U.S. patent application number 12/017705 was filed with the patent office on 2009-07-23 for air ventilation system.
This patent application is currently assigned to ASM AMERICA, INC.. Invention is credited to Robert C. Haro.
Application Number | 20090186571 12/017705 |
Document ID | / |
Family ID | 40876854 |
Filed Date | 2009-07-23 |
United States Patent
Application |
20090186571 |
Kind Code |
A1 |
Haro; Robert C. |
July 23, 2009 |
AIR VENTILATION SYSTEM
Abstract
The present invention is directed at an air ventilation system
for use with semiconductor manufacturing equipment. Specifically,
the ventilation system of the present invention adjusts vents or
outlets located on an enclosure used for semiconductor
manufacturing between a restricted state and an open state. When
the vents and/or outlets are in an open state, a high flow rate
through the enclosure is able to properly scavenge toxic and
volatile gasses to safely remove them. When the vents and/or
outlets are in a restricted state, the flow rate of gases
therethrough is substantially or fully restricted. Upon the sensing
of a condition (or the lack thereof) or the manual operation of an
operator, the vents and/or outlets are selectively adjusted between
the restricted and open states.
Inventors: |
Haro; Robert C.; (Gilbert,
AZ) |
Correspondence
Address: |
Snell & Wilmer L.L.P. (ASM America)
400 East Van Buren Street, One Arizona Center
Phoenix
AZ
85004-2202
US
|
Assignee: |
ASM AMERICA, INC.
Phoenix
AZ
|
Family ID: |
40876854 |
Appl. No.: |
12/017705 |
Filed: |
January 22, 2008 |
Current U.S.
Class: |
454/241 |
Current CPC
Class: |
H01L 21/67017
20130101 |
Class at
Publication: |
454/241 |
International
Class: |
F24F 7/00 20060101
F24F007/00 |
Claims
1. A semiconductor processing tool comprising: an enclosed space
through which air flows; an outlet in fluid communication with said
enclosed space; and an inlet in fluid communication with said
enclosed space wherein at least one of said inlet or said outlet is
operable between a restricted state and an open state based on the
presence or absence of a condition.
2. The semiconductor processing enclosure according to claim 1,
further comprising an access panel configured to grant access to
said enclosed space, wherein the presence of the condition occurs
when said access panel is in an open position.
3. The semiconductor processing enclosure according to claim 2,
wherein said access panel is a door.
4. The semiconductor processing enclosure according to claim 3,
wherein said door further comprises a handle and a sensor that is
operatively connected to said handle.
5. The semiconductor processing enclosure according to claim 4,
wherein said presence of the condition occurs when an operator
contacts said handle.
6. The semiconductor processing enclosure according to claim 4,
wherein said door further comprises a rod connected to said inlet
and movement of said door causes a grate in said inlet to change
orientation from a restricted state to an open state.
7. The semiconductor processing enclosure according to claim 1,
wherein the condition is a sensed condition that comprises one
selected from the group comprising: a change in temperature within
said enclosure, a change in pressure within said enclosure, a
change of gaseous composition within said enclosure, a change in
humidity level within said enclosure, a change in particulate level
within said enclosure, a fire within said enclosure, an explosion
within said enclosure, an implosion within said enclosure, a change
in amount of a particular gas within said enclosure, and a change
in percentage of a particular gas within said enclosure.
8. The semiconductor processing enclosure according to claim 4,
wherein said sensor can be any one of a chamber presence sensor, a
gas leak detection sensor, and emergency power sensor, or a thermal
runaway sensor.
9. The semiconductor processing tool according to claim 1, wherein
said inlet, said outlet, or a combination thereof, is maintained in
said restricted state prior to said presence of a condition.
10. A semiconductor processing tool with a ventilation system
comprising: an enclosed space defined by said semiconductor
processing tool; a door connected to said semiconductor processing
tool; a ventilation system in communication with said semiconductor
processing tool operable between a restricted state and an open
state; and a sensor in communication with said ventilation
system.
11. The semiconductor processing tool according to claim 10,
wherein said sensor is in communication with said enclosed
space.
