U.S. patent application number 11/460115 was filed with the patent office on 2009-01-08 for gra mems accelerometer.
Invention is credited to Donato Cardarelli.
Application Number | 20090007667 11/460115 |
Document ID | / |
Family ID | 40174861 |
Filed Date | 2009-01-08 |
United States Patent
Application |
20090007667 |
Kind Code |
A1 |
Cardarelli; Donato |
January 8, 2009 |
GRA MEMS ACCELEROMETER
Abstract
An accelerometer that lies generally in a plane, for detecting
acceleration along an input axis. There is a substrate, a generally
planar Servo Member (SM) flexibly coupled to the substrate such
that it is capable of oscillatory motion about a servo axis that
lies in the plane, a generally planar Torque Summing Member (TSM)
coplanar with and flexibly coupled to the SM such that the TSM is
capable of rotary motion relative to the SM about an output axis
that is in the plane and orthogonal to the servo axis, wherein the
TSM is mass-imbalanced relative to the output axis, and a generally
planar rotor coplanar with and flexibly coupled to the TSM such
that it is capable of rotary oscillatory motion relative to the TSM
about a rotor axis that is orthogonal to the plane of the members.
There are drives for oscillating the rotor about the rotor axis and
for oscillating the SM about the servo axis. Output sensors detect
oscillation of the rotor about the rotor axis and of the SM about
the servo axis. Output sensors detect rotation of the TSM about the
output axis.
Inventors: |
Cardarelli; Donato;
(Medfield, MA) |
Correspondence
Address: |
Brian M. Diugman, Esquire;Mirick, O'Connell, Demallie & Lougee, LLP
1700 West Park Drive
Westborough
MA
01581-3941
US
|
Family ID: |
40174861 |
Appl. No.: |
11/460115 |
Filed: |
July 26, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
60702422 |
Jul 26, 2005 |
|
|
|
Current U.S.
Class: |
73/514.15 |
Current CPC
Class: |
G01P 15/125 20130101;
G01P 15/13 20130101; G01P 15/0802 20130101; G01P 15/14
20130101 |
Class at
Publication: |
73/514.15 |
International
Class: |
G01P 15/14 20060101
G01P015/14 |
Goverment Interests
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH
[0002] This invention was made with government support under
contract number HQ0006-05-C-2718 issued by the MDA. The government
has certain rights in this invention.
Claims
1. An accelerometer that lies generally in a plane, for detecting
acceleration along an input axis that is orthogonal to the plane of
the accelerometer, comprising: a substrate defining a surface;
spaced bonding pads coupled to the substrate and projecting from
the surface of the substrate; a generally planar Servo Member (SM)
spaced from and essentially parallel to the surface of the
substrate and flexibly coupled to the bonding pads by servo member
flexures such that the servo member is capable of oscillatory
motion relative to the substrate about a servo axis that is in the
plane of the servo member; a generally planar plate Torque Summing
Member (TSM) located within, coplanar with, and flexibly coupled to
the SM such that the TSM is capable of rotational motion relative
to the substrate about an output axis that is in the plane of the
TSM and orthogonal to the servo axis, the TSM being mass-imbalanced
relative to the output axis; a generally planar plate rotor located
within coplanar with, and flexibly coupled to the TSM such that the
rotor is capable of rotary oscillatory motion relative to the TSM
about a rotor axis that is orthogonal to the plane of the rotor,
the torque summing member and the servo member; one or more rotor
drives for directly oscillating the rotor about the rotor axis at a
rotor oscillation frequency and amplitude; one or more SM drives
for oscillating the SM about the servo axis at a servo member
oscillation frequency and amplitude, and thereby also oscillating
the rotor and torque summing member about the servo axis at the
servo member oscillation frequency; one or more rotor motion
sensors that detect oscillation of the rotor relative to the
substrate about the rotor axis; one or more SM motion sensors that
detect oscillation of the SM relative to the substrate about the
servo axis; and one or more TSM motion sensors that detect rotation
of the TSM relative to the substrate about the output axis.
2-25. (canceled)
26. The accelerometer of claim 1 in which the servo member drives
comprise capacitive drives.
27. The accelerometer of claim 26 in which the servo member drives
and the servo member motion sensors each comprise plates on the
surface of the substrate, spaced from the servo member, and in
which the servo member drive plates and servo member motion sensor
plates are electrically isolated from one another.
28. The accelerometer of claim 27 in which at least the surface of
the substrate on which the drive and sensor plates are located is
electrically insulating.
29. The accelerometer of claim 28 in which at least the surface of
the substrate on which the drive and sensor plates are located is
Pyrex glass.
30. The accelerometer of claim 1 in which there is at least one
servo member drive on each side of the servo axis.
31. The accelerometer of claim 1 in which the rotor drives and
rotor motion sensors comprise capacitive devices.
