U.S. patent application number 12/359418 was filed with the patent office on 2009-07-30 for electron beam writing method, fine pattern writing system, and manufacturing method of uneven pattern carrying substrate.
This patent application is currently assigned to FUJIFILM CORPORATION. Invention is credited to Kazunori KOMATSU, Toshihiro Usa.
Application Number | 20090189094 12/359418 |
Document ID | / |
Family ID | 40898277 |
Filed Date | 2009-07-30 |
United States Patent
Application |
20090189094 |
Kind Code |
A1 |
KOMATSU; Kazunori ; et
al. |
July 30, 2009 |
ELECTRON BEAM WRITING METHOD, FINE PATTERN WRITING SYSTEM, AND
MANUFACTURING METHOD OF UNEVEN PATTERN CARRYING SUBSTRATE
Abstract
A fine pattern which includes servo patterns, each constituted
by servo elements, and groove patterns, each for separating
adjacent data tracks, is formed on a substrate applied with a
resist and placed on a rotation stage by scanning an electron beam
on the substrate. While rotating the substrate in one direction,
the electron beam is scanned so as to completely fill servo
elements corresponding to a plurality of tracks one by one during
one rotation of the substrate by X-Y deflecting the electron beam
and vibrating back and forth in the radius direction. Each groove
pattern is set as a line-up of a plurality of groove elements
divided at a predetermined angle, and groove elements corresponding
to the plurality of tracks following the writing of the servo
elements are sequentially written by deflection scanning the
electron beam largely in a circumferential direction during the
same rotation.
Inventors: |
KOMATSU; Kazunori;
(Odawara-shi, JP) ; Usa; Toshihiro; (Odawara-shi,
JP) |
Correspondence
Address: |
YOUNG & THOMPSON
209 Madison Street, Suite 500
ALEXANDRIA
VA
22314
US
|
Assignee: |
FUJIFILM CORPORATION
Tokyo
JP
|
Family ID: |
40898277 |
Appl. No.: |
12/359418 |
Filed: |
January 26, 2009 |
Current U.S.
Class: |
250/492.3 ;
250/396R; 850/3 |
Current CPC
Class: |
B82Y 10/00 20130101;
H01J 37/3026 20130101; G11B 7/261 20130101; H01J 37/3174 20130101;
B82Y 40/00 20130101; H01J 37/3056 20130101; G11B 5/855 20130101;
H01J 2237/31735 20130101 |
Class at
Publication: |
250/492.3 ;
250/396.R; 850/3 |
International
Class: |
A61N 5/00 20060101
A61N005/00; H01J 3/14 20060101 H01J003/14; G01N 13/10 20060101
G01N013/10 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 24, 2008 |
JP |
013532/2008 |
Claims
1. An electron beam writing method for writing a fine pattern, to
be formed on a discrete track medium, on a substrate applied with a
resist and placed on a rotation stage by scanning an electron beam
on the substrate while rotating the rotation stage, the fine
pattern including servo patterns, each constituted by servo
elements having a track direction length greater than an
irradiation diameter of the electron beam, and groove patterns,
each extending in the track direction to separate adjacent data
tracks in a groove-like manner, wherein, while rotating the
substrate in one direction, portions of the servo patterns and
groove patterns corresponding to a plurality of tracks are written
during one rotation of the substrate, wherein: the portion of each
servo pattern corresponding to the plurality of tracks is written
by rapidly vibrating the electron beam back and forth in a radius
direction of the rotation stage with an amplitude corresponding to
one track width and at the same time deflecting and moving the
electron beam in a direction opposite to a rotational direction of
the rotation stage faster than a rotation speed of the rotation
stage to scan the electron beam so as to completely fill the shape
of one of servo elements in the portion as one unit of writing, and
sequentially moving the writing start position of the electron beam
to each of the other servo elements and sequentially repeating the
one unit of writing; and groove patterns corresponding to the
plurality of tracks following the writing of the portion of each
servo pattern during the same rotation of the substrate are written
by setting each of the groove patterns as a line-up of a plurality
of groove elements divided at a predetermined angle, writing a
first groove element for a first track by deflection scanning the
electron beam in the direction opposite to the rotational direction
of the rotation stage as the substrate is rotated, deflecting the
electron beam in the same direction as the rotational direction and
the radius direction to a next track, writing a first groove
element of the next track by deflection scanning the electron beam
in the direction opposite to the rotational direction, sequentially
writing first groove elements for the other of the plurality of
tracks, deflecting the electron beam to the direction opposite to
the radius direction to return the electron beam to the first
track, writing a next groove element for the first track in the
same manner as above, and sequentially writing next groove elements
for the other of the plurality of tracks in the same manner as
above.
2. The electron beam writing method as claimed in claim 1, wherein,
in each of the servo patterns, when servo elements are arranged
contiguously in a radius direction of a plurality of tracks, the
servo elements are written by writing the servo element for a first
track, moving the electron beam to the writing start position of
the servo element of a next track by deflecting the electron beam
in the same direction as the rotational direction and in the radius
direction to the next track, and writing the servo element for the
next track.
3. The electron beam writing method as claimed in claim 1, wherein
the width of each groove element of each of the groove patterns is
set by changing the deflection speed of the electron beam in the
direction orthogonal to the radius direction.
4. A fine pattern writing system for realizing the electron beam
writing method as claimed in claim 1, comprising a signal output
unit for outputting a write data signal and an electron beam
writing unit for scanning an electron beam.
