U.S. patent application number 11/954156 was filed with the patent office on 2009-06-11 for storage system for components incorporating a liquid-metal thermal interface.
This patent application is currently assigned to APPLE INC.. Invention is credited to Clayton R. Anderson, Sean A. Bailey, Richard Lidio Blanco, JR., Michael D. Hillman, Anwyl M. McDonald, Ronald J. Smith, Gregory L. Tice, Oscar Woo.
Application Number | 20090145802 11/954156 |
Document ID | / |
Family ID | 40720519 |
Filed Date | 2009-06-11 |
United States Patent
Application |
20090145802 |
Kind Code |
A1 |
Hillman; Michael D. ; et
al. |
June 11, 2009 |
STORAGE SYSTEM FOR COMPONENTS INCORPORATING A LIQUID-METAL THERMAL
INTERFACE
Abstract
Embodiments of an apparatus that functions as a storage system
for components are described. This apparatus includes a containment
vessel enclosing a desiccant and a device. This device includes a
layer mechanically coupled to a component, where the component can
be one of a semiconductor die and a heat-removal device. Moreover,
a thermal-interface material is coupled to a region of the layer,
and a boundary material is mechanically coupled to the layer, where
a perimeter defined by the boundary-material surrounds the
region.
Inventors: |
Hillman; Michael D.; (Los
Altos, CA) ; Tice; Gregory L.; (Los Altos, CA)
; Woo; Oscar; (Santa Cruz, CA) ; Blanco, JR.;
Richard Lidio; (Santa Clara, CA) ; Smith; Ronald
J.; (New Berlin, WI) ; Bailey; Sean A.; (Menlo
Park, CA) ; McDonald; Anwyl M.; (Oakland, CA)
; Anderson; Clayton R.; (El Cerrito, CA) |
Correspondence
Address: |
PVF -- APPLE INC.;c/o PARK, VAUGHAN & FLEMING LLP
2820 FIFTH STREET
DAVIS
CA
95618-7759
US
|
Assignee: |
APPLE INC.
Cupertino
CA
|
Family ID: |
40720519 |
Appl. No.: |
11/954156 |
Filed: |
December 11, 2007 |
Current U.S.
Class: |
206/701 ;
165/104.33 |
Current CPC
Class: |
H01L 23/26 20130101;
H01L 2924/3011 20130101; H01L 23/42 20130101; H01L 2924/0002
20130101; H01L 2924/0002 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
206/701 ;
165/104.33 |
International
Class: |
B65D 85/00 20060101
B65D085/00; F28D 15/00 20060101 F28D015/00 |
Claims
1. An apparatus, comprising: a containment vessel enclosing a
desiccant and a device, wherein the device includes: a layer
mechanically coupled to a component, wherein the component can be
one of a semiconductor die and a heat-removal device; a
thermal-interface material coupled to a region of the layer; and a
boundary material mechanically coupled to the layer, wherein a
perimeter defined by the boundary-material surrounds the
region.
2. The apparatus of claim 1, further comprising an exterior
containment vessel enclosing the containment vessel.
3. The apparatus of claim 1, further comprising another desiccant
within the exterior containment vessel but outside of the
containment vessel.
4. The apparatus of claim 1, wherein the thermal-interface material
includes a material that is a liquid metal over a range of
operating temperatures of the semiconductor die.
5. The apparatus of claim 1, wherein at least one of the layer and
an inner surface of the boundary material includes a material that
is resistant to corrosion by the thermal-interface material.
6. The apparatus of claim 5, wherein the material includes a
metal.
7. The apparatus of claim 5, wherein the material includes nickel,
a nickel alloy, or stainless steel.
8. The apparatus of claim 1, wherein at least one of the layer and
an inner surface of the boundary material includes a material that
has a permeability for water that is less than a pre-determined
value.
9. The apparatus of claim 1, wherein the layer is deposited or
adhered onto the component.
10. The apparatus of claim 1, wherein the boundary material is
mechanically coupled to the layer by grease.
11. The apparatus of claim 1, wherein the semiconductor die
includes a processor.
12. The apparatus of claim 1, wherein the thermal-interface
material includes a gallium-indium-tin alloy.
13. An apparatus, comprising: a layer mechanically coupled to a
component, wherein the component can be one of a semiconductor die
and a heat-removal device; another layer mechanically coupled to
another component; a thermal-interface material between the
component and the other component, wherein the thermal-interface
material is mechanically coupled to a region of the layer and to a
region of the other layer; and a boundary material mechanically
coupled to the layer and the other layer, wherein the
thermal-interface material is contained in a cavity defined, at
least in part, by the layer, the boundary material, and the other
layer.
14. The apparatus of claim 13, further comprising a desiccant
within the cavity.
15. The apparatus of claim 13, wherein the thermal-interface
material includes a material that is a liquid metal over a range of
operating temperatures of the semiconductor die.
16. The apparatus of claim 13, wherein at least one of the layer,
the other layer and an inner surface of the boundary material
includes a material that is resistant to corrosion by the
thermal-interface material.
17. The apparatus of claim 16, wherein the material includes a
metal.
18. The apparatus of claim 16, wherein the material includes
nickel, a nickel alloy, or stainless steel.
