U.S. patent application number 12/033234 was filed with the patent office on 2009-08-20 for liquid cooling device for multiple electronic components.
This patent application is currently assigned to MAN ZAI INDUSTRIAL CO., LTD.. Invention is credited to Su-Chen Hu, Hao-Hui Lin, Cheng-Feng WAN.
Application Number | 20090205808 12/033234 |
Document ID | / |
Family ID | 40954029 |
Filed Date | 2009-08-20 |
United States Patent
Application |
20090205808 |
Kind Code |
A1 |
WAN; Cheng-Feng ; et
al. |
August 20, 2009 |
LIQUID COOLING DEVICE FOR MULTIPLE ELECTRONIC COMPONENTS
Abstract
A liquid cooling device for multiple electronic components has
two liquid blocks, a heat-dissipating plate, a pump and a heat
sink. The two liquid blocks and the heat sink are connected and
communicated with other via tubing. The pump operates to make a
coolant circulate among the two liquid blocks and the heat sink.
The heat-dissipating plate is integrally formed with one liquid
block. The heat-dissipating plate is disposed on another separate
electronic component for absorbing heat. Therefore, the liquid
cooling device has only two liquid blocks, but can dissipate heat
generated by three electronic components.
Inventors: |
WAN; Cheng-Feng; (Tainan,
TW) ; Lin; Hao-Hui; (Tainan, TW) ; Hu;
Su-Chen; (Tainan, TW) |
Correspondence
Address: |
BURR & BROWN
PO BOX 7068
SYRACUSE
NY
13261-7068
US
|
Assignee: |
MAN ZAI INDUSTRIAL CO.,
LTD.
Tainan
TW
|
Family ID: |
40954029 |
Appl. No.: |
12/033234 |
Filed: |
February 19, 2008 |
Current U.S.
Class: |
165/80.4 ;
165/104.28 |
Current CPC
Class: |
G06F 2200/201 20130101;
H01L 23/473 20130101; G06F 1/20 20130101; H01L 2924/0002 20130101;
H01L 2924/0002 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/80.4 ;
165/104.28 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Claims
1. A liquid cooling device for multiple electronic components, the
liquid cooling device comprising: two liquid blocks communicating
with each other via tubing and being filled with coolant, each of
the liquid blocks for being mounted on an electronic component; a
heat-dissipating plate integrally extending from and being outside
one of the liquid blocks for being mounted on another electronic
component; a pump being connected and communicating with one of the
liquid blocks via tubing; and a heat sink being connected and
communicating with the pump and one of the liquid blocks via
tubing.
2. The liquid cooling device as claimed in claim 1, wherein each
liquid block comprises: a base having a bottom surface in contact
with the electronic component; and a cover being mounted on the
base and formed with an inlet and an outlet.
3. The liquid cooling device as claimed in claim 2, wherein each
liquid block further comprises multiple heat-dissipating fins being
formed on a top surface of the base inside the cover.
4. The liquid cooling device as claimed in claim 1, wherein the
heat-dissipating plate is formed with multiple heat-dissipating
fins outside the cover.
5. The liquid cooling device as claimed in claim 2, wherein the
heat-dissipating plate is formed with multiple heat-dissipating
fins outside the cover.
6. The liquid cooling device as claimed in claim 3, wherein the
heat-dissipating plate is formed with multiple heat-dissipating
fins outside the cover.
7. The liquid cooling device as claimed in claim 5, wherein the
heat-dissipating plate integrally extends from the base of a
corresponding one of the liquid blocks.
8. The liquid cooling device as claimed in claim 6, wherein the
heat-dissipating plate integrally extends from the base of a
corresponding one of the liquid blocks.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The invention relates to a liquid cooling device and, in
particular, to a liquid cooling device for multiple electronic
components.
[0003] 2. Description of Related Art
[0004] As modem computers have to process very complicated
processes, its internal circuit design also becomes more
complicated. Electronic components in the computers produce heat
during their operations. Therefore, a liquid cooling device has
been introduced. The liquid cooling device comprises several liquid
blocks, a pump and a heat sink. The liquid blocks are filled with a
coolant and directly mounted on the electronic components for
absorbing heat generated from them. The liquid blocks are in liquid
communications with the pump and the heat sink via tubing.
Therefore, the pump operates to make the coolant circulate in the
liquid blocks. The coolant thus transfers heat from the liquid
blocks to the heat sink. After the heat sink dissipates the heat,
the coolant can flow back to the liquid blocks for repeatedly heat
dissipation.
[0005] From the above explanation, the existing liquid block is
designed for a single electronic component. To dissipate heat
generated by multiple electronic components on a mother board, the
liquid-cooling heat-dissipating device has to have several liquid
blocks respectively disposed on the those electronic components.
