U.S. patent application number 12/237061 was filed with the patent office on 2009-01-15 for connector assembly for an implantable medical device and process for making.
This patent application is currently assigned to Medtronic, Inc.. Invention is credited to Brian R. Burwick, Jay Lahti, John E. Nicholson, Andrew J. Ries, Gregory A. Theis, Bryan J. Zart.
Application Number | 20090017700 12/237061 |
Document ID | / |
Family ID | 37948703 |
Filed Date | 2009-01-15 |
United States Patent
Application |
20090017700 |
Kind Code |
A1 |
Zart; Bryan J. ; et
al. |
January 15, 2009 |
Connector Assembly For An Implantable Medical Device and Process
For Making
Abstract
A connector circuit assembly for use in an implantable medical
device, and a method of making the assembly that includes a core
portion formed of a thermoplastic material using either an
injection molding process or a machining process. This core portion
is adapted to be fitted with at least one electrically-conductive
circuit component such as a connector member, a set-screw block, or
a conductive jumper member. In one embodiment of the invention, the
core portion includes multiple receptacles or other spaces that are
adapted to be loaded with the various circuit components. The core
assembly is positioned into a second-shot mold assembly, and a
second thermoplastic material is injected into the mold so that the
second thermoplastic material extends over and adheres to the core
portion and the circuit component.
Inventors: |
Zart; Bryan J.; (Shakopee,
MN) ; Burwick; Brian R.; (Guentersville, AL) ;
Ries; Andrew J.; (Lino Lakes, MN) ; Nicholson; John
E.; (Blaine, MN) ; Lahti; Jay; (Apple Valley,
MN) ; Theis; Gregory A.; (St. Joseph, WI) |
Correspondence
Address: |
HUNTON & WILLIAMS LLP;INTELLECTUAL PROPERTY DEPARTMENT
1900 K STREET, N.W., SUITE 1200
WASHINGTON
DC
20006-1109
US
|
Assignee: |
Medtronic, Inc.
Minneapolis
MN
|
Family ID: |
37948703 |
Appl. No.: |
12/237061 |
Filed: |
September 24, 2008 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
11842704 |
Aug 21, 2007 |
|
|
|
12237061 |
|
|
|
|
11612278 |
Dec 18, 2006 |
|
|
|
11842704 |
|
|
|
|
11612278 |
Dec 18, 2006 |
|
|
|
11842704 |
|
|
|
|
10966636 |
Oct 15, 2004 |
7175482 |
|
|
11612278 |
|
|
|
|
09885354 |
Jun 20, 2001 |
6817905 |
|
|
10966636 |
|
|
|
|
60212746 |
Jun 20, 2000 |
|
|
|
Current U.S.
Class: |
439/736 ;
29/874 |
Current CPC
Class: |
Y10T 29/49204 20150115;
H01R 13/504 20130101; Y10T 29/4922 20150115; H05K 1/0284 20130101;
Y10S 439/905 20130101; H01R 13/405 20130101; H01R 43/24 20130101;
H05K 3/202 20130101; A61N 1/05 20130101; A61N 1/3752 20130101; Y10T
29/49208 20150115; H01R 43/18 20130101; Y10T 29/49146 20150115 |
Class at
Publication: |
439/736 ;
29/874 |
International
Class: |
H01R 13/405 20060101
H01R013/405; H01R 43/16 20060101 H01R043/16 |
Claims
1. A method of fabricating a modular header for providing
electrical connections between an array of feed-through pins
extending through a wall of a hermetically sealed enclosure of an
implantable medical device and lead connector receptacles within a
modular header assembled to said device comprising: (a) providing a
pre-formed molded header module having paths therein to accept and
incorporate a set of flexible conductors and connector blocks
associated with lead connector receptacles; (b) providing a
separate set of intermediate conjoined flexible conductors each
having a free end and a fixed end, wherein the fixed ends of the
flexible conductors are connected to a common element and
assembling said set of conductors into said paths in said
pre-formed molded header module attaching the free ends thereof to
corresponding connector blocks provided in said molded header
module; (c) performing an over-molding operation to incorporate and
hermetically seal said conductors into said header structure; (d)
removing said common element to provide an array of spaced
connectors configured and positioned to match and mate with said
array of feed-through pins when said header is assembled to a
compatible corresponding hermetically sealed enclosure; (e)
assembling said header module to said hermetically sealed enclosure
and connecting said flexible conductors to said feed-through pins;
and (f) backfilling any open interface volume between said header
module and said hermetically sealed enclosure after connecting said
flexible conductors to said feed-through pins.
2. A method of fabricating a modular header as in claim 1 including
testing the integrity of the connectors traversing said header
prior to assembling said header on a corresponding hermetically
sealed enclosure of an implantable medical device.
3. A method of fabricating a modular header as in claim 1 wherein
said flexible conductors are wrapped around said feed-through pins
and welded thereto.
4. A method as in claim 1 wherein said paths in said pre-formed
molded header include recessed channels.
5. A modular header for making electrical connections between an
array of feed-through pins extending through a wall of a
hermetically sealed enclosure of an implantable medical device and
lead connector receptacles within said modular header, said device
comprising: (a) a pre-formed molded header module having paths
therein to accept and incorporate a set of flexible conductors and
connector blocks; (b) a separate set of intermediate flexible
conductors each having a free end assembled into said paths in said
pre-formed molded header module, said free ends being attached to
corresponding connector blocks located in said molded header
module; (c) a layer of over molding incorporating and sealing said
conductors into said header structure; and (d) wherein said
flexible conductors each have an end opposite the free end provided
with a connecting device designed to connect with a feed-through
pin in a corresponding hermetically sealed medical device enclosure
and wherein one or more of said flexible conductors wrap around
said pre-formed molded header module.
6. A modular header as in claim 5 wherein said header includes
recessed conductor channels.
7. A modular header as in claim 5 wherein said flexible conductors
connect to connector receptacles located on a common side of said
pre-formed molded header module.
8. A modular header as in claim 7 wherein said lead connector
receptacles are arranged in a row in spaced alignment.
9. A modular header as in claim 5 wherein said header is connected
with a hermetically sealed enclosure of an implantable medical
device and wherein said flexible conductors match and are connected
to a corresponding array of feed-through pins protruding from said
enclosure wherein said connections are located in a recess provided
in said modular header and wherein said recess is backfilled with a
medical grade polymer.
10. A method of making a connector assembly for providing
electrical connections between a feed-through pattern of an
implantable medical device and lead receptacles within a connector
assembly coupled to said device comprising: (a) providing a core
portion having channel guides therein to accept and incorporate a
circuit member and set-screw blocks associated with lead
receptacles; (b) providing a circuit member comprising joined
deformable conductive finger elements each having a free end and a
joined end, wherein the joined ends of the deformable conductive
finger elements are mechanically and electrically connected via
conductive traces, and coupling said circuit member into said
channel guides in said core portion attaching the free ends thereof
to corresponding set-screw blocks provided in said core portion;
(c) performing an over-molding operation to encapsulate said
conductive finger elements in said connector assembly; (d) cutting
away said conductive traces to provide connector pads positioned to
connect with said feedthrough pattern when said connector assembly
is coupled to a compatible corresponding implantable medical
device; (e) assembling said connector assembly to said implantable
medical device and connecting said deformable conductive finger
elements to said feedthrough pattern; and (f) overlaying medical
adhesive on the connections between said connector assembly and
said implantable medical device after connecting said deformable
conductive finger elements to said feedthrough pattern.
