U.S. patent application number 11/761557 was filed with the patent office on 2008-12-18 for system and method for mounting a cooling device and method of fabrication.
This patent application is currently assigned to GENERAL ELECTRIC COMPANY. Invention is credited to Mehmet Arik, William Edward Burdick, Jr., Kunal Ravindra Goray, Charles Erklin Seeley, Yogen Vishwas Utturkar, Stanton Earl Weaver, Jr..
Application Number | 20080310110 11/761557 |
Document ID | / |
Family ID | 39640312 |
Filed Date | 2008-12-18 |
United States Patent
Application |
20080310110 |
Kind Code |
A1 |
Arik; Mehmet ; et
al. |
December 18, 2008 |
SYSTEM AND METHOD FOR MOUNTING A COOLING DEVICE AND METHOD OF
FABRICATION
Abstract
A mounting apparatus for a cooling device is disclosed. The
mounting apparatus includes a plurality of connectors extending
outwardly from the cooling device. The mounting apparatus also
includes at least one mounting post coupled to the plurality of
connectors and configured to mount the cooling device on a
substrate.
Inventors: |
Arik; Mehmet; (Niskayuna,
NY) ; Seeley; Charles Erklin; (Niskayuna, NY)
; Utturkar; Yogen Vishwas; (Latham, NY) ; Burdick,
Jr.; William Edward; (Niskayuna, NY) ; Goray; Kunal
Ravindra; (Bangalore, IN) ; Weaver, Jr.; Stanton
Earl; (Northville, NY) |
Correspondence
Address: |
GENERAL ELECTRIC COMPANY;GLOBAL RESEARCH
PATENT DOCKET RM. BLDG. K1-4A59
NISKAYUNA
NY
12309
US
|
Assignee: |
GENERAL ELECTRIC COMPANY
Schenectady
NY
|
Family ID: |
39640312 |
Appl. No.: |
11/761557 |
Filed: |
June 12, 2007 |
Current U.S.
Class: |
361/699 ;
165/104.11; 165/80.1; 257/E23.083; 257/E23.099; 29/890.03;
361/720 |
Current CPC
Class: |
H01L 23/467 20130101;
H01L 2924/0002 20130101; H01L 23/40 20130101; G06F 1/20 20130101;
Y10T 29/4935 20150115; H01L 2924/00 20130101; Y10T 29/5313
20150115; H01L 2924/0002 20130101; Y10T 29/49002 20150115 |
Class at
Publication: |
361/699 ;
361/720; 165/104.11; 165/80.1; 29/890.03 |
International
Class: |
H05K 7/20 20060101
H05K007/20; B21D 53/02 20060101 B21D053/02; F28D 15/00 20060101
F28D015/00 |
Claims
1. A mounting apparatus for a cooling device, comprising: a
plurality of connectors extending outwardly from the cooling
device; and at least one mounting post coupled to the plurality of
connectors and configured to mount the cooling device on a
substrate.
2. The mounting apparatus of claim 1, wherein each of the plurality
of connectors comprises a compliant material.
3. The mounting apparatus of claim 2, wherein the compliant
material comprises an elastomeric material.
4. The mounting apparatus of claim 1, wherein the plurality of
connectors comprises a plurality of tendons.
5. The mounting apparatus of claim 1, wherein the plurality of
connectors comprises a plurality of tabs.
6. The mounting apparatus of claim 1, wherein the plurality of
connectors is formed integral into an E-clip mounting
apparatus.
7. The mounting apparatus of claim 1, wherein the plurality of
connectors is configured to mount the cooling device at an angle
transverse to the substrate.
8. The mounting apparatus of claim 1, wherein the plurality of
connectors is configured to mount the cooling device in a plane
perpendicular to a plane of the substrate.
9. The mounting apparatus of claim 1, wherein the substrate is a
printed circuit board assembly.
10. A method of mounting a cooling device, comprising: disposing at
least one mounting post on a substrate; and mounting a cooling
device on the mounting post by way of a plurality of connectors
extending outwardly from the cooling device.
11. The method of claim 10, wherein the mounting by way of a
plurality of connectors comprises extending a compliant material
outwardly to form the plurality of connectors.
12. The method of claim 11, wherein the extending comprises forming
a plurality of tendons.
13. The method of claim 11, wherein the extending comprises forming
a plurality of tabs.
14. The method of claim 11, wherein the extending comprises forming
an E-clip.
15. The method of claim 10, wherein the mounting comprises mounting
the cooling device at an angle transverse to a plane of the
substrate.
16. A method of fabricating a cooling device comprising at least
one plate defining a chamber, at least one active material on the
at least one plate, and a compliant material within the at least
one plate and encompassing the chamber, the compliant material
having at least one opening facilitating fluid communication
between the chamber and an exterior environment, said method
comprising: disposing an active material on the plate, wherein said
disposing comprises at least one selected from the group consisting
of dispensing the active material via an automated system,
thermally curing a preformed membrane of active material with the
plate via an adhesive, ultraviolet light curing a preformed
membrane of active material with the plate via an adhesive, and
applying a preformed pressure sensitive tape to the plate.
