U.S. patent application number 11/959313 was filed with the patent office on 2009-06-18 for heat sink with vapor chamber.
This patent application is currently assigned to FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.. Invention is credited to QIAO-LI DING, CHENG-TIEN LAI, ZHI-YONG ZHOU.
Application Number | 20090151906 11/959313 |
Document ID | / |
Family ID | 40751684 |
Filed Date | 2009-06-18 |
United States Patent
Application |
20090151906 |
Kind Code |
A1 |
LAI; CHENG-TIEN ; et
al. |
June 18, 2009 |
HEAT SINK WITH VAPOR CHAMBER
Abstract
A heat sink includes a tank and a plate covering on the tank and
hermetically engaging with the tank. The tank includes a base for
absorbing heat from heat-generating members and a first wick layer
formed at an inner face of base. The plate has a second wick layer
formed at an inner face thereof. A chamber is defined between the
tank and the plate and contains working fluid therein. An artery
mesh is located in the chamber between the tank and the plate. The
artery mesh is in porosity communication with the first wick layer
and the second wick layer.
Inventors: |
LAI; CHENG-TIEN; (Tu-Cheng,
TW) ; ZHOU; ZHI-YONG; (Shenzhen, CN) ; DING;
QIAO-LI; (Shenzhen, CN) |
Correspondence
Address: |
PCE INDUSTRY, INC.;ATT. Steven Reiss
458 E. LAMBERT ROAD
FULLERTON
CA
92835
US
|
Assignee: |
FU ZHUN PRECISION INDUSTRY (SHEN
ZHEN) CO., LTD.
Shenzhen City
CN
FOXCONN TECHNOLOGY CO., LTD.
Tu-Cheng
TW
|
Family ID: |
40751684 |
Appl. No.: |
11/959313 |
Filed: |
December 18, 2007 |
Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
H01L 23/427 20130101;
F28D 15/046 20130101; H01L 2924/0002 20130101; H01L 2924/0002
20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/104.26 |
International
Class: |
F28D 15/00 20060101
F28D015/00 |
Claims
1. A heat sink comprising: a tank comprising a base for absorbing
heat from a heat-generating member, and a first wick layer formed
at an inner face of base; a plate covering on the tank and
hermetically engaging with the tank, the plate having a second wick
layer formed at an inner face thereof; a chamber being defined
between the tank and the plate and containing working fluid
therein; and an artery mesh located in the chamber between the tank
and the plate, the artery mesh being in porosity communication with
the first wick layer and the second wick layer.
2. The heat sink of claim 1, wherein the first wick layer and the
second wick layer are in porosity communication.
3. The heat sink of claim 1, wherein the tank comprises sidewalls
extending from the base, the first wick layer covering inner faces
of the sidewalls.
4. The heat sink of claim 3, wherein the first wick layer covers
allover the base and the sidewalls.
5. The heat sink of claim 3, wherein the tank comprises a flange
extending from the sidewalls, the flange engaging with the
plate.
6. The heat sink of claim 5, wherein the flange parallels to the
plate.
7. The heat sink of claim 1 further comprising a plurality of fins,
wherein the fins thermally contacts the plate.
8. The heat sink of claim 7, wherein the each of the fins is
L-shaped.
9. The heat sink of claim 8, wherein each of the fins comprises a
contacting portion thermally contacting the plate and a heat
dissipating portion extending remote from the plate.
10. The heat sink of claim 1, wherein the artery mesh has an end
thereof located at a central portion of the base.
11. The heat sink of claim 10, wherein the artery mesh has another
end thereof located at a lateral portion of the base.
12. The heat sink of claim 11, wherein the artery mesh is
L-shaped.
13. The heat sink of claim 12 further comprising three additional
artery meshes located in the chamber, wherein the artery meshes in
the chamber define an X-shaped figure between the base and the
plate.
14. The heat sink of claim 1, wherein the first wick layer is a
sintered wick layer.
15. The heat sink of claim 1, wherein the second wick layer is a
meshed wick layer.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a heat sink with vapor
chamber, and more particularly to a heat sink with vapor chamber
having wick structure.