11. A method of making a connector assembly as in claim 10,
including testing the integrity of the connectors traversing said
connector assembly prior to coupling said connector assembly to a
corresponding implantable medical device.
12. A method of making a connector assembly as in claim 10, wherein
said deformable conductive finger elements are connected to said
feedthrough pattern and welded thereto.
13. A method as in claim 10, wherein said channel guides in said
core portion comprise recessed channels.
14. A connector assembly for making electrical connections between
a feedthrough pattern of an implantable medical device and lead
receptacles within said connector assembly, said device comprising:
(a) a core portion having channel guides therein to accept and
incorporate a circuit member and set-screw blocks; (b) said circuit
member comprising deformable conductive finger elements each having
a free end assembled into said channel guides in said core portion,
said free ends being coupled to corresponding set-screw blocks
located in said connector assembly; (c) a second shot of
overmolding encapsulating said finger elements in said connector
assembly; and (d) wherein said deformable conductive finger
elements each have an end opposite the free end provided with a
connector pad designed to connect with a feedthrough pattern in a
corresponding implantable medical device and wherein one or more of
said deformable conductive finger elements wrap around said core
portion.
15. A connector assembly as in claim 14, wherein said connector
assembly comprises recessed channel guides.
16. A connector assembly as in claim 14, wherein said deformable
conductive finger elements connect to lead receptacles located on a
common side of said core portion.
17. A connector assembly as in claim 16, wherein said lead
receptacles are arranged in a row in spaced alignment.
18. A connector assembly as in claim 14, wherein said connector
assembly is coupled to an implantable medical device and wherein
said deformable conductive finger elements match and are connected
to a corresponding feedthrough pattern on said implantable medical
device, wherein said connections are located in a recess provided
in said connector assembly and wherein said recess is overlaid with
a medical adhesive.
19. An apparatus, comprising: a pre-molded header that is
biocompatible and that defines a first channel and a second
channel, the pre-molded header including a first terminal in
electrical communication with a first lead terminal of the
pre-molded header; a flex harness conformed to the pre-molded
header, the flex harness including a first conductor including a
first connection terminal and a second conductor including a second
connection terminal, the first and second conductors being
physically coupled by a common harness portion, the flex harness
including a pre-formed alignment such that the first conductor is
disposed in the first channel and the second conductor is disposed
in the second channel, with the first conductor defining a
conductive path between the first terminal and the first connection
terminal; and an over-molded layer that is biocompatible and
disposed over the pre-molded header and the flex harness such that
the first conductor and the second conductor are disposed between
the pre-molded header and the over-molding layer.
20. The apparatus of claim 19, wherein a conductive path extends
between the first connection terminal and the first lead terminal
internal to the pre-molded header.
21. The apparatus of claim 19, further comprising an implantable
device including a first pin and a second pin, with the first
connection terminal crimped to the first pin, and the second
connection terminal crimped to the second pin.
22. The apparatus of claim 21, wherein the first connection
terminal is welded to the first pin and the second connection
terminal is welded to the second pin.
23. The apparatus of claim 21, wherein the pre-molded header and
the first over-molded layer define a backfill recess, with the
first connection terminal and the second connection terminal being
disposed the in the backfill recess, and further comprising
backfill disposed in the backfill recess.
24. The apparatus of claim 21, further comprising a first lead
coupled to the first lead terminal.
25. The apparatus of claim 24, wherein the first lead terminal is
female, and the first lead include a male terminal which is
disposed at least partially in the first lead terminal.
26. The apparatus of claim 19, wherein the terminal is a first
connection terminal is a first spade terminal and the second
connection terminal is a second spade terminal.
27. The apparatus of claim 26, wherein the first spade terminal and
the second spade terminal each include stainless steel.
28. The apparatus of claim 26, wherein the first spade terminal and
the second spade terminal each are substantially planar and are
coplanar.
29. An apparatus, comprising: a pre-molded header that is
biocompatible and that defines a plurality of lead terminals in a
row, the pre-molded header defining an exterior surface with a
first terminal in electrical communication with a first lead
terminal of the plurality of lead terminals, and with a second
terminal in electrical communication with a second lead terminal of
the plurality of lead terminals; a harness coupled to the
pre-molded header, the harness including a first conductor
including a first connection terminal and a second conductor
including a second connection terminal, the first and second
conductors being physically coupled by a common harness portion,
the harness including a pre-formed alignment such that the first
conductor is aligned to the first terminal and the second conductor
is aligned to the second terminal, with the first conductor
defining a conductive path between the first terminal and the first
connection terminal; and an over-molded layer that is biocompatible
and disposed over the pre-molded header and the harness such that
the first conductor and the second conductor are disposed between
the pre-molded header and the over-molding layer.
30. The apparatus of claim 29, wherein the first terminal includes
a block connection.
31. The apparatus of claim 29, wherein the common harness portion
is a removable common harness portion adapted to be removed from
the first conductor and to be removed from the second
conductor.
32. An apparatus, comprising: a pre-molded header that is
biocompatible and that defines a first channel and a second
channel, the pre-molded header including a first terminal in
electrical communication with a first lead terminal of the
pre-molded header; a flex harness conformed to the pre-molded
header, the flex harness including a first conductor including a
first connection terminal and a second conductor including a second
connection terminal, the first and second conductors being
physically coupled by a common harness portion, the flex harness
including a pre-formed alignment such that the first conductor is
disposed in the first channel and the second conductor is disposed
in the second channel, with the first conductor defining a
conductive path between the first terminal and the first connection
terminal; and an over-molded layer that is biocompatible and
disposed over the pre-molded header and the flex harness such that
the first conductor and the second conductor are disposed between
the pre-molded header and the over-molding layer.
33. The apparatus of claim 32, wherein a conductive path extends
between the first terminal and the first lead terminal internal to
the pre-molded header.
34. The apparatus of claim 32, wherein the common harness portion
is a removable common harness portion adapted to be removed from
the first conductor and to be removed from the second
conductor.
35. A method, comprising: molding a biocompatible material over an
internal conductor to define a pre-molded header that includes a
first channel, a second channel and a lead terminal to receive a
lead, the internal conductor electrically coupling the lead
terminal to a first terminal; pre-forming a flex conductor harness
including a first conductor that includes a first connection
terminal and a second conductor that includes a second connection
terminal, with the first conductor and the second conductor coupled
at a common portion such that the first conductor is pre-formed to
conform, in alignment, to the first channel, and the second
conductor is pre-formed to conform, in alignment, to the second
channel; wrapping the flex conductor harness around the pre-molded
header such that a first conductor of the flex conductor harness is
disposed in the first channel and a second conductor of the flex
conductor harness is disposed in the second channel; electrically
coupling the first conductor to the first terminal; and
over-molding at a first pressure an over-molded layer of
biocompatible material over the first terminal, the first conductor
and the second conductor, with the first connection terminal and
the second connection terminal being exposed through an opening in
the over-molded layer.
36. The method of claim 35, further comprising: wrapping the first
connection terminal around a first pin of an implantable device;
wrapping the second connection terminal around a second pin of the
implantable device; and welding the first terminal to the first pin
and the second connection terminal to the second pin by
automatically adjusting a welding machine between a first welding
position and a second welding position along a single axis.