19. The apparatus of claim 13, wherein at least one of the layer,
the other layer and an inner surface of the boundary material
includes a material that has a permeability for water that is less
than a pre-determined value.
20. The apparatus of claim 13, wherein the layer is deposited or
adhered onto the component.
21. The apparatus of claim 13, wherein the boundary material is
mechanically coupled to the layer and the other layer by
grease.
22. The apparatus of claim 13, wherein the semiconductor die
includes a processor.
23. The apparatus of claim 13, wherein the thermal-interface
material includes a gallium-indium-tin alloy.
24. The apparatus of claim 13, further comprising: a containment
vessel enclosing the apparatus; and a desiccant within the
containment vessel.
Description
BACKGROUND
[0001] 1. Field of the Invention
[0002] The present invention relates to system for storing and
protecting components. More specifically, the present invention
relates to a system for storing and protecting components that
includes a liquid-metal thermal-interface material.
[0003] 2. Related Art
[0004] The functionality, performance, and operating speed of
integrated circuits (ICs) have increased significantly in recent
years. This has resulted in significantly increased power
consumption and associated heat generation in these devices.
Consequently, it is becoming a considerable challenge to maintain
acceptable internal and external operating temperatures in these
ICs.
[0005] One approach to managing the increasing thermal load is to
use an improved thermal-interface material between a semiconductor
die in an IC and an external environment (such as the IC package).
Proper operation of the semiconductor die over a range of operating
conditions determines several required properties for a candidate
thermal-interface material. In particular, the thermal-interface
material should not contain impurities and should not damage the
semiconductor die. Moreover, the thermal-interface material should
have a high bulk thermal conductivity and should conform to a
surface of the semiconductor die at ambient or low pressure,
thereby ensuring a low thermal impedance between the external
environment and the semiconductor die.
[0006] Several liquid metals are promising candidates as improved
thermal-interface materials. In principle, these liquid metals can
provide the required properties, if the liquid metals are dispensed
in a controlled manner. However, it is often difficult to work with
liquid metals. For example, liquid metals do not wet with many
materials. Consequently, it may be difficult to fabricate a thin
layer of liquid metal that conforms to the surface of the
semiconductor die. Moreover, many liquid metals are highly
corrosive and/or dissolve other metals, which makes them extremely
difficult to handle during manufacturing, thereby increasing the
complexity and the cost of the manufacturing processes, which may
prevent the use of these improved thermal-interface materials.
[0007] Hence what is needed are techniques for handling and
protecting components that include liquid metals without the
problems listed above.
SUMMARY
[0008] One embodiment of the present invention provides an
apparatus that includes a containment vessel enclosing a desiccant
and a device. This device includes a layer mechanically coupled to
a component, where the component can be one of a semiconductor die
and a heat-removal device. Moreover, a thermal-interface material
is coupled to a region of the layer, and a boundary material is
mechanically coupled to the layer, where a perimeter defined by the
boundary-material surrounds the region.
[0009] In some embodiments, the apparatus includes an exterior
containment vessel enclosing the containment vessel. Moreover,
another desiccant may be included within the exterior containment
vessel but outside of the containment vessel.
[0010] In some embodiments, the thermal-interface material includes
a material that is a liquid metal over a range of operating
temperatures of the semiconductor die.
[0011] In some embodiments, at least one of the layer and an inner
surface of the boundary material includes a material that is
resistant to corrosion by the thermal-interface material. For
example, the material may include a metal, such as nickel, a nickel
alloy, and/or stainless steel. Moreover, at least one of the layer
and the inner surface of the boundary material may include a
material which has a water permeability that is less than a
pre-determined value.
[0012] In some embodiments, the layer is deposited and/or adhered
onto the component.
[0013] In some embodiments, the boundary material is mechanically
coupled to the layer by grease.
[0014] In some embodiments, the semiconductor die includes a
processor.
[0015] In some embodiments, the thermal-interface material includes
a gallium-indium-tin alloy.
[0016] Another embodiment of the present invention provides another
apparatus that includes a layer mechanically coupled to a
component, and another layer mechanically coupled to another
component. Note that the component can be one of a semiconductor
die and a heat-removal device, and the other component can be a
dummy component. Moreover, a thermal-interface material resides
between the component and the other component, where the
thermal-interface material is mechanically coupled to a region of
the layer and to a region of the other layer. Additionally, a
boundary material is mechanically coupled to the layer and the
other layer, where the thermal-interface material is contained in a
cavity defined, at least in part, by the layer, the boundary
material, and the other layer.
[0017] In some embodiments, a desiccant is included within the
cavity.
[0018] In some embodiments, the thermal-interface material includes
a material that is a liquid metal over a range of operating
temperatures of the semiconductor die.
[0019] In some embodiments, at least one of the layer, the other
layer and an inner surface of the boundary material includes a
material that is resistant to corrosion by the thermal-interface
material. For example, the material may include a metal, such as
nickel, a nickel alloy, and/or stainless steel. Moreover, at least
one of the layer, the other layer and an inner surface of the
boundary material may include a material which has a permeability
for water that is less than a pre-determined value.
[0020] In some embodiments, the layer is deposited and/or adhered
onto the component.
