U.S. patent application number 12/270861 was filed with the patent office on 2009-03-05 for method of fabricating organic electronic device.
This patent application is currently assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE. Invention is credited to Jia-Chong Ho, Tarng-Shiang Hu, Cheng-Chung Lee, Tsung-Hsien Lin.
Application Number | 20090061558 12/270861 |
Document ID | / |
Family ID | 38233216 |
Filed Date | 2009-03-05 |
United States Patent
Application |
20090061558 |
Kind Code |
A1 |
Lin; Tsung-Hsien ; et
al. |
March 5, 2009 |
METHOD OF FABRICATING ORGANIC ELECTRONIC DEVICE
Abstract
A fabricating method of organic electronic device is provided.
The method comprises: providing a flexible substrate; fabricating a
plurality of organic elements on the flexible substrate; depositing
a patterned spacing layer on the flexible substrate with a spacing
material deposition source and a mask; and arranging a cover
substrate on the patterned spacing layer, and sealing the edges of
the flexible substrate and the cover substrate with a sealant,
wherein the patterned spacing layer is used to maintain a space
between the flexible substrate and the cover substrate.
Inventors: |
Lin; Tsung-Hsien; (Hsinchu
City, TW) ; Ho; Jia-Chong; (Hsinchu County, TW)
; Hu; Tarng-Shiang; (Hsinchu City, TW) ; Lee;
Cheng-Chung; (Taitung City, TW) |
Correspondence
Address: |
JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
7 FLOOR-1, NO. 100, ROOSEVELT ROAD, SECTION 2
TAIPEI
100
TW
|
Assignee: |
INDUSTRIAL TECHNOLOGY RESEARCH
INSTITUTE
Hsinchu
TW
|
Family ID: |
38233216 |
Appl. No.: |
12/270861 |
Filed: |
November 14, 2008 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
11554576 |
Oct 30, 2006 |
|
|
|
12270861 |
|
|
|
|
Current U.S.
Class: |
438/99 ;
257/E51.001 |
Current CPC
Class: |
H01L 51/5253 20130101;
H01L 2251/5338 20130101; H01L 51/525 20130101 |
Class at
Publication: |
438/99 ;
257/E51.001 |
International
Class: |
H01L 51/40 20060101
H01L051/40 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 12, 2006 |
TW |
95101178 |
Claims
1. A method of fabricating an organic electronic device,
comprising: providing a flexible substrate; fabricating a plurality
of organic elements on the flexible substrate; depositing a
patterned spacing layer on the flexible substrate with a spacing
material deposition source and a mask; and arranging a cover
substrate on the patterned spacing layer, and sealing the edges of
the flexible substrate and the cover substrate with a sealant,
wherein the patterned spacing layer is used to maintain a space
between the flexible substrate and the cover substrate.
2. The method of fabricating an organic electronic device as
claimed in claim 1, wherein the spacing material deposition source
deposits the patterned spacing layer with a process comprising at
least one of plasma enhanced chemical vapor deposition (PECVD),
vacuum thermal evaporation (VTE), E-beam evaporation, sputtering or
any combination thereof.
3. The method of fabricating an organic electronic device as
claimed in claim 1, wherein the material of the patterned spacing
layer includes polymers.
4. The method of fabricating an organic electronic device as
claimed in claim 1, wherein the material of the patterned spacing
layer includes organic oligomer.
5. The method of fabricating an organic electronic device as
claimed in claim 1, wherein the material of the patterned spacing
layer includes polymers mixed with microcolumns.
6. The method of fabricating an organic electronic device as
claimed in claim 1, wherein the material of the patterned spacing
layer includes organic oligomer and polymers mixed with
microcolumns.
7. The method of fabricating an organic electronic device as
claimed in claim 1, wherein the material of the patterned spacing
layer includes parylene.
8. The method of fabricating an organic electronic device as
claimed in claim 1, wherein the material of the patterned spacing
layer includes oxides.
9. The method of fabricating an organic electronic device as
claimed in claim 1, wherein the material of the patterned spacing
layer includes metal oxide derivatives.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This is a divisional application of patent application Ser.
