U.S. patent application number 12/228053 was filed with the patent office on 2009-02-19 for method and apparatus for providing supplemental cooling to server racks.
Invention is credited to Richard Grant Brewer, Hae-won Choi, James Hom, Tien Chih (Eric) Lin, Douglas E. Werner.
Application Number | 20090046430 12/228053 |
Document ID | / |
Family ID | 40341613 |
Filed Date | 2009-02-19 |
United States Patent
Application |
20090046430 |
Kind Code |
A1 |
Brewer; Richard Grant ; et
al. |
February 19, 2009 |
Method and apparatus for providing supplemental cooling to server
racks
Abstract
A cooling system includes a re-configurable duct work assembly
for a server rack or other electronics enclosure. Heat generating
devices are positioned within the electronics enclosure and heat
exchangers are coupled to the heat generating devices via the duct
work. The duct work is positioned within a plenum between the back
of the electronics servers and the heat exchangers. The interior of
the electronics enclosure is conceptually segmented into heat
zones. The duct work is used to selectively direct heated air to
the heat exchangers. In some embodiments, the heated air output
from a single heat zone is directed by the duct work to a
corresponding single heat exchanger. In other embodiments, the
heated air output from a group of adjacent heat zones is combined
within a single duct work guide that directs the combined heated
air to a corresponding number of adjacent heat exchangers.
Inventors: |
Brewer; Richard Grant;
(Foster City, CA) ; Choi; Hae-won; (Albany,
CA) ; Hom; James; (Redwood City, CA) ; Lin;
Tien Chih (Eric); (Fremont, CA) ; Werner; Douglas
E.; (Santa Clara, CA) |
Correspondence
Address: |
HAVERSTOCK & OWENS LLP
162 N WOLFE ROAD
SUNNYVALE
CA
94086
US
|
Family ID: |
40341613 |
Appl. No.: |
12/228053 |
Filed: |
August 7, 2008 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
60964025 |
Aug 7, 2007 |
|
|
|
Current U.S.
Class: |
361/701 |
Current CPC
Class: |
H05K 7/20736
20130101 |
Class at
Publication: |
361/701 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Claims
1. A cooling assembly comprising: a. an electronics enclosure
including a first side having a first air vent and a second side
having a second air vent, wherein the electronics enclosure
includes one or more heat generating devices each generating a
thermal load, further wherein an interior of the electronics
enclosure is conceptually partitioned into heat zones, each heat
zone having a determinant thermal load; b. a cooling panel coupled
to the second side of the electronics enclosure, wherein the
cooling panel includes one or more of heat exchangers; and c. a
plurality of duct guides coupled between the one or more heat
generating devices and the cooling panel, wherein the plurality of
duct guides are configured to selectively direct heated air output
from the one or more heat generating devices to the cooling
panel.
2. The cooling assembly of claim 1 further comprising a duct work
assembly coupled between the second side of the electronics
enclosure and the cooling panel, wherein plurality of duct guides
are positioned within the duct work assembly.
3. The cooling assembly of claim 1 wherein the electronics
enclosure further comprises a duct work assembly coupled between
the one or more heating devices and the cooling panel, wherein
plurality of duct guides are positioned within the duct work
assembly.
4. The cooling assembly of claim 1 wherein a position of each of
the plurality of duct guides is adjustable.
5. The cooling assembly of claim 1 wherein a volume of each heat
zone is dependent upon the thermal load distribution within the
electronics enclosure.
6. The cooling assembly of claim 1 wherein each heat generating
device includes one or more air moving devices.
7. The cooling assembly of claim 1 wherein an adjacent number of
the heat generating devices are organized by group, and each group
of heat generating devices include one or more air moving
devices.
8. The cooling assembly of claim 1 wherein the electronics
enclosure is conceptually partitioned into N heat zones, and the
cooling panel includes M heat exchangers, further wherein the
plurality of duct guides are configured to direct heated air from
one or more adjacent heat zones to one or more adjacent heat
exchangers.
9. The cooling assembly of claim 8 wherein each heat zone has an
equivalent thermal load.
10. The cooling assembly of claim 8 wherein each heat zone has an
independently determined thermal load.
11. The cooling assembly of claim 1 wherein the electronics
enclosure is conceptually partitioned into N heat zones, each heat
zone having an equivalent thermal load, and there are N heat
exchangers, further wherein the plurality of duct guides are
configured to direct heated air from one or more adjacent heat
zones to a corresponding one or more adjacent heat exchangers
12. The cooling assembly of claim 1 wherein one or more of the
plurality of duct guides are positioned to direct heated air to a
portion of one or more of the heat exchangers.
13. The cooling assembly of claim 1 further comprising one or more
supplemental duct guides positioned within an air flow pathway
between one or more heat zones and one or more heat exchangers.
14. The cooling assembly of claim 1 further comprising one or more
air dams positioned within an air flow pathway between one or more
heat zones and one or more heat exchangers, wherein each air dam is
configured to reduce air flow.
15. The cooling assembly of claim 14 wherein each air dam is
configured as a porous structure, a non-porous structure, or an
adjustable structure configured to be adjusted be a non-porous
structure and a porous structure with varying degrees of
porosity.
16. The cooling assembly of claim 1 wherein the second side of the
electronics enclosure includes a plurality of duct guide mounts
configured to hold each duct guide in position.
17. The cooling assembly of claim 1 wherein the cooling panel
includes a plurality of duct guide mounts configured to hold each
duct guide in position.
18. The cooling assembly of claim 1 wherein side panels of a duct
work assembly housing include a plurality of duct guide mounts
configured to hold each duct guide in position.
19. The cooling assembly of claim 1 wherein at least one of the
plurality of adjustable duct guides is rigid.
20. The cooling assembly of claim 1 wherein at least one of the
plurality of adjustable duct guides is compressible.
21. The cooling assembly of claim 20 wherein the duct guide in an
uncompressed state is wider than the electronics enclosure such
that when the duct guide is in a compressed state and positioned
within the electronics enclosure, an outward decompression force is
exerted on the electronics enclosure thereby holding the compressed
duct guide in place.
22. The cooling assembly of claim 1 wherein at least one of the
plurality of adjustable duct guides is deformable.
23. A cooling assembly comprising: a. an electronics enclosure
including a first side having a first air vent and a second side
having a second air vent, wherein the electronics enclosure
includes one or more heat generating devices each generating a
thermal load, further wherein an interior of the electronics
enclosure is conceptually partitioned into heat zones, each heat
zone having a determinant thermal load; b. a cooling panel
including one or more heat exchangers; and c. a plurality of duct
guides configured to direct heated air output from the one or more
heat generating devices to the cooling panel such that heated air
from one or more adjacent heat zones is directed to one or more
adjacent heat exchangers.
