U.S. patent application number 12/127236 was filed with the patent office on 2008-12-25 for component transferring apparatus and ic handler.
This patent application is currently assigned to SEIKO EPSON CORPORATION. Invention is credited to Hiroaki FUJIMORI, Daisuke KIRIHARA, Masami MAEDA, Naohisa MAEDA, Satoshi NAKAMURA, Takashi YAMAZAKI.
Application Number | 20080317575 12/127236 |
Document ID | / |
Family ID | 40136678 |
Filed Date | 2008-12-25 |
United States Patent
Application |
20080317575 |
Kind Code |
A1 |
YAMAZAKI; Takashi ; et
al. |
December 25, 2008 |
COMPONENT TRANSFERRING APPARATUS AND IC HANDLER
Abstract
A component transferring apparatus includes a shuttle; an
inspection socket; a retaining device that moves between the
shuttle and the inspection socket; a pressing device included in
the retaining device to hold and transfer an electronic component;
a position adjusting device that moves the pressing device to
correct a position of the electronic component based on an image
processing of image data obtained by photographing of the
electronic component; a socket mark provided near the inspection
socket; a hand mark provided on the retaining device such that the
hand mark is positioned near the socket mark when the retaining
device is moved to a mounting position where the electronic
component hold by the pressing device is mounted in the inspection
socket; a first camera provided on the shuttle to photograph a
single image including the electronic component hold by the
pressing device and the hand mark provided on the retaining device;
a second camera that photographs a single image including the
socket mark and the inspection socket and a single image including
the socket mark and the hand mark of the retaining device moved to
the mounting position; a first relative-position calculating unit
that performs an image processing of data obtained by photographing
of the single image including the socket mark and the inspection
socket to obtain a first relative position between the socket mark
and the inspection socket; a second relative-position calculating
unit that performs an image processing of data obtained by
photographing of the single image including the socket mark and the
hand mark located at the mounting position to obtain a second
relative position between the socket mark and the hand mark; and a
third relative-position calculating unit that performs an image
processing of data obtained by photographing of the single image
including the electronic component and the hand mark to obtain a
third relative position between the hand mark and the electronic
component, wherein based on the first, the second, and the third
relative positions, the position adjusting device corrects the
position of the electronic component to mount the electronic
component in the inspection socket.
Inventors: |
YAMAZAKI; Takashi; (Suwa,
JP) ; FUJIMORI; Hiroaki; (Suwa, JP) ; MAEDA;
Naohisa; (Okaya, JP) ; KIRIHARA; Daisuke;
(Chino, JP) ; NAKAMURA; Satoshi; (Matsumoto,
JP) ; MAEDA; Masami; (Suwa, JP) |
Correspondence
Address: |
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 828
BLOOMFIELD HILLS
MI
48303
US
|
Assignee: |
SEIKO EPSON CORPORATION
Tokyo
JP
|
Family ID: |
40136678 |
Appl. No.: |
12/127236 |
Filed: |
May 27, 2008 |
Current U.S.
Class: |
414/754 |
Current CPC
Class: |
G05B 2219/45026
20130101; G05B 2219/37216 20130101; G01R 31/2893 20130101; G05B
2219/40564 20130101 |
Class at
Publication: |
414/754 |
International
Class: |
B25J 11/00 20060101
B25J011/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 22, 2007 |
JP |
2007-165406 |
Claims
1. A component transferring apparatus, comprising: a shuttle; an
inspection socket; a retaining device that moves between the
shuttle and the inspection socket; a pressing device included in
the retaining device to hold and transfer an electronic component;
a position adjusting device that moves the pressing device to
correct a position of the electronic component based on an image
processing of image data obtained by photographing of the
electronic component; a socket mark provided near the inspection
socket; a hand mark provided on the retaining device such that the
hand mark is positioned near the socket mark when the retaining
device is moved to a mounting position where the electronic
component hold by the pressing device is mounted in the inspection
socket; a first camera provided on the shuttle to photograph a
single image including the electronic component hold by the
pressing device and the hand mark provided on the retaining device;
a second camera that photographs a single image including the
socket mark and the inspection socket and a single image including
the socket mark and the hand mark of the retaining device moved to
the mounting position; a first relative-position calculating unit
that performs an image processing of data obtained by photographing
of the single image including the socket mark and the inspection
socket to obtain a first relative position between the socket mark
and the inspection socket; a second relative-position calculating
unit that performs an image processing of data obtained by
photographing of the single image including the socket mark and the
hand mark located at the mounting position to obtain a second
relative position between the socket mark and the hand mark; and a
third relative-position calculating unit that performs an image
processing of data obtained by photographing of the single image
including the electronic component and the hand mark to obtain a
third relative position between the hand mark and the electronic
component, wherein based on the first, the second, and the third
relative positions, the position adjusting device corrects the
position of the electronic component to mount the electronic
component in the inspection socket.
2. The component transferring apparatus according to claim 1,
further comprising a first mirror that is provided on the retaining
device so as to reflect the socket mark and the hand mark located
at the mounting position in a direction of the second camera and a
second mirror that reflects the socket mark and the inspection
socket in the direction of the second camera at a reflecting
position above the inspection socket, wherein the second camera is
located at a position where the single image including the socket
mark and the inspection socket cannot be directly photographed and
also located at a position where the single image including the
socket mark and the hand mark located at the mounting position
cannot be directly photographed, as well as the second camera
photographs the single image including the socket mark and the hand
mark via the first mirror located at the mounting position and also
photographs the single image including the socket mark and the
inspection socket via the second mirror located at the reflecting
position.
3. The component transferring apparatus according to claim 1,
wherein the shuttle includes the first camera, and the retaining
device and the shuttle move to a first photographing position where
the first camera photographs the single image including the
electronic component and the hand mark, so as to allow the first
camera to photograph the single image including the electronic
component and the hand mark at the first photographing
position.
4. The component transferring apparatus according to claim 1,
wherein the socket mark has a circular shape and the hand mark has
an annular shape larger than the socket mark, so as to locate the
socket mark in the annular hand mark at the mounting position.
5. The component transferring apparatus according to claim 1,
wherein the socket mark includes at least two socket marks, and the
hand mark is provided so as to correspond to each of the socket
marks.
6. The component transferring apparatus according to claim 1,
wherein the socket mark has a rectangular shape and the hand mark
has a rectangular frame-like shape larger than the socket mark, so
as to locate the socket mark in the frame-like hand mark at the
mounting position.
7. The component transferring apparatus according to claim 1,
wherein the first relative-position calculating unit obtains the
first relative position from an average of first relative position
values already obtained by a predetermined number of times of
calculations, and the second relative-position calculating unit
obtains the second relative position from an average of second
relative position values already obtained by a predetermined number
of times of calculations.
8. The component transferring apparatus according to claim 1,
wherein when the second camera photographs the single image
including the socket mark and the hand mark, the retaining device
allows a distance between the hand mark and the second camera to be
equal to a distance between the socket mark and the second
camera.
9. The component transferring apparatus according to claim 8,
wherein the hand mark is shorter than the socket mark, and the
retaining device moves to the mounting position before moving to a
position where the distance between the hand mark and the second
camera is equal to the distance between the socket mark and the
second camera.
10. The component transferring apparatus according to claim 1,
wherein the third relative-position calculating unit obtains the
third relative position every time the electronic component is
mounted in the inspection socket; the first relative-position
calculating unit obtains the first relative position every
predetermined number of times of calculations for the third
relative position; and the second relative-position calculating
unit obtains the second relative position every predetermined
number of times of calculations for the third relative
position.
11. The component transferring apparatus according to claim 1,
wherein the third relative-position calculating unit obtains the
third relative position every time the electronic component is
mounted in the inspection socket; the second relative-position
calculating unit obtains the second relative position every time
the electronic component is mounted in the inspection socket; and
the first relative-position calculating unit calculates the first
relative position every predetermined number of times of
calculations for the third relative position.
12. The component transferring apparatus according to claim 1,
wherein the third relative-position calculating unit obtains the
third relative position every time the electronic component is
mounted in the inspection socket; the first relative-position
calculating unit obtains the first relative position every
predetermined number of times of calculations for the third
relative position; and the second relative-position calculating
unit obtains the second relative position when the electronic
component has been transferred to the mounting position.
13. An IC handler comprising the component transferring apparatus
according to claim 1.
Description
BACKGROUND
[0001] 1. Technical Field
[0002] The present invention relates to a component transferring
apparatus and an IC handler.
[0003] 2. Related Art
[0004] In general, a testing apparatus (an IC handler) that
inspects electronic components such as semiconductor chips includes
a plurality of transferring robots to transfer the components. The
transferring robots transfer an electronic component before
inspection into an inspection socket to measure quality of the
component, and then, retrieve the inspected component from the
socket.
[0005] Specifically, for example, a supplying robot sucks and holds
an electronic component before inspection and then releases the
component to mount in a supply pocket of a shuttle. Next, the
shuttle moves the electronic component to a position where a
measuring robot is located to suck and hold the component. The
measuring robot transfers the electronic component before
inspection from the shuttle to the inspection socket. After
inspection is finished, the measuring robot again sucks and holds
the component inspected to transfer it from the inspection socket
into a retrieval pocket of the shuttle. Then, the shuttle moves the
inspected component to a position of a retrieving robot, where the
retrieving robot releases the component into a retrieval tray in
accordance with an inspection result.
[0006] When the robots sequentially transfer the electronic
component to the inspection socket and the pockets, the component
is needed to be mounted in a predetermined position in each of the
inspection socket and the pockets. Particularly, in order to mount
the electronic component in the inspection socket, it is necessary
to suitably contact measuring terminals of the inspection socket
with terminals of the electronic component. Thus, it is desirable
to minimize a relative positional deviation between the electronic
component and the inspection socket. Additionally, when the
component is mounted in each pocket, reducing a relative positional
deviation between the pocket and the component is desired.
[0007] In order to reduce the relative positional deviation between
the electronic component and the inspection socket or the like,
there is known a method. In this method, first, a camera
photographs the electronic component, the inspection socket or the
like to obtain image data. Next, an image processing of the data is
performed to calculate the relative deviation amount, and then,
based on a calculation result, positional correction is performed
by only the relative deviation amount.
[0008] For example, there is disclosed a method for correcting a
relative positional deviation between an electronic component and a
socket or the like (e.g. WO 2003/023430). In an IC handler employed
in the method, when an electronic component before inspection is
transferred from a shuttle to a test device, a camera located
between the shuttle and a test socket (the test device) photographs
the component sucked and hold by a transfer head of a transferring
apparatus. Additionally, a camera equipped with the transfer head
photographs the test device. A controlling device of the IC handler
performs the image processing of each image data obtained by the
above photographing operations to calculate a relative deviation
between the electronic component and the test device. Then, based
on a calculation result, the controlling device operates an
adjustment mechanism of the transferring apparatus to adjust a
position of the transfer head so as to correct the relative
deviation between the component and the test device.
