U.S. patent application number 12/260097 was filed with the patent office on 2009-09-10 for heat dissipating module capable of removing dust.
Invention is credited to Hsiang-Chih Lee.
Application Number | 20090223649 12/260097 |
Document ID | / |
Family ID | 41052398 |
Filed Date | 2009-09-10 |
United States Patent
Application |
20090223649 |
Kind Code |
A1 |
Lee; Hsiang-Chih |
September 10, 2009 |
HEAT DISSIPATING MODULE CAPABLE OF REMOVING DUST
Abstract
A heat dissipating module includes a case, a fan, a heat
dissipating part, and a dust removal device. The case has a first
air opening and a second air opening. The fan is installed in the
case, and it is used to guide air to flow through the first air
opening and the second air opening. The heat dissipating part is
located at the second air opening, and the heat dissipating part
includes a plurality of heat conducting fins. The dust removal
device is disposed between the second air opening and the heat
dissipating part, and the dust removal device includes a window
structure and a plurality of dust scraping parts. The window
structure is used to allow the air guided by the fan to pass
through. The dust scraping parts and the heat conducting fins are
placed interlacedly.
Inventors: |
Lee; Hsiang-Chih; (Taipei
City, TW) |
Correspondence
Address: |
NORTH AMERICA INTELLECTUAL PROPERTY CORPORATION
P.O. BOX 506
MERRIFIELD
VA
22116
US
|
Family ID: |
41052398 |
Appl. No.: |
12/260097 |
Filed: |
October 29, 2008 |
Current U.S.
Class: |
165/95 |
Current CPC
Class: |
F28F 3/02 20130101; F28G
1/08 20130101 |
Class at
Publication: |
165/95 |
International
Class: |
F28G 1/12 20060101
F28G001/12 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 6, 2008 |
TW |
097107863 |
Claims
1. A heat dissipating module capable of removing dust, comprising:
a case having a first air opening and a second air opening; a fan
installed in the case, for guiding air to flow through the first
air opening and the second air opening; a heat dissipating part
located at the second air opening, the heat dissipating part
including a plurality of heat conducting fins; and a dust removal
device disposed between the second air opening and the heat
dissipating part, the dust removal device including: a window
structure for allowing the air guided by the fan to pass through;
and a plurality of dust scraping parts, wherein the dust scraping
parts and the heat conducting fins are placed interlacedly.
2. The heat dissipating module according to claim 1, wherein the
dust removal device comprises a filter, and the filter is installed
in the window structure.
3. The heat dissipating module according to claim 1, wherein the
heat conducting fins are parallel to each other.
4. The heat dissipating module according to claim 1, wherein a pull
handle is disposed on the dust removal device.
5. The heat dissipating module according to claim 1, wherein the
dust scraping parts are a plurality of toothed hooks.
6. The heat dissipating module according to claim 5, wherein the
toothed hooks bend and extend upward at an angle.
7. The heat dissipating module according to claim 1, wherein the
dust scraping parts are a plurality of post structures.
8. The heat dissipating module according to claim 1, wherein each
of the heat conducting fins has a gap at the top, and the gap is
used to allow the dust removal device to be inserted to the heat
dissipating part from the top.
9. The heat dissipating module according to claim 1, wherein the
dust scraping parts extend from the bottom of the dust removal
device.
10. The heat dissipating module according to claim 1, wherein the
first air opening is substantially perpendicular to the second air
opening.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The invention relates to a heat dissipating module and, more
particularly, to a heat dissipating module capable of removing
dust.
[0003] 2. Description of the Related Art
[0004] With the progress of the electronic science and technology,
functions of an electronic product become more and more complicated
and powerful. The operating speed of an internal microprocessor of
the electronic product should become quicker and quicker to deal
with heavy system operating workloads. However, when the operating
speed of the microprocessor continuously increases, heat generated
in the operating process also continuously increases. Therefore,
when manufacturers design the electronic product, heat dissipation
should be considered.
[0005] As far as a notebook computer is considered, since it is
light, slim, short, small, and portable, internal components are
generally arranged closely. Thus, heat generated by every component
(in particular, a central processing unit) accumulates quickly. If
the heat dissipation problem is not well dealt with, the system may
be down, and the internal components may even be burned. Therefore,
the heat dissipation efficiency has a crucial effect on the
performance of the notebook computer.
