U.S. patent application number 11/957349 was filed with the patent office on 2009-06-18 for heat sink with vapor chamber.
This patent application is currently assigned to FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.. Invention is credited to QIAO-LI DING, CHENG-TIEN LAI, ZHI-YONG ZHOU.
Application Number | 20090151905 11/957349 |
Document ID | / |
Family ID | 40751683 |
Filed Date | 2009-06-18 |
United States Patent
Application |
20090151905 |
Kind Code |
A1 |
LAI; CHENG-TIEN ; et
al. |
June 18, 2009 |
HEAT SINK WITH VAPOR CHAMBER
Abstract
A heat sink includes a tank and a plate covering on the tank and
hermetically engaging with the tank. The tank includes a base for
absorbing heat from heat-generating members and a sintered wick
layer formed at an inner face of base. The plate has a meshed wick
layer formed at an inner face thereof. A chamber is defined between
the tank and the plate and contains working fluid therein.
Inventors: |
LAI; CHENG-TIEN; (Tu-Cheng,
TW) ; ZHOU; ZHI-YONG; (Shenzhen, CN) ; DING;
QIAO-LI; (Shenzhen, CN) |
Correspondence
Address: |
PCE INDUSTRY, INC.;ATT. Steven Reiss
458 E. LAMBERT ROAD
FULLERTON
CA
92835
US
|
Assignee: |
FU ZHUN PRECISION INDUSTRY (SHEN
ZHEN) CO., LTD.
Shenzhen City
CN
FOXCONN TECHNOLOGY CO., LTD.
Tu-Cheng
TW
|
Family ID: |
40751683 |
Appl. No.: |
11/957349 |
Filed: |
December 14, 2007 |
Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
H01L 23/427 20130101;
F28D 15/04 20130101; H01L 2924/0002 20130101; H01L 2924/0002
20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/104.26 |
International
Class: |
F28D 15/02 20060101
F28D015/02; F28D 15/04 20060101 F28D015/04 |
Claims
1. A heat sink comprising: a tank comprising a base for absorbing
heat from a heat-generating member, and a sintered wick layer
formed at an inner face of base; a plate covering on the tank and
hermetically engaging with the tank, the plate having a meshed wick
layer formed at an inner face thereof; and a chamber being defined
between the tank and the plate, the chamber containing working
fluid therein.
2. The heat sink of claim 1, wherein the sintered wick layer and
the meshed wick layer are in porosity communication.
3. The heat sink of claim 1, wherein the tank comprises sidewalls
extending from the base, the sintered wick layer covering inner
faces of the sidewalls.
4. The heat sink of claim 3, wherein the sintered wick layer covers
allover the base and the sidewalls.
5. The heat sink of claim 3, wherein the tank comprises a flange
extending from the sidewalls, the flange engaging with the
plate.
6. The heat sink of claim 5, wherein the flange parallels to the
plate.
7. The heat sink of claim 1 further comprising a plurality of fins,
wherein the fins thermally contacts the plate.
8. The heat sink of claim 7, wherein each of the fins is
L-shaped.
9. The heat sink of claim 8, wherein each of the fins comprises a
contacting portion thermally contacting the plate and a heat
dissipating portion extending remote from the plate.
10. A heat sink comprising: a tank containing phase-changeable
working fluid therein; a plate hermetically covering the tank; a
first wick layer lining to tank; and a second wick layer lining to
the plate, the second wick layer being different from the first
wick layer and in porosity communication with the first wick
layer.
11. The heat sink of claim 10, wherein the tank comprises a heat
absorbing base and a sidewall extending from the base.
12. The heat sink of claim 11, wherein the first wick layer covers
the sidewall and the base.
13. The heat sink of claim 10, wherein the tank extends a flange
engaging with the plate.
14. The heat sink of claim 13, wherein the flange parallels to the
plate.
15. The heat sink of claim 10 further comprising a plurality of
fins positioned on the plate.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a heat sink with vapor
chamber, and more particularly to a heat sink with vapor chamber
having wick structure.
[0003] 2. Description of Related Art
[0004] It is well known that heat is generated during operations of
electronic components, such as integrated circuit chips. To ensure
normal and safe operations, cooling devices such as heat sinks are
often employed to dissipate the generated heat away from these
electronic components.
[0005] As progress continues to be made in the electronics art,
more components on the same real estate generate more heat. The
heat sinks used to cool these chips are accordingly made larger in
order to possess a higher heat removal capacity, which causes the
heat sinks to have a much larger footprint than the chips.
Generally speaking, a heat sink is more effective when there is a
uniform heat flux applied over an entire base of the heat sink.
When a heat sink with a large base is attached to an integrated
circuit chip with a much smaller contact area, there is significant
resistance to the flow of heat to the other portions of the heat
sink base which are not in direct contact with the chip.
[0006] A mechanism for overcoming the resistance to heat flow in a
heat sink base is to attach a heat spreader to the heat sink base
or directly make the heat sink base as a heat spreader. Typically,
the heat spreader includes a vacuum chamber defined therein, a wick
structure provided in the chamber and lining an inside wall of the
chamber, and a working fluid contained in chamber. As an integrated
circuit chip is maintained in thermal contact with the heat
spreader, the working fluid contained in the wick structure
corresponding to a hot contacting location vaporizes. The vapor
then spreads to fill the chamber, and wherever the vapor comes into
contact with a cooler surface of the chamber, it releases its
latent heat of vaporization and condenses. The condensate returns
to the hot contacting location via a capillary force generated by
the wick structure. Thereafter, the condensate frequently vaporizes
and condenses to form a circulation to thereby remove the heat
generated by the chip.
