U.S. patent application number 11/967109 was filed with the patent office on 2009-06-25 for mounting apparatus for securing heat dissipation module to circuit board.
This patent application is currently assigned to HON HAI PRECISION INDUSTRY CO., LTD.. Invention is credited to MING-KE CHEN, XIAO-ZHU CHEN, KE SUN, ZHEN-XING YE.
Application Number | 20090161321 11/967109 |
Document ID | / |
Family ID | 40788359 |
Filed Date | 2009-06-25 |
United States Patent
Application |
20090161321 |
Kind Code |
A1 |
SUN; KE ; et al. |
June 25, 2009 |
MOUNTING APPARATUS FOR SECURING HEAT DISSIPATION MODULE TO CIRCUIT
BOARD
Abstract
A heat dissipating apparatus includes a plurality of posts for
being detachably attached to a circuit board adjacent a socket
mounted thereon, a mounting frame for being attached to the heat
dissipation module, and a plurality of support devices. Each
support device comprises an enlarged flange portion, a support
portion extending up from an upper surface of the flange portion,
and a coupling portion extending down from a lower surface of the
flange portion and detachably installable to a corresponding post,
thereby suspending the heat dissipation module over the socket. A
plurality of sleeve bodies is for respectively receiving the posts,
and configured for being sandwiched between the corresponding
flange portions and the circuit board. A plurality of fasteners
extending from the mounting frame is engagable with the support
portions respectively.
Inventors: |
SUN; KE; (Shenzhen, CN)
; YE; ZHEN-XING; (Shenzhen, CN) ; CHEN;
MING-KE; (Shenzhen, CN) ; CHEN; XIAO-ZHU;
(Shenzhen, CN) |
Correspondence
Address: |
PCE INDUSTRY, INC.;ATT. Steven Reiss
458 E. LAMBERT ROAD
FULLERTON
CA
92835
US
|
Assignee: |
HON HAI PRECISION INDUSTRY CO.,
LTD.
Taipei Hsien
TW
HONG FU JIN PRECISION INDUSTRY (ShenZhen) Co., LTD
Shenzhen City
CN
|
Family ID: |
40788359 |
Appl. No.: |
11/967109 |
Filed: |
December 29, 2007 |
Current U.S.
Class: |
361/719 ;
361/704 |
Current CPC
Class: |
H01L 2924/0002 20130101;
Y10T 24/44026 20150115; H01L 2023/4087 20130101; H01L 23/4006
20130101; Y10T 24/44017 20150115; H01L 2023/405 20130101; H01L
2924/0002 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
361/719 ;
361/704 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 21, 2007 |
CN |
200710203321.1 |
Claims
1. A mounting apparatus for securing a heat dissipation module to a
circuit board with a socket mounted thereon, the socket adapted for
receiving a heat-generating component therein, the mounting
apparatus comprising: a plurality of posts adapted for being
detachably attached to the circuit board adjacent the socket; a
mounting frame adapted for attached to the heat dissipation module,
a plurality of hollow poles extending down from a lower surface of
the mounting frame; a plurality of support devices each comprising
an enlarged flange portion supporting a corresponding pole thereon,
a support portion extending up from an upper surface of the flange
portion and being received in the pole, and a coupling portion
extending down from a lower surface of the flange portion and
detachably installable to a corresponding post, thereby suspending
the heat dissipation module over the socket; a plurality of sleeve
bodies for respectively receiving the posts, and configured for
being respectively sandwiched between the corresponding flange
portions and the circuit board; and a plurality of fasteners
extending from the mounting frame and engagable with the support
portions respectively.
2. The mounting apparatus as described in claim 1, wherein the
flange portion of each of the support devices has a polygonal
shape.
3. The mounting apparatus as described in claim 1, wherein a
threaded hole is defined in each of the posts, and each of the
coupling portions of the support devices has male threads formed
therearound to detachably engage with the threaded hole of a
corresponding post.
