U.S. patent application number 12/018920 was filed with the patent office on 2009-07-09 for method for manufacturing metallic panel having multilayer arrays of micropores.
Invention is credited to Chang-Li Liu, Che-Tung Wu.
Application Number | 20090173713 12/018920 |
Document ID | / |
Family ID | 40843742 |
Filed Date | 2009-07-09 |
United States Patent
Application |
20090173713 |
Kind Code |
A1 |
Liu; Chang-Li ; et
al. |
July 9, 2009 |
Method for Manufacturing Metallic Panel Having Multilayer Arrays Of
Micropores
Abstract
A method for manufacturing a metallic panel having multilayer
arrays of micropores includes the steps of: preparing a metallic
thin plate first; forming a plurality of micropores and hollowed
portions on the metallic thin plate with the hollowed portion
forming a key body; arranging the plurality of micropores to form a
pattern on the surface of the key body; and cutting the metallic
thin plate to form a metallic panel of a predetermined shape. Then,
a multilayer backlight module is arranged on one side surface of
the metallic panel via a hot pressing or adhering process. Finally,
a telecommunication module is adhered on one side surface of the
backlight module. In this way, the metallic panel having multilayer
arrays of micropores can be completed.
Inventors: |
Liu; Chang-Li; (Gueishan,
TW) ; Wu; Che-Tung; (Gueishan, TW) |
Correspondence
Address: |
HDLS Patent & Trademark Services
P.O. BOX 220746
CHANTILLY
VA
20153-0746
US
|
Family ID: |
40843742 |
Appl. No.: |
12/018920 |
Filed: |
January 24, 2008 |
Current U.S.
Class: |
216/20 ;
156/256 |
Current CPC
Class: |
H01H 2209/002 20130101;
H04M 1/22 20130101; H01H 2209/07 20130101; H01H 2219/062 20130101;
Y10T 156/1062 20150115; H01H 2231/022 20130101; H01H 13/705
20130101; H01H 2219/058 20130101; H01H 2219/044 20130101; H04M 1/23
20130101; H01H 13/83 20130101; H01H 13/88 20130101; H01H 2221/004
20130101; H01H 2229/00 20130101; H01H 2219/054 20130101; H01H
13/7006 20130101 |
Class at
Publication: |
216/20 ;
156/256 |
International
Class: |
C23F 1/00 20060101
C23F001/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 3, 2008 |
TW |
097100206 |
Claims
1. A method for manufacturing a metallic panel having multilayer
arrays of micropores, the metallic panel being disposed on a
surface of an electronic device, the method comprising the steps
of: (a) preparing a metallic thin plate; (b) forming arrays of
micropores on the metallic thin plate, the arrays of micropores
forming patterns; (c) cutting the metallic thin plate to form a
metallic panel of a predetermined shape; and (d) adhering a
multilayer backlight module on one side surface of the metallic
panel.
2. The method according to claim 1, wherein the metallic thin plate
prepared in the step (a) is any one of a stainless steel (SUS) or
Al--Mg alloy.
3. The method according to claim 1, wherein the metallic thin plate
prepared in the step (a) further comprises stripe-like hollowed
portions, and each strip-like hollowed portion forms a key
body.
4. The method according to claim 1, wherein the pattern formed in
the step (b) is formed on a key body.
5. The method according to claim 1, wherein the pattern formed in
the step (b) comprises any one of numerals, characters, special
symbols and direction symbols.
6. The method according to claim 1, wherein filler is filled in the
micropores prior to performing the step (c).
7. The method according to claim 6, wherein the filler is any one
of UV glue, silicone, Vitro, epoxy or synthetic resin.
8. The method according to claim 1, wherein the multilayer
backlight module of the step (d) is formed by adhering at least a
first and second light-guiding plates on one side surface of the
metallic panel, the first and second light-guiding plates are
formed on one side of the metallic panel via a hot pressing or
adhering process, the first and second light-guiding plates have
first and second light-guiding microstructures respectively, and
the first and second light-guiding microstructures are arranged
alternatively on the key body.
9. The method according to claim 8, wherein a first set of
light-emitting units and a second set of light-emitting units are
arranged on the first and second light-guiding plates respectively,
a first shielding unit and a second shielding unit are arranged
above the first and second sets of light-emitting units and the
first and second light-guiding plates respectively.
10. The method according to claim 8, wherein the first and second
sets of light-emitting units are constituted of a plurality of
light-emitting diodes having the same or different colors.
