if the storage capacitor line
and the counter electrode are at the same potential, no voltage
will be applied to a liquid crystal layer. In a case where the
liquid crystal layer is a vertical alignment type liquid crystal
layer containing nematic liquid crystal material having a negative
dielectric anisotropy, the liquid crystal display device is
typically driven in a normally black mode. Therefore, the repaired
pixel is displayed in black. As a result, the point defect is less
likely to be conspicuous.
[0042] On the other hand, in a case where the liquid crystal layer
is a twist-aligned liquid crystal layer containing nematic liquid
crystal material having a positive dielectric anisotropy, the
liquid crystal display device is typically driven in a normally
white mode. In this case, a pixel electrode associated with a
defective pixel is allowed to be electrically continuous with a
storage capacitor line, and a different potential from the
potential supplied to a counter electrode is supplied to the
storage capacitor line, thereby applying a predetermined voltage to
the liquid crystal layer. A predetermined voltage (at which a pixel
is displayed in black) is applied to the liquid crystal layer, for
example, by supplying the potential at which the pixel is displayed
in black to the storage capacitor line. Therefore, the repaired
pixel is displayed as a black dot. As a result, the point defect is
less likely to be conspicuous.
EFFECTS OF THE INVENTION
[0043] According to the present invention, a point defect in an AM
substrate can be repaired. This can improve production yields.
BRIEF DESCRIPTION OF DRAWINGS
[0044] FIG. 1 is a plan view schematically illustrating an AM
substrate 12 according to an aspect of the present invention.
[0045] FIG. 2 is a cross-sectional view taken along the line II-II
in FIG. 1.
[0046] FIG. 3 is a plan view schematically illustrating an AM
substrate 12a according to a first embodiment.
[0047] FIG. 4 is a cross-sectional view taken along the line IV-IV
in FIG. 3.
[0048] FIG. 5 is a plan view for schematically explaining a repair
process step in a case where a short circuit is caused between
upper storage capacitor electrodes 25a and 25c.
[0049] FIG. 6 is a plan view for schematically explaining a repair
process step in a case where a short circuit is caused between the
upper storage capacitor electrode 25a and a data signal line
23.
[0050] FIG. 7 is a plan view for schematically explaining a repair
process step in a case where a short circuit is caused between an
upper storage capacitor electrode 25a and a storage capacitor line
27.
[0051] FIG. 8 is a plan view for schematically explaining a repair
process step in a case where a short circuit is caused between the
upper storage capacitor electrode 25b and an upper storage
capacitor electrode 25d.
[0052] FIG. 9 is a plan view for schematically explaining a repair
process step in a case where a short circuit is caused between the
upper storage capacitor electrode 25b and the data signal line
23.
[0053] FIG. 10 is a plan view for schematically explaining a repair
process step in a case where a short circuit is caused between the
upper storage capacitor electrode 25b and the storage capacitor
line 27.
[0054] FIG. 11 is a plan view schematically illustrating an AM
substrate 12b of a second embodiment set such that the total area
of regions of a storage capacitor line 27 on which upper storage
capacitor electrodes 25a and 25c are placed becomes smaller than
the area of regions of the storage capacitor line 27 on which upper
storage capacitor electrodes 25b and 25d are placed.
[0055] FIG. 12 is a plan view schematically illustrating an AM
substrate 12c of a third embodiment.
[0056] FIG. 13 is a plan view schematically illustrating an AM
substrate 12d of a fourth embodiment.
[0057] FIG. 14 is a plan view schematically illustrating an AM
substrate 12e of a fifth embodiment.
[0058] FIG. 15 is a plan view schematically illustrating an AM
substrate 12f of a sixth embodiment.
[0059] FIG. 16 is a cross-sectional view schematically illustrating
a liquid crystal display panel of the fifth embodiment and taken
along the line XVI-XVI in FIG. 15.
[0060] FIG. 17 is a plan view for schematically explaining a repair
process step for the AM substrate 12f of the sixth embodiment in a
case where a short circuit is caused between upper storage
capacitor electrodes 25a and 25c.
[0061] FIG. 18 is a plan view schematically illustrating the AM
substrate 12g of the seventh embodiment.
[0062] FIG. 19 is a cross-sectional view taken along the line
XIX-XIX in FIG. 18.
[0063] FIG. 20 is a plan view schematically illustrating an AM
substrate 12h of an eighth embodiment.
[0064] FIG. 21 is a cross-sectional view taken along the line
XXI-XXI in FIG. 20.
[0065] FIG. 22 is a block diagram illustrating a television device
15 of a ninth embodiment.
[0066] FIG. 23 is a block diagram illustrating a liquid crystal
display device 10 of the ninth embodiment.
[0067] FIG. 24 is a schematic plan view illustrating the
configuration of a portion of an AM substrate which corresponds to
a pixel, includes a storage capacitor element and is used for a
known AM type liquid crystal display device.
[0068] FIG. 25 is a cross-sectional view schematically illustrating
the cross section of the AM substrate taken along the line A-A' in
FIG. 24.
[0069] FIG. 26 is a plan view schematically illustrating the
configuration of a portion of an AM substrate corresponding to a
pixel divided into a plurality of subpixels.
[0070] FIG. 27 is a cross-sectional view schematically illustrating
the cross section of the AM substrate taken along the line B-B' in
FIG. 26.
DESCRIPTION OF REFERENCE NUMERALS
[0071] 10 liquid crystal display device [0072] 11 tuner [0073] 12
AM substrate [0074] 13 counter substrate [0075] 14 liquid crystal
layer (display medium layer) [0076] 15 television device [0077] 20
storage capacitor element [0078] 20R first storage capacitor
element [0079] 20L second storage capacitor element [0080] 21 pixel
electrode [0081] 21R subpixel electrode (first pixel electrode)
[0082] 21L subpixel electrode (second pixel electrode) [0083] 22
scanning signal lines [0084] 22a first scanning line [0085] 22b
second scanning line [0086] 23 data signal lines [0087] 24, 24L,
24R TFTs (active elements) [0088] 25L, 25R connection electrodes
[0089] 25a, 25b, 25c, 25d upper storage capacitor electrodes [0090]
26a, 26b, 26c, 26d contact holes [0091] 27 storage capacitor
(common) line [0092] 27a, 38c slits [0093] 31 substrate [0094] 32,
32R gate electrodes [0095] 33 gate insulating film [0096] 34
high-resistance semiconductor layer [0097] 36a source electrode
[0098] 36b drain electrode [0099] 37b black matrix [0100] 38
interlayer insulating film [0101] 39 counter electrode [0102] 98
unnecessarily left part of film (short-circuited portion)
BEST MODE FOR CARRYING OUT THE INVENTION
[0103] Embodiments of the present invention will be described
hereinafter with reference to the drawings. However, the present
invention is not limited to the embodiments described below. In
order to generally indicate similar components, alphabets in
reference numerals may be omitted. In other words, the components
may be denoted by only numerals in reference numerals. For example,
a first scanning signal line 22a and a second scanning signal line
22b may be generally expressed as scanning signal lines 22.
