U.S. patent application number 12/471242 was filed with the patent office on 2009-09-10 for electrical testing probe assembly having nonparallel facing surfaces and slots formed thereon for receiving probes.
This patent application is currently assigned to NICTECH CO., LTD.. Invention is credited to BYUNG-HEE JEON, DAE-CHEOL KANG.
Application Number | 20090224790 12/471242 |
Document ID | / |
Family ID | 40131695 |
Filed Date | 2009-09-10 |
United States Patent
Application |
20090224790 |
Kind Code |
A1 |
JEON; BYUNG-HEE ; et
al. |
September 10, 2009 |
ELECTRICAL TESTING PROBE ASSEMBLY HAVING NONPARALLEL FACING
SURFACES AND SLOTS FORMED THEREON FOR RECEIVING PROBES
Abstract
Disclosed is a probe assembly for use in electrical testing of a
test object. The probe assembly has a probe supporter body
elongated in a first direction. The probe supporter has a first
side surface, a second side surface, a first facing surface and a
second facing surface. The first and second facing surfaces are
configured to face a test object, and substantially nonparallel to
each other. The probe assembly has a plurality of first slots
formed on the first side surface and the first facing surface and a
plurality of second slots formed on the second side surface and the
second facing surface. Each slot is configured to receive a portion
of a probe.
Inventors: |
JEON; BYUNG-HEE;
(SEONGNAM-SI, KR) ; KANG; DAE-CHEOL;
(NAMYANGJU-SI, KR) |
Correspondence
Address: |
KNOBBE MARTENS OLSON & BEAR LLP
2040 MAIN STREET, FOURTEENTH FLOOR
IRVINE
CA
92614
US
|
Assignee: |
NICTECH CO., LTD.
SEOUL
KR
|
Family ID: |
40131695 |
Appl. No.: |
12/471242 |
Filed: |
May 22, 2009 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
12139330 |
Jun 13, 2008 |
|
|
|
12471242 |
|
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Current U.S.
Class: |
324/755.06 ;
29/428; 324/755.11 |
Current CPC
Class: |
G01R 1/07342 20130101;
Y10T 29/49826 20150115; G01R 1/06727 20130101; Y10T 29/49222
20150115 |
Class at
Publication: |
324/762 ;
29/428 |
International
Class: |
G01R 1/073 20060101
G01R001/073; B23P 11/00 20060101 B23P011/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 15, 2007 |
KR |
10-2007-0059161 |
Jun 15, 2007 |
KR |
10-2007-0059164 |
Claims
1. A probe assembly for use in electrical testing of an object, the
probe assembly comprising: a probe supporter body elongated in a
first direction and comprising a first side surface, a second side
surface, a first facing surface and a second facing surface,
wherein the first and second facing surfaces are configured to face
a testing object, wherein the first and second facing surfaces are
substantially nonparallel to each other; a plurality of first slots
formed on the first side surface and the first facing surface,
wherein each first slot is configured to receive a portion of a
probe; and a plurality of second slots formed on the second side
surface and the second facing surface, wherein each second slot is
configured to receive a portion of a probe.
2. The probe assembly of claim 1, wherein the probe supporter body
has a cross-section having a generally gable shape.
3. The probe assembly of claim 1, wherein the first facing surface
and the first side surface form a first angle therebetween, wherein
the second facing surface and the second side surface form a second
angle therebetween, and wherein the first and second angle are
about the same.
4. The probe assembly of claim 1, wherein each first slot comprises
a portion extending in a second direction that is substantially
perpendicular to the first direction, wherein each second slot
comprises a portion extending in the second direction.
5. The probe assembly of claim 1, wherein each first slot comprises
a portion extending in a third direction that is substantially
perpendicular to the first direction and substantially slanted
relative to the second direction, wherein each second slot
comprises a portion extending in a fourth second direction that is
substantially perpendicular to the first direction and
substantially slanted relative to the second direction, wherein the
third direction is not parallel to the fourth direction.
6. The probe assembly of claim 1, wherein the probe assembly
comprises one of the plurality of first slots which does not
overlap any one of the plurality of second slots when viewed in a
direction perpendicular to the first side surface.
7. The probe assembly of claim 1, wherein the probe assembly
comprises one of the plurality of first slots, which has a width
that partially overlaps with a width of one of the plurality of
second slots when viewed in a direction perpendicular to the first
side surface.
8. The probe assembly of claim 1, wherein the probe assembly
comprises one of the plurality of first slots that substantially
eclipses one of the plurality of second slots when viewed in a
direction perpendicular to the first side surface.
9. The probe assembly of claim 1, wherein the first and second side
surfaces are substantially parallel to each other.
10. The probe assembly of claim 9, wherein the first facing surface
is substantially slanted with respect to the first side
surface.
11. The probe assembly of claim 1, further comprising a first probe
engaged with one of the plurality of first slots, and a second
probe engaged with one of the plurality of second slots.
12. The probe assembly of claim 11, wherein the first probe
comprises: a first arm generally extending in a second direction
perpendicular to the first direction, wherein a portion of the
first arm is inserted in the one of the plurality of first slots, a
second arm electrically and physically connected to the first arm
and generally extending in a third direction substantially
perpendicular to the first direction and substantially slanted with
respect to the second direction, wherein a portion of the second
arm is inserted in the one of the plurality of first slots, a first
terminal portion formed at a distal end of the first arm and
comprising a first tip configured to contact a first electrode, and
a second terminal portion formed at a distal end of the second arm
and comprising a second tip configured to contact a second
electrode.
