U.S. patent application number 12/006118 was filed with the patent office on 2009-07-02 for folded gradient terminal board end connector.
This patent application is currently assigned to GENERAL ELECTRIC COMPANY. Invention is credited to Bruce Courtney Campbell Amm, Tunc Icoz, Yogen Vishwas Utturkar, Wensen Wang, Weijun Yin.
Application Number | 20090167306 12/006118 |
Document ID | / |
Family ID | 40748607 |
Filed Date | 2009-07-02 |
United States Patent
Application |
20090167306 |
Kind Code |
A1 |
Wang; Wensen ; et
al. |
July 2, 2009 |
FOLDED GRADIENT TERMINAL BOARD END CONNECTOR
Abstract
A folded gradient terminal board end connector includes a
multi-layer terminal connection board having a plurality of
connection paths and vias configured to provide intercrossing
between a plurality of folded gradient coils and further to provide
symmetry between the plurality of folded gradient coils without
spatial interference between folded portions of the plurality of
folded gradient coils to optimize the folded gradient coil
efficiency.
Inventors: |
Wang; Wensen; (Clifton Park,
NY) ; Amm; Bruce Courtney Campbell; (Clifton Park,
NY) ; Yin; Weijun; (Niskayuna, NY) ; Utturkar;
Yogen Vishwas; (Latham, NY) ; Icoz; Tunc;
(Schenectady, NY) |
Correspondence
Address: |
GENERAL ELECTRIC COMPANY;GLOBAL RESEARCH
PATENT DOCKET RM. BLDG. K1-4A59
NISKAYUNA
NY
12309
US
|
Assignee: |
GENERAL ELECTRIC COMPANY
Schenectady
NY
|
Family ID: |
40748607 |
Appl. No.: |
12/006118 |
Filed: |
December 29, 2007 |
Current U.S.
Class: |
324/322 |
Current CPC
Class: |
G01R 33/4215 20130101;
G01R 33/3858 20130101 |
Class at
Publication: |
324/322 |
International
Class: |
G01R 33/28 20060101
G01R033/28 |
Claims
1. A folded gradient terminal board end connector comprising a
multi-layer terminal connection board having a plurality of
connection paths and vias configured to provide intercrossing
between a plurality of folded gradient coils and further to provide
symmetry between the plurality of folded gradient coils without
spatial interference between folded portions of the plurality of
folded gradient coils to optimize efficiency of a folded gradient
coil assembly comprising the plurality of folded gradient
coils.
2. The folded gradient terminal board end connector according to
claim 1, wherein the symmetry between the plurality of folded
gradient coils is provided by a folded gradient coil assembly outer
surface Y-axis shield coil that surrounds an X-axis shield coil
that surrounds a Y-axis primary coil that surrounds an X-axis
primary coil that lies on the inner surface of the folded gradient
coil assembly.
3. The folded gradient terminal board end connector according to
claim 1, wherein the connection paths comprise copper cracks having
a desired thickness, wherein the tracks are bounded to a high
thermal dielectric material using a thermal bonding procedure of
prepreg that provides a desired level of thermal conduction and
insulation,
4. The folded gradient terminal board end connector according to
claim 1, wherein the plurality of gradient coils are interfaced
using solely the same outer surface of the board end connector such
that the board end connector becomes the folded part of the folded
gradient coil assembly.
5. The folded gradient terminal board end connector according to
claim 1, wherein the folded gradient coil assembly is configured as
a magnetic resonance imaging system gradient coil.
6. A terminal board end connector comprising a multi-layer terminal
connection board having a plurality of connection paths and vies
configured to receive and interface a plurality of coil end leads
to provide coupling symmetry between a plurality of coils and to
optimize spatial and operating efficiency between the plurality of
symmetrically coupled coils, wherein plurality of coils are
together configured as a magnetic resonance imaging system gradient
coil.
7. The terminal board end connector according to claim 6, wherein
the connection paths comprise copper tracks having a desired
thickness, and further wherein the tracks are bounded to a high
thermal dielectric material using a lamination procedure that
provides a desired level of thermal conduction and insulation.
8. The terminal board end connector according to claim 6, wherein
the plurality of coils are interfaced using solely the same outer
surface of the board end connector.
9. (canceled)
10. The terminal board end connector according to claim 6, wherein
the plurality of coils are configured as closed slot electric
machine stator coils.
