U.S. patent application number 12/203102 was filed with the patent office on 2009-03-12 for electrochemically fabricated microprobes.
This patent application is currently assigned to Microfabrica Inc.. Invention is credited to Vacit Arat, Richard T. Chen, Adam L. Cohen, Kieun Kim, Ezekiel J. J. Kruglick, Dennis R. Smalley.
Application Number | 20090066351 12/203102 |
Document ID | / |
Family ID | 34397185 |
Filed Date | 2009-03-12 |
United States Patent
Application |
20090066351 |
Kind Code |
A1 |
Arat; Vacit ; et
al. |
March 12, 2009 |
ELECTROCHEMICALLY FABRICATED MICROPROBES
Abstract
Multilayer test probe structures are electrochemically
fabricated via depositions of one or more materials in a plurality
of overlaying and adhered layers. In some embodiments each probe
structure may include a plurality of contact arms or contact tips
that are used for contacting a specific pad or plurality of pads
wherein the arms and/or tips are configured in such away so as to
provide a scrubbing motion (e.g. a motion perpendicular to a
primary relative movement motion between a probe carrier and the
IC) as the probe element or array is made to contact an IC, or the
like, and particularly when the motion between the probe or probes
and the IC occurs primarily in a direction that is perpendicular to
a plane of a surface of the IC. In some embodiments arrays of
multiple probes are provided and even formed in desired relative
position simultaneously.
Inventors: |
Arat; Vacit; (La Canada
Flintridge, CA) ; Cohen; Adam L.; (Los Angeles,
CA) ; Smalley; Dennis R.; (Newhall, CA) ;
Kruglick; Ezekiel J. J.; (San Diego, CA) ; Chen;
Richard T.; (Burbank, CA) ; Kim; Kieun;
(Pasadena, CA) |
Correspondence
Address: |
MICROFABRICA INC.;ATT: DENNIS R. SMALLEY
7911 HASKELL AVENUE
VAN NUYS
CA
91406
US
|
Assignee: |
Microfabrica Inc.
|
Family ID: |
34397185 |
Appl. No.: |
12/203102 |
Filed: |
September 2, 2008 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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11244817 |
Oct 6, 2005 |
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12203102 |
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10772943 |
Feb 4, 2004 |
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11244817 |
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60445186 |
Feb 4, 2003 |
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60506015 |
Sep 24, 2003 |
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60533933 |
Dec 31, 2003 |
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60536865 |
Jan 15, 2004 |
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Current U.S.
Class: |
324/762.02 |
Current CPC
Class: |
G01R 3/00 20130101; G01R
1/06744 20130101; G01R 1/06733 20130101; G01R 1/06711 20130101;
G01R 1/06716 20130101 |
Class at
Publication: |
324/754 |
International
Class: |
G01R 1/067 20060101
G01R001/067; G01R 31/02 20060101 G01R031/02 |
Claims
1. A probe device for testing integrated circuits, comprising: a
bridging element; a plurality of contact arms, each having a first
end and a second end, where the second end of each connects to the
bridging element and the first end of each is configured to contact
a pad of an integrated circuit and wherein the arms are configured
to scrub a surface of the pad as contact between the first end and
the pad is made.
2. The probe of claim 1 wherein a relative movement between the
bridging element of the probe device and the pad of the integrated
circuit is substantially perpendicular to a plane of the pad.
3. The probe of claim 1 wherein the plurality of the contact arms
have an outward taper.
4. The probe of claim 1 wherein the plurality of the contact arms
have an inward taper.
5. The probe of claim 1 additionally wherein the second end of each
arm comprises a compliant member.
6. The probe of claim 5 wherein the compliant member provides
compliance in a direction parallel to a direction of relative
movement between the pad and the bridging element.
7. The probe of claim 1 additionally wherein the bridging element
comprises a compliant member.
8. The probe of claim 7 wherein the compliant member provides
compliance in a direction parallel to a direction of relative
movement between the pad and the bridging element.
9. The probe of claim 7 wherein the compliant member is located
adjacent the plurality of arms.
10. The probe of claim 7 wherein the compliant member is located
away from a location where the second end of the arms contact the
bridging element.
11. The probe of claim 1 wherein the plurality of contact arms are
formed from a plurality of adhered layers of deposited
material.
12. The probe of claim 7 wherein the compliant member is formed
from a plurality of adhered layers of material.
13. A probe device for testing integrated circuits, comprising: a
bridging element; a plurality of contact arms, each having a first
end and a second end, where the second end of each connects to the
bridging element and the first end of each is configured to contact
a pad of an integrated circuit and wherein at least one of the arms
or the bridging element is configured to provide compliance between
the probe device and the pad as contact is made.
14. The probe of claim 13 wherein a relative movement between the
bridging element of the probe device and the pad of the integrated
circuit is substantially perpendicular to a plane of the pad.
15. The probe of claim 13 wherein the plurality of the contact arms
have an outward taper.
16. The probe of claim 13 wherein the plurality of the contact arms
have an inward taper.
17. The probe of claim 13 additionally wherein the second end of
each arm comprises a compliant member.
18. The probe of claim 17 wherein the compliant member provides
compliance in a direction parallel to a direction of relative
movement between the pad and the bridging element.
19. The probe of claim 13 additionally wherein the bridging element
comprises a compliant member.
20. The probe of claim 19 wherein the compliant member provides
compliance in a direction parallel to a direction of relative
movement between the pad and the bridging element.
21. The probe of claim 19 wherein the compliant member is located
adjacent the plurality of arms.
22. The probe of claim 19 wherein the compliant member is located
away from a location where the second end of the arms contact the
bridging element.
23. The probe of claim 13 wherein the plurality of contact arms are
formed from a plurality of adhered layers of deposited
material.
24. The probe device of claim 1 incorporated into an array of probe
devices with a plurality of probe devices each comprising a
conductive bridging element and a plurality of conductive arms
where each of the plurality of probe devices is adhered to a
substrate.
25. The probe device of claim 13 incorporated into an array of
probe devices with a plurality of probe devices each comprising a
conductive bridging element and a plurality of conductive arms
where each of the plurality of probe devices is adhered to a
substrate.
Description
RELATED APPLICATIONS
[0001] This application is a continuation of U.S. patent
application Ser. No. 11/244,817 (Microfabrica Docket No.
P-US097-B-MF), filed Oct. 6, 2005, which in turn is a continuation
of U.S. patent application Ser. No. 10/772,943 (Docket No.
P-US097-A-MF), filed Feb. 4, 2004 which in turn claims benefit of
U.S. Provisional Patent Application Nos.: 60/445,186 (Docket No.
