U.S. patent application number 12/209443 was filed with the patent office on 2009-03-19 for micro-heatpipe based cold and hot pad.
This patent application is currently assigned to NATIONAL YANG-MING UNIVERSITY. Invention is credited to FU-JEN KAO.
Application Number | 20090071169 12/209443 |
Document ID | / |
Family ID | 40453036 |
Filed Date | 2009-03-19 |
United States Patent
Application |
20090071169 |
Kind Code |
A1 |
KAO; FU-JEN |
March 19, 2009 |
MICRO-HEATPIPE BASED COLD AND HOT PAD
Abstract
The present invention provides a micro-heatpipe based cold and
holt microtube, including a cold chip, hot chip and a
power-controller.
Inventors: |
KAO; FU-JEN; (Taipei,
TW) |
Correspondence
Address: |
WPAT, PC;INTELLECTUAL PROPERTY ATTORNEYS
2030 MAIN STREET, SUITE 1300
IRVINE
CA
92614
US
|
Assignee: |
NATIONAL YANG-MING
UNIVERSITY
Taipei City
TW
|
Family ID: |
40453036 |
Appl. No.: |
12/209443 |
Filed: |
September 12, 2008 |
Current U.S.
Class: |
62/3.7 |
Current CPC
Class: |
F25D 2400/26 20130101;
F25B 2321/023 20130101; F28D 15/0266 20130101; F25B 2321/021
20130101; F28D 2015/0225 20130101; F25B 21/04 20130101; F28D
15/0233 20130101 |
Class at
Publication: |
62/3.7 |
International
Class: |
F25B 21/02 20060101
F25B021/02 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 19, 2007 |
TW |
096215704 |
Claims
1-7. (canceled)
8. A micro-heatpipe based cold/hot pad, comprising: a TEC in which
after being connected to a direct current produces a heat-absorbing
cold end and a heat-releasing hot end, and when the voltage is
reversed, the cold end becomes the hot end and vice versa; a
micro-heatpipe which is attached to the hot end of the TEC for the
purpose of heat exchange; and a power control component which is
electrically connected to the TEC to supply power to the TEC and to
regulate the charge polarity of the power input.
9. The pad of claim 8 further comprising a cold/hot pad, cold/hot
conduction case or any packaging with heat conducting
capabilities.
10. The pad of claim 8 wherein the power control component further
comprises a power supply and a power switch.
11. The pad of claim 10 wherein the said power supply provides
electricity to the TEC, the said power switch regulates the charge
polarity of the power input, for the TEC to achieve cooling or
heating effect based on the polarity of the power input.
12. The pad of claim 8 wherein the cold/hot pad further comprises a
temperature control device to adjust the degree of cooling or
heating of the TEC.
13. The pad of claim 12 wherein the temperature control device is a
variable resistor.
14. The pad of claim 12 wherein the temperature control device
further comprises a DC power switch and a sensor.
15. The pad of claim 8 further comprising a fixing device to secure
the cold/hot pad at a fixed body part.
16. The pad of claim 8 wherein the said power control component and
the cooling device are further installed on different base boards
connected via a wire to lessen the weight burden on users since the
cooling device is worn separated from the power control component.
Description
FIELD OF THE INVENTION
[0001] This invention relates to a cold/hot device, in particular a
micro-heatpipe based cold/hot pad.
DESCRIPTION OF PRIOR ART
[0002] Cold/hot packs on the market today mainly use gels or
chemical solutions as the content. Gel packs (e.g. cellulose gel)
must be put in the freezer or heated before use, for it could be
very troublesome with only a short period of cooling/heating effect
(approximately 30 minutes). Chemical cold/hot packs utilize
chemical reactions, e.g. sodium acetate solution and sheet metal.
This type of chemical pack can be heated by simply pressing on the
sheet metal to begin the heating process, but it needs to be heated
in hot water to restore its function; it also needs to be put in
the freezer to achieve cooling effect. Although chemical cold/hot
packs have longer cooling and heating effect than gel packs about 1
to 2 hours, the effects only last for a limited time.