[0009] Additionally, when transferring the inspected electronic
component from the shuttle to a tray, a pick and place (P&P)
robot sucks and holds the component to transfer from the shuttle to
the tray. The IC handler moves the P&P robot to above a camera
located within a movable range of the robot to allow the camera to
photograph the component sucked by the robot. The controlling
device of the IC handler performs the image processing of image
data obtained from the photographing operation to calculate a
relative deviation between the component and the tray. Then, based
on a calculation result, the controlling device operates an
adjustment mechanism of the robot to correct the relative deviation
between the electronic component and the tray.
[0010] In the above method, however, in order to calculate a
relative deviation between the transfer head and the test socket,
the camera of the transfer head is needed to be located with a high
precision. Furthermore, when a relative positional relationship
between the transfer head and the camera is changed due to thermal
expansion and contraction, vibration, or the like, it is impossible
to detect the change to reflect a detection result in the
calculation of the relative deviation.
[0011] Thus, there is disclosed a method for directly photographing
an electronic component and a test device (e.g. Patent No. JP
3063899). The method provides an IC handler including a camera
mounted on a supporting member with a mirror. The mirror is located
between the electronic component and the test device to reflect
both of the component and the test device thereon. When the
component before inspection is hold by a transferring apparatus and
located above the test device in a manner facing the test device,
the camera simultaneously photographs both images of them reflected
on the mirror.
[0012] However, in the above method, it is complicated to locate
and adjust the mirror such that both the component and the test
device can be reflected on the mirror. It is also difficult to
locate and adjust the camera in order to photograph their mirror
images. Moreover, when the electronic component and the test device
are photographed, the mirror is located therebetween. Accordingly,
locating and withdrawing the mirror is a time-consuming task.
SUMMARY
[0013] The present invention has been accomplished to solve the
above problems. An advantage of the invention is to provide a
component transferring apparatus that suitably mounts an electronic
component in a socket in such a manner that changes such as
mechanical distortion and thermal expansion and contraction can be
reflected as needed. Another advantage of the invention is to
provide an IC handler including the component transferring
apparatus.
[0014] A component transferring apparatus according to a first
aspect of the invention includes a shuttle, an inspection socket, a
retaining device that moves between the shuttle and the inspection
socket, a pressing device that is included in the retaining device
to hold and transfer an electronic component, a position adjusting
device that moves the pressing device to correct a position of the
electronic component based on an image processing of image data
obtained by photographing of the electronic component, a socket
mark provided near the inspection socket, a hand mark provided on
the retaining device such that the hand mark is positioned near the
socket mark when the retaining device is moved to a mounting
position where the electronic component hold by the pressing device
is mounted in the inspection socket, a first camera provided on the
shuttle to photograph a single image including the electronic
component hold by the pressing device and the hand mark provided on
the retaining device, a second camera that photograph a single
image including the socket mark and the inspection socket and a
single image including the socket mark and the hand mark of the
retaining device moved to the mounting position, a first
relative-position calculating unit that performs an image
processing of data obtained by photographing of the single image
including the socket mark and the inspection socket to obtain a
first relative position between the socket mark and the inspection
socket, a second relative-position calculating unit that performs
an image processing of data obtained by photographing of the single
image including the socket mark and the hand mark located at the
mounting position to obtain a second relative position between the
socket mark and the hand mark, and a third relative-position
calculating unit that performs an image processing of data obtained
by photographing of the single image including the electronic
component and the hand mark to obtain a third relative position
between the hand mark and the electronic component, wherein based
on the first, the second, and the third relative positions, the
position adjusting device corrects the position of the electronic
component to mount the electronic component in the inspection
socket.
[0015] In the component transferring apparatus of the above aspect,
the socket mark is provided near the inspection socket. Thus, the
inspection socket and the socket mark are photographed as the
single image by the second camera, and the image processing of the
image data obtained by the photographing operation is performed by
the first relative-position calculating unit. In this manner, the
first relative position between the inspection socket and the
socket mark can be obtained. Additionally, the hand mark of the
retaining device is located near the socket mark when the retaining
device is located at the mounting position. Thus, the hand mark and
the socket mark are photographed as the single image by the second
camera, and then, the image processing of the image data obtained
is performed by the second relative-position calculating unit. In
this manner, the second relative position between the hand mark of
the retaining device and the socket mark, namely, a relative
position of the socket mark with respect to the retaining device
can be obtained. Furthermore, the electronic component and the hand
mark are photographed as the single image by the first camera, and
then, the image processing of the data of the image is performed by
the third relative-position calculating unit. In this manner, the
third relative position between the electronic component and the
hand mark, namely, the relative position of the electronic
component with respect to the retaining device can be obtained. As
a result, based on the first to the third relative positions, the
position adjusting device can move the electronic component to a
position suitable for the inspection socket.
[0016] Specifically, installation-induced distortion and thermal
expansion and contraction occurring between the inspection socket
and the socket mark are reflected in the first relative position.
Additionally, the distortion and the temperature-induced change as
above occurring between the socket mark and the hand mark (the
retaining device) are reflected in the second relative position.
Furthermore, a sucking position deviation of the electronic
component with respect to the hand mark (the retaining device) is
reflected in the third relative position. As a result, the
electronic component can be suitably mounted in the inspection
socket in such a manner that the installation-induced distortion
and thermal expansion and contraction in the component transferring
apparatus are reflected as needed.
[0017] Additionally, since the above-mentioned physical changes
occurring in the component transferring apparatus can be reflected
as needed, no calibration as an initial setting is again needed to
correct those changes as above. This can reduce time and work
required for the calibration.
[0018] Preferably, the component transferring apparatus includes a
first mirror that is provided on the retaining device so as to
reflect the socket mark and the hand mark located at the mounting
position in a direction of the second camera and a second mirror
that reflects the socket mark and the inspection socket in the
direction of the second camera at a reflecting position above the
inspection socket, in which the second camera is located at a
position where the single image including the socket mark and the
inspection socket cannot be directly photographed and also located
at a position where the single image including the socket mark and
the hand mark located at the mounting position cannot be directly
photographed, as well as the second camera photographs the single
image including the socket mark and the hand mark via the first
mirror located at the mounting position and also photographs the
single image including the socket mark and the inspection socket
via the second mirror located at the reflecting position.
[0019] In the above apparatus, even when the second camera is
located at the position where it is impossible for the camera to
directly photograph the image including the socket mark and the
inspection socket and the image including the socket mark and the
hand mark, the second camera can photograph those images as in the
case of direct photographing. Accordingly, the second camera can be
located with greater freedom on a periphery of the retaining device
and the inspection socket where the location position for the
second camera is very limited. This can facilitate photographing of
the socket mark and the inspection socket together and
photographing of the socket mark and the hand mark together.
[0020] Additionally, the first and the second mirrors are provided,
whereby the single second camera can be used to photograph both the
single image including the socket mark and the inspection socket
and the single image including the socket mark and the hand mark.
This can help to simplify the structure of the component
transferring apparatus.
[0021] In the component transferring apparatus of the first aspect,
preferably, the shuttle includes the first camera, and the
retaining device and the shuttle move to a first photographing
position where the first camera photographs the single image
including the electronic component and the hand mark, so as to
allow the first camera to photograph the single image including the
electronic component and the hand mark at the first photographing
position.
[0022] In the above component transferring apparatus, the first
camera is provided in the shuttle. Thus, it is unnecessary to
provide a place for the first camera on the periphery of the
retaining device and the inspection socket in which there are many
limitations in the camera's location. Accordingly, the structure of
the component transferring apparatus can be simplified and also the
location of the first camera can be facilitated.
[0023] In the component transferring apparatus of the first aspect,
preferably, the socket mark has a circular shape and the hand mark
has an annular shape larger than the socket mark, so as locate the
socket mark in the annular hand mark at the mounting position.
[0024] In the above apparatus, since the circular socket mark is
located in the annular hand mark, a comparison between a center
position of the socket mark and a center position of the hand mark
can be easily made in the image processing for calculating the
relative position therebetween.
[0025] In the component transferring apparatus of the first aspect,
preferably, the socket mark includes at least two socket marks, and
the hand mark is provided so as to correspond to each of the socket
marks.
[0026] In the above apparatus, for example, using two socket marks
and two hand marks enables detection of an inclination of a line
connecting the two hand marks with respect to a line connecting the
two socket marks. Thus, the inclination between the two lines,
namely, an angular deviation between the lines can be calculated.
Additionally, based on an inclination between the line connecting
the socket marks and a first side of the socket, an angular
deviation between the line connecting the socket marks and the
first side of the socket can be calculated. Furthermore, based on
an inclination between the line connecting the hand marks and a
first side of the electronic component, an angular deviation
between the line connecting the hand marks and the first side of
the electronic component can be calculated. As a result, there can
be obtained an angle of inclination of the first side of the
electronic component and an angle of inclination of the first side
of the inspection socket, whereby there can be calculated an
angular deviation amount between the first side of the electronic
component and the first side of the inspection socket.
Consequently, the electronic component can be suitably mounted in
the inspection socket by allowing the angular deviation amount
therebetween to be "zero" so as to make the position of the
electronic component coincident with the position of the inspection
socket.
[0027] In the component transferring apparatus of the first aspect,
preferably, the socket mark has a rectangular shape and the hand
mark has a rectangular frame-like shape larger than the socket
mark, so as to locate the socket mark in the frame-like hand mark
at the mounting position.
[0028] In the above apparatus, even if the hand mark and the socket
mark, respectively, include a single mark, center positions of the
rectangular shapes of the marks can be compared with each other to
calculate a relative position between the marks, as well as
directions of the rectangular shapes of the marks can be compared
with each other to calculate an angular deviation therebetween.
Thus, it is possible to reduce the numbers of the hand mark and the
socket mark.
[0029] In the component transferring apparatus of the first aspect,
preferably, the first relative-position calculating unit obtains
the first relative position from an average of first relative
position values already obtained by a predetermined number of times
of calculations, and the second relative-position calculating unit
obtains the second relative position from an average of second
relative position values already obtained by a predetermined number
of times of calculations.
[0030] In the above apparatus, in order to obtain the first
relative position between the socket mark and the inspection socket
and the second relative position between the socket mark and the
hand mark in which values are not abruptly fluctuated, using data
obtained by the plurality of times of the calculations can
stabilize values of the relative positions to be newly
calculated
[0031] In the component transferring apparatus of the first aspect,
preferably, when the second camera photographs the single image
including the socket mark and the hand mark, the retaining device
allows a distance between the hand mark and the second camera to be
equal to a distance between the socket mark and the second
camera.
[0032] In the above apparatus, the second camera can photograph the
single image including the socket mark and the hand mark that are
located in a situation which the distance of the socket mark from
the second camera is equal to that of the hand mark from the second
camera. If the distances are different from each other, an error is
likely to occur in the image processing of the image data. However,
in the above apparatus, the distances of the marks from the second
camera are equalized so as to reduce such an error. Accordingly,
the relative distance between the socket mark and the hand mark can
be more suitably calculated.