13. The probe assembly of claim 1, further comprising a probe
engaged with one of the plurality of first slots, and further
comprising a channel generally extending in the first direction and
disposed between the first facing surface and the second facing
surface, wherein the probe comprises a projection projecting into
the channel and further configured to limit the probe's movement in
a direction perpendicular to the first side surface.
14. The probe assembly of claim 13, further comprising an
additional facing surface which is substantially parallel to the
first facing surface, wherein the channel is located between the
first facing surface and the additional facing surface, and an
additional slot formed on the additional facing surface configured
to receive a portion of the probe.
15. A probe for use in a probe assembly for electrical testing, the
probe comprising: a first arm extending generally in a fifth
direction; a second arm electrically and physically connected to
the first arm and extending generally in a sixth direction
substantially slanted with respect to the fifth direction; a first
terminal portion formed at a distal end of the first arm and
comprising a first tip configured to form an electrical and
physical contact with a first device, wherein the first terminal
portion is configured to allow the first tip to elastically move
generally in the fifth direction; and a second terminal portion
formed at a distal end of the second arm and comprising a second
tip configured to form an electrical and physical contact with a
second device, wherein the second terminal portion is configured to
allow the second tip to elastically move generally in the fifth
direction.
16. The probe of claim 15, wherein the second arm has an upper
surface and the probe further comprises a projection extending from
the upper surface.
17. The probe of claim 15, wherein the second terminal portion
comprises a resilient extension between the second arm and the
second tip, wherein the resilient extension generally extend in the
sixth direction.
18. A method of making a probe assembly for use in electrical
testing of an object, the method comprising: providing a probe
supporter which comprises: a probe supporter body elongated in a
first direction and comprising a first side surface, a second side
surface, a first facing surface and a second facing surface which
generally extend in the first direction, wherein the first and
second facing surfaces are substantially nonparallel to each other,
a plurality of first slots formed on the first side surface and the
first facing surface, and a plurality of second slots formed into
the second side surface and the second facing surface; providing a
first probe and a second probe; and engaging the first probe with
one of the plurality of first slots and the second probe with one
of the plurality of second slots.
19. The method of claim 18, wherein providing the probe supporter
comprises forming the plurality of first slots using a rotating
wheel cutter.
20. The method of claim 19, wherein in forming the plurality of
first slots, the rotating wheel cutter does not contact the second
facing surface.
Description
CROSS-REFERENCE TO RELATED PATENT APPLICATIONS
[0001] This application is a continuation application of U.S.
application Ser. No. 12/139,330 filed Jun. 13, 2008, now pending.
This application further claims priority to and the benefit of the
earlier filing dates of Korean Patent Application Nos.
10-2007-0059161 and 10-2007-0059164, both filed Jun. 15, 2007. This
application incorporates herein by references U.S. application Ser.
No. 12/139,330 and Korean Patent Application Nos. 10-2007-0059161
and 10-2007-0059164 in their entirety.
BACKGROUND
[0002] 1. Field
[0003] The present disclosure relates to a probe card and, more
particularly, to a probe assembly for use in testing electrical
characteristics of a testing object such as a semiconductor wafer,
a flat panel display.
[0004] 2. Description of the Related Technology
[0005] Semiconductor devices are manufactured through a variety of
processes including wafer production, wafer test, die packaging and
so forth. The wafer test refers to a so-called electrical die
sorting test for testing electrical characteristics of the
semiconductor devices. In the electrical die sorting test, the
semiconductor devices are sorted into acceptable products and
unacceptable products by bringing probe pins of a probe card into
contact with electrode pads of the semiconductor devices and then
allowing an electric current to flow through the electrode pads of
the semiconductor devices. In addition to testing the semiconductor
devices, the probe card is used in testing data/gate lines in a
cell process of flat displays such as a TFT-LCD (Thin Film
Transistor-Liquid Crystal Display), a PDP (Plasma Display Panel),
an OEL (Organic Electro-Luminescence) and the like.
[0006] U.S. Pat. Nos. 7,150,095 and 7,138,812 disclose probe cards
in which needle type probes are connected to a printed circuit
board. Each of the probe cards disclosed in these patent documents
includes a supporter for supporting probes on a printed circuit
board. The probes are fixed to the supporter by means of an
insulating material and electrically connected to the printed
circuit board by soldering.
[0007] With the probe cards disclosed in the above patent
documents, however, the probes need to be aligned with the
supporter through the use of a probe-positioning jig in order for a
worker to fix the probes to the supporter, and the soldering has to
be performed to bond the probes to the printed circuit board. This
sharply reduces the productivity of the probe cards and makes it
quite difficult to evenly align the probes to the supporter.
[0008] Furthermore, the probe cards make it difficult to repair or
replace the probes on a one-by-one basis because the probes are
soldered to the printed circuit board. In other words, when one of
the probes is defective, it is impossible to remove only the
defective probe. There is no choice but to replace the probe card
having the defective probe as a whole.
[0009] Moreover, in the probe cards, the probes are coated with an
insulating material in order to prevent short-circuit of the
probes, which leads to increased production cost and reduced
productivity.
[0010] In recent years, the diameter of a wafer tends to be
increased to 200 mm or more in an effort to improve the yield rate
of semiconductor chips. Furthermore, the pattern of a wafer grows
finer and finer. For these reasons, it is necessary to perform
touchdown of a probe card several times while a single sheet of
wafer is inspected with the probe card. Increase in the frequency
of touchdown of a probe card leads to prolonged inspection time and
rapid wear and damage of probes, thereby shortening the lifespan of
the probe card.