12. The semiconductor processing tool according to claim 10,
wherein said ventilation system further comprises an actuator.
13. The semiconductor processing tool according to claim 12,
wherein said actuator is connected to a movable panel, wherein said
movable panel restricts air flow into said enclosed space when said
ventilation system is in said restricted state and provides a less
restricted air flow into said enclosed space than when said
ventilation system is in said open state.
14. The semiconductor processing tool according to claim 10,
wherein said sensor senses said integrity of said enclosed
space.
15. A method of selectively moving air through an enclosure used
for semiconductor processing comprising: enclosing an environment
acceptable for semiconductor processing, wherein said enclosed
environment further comprises a door and an inlet, wherein said
inlet is operable between an open state and a restricted state;
detecting the presence of a condition; and directing said inlet
enter an open state based on the presence of the condition or a
restricted state based upon the absence of the condition.
16. The method according to claim 15, wherein the condition
comprises one selected from the group comprising: a change in
temperature within said enclosure, a change in pressure within said
enclosure, a change of gaseous composition within said enclosure, a
change in humidity level within said enclosure, a change in
particulate level within said enclosure, a fire within said
enclosure, an explosion within said enclosure, an implosion within
said enclosure, a change in amount of a particular gas within said
enclosure, and a change in percentage of a particular gas within
said enclosure.
17. A semiconductor processing tool comprising: an enclosed space
defined by said semiconductor processing tool; a movable panel
attached to said semiconductor processing tool; and a ventilation
system in communication with said enclosed space and coupled to
said movable panel, said ventilation system being operable between
an open state and a restricted state.
18. The semiconductor processing tool according to claim 17,
wherein movement of said movable panel actuates said ventilation
system.
19. The semiconductor processing tool according to claim 17,
wherein said moveable panel is a door that can be in an open or a
closed position.
20. The tool according to claim 19, wherein said ventilation system
is in an open state when said door is in the open position and a
restricted state when the door is in a closed position.
21. A semiconductor processing tool comprising: an enclosed space
of said semiconductor processing tool through which conditioned air
is flowable; at least one inlet operatively connected to said
processing tool, wherein conditioned air external to said enclosed
space enters said enclosed space through said at least one inlet;
at least one outlet operatively connected to said processing tool,
wherein gases within said enclosure exit said enclosed space
through said at least one outlet; and a ventilating system
operatively connected to said processing tool, wherein said
ventilating system selectively adjusts said flow rate through one
of said at least one inlet or said at least one outlet based on a
change of at least one condition.
22. The semiconductor processing tool according to claim 21,
wherein the ventilating system maintains said at least one inlet,
said at least one outlet, or a combination thereof in said
restricted state prior to the change of at least one condition.
23. The semiconductor processing tool according to claim 21,
wherein said ventilating system is configured to selectively adjust
said state of one selected from the group consisting of only at
least one inlet, only at least one outlet, and a combination of at
least one inlet and at least one outlet based on the change of at
least one condition.
24. The semiconductor processing tool of claim 21, wherein the
condition is a sensed condition that comprises one selected from
the group comprising a change in temperature within said enclosure,
a change in pressure within said enclosure, a change of gaseous
composition within said enclosure, a change in humidity level
within said enclosure, a change in particulate level within said
enclosure, a fire within said enclosure, an explosion within said
enclosure, an implosion within said enclosure, a change in amount
of a particular gas within said enclosure, and a change in
percentage of a particular gas within said enclosure.
25. The semiconductor processing tool of claim 21, wherein said
condition comprises a manual adjustment by an operator.
Description
FIELD OF INVENTION
[0001] The invention relates to an automated air ventilation system
for use with enclosures such as those used in semiconductor
manufacturing and processing. More particularly, the device of the
present invention comprises an automated ventilation system that
enables an enclosure to only have the maximum flow rate when
desired, for example, based on the presence or absence of one or
more conditions that require a high flow rate.
BACKGROUND OF THE INVENTION
[0002] Semiconductor manufacturing requires numerous gasses that
are highly explosive, toxic, corrosive, or otherwise harmful. These
gasses are typically found in numerous machines and processing
tools that include enclosures that are used (in part) to prevent
the gasses from escaping into the immediate working environment and
causing harm. Allowing these gasses to build up within the
enclosures can lead to explosions and releases of the toxic gasses
into the surrounding environment.