[0006] Generally speaking, in the notebook computer, a combination
of a fan and a heat sink is used on an electronic component whose
heat needs to be dissipated such as a central processing unit to
achieve heat dissipation. FIG. 1 is a schematic diagram of a
conventional heat dissipating module 10. As shown in FIG. 1, the
heat dissipating module 10 includes a case 12, a fan 14, and a heat
dissipating part 16. The case 12 has an air outlet 18. The fan 14
is installed in the case 12. The heat dissipating part 16 is near
to the air outlet 18, and the heat dissipating part 16 has
parallell heat conducting fins 20. When the electronic component
operates to generate heat, the heat dissipating module 10 drives
air to flow by the rotation of the fan 14 and expels the heat
generated from the electronic components by heat conduction of the
heat conducting fins 20 of the heat dissipating part 16. Thus, the
heat is dissipated and the temperature is reduced. Since airflow
generated in the heat dissipation process may drive internal dust,
dust is accumulated on the heat dissipating part 16 after the
notebook computer has operated for a long time. That is, much dust
adheres to the heat conducting fins 20 of the heat dissipating part
16, which reduces heat dissipation of the heat dissipating module
10. The above situation may be improved by detaching the heat
dissipating part 16 to clean dust or installing a filter. However,
detaching the heat dissipating part 16 is not easy, and fan blades
may be broke in the detaching process. If the filter is used to
shield off the dust, airflow resistance increases, the heat
dissipation ability is affected, and noise increases.
BRIEF SUMMARY OF THE INVENTION
[0007] One objective of the invention is to provide a heat
dissipating module capable of removing dust accumulating on a heat
dissipating part to solve the above problem.
[0008] The embodiment of the invention discloses a heat dissipating
module capable of removing dust. The heat dissipating module
includes a case, a fan, a heat dissipating part, and a dust removal
device. The case has a first air opening and a second air opening.
The fan is installed in the case, and it is used to guide air to
flow through the first air opening and the second air opening. The
heat dissipating part is located at the second air opening, and it
has a plurality of heat conducting fins. The dust removal device is
disposed between the second air opening and the heat dissipating
part. The dust removal device includes a window structure and a
plurality of dust scraping parts. The window structure allows the
air guided by the fan to pass through. The dust scraping parts and
the heat conducting fins are placed interlacedly.
[0009] These and other features, aspects, and advantages of the
present invention will become better understood with regard to the
following description, appended claims, and accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIG. 1 is a schematic diagram of a conventional heat
dissipating module;
[0011] FIG. 2 is a schematic diagram of a heat dissipating module
according to a first embodiment of the invention;
[0012] FIG. 3 is a schematic diagram showing a structure of a dust
removal device of the heat dissipating module in FIG. 2;
[0013] FIG. 4 is a partial sectional diagram of a heat conducting
fin and a dust scraping part in FIG. 2;
[0014] FIG. 5 is a schematic diagram showing relative positions of
the dust removal device and a heat dissipating part of the heat
dissipating module in FIG. 2 when they are assembled; and
[0015] FIG. 6 is a schematic diagram of a heat dissipating module
according to a second embodiment of the invention.
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0016] FIG. 2 is a schematic diagram of a heat dissipating module
50 according to a first embodiment of the invention. As shown in
FIG. 2, the heat dissipating module 50 includes a case 52, a fan
54, a heat dissipating part 56, and a dust removal device 58. The
case 52 has a first air opening 60 and a second air opening 62. As
shown in FIG. 2, the first air opening 60 is substantially
perpendicular to the second air opening 62. The fan 54 is installed
in the case 52, and it is used to guide air to flow through the
first air opening 60 and the second air opening 62. For example,
when the fan 54 rotates, the fan 54 expels the air from the second
air opening 62 via the rotation of the fan blades. Thereby, the air
passes through the heat dissipating part 56 to dissipate heat. The
heat dissipating part 56 is located at the second air opening 62,
and the heat dissipating part 56 includes a plurality of parallell
heat conducting fins 64. The dust removal device 58 is disposed
between the second air opening 62 and the heat dissipating part 56.
The dust removal device 58 includes a window structure 65 and a
plurality of dust scraping parts 66. The window structure 65 is
used to allow the air guided by the fan 54 to pass through, and the
dust scraping parts 66 are used to scrape dust adhering to the heat
conducting fins 64 of the heat dissipating part 56.
[0017] The structure of the dust removal device is described in
detail hereinbelow. FIG. 3 is a schematic diagram showing a
structure of the dust removal device 58 in FIG. 2. FIG. 4 is a
partial sectional diagram of the heat conducting fin 64 and the
dust scraping part 66 in FIG. 2. As shown in FIG. 3, the dust
scraping parts 66 may be a plurality of toothed hooks. That is, the
dust scraping parts 66 bend and extend upward at an angle from the
bottom of the dust removal device 58. As shown in FIG. 4, the heat
dissipating part 56 includes a plurality of parallell heat
conducting fins 64, and every heat conducting fin 64 has a gap 68
at the top. The gap 68 of each heat conducting fin 64 allows the
corresponding dust scraping part 66 to slide from the top of the
heat conducting fin 64 to the space between the heat conducting
fins 64. Thereby, the dust removal device 58 is assembled on the
heat dissipating part 56. However, the assembling mode of the heat
conducting fins 64 and the dust scraping parts 66 is not limited.
That is, the dust scraping parts 66 of the dust removal device 58
may also be inserted to the space between the heat conducting fins
64 of the heat dissipating part 56 at other angles.
[0018] FIG. 5 is a schematic diagram showing relative positions of
the dust removal device 58 and the heat dissipating part 56 in FIG.