[0104] In each of AM substrates described in the following
embodiments, a plurality of subpixels into which a pixel is divided
are driven by the same scanning signal line and the same data
signal line. Furthermore, adjacent pixels along the data signal
line share the same storage capacitor (common) line. An upper
storage capacitor electrode is formed on the storage capacitor
(common) line with an insulating film interposed therebetween while
being divided into three or more pieces. Two or more of the three
or more pieces into which the upper storage capacitor electrode is
divided are connected through associated connection electrodes to a
TFT located in the vicinity of the intersection of the scanning
signal line and the data signal line. The other piece/pieces of the
upper storage capacitor electrode to which no connection electrode
is connected is connected to a subpixel electrode forming a
subpixel.
[0105] On condition that the upper storage capacitor electrode is
divided into a plurality of upper storage capacitor electrodes, if
failures, such as current leakage between one of the upper storage
capacitor electrodes and the storage capacitor line, the data
signal line or an upper storage capacitor electrode of an adjacent
pixel, are caused, a repair is made to an associated defective
pixel by electrically isolating the upper storage capacitor
electrode from which a current has leaked. In a case where this
repair prevents current from passing through the associated
subpixel, continuity between the associated subpixel electrode and
the storage capacitor (common) line is provided by applying laser
light or the like to the divided electrode (upper storage capacitor
electrode) that is not connected to any connection electrode. In
this manner, the electrical potential of the storage capacitor
(common) line can be applied to the subpixel electrode. When the
same electrical potential is applied to the storage capacitor
(common) line and a counter electrode, no voltage is applied to a
liquid crystal layer interposed between the subpixel electrode and
the counter electrode. For a vertical alignment type liquid crystal
display device driven in a normally black mode, the repaired pixel
is displayed in black. As a result, a point defect becomes less
conspicuous.
[0106] On the other hand, for a twist-alignment type liquid crystal
display device driven in a normally white mode, a predetermined
voltage (the voltage at which a pixel is displayed in black) is
applied to a liquid crystal layer, for example, by supplying the
potential at which the pixel is displayed in black to a storage
capacitor (common) line. Therefore, the repaired pixel is displayed
as a black dot. As a result, a point defect becomes less
conspicuous. In view of the above, the above-mentioned repair
allows a defective pixel to be recognized as a minute point defect,
which is ignorable in terms of display quality, and can improve
production yields.
Embodiment 1
[0107] FIG. 3 is a plan view schematically illustrating an AM
substrate 12a of this embodiment. FIG. 4 is a cross-sectional view
taken along the line IV-IV in FIG. 3. The AM substrate 12a of this
embodiment takes on a Cs-on-Common structure in which a storage
capacitor line is formed as a lower electrode of a storage
capacitor element. The AM substrate 12a of this embodiment is
configured such that a pixel is divided into two subpixels and each
adjacent pair of pixels share a storage capacitor line.
[0108] Each subpixel herein is the smallest unit of display. Two or
more subpixels which are selected by a scanning signal supplied to
the same scanning signal line and a data signal supplied to the
same data signal line and to which the same data signal is fed form
one pixel. Furthermore, three pixels corresponding to R, G and B
form one picture element. A pixel (or subpixel) region of an AM
type liquid crystal display device is defined by a pixel electrode
(or a subpixel electrode) and a counter electrode opposed to the
pixel electrode (or the subpixel electrode). When the AM type
liquid crystal display device is provided with a black matrix, a
region of the AM type liquid crystal display device to which, in
order to display an image, a voltage is applied and which
corresponds to an opening of the black matrix strictly corresponds
to the pixel (or subpixel) region.
[0109] The AM substrate 12a of this embodiment has a plurality of
pixels arranged in a matrix form. Two subpixels arranged along the
row direction form one pixel. To be specific, as illustrated in
FIG. 3, each of pixel electrodes is divided into two subpixel
electrodes (a first pixel electrode and a second pixel electrode)
21R and 21L). Scanning signal lines 22 for supplying scanning
signals are located in the vicinity of the borders between the
subpixel electrodes 21R and 21L and adjacent subpixel electrodes of
the same pixel to extend along the column direction (longitudinally
in this figure). Data signal lines 23 for supplying data signals
are located along the lateral edges of the pixel electrodes to
extend along the row direction (laterally in this figure). TFTs 24R
and 24L are located, as switching elements connected to the
associated subpixel electrodes 21R and 21L, at the intersections of
the scanning signal lines 22 and the data signal lines 23. Each
scanning signal line 22 and the associated adjacent TFTs 24R and
24L are arranged along the row direction with the scanning signal
line 22 interposed between the associated TFTs 24R and 24L when
viewed in plan.
[0110] Each scanning signal line 22 is connected to respective gate
electrodes of the associated TFTs 24R and 24L. The drive of the
TFTs 24R and 24L is controlled by a scanning signal fed to the gate
electrodes. One of the data signal lines 23 is connected to
respective source electrodes 36a of the associated TFTs 24R and
24L, and a data signal is fed thereto. Drain electrodes 36b are
connected through associated connection electrodes 25L and 25R to
respective ones (upper storage capacitor electrodes) 25a and 25c of
the electrodes of associated storage capacitor elements and further
connected to the subpixel electrodes 21R and 21L via contact holes
26a and 26c formed in an interlayer insulating film 38.
[0111] FIG. 3 illustrates a right subpixel electrode 21R located at
the left side of a storage capacitor (common) line 27 and included
in a first pixel and a left subpixel electrode 21L included in a
second pixel adjacent to the first pixel along the row direction
(to the right side of the first pixel). The subpixel electrode 21R
included in the first pixel is the right one of two subpixel
electrodes selected by a scanning signal supplied to a first
scanning signal line 22a and a data signal supplied to a data
signal line 23. The subpixel electrode 21L included in the second
pixel is the left one of two subpixel electrodes selected by a
scanning signal supplied to a second scanning signal line 22b
adjacent to the first scanning signal line along the row direction
and a data signal supplied to the data signal line 23.
[0112] The two subpixels have a first storage capacitor element 20R
and a second storage capacitor element 20L, respectively, each
having a pair of electrodes between which an insulating film is
interposed. The first and second storage capacitor elements 20R and
20L share a storage capacitor (common) line 27 formed on a
transparent insulating substrate (insulating substrate) 31. The
storage capacitor (common) line 27 functions as one of the pair of
electrodes of each storage capacitor element. A gate insulating
film 33 covers the storage capacitor (common) line 27. The other
electrode (upper storage capacitor electrode) of the storage
capacitor element is formed so as to be opposed to the storage
capacitor (common) line 27 with the gate insulating film 33
interposed therebetween. The upper storage capacitor electrode
opposed to the storage capacitor (common) line 27 is divided into
four, i.e., upper storage capacitor electrodes 25a and 25b of the
first storage capacitor element 20R and upper storage capacitor
electrodes 25c and 25d of the second storage capacitor element 20L.