P-US048-A-MG); 60/506,015 (Docket No. P-US048-B-MG); 60/533,933
(Docket No. P-US048-C-MF), and 60/536,865 (Docket No. P-US048-D-MF)
filed on Feb. 4, 2003; Sep. 24, 2003; Dec. 31, 2003, and Jan. 15,
2004 respectively. All of these applications, including any
appendices attached thereto are incorporated herein by reference as
if set forth in full herein.
FIELD OF THE INVENTION
[0002] The present invention relates generally to microprobes and
electrochemical fabrication processes (e.g. EFAB.RTM. fabrication
processes) for making them and more particularly to microprobe
designs.
BACKGROUND OF THE INVENTION
[0003] A technique for forming three-dimensional structures (e.g.
parts, components, devices, and the like) from a plurality of
adhered layers was invented by Adam L. Cohen and is known as
Electrochemical Fabrication. It is being commercially pursued by
Microfabrica.RTM. Inc. (formerly MEMGen Corporation) of Van Nuys,
Calif. under the name EFAB.RTM.. This technique was described in
U.S. Pat. No. 6,027,630, issued on Feb. 22, 2000. This
electrochemical deposition technique allows the selective
deposition of a material using a unique masking technique that
involves the use of a mask that includes patterned conformable
material on a support structure that is independent of the
substrate onto which plating will occur. When desiring to perform
an electrodeposition using the mask, the conformable portion of the
mask is brought into contact with a substrate while in the presence
of a plating solution such that the contact of the conformable
portion of the mask to the substrate inhibits deposition at
selected locations. For convenience, these masks might be
generically called conformable contact masks; the masking technique
may be generically called a conformable contact mask plating
process. More specifically, in the terminology of Microfabrica.RTM.
Inc. (formerly MEMGen Corporation) of Van Nuys, Calif. such masks
have come to be known as INSTANT MASKS.TM. and the process known as
INSTANT MASKING.TM. or INSTANT MASK.TM. plating. Selective
depositions using conformable contact mask plating may be used to
form single layers of material or may be used to form multi-layer
structures. The teachings of the '630 patent are hereby
incorporated herein by reference as if set forth in full herein.
Since the filing of the patent application that led to the above
noted patent, various papers about conformable contact mask plating
(i.e. INSTANT MASKING) and electrochemical fabrication have been
published:
[0004] (1) A. Cohen, G. Zhang, F. Tseng, F. Mansfeld, U. Frodis and
P. Will, "EFAB: Batch production of functional, fully-dense metal
parts with micro-scale features", Proc. 9th Solid Freeform
Fabrication, The University of Texas at Austin, p 161, August
1998.
[0005] (2) A. Cohen, G. Zhang, F. Tseng, F. Mansfeld, U. Frodis and
P. Will, "EFAB: Rapid, Low-Cost Desktop Micromachining of High
Aspect Ratio True 3-D MEMS", Proc. 12th IEEE Micro Electro
Mechanical Systems Workshop, IEEE, p 244, January 1999.
[0006] (3) A. Cohen, "3-D Micromachining by Electrochemical
Fabrication", Micromachine Devices, March 1999.
[0007] (4) G. Zhang, A. Cohen, U. Frodis, F. Tseng, F. Mansfeld,
and P. Will, "EFAB: Rapid Desktop Manufacturing of True 3-D
Microstructures", Proc. 2nd International Conference on Integrated
MicroNanotechnology for Space Applications, The Aerospace Co.,
April 1999.
[0008] (5) F. Tseng, U. Frodis, G. Zhang, A. Cohen, F. Mansfeld,
and P. Will, "EFAB: High Aspect Ratio, Arbitrary 3-D Metal
Microstructures using a Low-Cost Automated Batch Process", 3rd
International Workshop on High Aspect Ratio MicroStructure
Technology (HARMST '99), June 1999.
[0009] (6) A. Cohen, U. Frodis, F. Tseng, G. Zhang, F. Mansfeld,
and P. Will, "EFAB: Low-Cost, Automated Electrochemical Batch
Fabrication of Arbitrary 3-D Microstructures", Micromachining and
Microfabrication Process Technology, SPIE 1999 Symposium on
Micromachining and Microfabrication, September 1999.
[0010] (7) F. Tseng, G. Zhang, U. Frodis, A. Cohen, F. Mansfeld,
and P. Will, "EFAB: High Aspect Ratio, Arbitrary 3-D Metal
Microstructures using a Low-Cost Automated Batch Process", MEMS
Symposium, ASME 1999 International Mechanical Engineering Congress
and Exposition, November, 1999.
[0011] (8) A. Cohen, "Electrochemical Fabrication (EFAB.TM.)",
Chapter 19 of The MEMS Handbook, edited by Mohamed Gad-EI-Hak, CRC
Press, 2002.
[0012] (9) Microfabrication--Rapid Prototyping's Killer
Application", pages 1-5 of the Rapid Prototyping Report, CAD/CAM
Publishing, Inc., June 1999.
[0013] The disclosures of these nine publications are hereby
incorporated herein by reference as if set forth in full
herein.
[0014] The electrochemical deposition process may be carried out in
a number of different ways as set forth in the above patent and
publications. In one form, this process involves the execution of
three separate operations during the formation of each layer of the
structure that is to be formed:
[0015] 1. Selectively depositing at least one material by
electrodeposition upon one or more desired regions of a
substrate.
[0016] 2. Then, blanket depositing at least one additional material
by electrodeposition so that the additional deposit covers both the
regions that were previously selectively deposited onto, and the
regions of the substrate that did not receive any previously
applied selective depositions.
[0017] 3. Finally, planarizing the materials deposited during the
first and second operations to produce a smoothed surface of a
first layer of desired thickness having at least one region
containing the at least one material and at least one region
containing at least the one additional material.
[0018] After formation of the first layer, one or more additional
layers may be formed adjacent to the immediately preceding layer
and adhered to the smoothed surface of that preceding layer. These
additional layers are formed by repeating the first through third
operations one or more times wherein the formation of each
subsequent layer treats the previously formed layers and the
initial substrate as a new and thickening substrate.
[0019] Once the formation of all layers has been completed, at
least a portion of at least one of the materials deposited is
generally removed by an etching process to expose or release the
three-dimensional structure that was intended to be formed.
[0020] The preferred method of performing the selective
electrodeposition involved in the first operation is by conformable
contact mask plating. In this type of plating, one or more
conformable contact (CC) masks are first formed. The CC masks
include a support structure onto which a patterned conformable
dielectric material is adhered or formed. The conformable material
for each mask is shaped in accordance with a particular
cross-section of material to be plated. At least one CC mask is
needed for each unique cross-sectional pattern that is to be
plated.