4. The mounting apparatus as described in claim 1, wherein a fixing
opening is defined in each of the support portions of the support
devices, and the fasteners are received in the fixing openings of
the support portions respectively.
5. The mounting apparatus as described in claim 1, wherein a
plurality of washers is respectively located at free ends of the
sleeve bodies.
6. A combination comprising: a circuit board with a socket mounted
thereon, the socket being configured for receiving an electronic
component therein; a plurality of posts attached to the circuit
board adjacent the socket; a heat dissipation module with thermal
grease mounted on a bottom surface thereof, a protective cover
attached on the bottom surface to cover the thermal grease; a
mounting frame attached to the heat dissipation module, a plurality
of hollow poles extending down from a lower surface of the mounting
frame; and a plurality of support devices detachably installable to
the posts respectively, each of the support devices comprising an
enlarged flange portion supporting a corresponding pole thereon, a
support portion extending up from an upper surface of the flange
portion and being received in the pole, and a sleeve body
sandwiched between the flange portion and the circuit board for
receiving a corresponding post, together suspending the heat
dissipation module over the socket to prevent the protective cover
from interfering with the socket; wherein a plurality of fasteners
extends from the mounting frame and is engagable with the support
portions of the connecting members respectively.
7. The combination as described in claim 6, wherein when the
support devices and the protective cover are removed away and the
electronic component is mounted on the socket, the fasteners are
engagable with the posts respectively to thereby secure the heat
dissipation module to the electronic component.
8. The combination as described in claim 7, wherein each of the
posts defines a threaded hole, and a threaded portion extends from
a lower surface of the flange portion of each of the support
devices and being screwed into a corresponding threaded hole.
9. The combination as described in claim 6, wherein a plurality of
washers is sandwiched between free ends of the sleeve bodies and
the circuit board.
Description
BACKGROUND
[0001] 1. Field of the Invention
[0002] The present invention relates to mounting apparatuses, and
more particularly to a mounting apparatus for securing a heat
dissipation module to a circuit board and allowing the heat
dissipation module and the circuit board being packed together
during transportation.
[0003] 2. Description of Related Art
[0004] In computer systems, certain electronic components such as
central processing units (CPUs) generate large amounts of heat
during their normal operation. The heat must be quickly removed to
prevent the CPUs from becoming overheated and damaged. Referring to
FIGS. 6 and 7, a thermal module 72 is attached to a CPU 70
superimposed on a socket 78 of a circuit board 76 to facilitate
dissipation of heat generated by the CPU 70. A thermal interface
material such as a layer of thermal grease 74 is evenly spread on a
bottom of the thermal module 72 and adjoins a top surface of the
CPU 70 to create a low resistance thermal path for dissipation of
heat.
[0005] However, when computer systems are transported by original
equipment manufacturers (OEMs) to their customers, thermal modules
and circuit boards are typically separately packed and transported
to customers because there are protective covers covering the
thermal grease spread on the thermal modules and the sockets on the
circuit boards which prevent the thermal modules from being
attached to the circuit boards. Therefore, packing and
transportation costs for the thermal modules and the circuit boards
are high.
[0006] What is desired, therefore, is a mounting apparatus which
firmly secures a thermal module to a circuit board and allows the
thermal module and the circuit board being packed together during
transportation.
SUMMARY
[0007] An exemplary mounting apparatus is provided for securing a
heat dissipation module to a circuit board with a socket mounted
thereon. The socket is adapted for receiving a heat-generating
component. The mounting apparatus comprises a plurality of posts
for being detachably attached to the circuit board adjacent the
socket, a mounting frame for being attached to the heat dissipation
module, a plurality of support devices, and a plurality of sleeve
bodies. A plurality of hollow poles extends down from a lower
surface of the mounting frame. Each of the support devices
comprises an enlarged flange portion supporting a corresponding
pole thereon, a support portion extending up from an upper surface
of the flange portion and being received in the pole, and a
coupling portion extending down from a lower surface of the flange
portion and detachably installable to a corresponding post, thereby
suspending the heat dissipation module over the socket. The sleeve
bodies are for respectively receiving the posts, and configured for
being sandwiched between the corresponding flange portions and the
circuit board. A plurality of fasteners extending from the mounting
frame is engagable with the support portions respectively.