2 when they are assembled. As shown in FIG. 5, the dust scraping
parts 66 and the heat conducting fins 64 of the heat dissipating
part 56 are placed interlacedly, and the dust scraping parts 66 are
inserted to the space between the heat conducting fins 64. Thereby,
the dust removal device 58 is assembled on the heat dissipating
part 56. Thus, when the heat conducting fins 64 has much dust to
affect heat dissipation of the heat dissipating module 50, users
only need to raise the dust removal device 58 upward to make the
dust removal device 58 separated from the heat dissipating part 56.
In the process, since the dust scraping parts 66 have a structure
of bending and extending upward at an angle, the dust scraping
parts 66 scrape dust adhering to the heat conducting fins 64 as the
users raise the dust removal device 58. After cleaning the taken
dust removal device 58, the users may insert the dust scraping
parts 66 of the dust removal device 58 to the space between the
heat conducting fins 58 that the dust scraping parts 66 correspond
to. Thus, the dust removal device 58 is assembled with the heat
dissipating part 56 again.
[0019] FIG. 6 is a schematic diagram of a heat dissipating module
100 according to a second embodiment of the invention. The
difference between the heat dissipating module 100 and the heat
dissipating module 50 of the first embodiment is the design of a
dust removal device. As shown in FIG. 6, the heat dissipating
module 100 includes a case 52, a fan 54, a heat dissipating part
56, and a dust removal device 102. The case 52 has a first air
opening 60 and a second air opening 62. The fan 54 is installed in
the case 52, and it is used to guide air to flow through the first
air opening 60 and the second air opening 62. The heat dissipating
part 56 is located at the second air opening 62, and the heat
dissipating part 56 includes a plurality of parallell heat
conducting fins 64. The dust removal device 102 is disposed between
the second air opening 62 and the heat dissipating part 56, and the
dust removal device 102 includes a window structure 65, a plurality
of dust scraping parts 104, and a pull handle 106. The dust
scraping parts 104 are used to scrape dust adhering to the heat
conducting fins 64 of the heat dissipating part 56. As shown in
FIG. 6, the dust scraping parts 104 are a plurality of extended
posts perpendicular to and protrudent from the bottom of the dust
removal device 102. It is the same with what shown in FIG. 5, the
dust scraping parts 104 and the heat conducting fins 64 of the heat
dissipating part 56 are placed interlacedly, and the dust scraping
parts 104 are inserted to the space between the corresponding heat
conducting fins 64. The pull handle 106 is disposed on the dust
removal device 102. Thus, when the heat conducting fins 64 have
much dust to affect heat dissipation of the heat dissipating module
100, users only need to exert a pull force on the pull handle 106
to raise the dust removal device 102 upward, and then the dust
removal device 102 is separated from the heat dissipating part 56.
In the process, the dust scraping parts 104 scrape dust adhering to
the heat conducting fins 64 as the users raise the dust removal
device 102. After cleaning the taken dust removal device 102, the
users insert the dust scraping parts 104 of the dust removal device
102 to the space between the heat conducting fins 64 that the dust
scraping parts correspond to. Thus, the dust removal device 102 is
assembled with the heat dissipating part 56 again. Furthermore, the
dust removal device 102 further includes a filter 108. The filter
108 is installed in the window structure 65 to improve the
situation that dust accumulates on heat conducting fins 64. The
extended post structure of the dust scraping parts 104 is not
limited, and this depends on a practical application. For example,
the relative angle between the extended post structure of the dust
scraping parts 104 and the bottom of the dust removal device 102
may be one of other angles besides an angle of 90 degrees.
[0020] The design of the gap structure in the first embodiment and
the additional disposition of the filter and the pull handle in the
second embodiment can be adapted for the first embodiment and the
second embodiment mutually. In addition, the dust scraping parts
may be located at other positions besides the bottom of the dust
removal device, which depends on design requirements of a practical
mechanism.
[0021] In the invention, the dust scraping parts of the dust
removal device are used to remove dust in the heat dissipating
part. When the heat dissipating module has much dust adhering to
the heat conducting fins to affect heat dissipation of the heat
dissipating module after being used a long time, the users only
need to raise the dust removal device upward by the pull handle to
take out the dust removal device from the heat dissipating module.
In the process, since the dust scraping parts of the dust removal
device have their own structure characteristics, they can scrape
dust adhering to the heat conducting fins as the users raise the
dust removal device. After cleaning the taken dust removal device,
the users can insert the dust removal device to the corresponding
space along relative positions (shown in FIG. 5) of the dust
scraping parts and the heat conducting fins which are interlacedly
disposed to assemble the heat dissipating part and the dust removal
device. Thus, the users can remove the dust adhering to the heat
conducting fins easily without using instruments and detaching a
fan or a heat sink.
[0022] Although the present invention has been described in
considerable detail with reference to certain preferred embodiments
thereof, the disclosure is not for limiting the scope of the
invention. Persons having ordinary skill in the art may make
various modifications and changes without departing from the scope
and spirit of the invention. Therefore, the scope of the appended
claims should not be limited to the description of the preferred
embodiments described above.
* * * * *