[0033] In the component transferring apparatus of the first aspect,
preferably, the hand mark is shorter than the socket mark, and the
retaining device moves to the mounting position before moving to a
position where the distance between the hand mark and the second
camera is equal to the distance between the socket mark and the
second camera.
[0034] In the above apparatus, when the second camera photographs
the marks, the hand mark can be separated from the mounting
position. This can prevent thermal transmission to the hand mark
from the inspection socket or the like and thermal expansion and
contraction in the hand mark, so that the relative position between
the socket mark and the hand mark can be more suitably
calculated.
[0035] In the component transferring apparatus of the first aspect,
preferably, the third relative-position calculating unit obtains
the third relative position every time the electronic component is
mounted in the inspection socket; the first relative-position
calculating unit obtains the first relative position every
predetermined number of times of calculations for the third
relative position; and the second relative-position calculating
unit obtains the second relative position every predetermined
number of times of calculations for the third relative
position.
[0036] The above apparatus reduces calculation frequencies of the
first relative position between the socket mark and the inspection
socket and the second relative position between the socket mark and
the hand mark in which values are less fluctuated. This can reduce
time required for the component transferring apparatus to mount the
electronic component in the inspection socket.
[0037] In the component transferring apparatus of the first aspect,
preferably, the third relative-position calculating unit obtains
the third relative position every time the electronic component is
mounted in the inspection socket; the second relative-position
calculating unit obtains the second relative position every time
the electronic component is mounted in the inspection socket; and
the first relative-position calculating unit obtains the first
relative position every predetermined number of times of
calculations for the third relative position.
[0038] The above apparatus reduces the calculation frequency of the
first relative position between the socket mark and the inspection
socket in which the fluctuation of values is the least. This can
reduce the time required for the component transferring apparatus
to mount the electronic component in the inspection socket.
[0039] In the component transferring apparatus of the first aspect,
preferably, the third relative-position calculating unit obtains
the third relative position every time the electronic component is
mounted in the inspection socket; the first relative-position
calculating unit obtains the first relative position every
predetermined number of times of calculations for the third
relative position; and the second relative-position calculating
unit obtains the second relative position when the electronic
component has been transferred to the mounting position.
[0040] In the above apparatus, the second relative position between
the socket mark and the hand mark is obtained when the electronic
component has been mounted in the inspection socket. This can omit
an additional operation for obtaining the second relative
position.
[0041] An IC handler according to a second aspect of the invention
includes the component transferring apparatus according to the
first aspect.
[0042] In the IC hander of the second aspect, the socket mark is
provided near the inspection socket. Thus, the second camera
photographs the single image including the inspection socket and
the socket mark, and the first relative-position calculating unit
performs the image processing of data of the image. Thereby, the
first relative position between the inspection socket and the
socket mark can be obtained. In addition, the hand mark provided on
the retaining device is located near the socket mark when the
retaining device is located at the mounting position. Accordingly,
the second camera photographs the single image including the hand
mark and the socket mark, and then, the second relative-position
calculating unit performs the image processing of data of the
image. Thereby the second relative position between the hand mark
of the retaining device and the socket mark, namely, the relative
position of the socket mark with respect to the retaining device
can be obtained. Furthermore, the first camera photographs the
single image including the electronic component and the hand mark,
and then, the third relative-position calculating unit performs the
image processing of data of the image. Thereby, the third relative
position between the electronic component and the hand mark,
namely, the relative position of the electronic component with
respect to the retaining device can be obtained. As a result, based
on the first to the third relative positions, the position
adjusting device can move the electronic component to the position
suitable for the inspection socket.
[0043] Specifically, installation-induced distortion and thermal
expansion and contraction occurring between the inspection socket
and the socket mark are reflected in the first relative position.
Additionally, the distortion and the temperature-induced physical
change as above occurring between the socket mark and the hand mark
(the retaining device) are reflected in the second relative
position. Furthermore, the sucking position deviation of the
electronic component with respect to the hand mark (the retaining
device) is reflected in the third relative position. As a result,
the electronic component can be suitably mounted in the inspection
socket in such a manner that installation-induced distortion and
thermal expansion and contraction occurring in the IC handler are
reflected as needed.
[0044] Furthermore, since the above-mentioned physical changes
occurring in the IC handler can be reflected as needed, it is
unnecessary to perform a calibration (an initial setting) again to
correct the physical changes such as the distortion and the
expansion and contraction. This can reduce time and work required
for the calibration.
BRIEF DESCRIPTION OF THE DRAWINGS
[0045] The invention will be described with reference to the
accompanying drawings, wherein like numbers reference like
elements.
[0046] FIG. 1 is a plan view showing a planar structure of an IC
handler according to an embodiment of the invention.
[0047] FIGS. 2A and 2B, respectively, are a plan view showing a
planar structure of a shuttle included in the embodiment and a
front view showing a frontal structure of the shuttle.
[0048] FIGS. 3A and 3B, respectively, are a plan view showing a
planar structure of an inspection section included in the
embodiment and a front view showing a frontal structure of the
inspection section.
[0049] FIGS. 4A, 4B, and 4C, respectively, are a front view showing
a frontal structure of a measuring robot included in the
embodiment, a bottom view showing a bottom structure of the
measuring robot, and a left side view showing a left side structure
of the measuring robot.
[0050] FIGS. 5A and 5B, respectively, are a plan view showing a
planar structure of a hand mark included in the embodiment and a
sectional view of the hand mark taken along line 5-5 in FIG.
5A.
[0051] FIG. 6 is a front view showing a frontal structure of each
of a photographing device and a reflecting device included in the
embodiment.
[0052] FIGS. 7A and 7B, respectively, are an illustrative view
illustrating a photographing operation by a shuttle camera included
in the embodiment and an illustrative view illustrating a
photographing range.
[0053] FIGS. 8A and 8B, respectively, are an illustrative view
illustrating a photographing operation by a chamber camera via a
first reflector included in the embodiment and an illustrative view
illustrating a photographing range of the chamber camera.
[0054] FIGS. 9A and 9B, respectively, are an illustrative view
illustrating a photographing operation by a chamber camera via a
second reflector included in the embodiment and an illustrative
view illustrating a photographing range of the chamber camera.
[0055] FIG. 10 is a block diagram showing an electrical structure
of the IC handler of the embodiment.
[0056] FIG. 11 is an illustrative view illustrating a device
recognition processing of the embodiment.
[0057] FIG. 12 is an illustrative view illustrating a mark-position
recognition processing of the embodiment.
[0058] FIG. 13 is an illustrative view illustrating a socket
recognition processing of the embodiment.
[0059] FIG. 14 is a flowchart showing an example of a processing
for transferring an IC chip T of the embodiment to inspect the
chip.
[0060] FIG. 15 is a flowchart showing a socket recognition
processing of the IC handler of the embodiment.
[0061] FIG. 16 is a flowchart showing a mark recognition processing
of the IC handler of the embodiment.
[0062] FIG. 17 is a flowchart showing a device recognition
processing of the IC handler of the embodiment.
[0063] FIG. 18 is a flowchart showing another example of the
processing for transferring the IC chip T of the embodiment to
inspect the chip.
[0064] FIG. 19 is a flowchart showing another example of the
processing for transferring the IC chip T of the embodiment to
inspect the chip.
DESCRIPTION OF EXEMPLARY EMBODIMENTS
[0065] Hereinafter, embodiments of the invention will be described
in detail with reference to the drawings.
First Embodiment
[0066] FIGS. 1 to 17 will be referred to describe a first
embodiment of the invention. FIG. 1 is a plan view showing an IC
handler 10 including a component transferring apparatus according
to the first embodiment.
[0067] The IC handler 10 includes a base 11, a safety cover 12, a
high temperature chamber 13, a supplying robot 14, a retrieving
robot 15, a first shuttle 16, a second shuttle 17, and a plurality
of conveyors C1 to C6.
[0068] The base 11 includes the above elements provided on a top
surface thereof. The safety cover 12 encloses a large area of the
base 11, where there are housed the supplying robot 14, the
retrieving robot 15, the first shuttle 16, and the second shuttle
17.
[0069] The conveyors C1 to C6 are provided on the base 11 such that
first ends of the conveyors are located on an outside of the safety
cover 12 and second ends thereof are located on an inside of the
cover. Each of the conveyors C1 to C6 transfers a tray 18 that
contains a plurality of IC chips T such as semiconductor chips as
electronic components or threshold-setting components, from the
outside to the inside of the safety cover 12 or from the inside to
the outside of the cover.
[0070] The supplying robot 14 includes an X-axis frame FX, a first
Y-axis frame FY1, and a supplying robot hand unit 20. The
retrieving robot 15 includes the X-axis frame FX, a second Y-axis
frame YF2, and a retrieving robot hand unit 21. The X-axis frame FX
is arranged in an X direction. The first and the second Y-axis
frames FY1 and FY2 are arranged such that both of the frames are
parallel to each other in a Y direction, and also are supported
movably in the X direction with respect to the X-axis frame FX. The
first and the second Y-axis frames FY1 and FY2 are reciprocally
moved along the X-axis frame FX in the X direction by each motor
(not shown) disposed on the X-axis frame FX.
[0071] On a lower side of the first Y-axis frame FY1, the supplying
robot hand unit 20 is supported movably in the Y direction. The
supplying robot hand unit 20 is reciprocally moved along the first
Y-axis frame FY1 in the Y direction by each motor (not shown)
disposed on the first Y-axis frame FY1. For example, the supplying
robot hand unit 20 supplies pretest IC chips T contained in the
tray 18 of the conveyor C1 to the first shuttle 16.
[0072] On a lower side of the second Y-axis frame FY2, the
retrieving robot hand unit 21 is supported movably in the Y
direction. The retrieving robot hand unit 21 is reciprocally moved
along the second Y-axis frame FY2 in the Y direction by each motor
(not shown) disposed on the second Y-axis frame FY2. For example,
the retrieving robot hand unit 21 supplies post-test IC chips T
supplied to the first shuttle 16 to the tray 18 of the conveyor
C6.
[0073] Between the supplying robot 14 and the retrieving robot 15
on the top surface of the base 11, a first rail 30A and a second
rail 30B, respectively, are arranged in parallel to the X-axis
direction. The first rail 30A includes the first shuttle 16 and the
second rail 30B includes the second shuttle 17. The first and the
second shuttles 16 and 17, respectively, are reciprocally movable
in the X-axis direction.
[0074] The first shuttle 16 includes an approximately planar base
member 16A that is elongated in the X-axis direction. On a bottom
surface of the base member 16A is provided a not-shown rail guide
that is in sliding contact with the first rail 30A. Then, the first
shuttle 16 is reciprocally moved along the first rail 30A by a
first shuttle motor M1 (See FIG. 10) included in the first shuttle
16.