[0021] In some embodiments, the boundary material is mechanically
coupled to the layer and the other layer by grease.
[0022] In some embodiments, the semiconductor die includes a
processor.
[0023] In some embodiments, the thermal-interface material includes
a gallium-indium-tin alloy.
[0024] In some embodiments, the other apparatus includes a
containment vessel enclosing the apparatus and another desiccant
within the containment vessel.
BRIEF DESCRIPTION OF THE FIGURES
[0025] FIG. 1 is a block diagram illustrating a chip package in
accordance with an embodiment of the present invention.
[0026] FIG. 2A is a block diagram illustrating a portion of a
process for applying a thermal-interface material in accordance
with an embodiment of the present invention.
[0027] FIG. 2B is a block diagram illustrating a portion of a
process for applying a thermal-interface material in accordance
with an embodiment of the present invention.
[0028] FIG. 2C is a block diagram illustrating a portion of a
process for applying a thermal-interface material in accordance
with an embodiment of the present invention.
[0029] FIG. 2D is a block diagram illustrating a portion of a
process for applying a thermal-interface material in accordance
with an embodiment of the present invention.
[0030] FIG. 3 is a block diagram illustrating a mask for use during
a process for applying a thermal-interface material in accordance
with an embodiment of the present invention.
[0031] FIG. 4 is a block diagram illustrating a chip package in
accordance with an embodiment of the present invention.
[0032] FIG. 5A is a block diagram illustrating a storage system for
components that incorporate a liquid metal in accordance with an
embodiment of the present invention.
[0033] FIG. 5B is a block diagram illustrating a storage system for
components that incorporate a liquid metal in accordance with an
embodiment of the present invention.
[0034] Note that like reference numerals refer to corresponding
parts throughout the drawings.
DETAILED DESCRIPTION
[0035] The following description is presented to enable any person
skilled in the art to make and use the invention, and is provided
in the context of a particular application and its requirements.
Various modifications to the disclosed embodiments will be readily
apparent to those skilled in the art, and the general principles
defined herein may be applied to other embodiments and applications
without departing from the spirit and scope of the present
invention. Thus, the present invention is not intended to be
limited to the embodiments shown, but is to be accorded the widest
scope consistent with the principles and features disclosed
herein.
[0036] Embodiments of an apparatus that includes a
thermal-interface material are described. This apparatus may be
assembled during a manufacturing or fabrication process. During the
process, surfaces on one or more components in the apparatus, such
as a heat-removal device and/or one or more semiconductor dies, may
be prepared, for example, by depositing one or more layers and/or
by adhering one or more films to these surfaces. These layers
and/or films may include materials that are compatible with the
thermal-interface material. In particular, the materials may have
properties that prevent the thermal-interface material from
damaging the components and which facilitate a low thermal boundary
impedance between the thermal-interface material and a given
surface. For example, one of the materials may be substantially
insoluble in the thermal-interface material and another of the
materials may wet the thermal-interface material.
[0037] Next, one or more regions may be defined on one or more of
the surfaces, for example, by adhering a mask (such as a contact
mask) onto the given surface. Then, the thermal-interface material
may be applied, for example, by using a spray-coating
technique.
[0038] Note that the one or more semiconductor dies may include a
processor, and the heat-removal device may include: a heat sink
(which may be made of a metal such as copper), a Peltier device, a
liquid-cooled cold plate, and/or a thermal reservoir. Moreover, the
thermal interface may include a metal in a liquid state (or more
generally, a metal alloy) as a thermal-interface material. This
metal or metal alloy (henceforth referred to as a liquid metal) may
have a low melting point (such as below room temperature or 25 C).
More generally, the liquid metal has a melting point which is below
an operating temperature of the semiconductor die.
[0039] In an exemplary embodiment, the liquid metal includes
gallium, indium, and tin. Note that the liquid metal may also
include elements other than metals, such as diamond or
graphite.
[0040] Moreover, during assembly of the apparatus a boundary
material (such as a metal-coated gasket) may be mechanically
coupled and/or chemically coupled to the semiconductor die and the
heat-removal device, thereby defining a cavity that includes the
thermal-interface material. When assembled, the thermal-interface
material may be mechanically coupled and/or chemically coupled to
regions in layers or films on the semiconductor die and the
heat-removal device, which may include at least one of the
previously described materials or another material. For example,
these layers may include a material that is resistant to corrosion
by the thermal-interface material and/or a material which has a
permeability for water that is less than a pre-determined
value.
[0041] In some embodiments, the boundary material is mechanically
coupled and/or chemically coupled to the semiconductor die and the
heat-removal device by grease. Moreover, the apparatus may include
a desiccant in the cavity.
[0042] In some embodiments, a service kit is used to store and
protect components, such as the semiconductor die and/or the
heat-removal device, after an intermediate operation during the
assembly process (such as after the thermal-interface material is
applied). This service kit may include one or more containment
vessels (such as an internal containment vessel and an external
containment vessel), each of which may include a desiccant. For
example, the semiconductor die, thermal-interface material and the
boundary material may be contained within the one or more
containment vessels. Moreover, a dummy layer may be coupled to the
boundary material to complete the cavity surrounding the
thermal-interface material within the internal containment
vessel.
