U.S. patent application number 11/862191 was filed with the patent office on 2009-03-26 for cylinder structure.
This patent application is currently assigned to COMPAL ELECTRONICS, INC.. Invention is credited to Yung-Hui Chen, Po-An Lin.
Application Number | 20090081390 11/862191 |
Document ID | / |
Family ID | 40471938 |
Filed Date | 2009-03-26 |
United States Patent
Application |
20090081390 |
Kind Code |
A1 |
Chen; Yung-Hui ; et
al. |
March 26, 2009 |
CYLINDER STRUCTURE
Abstract
A cylinder structure including a plastic cylinder, a metal
cylinder, and a metal layer is provided. The plastic cylinder has a
first flat on the top thereof. The metal cylinder has a second flat
on the top thereof, and is partly inserted into the top of the
plastic cylinder, wherein the second flat is higher than the first
flat relative to the top of the plastic cylinder. The metal layer
covers the exposed surface of the plastic cylinder and the exposed
surface of the metal cylinder.
Inventors: |
Chen; Yung-Hui; (Taipei
City, TW) ; Lin; Po-An; (Taipei City, TW) |
Correspondence
Address: |
JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
7 FLOOR-1, NO. 100, ROOSEVELT ROAD, SECTION 2
TAIPEI
100
TW
|
Assignee: |
COMPAL ELECTRONICS, INC.
Taipei City
TW
|
Family ID: |
40471938 |
Appl. No.: |
11/862191 |
Filed: |
September 26, 2007 |
Current U.S.
Class: |
428/34.1 |
Current CPC
Class: |
F16B 43/001 20130101;
F16B 37/122 20130101; H05K 7/142 20130101; F16B 33/004 20130101;
G06F 1/184 20130101; Y10T 428/13 20150115 |
Class at
Publication: |
428/34.1 |
International
Class: |
B65D 85/00 20060101
B65D085/00 |
Claims
1. A cylinder structure, comprising: a plastic cylinder having a
first flat on the top thereof; a metal cylinder partly inserted
into the top of the plastic cylinder, and having a second flat on
the top of the metal cylinder, wherein the second flat is higher
than the first flat relative to the top of the plastic cylinder;
and a metal layer covering the exposed surface of the plastic
cylinder and the exposed surface of the metal cylinder.
2. The cylinder structure according to claim 1, wherein the plastic
cylinder has a first hole having a first shoulder on the inner
surface of the first hole, and the metal cylinder has a second
shoulder supported by the first shoulder.
3. The cylinder structure according to claim 2, wherein the metal
cylinder has a second hole having an internal thread on the inner
surface of the second hole.
4. The cylinder structure according to claim 2, wherein the metal
cylinder has a first segment and a second segment, and the joint
between the first segment and the second segment forms the second
shoulder.
5. The cylinder structure according to claim 4, wherein a part of
the first segment protrudes from the first flat, and the part of
the first segment has the second flat, and the first segment has a
plurality of concaves spread on the outer surface thereof.
6. The cylinder structure according to claim 1, wherein the plastic
cylinder has a burr formed on the outermost edge of the first
flat.
7. The cylinder structure according to claim 1, wherein the plastic
cylinder has a plurality of reinforcing ribs distributed on the
outer side of the plastic cylinder.
8. An electronic device housing, comprising: a wall; at least one
plastic cylinder, having a first flat on the top thereof, and the
bottom of the plastic cylinder attached to an inner surface of the
wall; at least one metal cylinder, partly inserted into the top of
the plastic cylinder, and having a second flat on the top of the
metal cylinder, wherein the second flat is higher than the first
flat relative to the top of the plastic cylinder; and a metal
layer, covering the exposed portion of the inner surface of the
wall, the exposed surface of the plastic cylinder, and the exposed
surface of the metal cylinder.
9. The electronic device housing according to claim 8, wherein the
plastic cylinder has a first hole having a first shoulder on the
inner surface of the first hole, and the metal cylinder has a
second shoulder supported by the first shoulder.
10. The electronic device housing according to claim 9, wherein the
metal cylinder has a second hole having internal thread on the
inner surface of the second hole.
11. The electronic device housing according to claim 9, wherein the
metal cylinder has a first segment and a second segment, and the
joint between the first segment and the second segment forms the
second shoulder.
12. The electronic device housing according to claim 11, wherein a
part of the first segment protrudes from the first flat, and the
part of the first segment has the second flat, and the outer
surface of the first segment has a plurality of concaves spread on
the outer surface thereof.