[0075] On a left side on a top surface of the base member 16A (on a
side where the supplying robot 14 is located), a supply change kit
31 is exchangeably fixed by a screw or the like.
[0076] On a top surface of the supply change kit 31 are formed four
rectangular pockets 32 for placing the IC chips T supplied from the
supplying robot 14.
[0077] Each of the pockets 32 retains each of the placed IC chips
in a loosely fitting manner. Thus, the IC chip T is retained in a
predetermined position of the pocket 32 when the first shuttle 16
is moved.
[0078] On a right side on the top surface of the base member 16A
(on a side where the retrieving robot 15 is located), a retrieval
change kit 34 similar to the supply change kit 31 is exchangeably
fixed by a screw or the like to retain the IC chip T in each pocket
32 as in the supply change kit 31.
[0079] The second shuttle 17 has an approximately rectangular base
member 17A that is elongated in the X-axis direction. On a bottom
surface of the base member 17A is provided a not-shown rail guide
in sliding contact with the second rail 30B. The second shuttle 17
is reciprocally moved along the second rail 30B by a second shuttle
motor M2 (See FIG. 10) included in the second shuttle 17.
[0080] On a left side on a top surface of the base member 17A (on
the side where the supplying robot 14 is located), the supply
change kit 31 as in the base member 16A is exchangeably fixed by a
screw or the like to retain the IC chip T in each pocket 32 of the
supply change kit 31. Additionally, on a right side on the top
surface of the base member 17A (on the side where the retrieving
robot 15 is located), the retrieval change kit 34 similar to the
supply change kit 31 is exchangeably fixed by a screw or the like
to retain the IC chip T in each pocket 32.
[0081] As shown in FIGS. 2A and 2B, at centers of the top surfaces
of the first and the second shuttles 16 and 17, a first shuttle
camera 37 and a second shuttle camera 38, each serving as a first
camera, are respectively provided to photograph an object above
each of the cameras. In other words, the first and the second
shuttle cameras 37 and 38, respectively, are operated to photograph
the IC chip T retained at an upper position by a below-mentioned
measuring robot 22 from a lower position so as to output data of an
image obtained by the photographing operation. At a position
immediately below the measuring robot 22, an entire view of the
retained IC chip T and surroundings of the chip can be photographed
at one time. In addition, in the present embodiment, the first and
the second shuttle cameras 37 and 38 are CCD cameras, but are not
restricted to CCDs.
[0082] Between the first and the second shuttles 16 and 17 on the
top surface of the base 11 is provided an inspection section 23. As
shown in FIGS. 3A and 3B, the inspection section 23 includes an
inspection socket 24 for mounting the IC chip T therein, and a
first socket pin 25A and a second socket pin 25B. The first and
second socket pins 25A and 25B are protrudingly provided on a
socket pin arrangement line AY1 that is set closer to the supplying
robot 14 than is the inspection socket 24 and that is parallel to
the Y direction. The first socket pin 25A is provided on a side
where the second shuttle 17 is located (a front side) and the
second socket pin 25B is provided on a side where the first shuttle
16 is located (a back side). In this case, center positions of the
socket pins 25A and 25B are distant from each other by a length LSy
in the Y direction (front and back directions).
[0083] The inspection socket 24 is used to perform an electrical
inspection of the IC chip T mounted in the socket. The inspection
socket 24 includes a plurality of contact terminals 24T used for
chip inspection. The contact terminals 24T correspond to connection
terminals B of the IC chip T as an object to be inspected (See
FIGS. 4A to 4C). In the inspection socket 24, the connection
terminals B of the IC chip T are contacted with the contact
terminals 24T to be electrically connected with each other so as to
perform the electrical inspection of the IC chip T.
[0084] As shown in FIG. 3B, each of the socket pins 25A and 25B is
formed to have a circular columnar shape with a diameter R1 and a
height LSz and is made of a material that is silver and that is
hardly expanded and contracted or hardly distorted even if a
temperature changes, such as a metal. At circular centers of top
portions of the socket pins 25A and 25B, respectively, are provided
socket marks 260 and 261, respectively, used for image
recognition.
[0085] The socket marks 260 and 261 are each made of a material
that is circular and black, as well as is hardly expanded and
contracted or hardly distorted even if a temperature changes, such
as a metal. In other words, the socket pins 25A and 25B each have a
color tone distinctively different from that of the socket marks
260 and 261, so that the socket marks 260 and 261 can be suitably
recognized in an image recognition processing. Additionally,
centers of the socket marks 260 and 261 are arranged to be
positioned on the socket pin arrangement line AY1.
[0086] In the inspection section 23, the inspection socket 24 and
the socket marks 260 and 261 are arranged to have a predetermined
relative positional relationship.
[0087] Inside the high temperature chamber 13 is provided a
not-shown rail that is arranged in the Y direction so as to stride
above the first and the second shuttles 16, 17 and the inspection
socket 24.
[0088] At a lower portion of the rail, the measuring robot 22 is
supported in a reciprocally movable manner in the Y direction and
is reciprocally moved in the Y direction by a Y-axis motor MY (See
FIG. 10) provided on the rail. In other words, the measuring robot
22 is moved along the rail to mutually transfer the IC chip T
between the shuttles 16, 17 and the inspection socket 24.
[0089] Specifically, the measuring robot 22 acquires the IC chip T
supplied from each of the shuttles 16 and 17 to arrange the IC chip
T at a position immediately above the inspection socket 24. Then,
the measuring robot 22 lowers the IC chip T to allow the connection
terminals B of the IC chip T to be abutted with the contact
terminals 24T of the inspection socket 24 from above and pushes a
spring pin downward, so as to mount the IC chip T in the inspection
socket 24. After finishing an electrical inspection of the IC chip
T mounted in the inspection socket 24, the measuring robot 22
extracts the IC chip T mounted therein to locate the chip at a
position immediately above the retrieval change kit 34. Next, at
the position immediately above the kit 34, the measuring robot 22
lowers the IC chip T to contain the chip in a predetermined one of
the pockets 32 of the kit 34.
[0090] As shown in FIG. 4A, the measuring robot 22 includes a
supporting portion 22A, a connecting portion 22B, and a pressing
and retaining portion 22C of a retaining device. An upper portion
of the supporting portion 22A is supported so as to be reciprocally
movable in the front and back directions (the Y direction) with
respect to the not-shown rail. At a lower portion of the supporting
portion 22A, the connecting portion 22B is connected and supported
in a reciprocally movable manner in upper and lower directions (a Z
direction) with respect to the portion 22A. The connecting portion
22B is reciprocally moved in the upper and lower directions by a
Z-axis motor MZ (See FIG. 10) of the supporting portion 22A. A
lower end of the connecting portion 22B is fixed to the pressing
and retaining portion 22C that is reciprocally moved in the upper
and lower directions along with the connecting portion 22B. In
short, the pressing and retaining portion 22C of the measuring
robot 22 is structured so as to be movable in the front and back
directions (the Y direction) and the upper and lower directions
(the Z direction) with respect to the rail.
[0091] The pressing and retaining portion 22C is located so as to
be positioned immediately above the inspection socket 24 when the
measuring robot 22 is moved in the front and read direction (the Y
direction) to be located in a middle position between the first and
the second shuttles 16 and 17.
[0092] At a lower portion of the pressing and retaining portion 22C
is provided a pressing device 26 that is to be facingly opposed to
the inspection socket 24 and the pockets 32. The pressing device 26
is structured to extend downward and to descend from an initial
position as a descending-movement starting position to a suction
starting position and a mounting position.
[0093] At a center of a lower portion of the pressing device 26 is
provided a suction nozzle 27. Specifically, after the suction
nozzle 27 is facingly opposed to each pocket 32 of the supply
change kit 31 containing the IC chip T and the inspection socket
24, a top portion of the nozzle moves to the suction position to
reach the IC chip T. Additionally, after the suction nozzle 27 is
facingly opposed to each pocket 32 of the retrieval change kit 34
and the inspection socket 24, the top portion of the nozzle that
sucks and holds the IC chip T is moved to the mounting position of
the socket to press the IC chip T.
[0094] At the top portion of the suction nozzle 27 is provided a
not-shown suction hole. The suction hole communicates through an
inside of the suction nozzle 27 to be connected to a sucking device
52 via a suction valve V1 (See FIG. 10). Specifically, when the
suction nozzle 27 is connected to the sucking device 52 by
switching of the suction valve V1, the suction hole of the suction
nozzle 27 has a negative pressure, by which the suction hole of the
nozzle sucks the IC chip T. Conversely, when connection of the
suction valve V1 is switched from the sucking device 52 to an
atmosphere to connect the suction nozzle 27 to the atmosphere, the
suction hole of the suction nozzle 27 has an atmospheric pressure,
whereby the sucked IC chip T is released from the suction hole of
the nozzle.
[0095] Inside the pressing and retaining portion 22C is provided a
position adjusting device 25 corresponding to the pressing device
26. The position adjusting device 25 allows the pressing device 26
(the suction nozzle 27) to move in the right and left directions
(the X direction) and the front and back directions (the Y
direction) with respect to the pressing and retaining portion 22C,
and also is structured to rotate around a center axis of the
suction nozzle 27 as a rotational center with respect to a
horizontal surface (an XY plane). In other words, the position
adjusting device 25 moves the IC chip T sucked and hold by the
suction nozzle 27 in the right and left directions (the X
direction) and the front and back directions (the Y direction), as
well as rotates the center axis of the suction nozzle 27 as the
rotational center to correct a position of the IC chip T.
[0096] The measuring robot 22 allows the position adjusting device
25 to move the center position of the suction nozzle 27 to a
predetermined initial position coincident with a predetermined
center position of a bottom surface of the pressing and retaining
portion 22C, as well as to rotate the center axis of the suction
nozzle 27 to a predetermined initial angle where a rotational angle
of the center axis of the nozzle is "zero", before sucking and
holding the IC chip T by the suction nozzle 27. In other words, the
suction nozzle 27 sucks and holds the IC chip T after being set to
the predetermined initial position and the predetermined initial
angle with respect to the pressing and retaining portion 22C.
[0097] As shown in FIGS. 4A to 4C, a pair of supporting posts 28A
is fixed on a side surface of the pressing and retaining portion
22C facing the supplying robot 14. The supporting posts 28A are
disposed to be extended downward from the side surface by a
predetermined gap between the posts in the Y direction. A mark
formation member 28B is attached to lower portions of the
supporting posts 28A so as to be retained by both posts.
[0098] The mark formation member 28B is, as shown in FIGS. 5A and
5B, a rectangular planar member made of a material that is silver
and that is hardly expanded and contracted or hardly distorted even
if a temperature changes, such as a metal. Additionally, the mark
formation member 28B has the height LSz.