[0011] The foregoing discussion is to provide general background
information, and does not constitute an admission of prior art.
SUMMARY
[0012] One aspect of the invention provide a probe assembly for use
in electrical testing of an object, which comprises: a probe
supporter body elongated in a first direction and comprising a
first side surface, a second side surface, a first facing surface
and a second facing surface, wherein the first and second facing
surfaces are configured to face a testing object, wherein the first
and second facing surfaces are substantially nonparallel to each
other; a plurality of first slots formed on the first side surface
and the first facing surface, wherein each first slot is configured
to receive a portion of a probe; a plurality of second slots formed
on the second side surface and the second facing surface, wherein
each second slot is configured to receive a portion of a probe.
[0013] In the foregoing assembly, the probe supporter body may have
a cross-section having a generally gable shape. The first facing
surface and the first side surface form a first angle therebetween,
wherein the second facing surface and the second side surface form
a second angle therebetween, and wherein the first and second angle
may be about the same. Each first slot may comprise a portion
extending in a second direction that is substantially perpendicular
to the first direction, wherein each second slot may comprise a
portion extending in the second direction. Each first slot may
comprise a portion extending in a third direction that is
substantially perpendicular to the first direction and
substantially slanted relative to the second direction, wherein
each second slot may comprise a portion extending in a fourth
second direction that is substantially perpendicular to the first
direction and substantially slanted relative to the second
direction, wherein the third direction is not parallel to the
fourth direction.
[0014] Still in the foregoing assembly, the probe assembly may
comprise one of the plurality of first slots which does not overlap
any one of the plurality of second slots when viewed in a direction
perpendicular to the first side surface. The probe assembly may
comprise one of the plurality of first slots, which has a width
that partially overlaps with a width of one of the plurality of
second slots when viewed in a direction perpendicular to the first
side surface. The probe assembly may comprise one of the plurality
of first slots that substantially eclipses one of the plurality of
second slots when viewed in a direction perpendicular to the first
side surface. The first and second side surfaces may be
substantially parallel to each other. The first facing surface may
be substantially slanted with respect to the first side
surface.
[0015] Further in the foregoing assembly, the probe assembly may
further comprise a first probe engaged with one of the plurality of
first slots, and a second probe engaged with one of the plurality
of second slots. The first probe may comprise a first arm generally
extending in a second direction perpendicular to the first
direction, wherein a portion of the first arm is inserted in the
one of the plurality of first slots, a second arm electrically and
physically connected to the first arm and generally extending in a
third direction substantially perpendicular to the first direction
and substantially slanted with respect to the second direction,
wherein a portion of the second arm is inserted in the one of the
plurality of first slots, a first terminal portion formed at a
distal end of the first arm and comprising a first tip configured
to contact a first electrode, and a second terminal portion formed
at a distal end of the second arm and comprising a second tip
configured to contact a second electrode.
[0016] Still further in the foregoing assembly, the probe assembly
may further comprise a probe engaged with one of the plurality of
first slots, and may further comprise a channel generally extending
in the first direction and disposed between the first facing
surface and the second facing surface, wherein the probe may
comprise a projection projecting into the channel and further
configured to limit the probe's movement in a direction
perpendicular to the first side surface. The probe assembly may
further comprise an additional facing surface which is
substantially parallel to the first facing surface, wherein the
channel is located between the first facing surface and the
additional facing surface, and an additional slot formed on the
additional facing surface configured to receive a portion of the
probe.
[0017] Another aspect of the invention provides a probe for use in
a probe assembly for electrical testing, which comprises: a first
arm extending generally in a fifth direction; a second arm
electrically and physically connected to the first arm and
extending generally in a sixth direction substantially slanted with
respect to the fifth direction; a first terminal portion formed at
a distal end of the first arm and comprising a first tip configured
to form an electrical and physical contact with a first device,
wherein the first terminal portion is configured to allow the first
tip to elastically move generally in the fifth direction; and a
second terminal portion formed at a distal end of the second arm
and comprising a second tip configured to form an electrical and
physical contact with a second device, wherein the second terminal
portion is configured to allow the second tip to elastically move
generally in the fifth direction.
[0018] In the foregoing probe, the second arm may have an upper
surface and the probe may further comprise a projection extending
from the upper surface. The second terminal portion may comprise a
resilient extension between the second arm and the second tip,
wherein the resilient extension may generally extend in the fifth
direction.
[0019] Still another aspect of the invention provides a method of
making a probe assembly for use in electrical testing of an object,
the method comprising: providing a probe supporter which comprises:
a probe supporter body elongated in a first direction and
comprising a first side surface, a second side surface, a first
facing surface and a second facing surface which generally extend
in the first direction, wherein the first and second facing
surfaces are substantially nonparallel to each other, a plurality
of first slots formed on the first side surface and the first
facing surface, and a plurality of second slots formed into the
second side surface and the second facing surface; providing a
first probe and a second probe; and engaging the first probe with
one of the plurality of first slots and the second probe with one
of the plurality of second slots.
[0020] In the foregoing method, providing the probe supporter may
comprise forming the plurality of first slots using a rotating
wheel cutter. In forming the plurality of first slots, the rotating
wheel cutter does not contact the second facing surface.
[0021] An aspect of the present invention provides a probe and a
probe assembly which are easy to fabricate and can be manufactured
with reduced production cost and greatly increased productivity,
and a probe card having the same.