[0008] Other advantages and novel features of the present invention
will become more apparent from the following detailed description
of an embodiment when taken in conjunction with the accompanying
drawings, in which:
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 is an exploded, isometric view of a mounting
apparatus for securing a heat dissipation module to a circuit board
according to an embodiment;
[0010] FIG. 2 is an enlarged view of a connecting member of one
support device of FIG. 1;
[0011] FIG. 3 is an assembled view of one support device of FIG.
1;
[0012] FIG. 4 is an assembled view of FIG. 1;
[0013] FIG. 5 is a cross-sectional view of FIG. 4 taken along line
V-V;
[0014] FIG. 6 is an assembled, isometric view of a typical mounting
apparatus, together with a heat dissipation module and a circuit
board; and
[0015] FIG. 7 is a cross-sectional view of FIG. 6 taken along line
VII-VII.
DETAILED DESCRIPTION
[0016] Referring to FIGS. 1 and 5, in an embodiment, a mounting
apparatus is provided for securing a heat dissipation module 20 to
a circuit board 10. A socket 12 for receiving a computer chip such
as a central processing unit (CPU) is attached to a top surface of
the circuit board 10. A shielding lid 14 is covered onto the socket
12. A plurality of bores 16 is defined in the circuit board 10
surrounding the socket 12. A thermal adhesive 22 such as a layer of
thermal grease is spread on a bottom of the heat dissipation module
20 to create a low resistance thermal path between the computer
chip and the bottom of the heat dissipation module 20. A protective
cover 24 is mounted at the bottom of the heat dissipation module 20
to cover the thermal adhesive 22 and protect the thermal adhesive
22 from dust and possible damage.
[0017] In the embodiment, the mounting apparatus includes a bolster
plate 30 attached to a bottom surface of the circuit board 30, a
plurality of support devices 40, and a mounting frame 60 fixed at
the bottom of the heat dissipation module 20. A plurality of posts
32 projects upwardly from a top surface of the bolster plate 30
respectively adjacent four corners thereof, corresponding to the
bores 16 of the circuit board 10. A threaded hole 34 is defined in
each post 32 at a free end thereof, and an encircling mounting
groove 36 is defined adjacent a bottom of each post 32.
[0018] Referring also to FIG. 2, each support device 40 includes a
connecting member 41, a sleeve body 50, and a washer 55. The
connecting member 41 includes a flange portion 42, and a coupling
portion such as a threaded portion 44 and a support portion 46
respectively extending down from a lower surface and up from an
upper surface of the flange portion 42. The flange portion 42 has a
polygonal shape such as a hexagon shape to facilitate manipulation
of the connecting member 41. A fixing opening such as a threaded
opening 48 is defined in the support portion 46 at a top thereof.
In this embodiment, the sleeve bodies 50 and washers 55 of the
support devices are made of Mylar.
[0019] A plurality of support legs 62 extends from the mounting
frame 60. A fastener, such as a screw 64, is provided for extending
through each support leg 62. A coil spring 65 is attached around
the fastener 64 and compressed between a head of the fastener 64
and the corresponding support leg 62. A hollow pole 66 extends down
from a lower surface of the support leg 62, allowing the
corresponding fastener 64 extending therethrough.