11. A method of connecting a plurality of folded gradient coils
comprises: providing a folded gradient terminal board end connector
having a plurality of connection paths and vias; and connecting a
plurality of corresponding folded gradient coil end leads to the
end connector to provide a folded gradient coil assembly having
symmetry between a plurality of folded gradient coils without
spatial interference between folded portions of the plurality of
folded gradient coils to optimize coil efficiency of the plurality
of folded gradient coils.
12. The method according to claim 11, wherein providing a folded
gradient terminal board end connector having a plurality of
connection paths and vias comprises providing a folded gradient
terminal board end connector including copper tracks having a
desired thickness, wherein the tracks are bound to a high thermal
dielectric material using a lamination procedure that provides a
desired Level of thermal conduction and insulation.
13. The method according to claim 11, wherein connecting a
plurality of corresponding folded gradient coil end leads to the
end connector to provide a folded gradient coil assembly having
symmetry between a plurality of folded gradient coils without
spatial interference between folded portions of the plurality of
folded gradient coils to optimize coil efficiency of the plurality
of folded gradient coils comprises connecting a plurality of
corresponding folded gradient coil end leads to the end connector
such that the symmetry between the plurality of folded gradient
coils is provided by a folded gradient coil assembly outer surface
Y-axis shield coil that surrounds an X-axis shield coil that
surrounds a Y-axis primary coil that surrounds an X-axis primary
coil that lies on the inner surface of the folded gradient coil
assembly.
14. The method according to claim 11, wherein connecting a
plurality of corresponding folded gradient coil end leads to the
end connector to provide a folded gradient coil assembly having
symmetry between a plurality of folded gradient coils without
spatial interference between folded portions of the plurality of
folded gradient coils to optimize coil efficiency of the plurality
of folded gradient coils comprises connecting the plurality of
corresponding folded gradient coil end leads solely to the same
outer surface of the board end connector such that the board end
connector becomes the folded part of the folded gradient coil
assembly.
15. The method according to claim 11, wherein connecting a
plurality of corresponding folded gradient coil end leads to the
end connector to provide a folded gradient coil assembly comprises
connecting a plurality of corresponding folded gradient coil end
leads to the end connector to provide a magnetic resonance imaging
system gradient coil.
16. A method of interconnecting a plurality of coils comprises:
providing a multi-layer terminal board end connector having a
plurality of connection paths and vias configured to receive a
plurality of coil end leads; and connecting the plurality of coil
end leads to the end connector to provide coupling symmetry between
a plurality of corresponding coils and to optimize spatial and
operating efficiency between the plurality of symmetrically coupled
coils, wherein connecting the plurality if coil end leads to the
end connector comprises connecting the plurality of coil end leads
solely to the same outer surface of the board end connector to form
a magnetic resonance imaging system gradient coil.
17. The method according to claim 16, wherein providing a
multi-layer terminal board end connector having a plurality of
connection paths and vias comprises providing a multi-layer
terminal board end connector including copper tracks having a
desired thickness, wherein the tracks are bound to a high thermal
dielectric material using a lamination procedure that provides a
desired level of thermal conduction and insulation.
18. The method according to claim 16, wherein connecting the
plurality of coil end lends to the end connector comprises
connecting the plurality of coil end leads solely to the same outer
surface of the board end connector.
19. (canceled)
20. The method according to claim 16, wherein connecting the
plurality of coil end leads to the end connector comprises
connecting the plurality of coil end leads solely to the same outer
surface of the board end connector to form a plurality of closed
slot electric machine stator coils.
Description
BACKGROUND
[0001] The invention relates generally to magnetic resonance
imaging (MRI) systems. In particular, the invention relates to a
terminal board end connector for the construction of a folded
gradient coil in a MRI system.
[0002] The embodiments described here are particularly directed to
the construction of a folded gradient coil in an MRI system.
However, its application can be expanded to other areas in which
there is a need for complicated leads or coil connections and which
has a limited space to assemble them, such as an electric machine
with a closed slot structure.
[0003] Magnetic Resonance Imaging (MRI) is a non-invasive method,
based on the physical phenomenon of nuclear spin resonance to
obtain the image of the inside of an object. It has been employed
for many years in the past in the field of chemistry to identify
the atomic constituents in the sample material. In the past 20
years, MRI has been successfully introduced into medical imaging to
demonstrate pathological or other physiological alternations of
living tissues. Now its medical and diagnostic applications appear
to be numerous and significant.
[0004] During the imaging process of MRI, an object is exposed to a
strong constant magnetic field. This aligns the nuclear spins of
the atoms in the object, which were previously oriented
irregularly. Radio-frequency waves can now excite these "ordered"
nuclear spins to a specific oscillation (resonant frequency). In
MRI, this oscillation generates the actual measuring signal (RF
response signal), which is picked up by suitable receiving
coils.