[0022] Another aspect of the present invention is to provide a
probe and a probe assembly that can save maintenance and repair
cost by making it possible to readily remove probes and a supporter
from a printed circuit board, and a probe card having the same.
[0023] A further aspect of the present invention is to provide a
probe and a probe assembly that can easily inspect an inspection
object having a fine pattern by reducing an arrangement interval of
probes mounted on a supporter, and a probe card having the
same.
[0024] A still further aspect of the present invention is to
provide a probe and a probe assembly which are less deformable and
enjoy a prolonged lifespan, and a probe card having the same.
[0025] In one aspect of the present invention, there is provided a
probe card for use in testing electric characteristics of an
inspection object having a plurality of electrode pads, comprising:
a printed circuit board through which electric signals are
transmitted to the electrode pads of the inspection object; a
supporter attached to the printed circuit board, the supporter
including a first side surface, a first slanting surface extending
obliquely toward a center plane of the supporter from the first
side surface and a plurality of first insertion slots formed across
the first side surface and the first slanting surface; and a
plurality of probes inserted into the first insertion slots, each
of the probes including a first arm portion fitted to the first
side surface, a second arm portion extending obliquely from the
first arm portion so that the second arm portion can be fitted to
the first slanting surface, a connection terminal portion joined to
a tip end of the first arm portion so that the connection terminal
portion can be connected to the printed circuit board and a contact
terminal portion joined to a tip end of the second arm portion so
that the contact terminal portion can be connected to each of the
electrode pads of the inspection object.
[0026] In another aspect of the present invention, there is
provided a probe assembly for transmitting electric signals between
an inspection object and a printed circuit board, comprising: a
supporter including a first side surface, a first slanting surface
extending obliquely toward a center plane of the supporter from the
first side surface and a plurality of first insertion slots formed
across the first side surface and the first slanting surface; and a
plurality of probes inserted into the first insertion slots, each
of the probes including a first arm portion fitted to the first
side surface, a second arm portion extending obliquely from the
first arm portion so that the second arm portion can be fitted to
the first slanting surface, a connection terminal portion joined to
a tip end of the first arm portion so that the connection terminal
portion can be connected to the printed circuit board and a contact
terminal portion joined to a tip end of the second arm portion so
that the contact terminal portion can be connected to the
inspection object.
[0027] In a further aspect of the present invention, there is
provided a probe for transmitting electric signals between an
inspection object and a printed circuit board, comprising: a first
arm portion; a second arm portion extending obliquely from the
first arm portion; a connection terminal portion joined to a tip
end of the first arm portion so that the connection terminal
portion can be connected to the printed circuit board; and a
contact terminal portion joined to a tip end of the second arm
portion so that the contact terminal portion can be connected to
the inspection object.
BRIEF DESCRIPTION OF THE DRAWINGS
[0028] The above and other aspects and features of the present
invention will become apparent from the following description of
embodiments, given in conjunction with the accompanying drawings,
in which:
[0029] FIG. 1 is an exploded perspective view schematically showing
a probe card in accordance with one embodiment of the present
invention;
[0030] FIG. 2 is a perspective view illustrating a plurality of
probe assemblies employed in the probe card in accordance with one
embodiment of the present invention;
[0031] FIG. 3 is an exploded perspective view showing one of the
probe assemblies shown in FIG. 2;
[0032] FIG. 4 is a section view illustrating the combined state of
a printed circuit board, an interposer, a space transformer and a
probe assembly employed in the probe card in accordance with one
embodiment of the present invention;
[0033] FIG. 5 is a front view schematically illustrating a probe of
a probe assembly in accordance with one embodiment of the present
invention;
[0034] FIGS. 6A and 6B are front views showing variants of a
connection terminal portion employed in the probe of the probe
assembly in accordance with one embodiment of the present
invention;
[0035] FIG. 7 is a section view depicting a process by which
insertion slots are formed in a supporter of the probe assembly in
accordance with one embodiment of the present invention;
[0036] FIG. 8 is a section view schematically showing a part of a
probe card in accordance with one embodiment of the present
invention; and
[0037] FIGS. 9a, 9b and 9c are sectional views showing positional
relationship between two slots.
DETAILED DESCRIPTION OF EMBODIMENTS
[0038] Hereinafter, embodiments of the present invention will be
described in detail with reference to the accompanying
drawings.
[0039] Referring to FIG. 1, a probe card 100 in accordance with one
embodiment of the present invention includes a printed circuit
board 110, a plurality of interposers 120, a plurality of space
transformers 130 and a plurality of probe assemblies 140.
[0040] The printed circuit board 110 is connected to a test head of
a tester (not shown) through a pogo block and a performance board
unit, both of which are well-known in the art. A stiffener 101 for
reinforcing the stiffness of the printed circuit board 110 is
attached to the upper surface of the printed circuit board 110. A
stiffener cover 102 for protecting the stiffener 101 is fixed to
the upper surface of the stiffener 101 and a plurality of handles
103 is attached to the upper surface of the stiffener cover
102.
[0041] The interposers 120 are attached to the lower surface of the
printed circuit board 110 so that they can be connected to the
printed circuit board 110. The interposers 120 serve to transmit
electric signals between the printed circuit board 110 and the
probe assemblies 140 and also to maintain the planarity of the
probe card 100.
