U.S. patent application number 11/961363 was filed with the patent office on 2009-06-25 for heat sink having bumps for positioning heat pipes therein.
This patent application is currently assigned to FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.. Invention is credited to CHENG-TIEN LAI, CHI-YUAN LAI, ZHI-YONG ZHOU.
Application Number | 20090159252 11/961363 |
Document ID | / |
Family ID | 40787209 |
Filed Date | 2009-06-25 |
United States Patent
Application |
20090159252 |
Kind Code |
A1 |
LAI; CHI-YUAN ; et
al. |
June 25, 2009 |
HEAT SINK HAVING BUMPS FOR POSITIONING HEAT PIPES THEREIN
Abstract
A heat sink adapter for cooling an electronic component includes
a lower plate, an upper plate, an upper fin set and a lower fin set
respectively fixed on the upper plate and the lower plate, and a
plurality of heat pipes sandwiched between the upper plate and the
lower plate. The lower plate forms a plurality of bumps projecting
upwardly therefrom, which sandwich the heat pipes therebetween to
position the heat pipes on the lower plate, wherein some of the
heat pipes are bent and sandwiched between two bumps at each bended
position, and some of the heat pipes are straight and located near
one bump at each end portion thereof.
Inventors: |
LAI; CHI-YUAN; (Tu-Cheng,
TW) ; ZHOU; ZHI-YONG; (Shenzhen, CN) ; LAI;
CHENG-TIEN; (Tu-Cheng, TW) |
Correspondence
Address: |
PCE INDUSTRY, INC.;ATT. Steven Reiss
458 E. LAMBERT ROAD
FULLERTON
CA
92835
US
|
Assignee: |
FU ZHUN PRECISION INDUSTRY (SHEN
ZHEN) CO., LTD.
Shenzhen City
CN
FOXCONN TECHNOLOGY CO., LTD.
Tu-Cheng
TW
|
Family ID: |
40787209 |
Appl. No.: |
11/961363 |
Filed: |
December 20, 2007 |
Current U.S.
Class: |
165/171 ;
165/185 |
Current CPC
Class: |
H01L 23/467 20130101;
F28D 15/0275 20130101; H01L 23/427 20130101; H01L 2924/0002
20130101; H01L 2924/0002 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/171 ;
165/185 |
International
Class: |
F28F 1/10 20060101
F28F001/10; F28F 7/00 20060101 F28F007/00 |
Claims
1. A heat sink adapted for an electronic component, comprising: a
lower plate; and heat pipes fixed on the lower plate, wherein the
lower plate forms a plurality of bumps according to peripheries of
the heat pipes to position the heat pipes relative to the lower
plate.
2. The heat sink as claimed in claim 1, wherein the heat pipes
comprises bended heat pipes, each of the bended heat pipes being
sandwiched between two bumps at each bended position.
3. The heat sink as claimed in claim 2, wherein the heat pipes
comprises straight heat pipes sandwiched between the bended heat
pipes, the straight heat pipes being juxtaposed and contacting with
each other.
4. The heat sink as claimed in claim 3, wherein each bended heat
pipe comprises a straight section, a pair of bended sections
extending slantwise and outwardly from the straight section, and an
extremity end extending from one of the pair of bended sections,
the straight sections of the bended heat pipes abutting
side-by-side against the straight heat pipes.
5. The heat sink as claimed in claim 4, wherein each of junctions
of the straight sections and the bended sections of the bended heat
pipes is sandwiched between and positioned by two bumps.
6. The heat sink as claimed in claim 4, wherein at least one of the
bended sections is located between two bumps, and at least one of
the extremity ends of the bended sections is located adjacent to
one bump.
7. The heat sink as claimed in claim 1, wherein the lower plate
forms a protrusion projecting downwardly therefrom and a trough
defined in the protrusion and opened upwardly, the protrusion being
adapted for contacting the electronic component.
8. The heat sink as claimed in claim 7, wherein the heat pipes have
a plurality of bulges projecting downwardly therefrom, the
plurality of bulges being received in the cavity and abutting
against the protrusion of the lower plate.
