U.S. patent application number 12/186830 was filed with the patent office on 2009-02-12 for thermoelectric temperature-controlled container holder and method.
This patent application is currently assigned to FERROTEC (USA) CORPORATION. Invention is credited to Robert W. Otey.
Application Number | 20090038317 12/186830 |
Document ID | / |
Family ID | 40345217 |
Filed Date | 2009-02-12 |
United States Patent
Application |
20090038317 |
Kind Code |
A1 |
Otey; Robert W. |
February 12, 2009 |
Thermoelectric temperature-controlled container holder and
method
Abstract
A Thermoelectric-based container holder has a receptacle with a
recess for receiving a container to be heated or cooled, a variable
interface surface disposed within the holder and configured to
flexibly contact an outside surface of the container to be heated
or cooled where the variable surface interface is in thermal
contact with the surface of the receptacle, and a thermoelectric
assembly thermally connected to at least the variable surface
interface.
Inventors: |
Otey; Robert W.;
(Litchfield, NH) |
Correspondence
Address: |
MESMER & DELEAULT, PLLC
41 BROOK STREET
MANCHESTER
NH
03104
US
|
Assignee: |
FERROTEC (USA) CORPORATION
Bedford
NH
|
Family ID: |
40345217 |
Appl. No.: |
12/186830 |
Filed: |
August 6, 2008 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
60954220 |
Aug 6, 2007 |
|
|
|
Current U.S.
Class: |
62/3.2 |
Current CPC
Class: |
F25D 2500/02 20130101;
F25B 21/04 20130101; F25D 2331/809 20130101; F25D 2331/805
20130101; F25D 31/007 20130101 |
Class at
Publication: |
62/3.2 |
International
Class: |
F25B 21/02 20060101
F25B021/02 |
Claims
1. A Thermoelectric-based container holder for receiving a
container to be heated or cooled, the container holder comprising:
a receptacle having a recess for receiving a container to be heated
or cooled; a variable surface interface disposed within the
receptacle and configured to flexibly contact and form to an
outside surface of the container to be heated or cooled, the
variable surface interface being in thermal contact with a surface
of the receptacle; and a thermoelectric assembly thermally
connected to at least the variable surface interface.
2. The container holder of claim 1 wherein the variable surface
interface has good heat transfer properties and is configured to
adapt to the shape of the container.
3. The container holder of claim 2 wherein the variable surface
interface is a component having a structure selected from the group
consisting of a flexible envelope and a formable heat transfer
material contained with the flexible envelope, a pin grid
component, a foam material, rubber compound, and any formable,
thermally conductive material.
4. The container holder of claim 2 wherein the variable surface
interface contacts a portion of the container selected from the
group consisting of the sides of the container, the bottom of the
container, and both.
5. The container holder of claim 1 wherein the receptacle has a
wall, the wall having a thermally-conductive portion that is in
contact with the variable surface interface.
6. The container holder of claim 1 wherein the receptacle has a
bottom, the bottom having a thermally-conductive portion that is in
contact with the variable surface interface.
7. The container holder of claim 1 wherein the thermoelectric
assembly is thermally connected indirectly to the receptacle
through a heat transfer block assembly.
8. The container holder of claim 7 wherein the heat transfer block
assembly comprising one of a heat transfer block, a heat pipe, a
heat transfer plate, and any combination thereof.
9. The container holder of claim 1 wherein the thermoelectric
assembly is thermally connected directly to the receptacle.
10. The container holder of claim 1 wherein the thermoelectric
assembly is thermally connected indirectly to the variable surface
interface through a heat transfer block assembly.
11. The container holder of claim 1 further comprising an
electrical polarity switch coupled to the thermoelectric
assembly.
12. The container holder of claim 1 wherein the receptacle further
includes an adjustable container biasing mechanism.
13. The container holder of claim 11 wherein the container biasing
mechanism is selected from the group consisting of an engageable
tang and an engageable fulcrum assembly.
14. The container holder of claim 12 wherein the container biasing
mechanism is automatically adjustable.