[0042] The space transformers 130 are attached to the lower
surfaces of the interposers 120 so that they can be connected to
the interposers 120. Each of the space transformers 130 is formed
of a multi-layer printed circuit board 131 having a plurality of
electrode pads 132 on the lower surface thereof. The electrode pads
132 are electrically connected to the printed circuit board 110
through the interposers 120. Although the interposers 120 and the
space transformers 130 are two in number in one embodiment shown in
FIG. 1, the number of the interposers 120 and the space
transformers 130 may be changed arbitrarily.
[0043] Referring to FIGS. 1 to 3, each of the probe assemblies 140
includes a supporter 141 attached to the lower surface of the
multi-layer printed circuit board 131 and a plurality of probes 161
fixed to the opposite side surfaces of the supporter 141. The
supporter 141 is made of an insulating material, e.g., a ceramic
material such as zirconia (ZrO.sub.2) or the like.
[0044] As illustrated in FIGS. 3 and 4, the supporter 141 has first
and second vertical side surfaces 142 and 143 formed on the
opposite sides of the supporter 141, a horizontal lower surface 146
formed on the underside of the supporter 141 and first and second
slanting surfaces 144 and 145 for joining the first and second side
surfaces 142 and 143 to the lower surface 146. The first and second
side surfaces 142 and 143 extend in a parallel relationship with
each other. The first slanting surface 144 is formed between the
first side surface 142 and the lower surface 146 and extends
obliquely toward a center plane of the supporter 141 from the first
side surface 142. Similarly, the second slanting surface 145 is
formed between the second side surface 143 and the lower surface
146 and extends obliquely toward a center plane of the supporter
141 from the second side surface 143. A first channel 151 is formed
in the middle region of the first slanting surface 144 to extend in
a longitudinal direction. Likewise, a second channel 152 is formed
in the middle region of the second slanting surface 145 to extend
in the longitudinal direction. The first slanting surface 144 is
divided by the first channel 151 into a first surface portion 144a
(a first facing surface) joined to the first side surface 142 and a
second surface portion 144b (an additional facing surface) joined
to the lower surface 146. Similarly, the second slanting surface
145 is divided by the second channel 152 into a first surface
portion 145a joined to the second side surface 143 and a second
surface portion 145b joined to the lower surface 146.
[0045] The supporter 141 has a plurality of first and second
insertion slots 147 and 148 into which the probes 161 of a thin
plate type are inserted. The first insertion slots 147 are formed
on the first side surface 142 and the first slanting surface 144.
The second insertion slots 148 are formed on the second side
surface 143 and the second slanting surface 145. Each of the first
insertion slots 147 consists of a first slot portion 147a formed on
the first side surface 142, a second slot portion 147b formed on
the first surface portion 144a of the first slanting surface 144
and a third slot portion 147c formed on the second surface portion
144b of the first slanting surface 144. The first, second and third
slot portions 147a, 147b and 147c lie on one and the same
cross-sectional plane. Each of the second insertion slots 148
consists of a first slot portion 148a formed on the second side
surface 143, a second slot portion 148b formed on the first surface
portion 145a of the second slanting surface 145 and a third slot
portion 148c formed on the second surface portion 145b of the
second slanting surface 145. The first, second and third slot
portions 148a, 148b and 148c lie on the same cross-sectional plane.
The first insertion slots 147 and the second insertion slots 148
lie on the same cross-sectional plane in a symmetrical
relationship. Alternatively, the first insertion slots 147 and the
second insertion slots 148 may lie on different cross-sectional
planes.
[0046] The first insertion slots 147 and the second insertion slots
148 are formed to extend across the lower surface 146 of the
supporter 141. This means that the first insertion slots 147 and
the second insertion slots 148 are met with each other on the lower
surface 146. Needless to say, the first insertion slots 147 and the
second insertion slots 148 are not met with each other on the first
slanting surface 144 or the second slanting surface 145.
[0047] The supporter 141 is screw-fixed to the lower surface of the
multi-layer printed circuit board 131. For this purpose, a pair of
thread holes 149 is formed in the opposite end portions of the
supporter 141. As can be seen in FIG. 4, the supporter 141 is fixed
to the lower surface of the multi-layer printed circuit board 131
by driving a screw 153 into the corresponding one of the thread
hole 149 through the multi-layer printed circuit board 131.
Although the supporter 141 is of an elongated bar shape in the
illustrated embodiment, the width and length of the supporter 141
may be arbitrarily changed if such a need arises. For example, the
supporter 141 may have a block shape or other shapes rather than
the elongated bar shape.
[0048] The thin plate type probes 161 are fitted to the first and
second insertion slots 147 and 148 of the supporter 141. As shown
in FIG. 4, each of the probes 161 is designed to make contact with
an electrode pad 132 of the multi-layer printed circuit board 131
at one end and with an electrode pad 11 of an inspection object 10
such as a wafer, a flat display or the like at the other end.
Electric signals are transmitted between the multi-layer printed
circuit board 131 and the inspection object 10 through the probes
161. Each of the probes 161 includes a first arm portion 162, a
second arm portion 163, a connection terminal portion 164 and a
contact terminal portion 167. The second arm portion 163 extends
obliquely from the first arm portion 162 in a downward
direction.
[0049] As illustrated in FIG. 5, the connection terminal portion
164 is joined to the upper end of the first arm portion 162 so that
it can be connected to the electrode pad 132 of the multi-layer
printed circuit board 131. The connection terminal portion 164 is
formed of an elastically deformable spring portion 165 and a first
terminal 166. The spring portion 165 is connected to the upper end
of the first arm portion 162 and is formed into a meandering shape
so that it can be elastically deformed when compressed or pulled.
