U.S. patent application number 11/996060 was filed with the patent office on 2009-05-21 for sheet cutting device and cutting method.
This patent application is currently assigned to LINTEC CORPORATION. Invention is credited to Kenji Kobayashi, Kan Nakata, Hideaki Nonaka, Yoshiaki Sugishita.
Application Number | 20090126542 11/996060 |
Document ID | / |
Family ID | 37708658 |
Filed Date | 2009-05-21 |
United States Patent
Application |
20090126542 |
Kind Code |
A1 |
Nonaka; Hideaki ; et
al. |
May 21, 2009 |
SHEET CUTTING DEVICE AND CUTTING METHOD
Abstract
A cutting device 15 that, after a sheet S is stuck on a wafer W
on a sticking table 13, cuts the sheet S along the outer edge of
the wafer. The cutting device 15 comprises a robot body 62 disposed
beside the sticking table 13 and a cutter blade 63 supported by a
tool holding chuck 69 positioned at the front end of the robot body
62. The cutter blade 63 is detachably attached to the tool holding
chuck so as to be replaceable and is arranged so as to cut the
sheet S in a state that the posture thereof is adjusted along a
preset movement track.
Inventors: |
Nonaka; Hideaki; (Tokyo,
JP) ; Nakata; Kan; (Tokyo, JP) ; Sugishita;
Yoshiaki; (Tokyo, JP) ; Kobayashi; Kenji;
(Tokyo, JP) |
Correspondence
Address: |
LOWE HAUPTMAN HAM & BERNER, LLP
1700 DIAGONAL ROAD, SUITE 300
ALEXANDRIA
VA
22314
US
|
Assignee: |
LINTEC CORPORATION
TOKYO
JP
|
Family ID: |
37708658 |
Appl. No.: |
11/996060 |
Filed: |
July 21, 2006 |
PCT Filed: |
July 21, 2006 |
PCT NO: |
PCT/JP2006/314484 |
371 Date: |
January 17, 2008 |
Current U.S.
Class: |
83/43 ;
83/597 |
Current CPC
Class: |
B26D 1/1535 20130101;
B26D 3/10 20130101; B26D 7/015 20130101; Y10T 83/8798 20150401;
B26D 7/2614 20130101; Y10T 83/0467 20150401; B25J 15/04 20130101;
Y10T 83/0543 20150401; Y10T 83/8821 20150401; H01L 21/67092
20130101; B26D 7/22 20130101; Y10T 83/9457 20150401; Y10T 156/12
20150115; B25J 11/0055 20130101; H01L 21/67132 20130101; Y10T
83/0393 20150401; B26F 1/3846 20130101 |
Class at
Publication: |
83/43 ;
83/597 |
International
Class: |
B26D 3/00 20060101
B26D003/00; B26D 5/08 20060101 B26D005/08 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 4, 2005 |
JP |
2005-226334 |
Jan 25, 2006 |
JP |
2006-015783 |
Claims
1. A sheet cutting device to cut a sheet stuck on an adherend on a
sticking table, comprising: a robot body and a cutter blade
supported on a free-end of the robot body, wherein said robot body
is a multi-joint robot having a plurality of joints and these
joints are controlled based on numerical information.
2. A sheet cutting device to cut a sheet stuck on an adherend on a
sticking table, comprising: a robot body disposed beside said
sticking table and a cutter blade supported on a free-end side of
the robot body and arranged so as to move along a preset track,
wherein said robot body includes a tool holding chuck on the
free-end side, and the cutter blade is detachably attached thereto
via the tool holding chuck.
3. The sheet cutting device according to claim 1, wherein said
cutter blade incorporates a heater therein.
4. The sheet cutting device according to claim 1, wherein said
cutter blade is arranged so as to vibrate via a vibrating
device.
5. The sheet cutting device according to claim 1, wherein said
robot body supports said cutter blade so as to adjust the posture
of the cutter blade when cutting the sheet along the outer
periphery of said adherend.
6. The sheet cutting device according to claim 5, wherein a posture
of the cutter blade in said sheet cutting operation maintains a
toe-in angle with which the center line of the cutter blade is
inclined with respect to the cutting direction viewed from the top
in the cutting direction, and a blade edge of the cutter blade is
positioned closer to the outer periphery of the adherend than the
back portion of the cutter blade.
7. The sheet cutting device according to claim 5, wherein the
posture of the cutter blade in said sheet cutting operation
maintains a camber angle with which the center line of the cutter
blade is inclined viewed from the front in the cutting direction,
and said sheet is cut with no protrusion out of the outer periphery
of said adherend.