No. 11/554,576, filed on Oct. 30, 2006, which claims the priority
benefit of Taiwan patent application serial no. 95101178, filed
Jan. 12, 2006. The entirety of each of the above-mentioned patent
applications is hereby incorporated by reference herein and made a
part of this specification.
BACKGROUND OF THE INVENTION
[0002] 1. Field of Invention
[0003] The present invention relates to a method of fabricating an
electronic device. More particularly, the present invention relates
to a method of fabricating an organic electronic device.
[0004] 2. Description of Related Art
[0005] With the improvement of semiconductor processing techniques,
many electronic devices are now fabricated on silicon substrates
with semiconductor processes. In terms of flat displays, the
required elements are fabricated on glass substrates with
semiconductor processes. However, silicon substrates and glass
substrates are both hard substrates, thus the electronic devices
produced cannot be bent. To make electronic devices lighter,
thinner, and flexible, flexible substrates such as plastic
substrates have been used in the fabrication of electronic
devices.
[0006] Besides, as for the material selection of electronic
devices, now some electronic devices can be fabricated with organic
materials, for example, organic thin film transistors (OTFTs). In
comparison with traditional inorganic transistors, OTFTs can be
fabricated at a low temperature, so lighter, thinner, and cheaper
plastic can substitute glass to function as the substrate.
Meanwhile, plastic substrates are advantageous as they are
flexible. Furthermore, the OTFT process is simple. By directly
patterning organic thin films with printing techniques, the number
of required masks and vacuum evaporation apparatus can be reduced.
In addition, the manufacturing cost can be greatly reduced because
OTFT process is suitable for plastic substrates and is highly
compatible with the roll-to-roll process.
[0007] However, in a traditional flat display employing OTFTs and
plastic substrates, the electronic elements are sealed between two
plastic substrates with a sealant at their edges. In this case,
when the flat display is flexed, electronic elements will be easily
in contact with the plastic substrates, and problems of scratching,
wear, and even damage will be occurred since a fixed space cannot
be maintained between the two plastic substrates.
SUMMARY OF THE INVENTION
[0008] Accordingly, an object of the present invention is to
provide a method of fabricating organic electronic device, which is
applicable for solving the problem that the electronic devices of
the organic electronic device employing flexible substrates will be
easily in contact with the plastic substrates and thus damaged when
the device is flexed.
[0009] The present invention provides a method of fabricating the
organic electronic device. The method comprises: providing a
flexible substrate; fabricating organic elements on the flexible
substrate; fabricating a patterned spacing layer on the flexible
substrate; and arranging a cover substrate on the patterned spacing
layer, and sealing the edges of the flexible substrate and the
cover substrate with a sealant, wherein, the patterned spacing
layer is used to maintain a space between the flexible substrate
and the cover substrate.
[0010] In one embodiment of the method of fabricating the organic
electronic device, the step for fabricating organic elements is
performed before fabricating the patterned spacing layer; and the
organic elements include OTFTs. Furthermore, the step for
fabricating the patterned spacing layer includes, for example,
covering the organic elements with the patterned spacing layer. In
addition, a plurality of Organic Electro Luminescent Devices
(OLEDs) can further be fabricated on the flexible substrate in an
area without covered by the patterned spacing layer after the
patterned spacing layer is fabricated and before the cover
substrate is arranged.
[0011] In one embodiment of the method of fabricating the organic
electronic device, the step for fabricating the organic elements is
performed after the patterned spacing layer is fabricated. The
organic elements are formed on the flexible substrate in an area
without covered by the patterned spacing layer, and the organic
elements include OLEDs.
[0012] In one embodiment of the method of fabricating the organic
electronic device, the method of fabricating the patterned spacing
layer includes: coating a spacing material layer on the flexible
substrate; and patterning the spacing material layer to form the
patterned spacing layer. Furthermore, the spacing material layer
can be pre-baked after coating the spacing material layer and
before patterning the spacing material layer. In addition, the
method of coating the spacing material layer is, for example, a
spin coating. Moreover, the spacing material layer can be
photosensitive, and the method of patterning the spacing material
layer includes photolithography and etching. In addition, the
material of the patterned spacing layer can be a polymer, for
example, a photo-patterned polymer, a polymer mixed with
microcolumns, or a combination thereof, and the material of the
patterned spacing layer can also be, for example, dichromated
polyvinyl alcohol (DCPVA), polyvinyl pyrrolidone (PVP), polyimide
(PI), or a combination thereof.