The first terminal 166 is joined to the upper end of the spring
portion 165 and is connected to the electrode pad 132 of the
multi-layer printed circuit board 131. In one embodiment of the
present invention, the connection terminal portion 164 of each of
the probes 161 may have many different shapes.
[0050] FIGS. 6A and 6B show variants of the connection terminal
portion. A connection terminal portion 182 shown in FIG. 6A is
joined to the upper end of a first arm portion 181. The connection
terminal portion 182 includes a pre-stressed and elongated spring
portion 183 having a gently curved shape, and a first terminal 184
joined to the upper end of the spring portion 183. The spring
portion 183 is of a pre-stressed bending beam structure and has
relatively high flexural stiffness, i.e., increased elastic strain
and durability. Therefore, the spring portion 183 is prevented from
being plastically deformed even when the first terminal 184 makes
contact with the electrode pad 132 of the multi-layer printed
circuit board 131 (see FIG. 4) and receives a vertical load. When
the first terminal 184 is connected to the electrode 132, the
spring portion 183 undergoes elastic deformation to thereby
increase the contact area between the first terminal 184 and the
electrode pad 132. This makes it possible to assure stable
connection between the first terminal 184 and the electrode pad
132.
[0051] A connection terminal portion 192 shown in FIG. 6B is formed
of a spring band 193 and a first terminal 196. The spring band 193
has a band portion 194 joined to the upper end of a first arm
portion 191 and a plurality of holes 195 formed along the length of
the band portion 194 at an equal interval. The opposite side
surfaces of the band portion 194 are formed into an undulating
shape to permit elastic deformation of the band portion 194. If the
first terminal 196 makes contact with the electrode pad 132 of the
multi-layer printed circuit board 131 (see FIG. 4) and receives a
vertical load, the spring band 193 is compressed and elastically
deformed. The first terminal 196 is maintained in close contact
with the electrode pad 132 by the biasing force of the spring band
193.
[0052] Referring again to FIGS. 4 and 5, the contact terminal
portion 167 of each of the probes 161 includes an elastic bar 168
and a second terminal 169. The elastic bar 168 extends in an
elongated shape from the tip end of the second arm portion 163 so
that it can be elastically deformed. The second terminal 169 is
formed in the tip end of the elastic bar 168 and is designed to
make contact with the electrode pad 11 of the inspection object
10.
[0053] Each of the probes 161 includes a reinforcing portion 171
that reinforces the stiffness of the elastic bar 168. The
reinforcing portion 171 is formed of an extension portion 172 and a
connection portion 173. The extension portion 172 extends upwardly
from the upper edge of the second arm portion 163. The connection
portion 173 serves to interconnect the intermediate portion of the
elastic bar 168 and the upper surface of the extension portion 172.
The elastic bar 168, the extension portion 172 and the connection
portion 173 make a triangle when they are viewed from the front. As
can be seen in FIG. 4, the reinforcing portion 171 of each of the
probes 161 is positioned in the first channel 151 or the second
channel 152 of the supporter 141.
[0054] In addition, each of the probes 161 has a first recess 174
and a second recess 175. The first recess 174 is formed in an inner
corner where the first arm portion 162 and the second arm portion
163 are met with each other. The second recess 175 is formed in an
inner corner where the second arm portion 163 and the extension
portion 172 are met with each other. Provision of the first and
second recesses 174 and 175 in each of the probes 161 helps
restrain stresses from being concentrated on the corner where the
first arm portion 162 and the second arm portion 163 are met with
each other and the corner where the second arm portion 163 and the
extension portion 172 are met with each other. Otherwise, the
stress concentration may occur in the manufacturing process of the
probes 161. Furthermore, the first and second recesses 174 and 175
serve to ensure that the probes 161 are accurately fitted to the
supporter 141 even if a machining error exists in the supporter 141
or even when an assembly error is present between the supporter 141
and the probes 161.
[0055] As can be seen in FIG. 4, during the process of inserting
the probes 161 into the first insertion slots 147 of the supporter
141, the outer corner where the first side surface 142 and the
first slanting surface 144 are met with each other is received in
the first recess 174, and the outer corner where the first surface
portion 144a of the first slanting surface 144 and the first
channel 151 are met with each other is received in the second
recess 175. This makes it possible to accurately insert the probes
161 into the first insertion slots 147. Similarly, during the
course of inserting the probes 161 into the second insertion slots
148 of the supporter 141, the outer corner where the second side
surface 143 and the second slanting surface 145 are met with each
other is received in the first recess 174, and the outer corner
where the first surface portion 145a of the second slanting surface
145 and the first channel 151 are met with each other is received
in the second recess 175. This makes it possible to accurately
insert the probes 161 into the second insertion slots 148.
[0056] The probes 161 configured as above are firmly fixed to the
supporter 141 by means of an insulating resin material 154 such as
epoxy resin or the like, after they have been inserted into the
first and second insertion slots 147 and 148 of the supporter 141.
The probe assemblies 140, each of which includes the supporter 141
and the probes 161, are attached to the lower surface of the
multi-layer printed circuit board 131. For the purpose of
protecting the probe assemblies 140 attached to the lower surface
of the multi-layer printed circuit board 131, a cover 104 is fixed
to the lower surface of the printed circuit board 110 by a
plurality of screws 105 as shown in FIG. 1. An opening 105 for
receiving the probe assemblies 140 is formed in the central region
of the cover 104.
[0057] Description will now be made on a process of manufacturing
the probe card in accordance with one embodiment of the present
invention.