13. The electronic device housing according to claim 8, wherein the
plastic cylinder has a burr formed on the outermost edge of the
first flat.
14. The electronic device housing according to claim 8, wherein the
plastic cylinder has a plurality of reinforcing ribs distributed on
the outer side of the plastic cylinder.
15. The electronic device housing according to claim 8, wherein the
wall and the plastic cylinder are integrally formed.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention generally relates to a housing and a
cylinder structure thereof, in particular, to an electronic device
housing and a cylinder structure thereof.
[0003] 2. Description of Related Art
[0004] An electronic device housing mainly serves two purposes.
First of all, the electronic device housing provides a base for the
electronic components to be fixed thereon. Secondly, the electronic
device housing offers physical protection to the electronic
components disposed therein and prevents the electronic components
from damage caused by electrostatic discharge (ESD) and
electro-magnetic interference (EMI).
[0005] In order to perform the aforesaid two functions, the housing
for electronic device usually comprises cylinder structures, onto
which the electronic parts can be fastened, and a metal layer,
shielding the electronic components from ESD and EMI.
[0006] FIG. 1A is a local cross-sectional view of a conventional
electronic device housing. Referring to FIG. 1A, the electronic
device housing 100 includes a wall 110, a metal cylinder 120, a
plastic cylinder 130, and a metal layer 140. The plastic cylinder
130 is formed on the wall 110, and the plastic cylinder 130 has a
first hole 132 and a plurality of burrs 134 on the top thereof,
wherein the burrs 134 are resulted from inevitable defect of the
molding process. The metal cylinder 120, which has a second hole
122 with an internal thread 122a, is inserted into the first hole
132 and fixed therein. The metal layer 140 is a sputtered layer,
which covers the exposed surface of the plastic cylinder 130, the
exposed surface of the metal cylinder 120, and the inner surface of
the wall 110.
[0007] FIG. 1B is a local cross-sectional view of a circuit board
installed on the electronic device housing in FIG. 1A, and FIG. 1C
is a local cross-sectional view of the electronic device housing in
FIG. 1B with its burrs consumed. Referring to FIG. 1B, the circuit
board 50 of the electronic device has a plurality of ground pads 52
( only one is shown), a plurality of screws 54 ( only one is shown
), and a plurality of fixing hole 56 (only one is shown), through
which the screws 54 are fastened in the second hole 122 of the
metal cylinder 120, and thus the circuit board 50 is fixed on the
burrs 134 (shown in FIG. 1A) on the top of the plastic cylinder
130, wherein the ground pads 52 are in contact with the metal layer
140. The contact between the metal layer 140 and the ground pads 52
provides the metal layer 140 with the function of electromagnetic
shielding.
[0008] The burrs 134 and a portion of the metal layer 140 thereon,
however, could be consumed by the friction between the circuit
board 50 and the plastic cylinder 130, or by the pressure exerted
on the burrs 134 when installing the circuit board. The damage of
the contact between the ground pads 52 and the metal layer 140
produces an open 142 (shown in FIG. 1C) on the metal layer 140,
which leads to higher resistance or open circuit therebetween, and
hence diminishes the electromagnetic shielding performance of the
electronic device housing 100.
SUMMARY OF THE INVENTION
[0009] Accordingly, the present invention is directed to a cylinder
structure preventing the metal layer from being open-circuited by
the damage of burrs.
[0010] The present invention also provides an electronic device
housing using the aforementioned cylinder structure and thus
insures the electromagnetic shielding performance.
[0011] The present invention provides a cylinder structure
including a plastic cylinder, a metal cylinder, and a metal layer.
The plastic cylinder has a first flat on the top thereof. The metal
cylinder has a second flat on the top thereof, and is partly
inserted into the top of the plastic cylinder, wherein the second
flat is higher than the first flat relative to the top of the
plastic cylinder.
[0012] According to an embodiment of the present invention, the
plastic cylinder has a first hole having a first shoulder on the
inner surface of the first hole, and the metal cylinder has a
second shoulder supported by the first shoulder.
[0013] According to an embodiment of the present invention, the
metal cylinder has a second hole having an internal thread on the
inner surface of the second hole.
[0014] According to an embodiment of the present invention, the
metal cylinder has a first segment and a second segment, and the
joint between the first segment and the second segment forms the
second shoulder.
[0015] According to an embodiment of the present invention, a part
of the first segment protrudes from the first flat, and the part of
the first segment has the second flat, and the first segment has a
plurality of concaves spread on the outer surface thereof.