5. The fine pattern writing system as claimed in claim 4, wherein:
the electron beam writing unit includes a rotation stage movable in
a radius direction thereof while rotating a substrate applied with
a resist, an electron gun that emits an electron beam, a deflection
means that X-Y deflects the electron beam in a radius direction of
the substrate and a direction orthogonal to the radius direction
and rapidly vibrates the electron beam in the radius direction, a
blanking means that blocks the radiation of the electron beam other
than a writing area, and a controller that performs associated
operation control of each of the means, and the signal output unit
outputs a write data signal to the controller of the electron beam
writing unit based on data corresponding to the form of a fine
pattern to be written on the substrate.
6. A manufacturing method of an uneven pattern carrying substrate,
comprising the steps of: exposure writing a fine pattern, to be
formed on a discrete track medium, on a substrate applied with a
resist by the electron beam writing method as claimed in claim 1;
and forming an uneven pattern corresponding to the fine pattern on
the substrate.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to an electron beam writing
method for writing a fine pattern (uneven pattern) on a resist
provided on a substrate by irradiating an electron beam on the
resist when manufacturing a discrete track medium, and a fine
pattern writing system for implementing the electron beam writing
method.
[0003] The invention also relates to a manufacturing method of an
uneven pattern carrying substrate that includes an imprint mold
having an uneven pattern surface formed through a writing step
using the electron beam writing method described above.
[0004] 2. Description of the Related Art
[0005] Fine patterns, such as servo patterns and the like, are
formed on magnetic disk media. As one of the methods of forming
such fine patterns, an electron beam writing method in which patter
writing is performed by irradiating an electron beam on a substrate
applied with a resist according to the shape of a pattern while
rotating the substrate is proposed as described, for example, in
U.S. Pat. No. 7,026,098 and Japanese Unexamined Patent Publication
No. 2006-184924.
[0006] The electron beam writing method described in U.S. Pat. No.
7,026,098 is a method in which when writing, for example, a
rectangular or parallelogram element, which constitute a servo
pattern, extending in a track width direction, the electron beam is
deflected in a radius direction while vibrating rapidly in
circumferential directions to scan the beam so as to completely
fill the area of the element.
[0007] The electron beam writing method described in Japanese
Unexamined Patent Publication No. 2006-184924 is a method in which,
when writing an element of a record bit string having the same
length in a track width direction and different lengths in a track
direction, the writing is performed by rapidly vibrating an
electron beam in a radius direction of a substrate while
controlling the amplitude thereof as the substrate is rotated.
[0008] Further, as on/off writing method, a method in which pattern
writing is performed by on/off irradiating an electron beam on a
substrate applied with a resist according to the shape of a pattern
while rotating the substrate, and shifting the substrate or
electron beam irradiation unit by one beam width every rotation of
the substrate in a radius direction is also known.
[0009] Recently, in view of the demand of higher recording density,
a discrete track medium (DTM), in which magnetic interference
between adjacent data tracks is reduced by separating the tracks
with a groove pattern (guard band), has been attracting wide
attention.
[0010] When writing a fine pattern on such a discrete track medium,
the aforementioned electron beam writing methods pose a problem
that the methods require a long time to write the fine pattern on
the entire surface of the substrate because of a narrower track
width and an increased number of tracks to be written due to the
formation of groove patterns.
[0011] For example, according to the writing method described in
U.S. Pat. No. 7,026,098, it is difficult to effectively improve the
writing time for the increased number of tracks, although the
writing time may be reduced for servo patterns by the employment of
the back and forth vibration scheme in comparison with the on/off
writing method. In particular, the method has difficulties in
accurately writing a groove pattern with a predetermined width, in
addition to the problem of having difficulties in reducing the
writing time.
[0012] That is, according to the writing method described in U.S.
Pat. No. 7,026,098, a servo pattern may be written on a discrete
track medium with the predetermined characteristics described
therein, but when writing a groove pattern on the medium following
the servo pattern, if the electron beam is fixedly irradiated to
write the groove pattern in an arc shape by the rotation of the
substrate, the radiation dose of the electron beam becomes
excessive for the groove pattern and the line width is increased by
exposure bleeding, thereby posing a problem that a groove pattern
having a predetermined width relative to the track width is not
written. This is due to the fact that, for the writing of a servo
pattern, electron beam intensity is set great to allow scan writing
of a predetermined area with a predetermined exposure amount by
rapidly vibrating the electron beam in a track direction while the
substrate is rotated at a constant speed. It is difficult to reduce
the beam intensity when transferring the writing from a servo
pattern to a groove pattern from the viewpoint of operational
stability of the electron beam radiation unit.
[0013] It is possible to secure the writing characteristics for a
groove pattern by writing the groove pattern with a different
rotation speed and different conditions from those for writing a
servo pattern. But this writing method has a problem that the
writing time is further extended since a fine pattern for one track
is written with a plurality of different rotation speeds of the
substrate.
[0014] In the mean time, in the writing method described in
Japanese Unexamined Patent Publication No. 2006-184924, a groove
pattern is written in a manner similar to that described in U.S.
Pat. No. 7,026,098, thus the radiation dose becomes excessive in
the same way. Therefore, the method also has the problem of having
difficulties in writing a groove pattern with a desired width, in
addition to the problem of extended time for writing a fine pattern
for a discrete track medium on the entire surface of the
substrate.