24. A cooling assembly comprising: a. a cooling panel including a
plurality of heat exchangers, each heat exchanger is independently
configured to cool a specific thermal load; b. an electronics
enclosure including a first side having a first air vent and a
second side having a second air vent, wherein the electronics
enclosure includes one or more heat generating devices each
generating a thermal load, further wherein an interior of the
electronics enclosure is conceptually partitioned into heat zones,
each heat zone having a determinant thermal load; and c. a
plurality of duct guides configured to direct heated air output
from the one or more heat generating devices to the cooling panel
such that heated air from one or more adjacent heat zones is
directed to one or more heat exchangers.
Description
RELATED APPLICATIONS
[0001] This application claims priority of U.S. provisional
application, Ser. No. 60/964,025, filed Aug. 7, 2007, and entitled
"Method and Apparatus for Providing Supplemental Cooling to Server
Racks", by these same inventors. This application incorporates U.S.
provisional application, Ser. No. 60/964,025 in its entirety by
reference.
FIELD OF THE INVENTION
[0002] The invention relates to a method of and apparatus for
cooling a heat generating device in general, and specifically, to a
method of and apparatus for cooling server applications using duct
work and fluid-based cooling systems.
BACKGROUND OF THE INVENTION
[0003] Cooling of high performance integrated circuits with high
heat dissipation is presenting significant challenge in the
electronics cooling arena. Conventional cooling with heat pipes and
fan mounted heat sinks are not adequate for cooling chips with
every increasing wattage requirements, including those exceeding
100 W.
[0004] Electronics servers, such as blade servers and rack servers,
are being used in increasing numbers due to the higher processor
performance per unit volume one can achieve. However, the high
density of integrated circuits also leads to high thermal density,
which is beyond the capability of conventional air-cooling
methods.
[0005] A particular problem with cooling integrated circuits on
electronics servers is that multiple electronics servers are
typically mounted in close quarters within a server chassis. In
such configurations, electronics servers are separated by a limited
amount of space, thereby reducing the dimensions within which to
provide an adequate cooling solution. Typically, stacking of
electronics servers does not provide the mounting of large fans and
heat sinks for each electronics server. Often each server within an
electronics enclosure is cooled by a dedicated internal fan. For
blade server applications, groups of blade servers are cooled by
one or more internal fans dedicated to each group of blade servers.
Using such configurations, the integrated circuits on each
electronics server are cooled using fans that blow air over the
integrated circuits on the electronics servers. However,
considering the limitations of the internal fans within the server
rack, the amount of air available for cooling the integrated
circuits is limited.
[0006] Supplemental cooling is provided by Computer Room Air
Conditioning (CRAC) units external to the electronics enclosure.
Cooled air is vented through the electronics enclosure, entering
from one side of the chassis and exiting an opposite side. As data
centers continue to increase their computer density, electronics
servers are being deployed more frequently. Fully populated
electronics servers significantly increase rack heat production.
This requires supplemental cooling beyond what the CRAC units can
provide. Supplemental cooling systems may include fans, pump, and
heat exchangers located outside the back end of the electronics
server to decrease the air temperature exiting the electronics
server. The heat exchangers in these supplemental cooling systems
are supplied with pumped coolants, water, or refrigerants. Some
supplemental cooling systems are configured as a "cooling door"
that is attached to the back of an electronics enclosure. However,
for some electronics enclosure there is typically uneven heat load
throughout the electronics enclosure, which often leads to
inadequate cooling of certain areas within the electronics
enclosure, even when conventional supplemental cooling systems are
used.
SUMMARY OF THE INVENTION
[0007] Cooling systems of the present invention are directed to a
re-configurable duct work assembly for a server rack or other
electronics enclosure. In some embodiments, a front door, a rear
door, or both the front and rear doors of the electronics enclosure
are configured as cooling doors including one or more heat
exchangers. In other embodiments, the front door and/or the rear
door of the electronics enclosure is replaced by a plurality of
movable segments that enable access to the interior of the
electronics enclosure. Each segment includes one or more heat
exchangers.
[0008] A plurality of heat generating devices, such as electronics
servers, are positioned within the electronics enclosure. The heat
exchangers are coupled to the electronics servers via the duct
work. The duct work is positioned within a plenum between the back
of the electronics servers and the heat exchangers. In most
applications, a heat load within the electronics enclosure is not
evenly distributed. Typically, each electronics server, or groups
of adjacent electronics servers within the electronics enclosure,
generate a different heat load than other electronics servers, or
groups of adjacent electronics servers. As such, the heat load per
unit volume is not constant within the electronics enclosure. The
interior of the electronics enclosure is conceptually segmented
into heat zones. In some embodiments, each heat zone has an equal
thermal output, and the duct work is used to direct an equal amount
of heated air to each of the heat exchangers, or in the case of a
single heat exchanger, to evenly distribute heated air across the
heat exchanger. In some embodiments, the heated air output from a
single heat zone is directed by the duct work to a corresponding
single heat exchanger. In other embodiments, the heated air output
from a group of adjacent heat zones is combined within a single
duct work guide that directs the combined heated air to a
corresponding number of adjacent heat exchangers.
[0009] The rear door including the one or more heat exchangers is
configured to provide access to the cables and equipment located
within the electronics enclosure. Such access can be provided by
swinging the door open on hinges like a standard door. In the case
where there are multiple heat exchangers, the door can be
configured into segments, one segment per heat exchanger, and each
segment includes hinges so as to be opened independently from the
other segments. Such a configuration reduces the cooling disruption
to the other electronics servers within the electronics enclosure.
In some embodiments, each segment swivels open like a standard
door. In other embodiments, each segment is configured to swivel up
or down. In still other embodiments, each segment is configured to
be disconnected from the electronics enclosure and moved out of the
way, in which case each heat exchanger is connected using either
flexible tubing that can be bent out of the way or quick
disconnects. In other embodiments, the entire rear door, or each
segment of the rear door, can be configured to slide open and
closed like a drawer.
[0010] In some embodiments, individual duct guides are configured
with a deformable end that is configured to locally deform around
the electrical connection lines extending from the rear of one or
more electronics servers. The deformable end can be made of
bristles, as in a brush, or foam that includes slits and/or
holes.