9. The heat sink as claimed in claim 1, wherein the lower plate
comprises a planar board, a pair of sidewalls extending upwardly
from two opposite sides of the board, and a pair of flanges formed
vertically from tops of the pair of sidewalls, the bumps being
formed on the board.
10. The heat sink as claimed in claim 9 further comprising an upper
plate fixed on the flanges of the lower plate, wherein the heat
pipes are sandwiched between and directly contact the board and the
upper plate, and spaced from the sidewalls of the lower plate.
11. The heat sink as claimed in claim 10 further comprising an
upper fin arrangement fixed on the upper plate and a lower fin
arrangement fixed on the board, wherein the upper fin arrangement
occupies a total area of a top face of the upper plate and the
lower fin arrangement occupies a half area of a bottom face of the
board.
12. A heat sink adapted for dissipating heat from an electronic
component, comprising: a lower plate; an upper plate fixed on the
lower plate; and a plurality of heat pipes sandwiched between the
lower plate and the upper plate, wherein the lower plate has a
plurality of embosses formed upwardly corresponding to shapes of
the plurality of heat pipes, and wherein the plurality of heat
pipes are sandwiched between the plurality of embosses to be
positioned on the lower plate.
13. The heat sink as claimed in claim 12, wherein the plurality of
heat pipes comprises at least a bended heat pipe and at least a
straight heat pipe, the at least a bended heat pipe being
sandwiched between two embosses at each bended position, and the at
least a straight heat pipe being located near one emboss at each
end thereof.
14. The heat sink as claimed in claim 13, wherein the at least a
bended heat pipe comprises a straight portion parallel to and
contacting the at least a straight heat pipe, a pair of bended
portions extending slantwise from two ends of the straight portion,
and an extremity end extending from one of the bended portions and
parallel to the straight portion.
15. The heat sink as claimed in claim 14, wherein one emboss is
located adjacent to the end of the at least a straight heat pipe
and sandwiches an junction of the straight portion and one of the
pair of bended portions of the at least a bended heat pipe with
another emboss.
16. The heat sink as claimed in claim 12 further comprising an
upper fin arrangement fixed on the upper plate and a lower fin
arrangement fixed on the lower plate, wherein each of the upper fin
arrangement and the lower fin arrangement comprises a plurality of
fins parallel to each other.
17. The heat sink as claimed in claim 12, wherein a protrusion
projects downwardly from a part of the lower plate and a trough is
defined in the protrusion and opened upwardly, the heat pipes
having at least a part received in the trough and contacting the
protrusion.
18. A heat sink for cooling an electronic component comprising: a
lower plate; a lower fin set fixed on the lower plate; an upper
plate; an upper fin set fixed on the upper plate; and a plurality
of heat pipes sandwiched between the lower plate and the upper
plate comprising straight heat pipes and bended heat pipes, wherein
a plurality of bumps projecting upwardly from the lower plate and
sandwich the heat pipes therebetween to position the heat pipes on
the lower plate, and wherein some of the bumps are located adjacent
to ends of the straight heat pipes and other some of the bumps are
located adjacent to the bended heat pipes at bended positions and
still other some of the bumps are located adjacent to ends of the
bended heat pipes.
19. The heat sink as claimed in claim 18, wherein the upper fin set
occupies a whole area of a top face of the upper plate and the
lower fin set occupies a half area of a bottom face of the lower
plate.
20. The heat sink as claimed in claim 18, wherein the lower plate
forms a protrusion projecting downwardly therefrom and adjacent to
the lower fin set, and a trough defined in the protrusion and
opened upwardly, the heat pipes having portions being received in
the trough and contacting with the protrusion.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a heat sink, and more
particularly to a heat sink having bumps for positioning heat pipes
therein.
[0003] 2. Description of Related Art
[0004] The central processing unit (CPU) mounted on the motherboard
in a computer is the center of operations of the computer. During
the operations of the computer, the CPU produces heat. The heat
must be quickly carried away from the CPU during the operations of
the computer. Accordingly, a heat sink is used to remove the heat
from the CPU.