[0003] 2. Description of Related Art
[0004] It is well known that heat is generated during operations of
electronic components, such as integrated circuit chips. To ensure
normal and safe operations, cooling devices such as heat sinks are
often employed to dissipate the generated heat away from these
electronic components.
[0005] As progress continues to be made in the electronics art,
more components on the same real estate generate more heat. The
heat sinks used to cool these chips are accordingly made larger in
order to possess a higher heat removal capacity, which causes the
heat sinks to have a much larger footprint than the chips.
Generally speaking, a heat sink is more effective when there is a
uniform heat flux applied over an entire base of the heat sink.
When a heat sink with a large base is attached to an integrated
circuit chip with a much smaller contact area, there is significant
resistance to the flow of heat to the other portions of the heat
sink base which are not in direct contact with the chip.
[0006] A mechanism for overcoming the resistance to heat flow in a
heat sink base is to attach a heat spreader to the heat sink base
or directly make the heat sink base as a heat spreader. Typically,
the heat spreader includes a vacuum chamber defined therein, a wick
structure provided in the chamber and lining an inside wall of the
chamber, and a working fluid contained in chamber. As an integrated
circuit chip is maintained in thermal contact with the heat
spreader, the working fluid contained in the wick structure
corresponding to a hot contacting location vaporizes. The vapor
then spreads to fill the chamber, and wherever the vapor comes into
contact with a cooler surface of the chamber, it releases its
latent heat of vaporization and condenses. The condensate returns
to the hot contacting location via a capillary force generated by
the wick structure. Thereafter, the condensate frequently vaporizes
and condenses to form a circulation to thereby remove the heat
generated by the chip.
[0007] As progress continues to be made in electronics area, the
electronic components are made to be more powerful while occupying
a smaller size. Thus, a heating area of the heat spreader needs to
transfer more heat to a cooling area of the heat spreader. In
contrast, the heating area of the heat spreader is decreased as the
size of the electronic component is decreased, and the cooling area
of the heat spreader is commensurately increased. Therefore, the
heat flux density between the heating and the cooling areas of the
heat spreader is increased. Accordingly, the wick structure needs
to have more powerful heat transfer capability. However, the wick
structure of the heat spreader selected from the conventional
types, such as mesh, fiber, fine grooves, and sintered powder,
cannot satisfy such requirement, which further limits the increase
for the heat transfer capability of the heat spreader.
[0008] What is needed therefore is to provide a heat sink with
vapor chamber having wick structures which achieves good heat
dissipation performance.
SUMMARY OF THE INVENTION
[0009] A heat sink in accordance with a preferred embodiment of the
present invention comprises a tank and a plate covering on the tank
and hermetically engaging with the tank. The tank comprises a base
for absorbing heat from heat-generating members and a first wick
layer formed at an inner face of base. The plate has a second wick
layer formed at an inner face thereof. A chamber is defined between
the tank and the plate and contains working fluid therein. An
artery mesh is located in the chamber between the tank and the
plate. The artery mesh is in porosity communication with the first
wick layer and the second wick layer.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Many aspects of the present heat sink with vapor chamber can
be better understood with reference to the following drawings. The
components in the drawings are not necessarily drawn to scale, the
emphasis instead being placed upon clearly illustrating the
principles of the present portable projector using a related heat
dissipation system. Moreover, in the drawings, like reference
numerals designate corresponding parts throughout the several
views.
[0011] FIG. 1 is an isometric, exploded view of a heat sink in
accordance with a preferred embodiment of the present
invention;
[0012] FIG. 2 is an assembled view of FIG. 1;
[0013] FIG. 3 is an inverted view of FIG. 2;
[0014] FIG. 4 is a sectional view of FIG. 2 taking along a line
IV-IV; and
[0015] FIG. 5 is an enlarged view of a part V shown in FIG. 4.
DETAILED DESCRIPTION OF THE INVENTION
[0016] Referring to FIGS. 1 and 2, the heat sink comprises a heat
spreader 10 and a plurality of fins 30 arranged on the heat
spreader 10.