[0011] Other features and advantages of the present invention will
become apparent after reviewing the detailed description of the
embodiments set forth below.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 illustrates a cut out side view of an electronics
enclosure coupled to a duct work assembly according to an
embodiment of the present invention.
[0013] FIG. 2A illustrates a cut out side view of the electronics
enclosure coupled to a duct work assembly according to another
embodiment of the present invention.
[0014] FIG. 2B illustrates a cut out side view of the electronics
enclosure coupled to a duct work assembly according to yet another
embodiment of the present invention.
[0015] FIG. 3 illustrates a front view of the cooling panel of FIG.
1.
[0016] FIG. 4 illustrates an isometric view of an electronics
enclosure with a first embodiment of an access mechanism in a
closed position.
[0017] FIG. 5A illustrates an isometric view of the electronics
enclosure with the access mechanism in an open position.
[0018] FIG. 5B illustrates an isometric view of the electronics
enclosure with the sliding access mechanism according to another
embodiment.
[0019] FIG. 6 illustrates an isometric view of an electronics
enclosure with a second embodiment of an access mechanism.
[0020] FIG. 7 illustrates an isometric view of an electronics
enclosure with a third embodiment of an access mechanism.
[0021] FIG. 8 illustrates a cut out side view of a supplemental
cooling assembly coupled to an electronics enclosure.
[0022] FIG. 9 illustrates an isometric view of an electronics
enclosure with a fourth embodiment of an access mechanism.
[0023] FIG. 10 illustrates an exemplary duct guide comprising
bristles.
[0024] FIG. 11 illustrates an exemplary duct guide comprising
bristles coupled to a rigid structure, where the bristles form a
majority of the duct guide.
[0025] FIG. 12 an exemplary duct guide comprising bristles coupled
to a rigid structure, where the bristles form a minority of the
duct guide.
[0026] FIG. 13 illustrates an exemplary duct guide comprising foam
having slits.
[0027] FIG. 14 illustrates an exemplary duct guide comprising foam
having holes.
[0028] The present invention is described relative to the several
views of the drawings. Where appropriate and only where identical
elements are disclosed and shown in more than one drawing, the same
reference numeral will be used to represent such identical
elements.
DETAILED DESCRIPTION OF THE PRESENT INVENTION
[0029] Reference will now be made in detail to the embodiments of
the cooling system of the invention, examples of which are
illustrated in the accompanying drawings. While the invention will
be described in conjunction with the embodiments below, it will be
understood that they are not intended to limit the invention to
these embodiments and examples. On the contrary, the invention is
intended to cover alternatives, modifications and equivalents,
which may be included within the spirit and scope of the invention
as defined by the appended claims. Furthermore, in the following
detailed description of the present invention, numerous specific
details are set forth in order to more fully illustrate the present
invention. However, it will be apparent to one of ordinary skill in
the prior art that the present invention may be practiced without
these specific details. In other instances, well-known methods and
procedures, components and processes haven not been described in
detail so as not to unnecessarily obscure aspects of the present
invention.
[0030] Embodiments of the present invention are directed to a
cooling system that transfers heat generated by one or more
electronics servers within an electronics enclosure or server rack,
collectively referred to herein as an electronics enclosure. The
cooling system described herein can be applied to any electronics
system or sub-system that is mounted to a rack, including but not
limited to, a blade server, a rack server, and a storage server,
herein referred to collectively as an electronics server. An
electronics enclosure is configured to house multiple electronics
servers. Each electronics server includes one or more heat
generating devices as is well known in the art.
[0031] The cooling system utilizes the air flow generated by the
internal fans included as part of the electronics servers. The
interior of the electronics enclosure is conceptually partitioned
into heat zones. In some embodiments, the thermal load in each heat
zone is equal. Due to the unique heat generating qualities of each
of the electronics servers within the electronics enclosure, the
heat zones may or may not be of equal size by volume. For example,
a first heat zone with a first volume may have a larger volume than
a second heat zone with a second volume. A duct work assembly is
coupled to an air out flow side of the electronics servers. Duct
guides are positioned within a plenum between the back of the
electronic servers and the heat exchangers. The duct work assembly
includes a plurality of duct guides positioned to selectively guide
the output air flow from the electronics servers to one or more
heat exchangers. In some embodiments, the air flow output from one
heat zone is directed by the duct guides to a single heat
exchanger. In other embodiments, the air flow output from multiple
adjacent heat zones, such as N heat zones, is combined into common
duct work and collectively directed to a corresponding number of
adjacent heat exchangers, such as N heat exchangers. In still other
embodiments, there is not a one-to-one relationship between the
number of heat zones and the number of heat exchangers. In general,
the interior of the electronics enclosure is conceptually
partitioned into M heat zones, and the cooling panel includes N
heat exchangers. The duct guides are adjustably positioned to
selectively direct heated air from one or more heat zones to one or
more heat exchangers. In some cases, duct guides are positioned to
direct air to portions of one or more heat exchangers, essentially
segmenting the heat exchangers and directing different air flows to
different segments of the same heat exchangers.
[0032] In general, the duct work assembly directs heated air from
conceptualized heat zones within the electronics enclosure to heat
exchangers. As opposed to uniformly directing heated air, which has
a non-uniform thermal load distribution, to one or more heat
exchangers, the duct work assembly provides more cooling to areas
of higher thermal load by directing the heated air output from the
higher thermal load areas to greater relative cross-sectional areas
of the heat exchangers. In other words, the cooling capacity of the
heat exchanges is more targeted to cooling the hotter areas within
the electronics enclosure.
[0033] FIG. 1 illustrates a cut out side view of an electronics
enclosure 10 coupled to a duct work assembly 30 according to an
embodiment of the present invention. The electronics enclosure 10
includes a plurality of heat generating devices (not shown), such
as electronics servers. The electronics enclosure 10 is configured
to enable airflow from a first side 14 to a second side 12. The
first side 14 and the second side 12 are configured with air vents
to enable air flow. The air vents can be gratings, mesh, vertical
slats, horizontal slats, or any other type of opening in the
electronics enclosure siding to allow air flow. Such openings can
refer to multiple openings within a side panel structure, or an
opening can be an open space framed by the ends of the side, top,
and bottom panels of the electronics enclosure 10. In general, the
term "air vent" refers to one or more openings in a side panel
structure or to an open space where a side panel structure is not
present. Air flows from the first side 14 of the electronics
enclosure 10 to the second side 12. The air flow through the
electronics enclosure 10 is generated by an internal air moving
system (not shown) positioned within the electronics enclosure 10,
for example an internal fan, and/or within each of the electronics
servers or group of electronics servers. Air is drawn into the
electronics enclosure 10 through the first side 14. The air flows
over the heat generating devices within the electronics enclosure
10, thereby heating the air. The heated air flows out the second
side 12 of the electronics enclosure 10 and into the duct work
assembly 30.