[0003] To prevent gas buildup within the enclosures, a certain
quantity of air must flow through the enclosures to properly
scavenge and/or dilute the toxic gasses. Generally, this flow is
the result of a draw point or a duct that is connected to a
facility exhaust system that has a lower pressure than the
atmosphere outside the enclosure. This pressure differential causes
air to flow from outside the enclosure, through the inlet orifices
to the exhaust system through the exit outlet or duct. An
alternative method would be to have the exit vent in a room of
lesser pressure than the room where the inlet vent is located. A
ventilation system comprising an inlet vent and an outlet (such as
an exhaust duct) in communication with the enclosure enables the
flow rate within the enclosure. Certain exemplary pieces of
semiconductor manufacturing equipment utilize billions of cubic
feet per year of conditioned air to maintain the required flow rate
for safe operation of semiconductor manufacturing equipment.
[0004] Maintaining a high flow rate can be expensive as the air
used must generally be conditioned for temperature, humidity,
particles, and other factors that are typically required in the
manufacture of semiconductors. Such conditioning is costly and can
exceed tens of thousands of dollars per machine on an annual
basis.
[0005] That being said, it is not necessary to maintain a high flow
rate at all times during a particular machine's operation.
Typically, a high flow rate is only needed a very small percentage
of the time that a tool is operating. For example, many
semiconductor manufacturing tools require a high flow rate only
three percent of the total operating time. Certain exemplary times
when a high flow rate is needed include times when a technician
gains access to the enclosure by removing an access panel or if an
explosion, implosion or other similar event has already occurred
within the enclosure and a gas release has occurred. For reasons of
safety, the flow rate through these enclosures are typically set at
"worst-case" conditions (where a high flow rate is required) and is
therefore higher than is required for "general and/or least case"
situations.
[0006] Because current semiconductor manufacturing tools utilize a
high flow rate the entire time they operate regardless of whether
such a high flow rate is actually needed, these tools consume a
tremendous amount of energy and money. Therefore, an automated
ventilation system for use with semiconductor manufacturing tools
that selectively provides a high flow rate based upon the need for
such a high flow rate is desired.
SUMMARY OF THE INVENTION
[0007] As set forth in the detailed description and accompanying
figures, the present invention comprises, in various exemplary
embodiments, a device configured to overcome a typical ventilation
system's shortcomings by providing a system and device that adjusts
the air flow within an enclosure used for semiconductor
manufacturing based upon the occurrence of one or more conditions.
As a result, the ventilation system of the present invention
reduces the cost to operate semiconductor manufacturing equipment
because of the reduced amount of conditioned air that is
consumed.
[0008] In accordance with an exemplary embodiment of the present
invention, an automated air ventilation system for use with
semiconductor manufacturing equipment is provided. In accordance
with one exemplary embodiment of the present invention, the
ventilation system comprises an air inlet orifice restriction
system that is configured to enable an air inlet to be in an open
state to allow for a high flow rate and a restricted state to
prevent a high flow rate. The ventilation system changes its
orientation from a restricted state to an open state based on the
occurrence of one or more conditions. Certain exemplary conditions
comprise opening a door or removing a panel to gain access to the
enclosure, or attempting to do the same by, for example, unlocking
a locking mechanism on the panel or door, or the occurrence of an
explosion, implosion, gas leak, or other similar event within the
enclosure.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The subject invention will hereinafter be described in
conjunction with the appended drawing figures, wherein like
numerals denote like elements, and wherein;
[0010] FIG. 1 is a schematic diagram of the present invention
depicting an enclosure used for semiconductor manufacturing with a
ventilation system and access panels in an exemplary
embodiment;
[0011] FIG. 2 is a schematic diagram of the present invention
depicting a guillotine-type air inlet actuator in a position that
enables air to enter an enclosure used for semiconductor
manufacturing according to an exemplary embodiment;
[0012] FIG. 3 is a schematic diagram of the present invention
depicting a guillotine-type air inlet actuator in a restricted
position mechanically coupled to an access door that prevents air
from entering an enclosure used for semiconductor manufacturing
according to an exemplary embodiment;
[0013] FIGS. 4A and 4B are schematic diagrams of the present
invention depicting an air inlet actuator mechanically coupled to
an access door in both an open state (FIG. 4A) that enables air to
enter an enclosure used for semiconductor manufacturing and a
restricted state (FIG. 4B) that prevents air from entering the
enclosure according to an exemplary embodiment;
[0014] FIG. 5 is a block diagram of the ventilation system
according to an exemplary embodiment of the present invention;
and
[0015] FIG. 6 is a flow chart showing the steps and logic of the
air ventilation system according to an exemplary embodiment.
