U.S. patent application number 11/876838 was filed with the patent office on 2009-04-23 for led metal strip flexible interconnection.
Invention is credited to Jeff Lin.
Application Number | 20090104804 11/876838 |
Document ID | / |
Family ID | 40563916 |
Filed Date | 2009-04-23 |
United States Patent
Application |
20090104804 |
Kind Code |
A1 |
Lin; Jeff |
April 23, 2009 |
LED METAL STRIP FLEXIBLE INTERCONNECTION
Abstract
An LED interconnection apparatus and a method of electrical
connection for an array of LEDs are disclosed, the LED
interconnection apparatus including a back plate substrate having a
plurality of adaptable through-holes formed therein and a flexible
conductive pattern disposed adjacent the back plate substrate,
wherein the adaptable through-holes of the back plate substrate
facilitate selective access to the flexible conductive pattern to
provide a simple, adaptable, and standardized method of electrical
communication for an array of LEDs.
Inventors: |
Lin; Jeff; (Novi,
MI) |
Correspondence
Address: |
FRASER CLEMENS MARTIN & MILLER LLC
28366 KENSINGTON LANE
PERRYSBURG
OH
43551
US
|
Family ID: |
40563916 |
Appl. No.: |
11/876838 |
Filed: |
October 23, 2007 |
Current U.S.
Class: |
439/211 ;
29/846 |
Current CPC
Class: |
F21S 43/14 20180101;
H05K 2201/09063 20130101; H05K 1/029 20130101; Y10T 29/49155
20150115; F21Y 2115/10 20160801; H05K 2201/10598 20130101; H05K
3/202 20130101; H05K 2201/10106 20130101; F21K 9/00 20130101; F21Y
2107/00 20160801; H05K 2203/175 20130101; H05K 1/0284 20130101 |
Class at
Publication: |
439/211 ;
29/846 |
International
Class: |
H01R 4/58 20060101
H01R004/58; H05K 3/10 20060101 H05K003/10 |
Claims
1. A method of electrical connection for an LED array, the method
comprising the steps of: providing a back plate substrate including
a plurality of adaptable through-holes; providing a flexible
conductive pattern disposed adjacent the back plate substrate,
wherein the adaptable through-holes of the back plate substrate
facilitate selective access to the flexible conductive pattern;
forming the flexible conductive pattern using a first forming
operation to conform to a shape of the back plate substrate;
coupling the flexible conductive pattern to a first side of the
back plate substrate; shaping a desired number of unformed
connector terminals using a second forming operation to provide
electrical interconnection; and severing a desired portion of the
flexible conductive pattern using a secondary punching operation to
create a desired circuitry pattern.
2. The method according to claim 1, wherein the flexible conductive
pattern includes a plurality of connector terminals, a coupling
feature, and a plurality of strip separation tabs disposed
therein.
3. The method according to claim 2, wherein the adaptable
through-holes facilitate severing a desired number of strip
separation tabs to prevent electrical communication between a first
conductive strip and a second conductive strip of the flexible
conductive pattern.
4. The method according to claim 1, wherein the adaptable
through-holes of the back plate substrate align with a desired
portion of the flexible conductive pattern.
5. The method according to claim 1, wherein the second forming
operation is a selective bending of the connector terminals to
provide electrical communication between adjacent flexible
conductive patterns.
6. The method according to claim 1, wherein the adaptable
through-holes facilitate severing a desired portion of the flexible
conductive pattern along a longitudinal axis thereof to create the
desired circuitry pattern.
7. An LED interconnection apparatus comprising: a back plate
substrate including a plurality of adaptable through-holes; and a
flexible conductive pattern disposed adjacent the back plate
substrate, wherein the adaptable through-holes of the back plate
substrate facilitate selective access to the flexible conductive
pattern.
8. The LED interconnection apparatus according to claim 7, wherein
the flexible conductive pattern includes a plurality of connector
terminals, a coupling feature, and a plurality of strip separation
tabs disposed therein.
9. The method according to claim 8, wherein the adaptable
through-holes facilitate severing a desired number of strip
separation tabs to prevent electrical communication between a first
conductive strip and a second conductive strip of the flexible
conductive pattern.
10. The LED interconnection apparatus according to claim 7, wherein
the adaptable through-holes of the back plate substrate are aligned
with a desired portion of the flexible conductive pattern.
11. The LED interconnection apparatus according to claim 8, wherein
the connector terminals are adapted to provide electrical
communication between a plurality of flexible conductive
patterns.
12. The method according to claim 7, wherein the adaptable
through-holes facilitate severing a desired portion of the flexible
conductive pattern along a longitudinal axis thereof to create a
desired circuitry pattern.
13. The LED interconnection apparatus according to claim 7, wherein
the flexible conductive pattern is a dual conductive strip.
