U.S. patent application number 12/018187 was filed with the patent office on 2009-06-18 for heat sink.
Invention is credited to Tsung-Hsien Huang.
Application Number | 20090151900 12/018187 |
Document ID | / |
Family ID | 39326888 |
Filed Date | 2009-06-18 |
United States Patent
Application |
20090151900 |
Kind Code |
A1 |
Huang; Tsung-Hsien |
June 18, 2009 |
HEAT SINK
Abstract
A heat sink includes a thermal conductive base panel that has a
plurality of heat dissipation columns of any of a variety of
configurations perpendicularly upwardly extending from the top
wall, and radiation fins mounted on the heat dissipation columns at
different elevations, each radiation fin having a plurality of
mounting through holes respectively press-fitted onto the heat
dissipation columns. The base panel may be provided with a fan
and/or heat pipes to enhance heat dissipation efficiency.
Inventors: |
Huang; Tsung-Hsien; (I-Lan
Hsien, TW) |
Correspondence
Address: |
PAI PATENT & TRADEMARK LAW FIRM
1001 FOURTH AVENUE, SUITE 3200
SEATTLE
WA
98154
US
|
Family ID: |
39326888 |
Appl. No.: |
12/018187 |
Filed: |
January 22, 2008 |
Current U.S.
Class: |
165/80.3 |
Current CPC
Class: |
H01L 23/467 20130101;
H01L 2924/0002 20130101; H01L 23/3677 20130101; H01L 23/3672
20130101; H01L 2924/0002 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/80.3 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 12, 2007 |
TW |
096147379 |
Claims
1. A heat sink comprising: a thermal conductive base panel, said
base panel having a plurality of heat dissipation columns
perpendicularly upwardly extending from a top wall thereof and
respectively spaced from one another at a distance; and a plurality
of radiation fins mounted on said heat dissipation columns at
different elevations, said radiation fins each having a plurality
of mounting through holes respectively press-fitted onto said heat
dissipation columns.
2. The heat sink as claimed in claim 1, wherein said heat
dissipation columns are arranged in an array.
3. The heat sink as claimed in claim 1, wherein said mounting
through holes of said radiation fins have a cross-shaped cross
section, and said heat dissipation columns have a cross-shaped
cross section respectively tightly fitted into said mounting
through holes of said radiation fins.
4. The heat sink as claimed in claim 1, wherein said mounting
through holes of said radiation fins have a rectangular cross
section, and said heat dissipation columns have a rectangular cross
section respectively tightly fitted into said mounting through
holes of said radiation fins.
5. The heat sink as claimed in claim 1, wherein said mounting
through holes of said radiation fins have a circular cross section,
and said heat dissipation columns have a circular cross section
respectively tightly fitted into said mounting through holes of
said radiation fins.
6. The heat sink as claimed in claim 1, wherein said mounting
through holes of said radiation fins have a hexagonal cross
section, and said heat dissipation columns have a hexagonal cross
section respectively tightly fitted into said mounting through
holes of said radiation fins.
7. The heat sink as claimed in claim 1, wherein said mounting
through holes of said radiation fins have a triangular cross
section, and said heat dissipation columns have a triangular cross
section respectively tightly fitted into said mounting through
holes of said radiation fins.
8. The heat sink as claimed in claim 1, wherein said mounting
through holes of said radiation fins have an elongated rectangular
cross section, and said heat dissipation columns have an elongated
rectangular cross section respectively tightly fitted into said
mounting through holes of said radiation fins.
9. The heat sink as claimed in claim 1, wherein said heat
dissipation columns each have a chamfered foot fixedly connected to
the top wall of said base panel.
10. The heat sink as claimed in claim 9, wherein the chamfered foot
of each said heat dissipation column is chamfered in taperedly
chamfered form, convexly chamfered form, or concavely chamfered
form.
11. The heat sink as claimed in claim 1, wherein said radiation
fins each have a plurality of flanges protruding from a top surface
thereof and respectively extending around said mounting through
holes.