8. The sheet cutting device according to claim 5, wherein the
posture of the cutter blade in said sheet cutting operation
maintains a caster angle with which the center line of said cutter
blade is inclined in the cutting direction viewed from the side in
the cutting direction, and the angle formed between said sheet and
the blade edge is kept at an acute angle.
9. The sheet cutting device according to claim 1, wherein an
inspection means for inspecting cutter blades is disposed in the
vicinity of said robot body.
10. A sheet cutting method to cut a sheet stuck on an adherend on a
sticking table, wherein a multi-joint robot body is used, the robot
having a plurality of joints controlled based on numerical
information and holding a cutter blade on a free-end of the robot
body in a state enabling to adjust a posture of the cutter blade,
and said sheet is cut by movement of said cutter blade along a
preset track.
11. A sheet cutting method to cut a sheet stuck on an adherend on a
sticking table, wherein a cutting device is used, a robot body of
which is disposed beside said sticking table and holds a cutter
blade on a free end thereof in a state enabling to adjust a posture
of the cutter blade, and the cutting device includes a cutter blade
and said sheet is cut by movement of said cutter blade along a
preset track.
12. The sheet cutting method according to claim 10, wherein the
sheet is cut in a state that said cutter blade is heated.
13. The sheet cutting method according to claim 10, wherein said
cutter blade cuts the sheet while being vibrated.
14. The sheet cutting method according to claim 10, wherein the
cutter blade maintains a toe-in angle with which the center line of
said cutter blade is inclined with respect to the cutting direction
viewed from the top in the cutting direction, and the sheet is cut
in a state that a blade edge of the cutter blade is positioned
closer to the outer periphery of the adherend than the back portion
of the cutter blade.
15. The sheet cutting method according to claim 10, wherein the
cutter blade maintains a camber angle with which the center line of
said cutter blade is inclined viewed from the front in the cutting
direction, and said sheet is cut with no protrusion out of the
outer periphery of said adherend.
16. The sheet cutting method according to claim 10, wherein the
cutter blade maintains a caster angle with which the center line of
said cutter blade is inclined in the cutting direction viewed from
the side in the cutting direction, and the sheet is cut while
keeping the angle formed between said sheet and the blade edge at
an acute angle.
17. The sheet cutting method according to claim 10, wherein said
sheet is an adhesive sheet temporarily stuck on a strip of release
liner as an adherend via an adhesive, and the adhesive sheet and
adhesive are cut without cutting said release liner.
18. The sheet cutting method according to claim 10, wherein said
sheet is an adhesive sheet temporarily stuck on a strip of release
liner as an adherend via an adhesive; and a partial cutting is made
to form a cutoff line without completely cutting said release liner
and/or adhesive sheet.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a sheet cutting device and
a cutting method, particularly to a sheet cutting device and a
cutting method capable of cutting a sheet along a preset track and
performing the cutting of the sheet with high precision.
BACKGROUND OF THE ART
[0002] Conventionally, semiconductor wafers (hereinafter, simply
referred to as "wafer") are stuck with a protective sheet for
protecting circuit surface thereof, and stuck with a heat sensitive
adhesive sheet on the rear surface or front surface thereof.
[0003] As a sheet sticking method described above, the following
methods are known. That is, using a raw strip sheet in which
plane-shape sheets corresponding to the shape of the wafer are
temporarily stuck on a release liner, the sheet is peeled off from
the release liner with a peel plate, and then stuck onto the wafer;
or using a raw strip sheet in which a strip of sheet is temporarily
stuck on a strip of release liner, the sheet is peeled off from the
release liner, stuck onto a wafer, and then cut off along the
periphery of the wafer, thus the sheet is stuck onto the wafer
(refer to, for example, patent document 1).
[0004] Patent document 1: Japanese Patent No. 2919938
SUMMARY OF THE INVENTION
Problem to be Solved by the Invention
[0005] However, in the method of sticking plane-shape sheets
corresponding to the shape of the wafer, there is such a
disadvantage that a precise sheet feed-out structure and a table
shifting mechanism are indispensable for precisely matching the
outer periphery of the wafer and the outer periphery of the
sheet.
[0006] Also, the cutting device in the sticking apparatus disclosed
in the patent document 1 is disposed immediately above the sticking
table for supporting the wafer, and the sticking apparatus is
arranged to be obliged to use such the cutting device, the rotation
center of which is on a straight line running through the center of
the wafer. Therefore, there is such a disadvantage that an
extremely precise alignment between the rotation center of the
cutting device and the rotation center of the wafer is required.