[0015] The on/off writing method described above is a suitable
method for writing a groove pattern, but it requires a long time
for writing servo patterns on the entire substrate, as well as
having a problem that it is difficult to write a pattern having a
predetermined shape by securing on/off positional accuracy of the
electron beam during one rotation of the substrate and positional
accuracy in inner and outer circumferences.
[0016] Further, if it is possible to write a portion of a fine
pattern corresponding to a plurality of tracks during one rotation
of the substrate, the time for writing the fine pattern on the
entire surface of the substrate will be reduced. But it is
difficult to write a portion of a fine pattern of discrete track
medium corresponding to a plurality of tracks during one rotation
of the substrate, since portions of servo patterns and groove
patterns are present in a mixed manner in a single track.
[0017] In view of the circumstances described above, it is an
object of the present invention to provide an electron beam writing
method capable of writing portions of servo patterns and groove
patterns in a fine pattern of a discrete track medium corresponding
to a plurality of tracks during one rotation of the substrate with
a uniform radiation dose, and a fine pattern writing system for
implementing the electron beam writing method.
[0018] It is a further object of the present invention to provide a
manufacturing method of an uneven pattern carrying substrate having
a fine pattern accurately written by an electron beam, such as an
imprint mold or the like.
SUMMARY OF THE INVENTION
[0019] An electron beam writing method of the present invention is
a method for writing a fine pattern, to be formed on a discrete
track medium, on a substrate applied with a resist and placed on a
rotation stage by scanning an electron beam on the substrate while
rotating the rotation stage, the fine pattern including servo
patterns, each constituted by servo elements having a track
direction length greater than an irradiation diameter of the
electron beam, and groove patterns, each extending in the track
direction to separate adjacent data tracks in a groove-like
manner,
[0020] wherein, while rotating the substrate in one direction,
portions of the servo patterns and groove patterns corresponding to
a plurality of tracks are written during one rotation of the
substrate, wherein:
[0021] the portion of each servo pattern corresponding to the
plurality of tracks is written by rapidly vibrating the electron
beam back and forth in a radius direction of the rotation stage
with an amplitude corresponding to one track width and at the same
time deflecting and moving the electron beam in a direction
opposite to a rotational direction of the rotation stage faster
than a rotation speed of the rotation stage to scan the electron
beam so as to completely fill the shape of one of servo elements in
the portion as one unit of writing, and sequentially moving the
writing start position of the electron beam to each of the other
servo elements and sequentially repeating the one unit of writing;
and
[0022] groove patterns for the plurality of tracks following the
writing of the portion of each servo pattern during the same
rotation of the substrate are written by setting each of the groove
patterns as a line-up of a plurality of groove elements divided at
a predetermined angle, writing a first groove element for a first
track by deflection scanning the electron beam in the direction
opposite to the rotational direction of the rotation stage as the
substrate is rotated, deflecting the electron beam in the same
direction as the rotational direction and the radius direction to a
next track, writing a first groove element of the next track by
deflection scanning the electron beam in the direction opposite to
the rotational direction, sequentially writing first groove
elements for the other of the plurality of tracks, deflecting the
electron beam to the direction opposite to the radius direction to
return the electron beam to the first track, writing a next groove
element for the first track in the same manner as above, and
sequentially writing next groove elements for the other of the
plurality of tracks in the same manner as above.
[0023] In the electron beam writing method described above, it is
preferable that, in each of the servo patterns, when servo elements
are arranged contiguously in a radius direction of a plurality of
tracks, the servo elements be written by writing the servo element
for a first track, moving the electron beam to the writing start
position of the servo element of a next track by deflecting the
electron beam in the same direction as the rotational direction and
in the radius direction to the next track, and writing the servo
element for the next track.
[0024] Further, in the electron beam writing method described
above, the width of each groove element of each of the groove
patterns be set by changing the deflection speed of the electron
beam in the direction orthogonal to the radius direction.
[0025] A fine pattern writing system of the present invention is a
system for realizing the electron beam writing method described
above, and includes: a signal output unit for outputting a write
data signal; and an electron beam writing unit for scanning an
electron beam.
[0026] Preferably, the fine pattern writing system is structured in
the following manner. That is, the electron beam writing unit
includes a rotation stage movable in a radius direction thereof
while rotating a substrate applied with a resist, an electron gun
that emits an electron beam, a deflection means that X-Y deflects
the electron beam in a radius direction of the substrate and a
direction orthogonal to the radius direction and rapidly vibrates
the electron beam in the radius direction, a blanking means that
blocks the radiation of the electron beam other than a writing
area, and a controller that performs associated operation control
of each of the means. The signal output unit is configured to
output a write data signal to the controller of the electron beam
writing unit based on data corresponding to the form of a fine
pattern to be written on the substrate.
[0027] A manufacturing method of uneven pattern carrying substrate
of the present invention is a manufacturing method, including the
steps of: exposure writing a fine pattern, to be formed on a
discrete track medium, on a substrate applied with a resist by the
electron beam writing method described above; and forming an uneven
pattern corresponding to the fine pattern on the substrate. Here,
the uneven pattern carrying substrate is a substrate having a
desired uneven pattern shape on a surface thereof, such as an
imprint mold for transferring the uneven pattern shape to a target
medium or the like.
[0028] The term "imprint mold" as used herein refers to an original
mold (also referred to as "stamper") having a fine uneven pattern
formed thereon by electron beam writing like that described above.
In a shape patterning method using imprint technology, a
predetermined shape may be transferred to the surface of the medium
at a time by pressing the imprint mold having the predetermined
shape pattern onto the surface of a resin layer serving as a mask
in the process of forming a magnetic disk medium.