12. The heat sink as claimed in claim 1, wherein said base panel is
extruded from copper or aluminum.
13. The heat sink as claimed in claim 1, wherein said base panel
has a metal block embedded in a bottom wall thereof in flush with a
bottom surface thereof, said metal block having a heat transfer
coefficient higher than the metal material of said base panel.
14. The heat sink as claimed in claim 1, wherein said heat
dissipation columns have different heights.
15. The heat sink as claimed in claim 1, wherein said heat
dissipation columns are stepped columns.
16. The heat sink as claimed in claim 1, wherein said mounting
through holes of said radiation fins are stepped through holes, and
the stepped mounting through holes of one said radiation fin are
respectively fitted into the stepped mounting through holes of
another said radiation fin when said radiation fins are mounted on
said heat dissipation columns.
17. The heat sink as claimed in claim 1, wherein said heat
dissipation columns each have a chamfered top end.
18. The heat sink as claimed in claim 17, wherein the chamfered top
end of each said heat dissipation column is chamfered in taperedly
chamfered form, convexly chamfered form, or concavely chamfered
form.
19. The heat sink as claimed in claim 1, wherein said base panel
has a fan mounting region disposed at one side beyond said heat
dissipation columns and said radiation fins for the mounting of a
fan.
20. The heat sink as claimed in claim 1, wherein said base panel
has a fan mounting region disposed at the center thereof and
surrounded by said heat dissipation columns and said radiation fins
for the mounting of a fan.
21. The heat sink as claimed in claim 1, wherein said base panel
has at least one pipe groove on a flat bottom wall thereof, and at
least one heat pipe respectively mounted in said at least one pipe
groove, said at least one heat pipe each having a flat bottom wall
disposed in flush with the bottom wall of said base panel.
22. The heat sink as claimed in claim 21, wherein said at least one
heat pipe is respectively press-fitted into said at least one pipe
groove of said base panel.
Description
BACKGROUND OF THE INVENTION
[0001] (a) Field of the Invention
[0002] The present invention relates to a heat sink for dissipation
of heat from a semiconductor heat source and more particularly to a
heat sink, which comprises a base panel having upright heat
dissipation columns, and radiation fins with mounting through holes
mounted on the heat dissipation columns at different elevations.
The base panel of the heat sink may be provided with a fan and/or
heat pipes to enhance heat dissipation efficiency.
[0003] (b) Description of the Prior Art
[0004] Conventional heat sinks are commonly comprised of a flat
base panel and a plurality of radiation fins directly bonded to the
base panel. Heat pipes may be bonded to the base panel to enhance
heat dissipation performance. The base panel and the radiation fins
are commonly extruded from aluminum or copper. The radiation fins
are arranged on the base panel and spaced from one another at a
distance. The base panel transfers heat energy from the
semiconductor heat source to which the heat sink is attached to the
radiation fins for dissipation into the outside open air.
[0005] There are mini heat sinks in which the radiation fins are
integrally formed with the base panel, and arranged in lines. These
heat sinks have low performance in heat dissipation. They cannot
satisfy actual heat dissipation requirements. There are known heat
sinks equipped with heat pipes to provide enhanced heat dissipation
performance. However, these heat sinks are big in size,
complicated, and expensive, therefore not practical for use in
situations where lower heat dissipation power is required. In
conclusion, conventional heat sinks cannot fit different heat
dissipation requirements.
SUMMARY OF THE INVENTION
[0006] The present invention has been accomplished under the
circumstances in view. According to one aspect of the present
invention, the heat sink comprises a thermal conductive base panel
and radiation fins. The base panel has a plurality of heat
dissipation columns perpendicularly upwardly extending from the top
wall. The radiation fins are mounted on the heat dissipation
columns at different elevations. Each radiation fin has a plurality
of mounting through holes respectively press-fitted onto the heat
dissipation columns.