These upper storage capacitor electrodes 25a, 25b, 25c, and 25d are
placed on a pattern of the storage capacitor (common) line 27.
[0113] For the AM substrate 12a of this embodiment, connection
electrodes 25R and 25L are connected to the upper storage capacitor
electrodes 25a and 25c of the storage capacitor elements 20R and
20L, respectively. A nontransparent material is typically used as a
material of the connection electrodes 25R and 25L. Therefore,
regions of the AM substrate 12a in which the connection electrodes
25R and 25L are formed become nontransparent. Since the connection
electrodes 25R and 25L are therefore hardly utilized as the
aperture of an associated pixel, the aperture ratio of the pixel
can be enhanced by connecting the connection electrodes 25R and 25L
to only the upper storage capacitor electrodes 25a and 25c,
respectively, as compared with a case where each of the connection
electrodes is connected to both the associated upper storage
capacitor electrodes. However, in a case where regions of the AM
substrate 12a corresponding to the connection electrodes 25R and
25L are allowed to overlap regions thereof provided with ribs,
slits or the like, each connection electrode is preferably
connected to both of associated upper storage capacitor
elements.
[0114] A cross-sectional structure of a subpixel electrode 21R
included in a first pixel will be described with reference to FIG.
4. A gate electrode 32R is formed on a transparent insulating
substrate (insulating substrate) 31 made of glass, plastic or any
other material so as to be connected to a first scanning signal
line 22a. The first scanning signal line 22a and the gate electrode
32R are formed of a metal film made of titanium, chrome, aluminum,
molybdenum, or any other metal, an alloy of these metals, or a
layered film thereof. A storage capacitor (common) line 27
functioning as a lower storage capacitor electrode of a storage
capacitor element is typically formed of the same material as the
first scanning signal line 22a and the gate electrode 32R. A gate
insulating film 33 covering the storage capacitor (common) line 27,
the first scanning signal line 22a and the gate electrode 32R is
formed of an insulating film made of silicon nitride, silicon
oxide, or any other material. A high-resistance semiconductor layer
34 made of amorphous silicon, polysilicon, or any other material
and a low-resistance semiconductor layer made of n.sup.+ amorphous
silicon doped with impurities, such as phosphorus, or any other
material are formed on the gate insulating film 33 to overlap the
gate electrode 32R. The low-resistance semiconductor layer will be
a source electrode 36a and a drain electrode 36b.
[0115] A data signal line 23 is formed so as to be connected to the
source electrode 36a. Furthermore, a connection electrode 25R is
formed so as to be connected to the drain electrode 36b and formed
continuously with one of upper storage capacitor electrodes, i.e.,
an upper storage capacitor electrode 25a. The upper storage
capacitor electrode 25a is connected via a contact hole 26a to a
subpixel electrode 21R.
[0116] The other upper storage capacitor electrode 25b is connected
via a contact hole 26b to the subpixel electrode 21R. In summary,
the two upper storage capacitor electrodes 25a and 25b are
configured so as to be electrically connected through the subpixel
electrode 21R to each other. The data signal line 23, the
connection electrode 25 and the upper storage capacitor electrodes
25a and 25b are typically formed of the same material, e.g., a
metal film made of titanium, chrome, aluminum, molybdenum, or any
other metal, an alloy of these metals, or a layer film thereof. The
pixel electrodes 21R and 21L are formed of a transparent conductive
film, such as ITO, IZO, zinc oxide, or tin oxide. The contact holes
26a and 26b pass through an interlayer insulating film 38 covering
a TFT 24R, the scanning signal line 22a, the data signal line 23,
and the connection electrode 25. For example, an acrylic resin,
silicon nitride, silicon oxide, or any other material is used as a
material of the interlayer insulating film 38.
[0117] Next, the process step of repairing a point defect in the AM
substrate 12a of this embodiment will be described. In the AM
substrate 12a of this embodiment, in order to ensure a sufficient
storage capacity, the area of each of the upper storage capacitor
electrodes 25a through 25d opposed to the storage capacitor
(common) line 27 need to be as large as possible. For this reason,
upper storage capacitor electrodes of a subpixel are formed near
upper storage capacitor electrodes of another subpixel adjacent to
the subpixel in the row direction. Therefore, it is likely to cause
a current leakage failure between each pair of the upper storage
capacitor electrodes which are adjacent to each other in the row
direction. Furthermore, a short circuit may be caused between the
data signal line 23 and the upper storage capacitor electrode 25a
due to a defect, such as an unnecessarily left part of a film.
Moreover, a short circuit may be caused between the upper storage
capacitor electrode 25a and the storage capacitor line 27 due to
conductive foreign particles or pin holes in the gate insulating
film 33.
[0118] FIG. 5 is a plan view for schematically explaining a repair
process step for a short circuit caused between adjacent upper
storage capacitor electrodes 25a and 25c connected to connection
electrodes 25R and 25L, respectively. In an AM substrate 12aa to be
repaired, a short circuit is caused between the upper storage
capacitor electrodes 25a and 25c due to an unnecessarily left part
of a film. This allows adjacent subpixel electrodes 21R and 21L to
be electrically connected to each other through the shorted upper
storage capacitor electrodes 25a and 25c and contact holes 26a and
26c, resulting in combined defects.
[0119] FIG. 6 is a plan view for schematically explaining a repair
process step for a short circuit caused between an upper storage
capacitor electrode 25a connected to a connection electrode 25R and
a data signal line 23. In an AM substrate 12ab to be repaired, a
short circuit is caused between the data signal line 23 and the
upper storage capacitor electrode 25a due to defects, such as an
unnecessarily left part of a film. Thus, a data signal is fed
through the data signal line 23 and the upper storage capacitor
electrode 25a to a subpixel electrode 21R.
[0120] FIG. 7 is a plan view for schematically explaining a repair
process step for a short circuit caused between an upper storage
capacitor electrode 25a connected to a connection electrode 25R and
a storage capacitor line 27. In an AM substrate 12ac to be
repaired, a short circuit is caused between the upper storage
capacitor electrode 25a and the storage capacitor line 27 due to
conductive foreign particles or pin holes in a gate insulating film
33. As a result, the shorted pixel is recognized as a point defect
on a display image.
[0121] In a case where an upper storage capacitor electrode 25a
connected to a connection electrode 25R is shorted to an adjacent
upper storage capacitor electrode 25c, an associated data signal
line 23, or an associated storage capacitor line 27, short circuits
between subpixel electrodes 21R and 21L can be solved by removing a
part 101 of the subpixel electrode 21R located in a contact hole
26a formed on the shorted upper storage capacitor electrode 25a.