[0029] According to the electron beam writing method of the present
invention, writing of a fine pattern, to be formed on a discrete
track medium, that includes servo patterns, each being constituted
by servo elements having a track direction length greater than an
irradiation diameter of the electron beam, and groove patterns,
each extending in the track direction to separate adjacent data
tracks in a groove-like manner, is performed in the following way.
While rotating the substrate in one direction, portions of the
servo patterns and groove patterns corresponding to a plurality of
tracks are written during one rotation of the substrate. The
portion of each servo pattern corresponding to the plurality of
tracks is written by rapidly vibrating the electron beam back and
forth in a radius direction of the rotation stage with an amplitude
corresponding to one track width and at the same time deflecting
and moving the electron beam in a direction opposite to a
rotational direction of the rotation stage faster than a rotation
speed of the rotation stage to scan the electron beam so as to
completely fill the shape of one of servo elements in the portion
as one unit of writing, and sequentially moving the writing start
position of the electron beam to each of the other servo elements
and sequentially repeating the one unit of writing. Groove patterns
corresponding to the plurality of tracks following the writing of
the portion of each servo pattern during the same rotation of the
substrate are written by setting each of the groove patterns as a
line-up of a plurality of groove elements divided at a
predetermined angle, writing a first groove element for a first
track by deflection scanning the electron beam in the direction
opposite to the rotational direction of the rotation stage as the
substrate is rotated, deflecting the electron beam in the same
direction as the rotational direction and the radius direction to a
next track, writing a first groove element of the next track by
deflection scanning the electron beam in the direction opposite to
the rotational direction, sequentially writing first groove
elements for the other of the plurality of tracks, deflecting the
electron beam to the direction opposite to the radius direction to
return the electron beam to the first track, writing a next groove
element for the first track in the same manner as above, and
sequentially writing next groove elements for the other of the
plurality of tracks in the same manner as above. This allows
portions of the servo patterns and groove patterns corresponding to
a plurality of tracks to be written during one rotation of the
substrate with a uniform radiation dose, and a fine pattern, to be
formed on a discrete track medium, which includes servo patterns
and groove patterns may be written on the entire surface of the
substrate rapidly and accurately, whereby the writing efficiency is
improved and hence the writing time is reduced.
[0030] In particular, the scheme of repeating the writing of each
servo element of the servo patterns by rapidly vibrating the
electron beam back and forth in a radius direction of the rotation
stage with an amplitude corresponding to one track width and at the
same time deflecting and moving the electron beam in a direction
opposite to a rotational direction of the rotation stage faster
than a rotation speed of the rotation stage to scan the electron
beam so as to completely fill the shape of one of servo elements as
one unit of writing while shift deflecting the electron beam
between the tracks allows writing with the same deflection control
after moving the electron beam to the next writing start position,
whereby the servo patterns corresponding to a plurality of tracks
may be written rapidly and accurately.
[0031] Further, the scheme of writing each groove element of the
groove pattern by deflection scanning the electron beam in a
direction opposite to a rotational direction of the substrate while
rotating the substrate in one direction allows writing of groove
patterns corresponding to a plurality of tracks, and each groove
element may be written at a predetermined width without undue
radiation dose.
[0032] Where servo elements in each of the servo patterns arranged
contiguously in a radius direction of a plurality of tracks are
written by writing the servo element for a first track, moving the
electron beam to the writing start position of the servo element of
a next track by deflecting the electron beam in the same direction
as the rotational direction and in the radius direction to the next
track, and writing the servo element for the next track, portions
of the servo patterns corresponding to the plurality of tracks may
be written rapidly and accurately during one rotation of the
substrate.
[0033] Further, in the electron beam writing method described
above, where the width of each groove element of each of the groove
patterns is set by changing the deflection speed of the electron
beam in a direction orthogonal to the radius direction, the groove
pattern may be written rapidly with an appropriate radiation
dose.
[0034] The fine pattern writing system of the present invention
includes, for realizing the electron beam writing method described
above, a signal output unit for outputting an image data signal and
an electron beam writing unit for scanning an electron beam, so
that a fine pattern to be formed on a discrete track medium may be
written rapidly and accurately, whereby the writing efficiency is
improved and hence the writing time is reduced.
[0035] In particular, where the electron beam writing unit includes
a rotation stage movable in a radius direction thereof while
rotating a substrate applied with a resist, an electron gun that
emits an electron beam, a deflection means that X-Y deflects the
electron beam in a radius direction of the substrate and a
direction orthogonal to the radius direction and rapidly vibrates
the electron beam in the radius direction, a blanking means that
blocks the radiation of the electron beam other than a writing
area, and a controller that performs associated operation control
of each of the means, and the signal output unit is configure to
output a write data signal to the controller of the electron beam
writing unit based on data corresponding to the form of a fine
pattern to be written on the substrate, a preferable electron beam
writing system may be obtained.
[0036] Further, according to the manufacturing method of an uneven
pattern carrying substrate of the present invention, a fine
pattern, to be formed on a discrete track medium, is exposure
written on a substrate applied with a resist by the electron beam
writing method described above and an uneven pattern corresponding
to the fine pattern is formed on the substrate, so that a substrate
having a highly accurate uneven pattern thereon may be obtained
easily. In particular, in the case of an imprint mold, it has a
fine pattern to be formed on a discrete track medium thereon.