[0007] According to another aspect of the present invention, the
number of the radiation fins can be adjusted subject to different
heat dissipation requirements. When a relatively higher heat
dissipation power is required, the number of the radiation fins is
increased. On the contrary, when a relatively lower heat
dissipation power is required, the number of the radiation fins is
reduced. This arrangement fits different heat dissipation
requirements for different applications, providing the optimal heat
dissipation effect while simplifying the structure and saving the
cost.
[0008] According to still another aspect of the present invention,
the heat dissipation columns and the mounting through holes of the
radiation fins are made in any of a variety of shapes, for example,
rectangular, circular, cross-shaped, hexagonal, triangular or
elongated rectangular cross section.
[0009] According to still another aspect of the present invention,
the heat dissipation columns are stepped columns, and the size of
the mounting through holes of the radiation fins is relatively
modified to fit the stepped columns.
[0010] According to still another aspect of the present invention,
the base panel is extruded from aluminum or copper, and the bottom
wall of the base panel is mounted with a metal block that has a
relatively higher heat transfer coefficient.
[0011] According to still another aspect of the present invention,
the mounting through holes of the radiation fins are stepped
mounting through holes such that the flanges that extend around
each stepped mounting through hole of one radiation fin can be
fitted into the stepped mounting through holes of another radiation
fin.
[0012] According to still another aspect of the present invention,
the root or top end of each heat dissipation column is chamfered in
a taperedly chamfered form, convexly chamfered form or concavely
chamfered form. The chambered foot of each heat dissipation column
facilitates transfer of heat energy from the base panel to the body
of the respective heat dissipation column and then to the radiation
fins. The chambered top end of each heat dissipation column
facilitates insertion of the heat dissipation columns into the
mounting through holes of the radiation fins.
[0013] According to still another aspect of the present invention,
the base panel has a fan mounting region (either at one side or at
the center) for the mounting of a fan that is controlled to cause
currents of air toward the heat dissipation columns and the
radiation fins.
[0014] According to still another aspect of the present invention,
heat pipes may be fastened to the base panel and the radiation fins
to enhance heat dissipation performance. The heat pipes can be
directly press-fitted in bottom pipe grooves on the bottom wall of
the base panel.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] FIG. 1 is an exploded view of a heat sink in accordance with
one embodiment of the present invention.
[0016] FIG. 2 is an elevational assembly view of the heat sink
shown in FIG. 1.
[0017] FIG. 3 is an elevational assembly view of a heat sink in
accordance with another embodiment of the present invention.
[0018] FIG. 4 is a schematic top view of a part of the heat sink
shown in FIG. 3.
[0019] FIGS. 5.about.9 illustrate matching of radiation fins with
different configurations of heat dissipation columns according to
the present invention.
[0020] FIGS. 10.about.12 illustrate different shapes of the roots
of the heat dissipation columns according to the present
invention.
[0021] FIG. 13 is a side plan view of one embodiment of the heat
sink according to the present invention.
[0022] FIG. 14 is a schematic drawing of the present invention,
showing a bi-metal design of the base panel of the heat sink.
[0023] FIG. 15 is a schematic drawing of the present invention,
showing different heights of heat dissipation columns matched with
different sizes of radiation fins.
[0024] FIG. 16 is a schematic drawing of the present invention,
showing stepped form of heat dissipation columns matched with
different sizes of radiation fins.
[0025] FIG. 17 is a schematic drawing of the present invention,
showing the radiation fins provided with stepped mounting through
holes.
[0026] FIGS. 18.about.21 illustrate the top ends of the heat
dissipation columns of the base panel of the heat sink chamfered
differently according to the present invention.
[0027] FIG. 22 is an oblique elevation, showing a fan mounted on
the top wall of the base panel beyond the area of the heat
dissipation columns and the radiation fins according to the present
invention.
[0028] FIG. 23 illustrates another form of heat sink equipped with
a fan on the base panel according to the present invention.
[0029] FIG. 24 is an elevational view of a rectangular heat sink
with a fan mounted on the base panel at the center and surrounded
by the radiation fins according to the present invention.
[0030] FIG. 25 is an elevational view of a circular heat sink with
a fan mounted on the base panel at the center and surrounded by the
radiation fins according to the present invention.