[0099] The mark formation member 28B has two through-holes 28H
formed at a position where center positions of the holes are
separated from each other by the distance LSy. Each of the
through-holes 28H has a cylindrical member 28C inserted and fitted
thereinside. The cylindrical members 28C each have the height LSz
and an inner diameter R2 larger than the diameter R1 of each of the
first and the second socket pins 25A and 25B. In other words, when
the mark formation member 28B is lowered after being facingly
opposed to the first and the second socket pins 25A and 25B, the
first and the second socket pins 25A and 25B are inserted in the
cylindrical members 28C corresponding to the socket pins,
respectively. In addition, a line connecting the center positions
of the through-holes 28H, namely, the center positions of the
cylindrical members 28C is referred to as a hand mark arrangement
line AY2. The mark formation member 28B is disposed with the
pressing and retaining member 22C such that the hand mark
arrangement line AY2 is approximately parallel to the Y
direction.
[0100] The cylindrical members 28C are each made of a material that
is black and that is hardly expanded and contracted or hardly
distorted even if a temperature changes, such as a metal.
Additionally, annular surfaces of the cylindrical members 28C
located on a bottom surface 28D of the mark formation member 28B
are referred to as a first bottom surface hand mark 280 and a
second bottom surface hand mark 281 that each have an annular
shape. Furthermore, annular surfaces of the cylindrical members 28C
located on a top surface 28E of the mark formation member 28B are
referred to as a first top surface hand mark 282 and a second top
surface hand mark 283 that each have an annular shape.
[0101] The first bottom surface hand mark 280 and the first top
surface hand mark 282 having the same shape are separated from each
other in the Z direction. Additionally, the second bottom surface
hand mark 281 and the second top surface hand mark 283 having the
same shape are also provided in the same manner as above.
[0102] When the first and the second socket pins 25A and 25B,
respectively, are inserted in the cylindrical members 28C, the
first and the second top surface hand marks 282 and 283 are
approximately as high as the first and the second socket marks 260
and 261, whereby top surface positions of those marks are made
coincident with each other. Furthermore, since the mark formation
member 28B has a color tone greatly different from that of the hand
marks 280 to 283, the hand marks 280 to 283 can be suitably
recognized in the image recognition processing.
[0103] On the side surface of the pressing and retaining portion
22C facing the supplying robot 14, a first reflector 29 is provided
at a position upper than the supporting posts 28A. The first
reflector 29 includes a first mirror 29A. The first reflector 29 is
retained on the side surface of the pressing and retaining portion
22C facing the supplying robot 14 in such a manner that a planar
mirror image of the mark formation member 28B can be reflected on
the first mirror 29A. In other words, the first mirror 29A can
reflect the planar mirror mage of the mark formation member 28B in
a direction to the supplying robot 14 from the measuring robot 22
(in the left direction).
[0104] As shown in FIG. 6, inside the high temperature chamber 13
is provided a photographing device 40. Specifically, on a side
surface inside the high temperature chamber 13 facing the supplying
robot 14 is provided a horizontal rail 41 that extends in a
direction of the inspection section 23 (in the right direction of
FIG. 6). At a lower portion of the horizontal rail 41 is provided a
vertical rail 42 that allows the horizontal rail 41 to move in the
right and left directions (the X direction) by a horizontal motor
M3X of the horizontal rail 41. On a side surface of a front side of
the vertical rail 42 (the surface facing the second shuttle 17) is
provided a supporting board 43 that allows the vertical rail 42 to
move in the upper and lower directions (the Z direction) by a
vertical motor M3Z of the vertical rail 42. On the supporting board
43 is provided a chamber camera 44. The chamber camera 44 serves as
a second camera and is located in a direction where the camera 44
can capture a left side surface of the measuring robot 22 arranged
above the inspection section 23 in a photographing range.
[0105] Specifically, the chamber camera 44 is movable to a standby
position where the camera does not interfere with the measuring
robot 22 and to a photographing position for photographing
operation by the horizontal motor M3X and the vertical motor M3Z
that are drivingly controlled. Then, the chamber camera 44 located
at the photographing position can capture the first mirror 29A on
the side surface of the measuring robot 22 in the photographing
range to photograph the planar image of the mark formation member
28B via the first mirror 29A. In the present embodiment, the
chamber camera 44 is a CCD camera but is not restricted to
that.
[0106] As shown in FIG. 6, inside the high temperature chamber 13
is provided a reflector device 45. Specifically, on a side surface
inside the high temperature chamber 13 facing the retrieving robot
15 is provided a horizontal rail 46 that extends in the direction
of the inspection section 23 (in the left direction of FIG. 6). At
a lower portion of the horizontal rail 46 is provided a vertical
rail 47 that allows the horizontal rail 46 to move in the right and
left directions (the X direction) by a horizontal motor M4X of the
horizontal rail 46. On a side surface of a front side of the
vertical rail 47 (the surface facing the second shuttle 17) is
provided a supporting board 48 that allows the vertical rail 47 to
move in the upper and lower directions (the Z direction) by a
vertical motor M4Z of the vertical rail 47. On the supporting board
48 is provided a horizontal arm 48A extending in the direction of
the inspection section 23. At a top portion of the horizontal arm
48A is provided a second reflector 49. The second reflector 49
includes a second mirror 49A that reflects a planar mirror image of
the inspection section 23 in the direction of the chamber camera 44
(in the left direction of FIG. 6) when the second reflector 49 is
moved and located above the inspection section 23.
[0107] When the measuring robot 22 is located above the inspection
section 23, the second mirror 49A is withdrawn to a withdrawing
position in a direction of the retrieving robot 15 (in the right
direction of FIG. 6) so as not to interfere with the measuring
robot 22. Meanwhile, when the measuring robot 22 is not present
above the inspection section 23, the second mirror 49A is
maintained at a position as high as the chamber camera 44 to be
moved and located at a reflecting position above the inspection
section 23. Then, after the second mirror 49A is located at the
reflecting position, the chamber camera 44 located at the
photographing position can photograph planar images of the
inspection socket 24, the first and the second socket marks 260 and
261 of the inspection section 23 via the second mirror 49A.
[0108] In the IC handler 10, as shown in FIG. 7A, the measuring
robot 22 holding the IC chip T and the first shuttle 16 can be
relatively moved to a first photographing position CP1 where the
first shuttle camera 37 can capture the IC chip T and the first and
the second bottom surface hand marks 280 and 281 in a same visual
field.
[0109] When the measuring robot 22 and the first shuttle camera 37
are relatively moved to the above position CP1, the IC chip T and
the first and the second bottom surface hand marks 280 and 281 are
captured in the visual field of the first shuttle camera 37,
namely, a photographing range L1 so as to photograph the chip and
the hand marks at one time, as shown in FIG. 7B.
[0110] Data of an image obtained in the above photographing
operation is used to perform a "device recognition processing",
which is an image recognition processing for obtaining coordinates
of a center position DC (See FIG. 7B) of the IC chip T with respect
to the first bottom surface hand mark 280 and an angular deviation
of a first side of the IC chip T with respect to the hand mark
arrangement line AY2.
[0111] As shown in FIG. 8A, the measuring robot 22 located above
the inspection socket 24 mounts the retained IC chip T in the
inspection socket 24. In this situation, the first and the second
socket pins 25A and 25B, respectively, are inserted in the first
and the second top surface hand marks 282 and 283, respectively,
with a clearance fit, so as to make positions of the top surface
hand marks 282 and 283 coincident with positions of the top
surfaces of the socket marks 260 and 261.
[0112] When the chamber camera 44 is located at a second
photographing position CP2 where images of the top surface hand
marks 282 and 283 are reflected via the first reflector 29, the
chamber camera 44 captures the top surface hand marks 282 and 283
and the socket marks 260 and 261 in a photographing range L2 of the
chamber camera 44, as shown in FIG. 8B, to photograph an image
including those marks.
[0113] Data of the image photographed above is used to perform a
"mark-position recognition processing", which is an image
recognition processing for obtaining coordinates of a center
position of the first top surface hand mark 282 with respect to the
first socket mark 260 and an angular deviation of the hand mark
arrangement line AY2 with respect to the socket pin arrangement
line AY1.
[0114] Furthermore, when the measuring robot 22 is not located
above the inspection section 23, as shown in FIG. 9A, the chamber
camera 44 is positioned as high as the second mirror 49A. Then, the
second mirror 49A is moved to a reflecting position RP where the
chamber camera 44 captures the inspection socket 24 and the socket
marks 260 and 261 in a same photographing range L3. Next, as shown
in FIG. 9B, the chamber camera 44 photographs the inspection socket
24 and the socket marks 260 and 261 at one time via the second
mirror 49A located at the reflecting position RP.
[0115] Data of an image photographed above is used to perform a
"socket recognition processing", which is an image recognition
processing for obtaining coordinates of a center position SC of the
inspection socket 24 with respect to the first socket mark 260 and
an angular deviation of a first side of the inspection socket 24
with respect to the socket pin arrangement line AY1.
[0116] Next, FIG. 10 will be referred to describe an electrical
structure of the IC handler 10 that suitably mounts the IC chip T
in the inspection socket 24.
[0117] The IC handler 10 includes a controlling device 50 including
first to third relative-position calculating units.
[0118] In FIG. 10, the controlling device 50 includes a CPU 61, a
ROM 62, a RAM 63, an image processor 64, and an image memory 65.
According to various data and various control programs stored in
the ROM 62 and the RAM 63, the controlling device 50 (the CPU 61)
performs, for example, a processing that allows the IC handler to
suck, hold, and extract an IC chip T before inspection from the
pocket 32 of the supply change kit 31 to mount the chip in the
inspection socket 24. In the present embodiment, the RAM 63
includes an inspected-product counter memory that stores the counts
of the IC chips T inspected.
[0119] The controlling device 50 is electrically connected to an
input/output device 70. The input/output device 70 has various
switches and a condition display unit to output a command signal
for starting execution of each of the foregoing processings,
initial value data for executing each processing, and the like, to
the controlling device 50.
[0120] The controlling device 50 is also electrically connected to
a Y-axis motor driving circuit 71 and a Z-axis motor driving
circuit 72, respectively.
[0121] The Y-axis motor driving circuit 71 receives a control
signal CMY from the controlling device 50 and generates a driving
signal DMY based on the control signal CMY to drivingly control the
Y-axis motor MY by using the driving signal DMY. Additionally, the
controlling device 50 receives a rotation amount SMY of the Y-axis
motor MY detected by a Y-axis motor encoder EMY via the Y-axis
motor driving circuit 71. Thereby, the controlling device 50
acquires the position of the measuring robot 22 based on the
rotation amount SMY. In short, the controlling device 50 drivingly
controls the Y-axis motor MY to locate the pressing and retaining
portion 22C at the position above the inspection socket 24 and the
position above the first shuttle 16 or the second shuttle 17.