Description
[0001] This application claims the benefit of U.S. Provisional
Patent Application No. 60/954,220, filed Aug. 6, 2007.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates generally to coolers and
heaters for bottles, cups and other such devices. Particularly, the
present invention relates to thermoelectric container coolers and
heaters.
[0004] 2. Description of the Prior Art
[0005] Thermoelectric-based cup coolers and heaters as well as
bottle coolers and other such devices are currently available for
various applications including car consoles, furniture consoles,
after market accessories, desk/table top units as well as those
powered by a computer via a USB connection. Devices that use
convection to transfer heat to or from a container sacrifice the
heat transfer efficiency of conduction due to the difficulty in
achieving large surface area contact. Devices that use conduction
have a rigid interface which limits the amount of surface contact
the thermal interface of the cooling/heating mechanism has with the
container to be heated or cooled.
[0006] Some currently available container cooler/heater devices
based on thermoelectric technology utilize a rigid cooling/heating
interface with the container to be cooled. The interface can be
tailored to a specific container design such as the standard soda
can bottom or that of a provided container. However, a container
with an alternate design will not have the same amount of surface
in contact with the rigid cooling/heating interface, which will
lessen the effectiveness of the cooler/heater. Even devices that
have rigid cooling/heating interface that are designed to accept
multiple sizes sacrifice surface contact due to varying container
shapes. Purely convective type devices allow for multiple container
shapes and sizes but sacrifice heat transfer efficiency.
[0007] Therefore, what is needed is a container cooler/heater that
has improved surface contact with multiple container designs and
sizes. What is also needed is a container cooler/heater that has a
cooling/heating surface interface that enables good heat transfer
to a variety of common containers such as cans, mugs, and
bottles.
SUMMARY OF THE INVENTION
[0008] It is an object of the present invention to provide a
Thermoelectric-based container holder that has improved surface
contact with multiple container designs and sizes. It is a further
object of the present invention to provide a Thermoelectric-based
container holder that has a cooling/heating surface interface that
enables good heat transfer to a variety of common containers. It is
another object of the present invention to provide a
Thermoelectric-based container holder that has a variable surface
interface for cooling or heating. It is yet another object of the
present invention to provide a Thermoelectric-based container
holder that has a variable surface interface that can conform to
the surface of various types of containers.
[0009] The present invention achieves these and other objectives by
providing a Thermoelectric-based container holder for receiving a
container to be heated or cooled that has a receptacle, a variable
surface interface and a thermoelectric assembly. The receptacle has
a recess for receiving the container to be heated or cooled. The
variable surface interface is disposed within the receptacle and is
configured to flexibly contact and form itself to an outside
surface of the container. The thermoelectric assembly is thermally
connected to at least the variable surface interface.
[0010] In one embodiment of the present invention, the
Thermoelectric-based container holder includes a heat interface
block connected to the thermoelectric assembly and a heat transfer
device such as, for example, a heat pipe that extends to the
outside surface of the receptacle. This allows the thermoelectric
assembly to be located a predefined distance from the receptacle
but still allow efficient thermal transfer to occur.
[0011] In another embodiment of the present invention, the
Thermoelectric-based container holder incorporates two or more
receptacles to be cooled/heated using a single thermoelectric
assembly. In such an embodiment, a heat interface block is
configured with two or more heat transfer devices where at least
one of each of the heat transfer devices is attached to one of the
receptacles.
[0012] In still another embodiment of the present invention, the
Thermoelectric-based container holder incorporates a thermoelectric
assembly that is in direct thermal contact with either the
receptacle, the variable surface interface or both.
[0013] In yet another embodiment of the present invention, the
Thermoelectric-based container holder uses a variable surface
interface that is sufficiently flexible to form to the outside
surface of the container to be cooled/heated but rigid enough to be
part of or the entire receptacle for receiving the container to be
cooled/heated. In this embodiment, it is preferable, but
non-mandatory, that the inner surface of the "receptacle" be
metallized for better heat distribution and durability but remain
sufficiently flexible and resilient to form to the outside surface
of the container to be cooled/heated.