37. The method of claim 36, further comprising backfilling, under a
second pressure which is lower than the first pressure, a recess
defined by the implantable device, the pre-molded header, and the
over-molded layer, and containing the first connection terminal and
the second connection terminal.
38. The method of claim 36, further comprising laser welding the
first connection terminal to the first pin and laser welding the
second connection terminal to the second pin.
39. The method of claim 38, further comprising adjusting a laser
welder along a single axis to weld the first connection terminal to
the first pin and to weld the second connection terminal to the
second pin.
40. The method of claim 38, further comprising implanting the
implantable device without further coating the implantable
device.
41. An apparatus, comprising: means for electrically and physically
coupling a first lead terminal to a first terminal; means for
coupling to a pin of an implantable device and for electrically
coup the pin to the first terminal; and an over-molded layer that
is biocompatible and disposed over the means for electrically and
physically coupling a first lead terminal to a first terminal and
the means for coupling to a pin of an implantable device.
42. The apparatus of claim 41, wherein the means for electrically
and physically coupling a first lead terminal to a first terminal
include a pre-molded header that is biocompatible and that defines
a first channel and a second channel, the pre-molded header
including a first terminal in electrical communication with a first
lead terminal of the pre-molded header.
43. The apparatus of claim 42, wherein the means for coupling to a
pin of an implantable device include a flex harness that is
biocompatible, one-piece and includes a first conductor with a
first connection terminal and a second conductor with a second
connection terminal, with the first conductor and the second
conductor being physically interconnected by a common harness
portion, the flex harness conformed to the pre-molded header such
that the first conductor is disposed in the first channel and the
second conductor is disposed in the second channel.
44. An apparatus, comprising: a core portion that is biocompatible
and that defines a first channel guide and a second channel guide,
the core portion including a first set-screw block in electrical
communication with a first lead receptacle of the core portion; a
circuit member conformed to the core portion, the circuit member
including a first conductive finger element comprising a first
connector pad and a second conductive finger element comprising a
second connector pad, the first and second conductive finger
elements being mechanically connected via conductive traces, the
circuit member comprising a pre-formed alignment such that the
first conductive finger element is disposed in the first channel
guide and the second conductive finger element is disposed in the
second channel guide, wherein the first conductive finger element
defines a conductive path between the first terminal and the first
connector pad; and an overmolded layer that is biocompatible and
disposed over the core portion and the circuit member such that the
first conductive finger element and the second conductive finger
element are disposed between the core portion and the overmolded
layer.
45. The apparatus of claim 44, wherein a conductive path extends
between the first set-screw block and the first lead receptacle
internal to the core portion.
46. The apparatus of claim 44, further comprising an implantable
device including a first connector and a second connector, with the
first connector pad soldered or welded to the first connector, and
the second connector pad soldered or welded to the second
connector.
47. The apparatus of claim 46, wherein the first connector pad is
welded to the first connector and the second connector pad is
welded to the second connector.
48. The apparatus of claim 46, wherein the core portion and the
overmolded layer define a recess, with the first connector pad and
the second connector pad being disposed the in the recess, and
further comprising medical adhesive disposed in the recess.
49. The apparatus of claim 46, further comprising a first medical
electrical lead coupled to the first lead receptacle.
50. The apparatus of claim 49, wherein the first lead receptacle is
female, and the first medical electrical lead comprises a male pin
or ring which is disposed at least partially in the first lead
receptacle.
51. The apparatus of claim 44, wherein the first connector pad is a
first spade connector and the second connector pad is a second
spade connector.
52. The apparatus of claim 51, wherein the first spade connector
and the second spade connector each comprise stainless steel.
53. The apparatus of claim 51, wherein the first spade connector
and the second spade connector each are substantially planar and
are coplanar.
54. An apparatus, comprising: a core portion that is biocompatible
and that defines a plurality of lead receptacles in a row, the core
portion defining an exterior surface with a first set-screw block
in electrical communication with a first lead receptacle of the
plurality of lead receptacles, and with a second set-screw block in
electrical communication with a second lead receptacle of the
plurality of lead receptacles; a circuit member coupled to the core
portion, the circuit member comprising a first conductive finger
element including a first connector pad and a second conductive
finger element comprising a second connector pad, the first and
second conductive finger elements being mechanically connected via
conductive traces, the circuit member comprising a pre-formed
alignment such that the first conductive finger element is aligned
to the first set-screw block and the second conductive finger
element is aligned to the second set-screw block, with the first
conductive finger element defining a conductive path between the
first set-screw block and the first connector pad; and an
overmolded layer that is biocompatible and disposed over the core
portion and the circuit member such that the first conductive
finger element and the second conductive finger element are
disposed between the core portion and the overmolded layer.
55. The apparatus of claim 54, wherein the first set-screw block
comprises a block connection.
56. The apparatus of claim 54, wherein the conductive traces are
removable conductive traces adapted to be removed from the first
conductive finger element and to be removed from the second
conductive finger element.
57. An apparatus, comprising: a core portion that is biocompatible
and that defines a first channel guide and a second channel guide,
the core portion comprising a first set-screw block in electrical
communication with a first lead receptacle of the core portion; a
circuit member conformed to the core portion, the circuit member
comprising a first conductive finger element comprising a first
connector pad and a second conductive finger element comprising a
second connector pad, the first and second conductive finger
elements being mechanically connected via conductive traces, the
circuit member comprising a pre-formed alignment such that the
first conductive finger element is disposed in the first channel
guide and the second conductive finger element is disposed in the
second channel guide, with the first conductive finger element
defining a conductive path between the first set-screw block and
the first connector pad; and an overmolded layer that is
biocompatible and is disposed over the core portion and the circuit
member such that the first conductive finger element and the second
conductive finger element are disposed between the core portion and
the overmolded.
58. The apparatus of claim 57, wherein a conductive path extends
between the first set-screw block and the first lead receptacle
internal to the core portion.
59. The apparatus of claim 57, wherein the conductive traces are
removable conductive traces adapted to be removed from the first
conductive finger element and to be removed from the second
conductive finger element.
60. A method, comprising: molding a biocompatible material over a
jumper to define a core portion that includes a first channel
guide, a second channel guide, and a lead receptacle to receive a
medical electrical lead, the jumper electrically coupling the lead
receptacle to a first set-screw block; pre-forming a circuit member
comprising a first conductive finger element that comprises a first
connector pad and a second conductive finger element that includes
a second connector pad, wherein the first conductive finger element
and the second conductive finger element are coupled via conductive
traces such that the first conductive finger element is pre-formed
to conform, in alignment, to the first channel guide, and the
second conductive finger element is pre-formed to conform, in
alignment, to the second channel guide; wrapping the circuit member
around the core portion such that a first conductive finger element
of the circuit member is disposed in the first channel guide and a
second conductive finger element of the circuit member is disposed
in the second channel guide; electrically coupling the first
conductive finger element to the first set-screw block; and
overmolding at a first pressure an overmolded layer of
biocompatible material over the first set-screw block, the first
conductive finger element, and the second conductive finger
element, wherein the first connector pad and the second connector
pad are exposed through an opening in the overmolded layer.
61. The method of claim 60, further comprising: wrapping the first
connector pad around a first connector of an implantable device;
wrapping the second connector pad around a second connector of the
implantable device; and welding the first connector pad to the
first connector and the second connector pad to the second
connector by automatically adjusting a welding machine between a
first welding position and a second welding position along a single
axis.