[0043] In the discussion that follows, a semiconductor die is
understood to include: a bare die, a packaged die, multiple die,
and/or two or more die in a single package (which is sometimes
referred to as a multi-chip module).
[0044] By including the boundary material and thus defining the
cavity, which isolates or contains the liquid metal and protect the
liquid metal from contamination, the apparatus may facilitate the
use of the liquid metal as a thermal-interface material. Moreover,
the liquid metal may improve thermal coupling between the
heat-removal device and the one or more semiconductor dies. In
particular, the liquid metal may facilitate a low thermal impedance
between the one or more semiconductor dies and the heat-removal
device. In an exemplary embodiment, the liquid metal has a bulk
thermal conductivity between 7 and 100 W/mK. Furthermore, the
thermal impedance may be low even when the semiconductor dies have
different thicknesses or if surfaces of two semiconductor dies that
are in contact with the liquid metal are in different planes.
[0045] This improved thermal coupling may facilitate operation of
the semiconductor die at elevated temperatures and/or high power.
Moreover, the liquid metal may facilitate improved thermal coupling
at ambient or at low pressures (i.e., pressures below atmospheric
pressure), thereby simplifying and reducing the cost of a chip
package (such as the apparatus) that includes the one or more
semiconductor dies. In some embodiments, the liquid metal does not
form a permanent bond with the one or more semiconductor dies, thus
allowing the chip package to be reworked.
[0046] Consequently, the apparatus (and the process) described
below facilitate the use of liquid metal as the thermal-interface
material, and thus, the operation of the one or more semiconductor
dies at high thermal loads. Moreover, by using the apparatus and/or
the process, the liquid metal can be dispensed and contained in a
controlled manner, without damaging the components, and without
increasing the complexity and/or the cost associated with
manufacturing the chip package.
[0047] We now describe embodiments of an apparatus that includes a
thermal-interface material. FIG. 1 presents a block diagram
illustrating an embodiment of a chip package 100. This chip package
includes at least one semiconductor die, such as semiconductor die
110, and a heat-removal device 112. During operation of the chip
package 100, heat is generated by electrical circuits and/or
components on the semiconductor die 110. To improve the thermal
coupling between the heat-removal device 112 and the semiconductor
die 110 (and thus, to improve the transport of heat from the
semiconductor die 110 to the heat-removal device 112) a thermal
interface including a thermal-interface material 114 having a
thickness 116 may be included between a surface of the
semiconductor die 110 and a surface of the heat-removal device 112.
In an exemplary embodiment, the thickness 116 is between 1-150
.mu.m at atmospheric pressure or at a contact pressure of 5
psi.
[0048] As noted previously and discussed further below, the
thermal-interface material 114 may be a liquid (i.e., a material
without shear strength) at room temperature and/or an operating
temperature (such as 80, 100, or 125 C) of the semiconductor die
110. Consequently, a gasket 118 may be mechanically coupled and/or
chemically coupled to the semiconductor die 110 and the
heat-removal device 112 in the chip package 100, both to contain
the liquid thermal-interface material 114 and to protect it from
contamination. Note that there may be a void (indicated by the
hatched region) between the thermal-interface material 114 and the
gasket 118.
[0049] In principle, a wide variety of thermal-interface materials
may be used to provide the thermal interface. However, many
existing thermal-interface materials have melting points above room
temperature. Note that existing thermal-interface materials
include: conventional heat-sink grease (such as silicone-based
grease), thermally conductive pads, phase-change materials (such as
wax-based materials), heat-transfer fluids (such as ethylene glycol
or propylene glycol), water, or thermally conductive solders (such
as commercially pure indium). As discussed below, low-melting point
metal alloys (such as a liquid metal that has a melting-point below
room temperature or 25 C) have superior physical properties that
may facilitate improved operation of the one or more semiconductor
dies.
[0050] In particular, the physical properties of these metal alloys
enable them to conform to the surfaces of the one or more
semiconductor dies, even if the semiconductor dies have different
thicknesses and/or have surfaces that are not coplanar.
Consequently, thermal boundary resistances associated with
low-melting point metal alloys may be small.
[0051] Moreover, low-melting point metal alloys have high bulk
thermal conductivities, which, in conjunction with the low boundary
resistances, may result in a low thermal resistance between the
semiconductor die 110 and the heat-removal device 112. In turn, a
low thermal resistance may reduce the sensitivity to changes in the
thickness 116 of the thermal-interface material 114 (which is also
referred to as a bond-line thickness). For example, the
thermal-interface material 114 may have a bulk thermal conductivity
between 7 and 100 W/mK and the thermal resistance of the thermal
interface may be less than 0.2 K/W. Consequently, a thermal
difference or gradient .DELTA.T between the semiconductor die 110
and the heat-removal device 112 may be significantly reduced or
eliminated relative to the thermal gradient associated with other
thermal-interface materials. Furthermore, because the metal alloys
are already liquid at the operating temperatures of the one or more
semiconductor dies, the thermal-interface material 114 will not be
near a critical thermal breakdown temperature.