[0014] In any embodiment of the present invention, the opposite
side of the thermoelectric assembly that is not in contact with
either the heat interface block, the variable surface interface or
the receptacle can be cooled by way of convection or forced
convection from ambient air, or possibly from the HVAC system of a
home, auto, or other environment. It is conceived that some
applications could use conductive cooling or a combination of
conductive and convective. It is further conceived that a
liquid-cooled heat sinking assembly could be used.
[0015] The present invention can be a stand-alone unit or fit into
existing console enclosures. It can also be made to fit into
existing cup holders. The receptacle is preferably equipped with a
mechanism that provides forced contact between the variable surface
interface and the container to be cooled/heated. Examples of such a
mechanism includes, but is not limited to, spring loaded tangs, a
lever-fulcrum device, etc.
[0016] An important component of the present invention is the
variable surface interface. It is important that the variable
surface interface be capable of conforming to the outside surface
of various containers whose size is within a specified or
predefined design range. The variable surface interface may be a
flexible envelope that contains a heat transfer material. The heat
transfer material flows around the container being cooled/heated
with the constraints of the envelope. This provides the large area
of contact that enhances heat transfer. The heat flow path is
between the variable surface interface and the thermoelectric
assembly through an interface plate or block. It is also
contemplated that the variable surface interface can be directly
attached to the thermoelectric assembly or distanced from the
variable surface interface through a heat transfer method such as,
for example, one or more heat pipes. Other structures that are
useful as a variable surface interface includes, but is not limited
to, a pin grid structure, a resilient foam material, etc. It should
be understood that the variable surface interface can also be used
in the bottom of the receptacle where is would conform to the
bottom of the container to be cooled/heated or both the bottom and
sides of the container to be cooled/heated.
[0017] It should be noted that the present invention can be
configured as a portable unit, a console unit, a single receptacle
unit, or multiple receptacle unit. The present invention can also
be configured with an electrical polarity switch to change the
operating mode between either a cooling mode or a heating mode. It
is further contemplated that power to thermoelectric assembly can
be variable to control the amount of heating or cooling being
transferred from the thermoelectric assembly to the container to be
cooled/heated. Further, power to the thermoelectric assembly of the
present invention can be provided by different methods. These
methods include but are not limited to a USB port, a solar panel,
vehicle battery, household service, and the like.
BRIEF DESCRIPTION OF THE DRAWINGS
[0018] FIG. 1 is a top plan view of one embodiment of the present
invention showing a container to be cooled/heated within the
receptacle and biased against the variable surface interface and
the thermoelectric assembly.
[0019] FIG. 2 is a front view of the embodiment shown in FIG.
1.
[0020] FIG. 3 is a top plan view of another embodiment of the
present invention showing a smaller-sized container to be
cooled/heated within the receptacle and biased against the variable
surface interface and the thermoelectric assembly thermally.
[0021] FIG. 4 is a front view of the embodiment shown in FIG.
3.
[0022] FIG. 5 is a top plan view of an embodiment of the present
invention showing a multiple receptacle unit accommodating two
different sized containers to be cooled/heated.
[0023] FIG. 6A is a cross-sectional view of another embodiment of
the present invention showing an alternative automatic biasing
mechanism to provide forced contact between the container to be
cooled/heated and the variable surface interface prior to the
container activating the biasing mechanism.
[0024] FIG. 6B is a cross-sectional view of the embodiment of the
automatic biasing mechanism shown in FIG. 6A after the container
has activated the biasing mechanism.
[0025] FIG. 7A is a cross-sectional view of another embodiment of
the present invention showing an alternative automatic biasing
mechanism to provide forced contact between the container to be
cooled/heated and the variable surface interface prior to the
container activating the biasing mechanism.
[0026] FIG. 7B is a cross-sectional view of the embodiment of the
automatic biasing mechanism shown in FIG. 7A after the container
has activated the biasing mechanism.
[0027] FIG. 8 is a perspective view of another embodiment of the
present invention showing a variable surface receptacle.
[0028] FIG. 9A is a partial cross-sectional view of another
embodiment of the present invention showing a variable surface
interface in the bottom of the receptacle prior to insertion of the
container to be cooled/heated.
[0029] FIG. 9B is a partial cross-sectional view of the embodiment
shown in FIG. 9A after the container to be cooled/heated is
inserted within the receptacle.