62. The method of claim 61, further comprising backfilling, under a
second pressure which is lower than the first pressure, a recess
defined by the implantable device, the core portion, and the
overmolded layer, and comprising the first connector pad and the
second connector pad.
63. The method of claim 61, further comprising laser welding the
first connector pad to the first connector and laser welding the
second connector pad to the second connector.
64. The method of claim 63, further comprising adjusting a laser
welder along a single axis to weld the first connector pad to the
first connector and to weld the second connector pad to the second
connector.
65. The method of claim 63, further comprising implanting the
implantable device without further coating the implantable
device.
66. An apparatus, comprising: means for electrically and physically
coupling a first lead receptacle to a first set-screw block; means
for coupling to a connector of an implantable device and for
electrically coupling the connector to the first set-screw block;
and an overmolded layer that is biocompatible and disposed over the
means for electrically and physically coupling a first lead
receptacle to a first set-screw block, and the means for coupling
to a connector of an implantable device.
67. The apparatus of claim 66, wherein the means for electrically
and physically coupling a first lead receptacle to a first
set-screw block comprises a core portion that is biocompatible and
that defines a first channel guide and a second channel guide, the
core portion including a first set-screw block in electrical
communication with a first lead receptacle of the core portion.
68. The apparatus of claim 67, wherein the means for coupling to a
connector of an implantable device comprises a circuit member that
is biocompatible, one-piece, and that comprises a first conductive
finger element with a first connector pad and a second conductive
finger element with a second connector pad, wherein the first
conductive finger element and the second conductive finger element
are physically interconnected by conductive traces, the circuit
member conformed to the core portion such that the first conductive
finger element is disposed in the first channel guide and the
second conductive finger element is disposed in the second channel
guide.
Description
RELATED APPLICATIONS
[0001] This application is a continuation of U.S. patent
application Ser. No. 11/842,704, filed Aug. 21, 2007, and U.S.
patent application Ser. No. 11/612,278, filed on Dec. 18, 2006,
both entitled, "CONNECTOR ASSEMBLY FOR AN IMPLANTABLE MEDICAL
DEVICE AND PROCESS FOR MAKING," both to Zart et al. U.S. patent
application Ser. No. 11/842,704 is a continuation of U.S. patent
application Ser. No. 11/612,278, which is a continuation of U.S.
Pat. No. 7,175,482, filed on Oct. 15, 2004, entitled "CONNECTOR
ASSEMBLY FOR AN IMPLANTABLE MEDICAL DEVICE AND PROCESS FOR MAKING",
to Zart et al., which is a divisional of U.S. Pat. No. 6,817,905,
filed on Jun. 20, 2001, entitled "CONNECTOR ASSEMBLY FOR AN
IMPLANTABLE MEDICAL DEVICE AND PROCESS FOR MAKING", to Zart et al.,
which claims priority to U.S. Provisional Application No.
60/212,746, all of which are incorporated herein by reference in
their entireties.
FIELD OF THE INVENTION
[0002] This invention relates to a process for molding a circuit
component; and more particularly, to a two-shot thermoplastic
molding process for manufacturing an electrical connector.
BACKGROUND OF THE INVENTION
[0003] Electrical connectors and other similar electrical
components often include electrical conductors embedded within an
insulating housing to isolate the conductor from the surrounding
environment. Embedding the conductor within a housing protects the
conductor from damage, and also prevents the delivery of an
electrical shock. Electrical isolation is particularly important
when the connector is to be coupled to an implantable medical
device such as a pacemaker or defibrillation system.
[0004] One way to form an electrical connector having conductors
embedded therein is to mold a solid set-screw block using injection
molding techniques. After the molding is completed, the surface of
the set-screw block is formed to include channels. Wires or other
types of connectors are pressed into the channels. Generally, each
end of each wire is welded to some type of electrical contact. An
insulating adhesive is then applied over the wires and channels. If
the connector is to be used with an implantable medical device, a
medical adhesive is often employed for this purpose. The adhesive
is cured to form a protective, insulating layer that isolates the
wires from external elements.
[0005] Although the afore-mentioned method is relatively
straight-forward, it requires manual application of the adhesive.
This introduces variables into the manufacturing process. If the
adhesive is not properly dispensed, some portions of the conductor
may become exposed. As a result, shorts may develop between
adjacent conductors. Additionally, a conductor may come in contact
with external elements, causing degradation and loss of conductive
capabilities. Moreover, because a manual process is employed, the
manufacturing mechanism is more time-consuming and expensive.
[0006] An alternative approach to the use of adhesives involves the
positioning of one or more conductors within a mold in some
predetermined orientation. An insulating plastic is then introduced
into the mold to encapsulate the conductors. The plastic hardens to
provide the necessary insulating layer around the conductors. While
this process eliminates the variables associated with a manual
step, it is nevertheless difficult to implement with other than a
simple design. This is because the introduction of the plastic into
the mold at high pressures generally causes the position of the
conductors to shift. This may result in shorts between multiple
conductors, or conversely, may result in loss of a desired
electrical connection. While plastic injection systems of this
nature generally include mechanisms to hold the conductors in place
during the injection process, the process is more prone to failure
than other methods because shifting of components may occur
regardless of the efforts to prevent it. Additionally, a more
complex tooling system is required to implement the process.
Finally, the difficulty associated with maintaining isolation
between multiple conductors places limits on the assembly
dimensions. That is, an assembly cannot be made too small because
shorts will occur between closely spaced conductors that shift
during the mold injection process.
[0007] Yet another approach used to create connector assembly
includes use of a two-step thermoset casting process. A first mold
is used to receive a thermoset plastic material such as an epoxy.
As is known in the art, a thermoset plastic hardens because of a
chemical reaction occurring between the various components of the
plastic material. After the curing process is complete, the first
molded connector element is removed from the mold. Conductors are
selectively positioned on the exterior of this first element. The
first element is then positioned within a second mold and a
thermoset material is selectively applied to the first element to
encapsulate the conductors.
[0008] The two-step thermoset process provides a mechanism for
embedding conductors within a connector in a more precise manner.
This is because the first element holds the conductors in position
while the second molding step is performed. However, because
thermoset material requires a relatively long time to cure, the
process is slow. The manufacture time is increased since two serial
curing steps are required. Moreover, because the final products may
not be removed from the molds until the curing is completed, many
molds must be employed to increase output.
[0009] What is needed, therefore, is an improved mechanism for
creating more complex connector structures using a faster
production cycle.
SUMMARY OF THE INVENTION
[0010] The current invention provides an improved circuit assembly
for use in an implantable medical device, and a method of making
the assembly. The circuit assembly includes a core portion formed
of a thermoplastic material using either an injection molding
process or a machining process. This core portion is adapted to be
fitted with at least one electrically conductive circuit component
such as a connector member, a set-screw block, or a conductive
jumper member. In one embodiment of the invention, the core portion
includes multiple receptacles or other spaces that are adapted to
be loaded with the various circuit components. Core portion may
further be provided with groove and ridge members designed to
position and retain conductive jumper members at predetermined
locations at the surface of the core portion. Such conductive
jumpers may be welded or soldered to a respective one of these
circuit components to form electrical contacts between the jumpers
and the respective circuit component.
[0011] After the electrically conductive circuit components are
positioned in this manner with respect to the core portion, this
core assembly is prepared for an overmolding process. This involves
ensuring that certain portions of the core assembly will be
protected from the flow of thermoplastic material during a
subsequent overmold process. This process may include loading
bushings into various connector members and/or set-screw blocks of
the core element assembly.