[0122] The Z-axis motor driving circuit 72 receives a control
signal CMZ from the controlling device 50 and generates a driving
signal DMZ based on the control signal CMZ to drivingly control the
Z-axis motor MZ by using the driving signal DMZ. Additionally, the
controlling device 50 receives a rotation amount SMZ of the Z-axis
motor MZ detected by a Z-axis motor encoder EMZ via the Z-axis
motor driving circuit 72. Thereby, the controlling device 50
acquires the position of the pressing and retaining portion 22C
based on the rotation amount SMZ. In short, the controlling device
50 drivingly controls the Z-axis motor MZ to locate the pressing
and retaining portion 22C (the suction nozzle 27) at the initial
position as the descending-movement starting position via the
connecting portion 22B.
[0123] The controlling device 50 is electrically connected to a
valve driving circuit 73. The valve driving circuit 73 drivingly
controls the suction valve V1 based on a control signal CV1 input
from the controlling device 50. The controlling device 50 drivingly
controls the suction valve V1 to switch the connection of the
suction hole of the suction nozzle 27 to either the sucking device
52 or the atmosphere. When the suction hole is connected to the
sucking device 52, the IC chip T is sucked and hold by an opening
end of the suction nozzle 27.
[0124] The controlling device 50 is also electrically connected to
an electro-pneumatic regulator circuit 74 corresponding to the
pressing device 26. Based on a control signal C26 input from the
controlling device 50, the electro-pneumatic regulator circuit 74
moves the pressing device 26 (the suction nozzle 27) from the
initial position as the descending-movement starting position to a
lower suction starting position or a lower mounting position with
respect to the pressing and retaining portion 22C by using an
atmospheric pressure.
[0125] The controlling device 50 is electrically connected to the
position adjusting device 25 of the pressing and retaining portion
22C. Based on a control signal C25 input from the controlling
device 50, the position adjusting device 25 controls to move the
pressing device 26 (the suction nozzle 27) in the right and left
directions (the X direction) and the front and back directions (the
Y direction) with respect to the pressing and retaining portion
22C, as well as controls to rotate the suction nozzle 27 around the
center axis of the nozzle as a rotation center with respect to the
horizontal plane (the XY plane).
[0126] The controlling device 50 is electrically connected to a
first shuttle driving circuit 75 and a second shuttle driving
circuit 76, respectively.
[0127] The first shuttle driving circuit 75 receives a control
signal CM1 from the controlling device 50 and generates a driving
signal DM1 based on the control signal CM1 to drivingly control the
first shuttle motor M1 by using the driving signal DM1. Then, the
controlling device 50 drives the first shuttle motor M1 to move the
first shuttle 16 along the rail 30A. In addition, the controlling
device 50 receives a rotation amount SM1 of the first shuttle motor
M1 detected by a first shuttle encoder EM1 via the first shuttle
driving circuit 75. Thereby, the controlling device 50 acquires the
position of the first shuttle 16 based on the rotation amount
SM1.
[0128] The second shuttle driving circuit 76 receives a control
signal CM2 from the controlling device 50 and generates a driving
signal DM2 based on the control signal CM2 to drivingly control the
second shuttle motor M2 by using the driving signal DM2. The
controlling device 50 also drives the second shuttle motor M2 to
move the second shuttle 17 along the rail 30B. In addition, the
controlling device 50 receives a rotation amount SM2 of the second
shuttle motor M2 detected by a second shuttle encoder EM2 via the
second shuttle driving circuit 76. Thereby, the controlling device
50 acquires the position of the second shuttle 17 based on the
rotation amount SM2.
[0129] The controlling device 50 is also electrically connected to
a first shuttle camera driving circuit 77, a second shuttle camera
driving circuit 78, and a chamber camera driving circuit 79,
respectively.
[0130] Based on a control signal C37 input from the controlling
device 50, the first shuttle camera driving circuit 77 drivingly
controls the first shuttle camera 37. Then, the controlling device
50 drivingly controls the first shuttle camera 37 to acquire image
data GD1 for a "device recognition processing" obtained by the
first shuttle camera 37. Next, the controlling device 50 uses the
acquired image data GD1 to allow the image processor 64 to perform
the image recognition processing (the device recognition
processing) of the IC chip T sucked to the suction nozzle 27 and
the first and the second bottom surface hand marks 280 and 281.
[0131] As shown in FIG. 11, in the device recognition processing, a
center position 280C of the first bottom surface hand mark 280 is
set as an original point to calculate relative coordinates (x3, y3)
that describe a third relative position of the center position DC
of the IC chip T with respect to the original point. Additionally,
a center position 27C of the suction nozzle 27 is set as an
original point to calculate coordinates (x31, y31) that describe a
sucking position deviation of the center position DC of the IC chip
T with respect to the original point.
[0132] In addition, the device recognition processing is performed
to calculate an angular deviation .theta.3 that indicates a third
relative position of the first side of the IC chip T with respect
to the hand mark arrangement line AY2, namely, a rotation amount of
the first side of the IC chip T corresponding to the hand mark
arrangement line AY2.
[0133] Furthermore, the controlling device 50 stores the calculated
relative coordinates (x3, y3), the sucking position deviation (x31,
y31), and the angular deviation .theta.3 in the RAM 63. For
calculation convenience, each value of the relative coordinates
(x3, y3) and the angular deviation .theta.3 is given based on a
coordinate system used when the measuring robot 22 is viewed from
an upper side. Additionally, a relative position of the first
bottom surface hand mark 280 with respect to the measuring robot 22
is the same as that of the first top surface hand mark 282 with
respect to the robot 22. Thus, the center of the first top surface
hand mark 282 is equal to the center position 280C, and the values
of the relative coordinates (x3, y3) are the same for both the
first bottom surface hand mark 280 and the first top surface hand
mark 282.
[0134] Based on a control signal C38 input from the controlling
device 50, the second shuttle camera driving circuit 78 drivingly
controls the second shuttle camera 38. Then, the controlling device
50 drivenly controls the second shuttle camera 38 to acquire the
image data GD1 for the "device recognition processing" obtained by
the second shuttle camera 38. The controlling device 50 uses the
acquired image data GD1 to allow the image processor 64 to perform
the image recognition processing (the device recognition
processing) of the IC chip T sucked to the suction nozzle 27 and
the first and the second bottom surface hand marks 280 and 281.
Then, as shown in FIG. 11, the "device recognition processing" is
performed, where the processing is the same as above and thus a
description thereof will be omitted.
[0135] Based on a control signal C44 input from the controlling
device 50, the chamber camera driving circuit 79 drivingly controls
the chamber camera 44. Then, the controlling device 50 drivingly
controls the chamber camera 44 to acquire image data GD2 for a
"mark-position recognition processing" or image data GD3 for a
"socket recognition processing" obtained by the chamber camera
44.
[0136] The controlling device 50 uses the acquired image data GD2
for the "mark-position recognition processing" to allow the image
processor 64 to perform an image recognition processing (the mark
recognition processing) of the first and the second socket marks
260, 261 and the first and the second top surface hand marks 282,
283.
[0137] As shown in FIG. 12, in the above mark recognition
processing, a center position 260C of the first socket mark 260 is
set as an original point to calculate relative coordinates (x2 and
y2) that describe a second relative position of the center position
280C of the first top surface hand mark 282 with respect to the
original point, namely, a positional deviation of the hand mark 282
with respect to the first socket mark 260.
[0138] Additionally, the mark-position recognition processing is
performed to calculate the angular deviation .theta.2 indicating a
second relative position of the hand mark arrangement line AY2 with
respect to the socket pin arrangement line AY1. Then, the
controlling device 50 stores the relative coordinates and the
angular deviation calculated above in the RAM 63.
[0139] Furthermore, the controlling device 50 allows the image
processor 64 to perform an image recognition processing (the socket
recognition processing) of the first and the second socket marks
260, 261 and the first and the inspection socket 24 by using the
acquired image data GD3 for the "socket recognition
processing".
[0140] As shown in FIG. 13, in the socket recognition processing,
the center position 260C of the first socket mark 260 is set as an
original point to calculate relative coordinates (x1 and y1)
describing a first relative position of the center position SC of
the inspection socket 24 with respect to the original point.
Additionally, the socket recognition processing is also performed
to calculate an angular deviation .theta.1 indicating a first
relative position of the first side of the inspection socket 24
with respect to the socket pin arrangement line AY1, namely, a
rotation amount of the first side of the inspection socket 24
corresponding to the socket pin arrangement line AY1 in the X
direction and the Y direction, respectively. Then, the controlling
device 50 stores the relative coordinates and the angular deviation
calculated above in the RAM 63.
[0141] Specifically, the controlling device 50 applies a rotational
correction to the relative coordinates (x3, y3) of the center
position DC of the IC chip T by the angular deviation .theta.2, and
adds the relative coordinates (x2, y2) of the center position 280C
of the first top surface hand mark 282 to calculate relative
positional coordinates (x23, y23) of the IC chip T with respect to
the first socket mark 260. Additionally, the controlling device 50
adds the angular deviation .theta.2 of the hand mark arrangement
line AY2 to the angular deviation .theta.3 of the IC chip T to
calculate a relative angular deviation .theta.23 with respect to
the socket pin arrangement line AY1.
[0142] Furthermore, the controlling device 50 subtracts the
calculated relative positional coordinates (x23, y23) from the
relative coordinates (x1 and y1) of the center position SC of the
inspection socket 24 to calculate a positional deviation amounts
(.DELTA.x, .DELTA.y) of the center position DC of the IC chip T
with respect to the center position SC of the inspection socket 24.
Additionally, the controlling device 50 subtracts the calculated
relative angular deviation .theta.23 from the angular deviation
.theta.1 of the inspection socket 24 to calculate an angular
deviation amount .DELTA..theta. of the IC chip T with respect to
the inspection socket 24.
[0143] Based on the positional deviation amounts (.DELTA.x,
.DELTA.y), the angular deviation amount .DELTA..theta., and the
sucking position deviation (x31, y31), the controlling device 50
makes the center position DC of the IC chip T coincident with the
center position SC of the inspection socket 24, as well as
calculates the amounts of movements (the amounts of corrections) of
the suction nozzle 27 in the X and the Y directions and the
rotation angle so as to allow the angular deviation amount
.DELTA..theta. to be "zero". Then, the controlling device 50 inputs
a control signal C25 calculated based on the correction amounts to
the position adjusting device 25 to allow the suction nozzle 27 to
rotate and move in the X and the Y directions so as to make the
center position DC of the IC chip T coincident with the center
position SC of the inspection socket 24, namely, so as to correct
the position of the IC chip T.
[0144] The controlling device 50 is electrically connected to a
photographing device driving circuit 80 and a reflecting device
driving circuit 81, respectively.
