Heat Dissipating Module Capable Of Removing Dust

Lee; Hsiang-Chih

Patent Application Summary

U.S. patent application number 12/260097 was filed with the patent office on 2009-09-10 for heat dissipating module capable of removing dust. Invention is credited to Hsiang-Chih Lee.

Application Number20090223649 12/260097
Document ID /
Family ID41052398
Filed Date2009-09-10

United States Patent Application 20090223649
Kind Code A1
Lee; Hsiang-Chih September 10, 2009

HEAT DISSIPATING MODULE CAPABLE OF REMOVING DUST

Abstract

A heat dissipating module includes a case, a fan, a heat dissipating part, and a dust removal device. The case has a first air opening and a second air opening. The fan is installed in the case, and it is used to guide air to flow through the first air opening and the second air opening. The heat dissipating part is located at the second air opening, and the heat dissipating part includes a plurality of heat conducting fins. The dust removal device is disposed between the second air opening and the heat dissipating part, and the dust removal device includes a window structure and a plurality of dust scraping parts. The window structure is used to allow the air guided by the fan to pass through. The dust scraping parts and the heat conducting fins are placed interlacedly.


Inventors: Lee; Hsiang-Chih; (Taipei City, TW)
Correspondence Address:
    NORTH AMERICA INTELLECTUAL PROPERTY CORPORATION
    P.O. BOX 506
    MERRIFIELD
    VA
    22116
    US
Family ID: 41052398
Appl. No.: 12/260097
Filed: October 29, 2008

Current U.S. Class: 165/95
Current CPC Class: F28F 3/02 20130101; F28G 1/08 20130101
Class at Publication: 165/95
International Class: F28G 1/12 20060101 F28G001/12

Foreign Application Data

Date Code Application Number
Mar 6, 2008 TW 097107863

Claims



1. A heat dissipating module capable of removing dust, comprising: a case having a first air opening and a second air opening; a fan installed in the case, for guiding air to flow through the first air opening and the second air opening; a heat dissipating part located at the second air opening, the heat dissipating part including a plurality of heat conducting fins; and a dust removal device disposed between the second air opening and the heat dissipating part, the dust removal device including: a window structure for allowing the air guided by the fan to pass through; and a plurality of dust scraping parts, wherein the dust scraping parts and the heat conducting fins are placed interlacedly.

2. The heat dissipating module according to claim 1, wherein the dust removal device comprises a filter, and the filter is installed in the window structure.

3. The heat dissipating module according to claim 1, wherein the heat conducting fins are parallel to each other.

4. The heat dissipating module according to claim 1, wherein a pull handle is disposed on the dust removal device.

5. The heat dissipating module according to claim 1, wherein the dust scraping parts are a plurality of toothed hooks.

6. The heat dissipating module according to claim 5, wherein the toothed hooks bend and extend upward at an angle.

7. The heat dissipating module according to claim 1, wherein the dust scraping parts are a plurality of post structures.

8. The heat dissipating module according to claim 1, wherein each of the heat conducting fins has a gap at the top, and the gap is used to allow the dust removal device to be inserted to the heat dissipating part from the top.

9. The heat dissipating module according to claim 1, wherein the dust scraping parts extend from the bottom of the dust removal device.

10. The heat dissipating module according to claim 1, wherein the first air opening is substantially perpendicular to the second air opening.
Description



BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The invention relates to a heat dissipating module and, more particularly, to a heat dissipating module capable of removing dust.

[0003] 2. Description of the Related Art

[0004] With the progress of the electronic science and technology, functions of an electronic product become more and more complicated and powerful. The operating speed of an internal microprocessor of the electronic product should become quicker and quicker to deal with heavy system operating workloads. However, when the operating speed of the microprocessor continuously increases, heat generated in the operating process also continuously increases. Therefore, when manufacturers design the electronic product, heat dissipation should be considered.

[0005] As far as a notebook computer is considered, since it is light, slim, short, small, and portable, internal components are generally arranged closely. Thus, heat generated by every component (in particular, a central processing unit) accumulates quickly. If the heat dissipation problem is not well dealt with, the system may be down, and the internal components may even be burned. Therefore, the heat dissipation efficiency has a crucial effect on the performance of the notebook computer.