[0052] In some embodiments, the liquid metal is configured such
that a permanent chemical bond does not occur with the
semiconductor die 110 and/or the heat-removal device 112. This
property facilitates easier cleaning of these components (for
example, using a vacuum, a mechanical wipe, and/or a cleaning
agent, such as acetone and/or isopropyl alcohol) and/or rework of
the chip package 100.
[0053] In some embodiments, the thermal-interface material 114 in
the thermal interfaces includes: bismuth, lead, zinc, sliver, gold,
tin, chromium, nickel, aluminum, palladium, platinum, tantalum,
gallium, indium, and/or titanium. For example, the
thermal-interface material 114 may include metallic particles of
one or more of the preceding materials. In some embodiments, the
thermal-interface material 114 is an alloy that includes 1, 2, 3,
or more metal elements. In some embodiments, the thermal-interface
material 114 is a eutectic material. Moreover, in some embodiments
the liquid metal may be doped with other materials, such as diamond
and/or graphite. These materials may increase or enhance
interfacial adhesion between the liquid metal and the semiconductor
die 110 and the heat-removal device 112. In general, the liquid
metal may include a variety of organic and/or inorganic
compounds.
[0054] In an exemplary embodiment, the liquid metal is an alloy
that includes gallium, indium, and tin (or a similar density liquid
metal). This alloy can be formulated in a variety of compositions,
including eutectic gallium-indium-tin alloy (62.5% gallium, 21.5%
indium, and 16.0% tin) with a melting point of 10.7 C and
Galinstan.TM. (68.5% gallium, 21.5% indium, and 10.0% tin) with a
melting point of around 22 C. In some embodiments, the
gallium-indium-tin alloy includes between 55-75% gallium, 15-25%
indium, and 5-20% tin. In another embodiment, the thermal-interface
material 114 includes 75.5% gallium and 15.7% indium, with a
melting temperature of 15.7 C, or 62.5% gallium, 21.5% indium, and
10.7% tin, with a melting temperature of 10.7 C.
[0055] Note that in some embodiments chip package 100 includes
fewer or additional components. Moreover, two or more components
are combined into a single component, and/or a position of one or
more components may be changed.
[0056] We now discuss embodiments of a method for applying a
thermal-interface material, such as the thermal-interface material
114, to one or more surfaces of the semiconductor die 110 and/or
the heat-removal device 112. FIG. 2A presents a block diagram 200
illustrating an embodiment of a portion of a process for applying
the thermal-interface material 114 (FIG. 1). During this process,
one or more semiconductor dies, such as semiconductor die 110,
and/or heat-removal device 112 may be attached to one or more
carriers, such as carrier 210. This carrier facilitates
transportation of the components during the manufacturing process
and protects the components from corrosion by the thermal-interface
material 114 (FIG. 1).
[0057] Moreover, the carrier 210 may allow the tooling in the
remainder of the process to be common, i.e., to be used with any of
the components. While not shown, the carrier 210 may include
alignment features, which may be used to position one or more masks
relative to the components (as discussed further below with
reference to FIGS. 2B and 2C). In some embodiments, a surface 212
of the carrier 210 is coplanar with surfaces 214 of the components
that will be coated with the thermal-interface material 114 (FIG.
1).
[0058] Carrier 210 may include a material that resists corrosion by
the thermal-interface material 114 (FIG. 1). In some embodiments,
the carrier 210 includes: stainless steel, steel, polycarbonate,
and/or a chemically inert material.
[0059] In order to achieve uniform and complete coverage of the
desired portions of the surfaces 214, either or both of these
surfaces may be prepared by plating an initial layer onto these
surfaces 214. For example, a nickel-copper layer may be plated onto
the semiconductor die.
[0060] Then, one or more additional layers or films may be
deposited and/or adhered to either or both of the surfaces 214.
This is shown in FIG. 2B, which presents a block diagram 220
illustrating an embodiment of a portion of a process for applying
the thermal-interface material 114 (FIG. 1). In particular, a layer
including an insoluble material 230 that will not dissolve in the
presence of the thermal-interface material 114 (FIG. 1) may be
deposited and another layer that includes a wetting material 234
(i.e., a material that will wet with the thermal-interface material
114 in FIG. 1) may be deposited above the layer. In some
embodiments, yet another layer that includes an optional
inter-metallic compound 232 may be deposited between these
layers.
[0061] In general, the layers shown in block diagram 220 include a
metal (or more generally, a metal alloy), such as gold, platinum,
tantalum, titanium, tin, chromium, nickel, zinc, silver, and/or
aluminum. Moreover, in some embodiments the layers may include an
adhesion promoter, such as an RCA-1 surface preparation and/or a
silated promoter.
[0062] In an exemplary embodiment, the insoluble material 230
includes titanium, the wetting material 234 includes gold, and the
optional inter-metallic compound 232 includes a gold-titanium
alloy. Moreover, a thickness of the layer of insoluble material 230
may be 300 nm, a thickness of the layer of wetting material 234 may
be between 10-300 nm, and a thickness of the layer of optional
inter-metallic compound 232 maybe less than 100 nm.
[0063] Note that a variety of techniques may be used to deposit
these layers, including: plating, evaporation, and/or sputtering.
Moreover, prior to this operation the underlying surface may be
intentionally roughened (for example, using electromechanical
polishing) to promote adhesion.