[0005] Conventionally, a heat sink includes a metal base contacting
the CPU and a plurality of fins extending from the metal base for
dissipating heat absorbed by the metal base from the CPU to an
ambient. Heat pipes are often mounted to the metal base for
enhancing a heat dissipating efficiency of the heat sink.
[0006] In order to position the heat pipes in the heat sink, the
metal base usually defines a plurality of grooves for receiving the
heat pipes therein. Nevertheless, for receiving the heat pipes
therein substantially, the metal base should be made to have a
thickness larger than diameters of the grooves, whereby a material
cost of the metal base is increased.
[0007] Another method to position the heat pipes in the heat sink
is to use positioning clamps. The positioning clamps are disposed
on the metal base at first, and then the heat pipes are brought to
fit into gaps between the positioning clamps, thereby realizing the
positioning of the heat pipes on the metal base. However, if a size
of the heat sink is small, there will have not enough area of the
metal base for disposing the positioning clamps thereon; therefore,
the positioning of the heat pipes becomes difficult.
[0008] What is needed, therefore, is a heat dissipating device
which can overcome the above-mentioned disadvantages.
SUMMARY OF THE INVENTION
[0009] A heat sink adapter for cooling an electronic component
includes a lower plate, an upper plate, an upper fin set and a
lower fin set respectively fixed on the upper plate and the lower
plate, and a plurality of heat pipes sandwiched between the upper
plate and the lower plate. The lower plate forms a plurality of
bumps projecting upwardly therefrom, which sandwich the heat pipes
therebetween to position the heat pipes on the lower plate, wherein
some of the heat pipes are bent and sandwiched between two bumps at
the bended positions. Compared with the conventional heat sink that
forms grooves on a base to position heat pipes therein and the
conventional heat sink that use positioning clamps to position heat
pipes on the base, the heat sink of the present invention just
forms the plurality of bumps on the lower plate, which do not need
the lower plate being thick and are able to provide a convenient
positioning for the heat pipes.
[0010] Other advantages and novel features of the present invention
will become more apparent from the following detailed description
when taken in conjunction with the accompanying drawings, in
which:
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Many aspects of the present apparatus can be better
understood with reference to the following drawings. The components
in the drawings are not necessarily drawn to scale, the emphasis
instead being placed upon clearly illustrating the principles of
the present apparatus. Moreover, in the drawings, like reference
numerals designate corresponding parts throughout the several
views.
[0012] FIG. 1 is an assembled, isometric view of a heat sink in
accordance with a preferred embodiment of the present
invention;
[0013] FIG. 2 is an exploded view of FIG. 1;
[0014] FIG. 3 is a view similar to FIG. 2 with heat pipes being
mounted on a lower plate of the heat sink; and
[0015] FIG. 4 is an inverted view of FIG. 1.
DETAILED DESCRIPTION OF THE INVENTION
[0016] Referring to FIGS. 1 and 2, a heat sink 10 in accordance
with a preferred embodiment of the present invention is for being
mounted on an electronic component (not shown) to dissipate heat
therefrom. The heat sink 10 comprises a lower plate 20, an upper
plate 30, a plurality of heat pipes 60 sandwiched between the lower
plate 20 and the upper plate 30, and an upper fin set 40 and a
lower fin set 50 attached on the upper plate 30 and the lower plate
20, respectively.