[0006] Generally speaking, in the notebook computer, a combination of a fan and a heat sink is used on an electronic component whose heat needs to be dissipated such as a central processing unit to achieve heat dissipation. FIG. 1 is a schematic diagram of a conventional heat dissipating module 10. As shown in FIG. 1, the heat dissipating module 10 includes a case 12, a fan 14, and a heat dissipating part 16. The case 12 has an air outlet 18. The fan 14 is installed in the case 12. The heat dissipating part 16 is near to the air outlet 18, and the heat dissipating part 16 has parallell heat conducting fins 20. When the electronic component operates to generate heat, the heat dissipating module 10 drives air to flow by the rotation of the fan 14 and expels the heat generated from the electronic components by heat conduction of the heat conducting fins 20 of the heat dissipating part 16. Thus, the heat is dissipated and the temperature is reduced. Since airflow generated in the heat dissipation process may drive internal dust, dust is accumulated on the heat dissipating part 16 after the notebook computer has operated for a long time. That is, much dust adheres to the heat conducting fins 20 of the heat dissipating part 16, which reduces heat dissipation of the heat dissipating module 10. The above situation may be improved by detaching the heat dissipating part 16 to clean dust or installing a filter. However, detaching the heat dissipating part 16 is not easy, and fan blades may be broke in the detaching process. If the filter is used to shield off the dust, airflow resistance increases, the heat dissipation ability is affected, and noise increases.

BRIEF SUMMARY OF THE INVENTION

[0007] One objective of the invention is to provide a heat dissipating module capable of removing dust accumulating on a heat dissipating part to solve the above problem.

[0008] The embodiment of the invention discloses a heat dissipating module capable of removing dust. The heat dissipating module includes a case, a fan, a heat dissipating part, and a dust removal device. The case has a first air opening and a second air opening. The fan is installed in the case, and it is used to guide air to flow through the first air opening and the second air opening. The heat dissipating part is located at the second air opening, and it has a plurality of heat conducting fins. The dust removal device is disposed between the second air opening and the heat dissipating part. The dust removal device includes a window structure and a plurality of dust scraping parts. The window structure allows the air guided by the fan to pass through. The dust scraping parts and the heat conducting fins are placed interlacedly.

[0009] These and other features, aspects, and advantages of the present invention will become better understood with regard to the following description, appended claims, and accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0010] FIG. 1 is a schematic diagram of a conventional heat dissipating module;

[0011] FIG. 2 is a schematic diagram of a heat dissipating module according to a first embodiment of the invention;

[0012] FIG. 3 is a schematic diagram showing a structure of a dust removal device of the heat dissipating module in FIG. 2;

[0013] FIG. 4 is a partial sectional diagram of a heat conducting fin and a dust scraping part in FIG. 2;

[0014] FIG. 5 is a schematic diagram showing relative positions of the dust removal device and a heat dissipating part of the heat dissipating module in FIG. 2 when they are assembled; and

[0015] FIG. 6 is a schematic diagram of a heat dissipating module according to a second embodiment of the invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] FIG. 2 is a schematic diagram of a heat dissipating module 50 according to a first embodiment of the invention. As shown in FIG. 2, the heat dissipating module 50 includes a case 52, a fan 54, a heat dissipating part 56, and a dust removal device 58. The case 52 has a first air opening 60 and a second air opening 62. As shown in FIG. 2, the first air opening 60 is substantially perpendicular to the second air opening 62. The fan 54 is installed in the case 52, and it is used to guide air to flow through the first air opening 60 and the second air opening 62. For example, when the fan 54 rotates, the fan 54 expels the air from the second air opening 62 via the rotation of the fan blades. Thereby, the air passes through the heat dissipating part 56 to dissipate heat. The heat dissipating part 56 is located at the second air opening 62, and the heat dissipating part 56 includes a plurality of parallell heat conducting fins 64. The dust removal device 58 is disposed between the second air opening 62 and the heat dissipating part 56. The dust removal device 58 includes a window structure 65 and a plurality of dust scraping parts 66. The window structure 65 is used to allow the air guided by the fan 54 to pass through, and the dust scraping parts 66 are used to scrape dust adhering to the heat conducting fins 64 of the heat dissipating part 56.

[0017] The structure of the dust removal device is described in detail hereinbelow. FIG. 3 is a schematic diagram showing a structure of the dust removal device 58 in FIG. 2. FIG. 4 is a partial sectional diagram of the heat conducting fin 64 and the dust scraping part 66 in FIG. 2. As shown in FIG. 3, the dust scraping parts 66 may be a plurality of toothed hooks. That is, the dust scraping parts 66 bend and extend upward at an angle from the bottom of the dust removal device 58. As shown in FIG. 4, the heat dissipating part 56 includes a plurality of parallell heat conducting fins 64, and every heat conducting fin 64 has a gap 68 at the top. The gap 68 of each heat conducting fin 64 allows the corresponding dust scraping part 66 to slide from the top of the heat conducting fin 64 to the space between the heat conducting fins 64. Thereby, the dust removal device 58 is assembled on the heat dissipating part 56. However, the assembling mode of the heat conducting fins 64 and the dust scraping parts 66 is not limited. That is, the dust scraping parts 66 of the dust removal device 58 may also be inserted to the space between the heat conducting fins 64 of the heat dissipating part 56 at other angles.