[0012] When the core assembly has been prepared for the overmolding
process, it is loaded into a second-shot mold. In one embodiment of
the invention, the core assembly is aligned and retained within a
cavity of the mold by utilizing slidable members that are provided
by the mold, and that are adapted to engage the core assembly.
Positioning of the core assembly within the mold cavity may further
be accomplished using pegs that are adapted to engage various
corresponding apertures of the core element assembly.
[0013] During the overmold process, a second-shot of thermoplastic
material is injected into the mold. This thermoplastic material is
heated to a temperature at, or above, the melting point of the
material. This thermoplastic material is hot enough to create a
bond between the core portion and the overmold material. To achieve
this, the mass of the core element as compared to that of the
overmold material is made as small as possible so that the heat
energy from the mold is able to adequately heat the core portion.
In one embodiment, the mass of the core portion is less than fifty
percent of the mass of the overmold material, and preferably is
less than thirty percent. Bonding may further be enhanced by
providing ridges on the surface of the core portion that are melted
during the overmold process and thereafter integrated with the
overmold material. The bonding may also be facilitated by
pre-heating the core portion prior to injecting the second shot of
thermoplastic material into the mold.
[0014] In one embodiment of the invention, a hermetically-sealed
connector assembly is provided for use with an implantable medical
device (IMD) such as a cardioverter/defibrillator, a pacemaker, or
any other type IMD that is adapted to coupled to medical electrical
leads. Because the connector assembly is manufactured using
thermoplastic materials, the manufacturing process may be completed
in a much shorter amount of time than similar assemblies formed of
thermoset materials. The connector assembly includes one or more
connectors that are adapted to couple mechanically and/or
electrically to the pin or ring connectors of a medical electrical
lead. Such connector members may conform to various standards for
medical electrical leads, such as IS-1 and DF-1 standards.
[0015] Other aspects and advantages of the current inventive
circuit assembly system and method of making the circuit assembly
system will be apparent from the drawings and accompanying detailed
description of the invention embodiments.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] FIG. 1 is a front perspective view of a connector core
element of one embodiment of the current invention.
[0017] FIG. 2 is a front perspective view of a core member loaded
with respective set-screw blocks and connector members.
[0018] FIG. 3 is a back perspective view of an alternative
embodiment of the core member.
[0019] FIG. 4 is a bottom perspective view of core member.
[0020] FIG. 5 is side perspective view of an alternative embodiment
of the circuit member.
[0021] FIG. 6 is side perspective view of an alternative embodiment
of the core element adapted to engage the circuit member of FIG.
5.
[0022] FIG. 7 is a side perspective view of circuit member
positioned on the surface of core element.
[0023] FIG. 8 is a front perspective view of an exemplary lead core
assembly.
[0024] FIG. 9 is a perspective view of a core element being
prepared for the overmolding process.
[0025] FIG. 10 is a side perspective view of an alternative
embodiment of a core element which is designed to minimize core
element mass.
[0026] FIG. 11 is a perspective side view of an exemplary connector
assembly formed after injection of the second-shot material.
[0027] FIG. 12 is an alternative embodiment of the second-shot mold
assembly of FIG. 9.
[0028] FIG. 13 is a flowchart of the inventive assembly
process.
[0029] FIG. 14 is a side perspective view of a completed connector
assembly coupled to an implantable medical device (IMD).
DETAILED DESCRIPTION OF THE INVENTION
[0030] FIG. 1 is a front perspective view of a connector core
element 2 of one embodiment of the current invention. Core element
is integrally formed of a biocompatible thermoplastic material,
which may be a polyurethane such as pellathane commercially
available from The Polymer Technology Group (PTG) Incorporated, or
Tecothane.RTM. commercially available from Thermedics Incorporated.
Other polyurethane materials are suitable for use in the current
inventive process, as are other thermoplastic materials such as
polysulfone. In one embodiment, a suitable biocompatible
polyurethane may have a hardness of between 50 D and 90 D (Shore),
and is preferably about 75 D.
[0031] The core element 2 is formed by heating the thermoplastic
material to a temperature that is at, or slightly above, the melt
point. The material is then injected into a primary mold formed
into the desired shape of the core element and allowed to cool.
Cooling is generally completed in between twenty to seventy
seconds. This is much shorter than the curing period for thermoset
materials, which may be as much as one hour. After cooling, core
element 2 is removed from the mold. The removal process involves
opening the mold, which includes an ejection mechanism that
automatically releases the core element.
[0032] Core element 2 may take many different shapes. In one
embodiment, core element includes a structure that supports various
metal piece parts in a stable manner that can be maintained during
a second-shot molding process to be discussed below. In the
embodiment of FIG. 1, core element 2 includes receptacles 4, 6, and
8. Each of the receptacles is adapted to receive a respective
set-screw block, such as set-screw block 10 to be inserted within
receptacle 6, and 12 to be inserted within receptacle 8. Receptacle
4 is adapted to receive a similar set-screw block not shown in FIG.
1 for purposes of simplification. Set-screw blocks may be formed
entirely, or partially, from a conductive material such as MP35N,
stainless steel or titanium.
[0033] The set-screw blocks are loosely maintained within a
respective receptacle by the shape of core element 2 until the
second-shot over-molding process is completed. Each of these
set-screw blocks includes an opening such as opening 16 to receive
a set screw, and a second opening such as opening 17 to receive the
pin or ring connector provided at the proximal end of a medical
lead. A set screw inserted within opening 16 is used to
mechanically couple to a lead connector pin or ring to hold the
lead in place, as will be described further below.
[0034] In an alternative embodiment, the various receptacles needs
not be included and the set-screw blocks may be integrally formed
within the core element by positioning the set-screw blocks with
the primary mold prior to injecting the thermoplastic material to
form core element 2. In this instance, sealing means must be
provided to prevent the thermoplastic from being injected into the
openings of the set-screw blocks. For example, the primary mold
could include peg members adapted to be loaded into the openings of
set-screw blocks so that a tight seal is formed prior to injecting
the thermoplastic into the mold. The pegs would also retain the
set-screw blocks in position during the high-pressure injection
process. Because of the complications associated with maintaining
the set-screw blocks in position during the injection process, the
former embodiment is preferred.
[0035] Returning to FIG. 1, the exemplary embodiment of core
element 2 also includes additional circular receptacles 24 and 26.
Each circular receptacle includes an aperture 25 and 27,
respectively, to receive the connector pin of a medical electrical
lead. For example, during use, a lead connector pin may be inserted
within aperture 27 and further through opening 17. The lead is held
in place by a fastening member inserted within opening 16 of
set-screw block 10 and tightened on the lead pin or ring as is
known in the art.
[0036] In the embodiment shown, each circular receptacle 24 and 26
is adapted to receive a respective connector member such as
connector member 30. This type of connector member may be formed
entirely or partially of a conductive material such as stainless
steel or titanium. Connector member 30 is shown to include a
multi-beam connector (MBC) 32 adapted to couple electrically and
mechanically to a ring connector of a bipolar medical electrical
lead. This type of connector member would support a lead having a
connector conforming to the IS-1 standard, for example. Other types
of connector members may be utilized to form an electrical and/or
mechanical connection, as is known in the art.