Furthermore, the cutting direction is to be circumferential
direction along the periphery of the wafer, and thereby the cutting
device is not adapted to the cutting operation of other plane
shapes, for example, the cutting in the direction along the outer
periphery of a polygon shape; thus, resulting in a poor versatility
as a cutting device.
[0007] Moreover, every alteration of the wafer size requires an
adjustment of the cutter position, and since the cutter of the
cutting device is kept in a constant posture, it is not possible to
adjust the posture of a cutter blade corresponding to the thickness
of the sheet or the sectional shape of the outer periphery of an
adherend or the like. Even if the case where the posture can be
adjusted, there still resides another disadvantage that a deviation
of cutting diameter due to the alteration of the posture has to be
adjusted again.
[0008] Still further, since the cutting device is positioned above
the wafer, there is such a disadvantage as well that, when a
failure occurs on the device, the cutter blade may accidentally
touch a hand of a worker while carrying out removal operation of
the wafer or maintenance operation, resulting in an injury.
OBJECT OF THE INVENTION
[0009] The present invention has been proposed in view of the above
disadvantages. It is an object of the present invention to provide
a sheet cutting device and a cutting method capable of adjusting
the posture of a cutter in cutting operation, and even when cutting
position is changed accompanying the adjusting of the posture of
the cutter, the cutting diameter can be maintained precisely to a
preset value; moreover the cutting operation can be carried out
without restriction of cutting shape.
Means for Solving Problems
[0010] In order to achieve the above object, the present invention
adopts such an arrangement that a sheet cutting device to cut a
sheet stuck on an adherend on a sticking table, comprising: a robot
body and a cutter blade supported on a free-end of the robot body,
wherein
[0011] the robot body is a multi-joint robot having a plurality of
joints and these joints are controlled based on numerical
information.
[0012] Also, the present invention adopts such an arrangement that
a sheet cutting device to cut a sheet stuck on an adherend on a
sticking table, comprising: a robot body disposed beside the
sticking table and a cutter blade supported on a free-end of the
robot body and arranged so as to move along a preset track,
wherein
[0013] the robot body includes a tool holding chuck on the free-end
side, and the cutter blade is detachably attached thereto via the
tool holding chuck.
[0014] Further, the cutter blade may built-in a heater therein.
[0015] Furthermore, the cutter blade may be arranged so as to
vibrate via a vibrating device.
[0016] Still further, such an arrangement is adopted that the robot
body supports the cutter blade so as to adjust the posture of the
cutter blade when cutting the sheet along the outer periphery of
the adherend.
[0017] In the present invention, such an arrangement may be adopted
that a posture of the cutter blade in the sheet cutting operation
maintains a toe-in angle with which the center line of the cutter
blade is inclined with respect to the cutting direction viewed from
the top in the cutting direction, and a blade edge of the cutter
blade is positioned closer to the outer periphery of the adherend
than the back portion of the cutter blade.
[0018] Also, the posture of the cutter blade in the sheet cutting
operation may be arranged so as to maintain a camber angle with
which the center line of the cutter blade is inclined viewed from
the front in the cutting direction, and the sheet can also be cut
with no protrusion out of the outer periphery of the adherend.
[0019] Further, such an arrangement may be adopted that the posture
of the cutter blade in the sheet cutting operation maintains a
caster angle with which the center line of the cutter blade is
inclined in the cutting direction viewed from the side in the
cutting direction, and the angle formed between the sheet and the
blade edge is kept at an acute angle.
[0020] Furthermore, such an arrangement is adopted that an
inspection means for inspecting cutter blades is disposed in the
vicinity of the robot body.
[0021] The present invention adopts such a sheet cutting method to
cut a sheet stuck on an adherend on a sticking table that
[0022] a multi-joint robot body is used, the robot having a
plurality of joints controlled based on numerical information and
holding a cutter blade on a free-end of the robot body in a state
enabling to adjust a posture of the cutter blade, and
[0023] the sheet is cut by movement of the cutter blade along a
preset track.
[0024] Also, the present invention adopts such a sheet cutting
method to cut a sheet stuck on an adherend on a sticking table,
wherein
[0025] a cutting device is used, a robot body of which is disposed
beside the sticking table and holds a cutter blade on a free end
thereof in a state enabling to adjust a posture of the cutter
blade, and
[0026] the cutting device includes a cutter blade and the sheet is
cut by movement of the cutter blade along a preset track.