[0005] The foregoing medical imaging techniques are generally
implemented via a magnetic resonance imaging (MRI) apparatus such
as that shown in FIG. 1 that illustrates a structure of an MRI
apparatus 10 that includes a magnetostatic field magnet unit 12, a
gradient coil unit 13, an RF coil unit 14, an RF driver unit 22, a
gradient coil driver unit 23, a data acquisition unit 24, a
controller unit 25, a patient bed 26, a data processing unit 31, an
operating console unit 32, and a display unit 33. The magnetic
resonance imaging apparatus 10 transmits electromagnetic pulse
signals to a subject 16 placed in an imaging space 18 with a
magnetostatic field formed to perform a scan for obtaining magnetic
resonance signals from the subject 16 to reconstruct an image of
the slice of the subject 16 based on the magnetic resonance signals
thus obtained by the scan.
[0006] The magnetostatic field magnet unit 12 includes, for
example, typically an annular superconducting magnet, which is
mounted within a toroidal vacuum vessel. The magnet defines a
cylinder space surrounding the subject 16, and generates a constant
primary magneto static field, along the Z direction of the cylinder
space.
[0007] The magnetic resonance imaging (MRI) apparatus 10 also
includes a gradient coil unit 13 that forms a gradient field in the
imaging space 18 to add positional information to the magnetic
resonance signals received by the FR coil unit 14. The gradient
coil unit 13 includes three magnet systems, each of which generates
a gradient magnetic field which inclines into one of three spatial
axes perpendicular to each other, and generates a gradient field in
each of frequency encoding direction, phase encoding direction, and
slice selection direction in accordance with the imaging condition.
More specifically, the gradient coil unit 13 applies a gradient
field in the slice selection direction of the subject 16, to select
the slice; and the RF coil unit 14 transmits an RF pulse to a
selected slice of the subject 16 and excites it. The gradient coil
unit 13 also applies a gradient field in the phase encoding
direction of the subject 16 to phase encode the magnetic resonance
signals from the slice excited by the RF pulse. The gradient coil
unit 13 then applies a gradient field in the frequency encoding
direction of the subject 16 to frequency encode the magnetic
resonance signals from the slice excited by the RF pulse.
[0008] The gradient coil unit 13 can employ known gradient coil
structures such as a conventional gradient coil that employs a
separate primary coil portion and a separate shield coil portion. A
conventional folded gradient coil such as the coil 40 depicted in
FIG. 2 can also be employed to formulate the gradient coil unit 13.
The folded gradient coil 40 has a primary coil portion 42 and a
shield coil portion 44 that are connected via a folded portion 46
to provide a single gradient coil per axis. The folded coil
structure advantageously provides for lower inductance, lower
resistance, and a less leakage magnetic field as compared with the
conventional structure that has two separated gradient coils.
[0009] The transverse folded gradient coils, X and Y necessarily
have to intercross with one another to ensure symmetry and optimize
coil efficiency. Ideally, the coil stack-up structure should be
Y_shield, X_shield, Y_primary, X_primary. Manufacturing limitations
such as spatial interferences associated with the folded part 46 of
the coil prevent construction of such an ideal coil stack-up
structure, resulting in a coil stack-up structure having a
Y_shield, X_shield, X_primary, Y_primary sequence. The resultant
stack-up structure causes nonsymmetry, lowers the gradient coil
efficiency, and creates a higher complexity of manufacturing
requiring special parts to support the folded portion(s) 46 of the
coil in which both the Y_shield and Y_primary coils lie on the
cylinder surface.
[0010] A need therefore exists for a gradient coil structure that
is easy to manufacture and that does not require special parts to
support the folded portions of the gradient coil.
BRIEF DESCRIPTION
[0011] According to one embodiment, a folded gradient terminal
board end connector comprises a multi-layer terminal connection
board having a plurality of connection paths and vias configured to
provide intercrossing between a plurality of folded gradient coils
and further to provide symmetry between the plurality of folded
gradient coils without spatial interference between folded portions
of the plurality of folded gradient coils to optimize efficiency of
a folded gradient coil assembly comprising the plurality of folded
gradient coils.
[0012] According to another embodiment, a terminal board end
connector comprises a multi-layer terminal connection board having
a plurality of connection paths and vias configured to receive and
interface a plurality of coil end leads to provide coupling
symmetry between a plurality of coils and to optimize spatial and
operating efficiency between the plurality of symmetrically coupled
coils.