[0064] In an exemplary embodiment, deposition of the insoluble
material 230, the wetting material 234, and/or the optional
inter-metallic compound 232 includes sputtering. Regions on the
surfaces 214 (FIG. 2A) that are to be coated may be defined using a
shadow mask. This mask may have an edge tolerance of 0.5 mm.
[0065] However, in other embodiments at least some of the layers
may be adhered instead of deposited onto the surfaces 214 (FIG.
2A). For example, a pre-existing titanium film on a polymer backing
may be applied and adhered to the semiconductor die 110 and/or the
heat-removal device 212 using epoxy or a resin cement, such as
M-bond from Tokuyama America, Inc., in Burlingame, Calif. In some
embodiments, these films may be carefully pressed on, for example,
using a backing and low pressure.
[0066] After the one or more layers have been deposited and/or
adhered to the semiconductor die 110 and/or the heat-removal device
212, the resulting surfaces may be burnished or polished to reduced
roughness. Moreover, these surfaces may be cleaned using chemicals,
such as acetone and/or isopropyl alcohol.
[0067] Next, regions where the thermal-interface material 114 (FIG.
1) is to be applied may be defined by adhering one or more masks
(such as a contact mask) onto the semiconductor die 110 and/or the
heat-removal device 212. This is shown in FIG. 2C, which presents a
block diagram 240 illustrating an embodiment of a portion of a
process for applying the thermal-interface material 114 (FIG. 1).
In particular, mask 254 may be adhered to a surface 252 of a
component 250 (such as the semiconductor die 110 or the
heat-removal device 212 in FIG. 2B) and/or the carrier 210, thereby
creating a bridge between the component 250 and the carrier 210,
which may help hold the component 250 to the carrier 210. This mask
254 may limit an area or region 258 where the thermal-interface
material 114 (FIG. 1) is applied (as discussed further below with
reference to FIG. 2D). As noted previously, the position of the
mask 254 may, at least in part, be determined by alignment features
on the carrier 210.
[0068] In an exemplary embodiment, mask 254 includes a multi-layer
structure. This is shown in FIG. 3, which presents a block diagram
illustrating an embodiment of a mask 300 for use during a process
for applying the thermal-interface material 114 (FIG. 1). This mask
includes layers with non-adhesive material 310 (such as paper
and/or Mylar.RTM.) sandwiching an adhesive material 312 (such as a
rubber-based adhesive and/or an acrylic-based adhesive). In some
embodiments, the non-adhesive material 310 includes: 3M 7731FL, 3M
FP024502, 3M 7113, 3M 7816, 3M 76999, 3M 7812, and/or 3M 7600 (from
3M Corporation, in St. Paul, Minn.) Alternatively, the non-adhesive
material 310 may include: Bay Area Labels (BAL) 9415 A-10, BAL K22,
BAL V23, BAL KX04, BAL P66, BAL P07, BAL K10-8, BAL K47, BAL P05,
BAL K72-8, BAL M81-1.5, BAL P03, BAL K85, and/or BAL V86-4 (from
Bay Area Labels, Inc., in San Jose, Calif.).
[0069] Adhesive material 312 may form a temporary or a permanent
bond, and may have a high pull strength or a low pull strength. In
general, the adhesive material 312 is chosen so that it does not
leave a residue on the surface 252 (FIG. 2C) and will not to
disturb thermal-interface material 114 (FIG. 1) when the mask 300
is removed. Moreover, gaps may be defined in at least one of the
layers in the mask 300, leaving exposed regions, such as exposed
region 314. These exposed regions of adhesive may adhere to the
carrier 210 (FIG. 2C) and/or the component 250 (FIG. 2C).
[0070] Referring back to FIG. 2C, the geometry of the exposed
regions may be selected so that the thermal-interface material 114
(FIG. 1) does not leak under the mask 254 and so that the
thermal-interface material 114 (FIG. 1) is not moved or disturbed
when the mask 254 is removed after the thermal-interface material
114 (FIG. 1) is applied (which is discussed below with reference to
FIG. 2D). In some embodiments, a tamp-down fixture, such as a
gasket, is used to push down on the adhesive in the exposed regions
with a uniform pressure, thereby properly adhering the mask 254 to
the carrier 210 and/or the component 250.
[0071] In some embodiments, a region, such as corner region 256, of
the mask 254 may have more exposed regions, i.e., more adhesion
between the adhesive material 312 (FIG. 3) and the component 250.
This may reduce or eliminate disturbance of the thermal-interface
material 114 (FIG. 1) when the mask 254 is subsequently
removed.
[0072] Having prepared the surfaces 214 (FIG. 2A) and defined
regions, such as region 258, the thermal-interface material 114
(FIG. 1) may be applied to the semiconductor die 110 (FIG. 2B)
and/or the heat-removal device 112 (FIG. 2B). This is shown in FIG.
2D, which presents a block diagram 270 illustrating an embodiment
of a portion of a process for applying the thermal-interface
material 114 (FIG. 1). During this portion of the process, one or
more carriers and/or components (such as the semiconductor die 110
and/or the heat-removal device 112 in FIG. 2B) may be placed into a
containment box (not shown). In conjunction with the mask 254 (FIG.