[0058] First, each of the probe assemblies 140 is produced by
forming the first and second insertion slots 147 and 148 in the
supporter 141 and fitting the probes 161 into the first and second
insertion slots 147 and 148. Referring to FIG. 7, the first and
second insertion slots 147 and 148 are cut on the left and right
sides of the supporter 141 by means of a wheel cutter 20 having a
specified diameter (e.g., a diameter of 55.4 mm) at an equal or
unequal interval. In this cutting process, the first insertion
slots 147 are first cut on the first side surface 142 and the first
slanting surface 144, after which the second insertion slots 148
are cut on the second side surface 143 and the second slanting
surface 145.
[0059] During the process of cutting the first and second insertion
slots 147 and 148 on the first and second slanting surfaces 144 and
145, the first and second insertion slots 147 and 148 may be formed
to extend to the lower surface 146 of the supporter 141. In this
case, the first and second insertion slots 147 and 148 may be
overlapped with each other on the lower surface 146. The
overlapping occurs only in the lower surface 146. During the course
of cutting the second insertion slots 148, the wheel cutter 20 does
not meet with the first insertion slots 147 previously formed on
the first side surface 142 and the first slanting surface 144.
Therefore, it is possible to form the first and second insertion
slots 147 and 148 on the left and right sides of the supporter 141
at a narrow interval with no likelihood of mutual interference.
[0060] An insulating resin 154 is applied to the first and second
insertion slots 147 and 148 formed in the supporter 141. Then, the
probes 161 are fitted into the first and second insertion slots 147
and 148 as illustrated in FIGS. 3 and 4, thereby completing a
fabrication process of one of the probe assemblies 140. At this
time, the first arm portion 162 of each of the probes 161 is
inserted into the first slot portion 147a of each of the first
insertion slots 147. The second arm portion 163 is inserted into
the second slot portion 147b and the contact terminal portion 167
is inserted into the third slot portion 147c. The reinforcing
portion 171 is positioned in the first channel 151. Similarly, the
first arm portion 162 of each of the probes 161 is inserted into
the first slot portion 148a of each of the second insertion slots
148. The second arm portion 163 is inserted into the second slot
portion 148b and the contact terminal portion 167 is inserted into
the third slot portion 148c. The reinforcing portion 171 is
positioned in the second channel 152.
[0061] If the insulating resin 154 is completely cured after the
probes 161 have been inserted into the first and second insertion
slots 147 and 148, the probes 161 are firmly fixed to the supporter
141 by the insulating resin 154. In this manner, the probes 161 are
inserted into the first and second insertion slots 147 and 148
formed at a narrow interval, whereby the arrangement interval of
the probes 161 becomes narrow. This enables the probe assemblies
140 according to one embodiment of the present invention to test
the inspection object 10 having a fine pattern.
[0062] The insulating resin 154 for fixing the probes 161 to the
supporter 141 in the fabricating process of the probe assemblies
140 may be applied to the probes 161 and not to the first and
second insertion slots 147 and 148. In other words, the insulating
resin 154 may be applied to the first and second arm portions 162
and 163 of the probes 161 prior to inserting the probes 161 into
the insertion slots 147 and 148. This also makes it possible to
firmly fix the probes 161 to the supporter 141.
[0063] The probe assembly 140 thus fabricated is fixed to the lower
surface of the multi-layer printed circuit board 131 by tightening
the screws 153 into the thread holes 149 of the supporter 141
through the multi-layer printed circuit board 131. At this time,
the connection terminal portions 164 of the probes 161 are brought
into contact with the electrode pads 132 of the multi-layer printed
circuit board 131. If the first terminal 166 of each of the
connection terminal portions 164 receives a vertical load by making
contact with each of the electrode pads 132, the spring portion 165
is elastically deformed so that the first terminal 166 can remain
in close contact with each of the electrode pads 132 by means of
the biasing force of the spring portion 165.
[0064] After the probe assemblies 140 have been fixed to the lower
surface of the multi-layer printed circuit board 131, the
multi-layer printed circuit boards 131 are mounted to the
interposers 120 attached to the lower surface of the printed
circuit board 110. Then, the cover for protecting the probe
assemblies 140 is attached to the printed circuit board 110. The
stiffener 101 and the stiffener cover 102 are fixed to the upper
surface of the printed circuit board 110 one above the other,
thereby terminating the fabrication of the probe card 100.
[0065] Next, description will be made on how to test the inspection
object with the probe card in accordance with one embodiment of the
present invention.
[0066] The probe card 100 in accordance with one embodiment of the
present invention is installed on and connected to a test head. As
the test head comes into operation, the second terminal 169 of each
of the probes 161 makes contact with each of the electrode pads 11
of the inspection object 10 as illustrated in FIG. 4. If the second
terminal 169 of each of the probes 161 receives a vertical load by
coming into contact with each of the electrode pads 11, the elastic
bar 168 is elastically deformed to ensure that the second terminal
169 remains in close contact with each of the electrode pads 11 of
the inspection object 10. At this time, the connection portion 173
of the reinforcing portion 171 supports the intermediate portion of
the elastic bar 168 to prevent the elastic bar 168 from undergoing
plastic deformation. This helps increase the lifespan and
reliability of the probes 161.