[0007] Conventionally, the wick structure of the heat spreader is a
meshed or sintered type. Generally, the messed wick structure has
advantage of good osmosis, but drawbacks of bad heat transferring
capacity and weak gravity resistance. While the sintered wick
structure has advantages of good heat transferring capacity and
gravity resistance, but drawback of large hydro-resistance.
Therefore, heat spreaders with single meshed wick structure or
sintered wick structure does not achieve a perfect heat dissipation
efficiency for the aforesaid chips.
[0008] What is needed therefore is to provide a heat sink with
vapor chamber having wick structures which achieves good heat
dissipation performance.
SUMMARY OF THE INVENTION
[0009] A heat sink in accordance with a preferred embodiment of the
present invention comprises a tank and a plate covering on the tank
and hermetically engaging with the tank. The tank comprises a base
for absorbing heat from heat-generating members and a sintered wick
layer formed at an inner face of base. The plate has a meshed wick
layer formed at an inner face thereof. The sintered wick layer and
the meshed wick layer are in porosity communication. A chamber is
defined between the tank and the plate and contains working fluid
therein.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Many aspects of the present heat sink with vapor chamber can
be better understood with reference to the following drawings. The
components in the drawings are not necessarily drawn to scale, the
emphasis instead being placed upon clearly illustrating the
principles of the present portable projector using a related heat
dissipation system. Moreover, in the drawings, like reference
numerals designate corresponding parts throughout the several
views.
[0011] FIG. 1 is an isometric, exploded view of a heat sink in
accordance with a preferred embodiment of the present
invention;
[0012] FIG. 2 is an assembled view of FIG. 1;
[0013] FIG. 3 is an inverted view of FIG. 2;
[0014] FIG. 4 is a sectional view of FIG. 2 taking along a line
IV-IV; and
[0015] FIG. 5 is an enlarged view of a part V shown in FIG. 4.
DETAILED DESCRIPTION OF THE INVENTION
[0016] Referring to FIGS. 1 and 2, the heat sink comprises a heat
spreader 10 and a plurality of fins 30 arranged on the heat
spreader 10.
[0017] Referring also to FIGS. 3-5, the heat spreader 10 comprises
a tank 110 and a top plate 150 hermetically covering on the tank
110, thereby defining a chamber 180 between the tank 110 and the
plate 150. The tank 110 comprises a cuboids body 111 and a flange
112 circumferentially extending outwardly from the body 111. The
body 111 comprises a heat absorbing base 113 and four
interconnecting sidewalls 114 integrally extending upwardly from
the base 113. A sintered wick layer 116 is formed on an inner face
of the body 111 by sintering metal power at the inner face. The
sintered wick layer 116 covers allover the inner face, that is to
say, the sintered wick layer 116 covers the base 113 and the
sidewalls 114 of the tank 110. A meshed wick layer 156 is formed on
an inner face of the plate 150 by tightly engaging a mesh sheet to
the inner face. The sintered wick layer 116 on the sidewalls 114
extends toward the plate 150 to engage with the meshed wick layer
156. The sintered wick layer 116 and the meshed wick layer 156 are
in porosity communication, therefore, liquid can flows between the
sintered wick layer 116 and the meshed wick layer 156. The plate
150 has edges thereof air-tightly and liquid-tightly engaging with
the flange 112 of the tank 110. Working fluid is filled in the
chamber 180.
[0018] Each fin 30 is made from metal sheet. The fin 30 is
substantially L-shaped, and comprises a contacting portion (not
labeled) thermally contacting the plate 150 of the heat spreader 10
and a heat dissipation portion (not labeled) extending remote from
the plate 150.
[0019] In use, the base 113 of the tank 110 of the heat spreader 10
thermally contacts and absorbs heat from a heat-generating chip.
The working fluid in the chamber 180 of the tank 110 is heated and
vapored upwardly to reach the plate 150 of the heat spreader 10. At
the plate 150, the vapored working fluid exchanges heat with the
plate 150 and then is condensed to liquid. The liquid refluences to
the base 113 via the meshed wick layer 156 and the sintered wick
layer 116. The vapored and condensed cycle continues, the heat
generated by the chip is transferred to the plate 150, and the heat
in the plate 150 is dissipated by the fins 30 on the plate 150.
[0020] According to the embodiment of the present invention, the
heat spreader 10 of the heat sink comprises two different wick
layers located at different locations thereof: the sintered wick
layer 116 at the base 113 which absorbs heat from the
heat-generating chip, the meshed wick layer 156 at the plate 150
which releases heat to other members. Therefore, the heat generated
by the chip can be absorbed quickly by the base 113 and the working
fluid, then reaches the plate 150 to be dissipated. The working
fluid refluences to the base 113 rapidly via the meshed wick layer
156 and the sintered wick layer 116.
[0021] It is believed that the present invention and its advantages
will be understood from the foregoing description, and it will be
apparent that various changes may be made thereto without departing
from the spirit and scope of the invention or sacrificing all of
its material advantages, the examples hereinbefore described merely
being preferred or exemplary embodiments of the invention.
* * * * *