[0030] FIG. 10A is front view of another embodiment of the present
invention showing a simplified structure of the
thermoelectric-based container holder.
[0031] FIG. 10B is a front view of the embodiment shown in FIG. 10A
with container 1 positioned onto the thermoelectric-based container
holder.
[0032] FIG. 11A is a front view of another embodiment of the
present invention showing a variable surface interface with a
ring-type structure.
[0033] FIG. 11B is a front view of the embodiment shown in FIG. 11
A with container 1 inserted into the ring structure of the variable
surface interface.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0034] The preferred embodiment(s) of the present invention is
illustrated in FIGS. 1-9. FIG. 1 shows a top plan view of the
Thermoelectric-based container holder 10 of the present invention,
which is configured for receiving a container 1 to be cooled or
heated. It should be understood that container 1 is not part of the
present invention. Thermoelectric-based container holder 10
includes a receptacle 20, a variable surface interface 40 and a
thermoelectric assembly 50. Receptacle 20 has a recess 22 for
receiving the container 1 to be heated or cooled. Receptacle 20 has
at least a portion 21, which is in thermal contact with variable
surface interface 40, made of a thermally conductive material
having good heat transfer characteristics. Portion 21 is preferably
made of aluminum or copper. Variable surface interface 40 is
disposed within receptacle 20 and is configured to flexibly contact
and form itself to an outside surface of container 1. Receptacle 20
may optionally include a slot 27 in a portion of the receptacle 20
that accommodates a handle on a container.
[0035] In this embodiment, thermoelectric assembly 50 is thermally
connected to an outside surface 24 of receptacle 20, which is in
intimate thermal contact with variable surface interface 40; the
outside surface 24 being either the bottom or the side, or both,
depending on the preferred configuration. Thermoelectric assembly
50 includes a thermoelectric module 52 where one side is thermally
connected to a heat source, which is receptacle 20 in this
embodiment, and the other side is thermally connected to a heat
sink 54. An air moving mechanism 56 is typically mounted to move
convection air over heat sink 54 to remove waste heat from
Thermoelectric-based container holder 10. Arrows 3a, 3b and 3c
indicate the flow of air but it should be understood that any
configuration of the air moving mechanism 56 that moves air across
heat sink 54 can be used. Air moving mechanism 56 is preferably a
low voltage fan with a high air moving efficiency. It is further
contemplated that additional thermal efficiency could be obtained
by incorporating a mechanism to move the air within the space
between container 1 and receptacle 20 not occupied by variable
surface interface 40.
[0036] It is noted that in this embodiment, thermoelectric module
52 is directly connected to receptacle 20. There is also
illustrated one embodiment of a biasing mechanism 28 that provides
the forced contact of container 1 to variable surface interface 40.
More specifically, biasing mechanism 28 may be spring-loaded tangs
that automatically force container 1 against variable surface
interface 40.
[0037] Variable surface interface 40 is a material that has the
ability to adapt to the shape of the outside surface of container 1
and further exhibits good heat transfer properties. One example of
such a material is a variable surface interface 40 having an outer
envelope or casing of a flexible, resilient and/or elastic material
that is filled with a thermally conductive gel or other thermally
conductive fluid or other matter. The thermally conductive material
flows around container 1 within the constraints of the envelope as
biasing mechanism 28 provides forced contact of container 1 against
variable surface interface 40. This action provides a large area of
contact of variable surface interface 40 with container 1, which
enhances conductive heat transfer.
[0038] FIG. 2 shows a front view of the embodiment in FIG. 1.