[0013] In one embodiment of the method of fabricating the organic
electronic device, the method of fabricating the patterned spacing
layer includes depositing the patterned spacing layer on the
flexible substrate by using a spacing material deposition source
and a mask. Furthermore, the patterned spacing layer can be
deposited by the spacing material deposition source with a method
comprising at least one of Plasma Enhanced Chemical Vapor
Deposition (PECVD), Vacuum Thermal Evaporation (VTE), E-beam
Evaporation, sputtering or any combination thereof. In addition,
the material of the patterned spacing layer can be a polymer, for
example, an organic oligomer, a polymer mixed with microcolumns, or
a combination thereof, or, for example, parylene. Moreover, the
material of the patterned spacing layer can be an oxide, for
example, a metal oxide derivative.
[0014] In one embodiment of the method of fabricating the organic
electronic device, the method of fabricating the patterned spacing
layer includes: depositing a spacing material layer on the flexible
substrate; and patterning the spacing material layer to form the
patterned spacing layer. Furthermore, the method of depositing the
spacing material layer may comprise at least one of PECVD, VTE,
E-beam Evaporation, sputtering or any combination thereof. In
addition, the method of patterning the spacing material layer is,
for example, performing photo cracking or thermal cracking on the
spacing material layer with a laser to perform the patterning
process directly. Moreover, the material of the patterned spacing
layer is, for example, a polymer, or a polymer mixed with
microcolumns, or, for example, parylene.
[0015] To sum up, in the method of fabricating the organic
electronic device of the present invention, the space between the
flexible substrate and the cover substrate is maintained by the
patterned spacing layer so as to prevent the electronic elements in
the organic electronic device from being damaged when the device is
flexed. Furthermore, the patterned spacing layer can selectively
cover and protect the organic elements, which functions as a
protective layer. In addition, the present invention also has the
advantages that the patterned spacing layer can be localized with
high precision, and that the present invention is compatible with
the roll-to-roll process and the batch type process.
[0016] In order to make the above and other objects, features and
advantages of the present invention more comprehensible, preferred
embodiments accompanied with drawings are described in detail
below.
[0017] It is to be understood that both the foregoing general
description and the following detailed description are exemplary,
and are intended to provide further explanation of the invention as
claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The accompanying drawings are included to provide a further
understanding of the invention, and are incorporated in and
constitute a part of this specification. The drawings illustrate
embodiments of the invention and, together with the description,
serve to explain the principles of the invention.
[0019] FIGS. 1A-1F are sectional views of the flow of the method of
fabricating the organic electronic device according to the first
embodiment of the present invention.
[0020] FIGS. 2A-2D are sectional views of the flow of the method of
fabricating the organic electronic device according to the second
embodiment of the present invention.
[0021] FIGS. 3A-3F are sectional views of the flow of the method of
fabricating the organic electronic device according to the third
embodiment of the present invention.
DESCRIPTION OF EMBODIMENTS
[0022] The method of fabricating the organic electronic device of
the present invention relates to fabricating a plurality of organic
elements and a patterned spacing layer on a flexible substrate, and
sealing a cover substrate and the flexible substrate with a
sealant. The patterned spacing layer is used to maintain a space
between the flexible substrate and the cover substrate. By using
the patterned spacing layer capable of being localized with high
precision, when the organic electronic device is flexed, the
organic elements of the flexible substrate will be not in contact
with the cover substrate and can be prevented from being damaged.
Three embodiments capable of achieving the object will be described
below.
Embodiment 1
[0023] FIGS. 1A-1F are sectional views of the flow of the method of
fabricating the organic electronic device according to the first
embodiment of the present invention. Referring to FIG. 1A, the
method of fabricating the electronic device of the embodiment
comprises providing a flexible substrate 110 first. The flexible
substrate 110 may be a plastic substrate, a metal sheet, a
macromolecular substrate, an organic-inorganic mixing substrate, or
a glass substrate with a thickness of less than 1 mm. A plurality
of electronic elements 112 can be selectively formed on the
flexible substrate 110. The electronic elements 112 are, for
example, thin film transistors or other circuits. In particular,
the electronic elements 112 may be organic or inorganic thin film
transistors.