DETAILED DESCRIPTION
[0016] The detailed description of various exemplary embodiments of
the invention herein makes reference to the accompanying figures.
While these exemplary embodiments are described in sufficient
detail to enable those skilled in the art to practice the
invention, it should be understood that other embodiments may be
realized and that logical and mechanical changes may be made
without departing from the spirit and scope of the invention. Thus,
the detailed description herein is presented for purposes of
illustration only and not of limitation. Additionally, while the
disclosure herein describes the present invention used in
connection with semiconductor manufacturing and processing, it
should be noted that the air ventilation restriction system can be
used with any ventilation system or area receiving circulating
air.
[0017] In accordance with various exemplary embodiments of the
present invention, an air ventilation restriction system for use
with semiconductor manufacturing or processing equipment is
disclosed. The air ventilation restriction system is configured to
be used with an enclosure that houses one or more machines/tools
used for semiconductor manufacturing along with numerous volatile
or hazardous gasses that may be commonly present during any step of
the semiconductor manufacturing process.
[0018] The ventilation system of the present invention is an
automated or mechanically-operated system that adjusts vents on an
enclosure from a restricted state to an open state based on the
detection of a presence of one or more predetermined conditions
that require a high flow rate within the enclosure. For example,
the vents that can be adjusted include inlet, outlet, or any other
type of vents that allow air to flow into or out of the
enclosure.
[0019] In accordance with various embodiments, the ventilation
system generally comprises an enclosure where semiconductors are
manufactured or processed, the enclosure having various inlets,
outlets, and a door or other access panel.
[0020] For example, more specifically, in accordance with an
exemplary embodiment of the present invention and with reference to
FIGS. 1-5, an enclosed space such as an enclosure 12 used for
semiconductor manufacturing is equipped with a ventilation system
10. Enclosure 12 comprises a body, inlets 14, outlets 18, and an
access panel 16. The inlets 14 and outlets 18 are in fluid
communication with the enclosed space defined by enclosure 12. In
an exemplary embodiment, inlets 14 can be any opening or orifice
such as slits, holes, apertures, mesh screens, ducts, or any device
configured to allow air or other gasses to enter the enclosure 12.
Outlets 18 provide an exit for gases located within the enclosure
12. In an embodiment, ductwork (not shown) can extend from the
outlets 18 and is operatively connected to a vacuum or other
mechanism that causes gases within the enclosure to be withdrawn
therefrom through the outlets 18. In another embodiment, the
outlets 18 are slits, holes, apertures, mesh screens, ducts, or any
other device through which gases within the enclosure are
withdrawn. The enclosure 12 is configured to provide a pressure
differential between the interior of the enclosure 12 and the
location immediately adjacent to the external surface of the
outlets 18 such that the gases flow into the enclosure 12 through
the inlets 14 and exit the enclosure 12 through the outlets 18.
Accordingly, the flow rate of gases into the enclosure 12 via the
inlets 14 and out of the enclosure 12 via the outlets 18 can be
selectively adjustable at the inlets 14, the outlets 18, or a
combination thereof.
[0021] Further, access panel 16 can be a door mounted by hinges to
enclosure 12, a slideable door, a removable panel, or anything else
that grants a user access to enclosure 12. Inlets 14 and outlets 18
can located anywhere on enclosure 12 such as a fixed panel that may
form a sidewall of the enclosure 12 or on an access panel 16. The
present invention also contemplates that the air drawn through the
enclosure 12 is appropriately conditioned for semiconductor
manufacturing.