[0034] A first end of the duct work assembly 30 is coupled to the
second side 12 of the electronics enclosure 10, and a second end of
the duct work assembly 30 is coupled to a cooling panel 20. The
cooling panel 20 includes one or more heat exchangers. In the
exemplary configuration of FIG. 1, there are N heat exchangers,
indicated as heat exchanger 1, heat exchanger 2, . . . , heat
exchanger N. In some embodiments, the cooling panel 20 is a cooling
door.
[0035] FIG. 3 illustrates a front view of the cooling panel 20 of
FIG. 1. The cooling panel 20 in FIG. 3 includes the N heat
exchangers 1, 2, . . . , N. Each heat exchanger 1, 2, . . . , N has
a coolant flowing therethrough. As the heated air flows through the
heat exchangers 1, 2, . . . , N in the cooling panel 20, heat is
transferred from the air to the coolant flowing through the heat
exchangers 1, 2, . . . , N, thereby cooling the air exiting the
cooling panel 20. In some embodiments, the cooling panel 20 is
coupled to an external cooling system (not shown) that supplies
coolant to and returns heated coolant from the cooling panel 20.
The external cooling system can include a cooling tower, a chiller,
or other secondary cooling loop including a heat exchanger used to
cool the coolant exiting the cooling panel 20. Water, refrigerant,
or any other coolant is used. In some embodiments, the coolant is a
two-phase coolant. In other embodiments, the coolant is a
single-phase coolant.
[0036] In some embodiments, the heat exchangers are made of a
micro-tube construction with attached air fins or of a tube-fin
type of design. In other embodiments, the heat exchangers are any
conventional heat exchangers that use air flow for transferring
heat. The cooling panel 20 can include a single large heat
exchanger or a group of heat exchangers attached in parallel or
series. Separate heat exchangers are more manageable to construct
and provide better control of fluid distribution. The heat
exchangers 1, 2, . . . , N are shown in FIGS. 1 and 3 as panels
stacked one on top of another. It is understood that such a
configuration is for exemplary purposes only and that each heat
exchanger can be configured in a different shape than the panel
configuration shown in FIG. 3, and can be positioned in different
patterns than the stacked pattern shown in FIGS. 1 and 3.
[0037] Referring again to FIG. 1, the interior of the electronics
enclosure 10 is conceptually partitioned into heat zones. The
electronics enclosure 10 as a whole generates a total thermal load
output Q. However, due to the unique configuration and use of each
individual electronics server stored in the electronics enclosure
10, the thermal load throughout the interior of the electronics
enclosure 10 is not homogeneous. In some embodiments, each heat
exchanger 1, 2, . . . , N is configured to cool a same thermal
load. In this case, each heat exchanger cools a fractional
equivalent of 1/N of the total thermal load Q output from the
electronics enclosure 10. To enable this performance, a same amount
of thermal load, via heated air output from the second side 12 of
the electronics enclosure 10, is directed to each of the heat
exchangers 1, 2, . . . , N. To partition the total thermal load Q
output from the second side 12 into equivalent amounts to be
directed to each heat exchanger 1, 2, . . . , N, the interior of
the electronics enclosure 10 is conceptually partitioned into heat
zones, where each heat zone defines a specific volume within the
electronics enclosure 10. In this exemplary case, each heat zone is
conceptually partitioned to have an equivalent thermal load. As
such, the heated air output from one heat zone has the same thermal
load as the heated air output from another heat zone, however the
volume of each heat zone may be different. The heated air from each
heat zone is directed to a corresponding one of the heat exchangers
1, 2, . . . , N, via duct guides within the duct work assembly
30.
[0038] As the size of the heat zones is not uniform, the positions
of the duct guides within the duct work assembly 30 are also
non-uniform, as the position of each duct guide is individually
determined according to the size and location of the corresponding
heat zone and the heat exchanger to which the heated air is to be
directed. In the exemplary configuration of FIG. 1, heat zone 1 has
a larger volume than both the heat zone 2 and the heat zone N, and
the heat zone N has a larger volume than the heat zone 2. As such,
the thermal load per unit volume is greater in heat zone 2 than in
both the heat zone 1 and the heat zone N, and the thermal load per
unit volume is greater in the heat zone N than in the heat zone
1.
[0039] A duct guide 32 is positioned to direct heated air output
from the heat zone 1 to the heat exchanger 1. The duct guide 32 is
also used along with a duct guide 34 to direct heated air output
from the heat zone 2 to the heat exchanger 2, as the heat zone 2 is
adjacent to the heat zone 1. Similarly, the duct guide 34 is used
along with another duct guide (not shown) to direct air from a heat
zone 3 (not shown) to a heat exchanger 3 (not shown), as the heat
zone 3 is adjacent to the heat zone 2. A duct guide 38 is
positioned to direct heated air output from the heat zone N to the
heat exchanger N. In some embodiments, each of the duct guides 32,
34, 38 are substantially planer elements that span the distance
between the two side panels of the duct assembly 30 and also span
the distance between the electronics enclosure 10 and the cooling
panel 20. Alternatively, the duct guides can be curved. In some
embodiments, each of the duct guides span the distance between the
cooling panel 20 and the rear of the electronics servers within the
electronics enclosure 10.
[0040] In some embodiments, each heat exchanger 1, 2, . . . , N is
configured to cool the same thermal load Q/N. If the thermal load
within the electronics enclosure 10 were evenly distributed, each
conceptual heat zone 1, 2, . . . , N would be the same size, a
cross-section of each would be the same area as a cross-section of
each heat exchanger 1, 2, . . . , N. In this even distribution
configuration, each heat zone is referred to a baseline heat zone.
In comparison to the heat zones shown in FIG. 1, the heat zone 1 is
larger than the baseline heat zone. The duct work associated with a
heat zone that is larger than the baseline heat zone, such as the
heat zone 1, funnels the heated air output from the larger heat
zone to a relatively smaller cross-sectional area at the heat
exchanger. In this case, the air flow rate of the heated air is
increased as it moves toward the heat exchanger. In contrast, each
of the heat zone 2 and the heat zone N are smaller than the
baseline heat zone. The duct work associated with a heat zone that
is smaller than the baseline heat zone, such as the heat zones 2
and N, direct the heated air output from the smaller heat zones to
a relatively larger cross-sectional area at the heat exchanger. In
this case, the air flow rate of the heated air is decreased as it
moves toward the heat exchanger.