2C), this containment box protects corrosion-sensitive contact pads
on the components from exposure to the thermal-interface material
114 (FIG. 1). In particular, only the mask 254 (FIG. 2C) and
regions, such as region 258 (FIG. 2C), are exposed, and the mask
254 (FIG. 2C) may ensure that the applied thermal-interface
material 114 (FIG. 1) is confined to these regions. In an exemplary
embodiment, the containment box includes stainless steel, steel,
and/or nickel. Moreover, in some embodiments the containment box
includes an integrated fluid recovery system (to recycle excess
material) and/or replaceable gaskets.
[0073] As discussed previously, the thermal-interface material 114
(FIG. 1) applied may be a metal alloy, such as a gallium-indium-tin
eutectic. Component materials in this metal alloy may have a purity
of 99.99% or better. These component materials may be mixed at 150
C with a composition tolerance of 0.5%. Note that the component
materials may be obtained from a variety of suppliers, including
Alfa Acsar, Inc., in Ward Hill, Mass. Alternatively, the metal
alloy may be purchased pre-mixed from suppliers, such as AIM
Specialty Alloys, Inc., in Cranston, R.I.
[0074] In order to obtain the desired physical properties, the
applied thermal-interface material 114 (FIG. 1) should be thin
(with a thickness 116 in FIG. 1 between 1-150 .mu.m), and should
uniformly and completely cover the regions, such as the region 258
(FIG. 2C). Moreover, in order to reduce the manufacturing cost, the
process of applying the thermal-interface material 114 (FIG. 1)
should avoid waste (for example, by not applying excess material)
and should offer high volume and high yield.
[0075] However, many liquid metals tend to bead on many surfaces.
To avoid this, an atomization process may be used to provide energy
to initiate wetting with the surfaces 214 (FIG. 2A) of the
component 250. As shown in block diagram 270, nozzle 280 provides a
spray 282 that spray coats the thermal-interface material 114 (FIG.
1) onto the regions (such as region 258 in FIG. 2C) defined by the
mask 254. In some embodiments, a raster pattern (which includes a
sequence of parallel deposition paths) is used to reduce or
minimize the amount of the thermal-interface material 114 (FIG. 1)
used and to obtain a uniform coverage.
[0076] During application of the thermal-interface material 114
(FIG. 1), the thermal-interface material 114 (FIG. 1) may be
injected into a deposition chamber through an extended spray valve
using a cartridge and a pressure between 8-12 psi. This cartridge
may have a threaded connector to couple to the deposition chamber
and may include a dual plunger to prevent leakage. In some
embodiments, the cartridge includes a material resistant to
corrosion, such as high-density polyethylene, stainless steel,
and/or nickel. Moreover, the spray valve may utilize a design
described in U.S. Pat. No. 6,523,757, entitled "Compact Spray
Valve," the contents of which are hereby incorporated by
reference.
[0077] As the thermal-interface material 114 (FIG. 1) is pushed
through the spray valve, a sequence of bubbles are formed. An
atomizing gas strikes these bubbles, blowing them apart and
atomizing the thermal-interface material 114 (FIG. 1) and producing
the spray 282. In an exemplary embodiment, the nozzle 280 is 8-10
mm from the component 250 and the cartridge and spray valve are
heated to 35-40 C. Moreover, the atomizing gas may nitrogen with a
pressure between 10-13 psi, the raster speed may be between 100-200
mm/s, and the deposition rate may be 12 mg/s.
[0078] Note that the amount of material applied may be monitored to
ensure proper coverage and to prevent overflow. In some
embodiments, this monitoring includes visual inspection (for
example, looking for pin holes and/or determining the transparency
of the film) and/or weighing the applied thermal-interface material
114 (FIG. 1). In an exemplary embodiment, 50 mg of liquid metal are
applied to the surface of a given component, such as the component
250.
[0079] While spray coating has been described as an illustrative
example, in other embodiments other techniques may be used
separately or in conjunction with spray coating, including
print-head technology and/or silk screening. Moreover, a variety of
techniques may be used to spread the thermal-interface material 114
(FIG. 1) and improve the uniformity of the thickness 116 (FIG. 1),
including: angular acceleration (for example, by spinning the
component 250), magnetic hydrodynamics (where current in the
thermal-interface material 114 in FIG. 1 generates a magnetic field
that propels it in the region 258 in FIG. 2C), ultrasound, and/or
mechanical vibration. In some embodiments, an integrated sonicator,
which floats on the thermal-interface material 114 (FIG. 1) during
or after deposition, is used to improve the uniformity of the
thickness 116 (FIG. 1). In other embodiments, the thermal-interface
material 114 (FIG. 1) is applied as a solid, which becomes a liquid
at an operating temperature of the semiconductor die 110 (FIG.
1).
[0080] Note that in some embodiments block diagrams 200 (FIG. 2A),
220 (FIG. 2B), 240 (FIG. 2C), and/or 270, as well as mask 300 (FIG.
3), include fewer or additional components. Moreover, two or more
components are combined into a single component, and/or a position
of one or more components may be changed.