[0037] In an alternative embodiment, the connector members may be
eliminated by integrally forming the connectors such as connector
member 30 within core element 2. This may be accomplished by
loading the primary mold with the connectors prior to injecting the
thermoplastic. As discussed above with respective to the set-screw
blocks, some mechanism must be provided to prevent the
thermoplastic from flowing over the conductive surface of the
connectors. Additionally, the connector members must be retained in
position during the high-pressure injection process. Because of the
additional complexity associated with the need to maintain these
components in position, the former embodiment of inserting these
components into the completed core element 2 is preferred.
[0038] Core element 2 further includes additional lead bores 28 and
29 to receive the connector pins of additional leads. These lead
bores may be adapted to couple to the pin of a lead conforming to
the DF-1 standard for medical electrical leads, for example.
Additional apertures such as apertures 20 may be provided to couple
to additional circuit components in a manner to be discussed below.
Core element may further have one or more guide members shown as
guide members 21 and 23 integrally formed on the surface of core
element 2. These guide members serve as support and positioning
mechanisms for the additional circuit components, and also improves
the overmolding process, as is described below.
[0039] FIG. 1 further illustrates a circuit member 40 which is
formed of a conductive material such as stainless steel, titanium,
niobium, tantalum, or any other conductive biocompatible conductive
material. Circuit member 40 includes multiple conductive traces or
finger elements 42 through 52, each extending to a respective
connector pads 53 through 57. When the circuit member 40 is
initially coupled to core member 2, connector pads may be
electrically and mechanically joined to make the assembly process
more efficient. Circuit member 40 may be soldered or welded to the
various metal piece parts associated with core element 2, including
set-screw blocks 10 and 12, and the various connector members 30 in
a manner to be discussed below.
[0040] As noted above, using a single circuit member 40 having
conductive finger elements that are mechanically and electrically
joined makes the initial assembly process easier since multiple
elements need not be loaded onto the core element 2. However, in
this embodiment, an additional step is required later in the
assembly process to electrically isolate these components, as will
be discussed below. In another embodiment, each of the multiple
conductive finger elements 42 through 52 may be an individual
circuit element that is not mechanically or electrically coupled to
the other finger elements. In this embodiment, the multiple finger
elements must be individually loaded onto the core element.
However, the additional step of electrically isolating these
components later is not required. In yet another embodiment, the
conductive finger elements may be joined in a single circuit member
via insolated material. In this embodiment, the circuit member is a
unified structure that couples the conductive finger elements
mechanically, but provides electrical isolation. In this
embodiment, the additional step of electrically isolating these
components later is not required.
[0041] In yet another embodiment, the circuit member 40 could be
integrally formed to include the various connector members and
set-screw blocks so that the soldering or welding process may be
eliminated. Using this embodiment, attaching the circuit member 40
to the core element involves loading the receptacles and apertures
of the core element with the set-screw blocks and connector
members, respectively.
[0042] FIG. 2 is a front perspective view of core member 2 with
respective set-screw blocks inserted into receptacles 4,6 and 8,
and with connector members 58 and 30 inserted into circular
receptacles 24 and 26. This view further illustrates circuit member
40 coupled to core member 2. In this embodiment, finger elements 48
and 50 of circuit member may extend through apertures provided
within core element 2. For example, finger element 50 is inserted
through aperture 20, which is a channel that extends through the
core member. Similarly, finger element 48 extends through an
additional aperture (not shown in FIG. 2) to position circuit
member in a precise location with respect to core element 2. In one
manner of use, finger elements 48 and 50 are formed of a material
that is deformable, and which may be temporarily straightened to be
threaded through a respective aperture such as aperture 20. In
another exemplary embodiment, finger elements 48 and 50 are
initially straight, and may be manually or automatically bent in
the manner shown in FIG. 2 after being inserted within a respective
aperture.
[0043] After circuit member 40 is coupled to core member 2, it may
be soldered or welded to form predetermined electrical and
mechanical connections between connector members and set-screw
blocks and respective ones of the conductive finger elements. For
example, finger element 46 may be coupled to set-screw block 10,
whereas finger element 48 is electrically coupled to set-screw
block 60.
[0044] Additional circuit elements may further be coupled to the
core element using soldering, welding, or any other appropriate
process. For example, jumper 62 may be soldered or welded to both
finger element 46 and connector member 58 to form an electrical
connection between the two components. Jumper 66 may be positioned
on the surface of core member 2 using guide members 21 and 23 to
align the circuit member in a desired location so that an
electrical connection may be formed between set-screw block 12 and
a predetermined respective one of the finger elements.
[0045] FIG. 3 is a back perspective view of an alternative
embodiment of the core member designated core member 2a. Although
similar in almost every respect to the core members of FIGS. 1 and
2 discussed above, this core member includes a support structure 70
that is integrally molded into core element 2, and which is
provided to receive and support connector members such as connector
members 30 and 58. This support structure has a cutaway portion 72
to allow circuit element 62 to be welded or soldered to connector
member 58. Although this support structure helps maintain the
connector members in position during the second-shot overmolding
process, it may make insertion of the connector members more
cumbersome, and adds additional mass to the core element 2, which
may be undesirable for reasons to be discussed further below.
[0046] FIG. 3 further illustrates the manner in which finger
elements 48 and 50 of circuit member 40 are threaded through
apertures of core member 2. Further illustrated is circuit element
66, which is maintained in position on the surface of core element
by guide members 21 and 23 to form an electrical connection between
set-screw block 12 and finger element 42.
[0047] FIG. 4 is a bottom perspective view of core member 2. This
view illustrates the manner in which finger elements 48 and 50
extend through apertures 20 and 64, respectively. This view also
shows the manner in which the various finger elements may be
electrically coupled to connector members and set-screw blocks. For
example, finger element 44 is jumpered via circuit element 70 to
set-screw block 72; finger element 46 is electrically coupled to
set-screw block 10, and so on.
[0048] As shown in FIG. 4, one manner of retaining circuit member
40 in position in proximity to core element 2 is through the use of
apertures that extend through the core member and are adapted to
receive respective finger elements of the circuit member 40. While
this helps to prevent shifting of the circuit member 40 during the
second-shot molding process, the process of threading the finger
members through the various apertures is cumbersome and
time-consuming.
[0049] FIG. 5 is side perspective view of an alternative embodiment
of the circuit member. In this view, like features of circuit
member 40b as compared to circuit member 40 of FIGS. 1 through 4
are designated with like numeric identifiers including an
additional suffix. This embodiment includes finger elements 44b
through 46b that are not adapted to engage apertures in a core
element. Instead, these elements are adapted to be placed
externally on the surface of the core element to reduce assembly
time prior to the second-shot overmolding step. One or more of the
finger elements such as finger element 42b may have a longer,
flexible conductive end. This end is adapted to be manually shaped
to conform to a surface of the core member, as described below.
FIG. 5 also illustrates the use of alignment apertures 90 and 92,
which are provided to position the core element at a predetermined
location within the second-shot mold to be discussed below.
[0050] FIG. 6 is side perspective view of an alternative embodiment
of the core element adapted to engage the circuit member 40b of
FIG. 5. As in FIG. 5, like features of core element 2b as compared
to core element 2 of FIGS. 1 through 4 are designated with like
numeric identifiers including an additional suffix. Core element 2b
includes channel guides such as channel guides 100 through 110 that
are provided to guide the finger elements of circuit member 40b
into the desired position on the surface of core element 2b. During
the second-shot overmolding process, these channel guides retain
the finger elements in position, and prevent shifting that may
results in shorts between adjacent finger elements. These channel
guides also promote integration of the material of the core element
with the additional thermoplastic material provided during the
overmolding process, as will be discussed further below.