[0021] The support for a CC mask is typically a plate-like
structure formed of a metal that is to be selectively electroplated
and from which material to be plated will be dissolved. In this
typical approach, the support will act as an anode in an
electroplating process. In an alternative approach, the support may
instead be a porous or otherwise perforated material through which
deposition material will pass during an electroplating operation on
its way from a distal anode to a deposition surface. In either
approach, it is possible for CC masks to share a common support,
i.e. the patterns of conformable dielectric material for plating
multiple layers of material may be located in different areas of a
single support structure. When a single support structure contains
multiple plating patterns, the entire structure is referred to as
the CC mask while the individual plating masks may be referred to
as "submasks". In the present application such a distinction will
be made only when relevant to a specific point being made.
[0022] In preparation for performing the selective deposition of
the first operation, the conformable portion of the CC mask is
placed in registration with and pressed against a selected portion
of the substrate (or onto a previously formed layer or onto a
previously deposited portion of a layer) on which deposition is to
occur. The pressing together of the CC mask and substrate occur in
such a way that all openings, in the conformable portions of the CC
mask contain plating solution. The conformable material of the CC
mask that contacts the substrate acts as a barrier to
electrodeposition while the openings in the CC mask that are filled
with electroplating solution act as pathways for transferring
material from an anode (e.g. the CC mask support) to the
non-contacted portions of the substrate (which act as a cathode
during the plating operation) when an appropriate potential and/or
current are supplied.
[0023] An example of a CC mask and CC mask plating are shown in
FIGS. 1A-1C. FIG. 1A shows a side view of a CC mask 8 consisting of
a conformable or deformable (e.g. elastomeric) insulator 10
patterned on an anode 12. The anode has two functions. FIG. 1A also
depicts a substrate 6 separated from mask 8. One is as a supporting
material for the patterned insulator 10 to maintain its integrity
and alignment since the pattern may be topologically complex (e.g.,
involving isolated "islands" of insulator material). The other
function is as an anode for the electroplating operation. CC mask
plating selectively deposits material 22 onto a substrate 6 by
simply pressing the insulator against the substrate then
electrodepositing material through apertures 26a and 26b in the
insulator as shown in FIG. 1B. After deposition, the CC mask is
separated, preferably non-destructively, from the substrate 6 as
shown in FIG. 1C. The CC mask plating process is distinct from a
"through-mask" plating process in that in a through-mask plating
process the separation of the masking material from the substrate
would occur destructively. As with through-mask plating, CC mask
plating deposits material selectively and simultaneously over the
entire layer. The plated region may consist of one or more isolated
plating regions where these isolated plating regions may belong to
a single structure that is being formed or may belong to multiple
structures that are being formed simultaneously. In CC mask plating
as individual masks are not intentionally destroyed in the removal
process, they may be usable in multiple plating operations.
[0024] Another example of a CC mask and CC mask plating is shown in
FIGS. 1D-1F. FIG. 1D shows an anode 12' separated from a mask 8'
that includes a patterned conformable material 10' and a support
structure 20. FIG. 1D also depicts substrate 6 separated from the
mask 8'. FIG. 1E illustrates the mask 8' being brought into contact
with the substrate 6. FIG. 1F illustrates the deposit 22' that
results from conducting a current from the anode 12' to the
substrate 6. FIG. 1G illustrates the deposit 22' on substrate 6
after separation from mask 8'. In this example, an appropriate
electrolyte is located between the substrate 6 and the anode 12'
and a current of ions coming from one or both of the solution and
the anode are conducted through the opening in the mask to the
substrate where material is deposited. This type of mask may be
referred to as an anodeless INSTANT MASK.TM. (AIM) or as an
anodeless conformable contact (ACC) mask.
[0025] Unlike through-mask plating, CC mask plating allows CC masks
to be formed completely separate from the fabrication of the
substrate on which plating is to occur (e.g. separate from a
three-dimensional (3D) structure that is being formed). CC masks
may be formed in a variety of ways, for example, a
photolithographic process may be used. All masks can be generated
simultaneously, prior to structure fabrication rather than during
it. This separation makes possible a simple, low-cost, automated,
self-contained, and internally-clean "desktop factory" that can be
installed almost anywhere to fabricate 3D structures, leaving any
required clean room processes, such as photolithography to be
performed by service bureaus or the like.
[0026] An example of the electrochemical fabrication process
discussed above is illustrated in FIGS. 2A-2F. These figures show
that the process involves deposition of a first material 2 which is
a sacrificial material and a second material 4 which is a
structural material. The CC mask 8, in this example, includes a
patterned conformable material (e.g. an elastomeric dielectric
material) 10 and a support 12 which is made from deposition
material 2. The conformal portion of the CC mask is pressed against
substrate 6 with a plating solution 14 located within the openings
16 in the conformable material 10. An electric current, from power
supply 18, is then passed through the plating solution 14 via (a)
support 12 which doubles as an anode and (b) substrate 6 which
doubles as a cathode. FIG. 2A, illustrates that the passing of
current causes material 2 within the plating solution and material
2 from the anode 12 to be selectively transferred to and plated on
the cathode 6. After electroplating the first deposition material 2
onto the substrate 6 using CC mask 8, the CC mask 8 is removed as
shown in FIG. 2B. FIG. 2C depicts the second deposition material 4
as having been blanket-deposited (i.e. non-selectively deposited)
over the previously deposited first deposition material 2 as well
as over the other portions of the substrate 6. The blanket
deposition occurs by electroplating from an anode (not shown),
composed of the second material, through an appropriate plating
solution (not shown), and to the cathode/substrate 6. The entire
two-material layer is then planarized to achieve precise thickness
and flatness as shown in FIG. 2D. After repetition of this process
for all layers, the multi-layer structure 20 formed of the second
material 4 (i.e. structural material) is embedded in first material
2 (i.e. sacrificial material) as shown in FIG. 2E. The embedded
structure is etched to yield the desired device, i.e. structure 20,
as shown in FIG. 2F.
[0027] Various components of an exemplary manual electrochemical
fabrication system 32 are shown in FIGS. 3A-3C. The system 32
consists of several subsystems 34, 36, 38, and 40. The substrate
holding subsystem 34 is depicted in the upper portions of each of
FIGS. 3A-3C and includes several components: (1) a carrier 48, (2)
a metal substrate 6 onto which the layers are deposited, and (3) a
linear slide 42 capable of moving the substrate 6 up and down
relative to the carrier 48 in response to drive force from actuator
44. Subsystem 34 also includes an indicator 46 for measuring
differences in vertical position of the substrate which may be used
in setting or determining layer thicknesses and/or deposition
thicknesses. The subsystem 34 further includes feet 68 for carrier
48 which can be precisely mounted on subsystem 36.
[0028] The CC mask subsystem 36 shown in the lower portion of FIG.
3A includes several components: (1) a CC mask 8 that is actually
made up of a number of CC masks (i.e. submasks) that share a common
support/anode 12, (2) precision X-stage 54, (3) precision Y-stage
56, (4) frame 72 on which the feet 68 of subsystem 34 can mount,
and (5) a tank 58 for containing the electrolyte 16. Subsystems 34
and 36 also include appropriate electrical connections (not shown)
for connecting to an appropriate power source for driving the CC
masking process.