[0027] In the above cutting method, the sheet may be cut in a state
that the cutter blade is heated.
[0028] Also, the cutter blade may also cut the sheet while being
vibrated.
[0029] Further, such a method is adopted that the cutter blade
maintains a toe-in angle with which the center line of the cutter
blade is inclined with respect to the cutting direction viewed from
the top in the cutting direction, and the sheet is cut in a state
that a blade edge of the cutter blade is positioned closer to the
outer periphery of the adherend than the back portion of the cutter
blade.
[0030] Furthermore, such a method may also be adopted that the
cutter blade maintains a camber angle with which the center line of
the cutter blade is inclined viewed from the front in the cutting
direction, and the sheet is cut with no protrusion out of the outer
periphery of the adherend.
[0031] Still further, such a method may be adopted the cutter blade
maintains a caster angle with which the center line of the cutter
blade is inclined in the cutting direction viewed from the side in
the cutting direction, and the sheet is cut while keeping the angle
formed between the sheet and the blade edge at an acute angle.
[0032] It is possible to adopt such a method that the sheet is an
adhesive sheet temporarily stuck on a strip of release liner as an
adherend via an adhesive, and the adhesive sheet and adhesive are
cut without cutting the release liner.
[0033] Further, such a method may be adopted that the sheet is an
adhesive sheet temporarily stuck on a strip of release liner as an
adherend via an adhesive, and
[0034] a partial cutting is made to form a cutoff line without
completely cutting the release liner and/or adhesive sheet.
EFFECT OF THE INVENTION
[0035] According to the present invention, since the robot body is
controlled in a manner of NC (Numerical Control), the movement
amount of the respective joints with respect to a workpiece is
controlled based on the corresponding numerical information
respectively, and each movement amount is controlled through a
program. Therefore, being different from the conventional cutting
means, the position of the cutter blade does not have to be changed
manually whenever the wafer size is altered. Also, in the
conventional cutting means, deviation of cutting diameter caused by
the alteration of the posture of the cutter blade had to be
adjusted every time of the alterations. The robot body of the
present invention can maintain the cutting diameter precisely to a
preset value no matter how the posture of the cutter blade is
changed. Further, during non-cutting operation, since the cutter
blade can be escaped to a position out of an area above the table;
i.e., to an area beside the table, a wide workspace can be ensured
above the sticking table, and such a risk can be reduced that a
worker accidentally touches the cutter blade while removing an
adherend from the sticking table manually or carrying out
maintenance services.
[0036] Furthermore, since the cutter blade is detachably attached
via the tool holding chuck, the cutter blade can be replaced easily
and swiftly.
[0037] Still further, according to such an arrangement that the
cutter blade incorporates the heater therein, the adhesive sheet
can be cut more easily.
[0038] Still furthermore, owing to such an arrangement that the
cutter blade cuts the adhesive sheet while vibrating via the
vibrating device, the cutting performance can be enhanced.
[0039] Further, since the cutter blade is capable to adjust its
posture by controlling the joints of the robot, the cutting angle
can be altered corresponding to the stiffness and thickness of the
sheet, the sectional configuration of the outer periphery of the
adherend and the like; thus cutting operation can be achieved in
accordance with the purpose.
[0040] For example, in a state that the cutter blade maintains the
toe-in angle, cutting of the sheet just to fit to the outer
periphery position of the adherend can be achieved.
[0041] Furthermore, in a state that the cutter blade maintains the
camber angle, when the outer edge of the adherend is chamfered, the
sheet can be cut with no protrusion out of the outer periphery of
the adherend.
[0042] Still further, in such a state that the cutter blade
maintains a caster angle, by inclining the blade end corresponding
to the stiffness and thickness of the sheet, the sheet cutting
force can be reduced.
[0043] Further, owing to such an arrangement that an inspection
means of the cutter blade is disposed along with the cutting
device, defects of the blade edge and adhering degree of adhesive
of the sheet on the blade edge can be automatically detected. Owing
to this, the cutter blade can be replaced with a new one, and thus,
satisfactory cutting performance can be maintained stably.
BRIEF DESCRIPTION OF THE DRAWINGS
[0044] FIG. 1 is a front view schematically showing a sheet
sticking apparatus in accordance with an embodiment.
[0045] FIG. 2 is a perspective view schematically showing the sheet
sticking apparatus.
[0046] FIG. 3 is an enlarged perspective view showing a front-end
portion of a cutting device.
[0047] FIG. 4 is an enlarged perspective view of a cutter blade and
an inspection means.