[0016] According to an embodiment of the present invention, the
plastic cylinder has a burr formed on the outermost edge of the
first flat.
[0017] According to an embodiment of the present invention, the
plastic cylinder has a plurality of reinforcing ribs distributed on
the outer side of the plastic cylinder.
[0018] The present invention further provides an electronic device
housing including a wall, at least one plastic cylinder, at least
one metal cylinder, and a metal layer. The plastic cylinder has a
first flat on the top thereof, and the bottom of the plastic
cylinder is attached to the wall. The metal cylinder has a second
flat on the top thereof, and is partly inserted into the top of the
plastic cylinder, wherein the second flat is higher than the first
flat relative to the top of the plastic cylinder. The metal layer
covers the exposed surface of the plastic cylinder, the exposed
surface of the metal cylinder, and the inner surface of the
wall.
[0019] According to an embodiment of the present invention, the
plastic cylinder has a first hole having a first shoulder on the
inner surface of the first hole, and the metal cylinder has a
second shoulder supported by the first shoulder.
[0020] According to an embodiment of the present invention, the
metal cylinder has a second hole having internal thread on the
inner surface of the second hole.
[0021] According to an embodiment of the present invention, the
metal cylinder has a first segment and a second segment, and the
joint between the first segment and the second segment forms the
second shoulder.
[0022] According to an embodiment of the present invention, a part
of the first segment protrudes from the first flat, and the part of
the first segment has the second flat, and the first segment has a
plurality of concaves spread on the outer surface thereof.
[0023] According to an embodiment of the present invention, the
plastic cylinder has a burr formed on the outermost edge of the
first flat.
[0024] According to an embodiment of the present invention, the
plastic cylinder has a plurality of reinforcing ribs distributed on
the outer side of the plastic cylinder.
[0025] According to an embodiment of the present invention, the
wall and the plastic cylinder are integrally formed.
[0026] As described above, in the present invention, the second
flat is higher than the first flat relative to the top of the
plastic cylinder. To paraphrase, a circuit board installed on the
cylinder structure is supported by the metal cylinder instead of
the burrs or the first flat of the plastic cylinder. Hence, even if
the metal layer between the metal cylinder and the ground pads is
consumed, the metal layer remains electrically connected with the
ground pads via the metal cylinder thus insures the electromagnetic
shielding performance of the electronic device housing.
BRIEF DESCRIPTION OF THE DRAWINGS
[0027] The accompanying drawings are included to provide a further
understanding of the invention, and are incorporated in and
constitute a part of this specification. The drawings illustrate
embodiments of the invention and, together with the description,
serve to explain the principles of the invention.
[0028] FIG. 1A is a local cross-sectional view of a conventional
electronic device housing.
[0029] FIG. 1B is a local cross-sectional view of a circuit board
installed on the electronic device housing in FIG. 1A.
[0030] FIG. 1C is a local cross-sectional view of the electronic
device housing in FIG. 1B with its burrs consumed.
[0031] FIG. 2A is a local top view of the electronic device housing
according to an embodiment of the present invention.
[0032] FIG. 2B is a local cross-sectional view taken along line A-A
in FIG. 2A.
[0033] FIG. 2C is a magnified view of the area circle A in FIG.
2A.
[0034] FIG. 3 is a local cross-sectional view of a circuit board
installed on the electronic device housing in FIG. 2A.
[0035] FIG. 4 is a local cross-sectional view of a circuit board
installed on the electronic device housing according to another
embodiment of the present invention.
[0036] FIG. 5A is a top view of the metal cylinder in FIG. 4.
[0037] FIG. 5B is a cross-sectional view taken along line B-B in
FIG. 5A.
DESCRIPTION OF THE EMBODIMENTS
[0038] Reference will now be made in detail to the present
preferred embodiments of the invention, examples of which are
illustrated in the accompanying drawings. Wherever possible, the
same reference numbers are used in the drawings and the description
to refer to the same or like parts.