[0051] FIG. 7 is a side perspective view of circuit member 40b
positioned on the surface of core element 2b. This figure
illustrates the manner in which finger elements are positioned
using the guide members. For example, finger element 50b is
positioned between guide members 104 and 106, and finger element
42b is positioned between guide members 108 and 110 provided on the
bottom surface of core member 2b. The finger elements may be
soldered or welded to the conductive components such as the
set-screw blocks that are inserted in core member 2b in the manner
discussed above. Other circuit elements may also be used to form
electrical connections between circuit member 40b and a
predetermined conductive component. Alternatively, the longer
finger elements such a finger element 42b having a flexible
elongated end 42c (FIG. 5) may be manually shaped into position and
welded to form the desired connection as shown in FIG. 7. In this
example, the end 42c of finger element 42b is shaped along the top
surface of core member 2c to electrically couple to set-screw block
12c. This use of longer conductive finger elements makes the
assembly process more efficient by eliminating the need for
additional circuit components, and by minimizing the number of
locations that must be welded or soldered.
[0052] After all conductive components have been inserted into the
core element and the circuit member 40b has been welded, soldered,
or otherwise fixed into place, the resulting core element assembly
may be prepared to undergo the second-shot overmolding process.
This preparation may involve inserting pin members into the
connector members and the apertures of the set-screw blocks so that
thermoplastic material does not fill these structures during the
overmolding process. FIG. 7 illustrates pin members 120 and 122
being inserted into connector members 58b and 30b, respectively.
Pin members 124 and 126 are similarly inserted into lead bores 29b
and 28b, respectively. Additional pin members or bushings (not
shown in FIG. 7 for clarity) may be inserted into the apertures of
each of the set-screw blocks of core element 2b. These pin members
are made of a material that will withstand the temperature and
pressure conditions associated with the injection molding process.
For example, the pin members may be made of a tool steel or another
type of stainless steel. In one embodiment, multiple ones of the
pin members may be incorporated into a core assembly structure to
make insertion into the core element easier.
[0053] FIG. 8 illustrates an exemplary lead core assembly 130,
which is assembly that provides the pin members 120 through 126
shown in FIG. 7. The lead core assembly aligns the pin members, and
allows them to be inserted in one step.
[0054] In an alternative embodiment, ones of the pin members such
as those inserted into the set-screw blocks may be eliminated by
using protrusions in the second-shot mold assembly. These
protrusions are inserted into the set-screw blocks as the core
element is placed within the mold and the mold is closed, thereby
eliminating the step of manually inserting the pin members into the
core element. This is discussed further below.
[0055] FIG. 9 is a perspective view of a core element being
prepared for the overmolding process. This view, which is similar
to that shown in FIG. 3, illustrates core member 2a and the
associated metal piece parts that have been loaded into the core
member. Lead core assembly 130 is utilized to insert pin members
120, 122, 124, and 126 into the respective structures of the core
element as discussed in reference to FIG. 8. Similar bushings 140,
142, 144 and 146 may be inserted into the apertures of the
set-screw blocks. As noted above, bushings 144 and 146 may be
eliminated by instead providing protrusions within cavity 148 of
the bottom portion 150 that are aligned with the set-screw blocks.
Similar protrusions may be provided in the top portion 172 of the
mold to replace bushings 140 and 142. Providing such structures in
the mold itself eliminates the requirement of manually loading the
bushings into the core element.
[0056] After the core element is prepared for the overmolding
process, the entire assembly may then be loaded into cavity 148 of
a bottom portion 150 of a second-shot mold fixture. The lead core
assembly is positioned within the mold as shown by dashed lines 152
and 154. In this position, the lead core assembly suspends the core
element within the cavity of the mold so that the surface of the
core element is not in contact with the interior surface of the
mold. The positioning of the core assembly may further be aided by
fitting predetermined ones of the apertures included in the circuit
member 40 with the alignment pins 160 and 162 of the mold as
illustrated by dashed lines 164 and 166. For example, the apertures
in connector pads 54 and 56 of circuit member 40 (FIGS. 2 and 3) or
the alignment apertures 90 and 92 (FIG. 5) could be used for this
purpose. The circuit member 40 may further be supported by a
shoulder member 170.
[0057] After the assembly has been properly aligned within the
bottom portion 150, the top portion 172 of the second-shot mold
fixture is aligned with the bottom portion. This may be
accomplished by inserting pegs 174 and 176 into channel members 178
and 180. Both top and bottom mold portions may include additional
channels such as channels 182 and 184 to accommodate set-screws 140
and 142, respectively. Similar channels may be provided in the
bottom portion 150 of the mold fixture.
[0058] When the bottom and top portions of the mold fixture have
been aligned, a press may be utilized to maintain the alignment
during the high-pressure injection procedure. A thermoplastic
material is heated to at least the melting temperature, or
preferably, slightly above the melting temperature, of the
material, and is injected into cavity 148 via injection port 190.
The same, or a different, thermoplastic material may be used in the
second-shot injection process as compared to that used in the core
element. Moreover, the second-shot material may entirely
encapsulate the core element, or alternatively, need only cover a
portion of the core element. For example, it may be desirable to
leave exposed a portion of the thermoplastic material included in
the core element in the region of the circuit member connector
pads.
[0059] During the second-shot injection process, it is important to
ensure that bonding occurs between the core element and the second
shot material. If bonding does not occur, very small amounts of
ionic liquid pool between the core element 2 and the overmold
material after the connector has been implanted within a living
body for an extended period of time. This may result in what is an
unacceptably large leakage current between adjacent finger elements
of the circuit element. One way to ensure that adequate bonding is
achieved is to heat the second-shot plastic as hot as the material
characteristics will allow, and to inject the material as quickly
as possible. This allows the core element to be heated by, and
thereafter bonded to, the second-shot material.
[0060] Another method used to enhance the bonding process is to
ensure that the mass of the core element is as small as possible.
This allows the core element to be heated sufficiently during the
overmold process. In one embodiment, the mass of the thermoplastic
material incorporated into the core element is less than half of
the mass of the material utilized during the overmold process, and
is preferably less than thirty percent of that of the overmold
structure.
[0061] Another mechanism for enhancing the bonding of the core
element to the overmold material involves heating the core element
prior to injecting the second shot of thermoplastic material. If
this method is utilized, the mass of the core element may be
greater while still achieving adequate bonding. This is because the
second shot of thermoplastic material is not providing all of the
heat needed to warm the core element, with at least some of the
heat being provided during the heating step that precedes the
injection step. In one embodiment, the mass of the core element is
greater than fifty percent of the thermoplastic material used
during the overmold process while still retaining adequate
bonding.
[0062] Integration of the core element with the overmold material
may be further enhanced by providing relatively thin protruding
structures to the core member surface. Because these relatively
thin structures are readily melted and integrated with the
second-shot material, integration of the core element with the
overmold structure is enhanced. For example, guide members 100
through 110 (FIG. 6) serve not only to guide circuit elements on
the surface of the core member, but also facilitate this type of
bonding between the core element 2 and the overmold material. In
one embodiment, additional thin fin-like structures may be provided
in arbitrary shapes along various surfaces of the core member to
facilitate additional integration. Such structures may be included
in the first-shot mold assembly. Although such structures do
enhance integration, the addition of such structures makes the
molding of the core element more complex.