[0018] FIG. 5 is a schematic diagram showing relative positions of the dust removal device 58 and the heat dissipating part 56 in FIG. 2 when they are assembled. As shown in FIG. 5, the dust scraping parts 66 and the heat conducting fins 64 of the heat dissipating part 56 are placed interlacedly, and the dust scraping parts 66 are inserted to the space between the heat conducting fins 64. Thereby, the dust removal device 58 is assembled on the heat dissipating part 56. Thus, when the heat conducting fins 64 has much dust to affect heat dissipation of the heat dissipating module 50, users only need to raise the dust removal device 58 upward to make the dust removal device 58 separated from the heat dissipating part 56. In the process, since the dust scraping parts 66 have a structure of bending and extending upward at an angle, the dust scraping parts 66 scrape dust adhering to the heat conducting fins 64 as the users raise the dust removal device 58. After cleaning the taken dust removal device 58, the users may insert the dust scraping parts 66 of the dust removal device 58 to the space between the heat conducting fins 58 that the dust scraping parts 66 correspond to. Thus, the dust removal device 58 is assembled with the heat dissipating part 56 again.

[0019] FIG. 6 is a schematic diagram of a heat dissipating module 100 according to a second embodiment of the invention. The difference between the heat dissipating module 100 and the heat dissipating module 50 of the first embodiment is the design of a dust removal device. As shown in FIG. 6, the heat dissipating module 100 includes a case 52, a fan 54, a heat dissipating part 56, and a dust removal device 102. The case 52 has a first air opening 60 and a second air opening 62. The fan 54 is installed in the case 52, and it is used to guide air to flow through the first air opening 60 and the second air opening 62. The heat dissipating part 56 is located at the second air opening 62, and the heat dissipating part 56 includes a plurality of parallell heat conducting fins 64. The dust removal device 102 is disposed between the second air opening 62 and the heat dissipating part 56, and the dust removal device 102 includes a window structure 65, a plurality of dust scraping parts 104, and a pull handle 106. The dust scraping parts 104 are used to scrape dust adhering to the heat conducting fins 64 of the heat dissipating part 56. As shown in FIG. 6, the dust scraping parts 104 are a plurality of extended posts perpendicular to and protrudent from the bottom of the dust removal device 102. It is the same with what shown in FIG. 5, the dust scraping parts 104 and the heat conducting fins 64 of the heat dissipating part 56 are placed interlacedly, and the dust scraping parts 104 are inserted to the space between the corresponding heat conducting fins 64. The pull handle 106 is disposed on the dust removal device 102. Thus, when the heat conducting fins 64 have much dust to affect heat dissipation of the heat dissipating module 100, users only need to exert a pull force on the pull handle 106 to raise the dust removal device 102 upward, and then the dust removal device 102 is separated from the heat dissipating part 56. In the process, the dust scraping parts 104 scrape dust adhering to the heat conducting fins 64 as the users raise the dust removal device 102. After cleaning the taken dust removal device 102, the users insert the dust scraping parts 104 of the dust removal device 102 to the space between the heat conducting fins 64 that the dust scraping parts correspond to. Thus, the dust removal device 102 is assembled with the heat dissipating part 56 again. Furthermore, the dust removal device 102 further includes a filter 108. The filter 108 is installed in the window structure 65 to improve the situation that dust accumulates on heat conducting fins 64. The extended post structure of the dust scraping parts 104 is not limited, and this depends on a practical application. For example, the relative angle between the extended post structure of the dust scraping parts 104 and the bottom of the dust removal device 102 may be one of other angles besides an angle of 90 degrees.

[0020] The design of the gap structure in the first embodiment and the additional disposition of the filter and the pull handle in the second embodiment can be adapted for the first embodiment and the second embodiment mutually. In addition, the dust scraping parts may be located at other positions besides the bottom of the dust removal device, which depends on design requirements of a practical mechanism.

[0021] In the invention, the dust scraping parts of the dust removal device are used to remove dust in the heat dissipating part. When the heat dissipating module has much dust adhering to the heat conducting fins to affect heat dissipation of the heat dissipating module after being used a long time, the users only need to raise the dust removal device upward by the pull handle to take out the dust removal device from the heat dissipating module. In the process, since the dust scraping parts of the dust removal device have their own structure characteristics, they can scrape dust adhering to the heat conducting fins as the users raise the dust removal device. After cleaning the taken dust removal device, the users can insert the dust removal device to the corresponding space along relative positions (shown in FIG. 5) of the dust scraping parts and the heat conducting fins which are interlacedly disposed to assemble the heat dissipating part and the dust removal device. Thus, the users can remove the dust adhering to the heat conducting fins easily without using instruments and detaching a fan or a heat sink.

[0022] Although the present invention has been described in considerable detail with reference to certain preferred embodiments thereof, the disclosure is not for limiting the scope of the invention. Persons having ordinary skill in the art may make various modifications and changes without departing from the scope and spirit of the invention. Therefore, the scope of the appended claims should not be limited to the description of the preferred embodiments described above.

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