11. The method according to claim 8, wherein the first and second
light-guiding microstructures on the first and second light-guiding
plates are recessed in or protrude from one side surface of the
first and second light-guiding plates.
12. A method for manufacturing a metallic panel having multilayer
arrays of micropores, the metallic panel being disposed on a
surface of an electronic device, the method comprising the steps
of: (a) preparing a metallic thin plate; (b) forming arrays of
micropores on the metallic thin plate, the arrays of micropores
forming patterns; (c) cutting the metallic thin plate to form a
metallic panel of a predetermined shape; (d) adhering a multilayer
backlight module on one side surface of the metallic panel; and (e)
adhering a telecommunication module on one side surface of the
multilayer backlight module.
13. The method according to claim 12, wherein the metallic thin
plate prepared in the step (a) is any one of a stainless steel
(SUS) or Al--Mg alloy.
14. The method according to claim 12, wherein the metallic thin
plate prepared in the step (a) further comprises stripe-like
hollowed portions, and each strip-like hollowed portion forms a key
body.
15. The method according to claim 12, wherein the pattern formed in
the step (b) is formed on a key body.
16. The method according to claim 12, wherein the pattern formed in
the step (b) comprises any one of numerals, characters, special
symbols and direction symbols.
17. The method according to claim 12, wherein a filler is filled in
the micropores prior to performing the step (c).
18. The method according to claim 17, wherein the filler is any one
of UV glue, silicone, Vitro, epoxy or synthetic resin.
19. The method according to claim 12, wherein the multilayer
backlight module of the step (d) is formed by adhering at least a
first and second light-guiding plates on one side surface of the
metallic panel, the first and second light-guiding plates are
formed on one side of the metallic panel via a hot pressing or
adhering process, the first and second light-guiding plates have
first and second light-guiding microstructures respectively, the
first and second light-guiding microstructures are arranged
alternatively on the key body.
20. The method according to claim 19, wherein a first set of
light-emitting units and a second set of light-emitting units are
arranged on the first and second light-guiding plates respectively,
a first shielding unit and a second shielding unit are arranged
above the first and second sets of light-emitting units and the
first and second light-guiding plates respectively.
21. The method according to claim 20, wherein the first and second
sets of light-emitting units are constituted of a plurality of
light-emitting diodes having the same or different colors.
22. The method according to claim 19, wherein the light-guiding
microstructures on the two light-guiding plates are recessed in or
protrude from one side surface of the light-guiding plates.
23. The method according to claim 12, wherein the telecommunication
module of the step (e) has a flexible printed circuit board, the
circuit board has thereon a plurality of contacting points, each
contacting point corresponds to a metal dome, a film layer is
arranged on one side surface of the circuit board and the metal
dome, a protrusion is provided on one side surface of a protruding
portion of the film layer.
24. The method according to claim 13, wherein the telecommunication
module of the step (e) has a flexible printed circuit board, the
circuit board has thereon a plurality of contacting points, each
contacting point corresponds to a metal dome, a film layer is
arranged on one side surface of the circuit board and the metal
dome.
Description
RELATED APPLICATIONS
[0001] U.S. patent application Ser. No. 11/560,962 filed on Nov.
17, 2006, Ser. No. 11/957,771 filed on Dec. 17, 2007 and Ser. No.
12/014,857 filed on Jan. 17, 2006 are submitted as related
applications.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a panel, and in particular
to a method for manufacturing a metallic key panel.
[0004] 2. Description of Prior Art
[0005] As shown in FIGS. 1(a) and 1(b), US Patent Publication No.
2007/0205986A1 discloses a metallic panel 10a having an elastic
layer 1a. One side surface of the elastic layer 1a has a plurality
of protrusions 11a. The other side surface of the elastic layer 1a
is arranged with a plurality of metallic keys 2a to correspond to
the protrusions 11a. The metallic key 2a has a hollowed portion 21a
with a corresponding pattern. A light transmittable resin layer 22a
is filled in the hollowed portion 21a. When the metallic key panel
10a is disposed in a base 20a of an electronic device, the metallic
key panel 10a is located on a telecommunication module 30a. The
telecommunication module 30a has a printed circuit board 31a. The
circuit board 31a has a plurality of immovable contacting points
32a. A metallic sheet 33a is disposed on the circuit board 31a. The
metallic sheet 33a has a plurality of convex metal domes 331a. The
metal dome 331a corresponds to each contacting point 32a, and the
other side surface of the metal sheet 331a corresponds to the
protrusion 11a. When the metallic key 2a is pressed, the protrusion
11a is caused to press the surface of the metal dome 331a, so that
the metal dome 331a is deformed and brought into contact with the
contacting point 32a, thereby generating an electronic signal
output. Further, when a backlight source is lighted up, the light
of the backlight source can pass through the resin layer 22a of the
metallic key 2a, so that the user can see the position of each key
clearly.