[0003] Thermoelectric cooler (TEC) is a semiconductor P-N material,
exploiting the Peltier effect for heating and/or cooling. A direct
current is produced by connecting a DC voltage at both ends of the
TEC, which would warm one end and cool the other, as they are
called the hot end and the cold end, respectively. Reversing the
voltage would also reverse the transfer of heat flow which the hot
end becomes the cold end and vice versa. TECs are small in size,
not easily damaged, and can achieve cooling or heating effect by
just reversing the voltage. They are more power saving than
resistor heaters. Therefore, TECs are used in a variety of cold/hot
products for long lasting heating or cooling effect. When the hot
end of the TEC heats rapidly, heat dissipation apparatus is often
used in TEC cold/hot pads, mainly of cooling fan or heat sink, such
as ones disclosed in Taiwan (ROC) Patent No. 361249 and Taiwan
(ROC) patent No. 273931. However, the use of cooling fans and heat
sink to dissipate surface heat shows poor result. In addition, TEC
designed cold/hot pads are often large in size and cannot be
applied to specific parts for cooling or heating relief.
SUMMARY OF THE INVENTION
[0004] The present invention is related to a micro-heatpipe based
cold/hot pad comprising: a TEC in which after being connected to a
direct current produces a heat-absorbing cold end and a
heat-releasing hot end, and when the voltage is reversed, the cold
end becomes the hot end and vice versa; a micro-heatpipe which is
attached to the hot end of the TEC for the purpose of heat
exchange; and a power control component which is electrically
connected to the TEC to supply power to the TEC and to regulate the
charge polarity of the power input.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] FIG. 1 is a schematic diagram of the system architecture of
the micro-heatpipe cold/hot device in the first embodiment.
[0006] FIG. 2 is a 3-dimentaionl schematic diagram of the
micro-heatpipe cold/hot device in the first embodiment.
[0007] FIG. 3 is a schematic diagram of the system architecture of
the micro-heatpipe cold/hot device in the second embodiment.
[0008] FIG. 4 is a schematic diagram of the system architecture of
the micro-heatpipe cold/hot device in the third embodiment.
DETAILED DESCRIPTION OF THE INVENTION
[0009] As disclosed in the prior art, cold/hot pads that utilize
gel or chemical solution are inconvenient to use and only last for
short period of time. TEC cold/hot devices with cooling fans and
heat sink as the heat dissipating apparatus may complicate the
overall structure, while heat conduction is less effective and the
device cannot be applied to specific parts of the body. In view of
this, this invention aims to provide a micro-heatpipe based
cold/hot pad.
[0010] The present invention is a micro-heatpipe based cold/hot pad
that combines TEC and micro-heatpipe into a lightweight,
easy-to-use device that offers long-lasting cooling or heating
effect and can be applied to specific body parts. This invention
overcomes the shortcomings, such as inconvenience to use and short
lasting time, of gel or chemical cold/hot pads on the market. Since
micro-heatpipes have small thermal resistance, fast thermal
response, good heat conduction, and can distribute heat evenly,
they are free of the drawbacks of requiring heat dissipating
apparatus that complicates the structure and lowers the heat
conduction efficiency. Moreover, micro-heatpipes are lightweight,
small, with simple structure and longer wear-free product life
cycle; when combined with TEC, a cold/hot device is created that is
lightweight, durable and easy to carry. The flexible nature of
micro-heatpipes also allows the cold/hot pad to be perfectly
affixed onto specific body parts for targeted cooling or heating
needs.
[0011] To achieve the above purposes, the present invention is a
micro-heatpipe based cold/hot device, comprising the following
components. A TEC, in which when connected to a DC power supply,
one end becomes the heat-absorbing cold end, while the other
becomes the heat-releasing hot end, when the voltage is reversed,
the cold end turns into the hot end and vice versa. A
micro-heatpipe attached to the hot end of TEC for the purpose of
heat exchange. A power control component that is connected to the
TEC to supply power, and at the same time, regulates the charge
polarity of the power input.