[0024] Referring to FIG. 1B, a spacing material layer 120a is
coated on the flexible substrate 110, wherein the method of coating
spacing material layer 120a is, for example, dissolving a polymer
or a polymer mixed with microcolumns into an appropriate solvent,
and coating the solution on the flexible substrate 110 in the
manner of spin coating or in other manners. Furthermore, after
coating the spacing material layer 120a on the flexible substrate
110, the spacing material layer 120a can be optionally pre-baked to
slightly cure the layer. The time for pre-baking is, for example, 1
hour. In addition, the spacing material layer 120a is, for example,
photosensitive.
[0025] Referring to FIGS. 1C and 1D, photolithography and etching
are performed on the spacing material layer 120a. For example, in
particular, a mask 50 is provided between an exposure light source
30 and the spacing material layer 120a so as to partially expose
the spacing material layer 120a, and then the spacing material
layer 120a is developed. The exposure light source 30 is, for
example, the ultraviolet rays, and the method for development is,
for example, removing the unexposed part of the spacing material
layer 120a in the water with a temperature of 50.degree. C. With
this, the fabrication of the patterned spacing layer 120 is
completed. The patterned spacing layer 120 may cover or may not
cover the electronic elements 112, and in this embodiment the
electronic elements 112 are covered. When the patterned spacing
layer 120 covers the electronic elements 112, the patterned spacing
layer 120 also functions as a protective layer to protect the
electronic elements 112 from being damaged by water, oxygen, and
contaminants in the environment. The material of the patterned
spacing layer 120 can be one of various types of polymers including
photo-patterned polymers, organic polymers, inorganic polymers,
macromolecular polymers, micromolecular polymers, resins, or a
combination thereof. In particular, the material of the patterned
spacing layer 120 is, for example, DCPVA, PVP, PI, or a combination
thereof.
[0026] Referring to FIG. 1E, a plurality of electronic elements 130
is selectively fabricated on the flexible substrate 110 in an area
without covered by the patterned spacing layer 120. In this
embodiment, the electronic elements 130 are OLEDs. It should be
noted that in the method of fabricating the organic electronic
device of this embodiment, it is within the scope of the present
invention as long as one of electronic elements 112 and 130 are
organic electronic elements, and in the method of fabricating the
organic electronic device, it is allowed to only fabricate
electronic elements 112 or only fabricate electronic elements
130.
[0027] Referring to FIG. 1F, a cover substrate 140 is arranged on
the patterned spacing layer 120, i.e. the cover substrate 140 is in
contact with the patterned spacing layer 120, and the patterned
spacing layer 120 is used to maintain a space between the flexible
substrate 110 and the cover substrate 140. Meanwhile, a sealant 150
is arranged at the edges of the flexible substrate 110 and the
cover substrate 140 so as to seal the flexible substrate 110 and
the cover substrate 140 with the sealant 150.
Embodiment 2
[0028] FIGS. 2A-2D are sectional views of the flow of the method of
fabricating the organic electronic device according to the second
embodiment of the present invention. Only features different from
that of the Embodiment 1 will be described below; the same features
will be omitted. Referring to FIG. 2A, the method of fabricating
the electronic device of the embodiment comprises providing a
flexible substrate 210 first. A plurality of electronic elements
212 can be selectively formed on the flexible substrate 210.
[0029] Referring to FIG. 2B, a patterned spacing layer 220 is
deposited on the flexible substrate 210 with using a spacing
material deposition source 70 and a mask 80. When the patterned
spacing layer 220 is deposited, the mask 80 is arranged between the
flexible substrate 210 and the spacing material deposition source
70, so that the spacing material can be deposited on the flexible
substrate 210 through the hollowed-out part of the mask 80.
Furthermore, the method of depositing the patterned spacing layer
220 may comprise at least one of PECVD, VTE, E-beam Evaporation,
sputtering, another appropriate method or any combination thereof.