[0022] In this exemplary embodiment, enclosure 12 further comprises
exhaust pipes (not shown) and a filter 19 such as a HEPA filter
which is configured to remove dirt, debris, and other contaminants
from air that enters enclosure 12. Further, in one exemplary
embodiment, air that enters enclosure 12 is conditioned for
temperature, humidity, particles, and any other factor to make the
air suitable for semiconductor manufacturing.
[0023] Further, while the present disclosure is directed at a
specific embodiment where ventilation system 10 is used with
semiconductor manufacturing equipment, ventilation system 10 can be
used with any equipment or space that requires the use of
conditioned air. Further, in yet other embodiments, ventilation
system 10 can be applied to other applications where air may not be
pre-conditioned but must be treated after it has exited a confined
space such as enclosure 12.
[0024] As mentioned above, ventilation system 10 is an automated or
mechanically-operated ventilation system for enclosure 12 that
selectively adjusts the inlets 14 through which air and gases enter
the enclosure 12 or the outlets 18 through which air and gases exit
the enclosure 12 from a restricted flow rate to an open state,
thereby allowing air to flow through the enclosure 12 at an
unrestricted or higher flow rate. Ventilation system 10 is
typically in a restricted state to avoid excessive consumption of
conditioned air to reduce costs associated with conditioned air. In
one exemplary embodiment, ventilation system 10 is configured to
selectively adjust the inlet 14 through which air enters the
enclosure 12. In other exemplary embodiments, ventilation system 10
is configured to selectively adjust outlets 18 through which air
exits the enclosure 12. In yet another embodiment, the ventilation
system 10 is configured to selectively adjust both the inlets 14
and outlets 18 of the enclosure 12 between a restricted state and
an open state. It should be understood by one skilled in the art
that when the inlets 14 and/or outlets 18 are in the open state,
the inlets 14 and/or outlets 18 allow more air to flow therethrough
relative to when the inlets 14 and/or outlets 18 are in the
restricted state. It should also be understood by one skilled in
the art that the term "open state," as used herein, means that the
inlets 14 and/or the outlets 18 are fully open such that the flow
rate of gases flowing therethrough have little or no restriction.
It should also be understood by one skilled in the art that the
term "restricted state," as used herein, means that the inlets 14
and/or outlets 18 are either partially or fully closed such that
the flow rate of the gases flowing therethrough is less than the
flow rate flowing therethrough when the inlets 14 and/or outlets
are in the open state. In an embodiment, the inlets 14 and the
outlets 18 can be independently adjustable between the restricted
state and the open state. In another embodiment, the inlets 14 and
ducts can be simultaneously and correspondingly adjustable between
the restricted state and the open state.
[0025] In accordance with an exemplary embodiment of the present
invention and with reference to FIGS. 2-3, ventilation system 10
comprises actuator 20 which is in communication with inlet 14. The
exemplary embodiment of the ventilation system 10 is shown and
described with reference to controlling the flow rate of gases
through an inlet 14. However, it should be understood that the
ventilation system 10 can likewise be configured to control the
flow rate of gases through the outlets 18. Actuator 20 is any
mechanism that is capable of covering the inlet 14 or otherwise
adjusting inlets 14 to enable inlets 14 to be adjustable between
the restricted state and the open state.
[0026] In one exemplary embodiment, actuator 20 is a guillotine
style device and comprises a moveable panel 22 which is operatively
connected to a driving mechanism 24. Driving mechanism 24 can be
any mechanism configured to move moveable panel 22. Certain
exemplary driving mechanisms include pneumatic devices, piston
driven systems, air cylinders, electric motors, or any other such
similar mechanism. While moveable panel 22 is depicted as a
guillotine style blade in this exemplary embodiment, moveable panel
22 can be any device used to cover and/or obstruct gas flow through
the inlets 14. In certain exemplary embodiments, an access door
panel sensor is utilized and senses when movable panel 22 is about
to be opened and operates ventilation system 10 to reduce pressure
within enclosure 12 to enable access panel 22 to be opened
easily.