[0017] Also referring to FIG. 4, the lower plate 20 is made by
bending a metal plate, it comprises a rectangular and planar panel
22, a pair of sidewalls 24 extending upwardly and perpendicularly
from two opposite lateral sides of the panel 22, and a pair of
flanges 26 formed horizontally and oppositely from tops of the pair
of sidewalls 24, respectively. A square area of the panel 22 is
stamped downwardly to form a protrusion 220 (shown in FIG. 4)
projecting beyond a bottom face the panel 22, and a cavity 222
located corresponding to the protrusion 220 and beneath a top face
of the panel 22. The protrusion 220 is adapted for contacting the
electronic component to absorb heat therefrom. In the preferred
embodiment of the present invention, the protrusion 220 is located
at a front part of the panel 22; nevertheless, a location of the
protrusion 220 on the panel 22 can be varied according to positions
of the electronic component. A plurality of bumps 200 are formed on
the panel 22 by stamping corresponding points of the panel 22
upwardly. The bumps 200 are arranged according to profiles of the
heat pipes 60 so as to suitably sandwich the heat pipes 60
therebetween, wherein two of the bumps 200 are located in the
cavity 222, and other bumps 200 are located outside the cavity 222.
Corresponding portions of the sidewalls 24 and the flanges 26 are
bent outwardly and oppositely to form a pair of horizontal wings
(not labeled) at two lateral sides of the lower plate 20,
respectively. A pair of rectangular securing members 70 are
disposed on the two wings of the lower plate 20 and inserted into
the flanges 26 and the sidewalls 24, with an outer side thereof
being coincidental with an outer edge of a corresponding wing. Each
of the securing members 70 has a height larger than that of the
sidewalls 24, whereby a top of the each securing member 70 extends
beyond the flanges 26 for contacting the upper plate 30. A hole 700
is defined through each securing member 70 and each wing to provide
a passage for a fastener (not shown).
[0018] The upper plate 30 is soldered on the two flanges 26 of the
lower plate 20. The upper plate 30 has a periphery coincidental
with a periphery of the lower plate 20. A pair of cutouts 32 are
defined at each lateral side of the upper plate 30 corresponding to
one of the wings, while a part of the upper plate 30 located
between the pair of cutouts 32 forms a rectangular tab 34, which is
for resiliently abutting against a corresponding securing member
70. Total areas of the two cutouts 32 and the tab 34 are identical
to an area of the securing member 70 (illustrated in FIG. 1). A
circular hole 340 is defined in each tab 34 corresponding to the
hole 700 in the lower plate 20 and the securing member 70. The
fastener extends through the circular hole 340 of the upper plate
30 and a corresponding hole 700 of the lower plate 20 and the
securing member 70 to attach them on a printed circuit board (not
shown) where the electronic component is mounted.
[0019] The upper fin set 40 and the lower fin set 50 are fixed on
the upper plate 30 and the lower plate 20 by soldering,
respectively. Each of the upper fin set 40 and the lower fin set 50
comprises a plurality of parallel fins 42, 52, each of which
consists of an upright sheet (now labeled) and a pair of pieces
(not labeled) bent horizontally from a top and a bottom of the
sheet, respectively. The lower fin set 50 is secured on a rear part
of the bottom face of the panel 22 and near the protrusion 220
(viewed from FIG. 4), by soldering upper pieces of the fins 52 on
the panel 22; the upper fin set 40 is secured on a whole top face
of the upper plate 30, by soldering lower pieces of the fins 42 on
the upper plate 30, wherein every two adjacent fins 42, 52 form a
passage therebetween for allowing an airflow therethrough. The
lower fin set 50 has a width similar to that of the panel 22, and
the upper fin set 40 has a profile similar to that of the upper
plate 30 and a width larger than that of the lower fin set 50
(shown in FIG. 4).