[0063] Following the injection of the overmold material, the entire
assembly is allowed to cool for twenty to seventy seconds,
depending on the type of thermoplastic material utilized as
determined by the manufacturer specifications. The top portion of
the mold is removed from the bottom portion, causing the finished
connector assembly to be released. After removal from the mold, the
connector pads of the circuit member 40 may be separated, if
necessary, to achieve electrical isolation, as may be performed by
cutting away the intervening conductive traces. The pads may then
be soldered or welded to respective connectors of an implantable
medical device such as a pacemaker or cardioverter/defibrillator,
and overlaid with a medical adhesive to maintain electrical
isolation in the connection area. It may be noted that if
individual circuit elements are utilized in place of circuit member
40 or 40b, the step of removing the intervening conductive traces
between finger elements may be eliminated.
[0064] As discussed in the foregoing paragraphs, one way to promote
the formation of an adequate bond between the core member and the
overmold material is to utilize a core element that is as small as
possible. An alternative embodiment of a core element directed to
minimizing core element mass is shown in FIG. 10. It may be noted
that in this embodiment, the walls defining receptacles 4c, 6c, and
8c are relatively thin structures as compared to similar structures
shown in FIGS. 1 and 6. Other structure adjacent to receptacle 8c
has also been eliminated.
[0065] FIG. 11 is a perspective side view of an exemplary connector
assembly formed after injection of the second-shot material. The
side view of FIG. 11 corresponds to the view of core element 2b in
FIG. 6. Circuit member 40 has been trimmed in the manner discussed
above to achieve the necessary isolation between pads. This view
further illustrates an additional bore 190 extending through the
second thermoplastic material 191, which may be integrally formed
by a protrusion provided within the cavity of the bottom portion
150 or top portion 172 of the mold. This type of bore is provided
to allow for tightening of the set-screws after a lead is insert
into a respective lead receptacle such as receptacle 200 in this
instance. This bore will be fitted with a stop member such as a
grommet and/or a washer to form a fluid-tight opening that is
adapted to receive a tool used during the tightening of the
set-screw to the lead pin or ring connector. In one embodiment,
other apertures 202a and 202b are provided to allow the connector
to be sutured to tissue within the implant cavity. This type of
aperture may be formed by a pin that extends between the bottom
portion 150 and top portion 172 of the mold assembly.
[0066] FIG. 12 is an alternative embodiment of the second-shot mold
assembly of FIG. 9. This view illustrates core element 2a, the
associated metal piece parts that have been loaded into the core
member, and circuit member 40. This loaded core element assembly is
then positioned in the bottom portion 150a of the second-shot mold
fixture. In a manner similar to that discussed above with respect
to FIG. 9, apertures provided within the circuit element may be
positioned over pins 203 and 204 of shoulder member 205 to properly
align and suspend core member over cavity 206 of the mold. Two
slidable members 207 and 208 are provided to move into position
around the core element assembly, as shown by arrows 209 and 210,
respectively. These slidable members may be adapted to slide within
tracks of the bottom portion 150a. Each of the slidable members
includes one or more pegs such as pegs 211 and 212 of slidable
member 207 to engage the set-screw block apertures so that
additional bushings 140 through 146 (FIG. 9) are not needed. The
slidable members provide additional stability during the
second-shot injection mold process, and make removal of the
connector assembly following the second-shot injection process less
difficult.
[0067] Also shown in FIG. 12 is lead core assembly 130, which may
be slidably positioned within the bottom portion 150a of the mold
as illustrated by arrow 211 to engage the connector members of the
core element 2a in the manner discussed above. Once the lead core
assembly 130 and slidable members 207 and 208 are in position, a
top portion of the mold which is similar to top portion 172 (FIG.
9) may be positioned over the bottom portion 150a. This top portion
is held in position by a press or other mechanism during the
second-shot injection process, as discussed above.
[0068] FIG. 13 is a flowchart indicating the steps utilized to make
the current exemplary connector assembly. Although for discussion
purposes the associated description involves the core element of
FIG. 1, it will be understood the described process is equally
applicable to the production of any connector type, or an entirely
different type of thermoplastic component. In step 220, core member
2 is created. This may be accomplished by injecting a thermoplastic
material into a primary mold assembly, or by fabricating a core
member such as by a machining process. In step 222, the core member
is loaded with the various conductive components such as the
set-screw blocks and connector members to form the core member
assembly. This step includes welding or solder the circuit member
40 to the various other conductive components. Processing continues
with step 224, wherein the core member assembly is loaded onto the
lead core assembly. Additional bushings may be inserted into
set-screw blocks in 226 to ensure these structures remain open
during the overmolding process, although this step is unnecessary
if protrusions adapted to be inserted in the set-screw blocks are
included in the second-shot mold assembly.
[0069] Next, in step 228, the core member assembly is loaded into
the bottom portion 150 of the second-shot mold assembly. If
desired, apertures in the circuit member 40 may be used to align
the core member assembly within the mold cavity in a manner
discussed above. The top portion 172 of the mold assembly is
positioned over the bottom portion 150 as indicated by step 230,
and the two portions are held together using a press, for example.
Processing continues with step 232, wherein the thermoplastic
material is injected to create the overmold. To bond the core
member 2 with the overmold material, it is critical to heat the
core member adequately. This may be accomplished by ensuring the
mass of the core member is as small as possible as compared to the
mass of the overmold material. In one embodiment, the mass of the
core element is less than fifty percent of the mass of the
overmolding material, and is preferably less than thirty percent of
the overmold mass, as is discussed above. The bonding process may
further be enhanced by pre-heating the core element prior to the
overmold process, or by utilizing a thermoplastic material that can
be heated to a relatively high temperature without altering the
material characteristics. In either of these instances, the core
element may have a mass that is greater than fifty percent of the
overmold process while still achieving adequate bonding.
[0070] The connector assembly is cooled in step 234, and then
removed from the mold assembly in step 236. The lead core assembly
and optional bushings may be removed in step 238, and the various
connector pads of the circuit member may be electrically isolated,
as by removing interconnecting ones of the conductive traces. This
is illustrated in step 240. As noted above, if individual circuit
elements are used, this step is not needed.
[0071] FIG. 14 is a side perspective view of a completed connector
assembly 248 which is similar to that shown in FIG. 11. Connector
assembly 248 is coupled to an implantable medical device (IMD) 250,
which may be a pacemaker, cardio/defibrillator, neurological pain
stimulator, or any other type of implantable medical device
utilizing medical electrical leads. In one embodiment, the
connector pads such as pads 252 through 258 of the connector
assembly 248 are welded or soldered to a feedthrough pattern of the
IMD. This provides the desired electrical connections between the
connector assembly and the IMD.
[0072] Although the above description discusses a particular type
of connector assembly adapted to couple to four leads having
particular types of connectors, it may be noted that the inventive
process may be adapted to manufacture any type of connector
assembly having any number of shapes and sizes, and that is adapted
to couple to any type of lead connector. Alternatively, the process
could be utilized to manufacture any other type of thermoplastic
component that is adapted to include conductive piece parts. Thus,
the description of the specific connector assembly set forth above
should be considered merely exemplary in nature.
* * * * *