[0006] Although the above-mentioned metallic key panel 10a has been
manufactured to a compact extent and can be mounted in a
small-volume electronic device, during the manufacturing process,
it is necessary to fill the individual hollowed portions 21a on the
metallic key 2a with the resin layer 22a, and each of the metallic
keys 2a has to be adhered onto one side surface of the elastic
layer 1a accurately. As a result, the manufacturing process takes a
lot of time and labors and is not simple. After the metallic key
panel 10a is combined with the base 20a, a gap is formed between
the periphery of the metallic key 2a and the base 20a, and the gap
may be filled by external dusts or penetrated by moisture easily.
As a result, the metallic key cannot be pressed smoothly or an
internal short circuit may occur. Further, when the backlight
source of the metallic panel 10a is lighted up, the hollowed
portion 21a of the key 2a merely displays single luster. Therefore,
the external appearance and the overall visual effect of the
metallic key panel are dull.
SUMMARY OF THE INVENTION
[0007] In view of the above drawbacks, the present invention is to
provide a metallic panel that is simple in structure and can be
manufactured easily. Further, it has a multilayer backlight source,
thereby increasing the whole external appearance and visual effect
of the metallic key panel. Further, filler can be applied on the
metallic panel, thereby protecting against the dust and the
penetration of moisture.
[0008] The present invention is to provide a method for
manufacturing a metallic panel having multilayer arrays of
micropores, which includes the steps of: preparing a metallic thin
plate first; performing an etching process to the metallic thin
plate so as to form a plurality of micropores and hollowed portions
on the metallic thin plate with each hollowed portion forming a key
body; arranging the plurality of micropores to form a pattern on
the surface of the key body; and cutting the metallic thin plate to
form a metallic panel of a predetermined shape. Then, a first and a
second light-guiding plate are adhered on one side surface of the
metallic panel. The first and second light-guiding plates are
formed on one side of the metallic panel via a hot pressing or
adhering process. The first and second light-guiding plates are
pressed to form first and second light-guiding microstructures
corresponding to the pattern of the key body. The first and second
light-guiding microstructures are arranged alternatively. A first
and a second set of light-emitting units are disposed on one end of
the first and second light-guiding plates, respectively. A first
and a second shielding unit are disposed on the first and second
light-guiding plates and the first and second sets of
light-emitting units respectively. Finally, a telecommunication
module is adhered on one side surface of the backlight module. The
telecommunication module has a flexible printed circuit board. The
circuit board is provided thereon with a plurality of contacting
points. Each contacting point corresponds to a metal dome. A film
layer is arranged on one side surface of the circuit board and the
metal dome. A protrusion is provided on one side surface of the
protruding portion of the film layer.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIGS. 1(a) and 1(b) are schematic views showing a
conventional metallic key panel;
[0010] FIG. 2 is a schematic view showing the method for
manufacturing the metallic panel of the present invention;
[0011] FIGS. 3(a) to 3(d) are schematic views showing the
respective structures generated by the method for manufacturing the
metallic panel of the present invention;
[0012] FIG. 4 is an exploded view showing the metallic panel and
the backlight module of the present invention;
[0013] FIG. 5 is a side view of FIG. 4;
[0014] FIG. 6(a) is an assembled side view showing the metallic
panel, the backlight module and the telecommunication module of the
present invention;
[0015] FIG. 6(b) is a schematic view showing a pressing action of
the present invention;
[0016] FIG. 7 is an assembled side view showing the metallic panel,
the backlight module and another telecommunication module of the
present invention;
[0017] FIG. 8 is a schematic view showing another embodiment of the
present invention;
[0018] FIG. 9 is a schematic view showing the metallic panel of the
present invention being used in a mobile phone;
[0019] FIG. 10 is a schematic view showing the metallic panel of
the present invention being used in a personal digital assistant;
and
[0020] FIG. 11 is a schematic view showing the metallic panel of
the present invention being used in an automobile stereo panel.