32. The accelerometer of claim 31 in which the rotor drives and
rotor motion sensors comprise portions of a rotary comb capacitive
device comprising sets of mating combs defined by one or more
stators coupled to the substrate and one or more rotors coupled to
the rotor.
33. The accelerometer of claim 32 in which the rotary comb
capacitive device comprises four stator sectors coupled to the
substrate that are symmetrically, radially arranged around the
rotor axis to form the stators of four device sectors.
34. The accelerometer of claim 33 in which two of the four device
sectors are used for sensing, and the signals from these two
sectors are differenced, to increase the signal strength and reduce
common-mode noise.
35. The accelerometer of claim 1 further comprising a control loop,
responsive to the servo member motion sensors, for maintaining the
oscillation amplitude of the servo member constant.
36. The accelerometer of claim 1 in which the rotor oscillates at
its resonant frequency and the servo member oscillates at the same
frequency.
37. The accelerometer of claim 1 in which the rotor is flexibly
coupled to the torque summing member by a plurality of rotor
flexures.
38. The accelerometer of claim 37 in which the rotor defines a
circular perimeter, and the rotor flexures are spaced evenly about
the rotor perimeter.
39. The accelerometer of claim 38 in which the rotor flexures each
comprise two bending "U" flexures.
40. The accelerometer of claim 39 in which the rotor flexures each
further comprise a stress relief feature comprising a bend in the
flexure.
41. The accelerometer of claim 37 in which the rotor is coupled to
the torque summing member by flexures that are radial relative to
the rotor axis.
42. The accelerometer of claim 1 in which the rotor and the torque
summing member are each generally annular, and are concentric.
43. The accelerometer of claim 1 in which the torque summing member
is flexibly coupled to the servo member by a pair of colinear
torsional flexures that each comprise a stress relief feature.
44. The accelerometer of claim 1 in which the rotor and the servo
member are each symmetric about the servo axis and the output
axis.
45. The accelerometer of claim 1 in which at least the servo
member, the torque summing member, the rotor and the bonding pads
are made from a silicon monolith.
46. The accelerometer of claim 45 in which at least the servo
member, the torque summing member, the rotor and the bonding pads
are made by a dissolved wafer process.
47. The accelerometer of claim 1 in which at least the torque
summing member and the rotor are maintained at a common electrical
potential.
48. The accelerometer of claim 47 in which the common electrical
potential is ground.
49. The accelerometer of claim 1 in which the servo member flexures
comprise in-line torsional flexures.
50. The accelerometer of claim 49 in which the servo member
flexures each further comprise a stress relief feature.
51. The accelerometer of claim 1 in which the rotor, the torque
summing member and the servo member are concentric.
52. The accelerometer of claim 1 in which the rotor and the servo
member are each symmetric about both the servo axis and the input
axis.
53. The accelerometer of claim 27 in which the servo member drive
plates and sensor plates are symmetric with respect to the servo
axis.
54. The accelerometer of claim 1 in which the servo member
oscillation about the servo axis is at a constant frequency and
amplitude.
55. The accelerometer of claim 54 in which the rotor oscillation
about the rotor axis is at a constant frequency and amplitude.
56. The accelerometer of claim 55 in which the rotor and the servo
member oscillate at the same frequency, and further comprising a
control loop, responsive to the torque summing member motion
sensor, for varying the phase of either the rotor or the servo
member to apply gyroscopic torque to counter motion of the torque
summing member and bring it back to null.
57. The accelerometer of claim 56 in which the phase change is
related to the acceleration input.
58. The accelerometer of claim 56 in which the torque summing
member rotation due to acceleration input causes a phase change
between the rotor and the servo member that is related to the
acceleration input.
59. The accelerometer of claim 1 further comprising a control loop,
responsive to the rotor motion sensors, for maintaining the
oscillation amplitude of the rotor constant.
60. The accelerometer of claim 1 in which the torque summing member
motion sensors comprise capacitive plates on the surface of the
substrate, spaced from the torque summing member.
61. The accelerometer of claim 1 further comprising at least one
phase-lock loop control that locks onto the resonance of at least
one of the rotor and servo member.
62. The accelerometer of claim 1 comprising two controllers for
each of the rotor and servo member, one a phase-lock loop and the
second an amplitude control loop.
Description
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application claims priority of provisional application
Ser. No. 60/702,422 filed on Jul. 26, 2005, the disclosure of which
is incorporated herein by reference.
FIELD OF THE INVENTION
[0003] This invention relates to accelerometer designs.