[0017] Referring also to FIGS. 3-5, the heat spreader 10 comprises
a tank 110 and a top plate 150 hermetically covering on the tank
110, thereby defining a chamber 180 between the tank 110 and the
plate 150. The tank 110 comprises a cuboids body 111 and a flange
112 circumferentially extending outwardly from the body 111. The
body 111 comprises a heat absorbing base 113 and four
interconnecting sidewalls 114 integrally extending upwardly from
the base 113. A first wick layer 116 is formed on an inner face of
the body 111 by sintering metal power at the inner face. The first
wick layer 116 covers allover the inner face, that is to say, the
first wick layer 116 covers the base 113 and the sidewalls 114 of
the tank 110. A second wick layer 156 is formed on an inner face of
the plate 150 by tightly engaging a mesh sheet to the inner face.
The first wick layer 116 is a sintered wick layer which is formed
from sintering metal power. The second wick layer 156 is a meshed
wick layer which is formed from a mesh. The first wick layer 116 on
the sidewalls 114 extends toward the plate 150 to engage with the
second wick layer 156. The first wick layer 116 and the second wick
layer 156 are in porosity communication, therefore, liquid can
flows between the first wick layer 116 and the second wick layer
156. The plate 150 has edges thereof air-tightly and liquid-tightly
engaging with the flange 112 of the tank 110. Working fluid (not
labeled) is filled in the chamber 180.
[0018] In the chamber 180 of the heat spreader 10, a plurality of
artery meshes 170 are positioned between the base 113 and the plate
150. In this embodiment, there are four artery meshes 170
constructed in the heat sink. The artery mesh 170 is a flexible
elongate hollow tube which is woven from a plurality of metal wires
such as copper wires, aluminum wires, or stainless steel wires.
Alternatively, the artery mesh 170 can also be woven from a
plurality of fiber wires. A plurality of pores is defined in a wall
(not labeled) of the artery mesh 170. The pores communicate the
artery meshes 170 with the first wick layer 116 and the second wick
layer 156 so that the working fluid can move between top and bottom
portions of the heat spreader 10. That is, the working fluid can
move between the second wick layer 156 and the first wick layer 116
via capillary forces generated by the artery meshes 170. The artery
mesh 170 has an annular cross section and a channel (not labeled)
defined in a middle portion of the artery mesh 170. In this
embodiment, each artery mesh 170 is substantially L-shaped in
profile. The four artery meshes 170 are spaced from each other and
define a substantially X-shaped figure between the base 113 and the
plate 150. Each artery mesh 170 has one end therefore located at a
central portion (not labeled) of the base 113 and another end
thereof extending to a corresponding lateral portion (not labeled)
of the base 113.
[0019] Each fin 30 is made from metal sheet. The fin 30 is
substantially L-shaped, and comprises a contacting portion
thermally contacting the plate 150 of the heat spreader 10 and a
heat dissipation portion extending remote from the plate 150.
[0020] In use, the base 113 of the tank 110 of the heat spreader 10
has the central portion thereof thermally contacting and absorbing
heat from a heat-generating chip. The working fluid in the chamber
180 of the tank 110 is heated and vapored upwardly to reach the
plate 150 of the heat spreader 10. At the plate 150, the vapored
working fluid exchanges heat with the plate 150 and then is
condensed to liquid. The liquid refluences to the base 113 via the
second wick layer 156, the first wick layer 116 and the artery
meshes 170. In the tank 110, the artery meshes 170 not only carry
the working liquid from the second wick layer 156 to the first wick
layer 116, but also carry the working liquid to a central portion
of the base 113 from a lateral portion of the base 113. The vapored
and condensed cycle of the working fluid in the tank 110 continues,
the heat generated by the chip is transferred to the plate 150, and
the heat in the plate 150 is dissipated by the fins 30 on the plate
150.
[0021] It is believed that the present invention and its advantages
will be understood from the foregoing description, and it will be
apparent that various changes may be made thereto without departing
from the spirit and scope of the invention or sacrificing all of
its material advantages, the examples hereinbefore described merely
being preferred or exemplary embodiments of the invention.
* * * * *