[0041] Additional duct work elements, such as duct guides,
channels, and/or air dams, can be added within the duct guide
assembly. The additional duct work elements can be used, for
example, to regulate air flow and to make air flow homogeneous
through one or more corresponding heat exchangers. For example, an
air dam 39 is positioned between the duct guides 32 and 34 to
reduce the rate of air flow from the heat zone 2 to the heat
exchanger 2. In some embodiments, an air dam is configured as a
solid, non-porous structure where air is completely blocked and
forced to flow around the air dam structure. In other embodiments,
an air diam is configured as a porous structure that enables
partial air flow through the air dam structure. The porous nature
of the air dam structure provides some degree of air flow blockage,
thereby providing a degree of air flow regulation not provided
without the air dam. In still other embodiments, an air dam is
adjustable between non-porous and various degrees of porous. The
adjustable air dam structure is adjusted to allow various degrees
of air flow through the structure, similar in concept to how
adjustable window blinds are adjusted to allow various degrees of
light to pass through.
[0042] As another example of additional duct work elements that can
be used, duct guides 36 and 37 are added between the duct guide 38
and the bottom panel of the duct work assembly 30 to further refine
the air flow alignment directed at the heat exchanger N. The
additional duct guides 36 and 37 can also be used to minimize, if
not eliminate, re-circulation zones that may exist.
[0043] In some embodiments, the heated air output from multiple
adjacent heat zones can be combined into a common duct work and
directed to a group of adjacent heat exchangers. FIG. 2A
illustrates a cut out side view of the electronics enclosure 10
coupled to a duct work assembly 50 according to another embodiment
of the present invention. The configuration of FIG. 2A is similar
to that of FIG. 1 except that in FIG. 2A the thermal load
distribution within the electronics enclosure 10 is different and
the duct work assembly 50 uses common duct work, a duct guide 52
and a duct guide 54, to combine heated air output from multiple
adjacent heat zones 2, 3, and 4, to multiple adjacent heat
exchangers 2, 3, and 4. In this exemplary configuration, each heat
zone is not independently ducted to a corresponding one heat
exchanger. Other heat zones can be similarly combined, or can be
independently ducted, such as the heated air output from the heat
zone N being directed to the heat exchangers N by duct guide 56.
Additional duct guides, channels, and/or air dams can be used
within each ducted pathway. Although FIG. 2A shows the combination
of heated air output from three adjacent heat zones within a common
duct work, it is understood that heated air from more or less than
three adjacent heat zones can be combined within a common duct
work.
[0044] In use, the electronics servers within the electronics
enclosure are periodically changed or updated, thereby resulting in
a changed thermal load distribution within the electronics
enclosure. While the heat exchangers and the duct work assembly can
be initially configured to match a specific thermal load
distribution corresponding to an initial configuration of
electronics servers, once any one of the electronics servers are
changed, the thermal load distribution changes, and so do the
optimal air flow characteristics to meet this new thermal load
distribution. Since the positions of the duct guides are
changeable, the duct work assembly as a whole is adaptable to
changing thermal conditions within the electronics enclosure. In
general, if the thermal load conditions within the electronics
enclosure change, such as for example the swapping out of one or
more electronics servers for other electronics servers with
different thermal load profiles, the heat zones can be re-defined,
and the duct guides re-positioned within the duct work assembly
according to the newly defined heat zones.
[0045] The cooling systems of FIGS. 1 and 2A are described in terms
of conceptually partitioning the interior of the electronics
enclosure into heat zones having equivalent thermal loads, and for
establishing a 1:1 or N:N relationship between the ducting of
heated air from the heat zones to corresponding heat exchangers. It
is alternatively contemplated that there is not a one-to-one
relationship between the number of heat zones and the number of
heat exchangers. As previously described, the interior of the
electronics enclosure is conceptually partitioned into M heat
zones, and the cooling panel includes N heat exchangers. In some
cases, duct guides are positioned to direct air to portions of one
or more heat exchangers, essentially segmenting the heat exchangers
and directing the different air flows to different segments of the
same heat exchangers.
[0046] FIG. 2B illustrates the electronics enclosure 10 configured
as in FIG. 2A except that the duct guide 54 of FIG. 2A is
re-positioned as duct guide 54' in FIG. 2B such that air is
directed to a portion of the heat exchanger 4.
[0047] In some embodiments, the duct guides are made of a
deformable material, such as foam or sponge, including holes and/or
slits, or brush including stiff bristles to allow electrical
connection lines, such as cables or cords, to pass through the duct
guide material. In other embodiments, the duct guides are made of a
combination of materials including a rigid portion and a deformable
portion, such as a metal or plastic sheet with bristles attached to
one of the ends to allow cable pass-though. The duct guides are
configured to be removable and their positions adjustable to adapt
to changes in the heat load distribution within the electronics
enclosure, such as due to replacement of one or more electronics
servers with electronics servers that have different heat
generating profiles. In some embodiments, the cooling panel, the
back end of the electronics enclosure, and/or the plenum in between
is configured with mechanical means for holding the duct guides in
place. Examples of such mechanical means includes slots, flanges,
and screws. In other embodiments, the duct guide itself is fitted
with mechanical means for support that mate to corresponding
features on the electronics enclosure. A duct guide can be
positioned anywhere in the duct work assembly that provides or can
accept the mechanical means for supporting the duct guide in
position. The available positions for the duct guides are only
limited by the number and variety of the mechanical means for
support that are provided.
[0048] In some embodiments, the deformable nature of the duct guide
provides the mechanical means for holding the duct guide in place.
For example, the duct guide is made of foam that is compressible,
which for example is 26 inches wide in an uncompressed state. To
install the duct guide within the electronics enclosure, which for
example is 24 inches wide, the foam is compressed and placed in
position within the electronics enclosure while compressed, then
the compression is released. The action of the foam expanding back
towards it original form provides pressure against the electronics
enclosure, thereby holding the foam duct guide in place. A
deformable duct guide of this type can be positioned anywhere
within the duct work assembly.
[0049] Another advantage of the deformable aspect of the duct
guides is to accommodate all the electrical connection lines
connected to the back of the electronics servers. The deformable
duct guides, or the deformable portions of the duct guides, enable
the electrical connection lines to pass through the duct guide
while still maintaining the capability of guiding the air flow. In
an exemplary configuration, a duct guide is made of stiff bristles.
FIG. 10 illustrates an exemplary duct guide comprising bristles 60.