[0020] Referring to FIGS. 1 to 5, in assembly, the posts 32 of the
bolster plate 30 are respectively inserted through the bores 16 of
the circuit board 10, the bolster plate 30 abuts against the bottom
surface of the circuit board 10 and the posts 32 extend out from
the top surface of the circuit board 10. The mounting grooves 36 of
the posts 32 are generally positioned over the top surface of the
circuit board 10. A plurality of hollow rubber bushings (not shown)
is respectively assembled to the posts 32 by snappingly fitting in
the mounting grooves 36 thereof, a periphery of each rubber bushing
abuts against the top surface of the circuit board 10 thereby
securing the bolster plate 30 to the circuit board 10.
[0021] The sleeve bodies 50 are glued to the lower surfaces of the
flange portion 42 of the corresponding connecting member 41, and
the threaded portions 44 thereof are received in the corresponding
sleeve bodies 50. The washers 55 are glued to free ends of the
corresponding sleeve bodies 50, thereby the support devices 40 are
assembled. The threaded portions 44 of the support devices 40 are
screwed into the threaded holes 34 of the posts 32, and the posts
32 are received in the corresponding sleeve bodies 50 thereof. The
washers 55 of the support devices 40 are sandwiched between the top
surface of the circuit board 10 and the corresponding free ends of
the sleeve bodies 50.
[0022] The combined heat dissipation module 20 and mounting frame
60 are disposed on the circuit board 10, the support portions 46 of
the support devices 40 are respectively received in the hollow
poles 66 of the mounting frame 60, and free ends of the hollow
poles 66 respectively engage with the upper surfaces of the
corresponding flange portions 42 of the support devices 50. The
screws 64 of the mounting frame 60 are extended through the
corresponding hollow poles 66 and respectively screwed into the
threaded openings 48 of the corresponding support portions 46,
thereby securing the heat dissipation module 20 to the circuit
board 10. The heat dissipation module 20 is supported over the
socket 12, thereby leaving a space between the shielding lid 14
covering the socket 12 and the protective cover 24 covering the
bottom of the heat dissipation module 20.
[0023] Once the circuit board 10 combined with the heat dissipation
module 20 is received by a customer, the fasteners 64 of the
mounting frame 60 are respectively unscrewed from the corresponding
threaded openings 48 of the support devices 40, and the heat
dissipation module 20 is detached from the circuit board 10. The
threaded portions 44 of the support devices 40 are unscrewed from
the corresponding threaded holes 34 of the posts 32 of the bolster
plate 30, and the support devices 40 are detached from the posts 32
respectively. The shielding lid 14 is removed from the socket 12,
and a computer chip is installed in the socket 12. The protective
cover 24 is removed from the bottom of the heat dissipation module
20, and the heat dissipation module 20 combined with the mounting
frame 60 is disposed on the circuit board 10, the posts 32 of the
bolster plate 30 are respectively received in the hollow poles 66
of the mounting frame 60, and the free ends of the hollow poles 66
respectively engage the top surface of the circuit board 10. The
screws 64 are respectively screwed into the corresponding threaded
holes 34 of the posts 32, thereby securing the heat dissipation
module 20 to the circuit board 10.
[0024] The mounting apparatus of the present invention allows for
two mounting positions, one of which ensures safe shipping not only
by providing a space between surfaces needing protection, but also
by reinforcing the posts 32 of the bolster plate 30 because of the
arrangement of the sleeve bodies 50 between the flange portions 42
of the support devices 40 and the top surface of the circuit board
10, and the other which allows customer to secure the heat
dissipation module 20 to the circuit board 10 via the screws 64
engaging with the posts 32 directly after the support devices 40,
the shielding lid 14, the protective cover 24 are removed, and
contacting the thermal adhesive 22 spread on the bottom of the heat
dissipation module 20 with a top surface of the computer chip.
[0025] It is to be understood, however, that even though numerous
characteristics and advantages of the present invention have been
set forth in the foregoing description, together with details of
the structure and function of the invention, the disclosure is
illustrative only, and changes may be made in detail, especially in
matters of shape, size, and arrangement of parts within the
principles of the invention to the full extent indicated by the
broad general meaning of the terms in which the appended claims are
expressed.
* * * * *