14. The LED interconnection apparatus according to claim 7, wherein
the flexible conductive pattern is an annular conductive strip
pattern.
15. An LED interconnection apparatus comprising: a back plate
substrate including a plurality of adaptable through-holes; and an
annular conductive strip pattern disposed adjacent the back plate
substrate, wherein the adaptable through-holes of the back plate
substrate allow selective access to the conductive strip.
16. The LED interconnection apparatus according to claim 15,
wherein the flexible conductive pattern includes a plurality of
connector terminals, a coupling feature, and a plurality of strip
separation tabs disposed therein.
17. The LED interconnection apparatus according to claim 15,
wherein the through-holes of the back plate substrate align with a
desired portion of the flexible conductive pattern.
18. The LED interconnection apparatus according to claim 15,
wherein the connector terminals are adapted to provide electrical
communication between a plurality of flexible conductive
patterns.
19. The, LED interconnection apparatus according to claim 15,
wherein a punching operation on the annular conductive strip
pattern creates a desired circuitry pattern.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a light source assembly and
more particularly to a light emitting diode interconnection
apparatus and a method of electrical connection for an array of
light emitting diodes.
BACKGROUND OF THE INVENTION
[0002] Light emitting diodes (LED) are currently used in various
illumination capacities, such as, advertisement and signaling, for
example. A plurality of LEDs may be arranged in various lighting
patterns to produce a desired lighting effect. The plurality of
LEDs is typical coupled to a substrate to form a light source
assembly. Currently, both rigid and flexible substrates are used
for support and electrical communication between a power source and
the plurality of LEDs.
[0003] The light source assembly includes a desired electrical
circuitry pattern to regulate a power and a current routing of the
light source assembly. The electrical circuitry pattern also
provides electrical communication between the LEDs. The use of
pre-formed circuitry, such as a printed wiring board, is efficient
where the light source assembly is being mass produced. Since mass
production of a light source assembly typically requires a
standardized circuitry pattern and connection pattern, tools and
methods used in the mass production of a light source assembly may
be adapted to efficiently produce a particular light source
assembly. Where production of the light source assembly is on a
small scale, the use of pre-formed circuitry can be costly. The
constant adaptation of tools and methods of production for the
manufacturing of various light source assemblies can be
inefficient. Often, a light source assembly may require custom
formed circuitry patterns and lighting arrangements for a
particular application. Customization of each light source assembly
is time intensive and costly.
[0004] It would be desirable to develop an LED interconnection
apparatus and a method of electrical connection for an array of
LEDs, wherein the method and apparatus provide a simple, flexible
and standardized means of adaptable electrical communication
between a power source and the array of LEDs.
SUMMARY OF THE INVENTION
[0005] Concordant and consistent with the present invention, an LED
interconnection apparatus and a method of electrical connection for
an array of LEDs, wherein the method and apparatus provide a
simple, flexible and standardized means of adaptable electrical
communication between a power source and the array of LEDs, has
surprisingly been discovered.
[0006] In one embodiment, the LED interconnection apparatus
comprises a back plate substrate including a plurality of adaptable
through-holes; and a flexible conductive pattern disposed adjacent
the back plate substrate, wherein the adaptable through-holes of
the back plate substrate facilitate selective access to the
flexible conductive pattern.
[0007] In another embodiment, a back plate substrate including a
plurality of adaptable through-holes; and an annular conductive
strip pattern disposed adjacent the back plate substrate, wherein
the adaptable through-holes of the back plate substrate allow
selective access to the conductive strip.
[0008] Methods of electrical connection for an LED array are also
disclosed.
[0009] In one embodiment, the method comprises the steps of
providing a back plate substrate including a plurality of adaptable
through-holes; providing a flexible conductive pattern disposed
adjacent the back plate substrate, wherein the adaptable
through-holes of the back plate substrate facilitate selective
access to the flexible conductive pattern; forming the flexible
conductive pattern using a first forming operation to conform to a
shape of the back plate substrate; coupling the flexible conductive
pattern to a first side of the back plate substrate; shaping a
desired number of unformed connector terminals using a second
forming operation to provide electrical interconnection; and
severing a desired portion of the flexible conductive pattern using
a secondary punching operation to create a desired circuitry
pattern.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The above, as well as other advantages of the present
invention, will become readily apparent to those skilled in the art
from the following detailed description of the preferred embodiment
when considered in the light of the accompanying drawings in
which:
[0011] FIG. 1 is a front perspective view of an LED interconnection
apparatus according to an embodiment of the present invention;
[0012] FIG. 2 is a rear perspective view of the LED interconnection
apparatus according to the embodiment shown in FIG. 1; and
[0013] FIG. 3 is a front elevational view of a conductive strip
pattern according to another embodiment of the present
invention.
DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS OF THE INVENTION
[0014] The following detailed description and appended drawings
describe and illustrate various embodiments of the invention. The
description and drawings serve to enable one skilled in the art to
make and use the invention, and are not intended to limit the scope
of the invention in any manner. In respect of the methods
disclosed, the steps presented are exemplary in nature, and thus,
the order of the steps is not necessary or critical.
[0015] FIG. 1 illustrates an LED interconnection apparatus 10
according to an embodiment of the present invention. The LED
interconnection apparatus 10 includes a flexible conductive pattern
12 coupled to a first side 14 of a back plate substrate 16.
[0016] As illustrated, the flexible conductive pattern 12 is a dual
conductive strip pattern having a first conductive strip 20 and a
second conductive strip 22. It is understood that the flexible
conductive pattern 12 may be a single strip (not shown) or other
pattern as desired. The flexible conductive pattern 12 includes a
plurality of connector terminals 24, a coupling feature 26, and a
plurality of strip separation tabs 28, disposed therein. The
connector terminals 24 are formed in the flexible conductive
pattern 12 and may be selectively bent to provide an
interconnection between adjacent flexible conductive patterns 12.
The coupling feature 26 may be any conventional coupling feature
for coupling the flexible conductive pattern 12 and the back plate
substrate 16 such as an aperture adapted for a heat staking
operation, for example. As shown, the strip separation tabs are
disposed between the first conductive strip 20 and the second
conductive strip 22. The strip separation tabs 28 provide
electrical communication between the first conductive strip 20 and
the second conductive strip 22 of the flexible conductive pattern
12. The flexible conductive pattern 12 may be formed from any
conventional conductive material such as a metal, for example. Any
conventional means of preparing conductive frets can be used to
produce the flexible conductive pattern 12 such as a stamping
operation, for example. The flexible conductive pattern 12 may be
formed into any conventional shape or pattern such as, a single
segment element and a continuous strip, for example. Where the
flexible conductive pattern 12 is a single segment element, the
flexible conductive pattern 12 may be pre-formed using a first
forming operation to conform to a shape of a fixed back plate
substrate 16 design. If the flexible conductive pattern 12 is a
continuous strip, the continuous strip may be post-formed using the
first forming operation to conform to various shapes of back plate
substrates 16.
[0017] As illustrated in FIG. 2, the back plate substrate 16
includes a plurality of punch out windows 30, a plurality of
separation tab windows 32, and a plurality of terminal forming
windows 34, collectively referred to as a plurality of adaptable
through-holes. The adaptable through-holes 30, 32, 34 of the back
plate substrate 16 provide access to portions of the flexible
conductive pattern 12 from a second side 36 of the back plate
substrate 16. Specifically, the adaptable through-holes 30, 32, 34
of the back plate substrate 16 are substantially aligned with a
portion of the flexible conductive pattern 12. For example, the
separation tab windows 32 of the back plate substrate 16 are
aligned with the strip separation tabs 28 of the flexible
conductive pattern 12; the terminal forming windows 34 of the back
plate substrate 16 are aligned with the connector terminals 24; and
the punch out windows 30 are aligned with a desired portion of the
flexible conductive pattern 12 along a longitudinal axis thereof.
The back plate substrate 16 is shown as having a stair step shape.
It is understood that the back plate substrate 16 may have any
desired shape and size.
[0018] In use, the flexible conductive pattern 12 is disposed
adjacent the first side 14 of the back plate substrate 16. The
flexible conductive pattern 12 is coupled to the back plate
substrate 16 using any conventional means of coupling such as heat
staking and snapping, for example. Once the flexible conductive
pattern 12 is coupled to the back plate substrate 16, a second
forming operation is used on the flexible conductive pattern 12 to
shape a desired number of connector terminals 24. In the embodiment
shown in FIG. 2, the unformed connector terminals 24 of the
flexible conductive pattern 12 are selectively bent so that each of
the bent connector terminals 24 protrude through one of the
terminal forming windows 34 of the back plate substrate 16. The
bent connector terminals 24 are coupled to the bent connector
terminals 24 of an adjacent flexible conductive pattern to provide
electrical communication between adjacent flexible conductive
patterns 12. A punching operation is then used on the flexible
conductive pattern 12 to selectively trim the portions of the
flexible conductive pattern 12 through the punch out windows 30 and
the separation tab windows 32 to form a desired circuitry pattern.