Furthermore, the shorted upper storage capacitor electrode 25a can
be isolated by breaking the connection electrode 25R at the
location K using a laser. This isolation can prevent current from
leaking, through a TFT 24R, between the data signal line 23 and the
storage capacitor line 27 when the TFT 24R is in the ON state.
[0122] The subpixel electrode 21R is also electrically isolated
from the TFT 21R simultaneously with the above-mentioned isolation
so as to be nonenergized. For this reason, the other upper storage
capacitor electrode 25b (except for its part on which a contact
hole 26b is formed) is melted by a laser 102 or the like, thereby
providing continuity through the upper storage capacitor electrode
25b between the subpixel electrode 21R and the storage capacitor
(common) line 27. This allows the subpixel electrode 21R and the
storage capacitor (common) line 27 to be at the same potential. In
view of the above, for a liquid crystal display device having an AM
substrate 12a repaired in the above-mentioned manners, its region
corresponding to the subpixel electrode 21R is displayed in black,
and thus a defect in this region can be repaired so as to be
recognized as a microdefect.
[0123] FIG. 8 is a plan view for schematically explaining a repair
process step for a short circuit caused between an upper storage
capacitor electrode 25b that is not connected to a connection
electrode 25R and an upper storage capacitor electrode 25d adjacent
to the upper storage capacitor electrode 25b. In an AM substrate
12ad to be repaired, a short circuit is caused between the upper
storage capacitor electrodes 25b and 25d due to an unnecessarily
left part of a film. This allows adjacent subpixel electrodes 21R
and 21L to be electrically connected to each other through the
shorted upper storage capacitor electrodes 25b and 25d and contact
holes 26b and 26d, resulting in combined defects.
[0124] FIG. 9 is a plan view for schematically explaining a repair
process step for a short circuit caused between an upper storage
capacitor electrode 25b that is not connected to a connection
electrode 25R and a data signal line 23. In an AM substrate 12ae to
be repaired, a short circuit is caused between the data signal line
23 and the upper storage capacitor electrode 25b due to defects,
such as an unnecessarily left part of a film. Thus, a data signal
is fed through the data signal line 23 and the upper storage
capacitor electrode 25b to a subpixel electrode 21R.
[0125] FIG. 10 is a plan view for schematically explaining a repair
process step for a short circuit caused between an upper storage
capacitor electrode 25b that is not connected to a connection
electrode 25R and a storage capacitor line 27. In an AM substrate
12af to be repaired, a short circuit is caused between the upper
storage capacitor electrode 25b and the storage capacitor line 27
due to conductive foreign particles or pin holes in a gate
insulating film 33. As a result, the shorted pixel is recognized as
a point defect on a display image.
[0126] In a case where an upper storage capacitor electrode 25b
that is not connected to a connection electrode 25R is shorted to
an adjacent upper storage capacitor electrode 25d, an associated
data signal line 23 or an associated storage capacitor line 27, a
part 103 of the subpixel electrode 21R located in a contact hole
26b formed on the shorted upper storage capacitor electrode 25b is
removed by a laser or the like. In this manner, the shorted upper
storage capacitor electrode 25b can be isolated from a subpixel
electrode 21R. This isolation can prevent an electrical potential
from being applied through the storage capacitor line 27 and the
upper storage capacitor electrode 25b to the subpixel electrode
21R. In view of the above, an associated subpixel can be driven at
near normal levels.
Embodiment 2
[0127] The AM substrate 12a of the first embodiment is set such
that the total area (first area) of regions of the storage
capacitor line 27 on which the upper storage capacitor electrodes
25a and 25c connected to the connection electrodes 25R and 25L are
placed is larger than that (second area) of regions thereof on
which the upper storage capacitor electrodes 25b and 25d prevented
from being connected to the connection electrodes 25R and 25L are
placed.
[0128] It may be more difficult to connect the subpixel electrodes
21R and 21L via the contact holes 26b and 26d to the upper storage
capacitor electrodes 25b and 25d with excellent coverage than to
connect the subpixel electrodes 21R and 21L via the contact holes
26a and 26c to the upper storage capacitor electrodes 25a and 25c
with excellent coverage. Furthermore, the contact resistance
between a metal film forming upper storage capacitor electrodes and
containing aluminum or any other metal and a film forming the
subpixel electrodes 21R and 21L and made of ITO or any other
material may be large. In these cases, the upper storage capacitor
electrodes 25b and 25d may be prevented from functioning as
electrodes of storage capacitor elements. To cope with this, the
first area is set to become larger than the second area, thereby
increasing the ratio of the first area to the total of the first
and second areas. This can ensure a large storage capacity
proportional to the ratio of the first area.
[0129] However, if a short circuit between the upper storage
capacitor electrodes 25a and 25c connected to the connection
electrodes 25R and 25L and other elements (e.g., the storage
capacitor line 27) is more likely to be caused than reduction in
reliability of contact between the subpixel electrodes 21R and 21L
and the upper storage capacitor electrodes 25a and 25c, the first
area may be set to be smaller than the second area.
[0130] FIG. 11 is a plan view schematically illustrating an AM
substrate 12b set such that the total area of regions of a storage
capacitor line 27 on which upper storage capacitor electrodes 25a
and 25c connected to connection electrodes 25R and 25L are placed
becomes smaller than that of regions thereof on which upper storage
capacitor electrodes 25b and 25d prevented from being connected to
the connection electrodes 25R and 25L are placed. The same
reference numerals are given to the same components as in the first
embodiment, and thus the components having the same reference
numerals as in the first embodiment will not be described.
[0131] The AM substrate 12b of this embodiment is set such that the
total area (first area) of regions of the storage capacitor line 27
on which the upper storage capacitor electrodes 25a and 25c
connected to the connection electrodes 25R and 25L are placed
becomes smaller than that (second area) of regions thereof on which
the upper storage capacitor electrodes 25b and 25d prevented from
being connected to the connection electrodes 25R and 25L are
placed. Therefore, if the upper storage capacitor electrodes 25a
and 25c connected to the connection electrodes 25R and 25L are
shorted to other elements, a large storage capacity proportional to
the ratio of the second area to the total area of the first and
second areas can be secured.
Embodiment 3
[0132] For the AM substrate 12b of the second embodiment, as
illustrated in FIG. 11, the upper storage capacitor electrodes 25a
and 25b corresponding to the right one (first subpixel) of two
subpixels included in the first pixel located at the left side of
the storage capacitor line 27 (the left one of the two subpixels is
only partially shown) are arranged to be symmetrical to the upper
storage capacitor electrodes 25c and 25d corresponding to the left
one (second subpixel) of two subpixels included in the second pixel
located at the right side of the storage capacitor line 27 (the
right one of the two subpixels is only partially shown). In other
words, the upper storage capacitor electrode 25a associated with
the first subpixel and connected to the connection pixel 25R is
adjacent to the upper storage capacitor electrode 25c associated
with the second subpixel and connected to the connection electrode
25L in a direction crossing the direction in which the storage
capacitor line 27 extends, and the upper storage capacitor
electrode 25c prevented from being connected to the connection
electrode 25R is adjacent to the upper storage capacitor electrode
25d prevented from being connected to the connection electrode 25L
in a direction crossing the direction in which the storage
capacitor line 27 extends.