Specifically, VTE and E-beam Evaporation may be used together. The
patterned spacing layer 220 may cover or may not cover electronic
elements 212. The patterned spacing layer 220 can function as a
protective layer when it covers the electronic elements 212. The
material of the patterned spacing layer 220 may be one of various
types of polymers including organic polymers, inorganic polymers,
macromolecular polymers, micromolecular polymers, organic oligomer,
resins, polymers mixed with microcolumns, or a combination thereof.
In particular, the material of the patterned spacing layer 220 is,
for example, parylene. Moreover, the material of the patterned
spacing layer 220 may be an oxide, for example, a metal oxide
derivative.
[0030] Referring to FIG. 2C, a plurality of electronic elements 230
is selectively fabricated on the flexible substrate 210 in an area
without covered by the patterned spacing layer 220.
[0031] Referring to FIG. 2D, a cover substrate 240 is arranged on
the patterned spacing layer 220, i.e. the cover substrate 240 is in
contact with the patterned spacing layer 220, and the patterned
spacing layer 220 is used to maintain a space between the flexible
substrate 210 and the cover substrate 240. Meanwhile, a sealant 250
is arranged at the edges of the flexible substrate 210 and the
cover substrate 240 so as to seal the flexible substrate 210 and
the cover substrate 240 with the sealant 250.
Embodiment 3
[0032] FIGS. 3A-3F are sectional views of the flow of the method of
fabricating the organic electronic device according to the third
embodiment of the present invention. Only features different from
that of the Embodiment 2 will be described below; the same features
will be omitted. Referring to FIG. 3A, the method of fabricating
the electronic device of the embodiment comprises providing a
flexible substrate 310 first. A plurality of electronic elements
312 can be selectively formed on the flexible substrate 310.
[0033] Referring to FIG. 3B, a spacing material layer 320a is
coated on the flexible substrate 310. Furthermore, the method of
depositing the spacing material layer 320a may comprise at least
one of PECVD, VTE, E-beam Evaporation, sputtering, another
appropriate method or any combination thereof. Specifically, VTE
and E-beam Evaporation may be used together.
[0034] Referring to FIGS. 3C and 3D, the spacing material layer
320a is patterned by performing photo cracking or thermal cracking
with, for example, laser 90 so as to form a patterned spacing layer
320. The material selection of the patterned spacing layer 320 is
the same as that of the patterned spacing layer 220 of Embodiment
2.
[0035] Referring to FIG. 3E, a plurality of electronic elements 330
is selectively fabricated on the flexible substrate 310 in an area
without covered by the patterned spacing layer 320.
[0036] Referring to FIG. 3F, a cover substrate 340 is arranged on
the patterned spacing layer 320, i.e. the cover substrate 340 is in
contact with the patterned spacing layer 320, and the patterned
spacing layer 320 is used to maintain a space between the flexible
substrate 310 and the cover substrate 340. Meanwhile, a sealant 350
is arranged at the edges of the flexible substrate 310 and the
cover substrate 340 so as to seal the flexible substrate 310 and
the cover substrate 340 with the sealant 350.
[0037] To sum up, in the method of fabricating the organic
electronic device of the present invention, a patterned spacing
layer is fabricated between a flexible substrate and a cover
substrate to maintain a space, and further to prevent the
electronic elements from being worn, scratched, and even damaged by
the cover substrate since the electronic elements will not be in
contact with the cover substrate when the organic electronic device
is flexed. Furthermore, the patterned spacing layer can selectively
cover the organic elements to protect the organic elements from
being damaged by water, oxygen, contaminants, etc. in the
environment. In addition, the present invention also has the
advantage that the patterned spacing layer can be localized with
high precision. Meanwhile, the process of the present invention is
compatible with the roll-to-roll process and the batch type
process, therefore, mass production can be achieved, and the
fabricating cost can be reduced as well.
[0038] It will be apparent to those skilled in the art that various
modifications and variations can be made to the structure of the
present invention without departing from the scope or spirit of the
invention. In view of the foregoing, it is intended that the
present invention cover modifications and variations of this
invention provided they fall within the scope of the following
claims and their equivalents.
* * * * *