[0027] In the normal operating conditions of the semiconductor tool
having the enclosure 12, the inlets 14 are in a restricted state,
thereby reducing the amount of conditioned air flowing through the
enclosure 12. In certain exemplary embodiments, ventilation system
10 further comprises one or more sensors 11 that are operatively
connected to actuator 20 that control the operation of actuator 20.
When at least one sensor 11 detects the presence or absence of one
or more sensed conditions, the inlets 14 are selectively adjusted
from the restricted state to the open state to provide a high flow
rate of gases through the enclosure to scavenge volatile
undesirable gasses and/or other types of dangerous gasses that may
be present within enclosure 12 or to generally dilute the gases
within the enclosure 12.
[0028] For example, one sensed condition is when an operator of the
equipment is attempting to gain or gaining access to enclosure 12
by attempting to open or remove access panel 16. Another exemplary
sensed condition is when there is an integrity change within
enclosure 12 that may result from an unusually high volume of
volatile gasses, an explosion or an implosion within enclosure 12.
In yet other exemplary embodiments, sensor 11 can detect whether or
not the user desired that the inlets 14 be changed from a
restricted state to an open state based on user input. As such, a
user can selectively adjust the state of inlets 14 if they desire
if none of the sensed conditions are present to automatically
change the state of inlets 14. Certain sensed conditions comprise,
but are not necessarily limited to, a changes in temperature within
the enclosure 12, a change in pressure within the enclosure 12, a
change of gaseous composition within the enclosure 12, a change in
humidity level within the enclosure 12, a change in particulate
level within the enclosure 12, a fire within the enclosure 12, an
explosion within the enclosure 12, an implosion within the
enclosure 12, a change in amount of a particular gas within the
enclosure, and a change in percentage of a particular gas within
the enclosure 12.
[0029] Sensors 11 may also detect the presence or absence of two or
more conditions. For example, in such an embodiment, the first
condition is whether or not a user is obtaining access to enclosure
12 based on movement or attempted movement of access panel 16 or a
latch/lock used for opening access panel 16. The second condition
is whether the integrity within enclosure 12 has been compromised
by a release of toxic fumes, an explosion, an implosion, or any
atmospheric change that would create an explosion or other risk
within enclosure 12.
[0030] Upon sensing the presence of at least one sensed condition,
the sensor 11 sends a signal to actuator 20 which directs the
driving mechanism 24 to move the moveable panel 22 away from inlets
14 to adjust the inlet 14 to the open state to obtain a high flow
rate of gases therethrough. When the sensed condition is no longer
present as detected by sensor 11, a second signal is sent to
actuator 20 which in turn directs that driving mechanism 24 move
moveable panel 22 to return the inlet 14 to a restricted state.
Alternatively, the lack of a signal from sensor 11 indicates that
driving mechanism 24 should maintain the moveable panel 22 over the
inlet 14 in a restricted state.
[0031] In accordance with an embodiment of the present invention
and with reference to FIGS. 1 and 2, sensor 11 can sense whether or
not access panel 16 has been moved or the operator intends to move
access panel 16 to gain entry to enclosure 12. For example, sensor
11 can be a capacitance sensor located within a handle 26 used to
move access panel 16, though sensor 11 may alternatively comprise
other type of sensors that detect a user contacting handle 26 such
as a thermal sensor to detect body heat that would occur when a
user's hand touches handle 26. Other exemplary sensors comprise an
emergency power sensor and a thermal runaway sensor. Further,
sensor 11 can be disposed within a frame of enclosure 12 that
supports access panel 16. This type of sensor may comprise a two
piece sensor wherein one piece is in the frame and another is
located on the edge of access panel 16. When access panel 16 is
installed within enclosure 12, a signal is sent between the two
sensors. However, when access panel 16 is removed from enclosure
12, the signal is no longer sent between the two parts of sensor 11
indicating the occurrence of a sensed condition, namely an open
access panel 16.