[0133] However, the arrangement of the upper storage capacitor
electrodes 25a through 25d of the present invention is not limited
to that described in the second embodiment. The upper storage
capacitor electrode 25a associated with the first subpixel and
connected to the connection pixel 25R and the upper storage
capacitor electrode 25c associated with the second subpixel and
connected to the connection electrode 25L may be shifted along the
direction in which the storage capacitor line 27 extends.
[0134] FIG. 12 is a plan view schematically illustrating an AM
substrate 12c of this embodiment. For the AM substrate 12c of this
embodiment, an upper storage capacitor electrode 25c associated
with a second subpixel and connected to a connection electrode 25L
is shifted below an upper storage capacitor electrode 25a
associated with a first subpixel and connected to a connection
electrode 25R only when viewed in this figure. Furthermore, an
upper storage capacitor electrode 25d associated with the second
subpixel and prevented from being connected to the connection
electrode 25L is shifted above an upper storage capacitor electrode
25b associated with the first subpixel and prevented from being
connected to the connection electrode 25R only when viewed in this
figure.
[0135] Since, in the AM substrate 12c of this embodiment, the upper
storage capacitor electrode 25c is shifted downward when viewed in
FIG. 12, the connection electrode 25L through which a drain
electrode of a TFT 24L is connected to the upper storage capacitor
electrode 25c is longer than the connection electrode 25R of the
first subpixel. Accordingly, the aperture ratio of the second
subpixel may become lower than that of the first subpixel. On
condition that the AM substrate 12c of this embodiment is used for
a liquid crystal display device operating in a MVA mode, if a
connection electrode 25L is formed on a region of the AM substrate
12c provided with a slit (provided without an electrode layer) or a
region of a counter substrate provided with a rib (projection)
projecting toward a liquid crystal layer, this can restrain the
aperture ratio from decreasing due to an increase in the length of
the connection electrode 25L.
[0136] In the second embodiment, as illustrated in FIG. 11, the
upper storage capacitor electrodes 25a and 25c connected to the
connection electrodes 25R and 25L, respectively, are located close
to each other. This may cause current leakage between the upper
storage capacitor electrodes 25a and 25c. If a short circuit is
caused between the upper storage capacitor electrodes 25a and 25c
connected to the connection electrodes 25R and 25L, respectively,
any one of the associated subpixels needs to be repaired, thereby
displaying the subpixel as a black dot.
[0137] For the AM substrate 12c of this embodiment, the upper
storage capacitor electrodes 25a and 25c connected to the
connection electrodes 25R and 25L, respectively, are located apart
from each other as compared with the second embodiment. Therefore,
a short circuit is less likely to be caused between the upper
storage capacitor electrodes 25a and 25c. On condition that the
upper storage capacitor electrodes 25a and 25c connected to the
connection electrodes 25R and 25L, respectively, are shorted to the
upper storage capacitor electrodes 25b and 25d prevented from being
connected to the connection electrodes 25R and 25L, the upper
storage capacitor electrodes 25b and 25d prevented from being
connected to the connection electrodes 25R and 25L need to be
isolated from the upper storage capacitor electrodes 25a and 25c.
Although this isolation decreases the storage capacities of the
upper storage capacitor electrodes 25b and 25d, it simultaneously
allows associated subpixels to be driven and displayed at near
normal levels.
Embodiment 4
[0138] In the first through third embodiments, the upper storage
capacitor electrodes 25a and 25b of the first subpixel are adjacent
to the upper storage capacitor electrodes 25c and 25d of the second
subpixel in a direction crossing the direction in which the storage
capacitor line 27 extends. However, the present invention is not
limited to these embodiments. For example, the upper storage
capacitor electrodes 25a through 25d may be arranged along the
direction in which the storage capacitor line 27 extends.
[0139] FIG. 13 is a plan view schematically illustrating an AM
substrate 12d of this embodiment. For the AM substrate 12d of this
embodiment, two upper storage capacitor electrodes 25a and 25b
included in a first subpixel are located above two upper storage
capacitor electrodes 25c and 25d included in a second subpixel only
when viewed in this figure. Furthermore, the upper storage
capacitor electrode 25a associated with the first subpixel and
connected to a connection electrode 25R is located above the upper
storage capacitor electrode 25b associated therewith and prevented
from being connected to the connection electrode 25R only when
viewed in this figure. On the other hand, the upper storage
capacitor electrode 25c associated with a second subpixel and
connected to a connection electrode 25L is located below the upper
storage capacitor electrode 25d associated therewith and prevented
from being connected to the connection electrode 25L only when
viewed in this figure.
[0140] When, as illustrated in FIG. 13, the upper storage capacitor
electrodes 25a through 25d are arranged along the direction in
which the storage capacitor line 27 extends, this can reduce the
width of the storage capacitor line 27. This width reduction can
improve the aperture ratio of each subpixel. Furthermore, since the
upper storage capacitor electrodes 25b and 25d are interposed
between the upper storage capacitor electrode 25a connected to the
connection electrode 25R and the upper storage capacitor electrode
25c connected to the connection electrode 25L, this can prevent a
short circuit from being caused between the electrodes 25a and 25c.
In a case where the upper storage capacitor electrode 25b of the
first subpixel is shorted to the upper storage capacitor electrode
25d of the second subpixel, any one of the storage capacitor
electrodes 25b and 25d need to be isolated from subpixel electrodes
21R and 21L. This isolation allows the subpixels to be driven and
displayed at near normal levels.
Embodiment 5
[0141] In the first through fourth embodiments, two of upper
storage capacitor electrodes 25a through 25d are placed in each of
first and second subpixels. However, an upper storage capacitor
electrode of at least one of two adjacent subpixels may be divided
into two or more pieces.
[0142] FIG. 14 is a plan view schematically illustrating an AM
substrate 12e of this embodiment. For the AM substrate 12e of this
embodiment, while a second subpixel has two upper storage capacitor
electrodes 25c and 25d, a first subpixel has only one upper storage
capacitor electrode 25a connected to a connection electrode 25R.
When an upper storage capacitor electrode is divided into two or
more pieces, the storage capacity of an associated subpixel is
reduced as compared with when an upper storage capacitor electrode
is not divided. To cope with this, an upper storage capacitor
electrode of only a subpixel in which a short circuit is likely to
be caused between the upper storage capacitor electrode and any
other element is divided. This can suppress a decrease in the
storage capacity of another adjacent subpixel.
Embodiment 6
[0143] In each of the embodiments, in a case where a short circuit
is caused between upper storage capacitor electrodes, this short
circuit can be solved, for example, by removing parts of electrodes
in contact holes formed on the shorted upper storage capacitor
electrodes. However, in the present invention, the short circuit
may be solved by removing shorted part of a liquid crystal display
device using the following countermeasure.