[0048] FIG. 5 is a partial cross sectional view of a table and the
cutting device.
[0049] FIG. 6 is an explanatory view showing cutting operation of
an adhesive sheet while keeping a toe-in angle.
[0050] FIG. 7 is an explanatory view showing cutting operation of
an adhesive sheet while keeping a camber angle.
[0051] FIG. 8 is an explanatory view showing cutting operation of
an adhesive sheet while keeping a caster angle.
[0052] FIG. 9 is an enlarged cross sectional view showing a state
of cut of the adhesive sheet stuck on a wafer.
EXPLANATION OF REFERENCE NUMERALS
[0053] 10: sheet sticking apparatus [0054] 15: cutting device
[0055] 16: inspection means [0056] 17: stock device [0057] 62:
robot body [0058] 63: cutter blade [0059] 63A: blade holder [0060]
63B: blade [0061] 63D: blade edge [0062] 63E: back portion [0063]
63F: front end portion [0064] 63j: base portion [0065] 69: tool
holding chuck [0066] L: raw strip sheet [0067] PS: release liner
[0068] S: adhesive sheet [0069] S1: unnecessary adhesive sheet
[0070] W: wafer (adherend)
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0071] Hereinafter, embodiments of the invention will be described
with reference to the drawings.
[0072] FIG. 1 is a front view schematically showing a sheet
sticking apparatus to which a cutting device according to the
present invention is applied; and FIG. 2 is a schematic perspective
view thereof. In these figures, a sheet sticking apparatus 10
comprises: a sheet feed-out unit 12 disposed in the upper portion
of a base 11; a table 13 for supporting a wafer W as an adherend; a
press roller 14 for imparting a press force to an adhesive sheet S
fed out to the upper surface side of the wafer W to stick the
adhesive sheet S to the wafer W; a cutting device 15 for cutting
the adhesive sheet S along the outer edge of the wafer W after
sticking the adhesive sheet S to the wafer W; an inspection means
16 (refer to FIG. 2) for inspecting a cutter blade 63 (which will
be described later) of the cutting device 15; a stock device 17 for
storing cutter blades 63 and the like; a peeling apparatus 18 for
peeling off unnecessary adhesive sheet S1 outside the wafer W from
the upper surface of the table 13; and a winding apparatus 19 for
winding the unnecessary adhesive sheet S1.
[0073] The sheet feed-out unit 12 comprises: a support roller 20
for supporting a rolled raw strip sheet L in which a strip of
adhesive sheet S is temporarily stuck on one surface of a strip of
a release liner PS; a peel plate 22 with which the raw strip sheet
L fed out from the support roller 20 is sharply folded back to peel
off the adhesive sheet S from the release liner PS; a collection
roller 23 for collecting the release liner PS by winding the same;
a plurality of guide rollers 25 to 31 disposed between the support
roller 20 and the collection roller 23; a buffer roller 33 disposed
between the guide rollers 25 and 26; a tension measuring means 35
disposed between the guide rollers 27 and 28, which includes a load
cell 39 and a tension measuring roller 40 supported by the load
cell 39 and positioned at the base side of the peel plate 22; and a
sticking-angle maintaining means 37 for integrally supporting the
peel plate 22, guide rollers 27, 28, 29, and the tension measuring
means 35, which interacts with the press roller 14 to maintain the
sticking angle .theta. of the adhesive sheet S with respect to the
wafer W to a constant angle. The guide rollers 27 and 29 are
provided with brake shoes 32, 42 respectively. These brake shoes 32
and 42 are arranged so as, when sticking the adhesive sheet S to
the wafer W, to be moved toward/away from the corresponding guide
rollers 27, 29, by means of cylinders 38 and 48 respectively, to
nip the adhesive sheet S to restrain the feeding thereof.
[0074] Note that the sheet feed-out unit 12, and the tension
measuring means 35 and the sticking-angle maintaining means 37,
which constitute the sheet feed-out unit, are the identical to
those disclosed in the Japanese Patent Application Laid-Open No.
2005-198806 applied by the applicant of the present invention.
Therefore, detailed description thereof will be omitted herein.