Therefore, when performing shape patterning using imprint
technology, the fine pattern may be transferred to the surface of
the medium at a time by pressing the imprint mold onto the surface
of a resin layer serving as a mask in the process of forming a
magnetic disk medium, whereby a discrete track medium with
excellent characteristics may be produced easily.
BRIEF DESCRIPTION OF THE DRAWINGS
[0037] FIG. 1 is an overall plan view of a fine pattern of a
discrete track medium to be written on a substrate by an electron
beam writing method of the present invention.
[0038] FIG. 2 is a partially enlarged view of the fine pattern.
[0039] FIG. 3A is an enlarged schematic view of a basic writing
principle for writing elements constituting the fine pattern.
[0040] FIGS. 3B to 3F illustrate various control signals, including
a deflection signal and the like, used in the writing
principle.
[0041] FIG. 4A is a relevant side view of a fine pattern writing
system according to an embodiment of the present invention for
implementing the electron beam writing method of the present
invention.
[0042] FIG. 4B is a partial plan view of the fine pattern writing
system shown in FIG. 4A.
[0043] FIG. 5 is a schematic cross-sectional view, illustrating a
process of transfer forming a fine pattern using an imprint mold
having a fine pattern written by the electron beam writing method
or fine pattern writing system.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0044] Hereinafter, an exemplary embodiment of the present
invention will be described in detail with reference to the
accompanying drawings. FIG. 1 is an overall plan view of a fine
pattern of a discrete track medium to be written on a substrate by
an electron beam writing method of the present invention. FIG. 2 is
a partially enlarged view of the fine pattern. FIG. 3A is an
enlarged schematic view of a basic writing principle for writing
elements constituting the fine pattern. FIGS. 3B to 3F illustrate
various control signals, including a deflection signal and the
like, used in the writing principle. FIG. 4A is a relevant side
view of a fine pattern writing system according to an embodiment of
the present invention for implementing the electron beam writing
method of the present invention. FIG. 4B is a partial plan view of
the fine pattern writing system shown in FIG. 4A.
[0045] As illustrated in FIGS. 1 and 2, a fine pattern of fine
uneven shape for a discrete track medium includes servo patterns 12
formed in servo areas, and groove patterns 15 formed in data areas.
The fine pattern is formed on an annular region of disk-shaped
substrate 10 other than outer circumferential portion 10a and inner
circumferential portion 10b.
[0046] Servo patterns 12 are formed in elongated areas
substantially radially extending from the center to each sector on
concentric tracks of substrate 10 at regular intervals. In this
example, servo patterns 12 are formed in contiguous curved radials
in a radius direction. As shown in FIG. 2, which is a partially
enlarged view of a portion of a servo pattern, fine rectangular
servo elements 13 corresponding to, for example, preamble, address,
and burst signals are disposed on concentric tracks T1 to T4. One
servo element 13 has a width corresponding to one track width and a
track direction length greater than an irradiation diameter of the
electron beam. Some of servo elements 13 of the burst signal are
shifted by a half track width and extending over an adjacent
track.
[0047] In the mean time, groove patterns 15 are concentrically
formed in each guard band area between data tracks and extending in
a track direction so as to separate between adjacent tracks T1 to
T4 like a groove. Each groove pattern 15 is formed of a line-up of
a plurality of groove elements 16 divided at a predetermined
angle.
[0048] Each servo element 13 and groove element 16 of servo pattern
12 and groove pattern 15 are written by rotating substrate 10
applied with a resist 11 and placed on rotation stage 41 (FIG. 4),
to be describe later, and sequentially scanning elements 13 and 16
with electron beam EB to expose resist 11 for a plurality of tracks
at a time from a track on the inner circumferential side to a track
on the outer circumferential side or vice versa.
[0049] That is, a portion of the fine pattern corresponding to a
plurality of tracks is written during one rotation of substrate 10
in order to reduce the writing time, like hatched servo elements 13
and groove elements 16 on two tracks T1 and T2, which extend
linearly when viewed microscopically, are written in a first
rotation, and non-hatched servo elements 13 and groove elements 16
on two adjacent tracks T3 and T4 are written in the next rotation,
as shown in FIG. 2.
[0050] Servo elements 13 shifted by a half track and extending over
an adjacent track are written at a time by shifting the writing
fiducial by a half track without dividing them into halves. As will
be described later, it is possible to perform the writing for three
or more tracks at a time depending on the deflectable range of
electron beam EB in a radius direction.
[0051] FIG. 3A illustrates an embodiment of the electron beam
writing method of the present invention. In the present embodiment,
a portion of servo pattern 12 for two tracks T1 and T2 (servo
elements 13a to 13d) is written first and then groove patterns 15
for the two tracks (groove elements 16a to 16d) are sequentially
written at a time during one rotation of substrate 10 (rotation
stage 41) by scanning electron beam EB.
[0052] That is, for a plurality of tracks, tracks T1 and T2, servo
elements 13 for the plurality of tracks of servo pattern 12 located
between the groove patterns 15 are sequentially written and then
the groove patterns 15 for the plurality of tracks are written, and
portions of servo patterns 12 and groove patterns 15 corresponding
to the plurality of tracks are alternately written during one
rotation of the substrate.
[0053] In the scanning described above, electron beam EB having a
beam diameter smaller than a minimum track direction length of
servo elements 13a to 13d is ON/OFF controlled by blanking means 24
(aperture 25 and blanking 26), to be described later, and at the
same time X-Y deflected by deflection means 21 and 22 in radius
direction Y and circumferential direction X orthogonal to the
radius direction while being rapidly vibrated back and forth in the
radius direction Y orthogonal to circumferential direction X at a
constant amplitude (one track width W), whereby the exposure
writing is performed.