[0029] The blanket deposition subsystem 38 is shown in the lower
portion of FIG. 3B and includes several components: (1) an anode
62, (2) an electrolyte tank 64 for holding plating solution 66, and
(3) frame 74 on which the feet 68 of subsystem 34 may sit.
Subsystem 38 also includes appropriate electrical connections (not
shown) for connecting the anode to an appropriate power supply for
driving the blanket deposition process.
[0030] The planarization subsystem 40 is shown in the lower portion
of FIG. 3C and includes a lapping plate 52 and associated motion
and control systems (not shown) for planarizing the
depositions.
[0031] Another method for forming microstructures from
electroplated metals (i.e. using electrochemical fabrication
techniques) is taught in U.S. Pat. No. 5,190,637 to Henry Guckel,
entitled "Formation of Microstructures by Multiple Level Deep X-ray
Lithography with Sacrificial Metal layers". This patent teaches the
formation of metal structure utilizing mask exposures. A first
layer of a primary metal is electroplated onto an exposed plating
base to fill a void in a photoresist, the photoresist is then
removed and a secondary metal is electroplated over the first layer
and over the plating base. The exposed surface of the secondary
metal is then machined down to a height which exposes the first
metal to produce a flat uniform surface extending across the both
the primary and secondary metals. Formation of a second layer may
then begin by applying a photoresist layer over the first layer and
then repeating the process used to produce the first layer. The
process is then repeated until the entire structure is formed and
the secondary metal is removed by etching. The photoresist is
formed over the plating base or previous layer by casting and the
voids in the photoresist are formed by exposure of the photoresist
through a patterned mask via X-rays or UV radiation.
[0032] Electrochemical Fabrication provides the ability to form
prototypes and commercial quantities of miniature objects, parts,
structures, devices, and the like at reasonable costs and in
reasonable times. In fact, Electrochemical Fabrication is an
enabler for the formation of many structures that were hitherto
impossible to produce. Electrochemical Fabrication opens the
spectrum for new designs and products in many industrial fields.
Even though Electrochemical Fabrication offers this new capability
and it is understood that Electrochemical Fabrication techniques
can be combined with designs and structures known within various
fields to produce new structures, certain uses for Electrochemical
Fabrication provide designs, structures, capabilities and/or
features not known or obvious in view of the state of the art.
[0033] A need exists in various fields for miniature devices having
improved characteristics, reduced fabrication times, reduced
fabrication costs, simplified fabrication processes, and/or more
independence between geometric configuration and the selected
fabrication process. A need also exists in the field of miniature
(i.e. mesoscale and microscale) device fabrication for improved
fabrication methods and apparatus.
SUMMARY OF THE INVENTION
[0034] Objects and advantages of various aspects of the invention
will be apparent to those of skill in the art upon review of the
teachings herein. The various aspects of the invention, set forth
explicitly herein or otherwise ascertained from the teachings
herein, may address one or more of the above objects alone or in
combination, or alternatively may address some other object of the
invention ascertained from the teachings herein. It is not
necessarily intended that all objects be addressed by any single
aspect of the invention even though that may be the case with
regard to some aspects.
[0035] In a first aspect of the invention, a probe device for
testing integrated circuits, including: a bridging element; a
plurality of contact arms, each having a first end and a second
end, where the second end of each connects to the bridging element
and the first end of each is configured to contact a pad of an
integrated circuit and wherein the arms are configured to scrub the
surface of the pad as contact between the probe and the pad is
made.
[0036] In a second aspect of the invention, a probe device for
testing integrated circuits, including: a bridging element; a
plurality of contact arms, each having a first end and a second
end, where the second end of each connects to the bridging element
and the first end of each is configured to contact a pad of an
integrated circuit and wherein at least one of the arms or the
bridging element is configured to provide compliance between the
probe and the pad as contact is made.
[0037] In a third aspect of the invention, a probe device for
testing integrated circuits, including: a compliant structure; a
bridging element adhered to a compliant structure; a plurality of
contact arms, each having a first end and a second end, where the
second end of each connects to the bridging element and the first
end of each is configured to contact a pad of an integrated circuit
and wherein at least one of the arms or the bridging element is
configured to provide compliance between the probe and the pad as
contact is made.
[0038] Further aspects of the invention will be understood by those
of skill in the art upon reviewing the teachings herein. Other
aspects of the invention may involve combinations of the above
noted aspects of the invention. Other aspects of the invention may
involve methods for forming the probe devices of the aspects noted
above. Other aspects may involve apparatus that can be used in
implementing one or more of the method aspects of the invention.
These other aspects of the invention may provide various
combinations of the aspects presented above as well as provide
other configurations, structures, functional relationships, and
processes that have not been specifically set forth above.
BRIEF DESCRIPTION OF THE DRAWINGS
[0039] FIGS. 1A-1C schematically depict side views of various
stages of a CC mask plating process, while FIGS. 1D-1G
schematically depict a side views of various stages of a CC mask
plating process using a different type of CC mask.
[0040] FIGS. 2A-2F schematically depict side views of various
stages of an electrochemical fabrication process as applied to the
formation of a particular structure where a sacrificial material is
selectively deposited while a structural material is blanket
deposited.
[0041] FIGS. 3A-3C schematically depict side views of various
example subassemblies that may be used in manually implementing the
electrochemical fabrication method depicted in FIGS. 2A-2F.
[0042] FIGS. 4A-4I schematically depict the formation of a first
layer of a structure using adhered mask plating where the blanket
deposition of a second material overlays both the openings between
deposition locations of a first material and the first material
itself.
[0043] FIG. 5 illustrates a probe of a first embodiment that
includes two contact arms/elements that have an outward taper.
[0044] FIG. 6 illustrates a second embodiment of a probe wherein
the probe includes four contact elements that taper in an outward
direction.
[0045] FIG. 7 illustrates a probe of a third embodiment that
includes two contact arms/elements that have an inward taper.
[0046] FIG. 8 illustrates a fourth embodiment of a probe wherein
the probe includes four contact elements that taper in an outward
direction.
[0047] FIGS. 9A and 9B depict respectively a side view and a
perspective view of a probe having three arm/contact elements.
[0048] FIG. 10 depicts a perspective view of another probe
embodiment where the probe has two contact arms with each have a
small curvature.
[0049] FIG. 11 depicts a perspective view of another probe
embodiment where the probe has four contact arms with each have a
small curvature.
[0050] FIG. 12 illustrates a probe of another embodiment where the
probe includes two contact arms/elements that have an outward taper
and a conformable or compressible element.
[0051] FIG. 13 illustrates a probe of a first embodiment that
includes two contact arms/elements that have an outward taper and
where it additionally includes a conformable element between the
arms and a bridging element.
