U.S. patent application number 12/039313 was filed with the patent office on 2009-09-03 for heat dissipation module.
This patent application is currently assigned to ASIA VITAL COMPONENTS CO., LTD.. Invention is credited to CHING-HANG SHEN.
Application Number | 20090218082 12/039313 |
Document ID | / |
Family ID | 41012282 |
Filed Date | 2009-09-03 |
United States Patent
Application |
20090218082 |
Kind Code |
A1 |
SHEN; CHING-HANG |
September 3, 2009 |
HEAT DISSIPATION MODULE
Abstract
A heat dissipation module includes a plurality of cooling fins
and at least a guide heat pipe. The cooling fins stack to one
another with at least a through hole at the respective cooling fin
for being penetrated with the guide heat pipe. A projecting annular
part is disposed at a side of the respective cooling fin to
surround the circumference of the through hole with an indented
spot at the periphery of the projecting annular part. The outer
side of said guide heat pipe has an elongated recess extending
along the length thereof to correspond to the indented spot such
that the indented spot is capable of fitting with the recess after
the guide heat pipe passing through the through hole respectively
to facilitate the subsequent welding job.
Inventors: |
SHEN; CHING-HANG;
(KAOHSIUNG, TW) |
Correspondence
Address: |
G. LINK CO., LTD
3550 BELL ROAD
MINOOKA
IL
60447
US
|
Assignee: |
ASIA VITAL COMPONENTS CO.,
LTD.
KAOHSIUNG
TW
|
Family ID: |
41012282 |
Appl. No.: |
12/039313 |
Filed: |
February 28, 2008 |
Current U.S.
Class: |
165/181 |
Current CPC
Class: |
H01L 23/427 20130101;
F28F 1/32 20130101; H01L 23/467 20130101; H01L 2924/0002 20130101;
F28D 15/0266 20130101; H01L 23/3672 20130101; H01L 2924/0002
20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/166 |
International
Class: |
F28F 3/02 20060101
F28F003/02 |
Claims
1. A heat dissipation module comprising: a plurality of cooling
fins stacking to one another with at least a through hole at the
respective cooling fin to align to each other; and at least a guide
heat pipe penetrating said through hole; wherein, a projecting
annular part is disposed at a side of the respective cooling fin to
surround the circumference of said through hole with an indented
spot at the periphery of said projecting annular part; and the
outer side of said guide heat pipe has an elongated recess
extending along the length of said guide heat pipe to correspond to
said indented spot such that said indented spot is capable of
fitting with said recess after said guide heat pipe passing through
said through hole respectively.
2. The heat dissipation module as defined in claim 1, wherein said
recess has a shape to accommodate said indented spot.
3. The heat dissipation module as defined in claim 1, wherein said
recess extends continuously or discretely.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention is related to a structure of heat
dissipation, and particularly to an improvement on a heat
dissipation module for facilitating the assembly job and promoting
the production efficiency significantly.
[0003] 2. Brief Description of the Related Art
[0004] The processing speed of the electronic chip increases due to
incessantly progress of technology but it leads to increase of the
generated heat as well. Nevertheless, the high temperature is a
primary reason of the undesirable operation efficiency and burn-out
of the chip. Therefore, how to dissipate the heat from the chip for
protecting the chip is one of the subjects that are researched and
developed currently. In order to obtain the best effect, a
plurality of cooling fins being stacked as a cooling fin set in
association with the heat guide pipes are utilized in the most
researches and developments for promoting the cooling
efficiency.
[0005] Taiwan Patent Publication No. 449514 entitled "A METHOD FOR
JOINING A GUIDE HEAT PIPE TO COOLING FINS" discloses a method that
a soldering layer is coated on a joining surface between the guide
heat pipe and the cooling fins and the joined guide heat pipe and
the cooling fins heat up in a vacuum heating stove such that the
solder tin can melt in the process of heating and form the
phenomenon of capillary to permeate the joining surface for
engagement tightly. Further, Taiwan Patent publication No. 1236337
entitled "A METHOD FOR FORMING A HEAT PIPE AND COOLING FINS
discloses (a) a metal conductive medium layer is plated at a spot
of the heat pipe and the cooling fins for joining the cooling fins;
(b) the cooling fins are placed at the spot plated with the metal
conductive medium; and (c) The conductive medium is heated up to
melt between the heat pipe and the cooling fins and then cools
down.