[0032] In yet another exemplary embodiment, at least one sensor 11
is in communication with an operating mechanism that automatically
operates access panel 16. When this operating mechanism begins move
or remove access panel 16, sensor 11 sends a signal to actuator 20
to selectively adjust the inlet 14 from a restricted state to an
open state (or vice versa) depending on whether access panel is
being removed from enclosure 12 or replaced.
[0033] In another embodiment, the sensor 11 can be eliminated such
that the actuator 20 is mechanically coupled or otherwise linked to
access panel 16. In this exemplary embodiment depicted in FIG. 3, a
mechanical coupling 28, such as a clevis mount (not shown) or any
other similar device, attaches driving mechanism 24 to access panel
16. Therefore, the movement of access panel 16 causes the driving
mechanism 24 to move moveable panel 22 when the handle 26 is
operated. Accordingly, as the handle 26 is lifted or moved to
remove the access panel 16, the driving mechanism 24 moves the
moveable panel 22, thereby selectively adjusting the inlet 14 from
a restricted state to an open state to increase the flow rate of
gases through the inlet 14.
[0034] In this embodiment, access panel 16 is configured to move
within the body of enclosure 12 upwards in the direction of arrows
A. In other exemplary embodiments, access panel 16 can be moved
downwards in the opposite direction than that depicted. In yet
other embodiments, access panel can be moved side to side. This
movement of access panel 16 moves both the coupling mechanism 28
and the driving mechanism 24, which in turn pulls moveable panel 22
upwardly to allow inlet 14 to be in the open state and enclosure 12
to have a high flow rate therethrough. When the door is moved back
to the closed position, it in turn moves coupling mechanism 28 and
driving mechanism 24 and moveable panel 22 back over inlet 14
placing inlet 14 in a restricted state.
[0035] In accordance with another exemplary embodiment of the
present invention and with reference to FIGS. 4A and 4B, the grate
21 of the inlet 14 is itself selectively adjustable between an open
state (FIG. 4A) and a restricted state (FIG. 4B). In this exemplary
embodiment, the handle 26 of the access panel 16 is mechanically
coupled to the grate 21 of the inlet 14 by a rod 30 and configured
to move the grate 21 upwardly in the direction of arrow A. The rod
30 operatively connects the access panel 16 and the grate 21 of the
inlet 14. Movement of the handle 26 in the upwardly or downwardly
direction relative to arrow A causes the access panel 16 to move in
a corresponding manner. As the handle 26 is lifted to open the
access panel 16 or the handle 26 is lowered to lock the access
panel 16, the rod 30 translates or moves in a corresponding manner,
thereby selectively adjusting the grate 21 of the inlet 14 between
the open and restricted states. In other exemplary embodiments,
access panel 16 can be moved side to side or any other direction in
which movement of the handle 26 and access panel 16 causes the
inlet 14 to be adjusted between the open and restricted states.
When access panel 16 is moved upward in the direction of arrows A,
rod 30 is also moved upward thereby placing inlets 14 in an open
state as depicted in FIG. 4B.
[0036] In other exemplary embodiments, rod 30 can be coupled to a
motor instead of completely depending upon the movement of handle
26 or access panel 16. In yet other exemplary embodiments, at least
one sensor 11 can be used as described above to send a signal to a
motor coupled to rod 30 and operate the grate 21 of the inlet 14 as
described above based on the presence or absence of certain
conditions.
[0037] Besides the attempted or actual movement of the handle 26 or
the access panel 16 in various embodiments, ventilation system 10
may be activated depending on whether or not the integrity within
enclosure 12 has been compromised. As used herein, the term
"integrity" denotes any change of atmosphere, gaseous composition,
humidity level, particulate level, fire, temperature, explosion,
implosion, pressure change, a certain amount of a particular gas, a
percentage of a particular gas or any other atmospheric change they
may occur within enclosure 12.
[0038] In this exemplary embodiment, a sensor 11 can sense the
change of integrity within enclosure 12 and then send a signal to
the actuator 20 (FIG. 2). Actuator 20 then directs the driving
mechanism 24 to move moveable panel 22 upwardly (e.g. as depicted
in FIG. 2.) thereby placing the inlet 14 in an open state allowing
for a high flow rate. Certain exemplary sensors 11 to sense for and
detect integrity changes comprise, but are certainly not limited
to, a chamber presence sensor, a gas leak detector sensor, an
emergency power off (EPO), thermal run away sensor.