[0013] According to yet another embodiment, a method of connecting
a plurality of folded gradient coils comprises:
[0014] providing a folded gradient terminal board end connector
having a plurality of connection paths and vias; and
[0015] connecting a plurality of corresponding folded gradient coil
end leads to the end connector to provide a folded gradient coil
assembly having symmetry between a plurality of folded gradient
coils without spatial interference between folded portions of the
plurality of folded gradient coils to optimize coil efficiency of
the plurality of folded gradient coils.
[0016] According to still another embodiment, a method of
interconnecting a plurality of coils comprises:
[0017] providing a multi-layer terminal board end connector having
a plurality of connection paths and vias configured to receive a
plurality of coil end leads; and
[0018] connecting the plurality of coil end leads to the end
connector to provide coupling symmetry between a plurality of
corresponding coils and to optimize spatial and operating
efficiency between the plurality of symmetrically coupled
coils.
DRAWINGS
[0019] These and other features, aspects, and advantages of the
present invention will become better understood when the following
detailed description is read with reference to the accompanying
drawings in which like characters represent like parts throughout
the drawings, wherein:
[0020] FIG. 1 is a magnetic resonance imaging apparatus known in
the art;
[0021] FIG. 2 is a pictorial diagram illustrating a conventional
folded gradient coil structure known in the art;
[0022] FIG. 3 is a pictorial view illustrating a folded gradient
coil structure, in accordance with one aspect of the present
invention;
[0023] FIG. 4 is a cross-sectional view of a portion of a folded
gradient terminal board end connector suitable for use to implement
the folded gradient coil structure depicted in FIG. 3, according to
one aspect of the present invention; and
[0024] FIG. 5 is a pictorial diagram illustrating a closed slot
stator assembly suitable for use with a terminal board end
connector, according to one aspect of the present invention.
[0025] While the above-identified drawing figures set forth
alternative embodiments, other embodiments of the present invention
are also contemplated, as noted in the discussion. In all cases,
this disclosure presents illustrated embodiments of the present
invention by way of representation and not limitation. Numerous
other modifications and embodiments can be devised by those skilled
in the art which fall within the scope and spirit of the principles
of this invention.
DETAILED DESCRIPTION
[0026] FIG. 3 is a pictorial diagram illustrating a folded gradient
coil 50, in accordance with one aspect of the present invention.
Folded gradient coil 50, according to one embodiment, includes an
outer surface Y_shield coil 52 that surrounds an X_shield coil 54
that surrounds a Y_primary coil 56 that surrounds an X_primary coil
58 that lies on the inner surface of the gradient coil 50. A
multi-layer terminal connection board 60 constructed in one
embodiment of a laminated high thermal dielectric material is
configured with connection paths and vias as described in further
detail below with reference to FIG. 4. Wire leads from each portion
of the folded gradient coil 50, i.e. Y_shield coil 52, X_shield
coil 54, Y_primary coil 56, X_primary coil 58, are attached
(soldered) to corresponding vias on the surface of the multi-layer
terminal connection board 60. The requisite through channels on the
multi-layer terminal connection board 60 are connected to
predetermined vias by copper tracks in between the layers as well
as on the surface of the terminal connection board 60.
[0027] The multi-layer terminal connection board 60 is constructed
in a fashion such that intercrossing between the gradient coils 52,
54, 56, and 58 is accomplished to provide symmetry without spatial
interference to optimize the gradient coil efficiency and reduce
complexity of manufacturing.
[0028] FIG. 4 is a cross-sectional view of a portion 100 of the
folded gradient terminal board end connector 60 suitable for use to
implement the folded gradient coil structure 50 depicted in FIG. 3,
according to one aspect of the present invention. Using this
multilayer folded gradient terminal board connector 60, the leads
from both the primary and shield portions of the folded gradient
coil 50 can be soldered to the vias 102 which are on the outer
surface of the board 60. Copper tracks 104 having a desired
thickness are bounded to the high thermal dielectric material 106
using a thermal bonding procedure of prepreg that ensures the
proper thermal conduction and insulation requirements are met.
[0029] The copper tracks 104 represent the wire patterns of the
folded parts of the folded gradient coil structure 50. All of the
wire leads will pass through the via 102 channels, crossing the
different layers 108, 110, 112, 114, and 116 of the board connector
60. Each via 102 channel has an internal surface that is clad with
a layer of copper foil. The copper foil, which has a certain
thickness to handle the current up to about a couple of hundreds of
amperes, provides a conductive path between the vias 102 and
predetermined tracks 104 on different layers. In this way, two wire
leads soldered on different vias 102 respectively, can be
internally connected through the copper tracks 104 on the board
connector 60.