[0054] More specifically, while substrate 10 (rotation stage 41) is
rotated in one direction A, two pairs of servo elements 13a to 13d
of servo pattern 12 on tracks T1 and T2 (with track width W)
disposed continuously and parallel in radius direction Y, shown in
FIG. 3A, are written one by one by scanning electron beam EB so as
to completely fill the shape of each servo element as one unit of
writing.
[0055] One servo element 13 is written by vibrating electron beam
EB back and forth in radius direction Y with the amplitude of one
track width W and deflecting in circumferential direction X faster
than the rotation speed. This writing is sequentially repeated by
scanning electron beam EB in N-shaped trajectory, in which electron
beam EB is moved to the next track and deflected, as required, in
circumferential direction X which is the same direction as the
rotational direction A so as to be moved to the writing start
position of each of servo elements 13a to 13d, whereby servo
elements 13a to 13d for the two tracks are written during one
rotation of substrate 10.
[0056] Following this, two pairs of groove elements 16a to 16d of
groove patterns 15 adjacent to the inner and outer circumferences
divided in a radius direction at a predetermined angle shown in
FIG. 3A are written by scanning electron beam EB in Z-shaped
trajectory, whereby groove elements 16a to 16d for the two tracks
are likewise written during one rotation of substrate 10. When
groove patterns 15 are written, the rapid back and forth vibrations
of electron beam EB in radius direction Y in the writing of servo
elements 13 is stopped.
[0057] In the writing of groove patterns 15, first groove element
16a of track T1 divided at a predetermined angle is written by
deflecting electron beam EB largely in circumferential direction X
which is opposite to rotational direction A by the element length
from the writing start position, and second groove element 16c on
the same track, track T1, is written in the same manner after a
time interval for substrate 10 to rotate to the writing start
position by largely deflecting electron beam EB in circumferential
direction X which is opposite to rotational direction A from the
writing start position. During the time period between the writing
of groove elements 16a and 16c, first groove element 16b of track 2
is written.
[0058] At this time, electron beam EB is deflected in
circumferential direction X which is the same direction as
rotational direction A so as to be returned to the writing start
position of the first groove element 16a, and at the same time
deflected in radius direction Y to the next track, track T2,
whereby electron beam EB is moved to the writing start position of
the first groove element, element 16b, of track T2. Then, groove
element 16b is written by largely deflecting electron beam EB in
circumferential direction X which is opposite to rotational
direction A in the same manner as described above.
[0059] Detailed description will be made with reference to FIGS. 3A
to 3F. FIG. 3A illustrates a writing operation by electron beam EB
on substrate 10 in radius direction Y (outer circumferential
direction) and circumferential direction X (rotational direction).
FIG. 3B illustrates deflection signal Def(Y) that deflects electron
beam EB in radius direction Y, and FIG. 3c illustrates deflection
signal Def(X) that deflects electron beam EB in circumferential
direction X. FIG. 3D illustrates vibration signal Mod (Y) that
vibrates electron beam EB in radius direction Y. FIG. 3E
illustrates ON/OFF operations of blanking signal BLK. FIG. 3F
illustrates synchronization characteristic by encoder pulses. It is
noted that, the horizontal axis in FIG. 3A represents rotational
phase, and horizontal axes in FIGS. 3B to 3D represent time.
[0060] First, at point "a", blanking signal BLK is turned ON to
irradiate electron beam EB and start writing of servo element 13a.
While being vibrated back and forth in radius direction Y by
vibration signal Mod(Y) (FIG. 3D), electron beam EB is deflected by
deflection signal Def (X) (FIG. 3C) so as to be moved in
circumferential direction X which is opposite to rotational
direction A faster than the rotational speed, whereby electron beam
EB is scanned so as to completely fill rectangular servo element
13a.
[0061] Then, at point "b", blanking signal BLK is turned OFF to
terminate the irradiation of electron beam EB. After point "b", the
irradiation position of electron beam EB is deflected to the
writing start position of servo element 13b of the next track,
track T2. That is, electron beam EB is shift deflected in radius
direction (-Y) by one track by deflection signal Def (Y) (FIG. 3B)
and largely in circumferential direction X which is the same
direction as rotational direction A, including displacement of
radiation position thereof due to the rotation of substrate 10 in
rotational direction A by defection signal Def(X) (FIG. 3C),
thereby moving electron beam to the writing start position of
groove element 13b. Then, at point "c" where electron beam EB is
moved to the writing start position, blanking signal BLK is turned
ON to irradiate electron beam EB, and writing of servo element 13b
of track T2 is started. The writing of servo element 13b is
performed by vibrating electron beam EB back and forth in radius
direction Y and in circumferential direction X which is opposite to
rotational direction A faster than the rotational speed in the same
manner as described above, whereby electron beam EB is scanned so
as to completely fill servo element 13b. Then, at point "d",
blanking signal BLK is turned OFF to terminate the irradiation of
electron beam EB and writing of servo element 13b. Thereafter, the
deflections of electron beam EB in radius direction Y and
circumferential direction X are returned to the fiducial
position.
[0062] Next, when substrate further rotates and reaches point "e",
the writing of the next servo element, servo element 13c, is
started in the same manner as described above and servo element 13c
is written in the same manner as described above based on the same
deflection signals, which is then terminated at point "f".