BACKGROUND OF THE INVENTION
[0004] Closed loop MEMS pendulous accelerometers typically use
torque rebalance with a voltage-controlled capacitive actuator to
hold the pendulum at null. Assuming the actuator is stable, the
voltage applied is proportional to acceleration. The accelerometers
are calibrated to obtain the scale factor (acceleration to voltage
proportionality). In this implementation, the torque applied is not
measured directly. The accuracy and stability will be dependent on
the accuracy and stability of the applied voltage and the actuator
functionality, thereby limiting scale factor accuracy if only the
voltage is measured. To increase performance of MEMS
accelerometers, the stability in the components becomes more
critical.
[0005] In the Pendulous Integrating Gyro Accelerometer (PIGA), a
single degree-of-freedom (SDF) gyro is mounted onto a rotating
platform that allows the gyro to be rotated about its Input Axis.
The gyro contains a wheel that spins about the SRA (Spin Reference
Axis). The wheel is mounted to a gimbal that can rotate about the
Output Axis (OA). The gimbal is mounted within a case that is in
turn attached to the rotating platform via a post. The SRA and OA
are orthogonal. During operation, in response to a rotation of the
case about the gyro Input Axis, the gyro gimbal responds with a
rotation about the Output Axis. By rotating the platform, the same
gimbal rotation will result.
[0006] To make a PIGA, the gyro is made purposely unbalanced by the
addition of a mass along the SRA axis, to convert the gimbal into a
pendulum. Under acceleration, the unbalanced mass generates a
torque that tends to rotate the gimbal about the OA. By rotation of
the platform (servo member) in the appropriate direction, the
gimbal can be returned to its null position. Note that the
pendulous torque and the gyro torque act on a common member, the
gimbal. For this reason the gimbal is referred to as a Torque
Summing Member (TSM).
[0007] The PIGA equation of motion for the gimbal rotation angle
.theta. is given by
I{umlaut over (.theta.)}+D{dot over
(.theta.)}+K.theta.=H.sub.spin{dot over (.phi.)}-Pa (1)
where H.sub.spin{dot over (.phi.)} is the gyro torque; Pa is the
pendulous torque; H.sub.spin=I.sub.wheel{dot over
(.alpha.)}.sub.spin is the wheel angular momentum; I.sub.wheel is
the wheel moment of inertia about the spin axis; {dot over (.phi.)}
is the rotation rate of the platform; {dot over (.alpha.)}.sub.spin
is the spin rate of the wheel; P is the pendulosity; and a is the
input acceleration. In closed loop operation, the gyro torque is
equal to the pendulous torque, H.sub.spin{dot over (.phi.)}=Pa. The
acceleration is then given by
a = H spin P .phi. . ( 2 ) ##EQU00001##
where
H spin P ##EQU00002##
is the Scale Factor.
[0008] One unique attribute of the PIGA is that when both sides of
equation 2 are integrated, the following expression is
obtained.
v = H spin P .PHI. ( 3 ) ##EQU00003##
This expression represents the mechanical integration of
acceleration, and the velocity is given directly by the Servo
Member angle. The significance of this is that numerical
integration is not required and a source of random walk in velocity
is eliminated.
[0009] A second PIGA attribute is that the accuracy of the
measurement only depends on the measurement of the platform angle
for the velocity read-out or the rate of the platform rotation for
the acceleration read-out, since the wheel speed is maintained
constant by a synchronous drive motor whose speed is determined by
the drive frequency only, and not on the magnitude of the
voltages/currents applied to spin the wheel and rotate the
platform. This attribute is possible because a very stable
gyroscope is used to provide a very accurate rebalance torque.
[0010] The Gyro-Rebalanced Accelerometer (GRA) is intended to
overcome the instability of torque rebalance components by applying
a gyroscopic torque that can be measured directly. The principle
has been shown in U.S. Pat. Nos. 5,457,993, 5,691,470 and
5,712,426, the disclosures of which are incorporated herein by
reference. The significance of this approach is that the
acceleration-produced torque is balanced by a gyroscopic torque;
both are inertial torques.
SUMMARY OF THE INVENTION
[0011] This invention relates to designs and implementations of a
Gyro Rebalanced Accelerometer (GRA).
[0012] This invention further relates to planar GRA designs capable
of being fabricated with MEMS processing technologies.
[0013] This invention further relates to the components of the
design and how they provide the functionality of the GRA.
[0014] This invention also relates to open-loop operation of the
GRA.
[0015] This invention also relates to GRA designs optimized for
MEMS fabrication processes.
[0016] This invention also relates to offset operation of the GRA
as defined by the frequency difference between the Rotor and Servo
Member natural frequencies. The preferred offset is zero. Non-zero
offset requires that the frequency difference is small to minimize
the drive power.
[0017] This invention also relates to monolithic constructions of
the GRA to minimize structural instability. Because of this, the
structure is electrically connected to ground.