Thermoelectric assembly 50 has an air moving mechanism 56 that is
typically a low power, high efficiency fan. A power line 58
connects to thermoelectric assembly 50 to power both air moving
mechanism 56 and thermoelectric module 52. Power line 58 may be
connected to any power source that provides the required power to
operate Thermoelectric-based container holder 10. Examples of
acceptable power connections include a USB port, a solar panel, one
or more batteries, household service, and vehicle power source,
etc. Power may be DC or AC with the appropriate power control
circuit. Air moving mechanism 56 is not necessary but relying on
unassisted convection to move air over the heat sink will provide
less efficient thermal cooling/heating than using forced
convection. Instead of forced convection with ambient air, air
moving mechanism 56 may also be connected to an HVAC system of a
home, auto or other environment, or other fluid or conductive means
available. As can be seen from FIG. 2, variable surface interface
40 covers a large portion of the outside surface of container 1
that is to be cooled/heated. Receptacle 20 may also be configured
with a receptacle bottom extension 30 that would fit into existing
cup holders. This embodiment would convert an existing cup holder
to a thermoelectrically cooled or heated cup holder by simply
connecting the Thermoelectric-based container holder 10 to a power
source.
[0039] Turning now to FIG. 3, there is shown a top plan view of
another embodiment of the Thermoelectric-based container holder 10
of the present invention. Like the embodiment in FIG. 1,
Thermoelectric-based container holder 10 includes a receptacle 20,
a variable surface interface 40 and a thermoelectric assembly 50.
Receptacle 20 has a recess 22 for receiving a container 1' to be
heated or cooled. Variable surface interface 40 is disposed within
receptacle 20 and is configured to flexibly contact and form itself
to an outside surface of container 1'. As can be seen in FIG. 3
when compared to FIG. 1, container 1' has a smaller diameter than
container 1, yet, variable surface interface 40 conforms to the
outside surface of container 1'. It is the biasing mechanism 28
that automatically forces container 1' against variable surface
interface 40 and further accommodates various sizes of the
container to be cooled/heated.
[0040] In this embodiment, thermoelectric assembly 50 is thermally
connected to the outside surface 24, which is in intimate thermal
contact with variable surface interface 40. Unlike FIG. 1,
thermoelectric assembly 50 is directly thermally connected to a
heat or thermal interface block 60, which is optionally connected
to a heat transfer component 62, which, in turn, may also be
optionally connected to a heat interface plate 64 that has good
lateral thermal properties and is thermally connected to either
receptacle 20, variable interface surface 40 or both. It should be
noted that the embodiment illustrated in FIG. 3 is not restrictive
but could have thermal interface block 60 directly connected to
receptacle 20 or connected to heat interface plate 64, etc.
[0041] Thermoelectric assembly 50 includes a thermoelectric module
52 where one side is thermally connected to a heat source, which is
thermal interface block 60 in this embodiment, and the other side
is thermally connected to a heat sink 54. An air moving mechanism
56 is typically mounted to move convection air over heat sink 54 to
remove waste heat from Thermoelectric-based container holder 10. As
in FIG. 1, arrows 3a, 3b and 3c indicate the flow of air.
[0042] FIG. 4 shows a front view of the embodiment in FIG. 3.
Thermoelectric assembly 50 has an air moving mechanism 56 that is
typically a low power, high efficiency fan. A power line 58
connects to thermoelectric assembly 50 to power both air moving
mechanism 56 and thermoelectric module 52. Power line 58 may be
connected to any power source that provides the required power to
operate Thermoelectric-based container holder 10. Examples of
acceptable power connections have been previously disclosed. As
previously discussed, air moving mechanism 56 is not necessary but
relying on unassisted convection to move air over the heat sink
will provide less efficient thermal cooling/heating than using
forced convection. As can be seen from FIG. 4, variable surface
interface 40 covers a large portion of the outside surface of
container 1 that is to be cooled/heated. Receptacle 20 may also be
configured with a receptacle bottom extension 30 that would fit
into existing cup holders.
[0043] FIG. 5 shows a multiple receptacle thermoelectric cooler 100
of the present invention. In this embodiment, Thermoelectric-based
container holder 100 includes a housing 110 containing two
receptacles 20 where each receptacle has a variable surface
interface 40 and a biasing mechanism 28, and a single
thermoelectric assembly 50. Thermoelectric assembly 50 has a
thermoelectric module 52 where one side is thermally connected to a
heat sink 54 and the other side is thermally connected to a thermal
interface block 60. A heat transfer component 62 thermally connects
thermal interface block 60 to heat transfer plate 64, which is in
thermal contact with either receptacle 20 which is in direct
thermal contact with variable surface interface 40, or directly
with variable surface interface 40 itself. As illustrated, heat
transfer plate 64 is thermally connected between receptacle 20 and
heat transfer component 62. Heat transfer plate 64 may be, for
example, a metalized coating, a formable metal plate and the like.