[0012] This invention of a micro-heatpipe cold/hot device can
further comprise a cold/hot pad, a cold/hot conduction case or any
packaging with heat-conducting capabilities. The power control
component of this cold/hot micro-heatpipe device comprises a power
supply and a power switch. In a preferred embodiment, the power
supply provides electricity to the TEC; the switch is used to
regulate the charge polarity of the power input, for the TEC to
achieve cooling or heating effect based on the polarity of the
power supply.
[0013] This invention of a micro-heatpipe cold/hot device can
further comprise a temperature control device, in which the control
device regulates the degree of cooling or heating of the TEC. In a
preferred embodiment, the temperature control device can be a
variable resistor. The temperature control device can comprise a
power switch and a sensor.
[0014] This invention of a micro-heatpipe cold/hot device can
further comprise a fixing device to secure the cold/hot pad at a
fixed body part.
[0015] The power control component and the cooling component of
this invention of a micro-heatpipe cold/hot device can be installed
on different base boards, so that they are connected through an
electric wire to lessen the weight burden on users since the
cooling component is separated from the power control
component.
[0016] In order to allow workers with the relevant skills to
understand and content of the invention of content and the
embodiment, and to easily comprehend the related purpose and
advantages put forward in the content, claims and drawings
disclosed in this application, the embodiment will detail the
features and advantages of this invention. Please refer to the
drawings and descriptions for the content of this invention and
embodiment examples. In fact, this invention may be embodied in a
variety of forms and should not be inferred to be limited by the
examples given in the text.
EXAMPLES
[0017] To elucidate the purpose, structure, feature and function of
the present invention, the following detailed description shows
example embodiments of the present invention.
[0018] FIG. 1 is a schematic diagram of the system architecture of
the micro-heatpipe cold/hot device in the first embodiment. FIG. 2
is a 3-dimentaionl schematic diagram of the micro-heatpipe cold/hot
device in the first embodiment. FIG. 3 is a schematic diagram of
the system architecture of the micro-heatpipe cold/hot device in
the second embodiment. FIG. 4 is a schematic diagram of the system
architecture of the micro-heatpipe cold/hot device in the third
embodiment. The following section describes the components in the
embodiment of this invention.
[0019] As presented in FIG. 1, to achieve the purpose for targeted
cooling/heating of body parts, the present invention of a
lightweight micro-heatpipe cold/hot device comprises a TEC 20, a
micro-heatpipe 30 and a power control component 90. As shown in
FIG. 1, a TEC 20 is installed in the cold/hot pad 10 of this
invention, where a micro-heatpipe 30 is attached to one side of the
TEC, in addition to a small power supply 40 to provide electricity
to TEC 20. The TEC 20 is a semiconductor P-N material, using
Peltier effect for heating or cooling. When the TEC 20 is connected
to a direct current, one end is heated and the other is cooled, as
they are the heat-absorbing cold end 21 and heat-releasing hot end
22, respectively. Reversing the voltage on the TEC 20 would reverse
the transfer of heat flow--the cold end 21 becomes heat-releasing
and the hot end 22 becomes heat-absorbing. TEC 20 is small, not
easily damaged, and can achieve cooling or heating effect by simply
reversing the charge polarity of the power supply. Moreover, TEC 20
is more energy efficient than common heat resistor, while still
capable of providing long-lasting cooling or heating effect.
[0020] The micro-heatpipe 30 used in this invention can be either
flat tube or round tube, which is attached to the hot end 22 of the
TEC 20 for the purpose of heat exchange. When the hot end 22 of the
TEC 20 is heated to a high temperature, the micro-heatpipe 30
allows rapid heat dissipation, when the hot end 22 is cooled, the
adjoining micro-heatpipe absorbs heat from the surrounding to
establish a heat balance with the hot end 22, preventing it from
freezing.
[0021] The power control component 90 (FIG. 2) is electrically
connected the TEC 20 to supply power to the said TEC and to
regulate the charge polarity of the power input; the TEC 20 can
then produce cooling or heating effect based on the charge
polarity. Consequently, users can reverse the polarity of the
battery 40 to change the cooling/heating ends of the cold/hot pad
10 according to their heating or cooling needs. Power supply 40 for
use in this invention comprises, but not limited to, lithium
batteries.