[0039] FIG. 2A is a local top view of the electronic device housing
according to an embodiment of the present invention, FIG. 2B is a
local cross-sectional view taken along line A-A in FIG. 2A, and
FIG. 2C is a magnified view of the circle A in FIG. 2A. Referring
to FIG. 2A, FIG. 2B, and FIG. 2C, the electronic device housing 300
includes a wall 310 and a cylinder structure 200. The cylinder
structure 200 includes a plastic cylinder 210, a metal cylinder
220, and a metal layer 230, wherein the plastic cylinder 210 has a
first flat 212 on the top thereof. The bottom of the plastic
cylinder 210 is attached to the wall 300, wherein the wall 300 and
the plastic cylinder 210 may be integrally formed. The metal
cylinder 220 has a second flat 222, and is partly inserted into the
top of the plastic cylinder 210 and fixed therein, wherein the
second flat 222 is higher than the first flat 212 relative to the
top of the plastic cylinder 210. In the present embodiment, the
plastic cylinder 210 has a first hole 214, wherein the first hole
214 has a first shoulder 214a on the inner surface thereof. The
metal cylinder 220 is partly inserted into the first hole 214 and
has a second shoulder 224, which is supported by the first shoulder
214a. The metal layer 230 maybe a sputtered layer, which covers the
exposed portion of the inner surface of the wall 300, the exposed
surface of the plastic cylinder 210 and the exposed surface of the
metal cylinder 220. What is more, the cylinder structure 200 may
further include a plurality of reinforcing ribs 218, which are
distributed on the outer surface of the plastic cylinder 210 and
strengthen the structure of the plastic cylinder 210.
[0040] FIG. 3 is a local cross-sectional view of a circuit board
installed on the cylinder structure in FIG. 2A. Referring to FIG.
2A and FIG. 3, it should be noticed that, although a circuit board
50 is described, any electronic elements suitable for being
installed on an electronic device housing is applicable. The
circuit board 50 is supported by the metal cylinder 220 instead of
the plastic cylinder 210, since the second flat 222 is higher than
the first flat 212. Thus, even if the metal layer 230 between the
metal cylinder 220 and the circuit board 50 is consumed by
friction, the ground pad 52 will still be in contact with the metal
cylinder 220, hence the electromagnetic shielding performance of
the metal layer 230 is ensured.
[0041] FIG. 4 is a local cross-sectional view of a circuit board
installed on the cylinder structure according to another embodiment
of the present invention. The present embodiment is similar to the
aforesaid embodiment, and in these two embodiments, like reference
numerals refer to like elements. Referring to FIG. 4, the cylinder
structure 200' has a plurality of burrs 216 formed on the outermost
edge of the first flat 212'. The circuit board 50 is supported by
the metal cylinder 220, which is higher than the burrs 216 relative
to the top of the plastic cylinder 210', thus the circuit board 50
is not in contact with the burrs 216, therefore prevents the
circuit board 50 from damaging the burrs 216 and maintains the
electromagnetic shielding performance of the metal layer 230.
[0042] FIG. 5A is a top view of the metal cylinder in FIG. 4, and
FIG. 5B is a cross-sectional view taken along line B-B in FIG. 5A.
Referring to FIG. 4, FIG. 5A and FIG. 5B, the metal cylinder 220
may have a second hole 226 having an internal thread 226a on the
inner surface of the second hole 226. The circuit board 50 may be
fixed on the cylinder structure 200' by use of fastening the screw
54 in the second hole 226 through a fixing hole 56 on the circuit
board 50. In the present embodiment, the metal cylinder 220 may
have a first segment 220a and a second segment 220b, wherein the
joint between the first segment 220a and the second segment 220b
forms the aforesaid second shoulder 224. Furthermore, one part of
the first segment 220a may protrude from the first flat 212', and
the second flat 222 is located on the top of the aforementioned
part of the first segment 220a, hence the ground pad 52 of the
circuit board 50 is in contact with the first segment 220a.
Moreover, the first segment 220a may have a plurality of concaves
228 spread on the outer surface thereof. The concaves 228 further
enhance the fixation between the metal cylinder 220 and the plastic
cylinder 210'.
[0043] In summary, in the present invention, the second flat is
higher than the first flat relative to the top of the plastic
cylinder. To restate, a circuit board installed on the cylinder
structure or the electronic device housing is not in contact with
the metal layer on the burrs or on the plastic cylinder,
alternatively, the circuit board is in contact with the metal layer
on the metal cylinder. Hence, even if the metal layer between the
metal cylinder and the ground pads is consumed, the metal layer
remains its electrical connection with the ground pads through the
metal cylinder. Thus the electromagnetic shielding performance of
the electronic device housing in the present invention is
assured.
[0044] Furthermore, the plastic cylinder has a plurality of
concaves spread on the outer surface thereof, which enhances the
fixation between the plastic cylinder and metal cylinder.
[0045] It will be apparent to those skilled in the art that various
modifications and variations can be made to the structure of the
present invention without departing from the scope or spirit of the
invention. In view of the foregoing, it is intended that the
present invention cover modifications and variations of this
invention provided they fall within the scope of the following
claims and their equivalents.
* * * * *