[0006] Although either the solder tin or the metal conductive
medium of the preceding cited references is heated up for joining
the heat pipe to the cooling fins, the heat pipe is circular in
cross section and the cooling fins are easy to swing or rotate with
respect to the heat pipe before the heat pipe is fixed to the
cooling fins. That is, the heat pipe is unable to be located well
during being joined to the cooling fins and it is easy to result in
clearances between the heat pipe and the cooling fins to degrade
the effect of heat transfer.
SUMMARY OF THE INVENTION
[0007] In order to overcome the deficiencies of the prior art, an
object of the present invention is to provide a heat dissipation
module, which is assembled easily for promoting production
efficiency.
[0008] Accordingly, a heat dissipation module according to the
present invention includes a plurality of cooling fins and at least
a guide heat pipe. The cooling fins stack to one another with at
least a through hole at the respective cooling fin for being
penetrated with the guide heat pipe. A projecting annular part is
disposed at a side of the respective cooling fin to surround the
circumference of the through hole with an indented spot at the
periphery of the projecting annular part. The outer side of said
guide heat pipe has an elongated recess extending along the length
thereof to correspond to the indented spot such that the indented
spot is capable of fitting with the recess after the guide heat
pipe passing through the through hole respectively to facilitate
the subsequent welding job.
[0009] Wherein, the protrusion part can be circular or the square
shape. Further, a plurality of the protrusion parts can be arranged
irregularly on the plate member such that the effect of different
eddy currents at the periphery of the cooling fin can be produced
advantageously and the slots at the lateral sides of the respective
protrusion part are helpful for increasing the coefficient of heat
exchange of the cooling fin and enhancing the integral performance
of the cooling fin.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The detail structure, the applied principle, the function
and the effectiveness of the present invention can be more fully
understood with reference to the following description and
accompanying drawings, in which:
[0011] FIG. 1 is a perspective view of a cooling fin in a heat
dissipation module according to a preferred embodiment of the
present invention;
[0012] FIG. 2 is a perspective view illustrating the cooling fin
shown in FIG. 1 being penetrated by two guide heat pipes;
[0013] FIG. 3 is a sectional view of FIG. 2; and
[0014] FIG. 4 is a perspective view of a heat dissipation module
according to the present invention in which a plurality of the
cooling fins stacking to each other and being penetrated by the
heat guide pipes.
DETAILED DESCRIPTION OF THE INVENTION
[0015] Referring to FIGS. 1 to 4, a heat dissipation module
according to a preferred embodiment of the present invention
includes a plurality of cooling fins 1 and at least a guide heat
pipe 2. The cooling fins 1 are stacked to one another. Each cooling
fin 1 has at least a circular through hole 11 corresponding to the
guide heat pipe 2. A side of the respective cooling fin 1 provides
a projecting annular part 12 to surround the circumference of the
through hole 11. The projecting annular part 12 has an indented
spot 121 at the periphery thereof. The guide heat pipe 2 provides
an elongated recess 21, which is formed continuously or discretely,
extending along the length of the guide heat pipe 2 corresponding
to the indented spot 121 such that the indented spot 121 can fit
with the recess 21.
[0016] As the foregoing, the guide heat pipe 2 penetrates the
through hole 11 of the respective stacked cooling fin in a way of
the elongated recess 21 fitting with the indented spot 121 of the
respective annular part 12 such that it facilitates the subsequent
welding job for joining the guide heat pipe 2 to the respective
cooling fin 1 firmly.
[0017] It is appreciated that the heat dissipation module according
to the present invention is composed of a plurality of stacked
cooling fins 1 and at least a guide heat pipe 2 with an projecting
annular ring 12, which surrounds an end of at lest a through hole
11 of the respective cooling fin 1, having an indented spot 121
fitting with an elongated recess 21 of the guide heat pipe 2 to
facilitate the subsequent welding job for joining the guide heat
pipe 2 to the cooling fins firmly.
[0018] While the invention has been described with referencing to
the preferred embodiment thereof, it is to be understood that
modifications or variations may be easily made without departing
from the spirit of this invention, which is defined by the appended
claims.
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