[0144] FIG. 15 is a plan view schematically illustrating an AM
substrate 12f of this embodiment. FIG. 16 is a cross-sectional view
schematically illustrating the cross section of a liquid crystal
display panel 5 of this embodiment taken along the line XVI-XVI in
FIG. 15.
[0145] As illustrated in FIG. 16, the liquid crystal display panel
5 includes an AM substrate 12f and a counter substrate 13 opposed
to each other, and a liquid crystal layer 14 formed between these
substrates 12f and 13.
[0146] For the AM substrate 12f, each of storage capacitor lines 27
has a slit 27a between a combination of upper storage capacitor
electrodes 25a and 25b and a combination of upper storage capacitor
electrodes 25c and 25d. The other configuration and effect of the
AM substrate 12f are similar to those of the AM substrate 12a
described in the first embodiment, and thus description thereof
will not be given. The pattern shape of the slit 27a is not limited
to that illustrated in FIG. 15 and is appropriately adjusted
according to the shapes of the upper storage capacitor electrodes
25a through 25d and the storage capacitor line 27.
[0147] The counter substrate 13 takes on a multilayer structure in
which a color filter layer 37, a counter electrode 39, an alignment
film (not shown), and other films are sequentially stacked on a
substrate 31.
[0148] The color filter layer 37 includes colored layers 37a each
associated with any one of R, G and B and arranged in a matrix
pattern to correspond to pixels of the AM substrate 12f and black
matrixes 37b each disposed between each adjacent pair of the
colored layers 37a. As illustrated in FIG. 16, each black matrix
37b overlaps the slit 27a formed in the AM substrate 12f. In view
of the above, for a liquid crystal display device operating in a
normally white mode, light can be restrained from leaking through
the slit 27a when pixels are displayed in black.
[0149] Next, a fabrication method for a liquid crystal display
panel 5 of the above-described configuration will be described. The
liquid crystal display panel 5 is fabricated through the process
steps of producing an AM substrate, producing a counter substrate
and producing a liquid crystal display panel. These process steps
will be described below. Furthermore, after at least one of the AM
substrate production process step and the liquid crystal display
panel production process step, a test process step is carried out.
When a defective pixel is detected in the test process step, the
process step of repairing the defective pixel is added after the
test process step.
[0150] The AM substrate production process step will be described
hereinafter.
[0151] First, a metal film made of titanium, chrome, aluminum,
molybdenum, tantalum, tungsten, copper, or any other metal, an
alloy film of these metals, or a layered film of these films is
entirely deposited (to a thickness of 1000 .ANG. through 3000
.ANG.) on a substrate 31 made of glass, plastic, or any other
material by sputtering. Then, the deposited film is patterned by
photolithography technology (photo engraving process: hereinafter,
referred to as a "PEP technology"), thereby providing scanning
signal lines 22, gate electrodes 32R and storage capacitor lines
27.
[0152] Next, an inorganic insulating film made of silicon nitride,
silicon oxide, or any other material is deposited (to a thickness
of approximately 3000 .ANG. through 5000 .ANG.) by CVD (chemical
vapor deposition) to entirely cover the substrate on which the
scanning signal lines 22 and other elements are formed, thereby
forming a gate insulating film 33.
[0153] Subsequently, an intrinsic amorphous silicon film (having a
thickness of 1000 .ANG. through 3000 .ANG.) and an n+ amorphous
silicon film (having a thickness of 400 .ANG. through 700 .ANG.)
doped with phosphorus are sequentially formed by CVD to entirely
cover the gate insulating film 33 covering the substrate. Then,
these films are patterned in island forms by PEP technology to
cover the gate electrode 32R, thereby forming silicon layered
structures composed of the intrinsic amorphous silicon film and the
n+amorphous silicon film.
[0154] Subsequently, a metal film made of titanium, chrome,
aluminum, molybdenum, tantalum, tungsten, copper, or any other
metal, an alloy film of these metals, or a layered film of these
films is deposited (to a thickness of 1000 .ANG. through 3000
.ANG.) by sputtering to entirely cover the substrate on which the
silicon layered structures are formed. Then, the deposited film is
patterned by PEP technology, thereby providing data signal lines
23, connection electrodes 25R and 25L and upper storage capacitor
electrodes 25a through 25d (storage capacitor electrode formation
process step).
[0155] Furthermore, the n+ amorphous silicon layer forming parts of
the silicon layered structures is partially etched away using the
data signal lines 23 and the connection electrodes 25R and 25L as
masks, thereby forming a channel portion of a TFT. In this manner,
a semiconductor layer having a source electrode 36a and a drain
electrode 36b is formed (channel portion formation process
step).
[0156] The semiconductor layer may be formed of an amorphous
silicon film as described above. Alternatively, it may be formed of
a polysilicon film. Furthermore, an amorphous silicon film or a
polysilicon film may be laser annealed, resulting in its
crystallinity improved. In this manner, the speed of electrons
traveling through the semiconductor layer is increased, resulting
in the characteristics of a TFT 24 improved.
[0157] Next, an inorganic insulating film made of silicon nitride,
silicon oxide, or any other material is deposited (to a thickness
of 2000 .ANG. through 5000 .ANG.) by CVD to entirely cover the
substrate on which the data signal lines 23 and other elements are
formed. Alternatively, a photosensitive acrylic resin (having a
thickness of 2 .mu.m through 4 .mu.m) may be formed by die coating
(coating). In this manner, an interlayer insulating film 38 is
formed.
[0158] Then, parts of the interlayer insulating film 38
corresponding to the upper storage capacitor electrodes 25a through
25d are etched away, thereby forming contact holes 26a through
26d.
[0159] Subsequently, a transparent conductive film made of ITO
(indium tin oxide), IZO (indium zinc oxide), zinc oxide, tin oxide,
or any other material is deposited (to a thickness of 1000 .ANG.
through 2000 .ANG.) by sputtering to entirely cover the interlayer
insulating film 38 which is formed on the substrate and in which
the contact holes 26a through 26d are formed. Then, the transparent
conductive film is patterned by PEP technology, thereby forming
pixel electrodes 21R and 21L.
[0160] Finally, a polyimide resin with a thickness of 500 .ANG.
through 1000 .ANG. is printed to entirely cover the substrate on
which the pixel electrodes 21R and 21L are formed, then baked and
rubbed along one direction by a rubbing cloth, thereby forming an
alignment film.
[0161] In the above-described manner, an AM substrate 12f is
produced (fabricated).
[0162] The counter substrate production process step will be
described hereinafter.
[0163] First, a chrome thin film or a resin containing a black
pigment is formed to entirely cover a substrate 31 made of glass,
plastic, or any other material and then patterned by PEP
technology, thereby forming black matrixes 37b.