However, this increases the production cost and complicates the
assembling operations among those liquid blocks since a lot of
tubing for connections is required.
[0006] To overcome the shortcomings, the present invention provides
a liquid cooling device to mitigate or obviate the aforementioned
problems.
SUMMARY OF THE INVENTION
[0007] An objective of the invention is to provide a liquid cooling
device that can be applied to multiple electronic components.
[0008] To achieve the objective, the liquid cooling device
comprises:
[0009] two liquid blocks communicating with each other via tubing
and being filled with coolant, each of the liquid blocks for being
mounted on an electronic component;
[0010] a heat-dissipating plate integrally extending from and being
outside one of the liquid blocks for being mounted on another
electronic component;
[0011] a pump being connected and communicating with any one of the
liquid blocks via tubing; and
[0012] a heat sink being connected and communicating with the pump
and any one of the liquid blocks via tubing.
[0013] The invention can achieve liquid-cooling effects for three
electronic components just using two liquid blocks and the
heat-dissipating plate. The invention does not only reduce the cost
by having one less liquid block, but also simplifies the
connections among the components by using fewer tubing.
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] FIG. 1 is a perspective operational view of a preferred
embodiment of a liquid cooling device in accordance with the
invention being applied to a mother board with south and north
bridge chips and an image processing chip;
[0015] FIG. 2 is a top plan view of the mother board with the
liquid cooling device in FIG. 1;
[0016] FIG. 3 is a side view in partial section of the mother board
with the liquid cooling device in FIG. 1; and
[0017] FIG. 4 is an exploded perspective view of a preferred
embodiment of a second liquid block and a heat-dissipating plate in
accordance with the invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0018] With reference to FIGS. 1 to 3, a mother board 10 is
disposed with several electronic components such as a south bridge
chip 11, a north bridge chip 12 and an image processing chip 13
that will generate heat. A liquid cooling device of the present
invention comprises a first liquid block 20, a second liquid block
30, a heat-dissipating plate 40, a pump 50 and a heat sink 60.
[0019] The first liquid block 20 is mounted on the north bridge
chip 12 and has a base 21 and a cover 22. The base 21 has a bottom
surface being in contact with the north bridge chip 12 and a top
surface formed with heat-dissipating fins 21 1. The cover 22 is
mounted on the base 21 and completely covers and seals the
heat-dissipating fins 211 to accommodate the coolant. The cover 22
is formed with two inlet/outlet 221.
[0020] The second liquid block 30 is mounted on the image
processing chip 13. The second liquid block 30 has the same
structure as the first liquid block 20. One of the inlet/outlet 321
is connected via tubing 33 to one of the liquid inlet/outlet 221 of
the first liquid block 20.
[0021] With reference to FIG. 4, the heat-dissipating plate 40 is
integrally extended from one side of the base 31 of the second
liquid block 30 to the south bridge chip 11 in order to absorb heat
produced by the south bridge chip 11 and dissipate heat. Some of
the heat is also rapidly transferred to the second liquid block 30
and absorbed by the coolant in the second liquid block 30. In this
embodiment, the heat-dissipating plate 40 is formed with multiple
heat-dissipating fins 41. Therefore, the heat absorbed by the
heat-dissipating plate 40 is not only absorbed by the coolant
inside the second liquid block 30, but is also dissipated by the
heat-dissipating fins 41. This achieves a double-cooling
effect.
[0022] The pump 50 is connected with one of the inlet/outlet 221 on
the first liquid block 20 via tubing 51 so as to have liquid
communications with the first liquid block 20.
[0023] The heat sink 60 is connected via two tubing 61 with the
pump 50 and one of the inlet/outlet 321 on the second liquid block
30, respectively. The pump 50 operates to make the coolant
circulate among the first liquid block 20, the second liquid block
30, the pump 50 and the heat sink 60. When the coolant absorbed
with heat flows to the heat sink 60, the heat is dissipated into
the environment by the heat sink 60.
[0024] The invention uses a heat-dissipating plate in combination
with two liquid blocks 20,30 to absorb heat produced by three
heat-generating electronic components. The heat-dissipating fins 41
on the heat-dissipating plate 40 can further enhance the
heat-dissipating effect. In comparison with the conventional liquid
cooling device, the invention has one less liquid block and thus a
lower production cost. Moreover, the invention simplifies the
connections among various electronic components.
[0025] Even though numerous characteristics and advantages of the
present invention have been set forth in the foregoing description,
together with details of the structure and features of the
invention, the disclosure is illustrative only. Changes may be made
in the details, especially in matters of shape, size, and
arrangement of parts within the principles of the invention to the
full extent indicated by the broad general meaning of the terms in
which the appended claims are expressed.
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