[0075] As shown in FIG. 5, the table 13 comprises: an outer table
51 having a substantially square shape in plane view; and an inner
table 52 having a substantially circular shape in plane view. The
outer table 51 is configured in a concave-shape so as to receive
the inner table 52 in a state that a gap C is formed between the
outer edge of the inner table 52 and the outer table 51, and is
arranged so as to move in the vertical direction with respect to
the base 11 via a uniaxial robot 54. On the other hand, the inner
table 52 is arranged so as to move in the vertical direction with
respect to the outer table 51 via a uniaxial robot 56. Accordingly,
the outer table 51 and the inner table 52 are arranged so as to
move integrally in the vertical direction as well as to move in the
vertical direction independently each other. Owing to this, the
outer table 51 and the inner table 52 are arranged to be adjustable
to a predetermined level position corresponding to the thickness of
the adhesive sheet S and the wafer W.
[0076] The press roller 14 is supported via a portal frame 57. On
the upper surface side of the portal frame 57, cylinders 59, 59 are
provided. The press roller 14 is arranged so as to move in the
vertical direction owing to the operation of these cylinders 59. As
shown in FIG. 2, the portal frame 57 is arranged to be movable in
the X-direction in FIG. 1 via a uniaxial robot 60 and a guide rail
61.
[0077] As shown in FIGS. 3 to 5, the cutting device 15 comprises a
robot body 62 and a cutter blade 63 supported on the free-end side
of the robot body 62. As shown in FIG. 5, the robot body 62
includes a base section 64, first to sixth arms 65A to 65F, which
are disposed on the upper surface side of the base section 64 so as
to be rotatable in the directions indicated with arrows A to F
respectively, and a tool holding chuck 69 attached to the front end
side of the sixth arm 65F; i.e., on the free-end side of the robot
body 62. Each of the second, third and fifth arms 65B, 65C, 65E is
provided rotatably within a Y.times.Z plane in FIG. 5; and each of
the first, fourth and sixth arms 65A, 65D, 65F is provided
rotatably about the axis thereof. The robot body 62 in this
embodiment is controlled by NC (Numerical Control). That is, the
movement amount of the respective joints with respect to a
workpiece is controlled based on numerical information
corresponding thereto, and every movement amount thereof is
controlled through a program. Thus, the method adopted is
completely different from the conventional cutting means, in which
the position of cutter blade has to be changed manually whenever
the wafer size is altered. Further, in the conventional cutting
means, accompanying the alteration of the posture of the cutter
blade (toe-in angle .alpha.1, camber angle .alpha.2, caster angle
.alpha.3, which will be described later), deviation of cutting
diameter has to be readjusted every time of the alteration. The
robot body 62 of the embodiment can maintain the cutting diameter
precisely to a preset value no matter how the posture of the cutter
blade is altered. Furthermore, the cutter blade 63 is arranged so
as to be moved to a position outside of the area above the table
13; i.e., a position beside the table 13 to escape therefrom during
non-cutting operation.
[0078] As shown in FIG. 3, the tool holding chuck 69 comprises a
cutter blade receiver 70 having a substantially cylindrical shape
and three chuck claws 71 disposed at positions substantially
120.degree. away from each other in the peripheral direction of the
cutter blade receiver 70, which detachably holds the cutter blade
63 and a suction arm 100 to be described later. Each of the chuck
claws 71 has a pointed-edge portion 71A, inner end of which forms
an acute angle, and is arranged so as to move forward/backward in
the radial direction with respect to the center of the cutter blade
receiver 70 by pneumatic pressure.
[0079] As shown in FIG. 4, the cutter blade 63 comprises a blade
holder 63A constituting a base portion and a blade 63B inserted
into the front end of the blade holder 63A and fixed thereto. The
blade holder 63A has a substantially cylindrical shape, and at the
positions substantially 120.degree. away from each other in the
peripheral direction of the circumferential surface thereof,
grooves 72 having a length extending from the base end to an
intermediate portion thereof are formed along the axial direction.
The pointed-edge portions 71A of the chuck claws 71 are arranged to
engage with these grooves 72, and thereby the position of the
cutter blade 63 with respect to the tool holding chuck 69 is
maintained to be constant.
[0080] The blade holder 63A is equipped with a heater (not shown)
and a vibrating device (not shown) therein, and is arranged so as
to heat the blade 63B with the heater as well as to vibrate the
blade 63B with the vibrating device. As the heater, a coil heater
can be exemplified; and as the vibrating device, an ultrasonic
vibrating device can be exemplified.
[0081] As shown in FIG. 2 and FIG. 4, the cutter blade inspection
means 16 is arranged with a camera disposed along with the cutting
device 15. The cutter blade inspection means 16 is for detecting
defects of the blade edge 63D in the cutter blade 63 or adhered
state of the adhesive on the blade edge 63D. It is arranged so
that, when a defect is detected or when the amount of the adhesive
adhered to the blade exceeds an allowable range, a signal is
outputted to a control device (not shown); and corresponding to the
signal, the robot body 62 automatically replaces the cutter blade
63 with another one stored in the stock device 17.