[0081] After the thermal-interface material is applied, mask 254
(FIG. 2D) may be removed. Next, the semiconductor die 110 (FIG. 2B)
and the heat-removal device 112 (FIG. 2B) may be assembled with a
boundary material (such as a gasket) in a chip package, such as the
chip package 110 (FIG. 1). In particular, grease, such as
Krytox.RTM. (from DuPont.TM., in Wilmington, Del.), may be applied
to the heat-removal device 112 (FIG. 2B), and a gasket may be
picked and placed onto the heat-removal device 112 (FIG. 2B). Then,
grease may be applied to the top of the gasket, and the
semiconductor die 110 (FIG. 2B) may be picked and placed onto the
gasket. Note that placement may be based on optical and/or
mechanical alignment features, such as pins and/or holes. In some
embodiments, blue light is used to enhance contrast during assembly
of the chip package.
[0082] FIG. 4 presents a block diagram illustrating an embodiment
of a resulting chip package 400. In this chip package, the
thermal-interface material 114 may be contained within a cavity
defined, at least in part, by gasket 118 and layers 410, such as
one or more of the layers illustrated in FIG. 2B. In some
embodiments, inner surfaces of this cavity may include a material
that is resistant to corrosion by the thermal-interface material
114 and/or which has a permeability for water that is less than a
pre-determined value, such that a water-vapor transmission ratio of
the cavity is 10 .mu.g/hr. For example, the material may include a
metal, such as nickel, a nickel alloy, and/or stainless steel.
[0083] Consequently, gasket 118 may include a metal coating on an
inner surface. For example, gasket 118 may be a stamped metal or a
metal-coated plastic. In some embodiments, a tire-style gasket is
used to increase an overflow volume. Moreover, the gasket 118 may
have a flat surface that facilitates less stringent manufacturing
and/or assembly tolerances.
[0084] In some embodiments, the cavity includes one or more
desiccants 414 to further protect the thermal-interface material
114 from water. This desiccant may include: type 3A, type 4A, type
7A, an alumina-silica desiccant, and/or a molecular-sieve
desiccant. In some embodiments, desiccant 414 is rechargeable. For
example, desiccant 414 may include silicon rubber and a molecular
sieve.
[0085] In some embodiments, the chip package 400 includes one or
more optional mechanical coupling elements 416 (such as screws or
springs) that are mechanically coupled to the heat-removal device
112. These optional mechanical coupling elements 416 may couple the
heat-removal device 112 to another component. For example, the
other component may include a motherboard, a chassis, and/or a
processor in a computer.
[0086] Note that in some embodiments chip package 400 includes
fewer or additional components. Moreover, two or more components
are combined into a single component, and/or a position of one or
more components may be changed.
[0087] In some embodiment, assembly of the chip module 400 occurs
over a time interval. For example, application of the
thermal-interface material 114 to the semiconductor die 110 may
occur at a different time that application of the thermal-interface
material 114 to the heat-removal device 112. Moreover, these
components may be processed on separate fabrication lines and/or at
different locations.
[0088] Consequently, there may be a need to store and protect
components that include the thermal-interface material 114 (for
example, from water vapor) until the assembly of the chip-module
400 is completed. This may be accomplished using a service kit,
such as the storage system 500 illustrated in FIG. 5A. This storage
system includes one or more containment vessels 514 surrounding a
component 510, such as the semiconductor die 410 (FIG. 4) or the
heat-removal device 412 (FIG. 4), after the thermal-interface
material 114 has been applied. These containment vessels 514 may
have a low permeability for water. For example, a given containment
vessel, such as containment vessel 514-1, may include a
metal-coated plastic bag. Moreover, the protection from water vapor
may be increased by including optional desiccants 516 in each of
the containment vessels 514.
[0089] Note that containment vessels 514 effectively complete the
cavity surrounding the thermal-interface material 114. However, in
other embodiments a dummy component is used to temporarily complete
the cavity until the assembly process with the remaining real
components is completed. This is shown in FIG. 5B, which presents a
block diagram illustrating a storage system 530 for components that
incorporate a liquid metal. In particular, dummy component 512 is
coupled to gasket 118 by grease 412.
[0090] In an exemplary embodiment, two metal-coated plastic
containment vessels 514 are used to store and protect the component
510. These plastic containment vessels may be anti-static and the
metal coating may have a thickness of at least 25 .mu.m. Moreover,
optional desiccant 516-1 may weigh 5 g and optional desiccant 516-2
may weigh 20 g. These desiccants may be a type 4A molecular sieve
and/or a silica desiccant. In some embodiments, the containment
vessels 514 are vacuum packed.
[0091] Note that in some embodiments storage systems 500 (FIG. 5A)
and/or 530 may include fewer or additional components. For example,
the cavity in storage system 530 may include desiccants, such as
desiccants 414 (FIG. 4). Moreover, additional containment vessels,
surrounding containment vessels 514, may be used. Moreover, two or
more components are combined into a single component, and/or a
position of one or more components may be changed.
[0092] The foregoing descriptions of embodiments of the present
invention have been presented for purposes of illustration and
description only. They are not intended to be exhaustive or to
limit the present invention to the forms disclosed. Accordingly,
many modifications and variations will be apparent to practitioners
skilled in the art. Additionally, the above disclosure is not
intended to limit the present invention. The scope of the present
invention is defined by the appended claims.
* * * * *