[0018] This invention features an accelerometer that lies generally
in a plane, for detecting acceleration along an input axis,
comprising a substrate, a generally planar Servo Member (SM)
flexibly coupled to the substrate such that it is capable of
oscillatory motion about a servo axis that lies in the plane, a
generally planar Torque Summing Member (TSM) coplanar with and
flexibly coupled to the SM such that the TSM is capable of rotary
motion relative to the SM about an output axis that is in the plane
and orthogonal to the servo axis, wherein the TSM is
mass-imbalanced relative to the output axis, and a generally planar
rotor coplanar with and flexibly coupled to the TSM such that it is
capable of rotary oscillatory motion relative to the TSM about a
rotor axis that is orthogonal to the plane. There are one or more
rotor drives for oscillating the rotor about the rotor axis, and
one or more SM drives for oscillating the SM about the servo axis.
There are also one or more rotor output sensors that detect
oscillation of the rotor about the rotor axis, one or more SM
output sensors that detect oscillation of the SM about the servo
axis, and one or more TSM output sensors that detect rotation of
the TSM about the output axis.
[0019] The rotor and SM drives preferably comprise capacitive
drives. The SM drive may comprise plates. There may be at least one
SM drive on each side of the servo axis.
[0020] The rotor output sensors may comprise capacitive sensors,
which may be comb sensors. The comb sensors may comprise sectors
that are radially arranged around the output axis. There may be two
pairs of adjacent comb sectors, one pair for sensing and one pair
for driving. The TSM output sensors may comprise capacitive plate
sensors.
[0021] The accelerometer may further comprise a controller,
responsive to the rotor output sensors, for maintaining the
amplitude and phase of the rotor constant. The rotor may oscillate
at essentially the same frequency as the SM oscillation frequency.
The rotor may be flexibly coupled to the TSM by a plurality of
rotor flexures. The rotor may be circular, in which case the rotor
flexures may be spaced evenly about its periphery. The rotor
flexures may each comprise two bending "U" flexures, and may
further comprise stress relief features comprising a bend in the
flexure. The SM may be flexibly coupled to the substrate by a pair
of SM linear flexures.
[0022] The rotor may be located within the TSM, and the TSM may be
located within the SM. The rotor may be coupled to the TSM by
flexures that are radial relative to the rotor axis. The rotor may
oscillate at resonance.
[0023] The accelerometer may further comprise a controller,
responsive to the SM output sensors, for maintaining the amplitude
and phase of the SM constant. The accelerometer may further
comprise a controller, responsive to the TSM output sensors, for
causing the rotor drive to vary the phase of the rotor oscillation.
The accelerometer may further comprise a controller, responsive to
the TSM output sensors, for causing the SM drive to vary the phase
of the SM oscillation. The accelerometer may further comprise at
least one phase-lock loop control that locks onto the resonance of
at least one of the rotor and SM. The accelerometer may comprise
two controllers for each of the rotor and SM, one a phase-lock loop
and the second an amplitude control loop.
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Other objects, features and advantages will occur to those
skilled in the art from the following description of the preferred
embodiments, and the accompanying drawings, in which:
[0025] FIGS. 1A, 1B and 1C schematically depict the inventive
planar GRA concept based on the oscillatory gyro and the simple
pendulum accelerometer.
[0026] FIG. 2 is a graph of the GRA scale factor as a function of
phase, .delta., between the Servo and Rotor Members for the
invention.
[0027] FIG. 3 is a top schematic view of the preferred GRA
mechanical design.
[0028] FIG. 4 is a close-up view of the W-flexure design of FIG.
3.
[0029] FIG. 5 shows the rotary comb design of FIG. 3.
[0030] FIG. 6 shows neighboring comb segments of the rotary comb
design of FIG. 5.
[0031] FIG. 7 shows the GRA metallization layout for the preferred
embodiment.
[0032] FIG. 8 is a view similar to that of FIG. 3 for an
alternative embodiment of a GRA with square TSM geometry.
[0033] FIG. 9 is a functional block diagram of the preferred GRA
electronics.
[0034] FIG. 10 schematically depicts the preferred Dissolved Wafer
Process steps.
[0035] FIG. 11 is a schematic side-view of a completed GRA device
after the silicon substrate is etched away.
PREFERRED EMBODIMENTS OF THE INVENTION
[0036] The GRA is similar in operation to the PIGA. By
understanding the PIGA, the description of the POGA is
simplified.
[0037] Like the PIGA, the GRA is based on the use of a stable
gyroscope. However, because the rotor and Servo Member in the GRA
are oscillatory, the measurement and control of their amplitudes
bypasses the instability in the actuators and the voltages applied.
Therefore a stable and accurate scale factor will be obtained.
GRA Description/Principle of Operation
[0038] The GRA is a planar device with two oscillating members and
a pendulum. FIGS. 1A-1C show how the gyroscope and pendulum are
combined in one instrument. The simple pendulum accelerometer, FIG.