[0067] The elastic bar 168 of each of the probes 161 is inserted
into and held in place by the third slot portion 147c of each of
the first insertion slots 147 and the third slot portion 148c of
each of the second insertion slots 148. For this reason, the
elastic bar 168 is less likely to undergo flexural deformation in a
transverse direction of the third slot portion 147c or 148c. This
ensures that the second terminal 169 makes accurate contact with
each of the electrode pads 11 of the inspection object 10, thereby
greatly improving the reliability and repeatability of the test for
the inspection object 10.
[0068] Once the second terminals 169 of the probes 161 come into
contact with the electrode pads 11 of the inspection object 10,
electric signals are transmitted between the printed circuit board
110 and the inspection object 10 via the interposers 120, the
multi-layer printed circuit boards 131 and the probe assemblies
140. In case the probes 161 are arranged with an increased density,
the multi-layer printed circuit board 131 makes it easy for the
inter-layer conductor circuit to interconnect the probes 161 and
the printed circuit board 110. Furthermore, the probe assemblies
140 can be arranged at a high density using a plurality of the
interposers 120 and a plurality of the space transformers 130.
Therefore, the probe card 100 in accordance with one embodiment of
the present invention is capable of inspecting a single sheet of
wafer having a diameter of 200 mm or 300 mm by performing only one
or two touchdown operation. This makes it possible to greatly
increase the inspection speed of the inspection object 10.
[0069] With the probe card 100 in accordance with one embodiment of
the present invention, the spring portions 165 of the probes 161
are elastically deformed to ensure that tight physical contact is
maintained between the electrode pads 132 of the multi-layer
printed circuit board 131 and the first terminals 166 of the probes
161. This eliminates the need to solder the electrode pads 132 and
the first terminals 166, thus greatly improving the productivity
and reliability of the probe card 100 as compared to the prior
art.
[0070] With the probe card 100 in accordance with one embodiment of
the present invention, the probes 161 are fixed in place in a state
that they are inserted into the first and second insertion slots
147 and 148 of the supporter 141. This eliminates the need to use a
jig which would otherwise be used in the prior art for fitting the
probes 161 to the supporter 141. Therefore, it is possible to
fabricate the probe assemblies 140 with ease, which in turn greatly
improves the productivity of the probe card 100.
[0071] The probe card 100 in accordance with one embodiment of the
present invention is of a structure in which the probes 161 are
inserted into the first and second insertion slots 147 and 148 of
the insulating supporter 141. This eliminates the need to coat the
probes 161 with an insulating material, which assists in saving
production costs and improving productivity.
[0072] With the probe card 100 in accordance with one embodiment of
the present invention, if an abnormality occurs in one of the probe
assemblies 140, it is possible to remove only the abnormal one and
replace it with a new one in a simple manner. This makes it
possible to sharply reduce the costs involved in maintenance and
repair.
[0073] FIG. 8 is a section view schematically showing a part of a
probe card in accordance with one embodiment of the present
invention. The probe card 200 shown in FIG. 8 is the same in most
configurations as the probe card 100 of the preceding embodiment,
except that probe assemblies 220 are directly coupled to a printed
circuit board 210 with no intervention of the interposers 120 (see
FIG. 1) and the space transformers 130 (see FIG. 1). The printed
circuit board 210 is provided with a plurality of electrode pads
211. The probes 231 of the probe assemblies 220 have connection
terminal portions 232 connected to electrode pads 211 of the
printed circuit board 210. Each of the probe assemblies 140 is
fixed to the printed circuit board 210 by driving screws 223 into
thread holes 222 of a supporter 221 through the printed circuit
board 210. The remaining configurations including the probe
assemblies 140 are the same as those of the preceding embodiment
and, therefore, no description will be made in that regard.
[0074] Referring to FIG. 9a, in one embodiment, the probe assembly
comprises one of the plurality of first slots 147 which does not
overlap any one of the plurality of second slots 148 when viewed in
a direction perpendicular to the first side surface 142. Referring
to FIG. 9b, in one embodiment, the probe assembly comprises one of
the plurality of first slots 147, which has a width that partially
overlaps with a width of one of the plurality of second slots 148
when viewed in a direction perpendicular to the first side surface
142. Referring to FIG. 9c, in one embodiment, the probe assembly
comprises one of the plurality of first slots 147 that
substantially eclipses one of the plurality of second slots 148
when viewed in a direction perpendicular to the first side surface
142.
[0075] As described above, the probe card in accordance with one
embodiment the present invention includes a plurality of probes
arranged at a high density. This helps reduce the frequency of
touchdown operations performed during the course of inspecting an
inspection object, thereby greatly increasing the inspecting speed
of the inspection object.
[0076] Furthermore, the probe card in accordance with one
embodiment the present invention is of a structure in which probes
are inserted into insertion slots of an insulating supporter.
Therefore, the probe card can be fabricated with ease and increased
accuracy. It is also possible to manufacture the probe card with
reduced production cost and greatly increased productivity.
[0077] Moreover, the probe card in accordance with one embodiment
the present invention is formed of individual probe assemblies that
can be separated from a printed circuit board on a one-by-one
basis. This makes it easy to replace a defective probe or a
defective probe assembly, consequently reducing the costs involved
in maintenance and repair.
[0078] In addition, the probe card in accordance with one
embodiment the present invention allows probes to be accurately
connected to an inspection object and a printed circuit board with
no likelihood of plastic deformation. Thus, the probe card can
enjoy increased reliability and prolonged lifespan.
[0079] The present invention is not limited to the embodiments
shown and described hereinabove. It will be understood by those
skilled in the art that various changes and modifications may be
made without departing from the scope of the invention defined in
the claims.
* * * * *