[0052] FIG. 14 depicts a further embodiment of a probe wherein the
probe is similar to that of the embodiment of FIG. 12 with the
exception that the probe additionally includes a drive shaft that
forces a pair of pushing elements to cause the contact arms to
separate.
[0053] FIG. 15 depicts and embodiment similar to that of FIG. 14
however with the arms taking on the configuration of the embodiment
of FIG. 13.
[0054] FIG. 16 depicts a further alternative embodiment where a
probe includes a shaft that can move independently of the movement
of a bridge element such that both inward and outward motion of the
contact arms can be made to occur.
[0055] FIG. 17 depicts a further alternative embodiment where a
probe includes a shaft to which elements are attached that may be
used to pull the contact arms inward.
[0056] FIG. 18 depicts a further alternative embodiment which is
similar to the embodiment of FIG. 17 with the exception that the
contact arms have an inward slant.
[0057] FIG. 19 depicts a side view of a probe with two
joint/contact positions highlighted.
[0058] FIGS. 20A-20D depict side views of four exemplarily
joint/contact configurations for an arm and a pushing rod.
[0059] FIGS. 21A-21D depict side views of four exemplarily
joint/contact configurations for a shaft and a pushing rod.
[0060] FIG. 22 depicts a perspective view of a cut through a
bellows type probe element of another embodiment of the
invention.
[0061] FIG. 23 depicts a perspective view of an array of probes
mounted to a substrate.
[0062] FIGS. 24A and 24B depict a perspective and top view,
respectively of a multiple contact element microprobe according to
another embodiment of the invention.
[0063] FIG. 25 depicts a side view of a multiple contact element
probe (as cut through its center) according to another embodiment
of the invention.
[0064] FIG. 26 depicts a side view of an alternative probe (or
possibly probe tip configuration) which includes two contact
tips.
[0065] FIGS. 27A-27C depict a side view and two bottom views of a
cylindrical probe structure that includes top and bottom rings
connected by a plurality of non-vertical extending elements.
[0066] FIG. 28 depicts a perspective view of a portion of a probe
bridging ring and two contact tips located on arms extending
laterally from the bridging ring.
[0067] FIGS. 29A-29B depict side views of bridging rings or disks
with a plurality of tips located on arms extending both laterally
and vertically from the bridging.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS OF THE INVENTION
[0068] FIGS. 1A-1G, 2A-2F, and 3A-3C illustrate various features of
one form of electrochemical fabrication that are known. Other
electrochemical fabrication techniques are set forth in the '630
patent referenced above, in the various previously incorporated
publications, in various other patents and patent applications
incorporated herein by reference, still others may be derived from
combinations of various approaches described in these publications,
patents, and applications, or are otherwise known or ascertainable
by those of skill in the art from the teachings set forth herein.
All of these techniques may be combined with those of the various
embodiments of various aspects of the invention to yield enhanced
embodiments. Still other embodiments may be derived from
combinations of the various embodiments explicitly set forth
herein.
[0069] FIGS. 4A-4I illustrate various stages in the formation of a
single layer of a multi-layer fabrication process where a second
metal is deposited on a first metal as well as in openings in the
first metal where its deposition forms part of the layer. In FIG.
4A, a side view of a substrate 82 is shown, onto which patternable
photoresist 84 is cast as shown in FIG. 4B. In FIG. 4C, a pattern
of resist is shown that results from the curing, exposing, and
developing of the resist. The patterning of the photoresist 84
results in openings or apertures 92(a)-92(c) extending from a
surface 86 of the photoresist through the thickness of the
photoresist to surface 88 of the substrate 82. In FIG. 4D, a metal
94 (e.g. nickel) is shown as having been electroplated into the
openings 92(a)-92(c). In FIG. 4E, the photoresist has been removed
(i.e. chemically stripped) from the substrate to expose regions of
the substrate 82 which are not covered with the first metal 94. In
FIG. 4F, a second metal 96 (e.g., silver) is shown as having been
blanket electroplated over the entire exposed portions of the
substrate 82 (which is conductive) and over the first metal 94
(which is also conductive). FIG. 4G depicts the completed first
layer of the structure which has resulted from the planarization of
the first and second metals down to a height that exposes the first
metal and sets a thickness for the first layer. In FIG. 4H the
result of repeating the process steps shown in FIGS. 4B-4G several
times to form a multi-layer structure are shown where each layer
consists of two materials. For most applications, one of these
materials is removed as shown in FIG. 4I to yield a desired 3-D
structure 98 (e.g. component or device).
[0070] The various embodiments, alternatives, and techniques
disclosed herein may be combined with or be implemented via
electrochemical fabrication techniques. Such combinations or
implementations may be used to form multi-layer structures using a
single patterning technique on all layers or using different
patterning techniques on different layers. For example, different
types of patterning masks and masking techniques may be used or
even techniques that perform direct selective depositions may be
used without the need for masking. For example, conformable contact
masks may be used during the formation of some layers or during
some selective deposition or etching operations while
non-conformable contact masks may be used in association with the
formation of other layers or during other selective deposition or
etching operations. Proximity masks and masking operations (i.e.
operations that use masks that at least partially selectively
shield a substrate by their proximity to the substrate even if
contact is not made) may be used, and adhered masks and masking
operations (masks and operations that use masks that are adhered to
a substrate onto which selective deposition or etching is to occur
as opposed to only being contacted to it) may be used.
[0071] FIG. 5 illustrates a probe 202 that includes two contact
arms 204(a) and 204(b) that are connected by a bridge element 206,
which in turn connects to a rod 208. The rod 208 forms part of or
connects to the rest of a testing system which may include
positioning elements and connections or components for performing
electrical tests of a circuit pad to which elements 204(a) and
204(b) will contact. Probe 202 will be driven to contact a pad (not
shown) by moving it vertically in the direction of arrow 212. As
the pad is contacted the vertical motion of the probe will be
translated into horizontal movement of tips 214(a) and 214(b) which
will result in a scrubbing of the pad surface which will tend to
remove any dielectric coating on the pad or on the probe tips,
thereby allowing electrical contact to be made. As contact with the
pad is made, tips 214(a) and 214(b) will spread in the direction
indicated by arrow 216.
[0072] Various alternatives of the embodiment of FIG. 5 are
possible. In some alternative embodiments, rod 208 may be excluded
in favor a vertically compliant structure or other structural
element. In some alternative embodiments the bridge element 206 may
be a multilayer structure which may be rigid or compliant. In some
alternative embodiments, contact elements 214(a) and 214(b) may be
formed from a different material than that forming other parts of
arms 204(a) and 204(b). In still other alternative embodiments,
contact elements 214(a) and 214(b) may be formed in a different
process than that used to form other portions of the probe
elements. In some embodiments, the probe 202 may actually only be a
portion of a larger probe design which includes compliant regions,
shields, or the like (e.g. probe 202 may be considered a
multi-layer probe tip structure as opposed to an entire probe). In
some alternative embodiments additional arm-like elements and
contact elements may used. In still other embodiments, the various
layer steps in the structure may each be made of multiple layers,
the layer thickness used may be much smaller than the structural
height and/or the layers may offset in a more uniform manner such
that the discontinuities between layers is less noticeable. In some
alternative embodiments a smaller number of layers may be used or a
larger number of layers. Various elements of these alternative
embodiments may be the basis of alternatives to the various other
embodiments set forth hereafter and/or may combined with one
another or with other alternatives to form other embodiments.