Optional bindings or straps 62 can be used to bind the bristles
together. Where the bristles impinge the electrical connection
lines at the back end of the electronics servers, the bristles
deform around the electrical connection lines. Alternatively, the
electrical connection lines can be manually positioned to drape
across the duct guide and pass through the bristles at the end
proximate the cooling panel. FIG. 11 illustrates an exemplary duct
guide comprising bristles 72 coupled to a rigid structure 70, where
the bristles 72 form a majority of the duct guide. FIG. 12 an
exemplary duct guide comprising bristles 82 coupled to a rigid
structure 80, where the bristles 82 form a minority of the duct
guide. It is understood that other proportions of bristles to rigid
structure than those shown in FIGS. 11 and 12 can be used. In some
embodiments, the duct guide is positioned such that the bristled
end faces the electronics servers. In other embodiments, the duct
guide is positioned such that the bristle end faces the cooling
panel. In this case, the electrical connection lines drape over the
duct guide and pass through the bristles facing the cooling
panel.
[0050] In another exemplary configuration, a duct guide is made of
a deformable material, such as foam, with slits, holes, or a
combination of slits and holes. The electrical connection lines
either slide within the slits or into the holes cut into one end of
the foam. FIG. 13 illustrates an exemplary duct guide comprising
foam 90 having slits 92. The slits 92 extend through the entire
thickness of the foam 90 and extend from an end 91 along a partial
length of the foam 90. FIG. 14 illustrates an exemplary duct guide
comprising foam 94 having slits with a hole 96 at the end of each
slit. The holes 96 extend through the entire thickness of the foam
94. In an alternative configuration, a foam duct guide includes
holes, but no slits. As with the bristle duct guides, the foam duct
guides can be positioned such that the end with the slits is
positioned facing either the electronics servers or the cooling
panel.
[0051] For those implementations where the distance between the
second side 12 (FIG. 1) and the heat exchangers is relatively
short, for example less than or equal to 12 inches, a single duct
guide can be used to span the entire gap. The duct guide can be
attached on the heat exchanger side, such as on the cooling panel
20 (FIG. 1), and when the cooling panel is shut, wherever cords or
cables are present at the electronics server side, such as the
second side 12 (FIG. 1), the cords and cables locally impede the
deformable material, which bends to accommodated. The remaining
deformable material not impeded by the cords and cables remains in
place.
[0052] For those implementations where the distance between the
second side 12 and the heat exchangers is relatively long, for
example greater than 12 inches, two separate duct guides can be
used to span the entire gap. A first duct guide is rigid and is
attached on the heat exchanger side, such as the cooling panel 20.
A second duct guide is either deformable, or a combination of rigid
and deformable, and is attached on the electronics enclosure side.
The deformable second duct guide, or the deformable portion of the
second duct guide, deforms about the electrical connection lines.
When the cooling panel is shut, the ends of the first and second
duct guide abut or slightly overlap, to conceptually form a
substantially single duct guide that spans the distance between the
electronics servers and the heat exchangers. Both the first and
second duct guides can be re-positioned as described above.
[0053] FIGS. 1 and 2 show the cooling panel 20, 40 and the
electronics enclosure 10 with a 1:1 relationship between the number
of heat exchangers in the cooling panel and the number of heat
zones in the electronics enclosure. It is understood that the
cooling panel and the electronics enclosure can be configured with
alternative relationships. In general, the ratio between the number
of heat exchangers and the number of heat zones is 1:n.
[0054] Each of the heat exchangers are described above as being
configured to cool the same amount of thermal load and each heat
zone is conceptually defined as generating the same amount of
thermal load. In alternative configurations, each heat exchanger
can be configured to cool an independent amount of thermal load, as
compared to the other heat exchangers, and the heat zones can be
conceptually defined according to unequal thermal loads. Each heat
exchanger can vary by size and/or density of heat exchanging
elements. The duct work assembly is re-configurable to adjust the
positions and numbers of duct guides to alter the air flow
according to any desired configuration and specifications as
determined by the thermal load distribution within the electronics
enclosure and the configuration of each of the heat exchangers.
[0055] Although the electronics enclosure, the duct work assembly,
and the cooling panel with heat exchanger(s) are described above as
separate components, it is understood that the duct work assembly
can be integrated as part of the electronics enclosure and/or as
part of the cooling panel. Also, the cooling panel, configured with
or without the duct work assembly, can be integrated as part of the
rear panel of the electronics enclosure. In the case where there is
no duct work assembly, the electronics enclosure is configured with
a rear plenum within which the duct guides can be positioned.
[0056] In conventional electronics enclosures, the rear panel is
configured as a door to enable access to the internal electronics
servers. However, when the rear panel or door is configured with
heat exchangers that are coupled to external fluid supply lines,
and in some cases the inclusion of a duct work assembly of the type
described above, alternative means for accessing the interior of
the electronics enclosure are used.
[0057] FIG. 4 illustrates an isometric view of an electronics
enclosure with a first embodiment of an access mechanism in a
closed position. An electronics enclosure 110 includes a rear panel
120 including one or more heat exchangers. The one or more heat
exchangers are coupled to flexible fluid lines 140 for input and
output of cooling fluid. In some embodiments, the electronics
enclosure 110 includes a plenum and duct work of the type described
above in relation to FIGS. 1-3. In other embodiments, the
electronics enclosure 110 may or may not include a plenum and/or
duct work between the back of the electronics servers 160 (FIG. 5A)
and the rear panel 120.
[0058] FIG. 5A illustrates an isometric view of the electronics
enclosure 110 with the access mechanism in an open position. Slide
rails 150 are coupled to the rear panel 120 and to the rear end of
the electronics enclosure 110. The slide rails 150 enable the rear
panel 120 to slide back and forth relative to the electronics
enclosure 110, similar to a drawer in a filing cabinet. As shown in
FIG. 4, the rear panel 120 is slid into the closed position. As
shown in FIG. 5A, the rear panel 120 is slid into the open
position. The flexible fluid lines 140 enable movement of the rear
panel 120 between the open and closed positions while maintaining a
fluid connection with the rear panel 120. Sliding the rear panel
120 back and forth does not provide a torsional flex on the fluid
lines, simply a bending motion. While in the open position, duct
work (not shown) included at the back of the electronic servers 160
can be removed if present, and access to the back of the
electronics enclosure 110 including access to the electronics
servers 160, or other components included within the electronics
enclosure 110, is provided.