Heat transfer component 62 is preferably a heat pipe for its
ability to be conformed to the outer surface of the holder to
transfer heat over a wide area but may be any material with good
heat transfer properties.
[0044] As illustrated, two containers 1 and 1' having different
diameters can be used with Thermoelectric-based container holder
100. It is anticipated that each receptacle 20 may have its own
thermoelectric assembly 50 for cooling/heating a container 1 that
is placed within recess 22, or that any multiple of receptacles and
thermoelectric assemblies are within the scope of the present
invention. It is further anticipated that a thermal switch could be
incorporated to disconnect one or more of the receptacles 20.
[0045] Turning now to FIGS. 6A and 6B, there is illustrated another
embodiment of the biasing mechanism 28. FIG. 6A shows receptacle 20
with variable surface interface 40 disposed within recess 22 and a
pivotable biasing mechanism 28. Pivotable biasing mechanism 28 has
a lever component 29 with a first lever end 29a and a second lever
end 29b. First lever end 29a extends from a pivot point 29c toward
a bottom portion 22a of recess 22 and positioned to receive contact
from a bottom portion of container 1. Second lever end 29b extends
from pivot point 29c toward a top portion 22b of recess 22 and
positioned to contact and force container 1 into intimate thermal
contact with variable surface interface 40. FIG. 6B illustrates the
position of lever component 29 and container 1 after container 1
has been inserted into recess 22 of receptacle 20. As can be seen,
container 1 contacts first lever end 29a causing lever component 29
to pivot about pivot point 29a which causes second lever end 29b to
force container 1 against variable surface interface 40, which then
"flows" around a portion of the outside surface of container 1 as
shown in FIG. 1. It should be understood that a two-piece,
spring-loaded lever could be used to eliminate artificial container
size limitations by using a lever described above.
[0046] Turning now to FIGS. 7A and 7B, there is illustrated another
embodiment of the biasing mechanism 28. FIG. 7A shows receptacle 20
with variable surface interface 40 disposed within recess 22 and a
fulcrum biasing mechanism 28. Fulcrum biasing mechanism 28 has a
fulcrum activating component 29 that is mechanically connected to a
plurality of fulcrum arm extensions 29a that connect to receptacle
20. Receptacle 20 in this embodiment is a receptacle having at
least one movable portion 20a even though the embodiment
illustrated has two movable portions. Fulcrum activating component
29 is preferably spring loaded and configured for the weight of
container 1. FIG. 7B illustrates the position of fulcrum activating
component 29 and container 1 after container 1 has been inserted
into recess 22 of receptacle 20. As can be seen from FIG. 7B,
container 1 engages fulcrum activating component 29 causing the
plurality of fulcrum arm extensions 29a to force receptacle
portions 20a and variable surface interface 40 against the outside
surface of container 1 and making intimate thermal contact between
variable thermal interface 40 and container 1. Arrows 29b indicate
the relative action of plurality of fulcrum arm extensions 29a that
are connected to receptacle portions 20a.
[0047] Turning now to FIG. 8, there is illustrated another
embodiment of the Thermoelectric-based container holder of the
present invention. In this embodiment, Thermoelectric-based
container holder 210 includes a variable surface receptacle 220,
which is a combination component that combines the features of the
variable surface interface and the receptacle, and a thermoelectric
assembly 250. Variable surface receptacle 220 may be a
semi-flexible, resilient and/or elastic casing containing a
thermally conductive fluid or gel or it may be a foam material with
or without an outer layer of more rigid foam or other material to
provide the support structure for the Thermoelectric-based
container holder 210. Further, the casing may be made of a
combination of materials where the outside material provides
relative structure to the holder while material within the
receptacle is more flexible/resilient to allow the variable surface
receptacle to conform to the outside surface of the container to be
cooled/heated.