1A, contains an annular disk with a pendulous mass. The disk is
attached to the substrate with two in-line torsional flexures. The
gyroscope, FIG. 1B, contains a rotor in the center of a balanced
annular disk. The disk is also attached to the substrate with two,
in-line torsional flexures. The gyro is operated by oscillating the
rotor about the axis normal to the plane. In response to rotation
rate about the Input Axis, the annular disk (the output member)
oscillates about the Output Axis, which is aligned with the
torsional flexures. Radial flexures (not shown in this drawing)
suspend the rotor from the inner diameter of the ring.
[0039] The GRA, FIG. 1C, is formed by functionally combining the
two instruments. The annular disk (the TSM) is the common member.
The pendulous mass generates rotation of the disk about the Output
Axis in response to acceleration. The rotor causes oscillation of
the disk when the gyro is rotated about its Input Axis. When the
gyro is oscillated about its Input Axis and at the same frequency
as the Rotor, the disk is rotated (not oscillated) to counter the
rotation of the pendulum. To enable the oscillation of the gyro, a
third member (the Servo Member or SM) is added to the outside of
the Rotor and Disk. Because the gyro and pendulous mass both
produce torques on the disk, the disk is called the Torque Summing
Member (TSM).
[0040] The GRA equation of motion is that of the TSM (annular disk)
angle of rotation subject to gyro and pendulosity torques.
I{umlaut over (.theta.)}+D{dot over
(.theta.)}+K.theta.=H.sub.osc{dot over (.phi.)}.sub.osc-Pa (4)
where H.sub.osc{dot over (.phi.)}.sub.osc is the gyro torque, Pa is
the pendulous torque, H.sub.osc=I.sub.rotor{dot over
(.alpha.)}.sub.osc is the rotor angular momentum, I.sub.rotor is
the rotor moment of inertia about the oscillation axis, {dot over
(.phi.)}.sub.osc is the oscillation rate of the platform (TSM or
disk), {dot over (.alpha.)}.sub.osc is the oscillation rate of the
rotor, P is the pendulosity, and a is the input acceleration. In
closed loop operation, the gyro torque at steady state is equal to
the pendulous torque, H.sub.osc{dot over (.phi.)}.sub.osc=Pa. The
acceleration is then given by
a = H osc P .phi. . osc ( 5 ) ##EQU00004##
[0041] To obtain a more useful expression we substitute for
H.sub.osc=I.sub.rotor{dot over (.alpha.)}.sub.osc, {dot over
(.alpha.)}.sub.osc=.omega.{tilde over (.alpha.)}.sub.osc cos
.omega.t, {dot over (.phi.)}.sub.osc=.omega.{tilde over
(.phi.)}.sub.osc cos(.omega.t-.delta.) where {tilde over
(.alpha.)}.sub.osc is the rotor oscillation amplitude; {tilde over
(.phi.)} is the servo oscillation amplitude; .omega. is the
oscillation frequency and .delta. is the phase between the Rotor
and Servo Member oscillators. The more relevant expression for
acceleration becomes
a = I rotor .omega. 2 .alpha. ~ .phi. ~ 2 P cos .delta. ( 6 )
##EQU00005##
where
I rotor .omega. 2 .alpha. ~ osc .phi. ~ osc 2 P ##EQU00006##
is the Scale Factor and cos .delta. is the control variable for
closed-loop operation. The amplitudes of oscillation are not
required to be equal, but to maintain a constant scale factor, they
must be held constant. To change the magnitude of the Scale Factor,
the inertia, operating frequency and the oscillation amplitudes can
be changed.
[0042] FIG. 2 is a plot of the Scale Factor for a maximum
acceleration of 1 g. For practical operation, the nearly linear
operating range bounded by .+-.60 degrees is selected.
[0043] According to equation (6), the accuracy of the scale factor
depends primarily on the measurement accuracy of the oscillation
amplitude and not on the stability of the actuator or the applied
drive voltages. The measurement accuracy of acceleration is also
dependent on phase measurements, which are highly accurate and not
on how the phase is varied. The resolution and bias stability will
depend on the smallest measurable phase between the oscillators,
which is dependent on the magnitude of the scale factor and the
noise.
[0044] Unlike the simple pendulum, for which the accuracy and
stability of the accelerometer depends on the accuracy and
stability of the pick-off and actuator, the accuracy and stability
of the GRA is dependent on the accuracy and stability of the
pick-offs alone. Gyroscopic rebalance essentially provides a more
stable and accurate Scale Factor over simple accelerometers.
Practical Mode of Operation
[0045] The ideal GRA will operate with matched Rotor and Servo
Member natural frequencies. In the practical case, however, the
frequency match is difficult to obtain. Therefore, after the
difference (offset) is made small, the GRA is operated by
phase-locking the drive frequency to the Rotor or the Servo Member.