[0020] As viewed from FIGS. 2-3, the heat pipes 60 are sandwiched
between the upper plate 30 and the lower plate 20. In the preferred
embodiment of the present invention there are four heat pipes 60;
however, the number of the heat pipes 60 is adjustable according to
the amount of heat that the electronic component generates. Two
middle ones 62 of the four heat pipes 60 are straight and planar
and parallel to each other; two lateral ones 64 of the four heat
pipes 60 are planar and each have a straight section 640 parallel
to the two middle heat pipes 62, two bended sections 642 extended
slantwise and outwardly from two opposite ends of the straight
section 640, and an extremity end 644 extending backwardly from a
rear bended section 642, wherein each bended section 642 defines an
angle approximate to 135 degrees with the straight section 640. The
four heat pipes 60 are so arranged that the two middle heat pipes
62 abut side-by-side against each other along a lengthwise
direction of the lower plate 20, and the two lateral heat pipes 64
are juxtaposed with the two middle heat pipes 62 in a manner that
the straight sections 640 thereof directly contact the two middle
heat pipes 62, the bended sections 642 are inclinedly spaced from
the two middle heat pipes 62, and the extremity ends 644 are gapped
from and parallel to the two middle heat pipes 62. A distance from
an outmost portion of a front bended section 642 to an outmost
portion of the extremity end 644 of each lateral heat pipe 64 is
identical to a length of the middle heat pipe 62. A distance
between two extremity ends 644 of the two lateral heat pipes 64 is
less than that between two sidewalls 24 of the lower plate 20,
whereby when the four heat pipes 60 are fixed on the lower plate
20, the extremity ends 644 would be spaced from the sidewalls 24 to
define gaps (not labeled) therebetween (illustrated in FIG. 5),
which allow the airflow therethrough to increase heat dissipation
of the heat sink 10. The four heat pipes 60 are positioned on the
panel 22 by the bumps 200 in a manner such that the two middle heat
pipes 62 are sandwiched between two bumps 200 near each end
thereof; each junction (not labeled) of the two lateral heat pipes
64 between the bended sections 642 and the straight sections 640 is
sandwiched by two bumps 200, each of joints of the bended sections
642 and the extremity ends 644 is sandwiched by two bumps 200, each
front bended section 642 is located between two bumps 200, and each
extremity end 644 abuts against one bump 200. In other words, two
bumps 200 sandwich the two lateral heat pipes 64 at each bended
position thereof. Each heat pipe 60 has a part projecting
downwardly from a bottom face thereof to form a rectangular chassis
646, which has a length less than that of the cavity 222 of the
lower plate 20, and a thickness approximate to a depth of the
cavity 222 of the lower plate 20. Four chassises 646 are located
just above the cavity 222 and for being substantially accommodated
into the cavity 222 and directly contacting a top face of the
protrusion 220 to absorb heat therefrom.
[0021] In assembly, the heat pipes 60 are brought to be disposed
downwardly on the panel 22 between the bumps 200 and soldered to
the panel 20; then the upper plate 30 is put and soldered on the
flanges 26 of the lower plate 20; finally, the lower fin set 50 and
the upper fin set 40 are soldered on the lower plate 20 and the
upper plate 30, respectively.
[0022] In use, the heat sink 10 is disposed on the printed circuit
board with its protrusion 220 contacting with the electronic
component, wherein the upper fin set 40 is located above the
printed circuit board, and the lower fin set 50 extends downwardly
beyond the printed circuit board and has a part located lower than
the printed circuit board. Heat generated by the electronic
component is absorbed by the protrusion 220, and then is
transferred to other portions of the heat pipes 60 via the
chassises 646. The heat pipes 60 distribute the heat over the upper
plate 30 and the lower plate 20, which disperses the heat to the
ambient via the lower fin set 50 and the upper fin set 40.
[0023] On contrary to the conventional heat sink which needs
forming grooves in a base to position heat pipes therein, and the
conventional heat sink which needs positioning clamps disposed on a
base to position heat pipes thereon, the lower plate 20 of the
present invention only forms the bumps 200 thereon, which do not
need the lower plate 20 having a large thickness to form them, and
also do not occupy so much areas of the panel 22; therefore, a
thickness of the lower plate 20 is capable of being controlled in a
small range and a material cost is reduced accordingly, and a
convenient positioning between the heat pipes 60 and the lower
plate 20 is achieved which is not sensitive relative to a size of
the lower plate 20.
[0024] It is believed that the present invention and its advantages
will be understood from the foregoing description, and it will be
apparent that various changes may be made thereto without departing
from the spirit and scope of the invention or sacrificing all of
its material advantages, the examples hereinbefore described merely
being preferred or exemplary embodiments of the invention.
* * * * *