DETAILED DESCRIPTION OF THE INVENTION
[0021] The detailed description and technical contents of the
present invention will be explained with reference to the
accompanying drawings.
[0022] With reference to FIG. 2, it is a flow chart showing the
method for manufacturing a metallic panel having multilayer arrays
of micropores. As shown in this figure, according to the present
invention, the method for manufacturing a metallic key panel having
arrays of micropores includes the following steps. First, in the
step 100, a metallic thin plate 10 is prepared as shown in FIG.
3(a). The metallic thin plate 10 is any one of a stainless steel
(SUS) or Al--Mg alloy.
[0023] In the step 102, an etching process is applied to the
metallic thin plate 10 so as to form a plurality of micropores 11
and hollowed portions 12 on the metallic thin plate 10. The
hollowed portion 12 is formed as a key body 13. The plurality of
micropores 11 is arranged to form a pattern 14 on the surface of
the key body 13, as shown in FIG. 3(b). The above-mentioned pattern
14 is any one of numerals, characters, specific symbols ("#", "*",
".") and direction symbols.
[0024] In the step 104, the metallic thin plate 10 is cut to form a
metallic panel 1 of a predetermined shape, as shown in FIGS. 3(c)
and 3(d).
[0025] In the step 106, a backlight module 2 is adhered, as shown
in FIGS. 4 and 5. A plate-like first light-guiding plate 21 and a
second light-guiding plate 22 are adhered on one side surface of
the metallic panel 1. The first light-guiding plate 21 and the
second light-guiding plate 22 can be formed on one side of the
metallic panel 1 via a hot pressing or adhering process. The first
light-guiding plate 21 and the second light-guiding plate 22 are
pressed to form first light-guiding microstructures 211 and second
light-guiding microstructures 221 each corresponding to the pattern
14 of the key body 13. The first light-guiding microstructure 211
and the second light-guiding microstructure 221 are arranged
alternatively on the key body 13. Further, a first set of
light-emitting units 23 and a second set of light-emitting units 24
are arranged on one end of the first light-guiding plate 21 and a
second light-guiding plate 22, respectively. A sheet-like first
shielding unit 25 and a sheet-like second shielding unit 26 are
arranged above the first set of light-emitting units 23 and the
second set of light-emitting units 24, respectively. The first
shielding unit 25 or the second shielding unit 26 shields the light
generated by the first set of light-emitting units 23 or the second
set of light-emitting units 24, thereby avoiding the mutual
interference of light. The first set of light-emitting units 23 and
the second set of light-emitting units 24 are constituted of a
plurality of light-emitting diodes of the same or different colors.
The above-mentioned first and second light-guiding microstructures
211, 221 are recessed in the first and second light-guiding plates
21, 22, or protrude from one side surfaces of the first and second
light-guiding plates 21, 22, respectively.
[0026] In the step 108, a telecommunication module 3 is adhered, as
shown in FIG. 6. A telecommunication module 3 is adhered on one
side surface of the backlight module 2. The telecommunication
module 3 has a flexible printed circuit board (FPCB) 31. The
circuit board 31 is provided thereon with a plurality of contacting
points 311. Each contacting point 311 corresponds to a metal dome
32. A film layer 33 is disposed on one side surface of the circuit
board 31 and the metal dome 32. One side surface of the protruding
portion of the film layer 33 is provided with a protrusion 34. The
protrusion 34 corresponds to the first and second light-guiding
microstructures 211, 221 of the first and second light-guiding
plates 21, 22.
[0027] With reference to FIG. 5, it is a schematic view showing the
backlight module of the present invention after being lighted up.
As shown in this figure, under the control of the circuit (not
shown) of an associated electronic device, when one of the first
set of light-emitting units 23 and the second set of light-emitting
units 24 are lighted up, the light generated by the first set of
light-emitting units 23 or the second set of light-emitting units
24 enters one end of the first light-guiding plate 21 or the second
light-guiding plate 22. Then, the light 4 is reflected by the first
light-guiding microstructure 211 or the second light-guiding
microstructure 221 onto the key body 13. The light 4 passes through
the plurality of micropores 11 to display the pattern 14 on the
surface of the key body 13. When one of the first set of
light-emitting units 23 and the second set of light-emitting units
24 are lighted up, only the patterns 14 on several rows or lines of
key bodies 13 on the metallic panel 1 can be displayed, thereby
facilitating the user to operate a TV game or multimedia.