The second oscillator will then be driven at the same
frequency.
Advanced Mode of Operation
[0046] The Rotor and Servo Members are mechanical oscillators that
are coupled by the overall structure. By actively phase-locking the
separate oscillators, the two will lock and oscillate at the same
frequency if they are sufficiently close and the feedback amplitude
is also sufficient.
GRA Embodiment
Mechanical Design
[0047] The mechanical design of the preferred embodiment of
inventive GRA 10 is shown in FIG. 3. The rectangular shapes on each
end are bonding pads 12 used to bond the device to the Pyrex
substrate 14. Two co-linear torsional flexures 16, 17 connect the
Servo Member (SM) 18 to the bonding pads. The flexures are
stress-relieved by the oval cutouts 20, 21 in the bonding pads. The
square SM shape allows the placement of sufficiently large
capacitive plates underneath the SM for actuation. Capacitive sense
plates are used to measure the motion of the SM. The Rotor 22 is an
annular disk connected to the TSM 8 with four W-shaped flexures 24,
25, 26, 27.
[0048] The W-flexure design 42, shown in FIG. 4, is made up of two
U-shaped flexures 43, 44. One end of each is connected to the TSM 8
and the other to the Rotor 45 through an L-shaped segment 47, 48
essentially tangent to the rotor disk curvature. The L-shaped
segment is added to enable the U-structure to bend with Rotor
rotation and to absorb stress between the TSM and Rotor. The radial
alignment of the flexures along diagonals across the Rotor disk
makes a symmetric arrangement with each flexure experiencing the
equivalent stress.
[0049] The TSM is connected to the Servo Member with two torsional
flexures 76 and 77. The pendulosity is caused by the hole 78 cut
into the TSM.
[0050] The working gap between the gyro structure and the Pyrex
substrate is 10 microns but the gap used depends on several
factors: geometry, actuation capacity, sensitivity and fabrication
constraints. The gap is fabricated by etching a well in the silicon
and a well in the Pyrex, as explained below.
[0051] The use of Pyrex is dependent on the need to anodically bond
epitaxial silicon to a substrate as described in the DWP process.
Other fabrication processes are possible. It is preferred to use a
substrate that has similar thermal characteristics to the device
material, which in this case is silicon. An option is to also use
silicon as the substrate for close thermal match and to enable
anodic bonding with a deposited Pyrex-equivalent film added to the
substrate silicon. This would also preserve the electrical
isolation between devices.
[0052] It is preferred for the device to be monolithic for
mechanical stability and to connect it to electrical ground.
[0053] On the inside diameter of the Rotor is constructed a
continuous radial comb 30 around the circumference. The comb
fingers are aligned radially with the rotor center of rotation
about rotor axis 4. Four sets of stator mating combs are
constructed on four separate quadrants, fixed separately to the
substrate, two of which actuate the Rotor and two sense its
rotation. The stators are connected electrically to pads by
crimping the trace between the Pyrex and the silicon during anodic
bonding.
[0054] The GRA is operated by oscillating the Rotor about the Rotor
Axis 4 (about the normal to the plane), oscillating the Servo
Member about the Servo Axis 5 and sensing the rotation of the TSM
about the GRA Output Axis 6. The GRA Input Axis is the same as the
Rotor Axis.
Rotary Comb Capacitive Sensor
[0055] The rotary comb design 30 is illustrated in FIG. 5. It is
separated into four quadrants 32, 33, 34, 35. For each quadrant,
the comb is divided into a stator with stator comb fingers 36
attached to the substrate 14 and a rotor with rotor comb fingers 38
that are part of the moving Rotor disk 40. The stator fingers and
rotor fingers are aligned radially with the center of rotation of
the disk. For each rotor finger there is a stator finger with the
two separated by a small gap. They make up a comb finger pair.
Pairs of comb fingers are separated by a large gap. A number of
comb finger pairs makes up each quadrant. The sensitivity of the
comb sensor scales with the number of comb finger pairs. By
reducing the small gap between the comb finger pairs, the
sensitivity is increased.
[0056] Neighboring quadrants 33, 34 are designed symmetrically
about the axis that separates them as shown in FIG. 6. For rotation
of the rotor in either direction, the small gap 37 of comb finger
pairs in one quadrant decreases while the small gap of comb finger
pairs in the other quadrant increases. The purpose of the rotary
design based on neighboring quadrants is that when the signals from
the comb finger pairs located on two neighboring quadrants are
differenced, the signals add and the common-mode noise subtracts;
this is differential operation. At zero rotation of the IM, the
output is also zero. The other two quadrants 32, 35 are used to
actuate the rotor.