[0082] As shown in FIG. 2, the stock device 17 includes a first
stocker 17A for storing each cutter blade 63 and a second stocker
17B for storing suction arms 100 to suck and hold the wafer W. In
this embodiment, the cutting device 15 is arranged to be used as a
transfer device as well; and thus has such a versatility is
provided that, when a suction arm 100 is held in stead of the
cutter blade, the wafer can be transferred. Note that the suction
arm 100 comprises an arm holder 100A, which is formed with the same
grooves 72 as those of the blade holder 63A, and a Y-shaped arm
section 100B, which is attached to the arm holder 100A and has
vacuum holes 100C communicating with a decompression device (not
shown) in the front ends thereof. Other suction arms 100 are
I-shaped arms having different shapes and arms for sucking
different size wafers, and there is such an arrangement as suction
arms for handling semiconductor wafers of 8 inch, 12 inch or the
like can be stocked.
[0083] As shown in FIGS. 1 and 2, the peeling apparatus 18
comprises a small diameter roller 80 and a large diameter roller
81. A moving frame F supports the small diameter roller 80 and the
large diameter roller 81. The moving frame F comprises a front
frame F1 and a rear frame F2, relatively disposed along the
Y-direction in FIG. 2, the rear frame F2 being coupled with the
front frame F1 via a connecting member 83. The rear frame F2 is
supported by a uniaxial robot 85, while the front frame F1 is
supported by the guide rail 61. Owing to this, the moving frame F
is movable in X-direction in FIG. 2. An arm member 84 supports the
large diameter roller 81 as shown in FIG. 1. The arm member 84 is
arranged so that a cylinder 88 can move the large diameter roller
81 in the direction closer to/away from the small diameter roller
80 by the cylinder 88.
[0084] The winding apparatus 19 comprises: a drive roller 90
supported by the moving frame F; and a winding roller 93, which is
supported at the free-end of the rotation arm and abutted on the
circumferential surface of the drive roller 90 via a spring 92 to
nip the unnecessary adhesive sheet S1. A drive motor M is disposed
at the shaft end of the drive roller 90, and it is arranged so
that, when the drive roller 90 is driven to rotate by the motor M,
the winding roller 93 follows the drive roller 90 to rotate;
thereby the unnecessary adhesive sheet S1 is wound thereon. Note
that as the wound amount increases, the winding roller 93 shifts
rightward in FIG. 1 against the force of the spring
[0085] Next, a cutting method of the adhesive sheet S in the
embodiment will be described with reference to FIGS. 5 to 8. Note
that the sticking method of the adhesive sheet S is the identical
to that disclosed in the Japanese Patent Application Laid-Open No.
2005-198806. Therefore, description of the sheet sticking method
will be omitted here.
[0086] As the initial settings, external dimensions of the wafer, a
toe-in angle .alpha.1 with which the center line of the cutter
blade 63 is inclined with respect to the cutting direction viewed
from the top in the cutting direction as shown in FIG. 6, a camber
angle .alpha.2 with which the center line of the cutter blade 63 is
inclined viewed from the front side in the cutting direction as
shown in FIG. 7, and a caster angle .alpha.3 with which the center
line of the cutter blade 63 is inclined with respect to the cutting
direction viewed from the side in the cutting direction as shown in
FIG. 8 are inputted through an inputting device (not shown).
[0087] The above angles .alpha.1 to .alpha.3 will be described
again in other words with reference to the modes shown in FIGS. 6
to 8. The toe-in angle .alpha.1 is an angle in a state that the
blade edge 63D of the blade 63B is closer to the outer periphery of
the wafer W than a back portion 63E; the camber angle .alpha.2 is
an angle in a state that the front end portion 63F of the blade 63B
is positioned at an outer side than the base portion 63J; and the
caster angle .alpha.3 is an angle in a state that the base portion
63J of the blade 63B precedes the front end portion 63F in the
cutting direction.
[0088] Note that, assuming the adhesive sheet S comes to the bottom
surface side of the wafer W, and the adhesive sheet S is cut along
the outer periphery of the wafer from the upper surface side, the
camber angle is an angle in which the base portion 63J of the blade
63B is positioned at the outer side than the front end portion 63F.