[0164] Next, a colored layer 37a (with a thickness of approximately
2 .mu.m) corresponding to any one of red, green and blue is
patterned between each adjacent pair of the black matrixes by a
pigment dispersion method. In the above-mentioned manner, a color
filter layer 37 is formed.
[0165] Subsequently, a transparent conductive film made of ITO,
IZO, zinc oxide, tin oxide, or any other material is deposited (to
a thickness of approximately 1000 .ANG.) to entirely cover the
color filter layer 37, thereby forming a counter electrode 39.
[0166] Finally, a polyimide resin having a thickness of 500 .ANG.
through 1000 .ANG. is printed to entirely cover the counter
electrode 39, then baked and rubbed along one direction by a
rotation cloth, thereby forming an alignment film.
[0167] In the above-mentioned manner, a counter substrate 13 can be
produced.
[0168] <Liquid Crystal Display Panel Production Process
Step>
[0169] The liquid crystal panel production process step will be
described hereinafter.
[0170] First, a sealant made of a thermosetting epoxy resin or any
other material is applied to one of the AM substrate 12f and the
counter substrate 13 produced in the above-mentioned manner by
screen printing to form a frame-like pattern provided with a liquid
crystal inlet. Spherical spacers each having a diameter equal to
the thickness of a liquid crystal layer 14 and made of plastic or
silica are distributed over the other substrate.
[0171] Next, the AM substrate 12f and the counter substrate 13 are
bonded to each other, and the sealant is cured, thereby producing
an empty liquid crystal display panel.
[0172] Finally, liquid crystal material is injected into the empty
liquid crystal display panel by an evacuation method, and then a
UV-curable resin is applied to the liquid crystal inlet to enclose
the liquid crystal material by UV application. In this manner, a
liquid crystal layer 14 is formed.
[0173] The liquid crystal display panel 5 is produced (fabricated)
in the above-described manner.
[0174] The test process step and the defect repair process step
will be described hereinafter.
[0175] First, a description will be given of a case where the test
process step (short-circuited portion detection process step) is
carried out after the AM substrate production process step (before
the formation of an alignment film).
[0176] In this short-circuited portion detection process step, the
AM substrate 12f produced in the AM substrate production process
step is subjected to a visual test, an electrooptical test or other
tests, thereby detecting the location at which a short circuit is
caused (a short-circuited portion of the AM substrate). The visual
test herein indicates optical test of a line pattern using a CCD
camera or any other method. The electrooptical test herein
indicates that a line pattern is electrooptically inspected in the
following method: A modulator (electrooptical element) is placed so
as to be opposed to an active matrix substrate, and then a voltage
is applied between the active matrix substrate and the modulator
while light is allowed to be incident therebetween, and variations
in the intensity of the light are captured by a CCD camera.
[0177] Subsequently, the detected defect is repaired by removing
the detected short-circuited portion of the AM substrate 12f. In
this embodiment, a repair method for a short circuit caused between
upper storage capacitor electrodes 25a and 25c of an AM substrate
12fa will be described with reference to FIG. 17.
[0178] To be specific, laser light is applied through a slit 27a to
an unnecessarily left part 98 of a film that is a short-circuited
portion of the AM substrate 12fa, thereby isolating the shorted
upper storage capacitor electrodes 25a and 25c from each other. In
this way, the isolated upper storage capacitor electrodes 25a and
25c perform as well as upper storage capacitor electrodes 25a and
25c of a normal pixel.
[0179] In order to cut the unnecessarily left part 98 of the film,
for example, the fourth harmonic (having a wavelength of 266 nm) of
an yttrium aluminum garnet (YAG) laser is used. Use of the YAG
laser allows the short-circuited portion to be cut by laser
application with excellent accuracy.
[0180] The slit 27a preferably has a width of 5 .mu.m or more and
an area of 25 .mu.m.sup.2 or more. The width of the slit 27a means
the length of the slit 27a along the direction in which data signal
lines 23 extend. The area to which laser light is applied when the
short-circuited portion is cut by a YAG laser can be secured
proportionally to the above-mentioned width. Furthermore, in view
of the diameter of a light beam to be applied by a YAG laser and
alignment for laser application, the slit 27a preferably has a
width of 10 .mu.m or more and an area of 100 .mu.m.sup.2 or
more.
[0181] The test process step and the defect repair process step may
be carried out, not after the formation of pixel electrodes 21R and
21L, but after the process step of forming upper storage capacitor
electrodes 25a through 25d or after the process step of forming a
channel portion. Thus, a defective pixel can be repaired earlier in
a process for fabricating a liquid crystal display panel, resulting
in the production yields of AM substrates and liquid crystal
display panels further improved.
[0182] Next, a description will be given of a case where the test
process step (short-circuited portion detection process step) is
carried out after the liquid crystal display panel production
process step.
[0183] In this short-circuited portion detection process step, the
liquid crystal display panel 5 produced in the liquid crystal panel
production process step is subjected to a lighting test, thereby
detecting a short-circuited portion of the liquid crystal display
panel 5. To be specific, for example, a gate test signal (bias
voltage of -10V; pulse voltages of +15V with pulse width of 50
.mu.sec at a frequency of 16.7 msec) is input to the scanning
signal lines 22 to turn on all the TFTs 24. Further, a source test
signal of .+-.2 V potential whose polarity is inverted every 16.7
msec is applied to the data signal lines 23, whereby the electric
charge corresponding to .+-.2 V is written in the pixel electrode
21 through the source electrode 36a and the drain electrode 36b of
each TFT 24. At the same time, a counter electrode test signal,
which is a DC (direct current) signal of -1 V potential, is input
to the counter electrode 39 and the storage capacitor line 27. As a
result, a voltage is applied to the liquid crystal capacitor formed
between the pixel electrodes 21R and 21L and the counter electrode
39 and the storage capacitor element formed between the storage
capacitor line 27 and the upper storage capacitor electrodes 25a
through 25d, and a pixel forming these pixel electrodes 21R and 21L
enters the ON state. At the location where a short circuit is
caused between respective upper storage capacitor electrodes of
adjacent pixels (e.g., between upper storage capacitor electrodes
25a and 25c), associated pixel electrodes 21L and 21R become
electrically continuous, resulting in combined defects. In this
manner, the location of a short-circuited portion of the AM
substrate 12f is detected.
[0184] Subsequently, the detected defect is repaired by removing
the detected short-circuited portion of the AM substrate 12f. A
specific repair method will not be described in details because it
is substantially the same as the above-mentioned repair method for
the defect detected during or after the production of the AM
substrate 12f. In the case of the repair for the defect detected
during or after the production of the AM substrate 12f, laser light
can be applied through both the top and back surfaces of the AM
substrate 12f to the AM substrate 12f. On the other hand, in the
case of repair for the defect detected after the production of the
liquid crystal display panel 5, laser light is applied through the
surface of the AM substrate 12f located at the substrate 31 side
(the back surface of the AM substrate 12f) to the AM substrate
12f.