[0059] FIGS. 4 and 5A show the entire rear panel sliding back and
forth. Alternatively, the rear panel and heat exchangers can be
configured as separate pieces and each piece is configured with
slide rails, as in individual drawers in the filing cabinet. In
this configuration, each rear panel piece is fitted with flexible
fluid lines. In some embodiments, the rear panel pieces are
fluidically coupled in series, so that a flexible fluid line
couples one rear panel piece to the next rear panel piece and so
on, with the top-most and bottom-most rear panel pieces coupled to
input and output flexible fluid lines, as in the flexible fluid
lines 140 of FIGS. 4 and 5A. In other embodiments, each of the rear
panel pieces is fitted with their own set of input and output
flexible fluid lines. An advantage of segmenting the rear panel is
to only disrupt cooling of a portion of the electronics servers, as
opposed to opening the entire rear panel and disrupting cooling for
all of the electronics servers. Additionally, there is no need for
swivel joints that provide fluid connection between the heat
exchangers and external fluid lines, as in a rear door cooling door
assembly.
[0060] Although the electronics enclosure and sliding drawer(s)
with heat exchanger(s) is described in relation to a rear panel of
the electronics enclosure, the sliding drawer concept can be
applied to a front panel of the electronics enclosure.
[0061] The sliding access mechanism of FIGS. 4 and 5A can be
further adapted such that the rear panel slides from side to side
to once in an open position, thereby providing additional ease with
which to access the interior of the electronics enclosure. FIG. 5B
illustrates an isometric view of the electronics enclosure 110 with
an adapted version of the sliding access mechanism of FIG. 5B. The
sliding access mechanism of FIG. 5B works the same as the sliding
access mechanism of FIG. 5A with the addition of a second sliding
assembly 152 configured to enable the rear panel to slide side to
side. Specifically, the rear panel 120 of FIG. 5A is replaced with
a frame 154 and a rear panel 120'. The frame 154 is coupled to each
of the sliding assemblies 152. A top and a bottom sliding assembly
152 is coupled to the frame 154 and the rear panel 120'. The
sliding assemblies 152 enable the rear panel 120' to move
substantially orthogonally relative to the motion of the sliding
assemblies 150. The sliding assemblies 152 are configured to move
independently of the sliding assemblies 150. As such, the rear
panel 120' can be moved while the sliding assemblies 150 are in the
closed position or any degree of the open position, that is from a
slightly open position to a maximum open position. FIG. 5B shows
the rear panel 120' sliding to the left. Alternatively, the rear
panel 120' and the sliding assemblies 152 can be configured to
slide the rear panel 120' to the right, or can be enabled so that
the rear panel 120' can slide to both the left and the right.
[0062] FIG. 6 illustrates an isometric view of an electronics
enclosure with a second embodiment of an access mechanism. The rear
panel of an electronics enclosure 210 is replaced with a plurality
of heat exchangers 222, 224, 226 and duct work 232, 234, 236. The
inclusion of three sets of heat exchangers and duct works is for
exemplary purposes only, more or less than three sets of heat
exchangers and duct works can be used. Each of the heat exchangers
222, 224, 226 is coupled to fluid lines 240 for input and output of
cooling fluid. The fluid lines can be flexible or hard-plumbed. Air
output from the back of the electronics enclosure 210 is directed
to each of the heat exchangers 222, 224, 226 via the duct work 232,
234, 236, respectively. The heat exchangers 222, 224, 226 are each
positioned substantially horizontally, and the duct work 232, 234,
236 redirects the substantially horizontal air flow out the back of
the electronic enclosure 210 to a substantially upward vertical air
flow directed to the heat exchangers 222, 224, 226. As shown in
FIG. 6, the duct work 232, 234, 236 has a curved surface and two
sides to transition the horizontal air flow to the upward vertical
air flow. Alternative duct work configuration can also be used to
accomplish this change of air flow direction.
[0063] Each of the duct works 232, 234, 236 is detachably coupled
to the electronics enclosure 210 and the corresponding heat
exchanger 222, 224, 226. As such, each of the duct works 232, 234,
236 can be independently removed to provide access to the interior
of the electronics enclosure 210. An advantage of this
configuration is that the heat exchangers are not moved to provide
interior access to the electronics enclosure. As a result, fluid
pathways can be hard-plumbed. Additionally, there is no need for
swivel joints that provide fluid connection between the heat
exchangers and external fluid lines, as in a rear door cooling door
assembly.
[0064] In some embodiments, the electronics enclosure 210 also
includes a plenum and additional duct work of the type described
above in relation to FIGS. 1-3. Although the heat exchangers 222,
224, 226 and duct work 232, 234, 236 are described in relation to
replacing a rear panel of the electronics enclosure 210, similar
heat exchangers and duct work can be used to replace a front panel
of the electronics enclosure.
[0065] In FIG. 6, the heat exchangers and duct work are configured
to direct air upward. In an alternative configuration, the heat
exchangers and duct work are configured to direct air downward.
FIG. 7 illustrates an isometric view of an electronics enclosure
with a third embodiment of an access mechanism. The access
mechanism of FIG. 7 is configured similarly as the access mechanism
of FIG. 6 except that the heat exchanges and duct work are
configured to direct air downward. Specifically, the heat
exchangers 322, 324, 326 replace the heat exchangers 222, 224, 226
of FIG. 6, and duct work 332, 334, 336 replaces duct works 232,
234, 236 of FIG. 6. Each of the heat exchangers 322, 324, 326 is
coupled to fluid lines 340 for input and output of cooling fluid.
The fluid lines 340 can be flexible or hard-plumbed. Air output
from the back of the electronics enclosure 310 is directed to each
of the heat exchangers 322, 324, 326 via the duct works 332, 334,
336, respectively. The heat exchangers 322, 324, 326 are each
positioned substantially horizontally, and the duct works 332, 334,
336 redirects the substantially horizontal air flow out the back of
the electronic enclosure 210 to a substantially downward vertical
air flow directed to the heat exchangers 322, 324, 326. As shown in
FIG. 7, each of the duct works 332, 334, 336 has a curved surface
and two sides to transition the horizontal air flow to the downward
vertical air flow. Alternative duct work configuration can also be
used to accomplish this change of air flow direction.
[0066] Each of the duct works 332, 334, 336 is detachably coupled
to the electronics enclosure 310 and the corresponding heat
exchanger 322, 324, 326. As such, each of the duct works 332, 334,
336 can be independently removed to provide access to the interior
of the electronics enclosure 310. To protect the heat exchangers
322, 324, 326 while the duct works 332, 334, 336 are removed, a
protective cover having a perforated pattern is used. The
perforated pattern enables air flow through the cover, but provides
protection against physical contact with the heat exchanger
surface. Examples of a perforated protective cover include, but are
not limited to, a wire mesh, a metal sheet with perforations, a
parallel pattern of metal rods, and a cross-hatched pattern of
metal rods.