Thereafter, electron beam EB is moved to the writing start position
of servo element 13d of the next track, track T2, and the writing
of servo element 13d is started at point "g" and servo element 13d
is written in the same manner as described above based on the same
deflection signals, which is then terminated at point "h". Then,
the deflections of electron beam EB in radius direction Y and
circumferential direction X are returned to the fiducial
position.
[0063] Following this, at point "i", blanking signal BLK is turned
ON to irradiate electron beam EB and the writing of the first
groove element on track T1, groove element 16a, is started. In this
case, vibration signal Mod (Y) in FIG. 3D is turned OFF to stop the
back and forth vibrations in radius direction Y. Electron beam EB
is deflected by deflection signal Def (X) in FIG. 3C so as to be
moved largely in circumferential direction -X which is opposite to
rotational direction A, whereby groove element 16a having a
predetermined length is written, and the writing is terminated at
point "j". The writing length corresponds to the deflection amount
in -X direction plus rotation amount of substrate 10 in rotational
direction A. Here, it is noted that the deflection signal Def(Y) in
radius direction Y in FIG. 3B is turned OFF so that groove element
16a is not written in arc but linearly. In a microscopic range,
however, a strait line is not deviated largely from an arc.
[0064] After point "j", electron beam EB is deflected largely in
circumferential direction X which is the same direction as
rotational direction A, including displacement arising from the
rotation of substrate 10, so as to be returned to the writing start
position of groove element 16a. At the same time, electron beam EB
is deflected by deflection signal Def (Y) in FIG. 3B so as to be
moved by one track in radius direction (-Y), whereby electron beam
EB is positioned at the writing start position of the first groove
element, groove element 16b, on the next track, track T2. Then, at
point "k", blanking signal BLK is turned ON to irradiate electron
beam EB and the writing of groove element 16b is started. Electron
beam is deflected by deflection signal Def (X) in FIG. 3C so as to
be moved largely in circumferential direction (-X) which is
opposite to rotational direction A, whereby groove element 16b
having a predetermined length is written, and the writing is
terminated at point "m". Thereafter, the deflections in
circumferential direction X and radius direction -Y are returned to
the fiducial position.
[0065] After point "j", the writing of groove element 16b on track
T2 is started immediately following the termination of the writing
of groove element 16a on track T1, but a predetermined time may be
allocated between them.
[0066] Next, when substrate 10 is further rotated and reaches at
point "n" which is the writing start position of groove element 16c
on track T1, irradiation and deflection control of electron beam EB
are performed at points "o", "p", and "q" in the same manner as in
the writing of groove element 16a on track T1 and groove element
16b on track T2, whereby groove element 16c on track T1 and groove
element 16d on track T2 are written in the same manner.
[0067] The length of groove elements 16a to 16d is determined
according to the beam intensity of electron beam set to a value
which is sufficient to expose servo elements 13a to 13d on resist
11 by the rapid vibration writing. That is, the writing width (real
exposure width) tends to become wider than the radiation beam
diameter according to the exposure time. Therefore, the deflection
speed of electron beam EB is controlled so as to be scanned with a
predetermined radiation dose which ensures a real element exposure
width. For example, in order to reduce the element width, the
deflection speed is increased and radiation dose per unit area is
reduced. It is noted that it is difficult to change beam intensity
in the middle of writing from the viewpoint of beam stability.
[0068] Further, when writing groove elements 16a and 16c, the
writing start positions, i.e., point "i" and point "n" in FIG. 3E,
are positioned accurately based on the encoder pulse signal in FIG.
3F to improve the accuracy of the writing end position of groove
pattern 15 at the end point of the data area. More specifically,
the positions of point "i" and point "n" are synchronized with the
encoder pulse signal and determined at positions after
predetermined time (design time) t1 and t2 from the immediately
preceding encoder pulses S1 and S2 respectively.
[0069] After two tracks T1 and T2 are written during one rotation,
the electron beam EB is moved to the next two tracks and writing is
performed in the same manner as described above, whereby desired
fine patterns 12 and 15 are written on the entire area of substrate
10. The track migration of electron beam EB is performed by
linearly moving rotation stage 41, to be described later, in radius
direction Y. The movement is performed every writing of two tracks
or every writing of a plurality of tracks (e.g., 8 tracks)
according to the deflectable range of electron beam in radius
direction Y. That is, rotation stage 41 is moved after the writing
of a plurality of tracks is performed predetermined number of times
by deflecting electron beam EB.
[0070] Deflection signal Def(X) in circumferential direction X
allows writing of any parallelogram element, as well as
compensation for the displacement of writing position arising from
the rotation of rotation stage 41.
[0071] Preferably, writing by electron beam EB is performed by
controlling the rotation speed of rotation stage 41 so as to be
slow in the writing for the outer circumferential side and fast for
the inner circumferential side so that the same linear speed is
ensured over the entire writing area of substrate 10 when writing
position in the writing area of substrate 10 is moved in the radius
direction, i.e., track migration is performed from the viewpoint of
securing a uniform radiation dose and accuracy of writing
position.
[0072] As described above, electron beam EB is scanned in order to
write each element 13 of servo pattern 12 and each element 16 of
groove pattern 15. For performing the scanning control of electron
beam EB, a write data signal is sent from signal output unit 60
(FIG. 4) to controller 50 of electron beam writing unit 40, to be
described later. The timing and phase of the output signal are
controlled based on the encoder pulse signal generated according to
the rotation of rotation stage 41 and a reference clock signal.