[0145] The photographing device driving circuit 80 generates a
driving signal D3X for the right and left directions (the X
direction) and a driving signal D3Z for the upper and lower
directions (the Z direction) based on a control signal C40 from the
controlling device 50. Then, based on the driving signal D3X, the
horizontal motor M3X is drivingly controlled to move the
photographing device 40 (the chamber camera 44) in the right and
left directions. Additionally, based on the driving signal D3Z, the
vertical motor M3Z is drivingly controlled to move the
photographing device 40 (the chamber camera 44) in the upper and
lower directions. Furthermore, the controlling device 50 receives a
rotation amount S3X of the horizontal motor M3X detected by a
horizontal motor encoder E3X via the photographing device driving
circuit 80. Thereby, the controlling device 50 acquires the
position of the chamber camera 44 in the right and left directions
(the X direction) from the rotation amount S3X. Additionally, the
controlling device 50 receives a rotation amount S3Z of the
vertical motor M3Z detected by a vertical motor encoder E3Z via the
photographing device driving circuit 80. Thereby, the controlling
device 50 acquires the position of the chamber camera 44 in the
upper and lower directions (the Z direction) from the rotation
amount S3Z.
[0146] Based on a control signal C45 input from the controlling
device 50, the reflecting device driving circuit 81 generates a
driving signal D4X for the right and left directions (the X
direction) and a driving signal D4Z for the upper and lower
directions (the Z direction). Based on the driving signal D4X, the
horizontal motor M4X is drivingly controlled to move the reflecting
device 45 (the second mirror 49A) in the right and left directions.
Additionally, based on the driving signal D4Z, the vertical motor
M4Z is drivingly controlled to move the reflecting device 45 (the
second mirror 49A) in the upper and lower directions. The
controlling device 50 receives a rotation amount S4X of the
horizontal motor M4X detected by a horizontal motor encoder E4X via
the reflecting device driving circuit 81. Thereby, the controlling
device 50 acquires the position of the second mirror 49A in the
right and left directions (the X direction) from the rotation
amount S4X. Furthermore, the controlling device 50 receives a
rotation amount S4Z of the horizontal motor M4Z detected by a
horizontal motor encoder E4Z via the reflecting device driving
circuit 81. Thereby, the controlling device 50 acquires the
position of the second mirror 49A in the upper and lower directions
(the Z direction) from the rotation amount S4Z.
[0147] Next, FIGS. 14 to 17 will be referred to describe a series
of steps for transferring the sucked and hold IC chip T from the
first shuttle 16 to the inspection socket 24, in the IC handler 10.
In this case, the inspection of the IC chip T is about to be
started, and the IC chip T is yet to be sucked and hold by the
measuring robot 22.
[0148] First, upon a start of the inspection of the IC chip T, the
controlling device 50 clears the inspected-product counter memory
to "zero". The counter memory records the numbers of the IC chips
inspected (Step S1). After clearing the counter memory to "zero",
the controlling device 50 performs the socket recognition
processing (Step S2).
[0149] In the socket recognition processing, as shown in FIG. 15,
the controlling device 50 moves the second mirror 49A to the
reflecting position RP (Step S2-1) and moves the chamber camera 44
to the second photographing position CP2 (Step S2-2). When the
chamber camera 44 is moved to the second photographing position
CP2, the controlling device 50 allows the chamber camera 44 to
photograph the first and the second socket marks 260, 261 and the
inspection socket 24 to acquire the image data GD3 for the socket
recognition processing (Step S2-3).
[0150] After acquiring the image data GD3 for the socket
recognition processing, the controlling device 50 performs the
socket recognition processing to calculate the relative coordinates
(x1, y1) and the angular deviation .theta.1 (Step S2-4) so as to
store the calculated relative coordinates and the angular deviation
in the RAM 63 (Step S2-5). After storing the coordinates and the
angular deviation above in the RAM 63, the controlling device 50
moves the chamber camera 44 to the standby position (Step S2-6),
and then, moves the second mirror 49A to the withdrawing position
(Step S2-7) to complete the socket recognition processing.
[0151] Following the completion of the socket recognition
processing, the controlling device 50 performs the mark-position
recognition processing (Step S3).
[0152] In the mark-position recognition processing, as shown in
FIG. 16, the controlling device 50 moves the measuring robot 22 to
above the inspection socket 24 (Step S3-1), and then lowers the
measuring robot 22 (Step S3-2). After the measuring robot 22
descends, the socket pins 25A and 25B, respectively, are inserted
in the corresponding cylindrical members 28C, respectively. When
the measuring robot 22 lowers the pressing and retaining portion
22C to the original point, the top surface positions of the top
surface hand marks 282 and 283 corresponding to the socket marks
260 and 261 are made coincident with those of the socket marks 260
and 261 (Step S3-3). After that, the controlling device 50 moves
the chamber camera 44 to the second photographing position CP2
(Step S3-4). When the chamber camera 44 moves to the position CP2,
the controlling device 50 allows the chamber camera 44 to
photograph the socket marks 260, 261 and the corresponding top
surface hand marks 282, 283 via the first mirror 29A provided on
the left side surface of the measuring robot 22 to acquire the
image data GD2 for the mark-position recognition processing (Step
S3-5).
[0153] After acquiring the image data GD2 for the mark-position
recognition processing, the controlling device 50 performs the
mark-position recognition processing to calculate the relative
coordinates (x2, y2) and the angular deviation .theta.2 (Step S3-6)
so as to store the calculated relative coordinates and the angular
deviation in the RAM 63 (Step S3-7). After storing the coordinates
and the angular deviation above in the RAM 63, the controlling
device 50 moves the chamber camera 44 to the standby position (Step
S3-8) and moves the measuring robot 22 to a predetermined position
(Step S3-9) to complete the mark-position recognition
processing.
[0154] Upon the completion of the mark-position recognition
processing, the controlling device 50 supplies the IC chip T to
each pocket 32 of the supply change kit 31 of the first shuttle 16
to transfer the IC chip T to the position where the chip is sucked
and hold by the measuring robot 22 (Step S4). When the measuring
robot 22 transfers the IC chip T to the sucking and holding
position, the controlling device 50 performs the device recognition
processing (Step S5).
[0155] In the device recognition processing, the suction nozzle 27
is located at a predetermined initial position and at a
predetermined initial angle with respect to the measuring robot 22.
Then, as shown in FIG. 17, the suction nozzle 27 of the measuring
robot 22 is lowered to the sucking position to allow the measuring
robot 22 to suck and hold the IC chip T (Step S5-1). When the IC
chip T is sucked and hold by the measuring robot 22, the
controlling device 50 raises the measuring robot 22 (Step S5-2) to
move to the first photographing position CP1 where the first
shuttle camera 37 photographs the IC chip T and the bottom surface
hand marks 280, 281 (Step S5-3). After moving the measuring robot
22 to the position CP1, the controlling device 50 moves the first
shuttle 16 to move the first shuttle camera 37 to the first
photographing position CP1 (Step S5-4). When the measuring robot 22
and the first shuttle camera 37 are moved to the first
photographing position CP1, the controlling device 50 allows the
first shuttle camera 37 to photograph the IC chip T and the bottom
surface hand marks 280 and 281 so as to acquire the image data GD1
for the device recognition processing (Step S5-5).
[0156] When acquiring the image data GD1 for the device recognition
processing, the controlling device 50 performs the device
recognition processing. In the processing, the controlling device
50 calculates the sucking position deviation (x31, y31), the
relative coordinates (x3, y3), and the angular deviation .theta.3
(Step S5-6) to store in the RAM 63 (Step S5-7). Thereafter, the
controlling device 50 starts to move the measuring robot 22 to
mount the IC chip T in the inspection socket 24 (Step S5-8). After
starting the movement of the measuring robot 22, the controlling
device 50 starts to move the first shuttle 16 to a position for
retrieving the IC chip T (Step S5-9) to finish the device
recognition processing.
[0157] Upon the completion of the device recognition processing,
the controlling device 50 calculates the amounts of correction for
making the central position DC of the IC chip T coincident with the
center position SC of the inspection socket 24 based on the
relative coordinates (x1, y1), (x2, y2), and (x3, y3) and the
angular deviations .theta.1, .theta.2, and .theta.3 stored in the
RAM 63 (Step S6).
[0158] In the calculation of the correction amounts, the
controlling device 50 makes the center position DC of the chip
coincident with the center position SC of the socket based on the
sucking position deviation, the relative coordinates, and the
angular deviations, as well as calculates the amounts of movements
(the correction amounts) of the suction nozzle 27 in the X and the
Y directions and the rotational angle so as to allow the angular
deviation amount .DELTA..theta. to be "zero". After calculating the
correction amounts, the controlling device 50 allows the measuring
robot 22 to transfer the IC chip T to above the inspection socket
24 (Step S7).
[0159] After transferring the IC chip T to above the socket, the
controlling device 50 moves the position adjusting device 25 based
on the calculated correction amounts to make the center position DC
of the IC chip T coincident with the center position SC of the
socket and also performs a positional correction to make an
inclination of the first side of the IC chip T coincident with an
inclination of the first side of the socket (Step S8).
[0160] After correcting the positional the IC chip T, the
controlling device 50 mounts the IC chip T in the inspection socket
24 (Step S9) to perform an electrical inspection of the IC chip T.
Upon the completion of the electrical inspection of the chip, the
controlling device 50 allows the suction nozzle 27 to be located at
the predetermined initial position and at the predetermined initial
angle with respect to the measuring robot 22, and allows the
measuring robot 22 to extract the IC chip T from the inspection
socket 24 to retrieve the chip and place in each pocket 32 of the
retrieval change kit 34 of the first shuttle 16 (Step S10).
[0161] After placing the IC chip T in the retrieval change kit 34,
the controlling device 50 moves the first shuttle 16 to allow the
retrieving robot 15 to retrieve the chip. After the IC chip T is
retrieved by the retrieving robot 15, the controlling device 50
determines whether there is any next chip to be inspected (Step
S12).
[0162] If there is no next chip to be inspected (if NO at Step
S12), the controlling device 50 finishes the inspection of the IC
chip T. Conversely, if there is a next chip to be inspected (if YES
at Step S12), the controlling device 50 adds 1 to the
inspected-product counter (Step S13) and then determines whether a
predetermined number of chips were inspected (Step S14).
[0163] When the predetermined number of chips have not been
inspected (if NO at Step S14), the controlling device 50 returns to
Step S4 to repeat the transfer and inspection of the IC chip T. In
this case, the device recognition processing is performed to
recalculate the relative coordinates (x3, y3) and the angular
deviation .theta.3, whereas the socket recognition processing and
the mark-position recognition processing are not performed. Thus,
correction values are calculated using the relative coordinates
(x2, y2) and (x1, y1) and the angular deviations .theta.1 and
.theta.2 previously calculated and stored in the RAM 63. Meanwhile,
when the predetermined number of chips have been inspected (if YES
at Step S14), the controlling device 50 returns to Step S1 to
perform the socket recognition processing, the mark-position
recognition processing, and the device recognition processing,
whereby correction values are calculated to repeat the inspection
of the IC chip T.