[0031] FIG. 26 is a schematic top view of a rectangular heat sink
with heat pipes installed in the base panel and extended through
the radiation fins.
[0032] FIG. 27 is a sectional view taken along line A-A of FIG.
26.
[0033] FIG. 28 is a sectional view taken along line B-B of FIG.
26.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0034] Referring to FIGS. 1 and 2, a heat sink in accordance with
the present invention comprises a base panel 1 and a plurality of
radiation fins 2.
[0035] The base panel 1 is a flat metal member made of an excellent
heat conduction metal material (for example, aluminum or copper,
i.e., the so-called aluminum base or copper base), having a
plurality of heat dissipation columns 11 perpendicularly upwardly
extending from its top wall. The heat dissipation columns 11 are
arranged on the top side of the base panel 1 either in a regular or
irregular manner. According to this embodiment, the heat
dissipation columns 11 are arranged in an array. The radiation fins
2 have mounting through holes 21 respectively and tightly fastened
to the heat dissipation columns 11 in such a manner that the
radiation fins 2 are firmly supported on the heat dissipation
columns 11 at different elevations in a parallel manner.
[0036] By tightly fastening the mounting through holes 21 of the
radiation fins 2 to the heat dissipation columns 11 of the base
panel 1 to constitute the heat sink, the base panel 1 absorbs heat
energy from the attached semiconductor heat source (not shown) for
quick dissipation into the outside open air through the radiation
fins 2 via the heat dissipation columns 11.
[0037] According to the present invention, the heat dissipation
columns 11 are press-fitted into the mounting through holes 21 of
each radiation fin 2. The diameter of the mounting through holes 21
of the radiation fins 2 is slightly smaller than the diameter of
the heat dissipation columns 11 so that the heat dissipation
columns 11 can be tightly fitted into the mounting through holes 21
of each radiation fin 2. This assembly procedure is quite simple
and can save much of the cost.
[0038] The number of the radiation fins 2 is determined according
to the heat dissipation power required. When a relatively higher
heat dissipation power is required, the number of the radiation
fins 2 is increased. On the contrary, when a relatively lower heat
dissipation power is required, the number of the radiation fins 2
is reduced. This arrangement fits different heat dissipation
requirements for different applications, therefore it is able to
provide the optimal heat dissipation effect while simplifying the
structure and saving the cost.
[0039] There is no special limitation on the shape of the heat
dissipation columns 11 and the mounting through holes 21 of the
radiation fins 2. In the example shown in FIGS. 3 and 4, the heat
dissipation columns 11a and the mounting through holes 21a of the
radiation fins 2a have a cross-shaped cross section. In the example
shown in FIG. 5, the heat dissipation columns 11b and the mounting
through holes 21b of the radiation fins 2b have a rectangular cross
section. In the example shown in FIG. 6, the heat dissipation
columns 11c and the mounting through holes 21c of the radiation
fins 2c have a circular cross section. In the example shown in FIG.
7, the heat dissipation columns 11d and the mounting through holes
21dof the radiation fins 2d have a hexagonal cross section. In the
example shown in FIG. 8, the heat dissipation columns 11e and the
mounting through holes 21e of the radiation fins 2e have a
triangular cross section. In the example shown in FIG. 9, the heat
dissipation columns 11f and the mounting through holes 21f of the
radiation fins 2f have an elongated cross section.
[0040] Referring to FIGS. 10.about.12, the roots 121, 122 or 123 of
the heat dissipation columns 11 (11a.about.11f) that are bonded to
the top wall of the base panel 1 are made in any of a variety of
shapes, for example, taperedly chamfered, convexly chamfered, or
concavely chamfered, to allow heat energy to be rapidly transferred
from the base panel 1 through the roots 121, 122 or 123 to the heat
dissipation columns 11 (11a.about.11f) and then to the radiation
fins 2 for quick dissipation.