[0185] As described above, according to the AM substrate 12f of
this embodiment, in a case where a short circuit is caused between
the upper storage capacitor electrodes 25a and 25c or between the
upper storage capacitor electrodes 25b and 25d, laser light is
applied through the slit 27a to the unnecessarily left part 98 of a
film that is the short-circuited portion. In this manner, a
defective pixel can be easily repaired. Accordingly, the production
yields of AM substrates and liquid crystal display panels can be
improved.
[0186] In a case where the unnecessarily left part 98 of the film
between a combination of the upper storage capacitor electrodes 25a
and 25b and a combination of the upper storage capacitor electrodes
25c and 25d is formed of only a high-resistance semiconductor film,
such as an amorphous silicon film, the unnecessarily left part 98
of the film is hardly changed into a channel by the potential
supplied to the storage capacitor line 27. The reason for this is
that the storage capacitor line 27 is provided with the slit 27a.
In view of the above, the occurrence of combined defects can be
suppressed even without the above-mentioned repair using laser
light. To the contrary, in a case where the storage capacitor line
27 is not provided with the slit 27a, the unnecessarily left part
98 of the high-resistance semiconductor film is changed into a
channel so that the associated pair of upper storage capacitor
electrodes become electrically continuous. The reason for this is
that the storage capacitor line 27 functions as a gate electrode
and the pair of upper storage capacitor electrodes function as a
source electrode and a drain electrode.
Embodiment 7
[0187] FIG. 18 is a plan view schematically illustrating an AM
substrate 12g of this embodiment. FIG. 19 is a cross-sectional view
taken along the line XIX-XIX in FIG. 18.
[0188] For this AM substrate 12g, as illustrated in FIG. 19, an
interlayer insulating film 38 takes on a double-layer structure of
a lower first interlayer insulating film 38a and a upper second
interlayer insulating film 38b and has a slit 38c overlapping a
slit 27a of a storage capacitor line 27. The other configuration
and effect of the AM substrate 12g are similar to those of the AM
substrate 12a described in the first embodiment, and thus their
description will not be given.
[0189] In order to form the first interlayer insulating film 38a,
an inorganic insulating film made of silicon nitride, silicon
oxide, or any other material is deposited (to a thickness of 2000
through 5000 .ANG.) by CVD. In order to form the second interlayer
insulating film 38b, a photosensitive acrylic resin is deposited
(to a thickness of 2 through 4 .mu.m) by die coating.
[0190] The slit 38c is formed in the interlayer insulating film 38
simultaneously with the formation of respective contact holes 26a
through 26d of the upper storage capacitor electrodes 25a through
25d. To be specific, first, the photosensitive acrylic resin
forming the second interlayer insulating film 38b is patterned, and
subsequently the inorganic insulating film forming the first
interlayer insulating film is subjected to dry etching using the
patterned photosensitive acrylic resin as a mask, thereby forming
the interlayer insulating film 38 having the contact holes 26a
through 26d and the slit 38c.
[0191] In the above-mentioned etching process for forming the
contact holes 26a through 26d and other elements, the unnecessarily
left part 98 formed between any adjacent pair of the upper storage
capacitor electrodes 25a through 25d can also be removed. Thus, the
short-circuited portion can be removed by usual etching without
cutting the short-circuited portion by laser application.
Embodiment 8
[0192] FIG. 20 is a plan view schematically illustrating the AM
substrate 12h of this embodiment. FIG. 21 is a cross-sectional view
taken along the line XXI-XXI in FIG. 20.
[0193] For this AM substrate 12h, as illustrated in FIG. 21, a
subpixel electrode 21R overlaps a slit 27a of a storage capacitor
line 27. The other configuration and effect of the AM substrate 12h
are similar to those of the AM substrate 12a described in the first
embodiment, and thus their description will not be given.
[0194] According to the AM substrate 12h, since the subpixel
electrode 21R overlaps the slit 27a, laser light is applied through
the surface of the AM substrate 12h located at the substrate 31
side (the back surface of the AM substrate 12h) to the AM substrate
12h. Furthermore, when the AM substrate 12h is applied to a liquid
crystal display device operating in a normally white mode, light
can be restrained from leaking when a pixel is to be displayed in
black. This can suppress deterioration in display quality and
restrain the aperture ratio of a pixel from being reduced.
Embodiment 9
[0195] FIG. 22 is a block diagram illustrating a television device
15 of this embodiment. As illustrated in FIG. 22, the television
device 15 includes a tuner 11 for receiving a television broadcast
and outputting a video signal and a liquid crystal display device
10 for displaying an image based on the video signal supplied from
the tuner 11.
[0196] FIG. 23 is a block diagram illustrating the liquid crystal
display device 10 of this embodiment.
[0197] As illustrated in FIG. 23, the liquid crystal display device
10 includes a Y/C separation circuit 1 for separating the video
signal supplied from the tuner 11 or the like into a luminance
signal and a color signal, a video chroma circuit 2 for converting
the luminance signal and the color signal into an analog RGB signal
corresponding to one of the three primary colors of light, i.e., R,
G or B, an A/ID converter 3 for converting the analog RGB signal
into a digital RGB signal, a liquid crystal controller 4 to which
the digital RGB signal is fed, a liquid crystal display panel 5 to
which the digital RGB signal is fed through the liquid crystal
controller 4 at a predetermined time and which includes an AM
substrate 12, described in the above-mentioned embodiments, for
substantially displaying an image, a gray scale circuit 7 for
supplying a gray scale voltage to the liquid crystal display panel
5, a backlight 9 for supplying light to the liquid crystal display
panel 5, a backlight drive circuit 8 for driving the backlight 9,
and a microcomputer 6 for controlling the whole system of the
above-mentioned configuration.
[0198] Not only a video signal based on a television broadcast as
described above but also other various video signals, such as a
video signal for video taken by a camera and a video signal
supplied through an internet line, can be utilized as the video
signal supplied to the Y/C separation circuit 1.
[0199] The television device 15 of the above-mentioned
configuration includes a liquid crystal display device 10 having an
AM substrate in which a defective pixel is easily repaired. This
can improve the production yields of television devices and liquid
crystal display devices.
[0200] Although the preferred embodiments of the present invention
have been described, the technical scope of the present invention
is not limited to that described in the above embodiments. It
should be understood by those skilled in the art that the above
embodiments are exemplary only, and that various modifications may
be further made to combinations of the foregoing components and
processes and such modifications are also intended to fall within
the technical scope of the present invention.
INDUSTRIAL APPLICABILITY
[0201] An AM substrate of the present invention is applicable to
liquid crystal display devices, inorganic or organic EL display
devices, or other devices. A liquid crystal display device of the
present invention is applicable to various electrical apparatuses,
such as portable telephones, PDAs (personal digital assistances),
personal computers, thin TV sets, medical displays, car navigation
systems, amusement apparatuses, or other apparatuses.
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