Trimming the flexible conductive pattern 12 through the punch out
windows 30 severs electrical communication along the longitudinal
axis of the flexible conductive pattern 12. Trimming the flexible
conductive pattern 12 through the separation tab window 32 severs
electrical communication between the first conductive strip 20 and
the second strip 22. The desired circuitry pattern may be any
circuitry pattern such as series and parallel, for example. It is
understood that the desired circuitry pattern may be formed by the
punching operation before the flexible conductive pattern 12 is
coupled to the back plate substrate 16. A plurality of LEDs 44 is
coupled to the flexible conductive pattern 12 at a pre-determined
location. The flexible conductive pattern 12 provides electrical
communication between the plurality of LEDs 44 and a power source
(not shown). It is understood that the LED interconnection
apparatus 10 may also provide electrical communication between a
plurality of flexible conductive patterns 12.
[0019] FIG. 3 shows an LED interconnection apparatus 10' according
to another embodiment of the invention. Structure repeated from the
description of FIGS. 1 and 2 includes the same reference numeral
and a prime (') symbol. The LED interconnection apparatus 10'
includes a flexible conductive pattern 12' and a back plate
substrate 16'. In the embodiment shown, the flexible conductive
pattern 12' is an annular conductive strip pattern. The flexible
conductive pattern 12' includes a plurality of connector terminals
24', a coupling feature 26', and a plurality of separation tabs
28', disposed therein. The connector terminals 24' are formed in
the flexible conductive pattern 12' and may be selectively bent to
provide an interconnection between adjacent flexible conductive
patterns 12'. The coupling feature 26' may be any conventional
coupling feature for coupling the flexible conductive pattern 12'
and a back plate substrate 16' such as an aperture adapted for a
heat staking operation, for example. As shown, the strip separation
tabs 28' are disposed between an inner conductive strip 40 and an
outer conductive strip 42. The strip separation tabs 28' provide
electrical communication between the inner conductive strip 40 and
the outer conductive strip 42 of the flexible conductive pattern
12'. The flexible conductive pattern 12' may be formed from any
conventional conductive material such as a metal, for example. The
flexible conductive pattern 12' is produced using any conventional
means of preparing metal frets such as a stamping operation, for
example.
[0020] The back plate substrate 16' shown includes a plurality of
through-holes 46, the through-holes 46 adapted to provide selective
access to the flexible conductive pattern 12'. Although the back
plate substrate 16' is shown as having a rectangular shape, it is
understood that the back plate substrate 16' may have any
conventional shape and size.
[0021] In use, the flexible conductive pattern 12' is disposed
adjacent the first side 14' of the back plate substrate 16'. The
flexible conductive pattern 12' is coupled to the back plate 16'
substrate using any conventional means of coupling such as heat
staking and snapping, for example. Once the flexible conductive
pattern 12' is coupled to the back plate substrate 16', the
connector terminals 24' are selectively shaped by a second forming
operation to provide electrical communication between the connector
terminals 24' of adjacent flexible conductive patterns 12'. It is
understood that the second forming operation may be used to shape a
desired number of connector terminals 24' before the flexible
conductive pattern 12' is coupled to the back plate substrate 16'.
A punching operation is used on the flexible conductive pattern 12'
to selectively trim portions of the flexible conductive pattern 12'
to form a desired circuitry pattern. In the embodiment shown in
FIG. 3, the strip separation tabs 28' are punched, thereby
separating an inner conductive strip 40 from an outer conductive
strip 42 and creating the desired circuitry pattern. The desired
circuitry pattern may be any circuitry pattern such as series and
parallel, for example. It is understood that the desired circuitry
pattern may be formed by the punching operation before the flexible
conductive pattern 12' is coupled to the back plate substrate 16'.
A plurality of LEDs 44' is coupled to the flexible conductive
pattern 12' to form a desired lighting pattern. The flexible
conductive pattern 12' provides electrical communication between
the LEDs 44' and a power source (not shown). It is understood that
the flexible conductive pattern 12' may also be adapted to provide
electrical communication between a plurality of flexible conductive
patterns 12'.
[0022] The LED interconnection apparatuses 10, 10' provide a
simplified, standardized, and adaptable means of electrical
connection for arrays of LEDs 44, 44'. The back plate substrate 16,
16', in cooperation with the flexible conductive pattern 12, 12',
facilitates an efficient assembly process for arrays of LEDs 44,
44' and various lamp designs. The back plate substrate 16, 16', in
cooperation with the flexible conductive pattern 12, 12', further
provides an inexpensive and simplified method of circuitry
formation and modification. The standardization of the flexible
conductive pattern 12, 12' allows the flexible conductive pattern
12, 12' to be easily mass produced. The adaptable features of the
flexible conductive pattern 12, 12' and back plate substrate 16,
16' provide easily customized circuitry patterns and connector
terminals 24, 24' for a variety of applications.
[0023] From the foregoing description, one ordinarily skilled in
the art can easily ascertain the essential characteristics of this
invention and, without departing from the spirit and scope thereof,
make various changes and modifications to the invention to adapt it
to various usages and conditions.
* * * * *