[0073] In the mean time, where the recording system of patterns 12
and 15 described above is a constant angular velocity (CAV) system,
the writing lengths of elements 13 and 16 in a track direction are
formed long on an outer circumferential side track and short on an
inner circumferential side track according to the variation of the
sector length between the inner and outer circumferential sides. In
this case, when servo elements 13 are written, the rotational
linear speed is maintained constant as described above to maintain
the deflection speed in circumferential direction X constant
between the inner and outer circumferential side tracks and the
writing length is changed by controlling the amount of deflection.
This allows the exposure of each element 13 to be performed uniform
under the same stable condition in which the frequency of back and
forth vibrations in the radius direction and intensity of electron
beam EB are maintained constant.
[0074] In order to perform the writing described above, fine
pattern writing system 20 shown in FIG. 4 is used. Fine pattern
writing system 20 includes electron beam writing unit 40 and signal
output unit 60. Electron beam writing unit 40 includes rotation
stage unit 45 having rotation stage 41 that supports substrate 10
and spindle motor 44 having a motor axis aligned with central axis
42 of rotation stage 41; shaft 46 passing through a portion of
rotation stage unit 45 and extending in radius direction Y of
rotation stage 41; and linear moving means 49 that moves rotation
stage unit 45 along shaft 46. Rod 47 with accurate threading and
disposed parallel to shaft 46 is screwed to a portion of rotation
stage unit 45. Rod 47 is rotatable in the forward and reverse
directions by pulse motor 48, and linear moving means 49 of
rotation stage unit 45 is formed by rod 47 and pulse motor 48.
Further, encoder 53 that generates encoder pulses at regular
intervals and at predetermined rotational phases by reading encoder
slits is installed for detecting the rotation of rotation stage 41,
and the encoder pulse signal is outputted to controller 50.
Controller 50 further includes a clock means (not shown) therein
that generates the reference clock signal used for the timing
control.
[0075] Electron beam writing unit 40 further includes electron gun
23 that emits electron beam EB, deflection means 21, 22 that
deflect electron beam EB in radius direction Y and circumferential
direction X, as well as microscopically vibrating the beam back and
forth in radius direction Y with a constant amplitude, and aperture
25 and blanking 26 (deflector) as blanking means 24 for turning the
radiation of electron beam EB ON and OFF. Electron beam EB emitted
from electron gun 23 is irradiated on substrate 10 through
deflection means 21, 22, a not shown lens, and the like.
[0076] Aperture 25 of blanking means 24 has a through hole for
passing electron beam EB in the center, and blanking 26 operates
according to input of ON/OFF signals, in which it passes electron
beam EB through the through hole of aperture 25 during ON-signal
without deflecting the beam, while it blocks electron beam EB with
aperture 25 by deflecting the beam so as not pass through the
through hole during OFF-signal, so that electron beam EB is not
irradiated. Then, while each element 13 or 16 is being written,
ON-signal is inputted to irradiate electron beam EB, and OFF-signal
is inputted during the transfer period from element 13 to element
16 to block electron beam EB so that exposure is not performed.
[0077] Drive control of spindle motor 44, that is, the rotational
speed of rotation stage 41, driving of pulse motor 48, that is, the
linear movement of linear moving means 49, modulation of electron
beam EB, control of deflection means 21, 22, ON/OFF control of
blanking 26 of blanking means 24, and the like are performed based
on control signals outputted from controller 50 serving as the
control means.
[0078] Signal output unit 60 stores therein write data of a fine
pattern for a discrete track medium and outputs the write data
signal to controller 50. Controller 50 performs the associated
control described above based on the write data signal, and
electron beam writing unit 40 writes servo patterns 12 and groove
patterns 15 of the fine pattern on the entire surface of substrate
10.
[0079] Substrate 10 to be placed on rotation stage 41 is made of,
for example, silicon, glass, or quartz and a positive or negative
electron beam writing resist 11 is applied on a surface thereof in
advance.
[0080] Preferably, the power and beam diameter of electron beam EB
are controlled taking into account the shapes of the respective
elements 13 and 16, and the sensitivity of electron beam writing
resist 11.
[0081] FIG. 5 is a schematic cross-sectional view illustrating a
fine pattern transfer forming process using imprint mold 70 (uneven
pattern carrying substrate) having a fine pattern written by the
electron beam writing method using fine pattern writing system
20.
[0082] Imprint mold 70 has fine uneven patter 72 on a surface
thereof and is obtained in the following manner. That is, resist 11
is applied on a surface of substrate 71 made of a transparent
material, and servo patterns 12 and groove patterns 15 for a
discrete track medium are written thereon by the electron beam
writing method described above. Thereafter, imprint mold 70 is
produced through development process, etching process, and the
like.
[0083] An example method for manufacturing magnetic disk medium 80
by imprint method using imprint mold 70 will be described. Magnetic
disk medium 80 as a discrete track medium includes substrate 81 on
which magnetic layer 82 is stacked and resist resin layer 83 for
forming a mask layer is provided thereon. The uneven shape of fine
uneven pattern 72 is transfer formed by pressing fine uneven
pattern 72 of imprint mold 70 against resist resin layer 83 and
solidifying resist resin layer 83 by ultraviolet radiation.
Thereafter, magnetic layer 82 is etched based on the uneven shape
of resist resin layer 83, whereby magnetic disk medium 80 of
discrete track with the fine uneven pattern formed on magnetic
layer 82 is produced.
* * * * *