[0028] When the first set of light-emitting units 23 and the second
set of light-emitting units 24 are lighted up at the same time, the
patterns 14 on several rows or lines of key bodies 13 on the
metallic panel 1 are displayed to have the same color, while some
other rows or lines will display another color. Alternatively, the
lights generated by the first set of light-emitting units 23 and
the second set of light-emitting units 24 are mixed to generate a
light 4 of a third kind of color.
[0029] Please refer to FIGS. 6(a) and 6(b). FIG. 6(a) is an
assembled side view showing the metallic panel, the backlight
module and the telecommunication module of the present invention,
and FIG. 6(b) is a schematic view showing a pressing action of the
present invention. As shown in these figures, when the surface of
the key body 13 of the metallic panel 1 is pressed, the key body 13
is deformed to cause the protrusion 34 to press on the film layer
33. As a result, the metal dome 32 is deformed and pressed to
contact with the contacting point 311, thereby generating a
conductive signal output.
[0030] When one side surface of the metallic key panel 1 is not
pressed by an external force, due to the elasticity of the metallic
panel 1 and the metal dome 32, the metallic panel 1 may rise
automatically to its original state.
[0031] Please refer to FIG. 7, which is an assembled side view
showing the metallic panel, the backlight module and another
telecommunication module of the present invention. As shown in this
figure, another telecommunication module 3 is arranged on one side
surface of the backlight module. The telecommunication module has a
flexible printed circuit board (FPCB) 31. The circuit board 31 is
provided thereon with a plurality of contacting points 311. Each
contacting point 311 corresponds to a metal dome 32. A film layer
33 is arranged on one side surface of the circuit board 31 and the
metal dome 32. The metal dome 33 corresponds to the first and
second light-guiding microstructures 211, 221 on the first and
second light-guiding plates 21, 22.
[0032] When the surface of the key body 13 on the metallic panel 1
is pressed by an external force, the key body 13 is deformed to
press the film layer 33. As a result, the metal dome 32 is deformed
and pressed to contact with the contacting point 311, thereby
generating a conductive signal output.
[0033] When one side surface of the metallic key panel 1 is not
pressed by an external force, due to the elasticity of the metallic
panel 1 and the metal dome 32, the metallic panel 1 may rise
automatically to its original state.
[0034] Please refer to FIG. 8, it is a schematic view showing
another embodiment of the present invention. As shown in this
figure, the plurality of micropores 11 on the metallic panel 1 can
be filled with filler 5. Alternatively, the filler can be applied
on the surface of the metallic key panel 1 with the filler 5
penetrating into the micropores 11, thereby avoiding the
accumulation of dust and the penetration of moisture. In this
figure, the filler 5 can be any one of UV glue, silicone, Vitro,
epoxy or synthetic resin.
[0035] With reference to FIG. 9, it is a schematic view showing the
metallic panel of the present invention being used in a mobile
phone. As shown in this figure, after the metallic panel 1 of the
present invention is manufactured completely, it can be applied to
a mobile phone 6. When the light illuminates the metallic panel 1,
the metallic panel 1 generates a backlight of a luster, thereby
increasing the aesthetic feeling of the mobile phone 6.
[0036] With reference to FIG. 10, it is a schematic view showing
the metallic panel of the present invention being used in a
personal digital assistant. As shown in this figure, after the
metallic panel 1 of the present invention is manufactured
completely, in addition to the mobile phone 6, it can be applied to
a personal digital assistant (PDA) 7. When the light illuminates
the metallic panel 1, it generates a backlight of a luster, thereby
increasing the aesthetic feeling of the personal digital assistant
(PDA) 7.
[0037] With reference to FIG. 11, it is a schematic view showing
the metallic panel of the present invention being used in an
automobile stereo panel. As shown in this figure, after the
metallic panel 1 of the present invention is manufactured
completely, in addition to the mobile phone 6 and the personal
digital assistant (PDA) 7, it can be mounted in an automobile
stereo panel 8, thereby controlling the operations of an air
conditioning system, audio-video system and satellite navigation
system.
[0038] Although the present invention has been described with
reference to the foregoing preferred embodiments, it will be
understood that the invention is not limited to the details
thereof. Various equivalent variations and modifications can still
occur to those skilled in this art in view of the teachings of the
present invention. Thus, all such variations and equivalent
modifications are also embraced within the scope of the invention
as defined in the appended claims.
* * * * *