[0048] Variable surface receptacle 220 is configured with a recess
230 for receiving a container 1 to be cooled/heated. Optionally,
the surface 223 of recess 230 may be metallized to enhance lateral
thermal spreading. A thermoelectric assembly 250 as previously
described is thermally connected to variable surface receptacle 220
and a cup holder adapter may optionally be connected to the bottom
of variable surface receptacle 220. Variable surface receptacle 220
may also be formed of a foam material having the required thermally
conductive characteristics along with the structural resiliency and
rigidity to perform the functions required (e.g., an
expandable/stretchable receptacle capable of receiving various
sizes of a container to be cooled/heated within a predefined size
range).
[0049] FIGS. 9A and 9B illustrate the present invention showing
another embodiment Thermoelectric-based container holder 310.
Thermoelectric-based container holder 310 includes a receptacle
320, a variable surface interface 340, and a thermoelectric
assembly 350. The difference with this embodiment is that variable
surface interface 340 is positioned on the bottom of receptacle
320. Variable surface interface 340 may optionally include a wall
portion that accommodates the flow of the variable surface
interface up and around the side walls of container 1. FIG. 9B
illustrates the change in variable surface interface 340 and how it
flows around the side walls of container 1 when container 1 is
fully inserted into receptacle 320. In this type of embodiment, it
is beneficial to have the thermoelectric module 352 thermally
connected to the bottom of receptacle 320. It should be understood
that variable surface interface 340 may form the bottom of the
receptacle 320 and be directly connected to thermoelectric module
352.
[0050] FIGS. 10A and 10B illustrate the thermoelectric-based
container cooler in its most simplest configuration.
Thermoelectric-based container holder 410 includes a variable
surface interface 440 and a thermoelectric assembly 450. As can be
seen, this is primarily a bottom container heater. FIG. 10B
illustrates the forming capability of the variable surface
interface 440 to conform to the bottom of container 1 even when
container 1 has a concave portion.
[0051] FIGS. 11A and 11B illustrate a configuration of
thermoelectric-based container holder 510. Thermoelectric-based
container holder 510 includes a variable surface interface 540 in
the form of a ring where a portion of the outside surface of
variable surface interface is thermally connected to a side portion
521 of a support structure 520. Even though support structure 520
is shown as a cylindrical can, it should be understood that support
structure 520 may be a plate with a curved portion to accommodate
the "ring" structure of the variable surface interface 540, or a
curved wall, or a cylinder with out a bottom, etc. A thermoelectric
assembly 550 is thermally connected to support structure 520 where
the thermoelectric module 552 is directly or indirectly thermally
connected to support structure 520. It should be understood that
thermoelectric module 552 may also be directly thermally connected
to variable surface interface 540. FIG. 11 B shows the container
inserted into the variable support interface 540 and is supported
by it since the inside diameter of the ring structure is smaller
than the outside diameter of container 1.
[0052] The Thermoelectric-based container holder 10 of the present
invention has a thermally conductive interface that can conform to
the surface of various containers and can be configured as a
stand-alone unit or as a device that fits into existing console
enclosures. It is versatile in that it can be adapted for use is
various applications including, but not limited to, car consoles,
furniture consoles, after-market accessories, desk/table top units,
etc. The Thermoelectric-based container holder 10 can also be
configured as a portable unit, a console unit, a single receptacle
unit, or a multiple receptacle unit. It is further contemplated
that the variable surface interface 40 may optionally form a
portion of the inner surface to the receptacle 20 with the other
side of variable surface interface 40 being in direct or indirect
thermal contact with the thermoelectric assembly 50. It is further
contemplated that the Thermoelectric-based container holder 10 may
optionally be configured to operate in either a cooling mode or a
heating mode by using a switch to change the electrical polarity
supplied to the thermoelectric module 52. It is also further
contemplated that the Thermoelectric-based container holder 10 may
optionally include a temperature control unit or a variable
temperature control unit to control the amount of thermal heating
or cooling being transferred.
[0053] Although the preferred embodiments of the present invention
have been described herein, the above description is merely
illustrative. Further modification of the invention herein
disclosed will occur to those skilled in the respective arts and
all such modifications are deemed to be within the scope of the
invention as defined by the appended claims.
* * * * *