[0022] The cold/hot pad 10 in this invention can further comprise a
fixing device to directly fix or adhere the pad 10 to the skin or
clothing of the user where the heating or cooling is needed. For
example, a band can be attached to the sides of the pad, materials
such as Velcro, reusable adhesive, or ones suitable for skin
contact can also be adhered to the back of the pad.
[0023] FIG. 2 shows a 3-dimentaionl schematic diagram of the
micro-heatpipe cold/hot device in the first embodiment (FIG. 1). As
demonstrated in FIG. 2, the power control component 90 in this
invention comprises a power supply 40 and a power switch 50. The
power supply 40 provides electricity to the TEC 20; the power
switch 50 regulates the charge polarity for the TEC 20 to produce
cooling or heating based on the polarity of the power input.
[0024] When using, attach the side of the old/hot pad 10 with the
flat tube micro-heatpipe 30 to the body part in need of cooling or
heating. After turning on the power supply 40, one can control the
charge polarity by adjusting the power switch 50 for cooling or
heating effect. When the current is positive, i.e. using the
cold/hot pad 10 for cooling, the cold end 21 (skin contact surface,
as shown in FIG. 1) absorbs heat to rapidly lower skin surface
temperature; at the same time, the heat generated at the hot end 22
is rapidly dissipated via the micro-heatpipe 30. On the contrary,
when the current is negative, i.e. using the cold/hot pad 10 for
heating, the cold end 21 (skin contact surface, as shown in FIG. 1)
release heat to produce high temperature; at the same time, the
temperature at the hot end 22 is lowered where the micro-heatpipe
30 absorbs surrounding heat to establish a heat balance, preventing
it from freezing.
[0025] The cold/hot pad 10 in this invention can further comprise a
temperature control device 60 for users to set the temperature for
heating or cooling based on individual needs, so as to enhance the
practicality and cost-effectiveness of the product. The temperature
control device 60 can comprise an adjustment knob 62 for adjustable
variable resistor 61 for the purpose of altering the DC voltage for
TEC 20 in controlling the cooling/heating temperature. A DC power
on/off can also be used to adjust the cooling/heating of TEC 20, in
which a sensor is installed, when the temperature drops lower than
the minimum temperature detected by the sensor, heating begins,
whereas when the temperature exceeds the maximum temperature,
cooling begins.
[0026] FIG. 3 shows a schematic diagram of the system architecture
of the micro-heatpipe cold/hot device in the second embodiment. As
presented in FIG. 3, this is an improvement to the cold/hot pad in
the first embodiment of this invention, in which the weight of the
device exerted on the body part is reduced. The main differences
from the first embodiment are as follows. The power control
component 90 which can further comprise a temperature control
device 60 and power supply 40 are installed on one base board,
whereas the cooling/heating device comprising TEC 20,
micro-heatpipe 30 and cold/hot pad 10 is installed on another base
board. The two structures are connected by a wire 70. When using,
the power control component 90 and the cooling/heating device are
separately fixed on the waist and the body part in need of cooling
or heating to lessen the weight exerted on the user.
[0027] FIG. 4 shows a schematic diagram of the system architecture
of the micro-heatpipe cold/hot device in the third embodiment. As
shown in FIG. 4, the power control component 90 and TEC 20 are
installed on the same base board, where micro-heatpipe 30 is used
to conduct heat for cooling or heating. When using, the weight of
the device on the user is reduced, while the flexible feature of
micro-heatpipe 30 allows seamless adherence of the pad and the
skin. An insulation sheath can be added between the micro-heatpipe
30 and the cold/hot pad 10 for enhanced safety.
[0028] While the invention has been disclosed and illustrated with
reference to a preferred embodiment thereof, it will be understood
that various changes in the details, materials and arrangements of
the parts which have been described and illustrated in order to
explain the nature of this invention may be made by those skilled
in the art without departing from the principle and scope of the
invention as expressed in the following claims.
* * * * *