[0164] In addition, the IC handler 10 is also used to suck and hold
the IC chip T from the second shuttle 17 to mount the chip in the
inspection socket 24. A series of steps performed are the same as
those in the first shuttle 16. Thus, a description of the steps
using the second shuttle 17 will be omitted.
[0165] As described hereinabove, the component transferring
apparatus and the IC handler according to the embodiment of the
invention provide advantages as follows.
[0166] 1. In the present embodiment, there are provided the first
and the second socket marks 260 and 261. The socket marks 260, 261
and the inspection socket 240 are photographed to perform the image
recognition processing of the image data GD3 obtained by the
photographing operation. The image recognition processing provides
the relative coordinates (x1, y1) of the inspection socket 24 with
respect to the first socket mark 260 and the angular deviation
.theta.1 of the socket with respect to the socket pin arrangement
line AY1. As a result, even if installation-induced distortion and
thermal expansion and contraction occur in the IC handler 10, the
relative positional relationship between the inspection socket 24
and the first socket mark 260 can be obtained in such a manner as
to reflect physical changes such as the distortion and the
expansion and contraction as mentioned above.
[0167] 2. In the embodiment, the first and the second top surface
hand marks 282, 283, respectively, are provided to be inserted in
the first and the second socket marks 260, 261, respectively. Thus,
the socket mars 260, 261 and the corresponding hand marks 282, 283
are photographed to perform the image recognition processing of the
image data GD2 obtained by the photographing operation. The image
recognition processing provides the relative coordinates (x2, y2)
of the first top surface hand mark 282 with respect to the first
socket mark 260 and the angular deviation .theta.2 of the hand mark
arrangement line AY2 with respect to the socket pin arrangement
line AY1. As a result, even if installation-induced distortion and
thermal expansion and contraction occur in the IC handler 10, there
can be obtained an appropriate relative positional relationship
between the first top surface hand mark 282 and the first socket
mark 260, namely, an appropriate relative positional relationship
between the inspection section 23 and the measuring robot 22.
[0168] 3. In the embodiment, the relative coordinates (x1, y1) and
the angular deviation .theta.1 are obtained from the image data GD3
for the socket recognition processing; the relative coordinates
(x2, y2) and the angular deviation .theta.2 are obtained from the
image data GD2 for the mark-position recognition processing; and
the relative coordinates (x3, y3) and the angular deviation
.theta.3 are obtained from the image data GD1 for the device
recognition processing. Based on the relative coordinates (x1, y1),
(x2, y2), and (x3, y3) and the angular deviation .theta.2, there is
calculated the positional deviation amounts (.DELTA.x, .DELTA.y)
between the center position SC of the inspection socket 24 and the
center position DC of the IC chip T. Additionally, based on the
angular deviations .theta.1, .theta.2, and .theta.3, there is
calculated the angular deviation amount .DELTA..theta. between the
first side of the inspection socket 24 and the first side of the IC
chip T. As a result, the relative positions of the inspection
socket 24 and the IC chip T can be made coincident with each other,
whereby the position of the IC chip T can be adjusted such that the
angular deviation amount is made "zero".
[0169] 4. In the embodiment, the first and the second top surface
hand marks 282, 283, respectively, are provided to be inserted in
the first and the second socket marks 260, 261, respectively, where
the hand marks and the socket marks have the same height. Thus, the
chamber camera 44 can photograph all of the marks at one time.
Additionally, in the image recognition processing in which the
margin of error becomes larger if there is any difference in a
height direction, the relative positional relationship between the
socket marks 260, 261 and the corresponding top surface hand marks
282, 283 can be recognized with a high precision so as to calculate
the relative positions and the angular deviation.
[0170] 5. In the embodiment, the chamber camera 44 photographs the
image data GD2 for the "mark-position recognition processing" and
the image data GD3 for the "socket recognition processing". In this
manner, the single camera is used to photograph both of the two
image data, and thus, the number of cameras can be reduced.
Additionally, since the chamber camera 44 photographs those images
via the first and second mirror 29A and 49A, respectively, the
camera can be easily located on a periphery of the measuring robot
22 and the inspection section 23 in which the location position for
the camera is very limited.
[0171] 6. In the embodiment, the "device recognition processing" is
performed for each IC chip T, whereas the "mark-position
recognition processing" and the "socket recognition processing" are
performed every time a predetermined number of the IC chips T are
inspected. This can reduce the number of times of the image
recognition processings during the steps for inspecting the IC chip
T, which can shorten inspection time. Moreover, even if
installation-induced distortion and thermal expansion and
contraction occur in the IC handler, those changes can be reflected
in calculation results of correction values obtained in every
inspection of a predetermined number of the chips.
Modifications
[0172] For example, modifications of the above embodiment can be
implemented as follows.
[0173] In the above embodiment, the chamber camera 44 photographs
the image for the "mark-position recognition processing" and the
image for the "socket recognition processing", respectively, via
the first mirror 29A and the second mirror 49A, respectively.
However, the images for those recognition processings may be
directly photographed by the camera.
[0174] In the above embodiment, the chamber camera 44 photographs
the image for the "mark-position recognition processing" and the
image for the "socket recognition processing" at the second
photographing position CP2. However, those images may be
photographed at mutually different positions.
[0175] In the above embodiment, the chamber camera 44 is used to
photograph both of the image for the "mark-position recognition
processing" and the image for the "socket recognition processing".
However, an exclusive camera for each of the images may be used to
photograph each image.
[0176] In the above embodiment, there are provided the two socket
marks 260, 261 and the two cylindrical members 28C. However, the
numbers of the socket marks and the cylindrical members (hand
marks) are not restricted to two.
[0177] In the above embodiment, the socket marks 260, 261 and the
hand marks 280 to 283 are circular in shape. However, those marks
may be oval, polygonal, or cross-shaped. When such oval, polygonal,
or cross-shaped marks are used, an angular deviation can be
obtained from a single mark.
[0178] In the above embodiment, the socket pins 25A and 25B,
respectively, are inserted in the cylindrical members 28C. However,
as long as the socket pins and the cylindrical members are arranged
within the same viewing range of the camera, the arrangement manner
of the pins and the members is not specifically restricted. For
example, the socket pins 25A, 25B and the cylindrical members 28C
may be adjacently or separately arranged. Additionally, the heights
of the socket pins and the cylindrical members are not restricted
to the height LSz.
[0179] In the above embodiment, the socket pins 25A, 25B and the
cylindrical members 28C are each made of metal. However, the hand
marks 280 to 283 may be provided on glass, since it is only
necessary that the hand marks can be seen from upper and lower
sides. In this case, even when the socket marks are superimposed on
the hand marks provided on glass, both marks can be photographed
together by a camera. Additionally, a hand mark appropriate for an
image recognition processing can be easily drawn.
[0180] In the above embodiment, the first socket mark 260 is used
as a reference point for the relative coordinates. However, the
reference point may be provided at any position.
[0181] In the above embodiment, the positional deviation amounts
(.DELTA.x, .DELTA.y) and the angular deviation amount
.DELTA..theta. are calculated. However, there may be calculated
only a necessary deviation amount among the positional deviation
amount in the X direction, the positional deviation amount in the Y
direction, and the angular deviation amount.
[0182] In the above embodiment, the relative coordinates (x1, y1)
and the angular deviation .theta.1 are directly calculated by the
"socket recognition processing", and the relative coordinates (x2,
y2) and the angular deviation .theta.2 are directly calculated by
the "mark-position recognition processing". Then, based on the
calculation results, the positional deviation amounts (.DELTA.x,
.DELTA.y) and the angular deviation amount .DELTA..theta. are
calculated. Instead of that, a predetermined processing may be
performed using the coordinates calculated by the "socket
recognition processing". For example, values calculated by a
plurality of times of processings may be stored to obtain an
average value in a predetermined number of times of the processings
so as to calculate as the relative coordinates (x1, y1).
Additionally, a predetermined processing may be performed using the
angle calculated by the "socket recognition processing". For
example, values calculated by a plurality of times of processings
may be stored to obtain an average value in a predetermined number
of times of the processings so as to calculate as the angular
deviation .theta.1. Furthermore, a predetermined processing as
above may also be performed to calculate the relative coordinates
(x2, Y2), the angular deviation .theta.2, the positional deviation
amounts (.DELTA.x, .DELTA.y), or the angular deviation amount
.DELTA..theta..
[0183] In the above embodiment, the measuring robot 22 transfers
the single IC chip T into the single inspection socket 24. However,
the measuring robot 22 may transfer a plurality of IC chips T to
mount in a plurality of inspection sockets 24. In this case, the
numbers of the shuttle cameras 37, 38, the photographing device 40,
and the reflecting device 45 may be singular or plural.
[0184] In the above embodiment, in the image recognition
processing, the single image including the bottom surface hand
marks 280, 281 and the IC chip T is processed as the image data.
However, a plurality of image data may be processed at one time.
Similarly, the single image including the top surface hand marks
282, 283 and the corresponding socket marks 260, 261, as well as
the single image including the socket marks 260, 261 and the
inspection socket 24 may also be processed as above in the image
recognition processing.
[0185] In the above embodiment, when the top surface hand marks 282
and 283 are in contact with the inspection section 23, the top
surface positions of the hand marks 282 and 283 are made coincident
with those of the socket marks 260 and 261. However, instead of
that, the top surface positions of the hand marks and the socket
marks may be made coincident with each other in a position
separated from the inspection section 23. In this manner, the
cylindrical members 28C can be less influenced by a temperature
rise in the inspection section 23.
[0186] In that case, for example, the measuring robot 22 may be
once lowered to the position where the top surface hand marks 282
and 283 contact with the inspection section 23, namely, to the
mounting position, and then, may be raised by a predetermined
distance. Thereby, while eliminating an influence due to a change
in the relative distance between the measuring robot 22 and the
inspection section 23, the hand marks 282 and 283 can be located at
a position separated from the inspection section 23 by the
predetermined distance.
[0187] In the above embodiment, every time the IC chip T is
transferred to the inspection socket 24, the "device recognition
processing" is performed, whereas the "socket recognition
processing" and the "mark-position recognition processing" are
simultaneously performed every predetermined number of times of the
chip transfer. However, an interval for performing the "socket
recognition processing" and the "mark-position recognition
processing" is not specifically restricted, and those processings
may not be simultaneously performed.
[0188] For example, as shown in FIG. 18, the "mark-position
recognition processing" may be performed every after the "device
recognition processing".
[0189] Additionally, for example, as shown in FIG. 19, when the IC
chip T is mounted in the inspection socket 24, the image for the
"mark-position recognition processing" may be acquired to perform
the "mark-position recognition processing". Next, when mounting the
IC chip T in the inspection socket 24, the positional deviation
amounts (.DELTA.x, .DELTA.y) and the angular deviation amount
.DELTA..theta. may be calculated based on relative coordinates
calculated by the previous "mark-position recognition
processing".
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