[0041] Referring to FIG. 13 and FIG. 1 again, each radiation fin 2
(or 2a.about.2f) has a flange 211 protruding from the top surface
around each mounting through hole 21 (or 21a.about.21f). The
flanges 211 increase the contact surface area between the radiation
fins 2 and the heat dissipation columns 11 (or 11a.about.11f) to
enhance heat transfer speed.
[0042] Referring to FIG. 14, the base panel 1b has a metal block 13
embedded in its bottom side in a flash manner for direct contact
with the semiconductor heat source (not shown). The metal block 13
is made of a metal material having a heat transfer coefficient
higher than the metal material (copper or aluminum) of the base
panel 1b.
[0043] Referring to FIG. 15, the heat dissipation columns 11 (or
11a.about.11f) can be made having different heights and mounted
with different sizes of radiation fins 2.
[0044] Further, the heat dissipation columns 11 (or 11a.about.11f)
of the base panel 1 can be stepped columns. As shown in FIG. 16,
each heat dissipation column 11 (or 11a.about.11f) has an upper
section 111, a middle section 112, and a lower section 113. The
middle section 112 has a diameter greater than the upper section
111 but smaller than the lower section 113. Further, the sizes of
the mounting through holes 21 of the respective radiation fins 2
fit the diameters of the sections 111, 112 and 113 of the heat
dissipation columns 11 (or 11a.about.11f) respectively.
[0045] Referring to FIG. 17, the mounting through holes 21g of the
radiation fins 2g are stepped through holes so that the radiation
fins 2g can be fastened together in a stack (by means of fitting
the stepped flanges that extend around each mounting through hole
of one radiation fin into the stepped flanges of another radiation
fin). This stepped mounting through hole design can also be used in
the design where the base panel is provided with stepped heat
dissipation columns.
[0046] Referring to FIG. 18, the top end 114 of each heat
dissipation column 11 is taperedly, convexly or concavely chamfered
to facilitate insertion of the heat dissipation columns 11 through
the mounting through holes of the radiation fins 2. Similarly, the
heat dissipation columns 11a, 11c, 11d shown in FIGS. 19.about.21
have the respective top ends 114a, 114c, 114d taperedly, convexly
or concavely chamfered.
[0047] The heat sink may be provided with a fan at the base panel
1. FIGS. 22 and 23 show a fan 3 or 3a mounted on a blank area at
the top wall of the base panel 1 at one side relative to the heat
dissipation columns 11 and the radiation fins 2.
[0048] Referring to FIG. 24, the heat sink has a rectangular
profile with a fan 3b mounted on the top wall of the base panel 1
at the center and surrounded by the radiation fins 2.
[0049] Referring to FIG. 25, the heat sink has a circular profile
with a fan 3c mounted on the top wall of the base panel 1 at the
center and surrounded by the radiation fins 2.
[0050] The heat sink can be mounted with a fan 3, 3a or 3b, and can
also be provided with one or a number of heat pipes 4. As shown in
FIGS. 26.about.28, the base panel 1 has a plurality of bottom pipe
grooves 14 on the bottom wall, and heat pipes 4 are respectively
press-fitted in the bottom pipe grooves 14 of the base panel 1 with
the flat bottom side of each heat pipe 4 kept in flush with the
bottom wall of the base panel 1 for direct contact with the
semiconductor heat source (not shown) to enhance heat dissipation
performance.
[0051] The arrangement of the base panel 1, the radiation fins 2,
the fan 3 (3a, 3b. 3c) and the heat pipes 4 is not limited to the
aforesaid embodiments. The heat pipes 4 can be fastened to the
radiation fins 2 with only their one end respectively extended to
the bottom side of the base panel 1 and embedded in the bottom pipe
grooves 14.
[0052] A prototype of heat sink has been constructed with the
features of FIGS. 1.about.28. The heat sink functions smoothly to
provide all of the features discussed earlier.
[0053] Although particular embodiments of the invention have been
described in detail for purposes of illustration, various
modifications and enhancements may be made without departing from
the spirit and scope of the invention. Accordingly, the invention
is not to be limited except as by the appended claims.
* * * * *