[0030] Although all of the requisite gradient coil leads are
soldered on the vias 102 of the multilayer folded gradient terminal
board connector 60 using the same outer surface, the leads can thus
have connections to different and distinct layers respectively. The
primary and shield portions 52, 54, 56, and 58 of the two
transverse folded gradient coils 50, in one embodiment, are
soldered on one surface of the board connector 60 such that the
board connector 60 becomes the folded part of the folded gradient
coils 50, and such that the requisite connections are implemented
in different board connector layers 108, 110, 112, 114, and
116.
[0031] The folded gradient coil structure 50 depicted in FIG. 3 and
FIG. 4 substantially eliminates spatial interference generally
associated with conventional gradient coil structures. Further, the
folded gradient coil structure 50 allows use of well developed
techniques associated with convention gradient coil manufacturing
processes to manufacture the primary and shield coil parts
separately, and then bond the individual parts together using the
folded gradient terminal board end connector 60. The foregoing
structure 50 advantageously provides a simpler solution for testing
and troubleshooting manufacturing flaws due to the ease soldering
and de-soldering the primary and shield coil parts to the folded
gradient terminal board end connector 60.
[0032] Folded gradient coil 50 that includes folded gradient
terminal board end connector 60 advantageously has a higher
efficiency with less manufacturing complexity than conventional
folded gradient coil assemblies known in the art. The folded
gradient coil 50 that includes folded gradient terminal board end
connector 60 further advantageously allows more folded gradient to
be used in MRI systems such as MRI apparatus 10 depicted in FIG. 1.
Further benefits include lower manufacturing costs, lower
manufacturing risks, and lower maintenance costs. Another benefit
associated with folded gradient coil 50 that includes folded
gradient terminal board end connector 60 is an assembly having a
lower inductance which translates into a lower cost on the
corresponding gradient drive assembly and lower AC loss performance
that now requires reduced cooling requirements and enhance image
quality. The foregoing features allow use of higher speed image
capture and larger patient bores in MRI systems.
[0033] The folded gradient terminal board end connector 60 is
particularly advantageous when used to implement a folded gradient
coil assembly, because the folded gradient terminal board end
connector 60 allows construction of a cross sectional symmetric
geometry for the folded gradient X and Y coils 50 due to
elimination of spatial interference between the folded portions of
the folded gradient X and Y coils 50.
[0034] The present invention is not so limited however, and those
skilled in the art will readily appreciate the principles described
herein above with reference to FIGS. 3-4 depicting particular
embodiments, can just as easily be employed in many other
applications such as, but not limited to, electric machine design
and manufacturing. A closed slot in an electric motor/generator,
for example, contributes to lower AC losses in the stator iron
portion of the electric electric motor/generator. This feature is
very important to a high speed machine having high efficiency
requirements.
[0035] Typical stator winding schemes are not capable of providing
a winding solution for such a closed slot stator structure such as
that depicted in FIG. 5 however since such winding schemes employ a
winding machine to wind a stator coil that subsequently needs to be
inserted into the stator slot. The closed slot stator structure
prevents insertion of the stator coil into the slot.
[0036] A terminal board end connector such as that described above
allows a stator coil assembly 120 to be constructed for a
closed-slot stator structure such as that illustrated in FIG. 5
that depicts a plurality of closed slots 124. A winding machine is
used to wind the stator coils first and then insert them as a whole
part into the stator slots for a regular open-slot stator
structure. One does not have the access space necessary to insert a
pre-wound coil for a closed-slot stator structure such as depicted
in FIG. 5. One can first insert a desired number of conductor bars
into the slot 124 to obtain a desired number of turns for a desired
stator coil 122 by using a terminal board end connector 126. The
ends of conductor bars in different slots 124 are then connected to
form the conducting loop and achieve a desired final stator coil
122 winding structure by using the terminal end connector board
126. Terminal end connector board 126 thus allows use of a
closed-slot stator structure to provide a highly efficient stator
coil assembly 120 during manufacture of an electric
motor/generator.
[0037] While only certain features of the invention have been
illustrated and described herein, many modifications and changes
will occur to those skilled in the art. It is, therefore, to be
understood that the appended claims are intended to cover all such
modifications and changes as fall within the true spirit of the
invention.
* * * * *