[0039] In accordance with another exemplary embodiment and with
reference to FIG. 5, a block diagram depicts the connection between
various sensors 11 of the ventilation system 10 and the actuator
20. In this exemplary embodiment, a door sensor 36, a pressure
sensor 38, and a temperature gauge 40 are each operatively
connected to a signal generator 34. When any of the sensors 36, 38,
40 senses the presence or absence of a sensed condition, the
corresponding sensor 36, 38, 40 sends a signal to the signal
generator 34. The signal generator 34 receives the signal from the
sensors 36, 38, 40 that indicates a change in a sensed condition
and sends a corresponding signal to the actuator 20. The actuator
20 then selectively adjusts the inlet 14 to the open or restricted
state, depending upon the signal provided by the signal generator
34.
[0040] As can be appreciated by one of ordinary skill in the art,
pressure sensor 38 and temperature gauge 40 sense the pressure and
temperature within enclosure 12. Further, the door sensor 36 senses
whether or not access panel 16 has been moved or the operator
intends to move the access panel 16 by gripping the handle 26 when
the door sensor 36 is a capacitance sensor as described above. The
signal generator 34 monitors the various inputs from sensors 36,
38, 40 and directs the ventilation system 10 to respond as outlined
above. For example, if door sensor 36 indicated that a user's hand
was on handle 26, or alternatively, if pressure sensor 38 indicated
that pressure had increased dramatically within enclosure 12, the
corresponding sensor would send a signal to the signal generator 34
that would determine the present state of the inlet 14 and
determine if a signal should be sent to the actuator 20 to adjust
the state of the inlet 14. For example, if the pressure sensor 38
senses a change in pressure within the enclosure 12, the pressure
sensor 38 would send a signal to the signal generator 34. If the
inlet 14 is currently in the restricted state, the signal generator
34 would send a signal to the actuator 20 to adjust the inlet 14
from the restricted state to the open state in which the flow rate
of gas through the inlet 14 and the enclosure 12 is increased. If
the door sensor 36 then senses a change in condition, such as an
operator opening the access panel 16, the door sensor 36 would send
a signal to the signal generator 34. However, the signal generator
34 verifies that the inlet 14 is already in the open state due to
the previous pressure change and subsequent adjustment of the state
of the inlet 14. In an embodiment, the signal generator 34 sends a
signal to the actuator 20 to maintain the inlet 14 in the open
state. In another embodiment, the signal generator would not send a
signal to the actuator 20, thereby maintaining the inlet 14 in the
open state. The signal generator 34 sends a signal to the actuator
20 to adjust the inlet 14 from the open state to the restricted
state when the sensed condition of both sensors 36, 38 is no longer
sensed by the corresponding sensor and the signal generator 34
receives a signal from both sensors 36, 38 indicating that the
sensed condition is no longer present.
[0041] In accordance with another exemplary embodiment of the
present invention and with reference FIG. 6, a flow chart depicting
certain exemplary steps of operation for ventilation system 10 is
depicted. At a step 42, inlets 14 are in a restricted state and no
action from ventilation system 10 is required. At a decision point
44, the sensors determine whether an operator is attempting to
access enclosure 12. If the answer is yes, ventilation system 10
adjusts inlets 14 to be in an open state. If the answer is no,
ventilation system 10 directs that inlets 14 remain in the
restricted state.
[0042] Alternatively, at decision point 46 the sensors 11 detect
whether or not the integrity within enclosure 12 has changed in any
way or been compromised. If yes, ventilation system 10 adjusts
inlets 14 to the open state as described above. If no, ventilation
system 10 ensures that inlets 14 remain in the restricted
state.
[0043] Finally, various principles of the invention have been
described in illustrative embodiments. However, many combinations
and modifications of the above-described structures, arrangements,
proportions, elements materials and components, used in the
practice of the invention, in addition to those not specifically
described, can be varied without departing from those
principles.
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