Metallization Design
[0057] The metallization design 50 is shown in FIG. 7. It consists
of capacitive plates, connecting traces and pads. Capacitive plates
51 and 52 are located under part of the SM on one side of the Servo
Axis. They are connected by a trace. Capacitive plates 53, 54 are
located on the other side. They are connected by a trace. Drive
voltages are applied to the actuator plates to predominantly pull
down on one side of the SM during the first half of the drive cycle
and to predominantly pull down on the other side of the SM during
the second half of the drive cycle. The result is an oscillatory
motion of the SM about the Servo Axis. The sensing of the SM motion
is accomplished with two capacitive plates 55, 56. The outputs are
connected differentially since for any motion, the gap for one
increases and the gap for the other decreases.
[0058] Capacitive plates 70, 71, 72 and 73 are used to sense the
rotation of the TSM.
[0059] Trace 57 connects capacitive plates 51, 52 to the pad 58,
for example.
[0060] Stators of the rotary comb are connected to pads with traces
59 that are crimped between the stator structure and the Pyrex
substrate during anodic bonding. The GRA monolithic structure
containing the SM, Rotor and TSM is connected to electrical ground
with trace 63 crimped between the mounting structures 12 and the
Pyrex substrate.
[0061] Traces also act as capacitive sensing plates when they are
located beneath the moving structure, and this needs to be taken
into consideration. A rule is to make the lengths under the moving
parts equal and symmetric. Pick-up between plates is also a
consideration. Design practices known in the art apply. Electrical
pick-up can be a source of quadrature in the gyro output.
Electrical Leads
[0062] Electrical leads or traces connect the capacitive sensors
and actuators to the termination pads on the periphery of the
instrument. The gyro is grounded by a trace that is crimped under
the supporting mesa during anodic bonding. Stator combs are
connected similarly by crimping traces under their mesas. Plates
are connected directly to the pads.
Several Considerations Apply:
[0063] traces that pass under silicon structures add stray
capacitance, therefore this transit should be minimized, [0064]
traces that are required to pass under silicon structures should be
symmetric so that the influence of any leakage capacitance will
cancel under differential operation of the pick-off (capacitive
sensors) and actuators, and [0065] traces should be routed to
minimize capacitive coupling between them.
Flexures
[0066] The purposes of flexures are to: [0067] set orientational
alignment between members, [0068] govern rotation of the members
about prescribed axes, and [0069] provide support for the
structures.
[0070] The orientational alignment between members is an especially
important consideration for the gyroscope because it will introduce
mechanical coupling between the OM oscillation and the Output
Member to generate quadrature error.
[0071] The ideal flexure allows only motion about one axis.
[0072] The support capability is especially important when
considering shock capability. Through a combination of the
necessary design weight and flexure design, there is a maximum
possible shock capability. Modeling can be used to find
structurally-weak points and strengthen them.
SM Flexure Relief Structure
[0073] The stress relief absorbs the tension on the flexure that is
due to the differential thermal expansion between the Pyrex and
epitaxially-doped silicon, while cooling from the elevated anodic
bonding temperature. If a different process is used, the stress
relief may not be necessary. Without the stress relief, the tension
on the flexure will cause a potato chip deformation of the SM
structure that introduces stress between the SM and the TSM and
rotor, inhibiting their proper operation.
Rotor Flexure
[0074] The W-flexure enables rotation of the IM about the normal to
the plane. Four are used in this design. Each W-flexure is composed
of two bending U-flexures with a stress relief in each. For cases
where the OM applies a tension or compression to the W-flexure, the
stress relief can bend and absorb the stress. In this way, the
flexure does not kink and inhibit rotation of the IM.
Design Modification
[0075] A second design of the first iteration is shown in FIG. 8.
It modifies shape of the TSM from circular to square. One reason is
to reduce the mechanical coupling with the Rotor. The greater
inertia and the larger area would also provide greater capacitive
pick-off sensitivity and a larger proof-mass. The downside is that
the Servo Member surface area is smaller and the capacitive drive
and sense efficiency is reduced.
Description of Preferred Electronics
[0076] The preferred GRA electronics are described with a block
schematic in FIG. 9. A rotary capacitive comb actuator is used to
drive the rotor member into oscillation at its resonant frequency
for low power consumption. A rotary capacitive comb pick-off
(sensor) is used to sense the oscillation amplitude and phase. An
amplitude control loop is used to hold the amplitude constant. The
phase of the motion is used with a phase-lock loop to hold the
rotor member on resonance. Similar electronics are used for the
servo member. The servo member is designed to oscillate at the same
frequency as the rotor member for one embodiment. Capacitive plate
actuators and pick-offs (sensors) are used for this member because
its motion is towards and away from the plane.
[0077] Under acceleration input, the pendulum is caused to rotate.