[0073] FIG. 6 illustrates an alternative embodiment where the probe
222 includes four contact elements 224(a)-224(d), along with bridge
element 226 and rod 228. To contact a pad to be tested, the probe
is moved in the direction of arrow 232, and as contact with the pad
is made arms 224(a) and 224(b) move radially outward in the
direction shown by arrow 236 while elements 224(c) and 224(d)
spread outward in the direction shown by arrow 238.
[0074] FIG. 7 shows another alternative embodiment for a probe
device which includes two contact arms 242(a) and 242(b) connected
to a bridge element 246 and a support and movement rod 248. The
probe is moved vertically to contact a pad (not shown) to be tested
where the movement is in the direction indicated by arrow 252. As
the pad is contacted the two contact arms 242(a) and 242(b) slide
towards each other in the directions indicated by arrows 254(a) and
254(b).
[0075] FIG. 8 shows a further alternative embodiment where the
probe is similar to that of FIG. 7 with the exception that two
additional probe arms are included.
[0076] FIG. 9A depicts a side view of a probe that includes contact
arms 282(a) and 282(b). The contact arms are directed in opposing
directions and are offset from one another (as can be better seen
in FIG. 9B) so that they do not contact one another. The contact
arms join a common bridge element 286 which in turn connects to a
rod 288 which can be used to move the probe vertically up and down
to bring it into and away from contact with an electrical pad to be
probed. As the probe is moved downward and it contacts an
electrical pad to be tested (not shown), arm 282 scrubs in the
direction indicated by arrow 292(a) while arm 282(b) scrubs in the
direction shown by arrow 292(b).
[0077] A perspective view of the structure of FIG. 9A is shown in
FIG. 9B where it can be seen that the probe includes three contact
arms 282(a), 282(b) and 282(c). As the probe is moved in the
direction indicated by arrow 294 and contact is made with the pad
to be tested, arms 282(a), 282(b) and 282(c) move in the directions
indicated by arrows 292(a), 292(b), and 292(c) respectively.
[0078] FIGS. 10 and 11 illustrate a further embodiment of probe
elements. The probe of FIG. 10 is shown as having two arms 302(a)
and 302(b) connected by a bridge element 306 which in turn is
connected to rod element 308. As the arm elements 302(a) and 302(b)
have both an inward and outward bend they provide some amount of
compliance as a pad is contacted but they provide little or no
scrapping or scrubbing of the pad surface during at after contact
is made. As such, a probe of this type may have more difficulty in
penetrating any dielectric coating located on the pad surface. Some
scrubbing may be provided in embodiments where the inward and
outward curvatures are of different magnitudes (e.g. when the
contact regions are not located directly below the regions where
the arms join the bridge element). To assist in the scrubbing
process rod 308 may be made to undergo slight movement or vibration
in a horizontal direction thereby causing the two contact arms to
scrub the surface free of any conductivity inhibiting dielectric.
Such vibration may be of any appropriate frequency and magnitude
which is sufficient to cause successful scrubbing without causing
damage to the electrical component being tested or the probe
elements themselves.
[0079] FIG. 11 illustrates another alternative embodiment where the
probe is similar to that of FIG. 10 with the exception that four
contact arms are present instead of two.
[0080] FIG. 12 depicts another alternative embodiment with contact
arms 204(a) and 204(b) that are similar to those of FIG. 5. The
probe includes a rod 208 and a bridge element 206 as did the
embodiment of FIG. 5. However FIG. 12 additionally includes,
disposed between bridge 206 and arms 204(a) and 204(b), a compliant
member 210. As the probe is made to contact a pad (not shown), at
the lower surfaces of arms 204(a) and 204(b), the compliant element
210 compresses. This compression reduces the risk of arms 204(a)
and 204(b) damaging the electronic component, it also ensures a
steady contact force between arms 204(a) and 204(b) and the pad
(not shown), and allows for any vertical displacement necessary to
bring an array of contact elements into contacting position with
their respective pads. In other embodiments different width to
height aspect ratios may be used, additional arms and associated
compliant structures may be added, and/or the bridging element or a
secondary bridging element may be located at the bottom and/or in
the middle of the compliant portion of the structure (e.g. if the
compliant structure took the form of discs separated by large
diameter rings and small diameters rings or rods--bellows-like
structures).
[0081] FIG. 13 depicts an additional alternative embodiment with
contact arms similar to those shown in FIG. 7 with the addition of
a compliant element 240 located between contact arms 242(a) and
242(b) and bridge element 246.
[0082] FIG. 14 depicts a probe having arms 204(a) and 204(b), a
compliant member 210, a bridging element 206, and a rod 208 which
are similar to those depicted in the embodiment of FIG. 12. The
embodiment of FIG. 14 additionally includes a shaft 402 which abuts
bridge element 206 and pushing elements 404(a) and 404(b). As rod
208 is driven downward forcing the probe 400 against a pad to be
tested, compliant member 210 compresses thereby driving shaft 408
downward which in turn forces pushing elements 404(a) and 404(b) to
assume more horizontal positions which force the separation of arms
204(a) and 204(b). This in turn forces the tips 424(a) and 424(b)
of the arms to scrub the surface of the pad thereby enhancing the
electrical contact between the probe and the pad.
[0083] FIG. 15 depicts an additional alternative embodiment having
arms, a bridging element, and a rod similar to that of FIG. 13 as
well as a compliant element similar to but with a slightly
different configuration than that shown in FIG. 13 and where the
embodiment includes a shaft and pushing elements similar to those
of the embodiment of FIG. 14.
[0084] FIG. 16 depicts a further alternative embodiment where the
shaft 502 is capable of separate movement relative to bridging
element 506 such that relative upward and downward movement of
shaft 502 can cause either inward or outward movement,
respectively, of the arms in the directions indicated by arrows
528(a) and 528(b).
[0085] FIG. 17 depicts a further embodiment similar to that of FIG.
14, with the exception that it does not include pushing elements
that cause the arms to split apart upon making contact with a pad
to be tested. Instead, in this embodiment, pulling elements 606(a)
and 606(b) connect the shaft 624 to the arms 602(a) and 602(b). In
this embodiment, the connecting arms extend horizontally such that
any downward movement of the shaft causes a deflection of the
pulling elements that in turn cause the separation between the ends
of the arms to decrease. In other embodiments, the pulling elements
may take on other configurations (e.g. a downward slant toward the
shaft).