Also, as for the caster angle .alpha.3, the angle formed between
the blade edge 63D and the adhesive sheet S has to be simply an
acute angle. Accordingly, there may be such an inclined posture in
which the base portion 63J is positioned behind the front end
portion 63F in the cutting direction.
[0089] During the operation to stick the adhesive sheet S to the
wafer W, the cutting device 15 is kept in a position where the
cutter blade 63 escapes in a position beside the table 13. And
after the adhesive sheet S is stuck onto the upper surface of the
wafer W as shown in FIG. 5, the robot body 62 performs a
predetermined operation so that the cutter blade 63 moves to a
position above the table 13.
[0090] Then, based on the data inputted through the inputting
device, movement track data stored in a storage of the control
device (not shown) are read out, and the blade 63B cuts the
adhesive sheet S along the outer shape of the wafer while
maintaining the toe-in angle .alpha.1, camber angle .alpha.2 and
caster angle .alpha.3 (refer to FIGS. 6 to 8). Here, when the sheet
S can be hardly cut at a room temperature, the blade 63B may be
heated by the coil heater, or may be vibrated by the ultrasonic
vibrating device. Owing to this, the adhesive sheet S can be cut
matching with the outer periphery of the wafer W in a state that
the cutting resistance is reduced to an extremely small level.
[0091] Note that, since the sectional configuration of the
periphery of the wafer W is chamfered as shown in FIG. 9, owing to
the above-described toe-in angle .alpha.1 and camber angle
.alpha.2, the adhesive sheet S can be cut close to an intersection
P of the upper surface W1 and the side end surface W2 of the wafer
W. Accordingly, outer periphery of the adhesive sheet S does not
protrude out of the outer periphery of the wafer W. Therefore, when
the wafer W stuck with the adhesive sheet S is subjected to
grinding processing on the rear surface thereof in the following
process, such a disadvantage can be prevented that a grinder
catches a protruding portion of the sheet.
[0092] When the cutting operation of the adhesive sheet S is
completed, in order to perform a temporary function as a transfer
device, the cutting device 15 removes cutter blade 63B from the
tool holding chuck 69, and replaces the same with the suction arm
100. At this time, the cutter blade 63B is subjected to an
inspection of the blade edge 63D by the inspection means 16. Here,
when damage or the amount of the adhesive adhered on the blade edge
63D exceeding an allowable range is detected, and when the cutter
blade is determined as unacceptable, in the next cutting operation,
the unacceptable cutter blade 63B is not used, and a signal is
outputted to the control device (not shown) to replace the cutter
blade 63B with a new one, and the unacceptable cutter blade 63B is
stored in the stock device 17.
[0093] The cutting device 15 supporting the suction arm 100 sucks
the wafer W after completion of cutting the adhesive sheet S, and
transfers the same to the next process; and then transfers a next
wafer W to be stuck with the adhesive sheet S from a wafer stocker
(not shown) to the table 13. When the wafer W has been transferred,
the cutting device performs an operation to store the suction arm
100 to the second stocker 17B, and attaches a new cutter blade 63
to the tool holding chuck 69; thus to prepare for the next cutting
operation.
[0094] When the wafers W are removed from the table 13 by the
cutting device 15, which temporarily functions as the transfer
device, the peeling device 16 winds the unnecessary adhesive sheet
S1. Note that since the winding operation is the identical to the
operation disclosed in the Japanese Patent Application Laid-Open
No. 2005-198806, detailed description thereof will be omitted.
[0095] Therefore, according to the embodiment as described above,
such effects can be obtained that the adhesive sheet S stuck on the
wafer W can be precisely cut along the outer periphery of the
wafer, and adherends having various plane shapes can be handled as
the sheet cutting objects.
[0096] The best arrangement and method for carrying out the present
invention have been disclosed so far. However, the present
invention is not limited to the above.
[0097] That is, the present invention has been illustrated and
described mainly about a specific embodiment. However, it is
possible for those skilled in the art to add various modifications,
if necessary, to the above-described embodiment with respect to the
shape, position and/or disposition without departing from the
technical spirit and the range of the object of the present
invention.
[0098] For example, in the embodiment, the case where the adhesive
sheet S stuck on the wafer W is cut along the outer periphery of
the wafer W has been described. However, the present invention is
not limited to the above. Taking as a target an adhesive sheet
temporarily stuck on a strip of release liner via an adhesive as an
adherend, the adhesive sheet and the adhesive can be cut without
cutting the release liner, or the release liner and/or adhesive
sheet can be partially cut to form a cutoff line without cutting
the same completely.
* * * * *