The pendulum signal is used with a phase control loop to vary the
phase of either the Rotor or Servo Member to apply gyroscope torque
to counter the motion of the pendulum and bring it back to null.
Only rotor phase control is shown in FIG. 9. The cosine of the
phase change is proportional to the acceleration input.
[0078] The maximum operating range of the GRA is set to the most
linear segment of the cos .delta. control variable. The optimum
resolution depends on the smallest equivalent phase that can be
resolved, which depends on the sensor sensitivity and the
electronics noise as determined by the Allan Deviation and Scale
Factor.
Optional Open-Loop Mode of Operation
[0079] The GRA can also be operated open loop. In this case the
Rotor and Servo Members are driven in the same way: at the same
frequency and with constant amplitudes. The difference is that, as
the pendulum is acted upon by acceleration input, the pendulum is
allowed to rotate. The response is a phase change between the
oscillators. The phase change is the output.
Dissolved Wafer Processing
[0080] Dissolved Wafer Processing (DWP) is a MEMS fabrication
process for making relatively large parts with good flatness and
square profiles. The process requires two wafers: the first Pyrex
and the second silicon with a boron-doped epitaxial layer. The
combination of materials enables the two wafers to be anodically
bonded. The thickness of the epitaxy determines the final device
thickness, while boron doping of the epitaxial layer inhibits EDP
etching.
[0081] Typical dimensions include: device size of about 3 mm in the
plane, device thickness of 40 microns, smallest flexure thickness
of 5 microns and gaps between comb fingers of 5 microns.
[0082] Four process masks are needed: two for processing the
silicon and two for the Pyrex. Instrument functions are distributed
between the two layers: the mechanical structure and comb
components are fabricated in the doped silicon layer and the
electrical connections and flat capacitive plate components are
deposited onto the Pyrex layer. A detailed description of the
process follows.
Process Steps
[0083] The process steps are described with reference to FIG. 10.
The starting silicon wafer includes a grown epitaxial layer with
heavy boron diffusion of 43-micron thickness. In step 1, the
epitaxial layer is etched to form mesas that support the silicon
structures on the Pyrex as patterned by Mask 1. The mesa thickness
also sets part of the gap between the device and the substrate that
allows motion of parts. In step 2, deep reactive ion etching is
used to etch through the epitaxial layer to form the device
geometry that includes the structure, mass and combs as patterned
with Mask 2. In step 3, wells are formed in the Pyrex to form the
rest of the required gap using Mask 3. With Mask 4 (step 4), metal
deposited on the Pyrex is patterned to form capacitive plates for
driving and sensing out of plane motions. In addition, Mask 4
patterns traces (conductors) that connect the structure, capacitive
plates and the comb stators to the pads. In step 5, the silicon
wafer is anodically bonded to the Pyrex wafer by the mesas. In step
6 the wafer is cut with a saw along outlines (streets) that
separate devices. Each device is then EDP
(Ethylene-Diamene-Pyrocatechol) etched to remove the silicon,
leaving behind epitaxial devices with movable parts. The thickness
of the devices is equal to the epitaxial thickness minus the mesa
thickness, approximately 40 microns for the present devices. A
conceptual side view of the finished device is shown in FIG.
11.
Advantages/Disadvantages of DWP
[0084] DWP has several advantages: [0085] devices are made of one
material (doped silicon) for greater thermal stability, [0086]
Pyrex serves as a robust substrate since it can be made as thick as
desired, [0087] multiple devices can be fabricated on the same
Pyrex substrate, while making them physically separate, [0088]
thicker doped silicon devices can be made subject to the epitaxial
process, [0089] the process is a relatively low-temperature
process, thereby generating low internal stresses.
[0090] The disadvantages of DWP are not limiting, but can
contribute to cost of fabrication and greater design complication.
They include: [0091] epitaxial growth limits the device thickness
and introduces stresses, [0092] chemical etching of most of the
silicon wafer by EDP, [0093] induced stresses from differential
expansion of the silicon and Pyrex from the anodic bonding
operation, and [0094] reactive ion etching produces some tapering
which makes it difficult to assign a resonance frequency.
[0095] It is important to form flexures with precise geometry and
having a rectangular cross-section. A small variation in the wall
verticality can greatly affect the stiffness and hence the
dynamics. A conical cross-section would also have the effect of
changing the rotation axis of the IM, and perhaps the orthogonality
between the OM and IM axes. This misalignment leads to "quadrature
error" in gyroscopes.
[0096] Since certain changes that would be apparent to one skilled
in the art may be made in the above described embodiments of the
invention without departing from the scope thereof, it is intended
that all matter contained herein be interpreted in an illustrative
and not a limiting sense.
[0097] Other embodiments will occur to those skilled in the art and
are within the following claims.
* * * * *