[0067] FIG. 9 illustrates an isometric view of an electronics
enclosure with a fourth embodiment of an access mechanism. The rear
panel of an electronics enclosure 510 is replaced with a plurality
of heat exchangers 522, 524, 526, each of which is pivotally
coupled to the back end of the electronics enclosure 510. The
inclusion of three heat exchangers is for exemplary purposes only,
more or less than three heat exchangers can be used. Each of the
heat exchangers 522, 524, 526 is coupled to fluid lines 540 for
input and output of cooling fluid. The fluid lines can be flexible
or hard-plumbed. Air output from the back of the electronics
enclosure 510 is directed to each of the heat exchangers 522, 524,
526. The heat exchangers 522, 524, 526 are each configured to
swivel upward. In other words, a top end of each heat exchangers
522, 524, 526 is coupled to the electronics enclosure 510 such that
a bottom end of each heat exchangers 522, 524, 526 can swing up to
open and down to close. Each of the heat exchangers 522, 524, 526
is coupled to the electronics enclosure 510 using one or more
swivel joints that maintain a fluid connection between the heat
exchangers 522, 524, 526 and the fluid lines 540 while the heat
exchangers 522, 524, 526 are in either the up or down position. As
shown in FIG. 9, each of the heat exchangers is in the up position.
Although all three heat exchanges 522, 524, 526 are shown in the up
position, it is understood that each of the heat exchangers 522,
524, 526 can be opened and closed independently. While in the up
position, access is provided to the interior of the electronics
enclosure 510. The heat exchangers 522, 524, 526 are configured to
rotate from 0 to 90 degrees, and in some cases greater than 90
degrees. Rotating to less than 90 degrees provides internal access
to the interior of the electronics enclosure, but does not enable
the installation and/or removal of an electronics server. Rotating
to 90 degrees or greater does enable the installation and/or
removal of an electronics server.
[0068] In some embodiments, the electronics enclosure 510 also
includes a plenum and additional duct work of the type described
above in relation to FIGS. 1-3. Although the heat exchangers 522,
524, 526 are described in relation to replacing a rear panel of the
electronics enclosure 510, similar heat exchangers can be used to
replace a front panel of the electronics enclosure.
[0069] In FIG. 9, the heat exchangers are configured for a bottom
end to swivel up and down. In an alternative configuration, the
heat exchangers are configured to swivel downward. In other words,
a bottom end of each heat exchangers is coupled to the electronics
enclosure such that a top end of each heat exchangers can swing
down to open and up to close. A protective cover can be added to
each of the heat exchangers.
[0070] Supplemental cooling can be added to the electronics
enclosure without adapting the rear or front access panels, thereby
maintaining conventional access to the interior of the electronics
enclosure. In this case, a supplemental cooling assembly is added
to the top of the electronics enclosure, and air output from the
rear of each electronics server is directed to the supplemental
cooling assembly before being output from the electronics
enclosure.
[0071] FIG. 8 illustrates a cut out side view of a supplemental
cooling assembly coupled to an electronics enclosure. A plurality
of heat generating devices, such as electronics servers 420, are
stored within the electronics enclosure 410. The electronics
enclosure 410 is configured to enable airflow from a first side 414
toward a second side 412. The first side 414 is configured with air
vents to enable airflow into the electronics enclosure 410. The
second side 412 is configured as a solid panel to block air flow.
In some embodiments, the second side 412 is a solid door. Air flow
through the electronics enclosure 410 is generated by one or more
internal air moving system (not shown) positioned within the
electronics enclosure 410, for example one or more internal fans
included as part of each electronics server 420.
[0072] Between the rear end of each electronics server 420 and the
second side 412 is a back plenum 430. The back plenum 430 is formed
from either a back portion of the electronics enclosure 410, or the
back plenum 430 and the second side 412 are added as an extension
to an existing electronics enclosure. Heated air flows out the rear
of each electronic server 420 and into the back plenum 430. The
second side 412 prevents the heated air from exiting the
electronics enclosure 410, and as a result, the heated air rises to
a top plenum 460. In some embodiments, a top portion of an existing
electronics enclosure is adapted to include the top plenum. In
other embodiments, the top plenum is coupled to a top vented
surface of the electronics enclosure. The top plenum 460 is formed
by a top panel and four side panels. At least one of the panels is
vented. One or more heat exchangers are coupled to each vented
panel. As shown in FIG. 8, the top panel is vented and includes at
least one heat exchanger 450, a front panel is vented and includes
at least one heat exchanger 454, and a back panel is vented and
includes at least one heat exchanger 452. The heat exchangers 450,
452, 454 are coupled to inlet and outlet fluid lines 440. Heated
air entering the top plenum 460 flows through the heat exchangers
450, 452, 454, and cooled air is output from the heat exchangers
450, 452, 454. In some embodiments, one or more fans can be
positioned in the top plenum 460, or a supplemental fan tray can be
added on the exterior side of the heat exchanger 450, and/or the
heat exchangers 452, 454 to enhance air flow.
[0073] An advantage of the supplemental cooling assembly is that
the heat exchangers do not inhibit access to the interior of the
electronics enclosure. As shown and described in relation to FIG.
8, a top portion of an existing electronics enclosure is adapted to
include a top plenum. One or more of the panels that make up the
top plenum are vented, and one or more heat exchangers are coupled
to each vented panel. In other embodiments, the top plenum is added
as an extension to an existing electronics enclosure. To
accommodate this top plenum space within an existing electronics
enclosure, one or more electronics servers may need to be removed
from the top portion of the electronics enclosure.
[0074] The cooling system is described above for use with an
electronics enclosure, such as a server rack. In alternative
applications, the cooling system is used with other cooling devices
that have fans moving air through heat exchangers, such as overhead
cooling units used in data centers. In general, the power
efficiency of such cooling devices can be improved through the use
of the cooling system of the present invention.
[0075] The present invention has been described in terms of
specific embodiments incorporating details to facilitate the
understanding of the principles of construction and operation of
the invention. Such reference herein to specific embodiments and
details thereof is not intended to limit the scope of the claims
appended hereto. It will be apparent to those skilled in the art
that modifications may be made in the embodiment chosen for
illustration without departing from the spirit and scope of the
invention.
* * * * *