[0086] The embodiment of FIG. 18 is similar to that of FIG. 17 with
the exception that the arms point inward instead of outward.
[0087] FIGS. 19-21 depict various examples of joint/contact
possibilities that may exist between the arms and the separating
elements (i.e. in the regions encircled by element 19) and between
the separating elements and the shaft (as indicated by element
20).
[0088] FIG. 20A and 21A indicate that the connections may be of a
fixed nature such that movement occurs by flexing of the separating
elements and/or the shaft and/or the arms. FIGS. 20B and 21B
indicate that the positioning of the elements may be by having them
abut against one another. FIGS. 20C and 21C indicate that the
positioning/connection may be via a hinge like structure (such a
structure can be built directly using electrochemical fabrication
by leaving a small region of sacrificial material between the
moving elements so that after release the elements can move
relative to one another). FIGS. 20D and 21D indicate that the
elements may be moveably connected by a ball and socket-type joint
(such a structure can be built directly using electrochemical
fabrication by leaving a small region of sacrificial material
between the moving elements so that after release the elements can
move relative to one another).
[0089] In various alternative embodiments the
positioning/connecting elements may take on various other forms. In
still other embodiments different types of joints/contacts may be
used in the shaft-to-pushrod region and in the pushrod-to-arm
region.
[0090] In still other embodiments, compliant members may be used
that have different configurations than the specific spring-like
elements shown. In still other embodiments different numbers of
arms may be used; the arms may be extended at different angles;
they may include different numbers of layer elements; the arms and
separating elements may take on other configurations that result in
non-radial scrubbing of the pad surface, and the like. In still
other embodiments, horizontal movement or vibration of the contact
arms/elements may be used to enhance scrubbing.
[0091] The configuration of the tips of the arms that contact the
pad to be tested (i.e. the contact region of the arms) may take on
different configurations than those illustrated. For example, the
tips (i.e. contact region) of the arms may be narrower than the
width of the arms in a direction perpendicular to a direction used
for scrubbing. The tips may be shorter than a length of the arms in
a direction parallel to the direction used for scrubbing. The
contact region of the arm may be formed from a different material
than that used to form the bulk of the arms. The contact region of
the arms may be located relative to the rest of the arm such that
during movement of the arms (during a scrubbing motion), the
contact region experiences a desired force distribution that, for
example, may cause the orientation of the contact region to become
non-parallel to the plane of the pad being contacted. Such a change
in orientation may cause a desired biting or scrapping effect
between the pad and the contact region such that the effectiveness
of scrubbing (i.e. breaking through any oxide or other dielectric
layer) is enhanced.
[0092] In still other embodiments, the positioning of the arms
relative to any compliance member and more particularly relative to
any movement of the compliance member may be selected so as to
cause the contact region of the arms to take on an orientation that
is non-parallel to that of a pad being contacted. The orientation
may be such that the leading edge of the contact region (e.g. edge
of the layer forming the contact region) digs into the pad or such
that a desired side edge or trailing edge of the contact region
digs into the pad so as to cause an enhanced scrubbing effect.
[0093] In some preferred embodiments the probe structures depicted
may be formed using electrochemical fabrication techniques of the
contact mask (e.g. conformable or non-conformable type) or bonded
(e.g. adhered) mask type (e.g. via through mask plating using
patterned photoresist masks as selective electroplating patterns).
In some embodiments arrays of probes may be formed simultaneously
using electrochemical fabrication techniques. In still other
embodiments the rods and possibly the bridge elements and parts of
the arms may be part of a central conductor of coaxial transmission
lines which helps minimize signal loss.
[0094] In some embodiments the thickness of individual layers
forming a microprobe may be much thinner than the overall height
and/or width of the microprobe component in which case sloping
elements of the probe may take on a smooth or continuous
appearance. This is illustrated in the microprobes structures of
FIGS. 22-25.
[0095] In some embodiments contact arms (e.g. the portion of a
probe that is connected to contact regions) may move relative to
one another to allow scrubbing or even to cause scrubbing to occur.
In some embodiments, the arms of the probe may be relatively short
compared to the height of a conformable portion of the probe
element. An example of such a probe is illustrated in FIG. 22 where
the probe comprises a bridging element 624 which connects to arms
622-1 and 622-2 and where the bridging element includes a
compressible structure which provides compliance as the probe and
pad make contact. In some embodiments, arms 622-1 and 622-2 may
have mounted on their distal, or contact, regions tips
configurations. These tip configurations may be such that during
compression of the compliant structure, as contact is being
established, a relative horizontal movement of the tips occurs that
causes a scrubbing between at least one of the tips and the pad to
occur. In still other embodiments a large number of probes may be
formed on or attached to a single support structure to form a probe
array of desired configuration. An example of such a probe array is
illustrated in FIG. 23. The probe array of FIG. 23 may be obtained
by either electrochemical fabrication of the probes 632 onto
substrate 642 or the attachment of the probes to the substrate
after formation.
[0096] In some embodiments conformable portions of a probe element
having multiple arms may be associated with each individual arm. An
example of such a probe is illustrated in FIGS. 24A and 24B. The
probe includes a bridging element 706, and compliant elements 704
which form the upper portion of each of six arms 702-1 to 702-6 (of
which only 4 are shown).
[0097] FIG. 25 depicts a side view of a probe element formed with
layers which are thin compared to the overall height 750 of the
probe element where the probe has two arms 752, connected to a
bridging element 756 via compliant (i.e. compressible) structures
754. The compressible structure 754 may be a single structure that
functions as part of the bridging element or they may be individual
structures that function as part of each arm. A central drive shaft
758 is lowered as the structures 754 compresses in response to the
probe being driven against the pad which in turn causes inner most
ends 762 of the two transfer elements 764 to move downward which in
turn causes the transfer elements to spread arms 752 outward so as
to cause scrubbing of their contact tips 766 against the pad.
[0098] FIG. 26 provides a probe configuration 780 that includes a
shaft 778 that offers little compliance but an ability to cause
scrubbing of a contact pad as the two probe tip elements 782(a) and
782(b) make contact and then are forced slightly apart as
compression causes bridging element 784 to flex. In some
embodiments, the amount of stress to which bridging element 784 is
subjected is preferably less than that which will result in plastic
deformation of the element. In situations where more compliance is
desired the probe configuration of FIG. 26 may replace shaft 778
with a more compliant structural element or group of elements. In
some alternative embodiments the bridging element may be symmetric
in design and one or more additional arms and tips may be added to
it. In some alternative embodiments, the bridging element may take
on a more curved (as opposed to angular) configuration. In some
embodiments, the bridging element may curve downward with the tips
extending a sufficient distance to allow contact to the pad without
the shaft contacting the pad. In some embodiments, the tips may be
formed of the same material as the bridging element while in other
embodiments they may be of a different material. In some
embodiments, the tips may be formed in such a way so that they have
tapped configurations as shown or they may take on other
configurations. In some embodiments, the shaft or other structural
element may contact the bridging element along a relatively
straight portion of the bridging element while in other
embodiments, contact may be made at a transitional (e.g. angled or
curved portion of the bridging element.
[0099] FIGS. 27A-27C provide side views of a cylindrical probe
structure with a top ring 792 and a bottom ring 794 jointed by arms
796(a)-796(d) that extend from the perimeter of one ring to the
perimeter of the other ring but not in a completely vertical manner
such that when the two rings are placed in compression the rings
will experience a rotational force. One of the rings may be fixed
to a substrate (e.g. a space transformer), other structural
elements such as a structure with a desired amount of compliance,
or the like while the other ring has one or more probe tip elements
798(a) and 798(b) extending from it as shown in the side view of
FIG. 27B and in the bottom views of FIG. 27B and 27C. As indicated
in FIG. 27C, the probe tip need not take on a point like
configuration but instead may have an elongated configuration or
some other configuration.
[0100] FIG. 28 provides ring element 802 that acts as a bridge
element for two probe tips 804(a) and 804(b). The ring element that
may be located at the end of various probe structures (not shown,
e.g. compliant structures and the like). As shown, the ring has
extending from it two lateral extending arms 806(a) and 806(b) on
the distal ends of which probe tip elements 804(a) and 80(b) are
located. As the ring makes contact with a pad (not shown) the
lateral extending cantilever arms bend causing a change in the
lateral separation of the probe tips this change in separation may
translate into a lateral scrubbing action between at least one of
the probe tips and the pad. In other embodiments, more arms and
tips may extend from the rings, the rings may take on other
configurations (e.g. square, rectangular, oval, non-closed
configurations and the like), the tips may be formed as
multi-layered structures or tapered structures, and/or the arms may
not be completed lateral extending structures but may be formed as
multilayer structures of any desired configuration (see FIGS. 29A
and 29B). FIGS. 29A and 29B depict side views of ring-like or
disc-like structures 810 where a plurality of arms 812(a)-812(h)
extend out of the plane of the ring or disc with tips 814(a)-814(h)
respectively located thereon. When compression is applied to the
tips, each will undergo a horizontal as well as vertical
displacement that will produce a scrubbing motion. In FIG. 29A, the
tips will undergo a lateral motion that moves them closer together,
while in other embodiments (e.g. when the left right arm
configurations are reversed), the displacement will cause the tips
to move further apart.
[0101] Some embodiments may employ diffusion bonding or the like to
enhance adhesion between successive layers of material. Various
teachings concerning the use of diffusion bonding in
electrochemical fabrication process is set forth in U.S. Patent
Application No. 60/534,204 which was filed Dec. 31, 2003 by Cohen
et al. which is entitled "Method for Fabricating Three-Dimensional
Structures Including Surface Treatment of a First Material in
Preparation for Deposition of a Second Material" and which is
hereby incorporated herein by reference as if set forth in
full.
[0102] Further teaching about microprobes and electrochemical
fabrication techniques are set forth in a number of U.S. Patent
Applications which were filed Dec. 31, 2003. These Filings include:
(1) U.S. Patent Application No. 60/533,975 by Kim et al. and which
is entitled "Microprobe Tips and Methods for Making"; (2) U.S.
Patent Application No. 60/533,947 by Kumar et al. and which is
entitled "Probe Arrays and Method for Making"; (3) U.S. Patent
Application No. 60/533,948 by Cohen et al. and which is entitled
"Electrochemical Fabrication Method for Co-Fabricating Probes and
Space Transformers"; and (4) U.S. Patent Application No. 60/533,897
by Cohen et al. and which is entitled "Electrochemical Fabrication
Process for Forming Multilayer Multimaterial Microprobe
structures". These patent filings are each hereby incorporated
herein by reference as if set forth in full herein.
[0103] Teachings concerning the formation of structures on
dielectric substrates and/or the formation of structures that
incorporate dielectric materials into the formation process and
possibility into the final structures as formed are set forth in a
number of patent applications filed on Dec. 31, 2003. The first of
these filings is U.S. Patent Application No. 60/534,184, which is
entitled "Electrochemical Fabrication Methods Incorporating
Dielectric Materials and/or Using Dielectric Substrates". The
second of these filings is U.S. Patent Application No. 60/533,932,
which is entitled "Electrochemical Fabrication Methods Using
Dielectric Substrates". The third of these filings is U.S. Patent
Application No. 60/534,157, which is entitled "Electrochemical
Fabrication Methods Incorporating Dielectric Materials". The fourth
of these filings is U.S. Patent Application No. 60/533,891, which
is entitled "Methods for Electrochemically Fabricating Structures
Incorporating Dielectric Sheets and/or Seed layers That Are
Partially Removed Via Planarization". A fifth such filing is U.S.
Patent Application No. 60/533,895, which is entitled
"Electrochemical Fabrication Method for Producing Multi-layer
Three-Dimensional Structures on a Porous Dielectric". These patent
filings are each hereby incorporated herein by reference as if set
forth in full herein.
[0104] Various other embodiments of the present invention exist.
Some of these embodiments may be based on a combination of the
teachings herein with various teachings incorporated herein by
reference. Some embodiments may not use any blanket deposition
process and/or they may not use a planarization process. Some
embodiments may involve the selective deposition of a plurality of
different materials on a single layer or on different layers. Some
embodiments may use selective deposition processes or blanket
deposition processes on some layers that are not electrodeposition
processes. Some embodiments may use nickel as a structural material
while other embodiments may use different materials. Some
embodiments may use copper as the structural material with or
without a sacrificial material. Some embodiments may remove a
sacrificial material while other embodiments may not. Some
embodiments may employ mask based selective etching operations in
conjunction with blanket deposition operations. Some embodiments
may form structures on a layer-by-layer basis but deviate from a
strict planar layer on planar layer build up process in favor of a
process that interlacing material between the layers. Examples of
such build processes are disclosed in U.S. application Ser. No.
10/434,519, filed on May 7, 2003, entitled "Methods of and
Apparatus for Electrochemically Fabricating Structures Via
Interlaced Layers or Via Selective Etching and Filling of Voids".
This application and the other applications, patents, and
publications set forth herein are each incorporated herein by
reference as if set forth in full.
[0105] In view of the teachings herein, many further embodiments,
alternatives in design and uses of the instant invention will be
apparent to those of skill in the art. As such, it is not intended
that the invention be limited to the particular illustrative
embodiments, alternatives, and uses described above but instead
that it be solely limited by the claims presented hereafter.
* * * * *