17. A cooling device, comprising: at least one supporting
structure, including: an inner surface defining a chamber and
having a pair of grooves; and at least one opening facilitating
fluid communication between the chamber and an exterior
environment; and a pair of flexible plates, each said plate being
disposed within one of the pair of grooves.
18. The cooling device of claim 17, wherein the supporting
structure comprises a metallic structure.
19. The cooling device of claim 17, wherein the supporting
structure comprises a composite resin.
20. The cooling device of claim 17, wherein the supporting
structure is configured to tune a structural frequency equal to
about a Helmholtz frequency.
21. The cooling device of claim 17, further comprising a though
board clip to mount on a printed circuit board.
22. The cooling device of claim 17, further comprising at least one
pinned connection via an E-clip to mount on a printed circuit
board.
23. A cooling device comprising: a supporting frame, including: an
inner surface defining a chamber; and at least one opening
facilitating fluid communication between the chamber and an
exterior environment; and a pair of suspended jet plates, each
suspended jet plate attached to the supporting frame.
24. The cooling device of claim 23, wherein the suspended jet
plates are attached via a compliant adhesive.
25. The cooling device of claim 23, wherein the suspended jet
plates are attached via a plurality of cantilevers.
26. A cooling device comprising: a cup shaped supporting structure,
comprising: an inner surface defining a chamber; an orientation
plate attached to a base and configured to provide angular
orientation; and at least one opening facilitating fluid
communication between the chamber and an exterior environment; and
a pair of flexible plates, each said plate being attached to the
cup shaped supporting structure via an attachment.
27. The cooling device of claim 26, wherein the cup shaped
supporting structure comprises a V-shaped notch.
28. The cooling device of claim 26, wherein the attachment
comprises a metal support.
29. A modular cooling device comprising: a pair of flexible discs
having at least one opening facilitating fluid communication
between a chamber and an exterior environment; and a pair of
electrical terminals configured to provide a parallel electrical
connection to a second cooling device.
30. The modular cooling device of claim 29, wherein the flexible
discs comprise sandwich shaped discs.
31. The modular cooling device of claim 29, further comprising at
least two cooling devices in a parallel electrical connection.
32. A method of mounting a cooling device on a printed circuit
board comprising: disposing a plurality of mounting posts on the
cooling device to orient the cooling device at an angle relative to
the circuit board and forming a region under the cooling device;
and disposing a plurality of electronic components that do not
require cooling in the region under the cooling device.
Description
BACKGROUND
[0001] The invention relates generally to thermal management
systems, and more particularly to thermal management systems for
use in microelectronic devices.
[0002] Thermal management is becoming an increasingly significant
concern in the microelectronics industry. Non-limiting examples of
microelectronic devices include printed circuit board computers,
programmable logic controllers (PLCs), operator interface
computers, laptop computers, cell phones, personal digital
assistants (PDAs), and personal pocket computers. Such devices
generate waste heat during normal operation that must be dissipated
for desirable performance and reliability of microelectronic
components in the device.
[0003] Several technologies have been employed to remove heat from
microelectronic devices. An example includes forced air cooling via
conventional cooling fans and heat sinks. Heat sinks conduct
thermal energy away from the devices and transfers the thermal
energy to air circulated by cooling fans. However, cooling fans use
an undesirable amount of energy, create audible noise and have
space limitations.
BRIEF DESCRIPTION
[0004] In accordance with an aspect of the invention, a mounting
apparatus for a cooling device is provided. The mounting apparatus
includes a plurality of connectors extending outwardly from the
cooling device. The mounting apparatus also includes at least one
mounting post coupled to the plurality of connectors and configured
to mount the cooling device on a substrate.
[0005] In accordance with another aspect of the invention, a method
of mounting a cooling device is provided. The method includes
disposing at least one mounting post on a substrate. The method
also includes mounting a cooling device on the mounting post by way
of a plurality of connectors extending outwardly from the cooling
device.
[0006] In accordance with another aspect of the invention, a method
of fabricating a cooling device is provided. The cooling device
includes at least one plate defining a chamber, at least one active
material on the at least one plate, and a compliant material within
the at least one plate and encompassing the chamber, the compliant
material having at least one opening facilitating fluid
communication between the chamber and an exterior environment. The
method includes disposing an active material on the plate, wherein
said disposing comprises at least one selected from the group
consisting of dispensing the active material via an automated
system, condensate or thermally curing a preformed membrane of
active material with the plate via an adhesive, ultraviolet light
curing a preformed membrane of active material with the plate via
an adhesive, and applying a preformed pressure sensitive tape to
the plate.
[0007] In accordance with another aspect of the invention, a
cooling device is provided. The cooling device includes at least
one supporting structure, including an inner surface defining a
chamber and having a pair of grooves. The supporting structure also
includes at least one opening facilitating fluid communication
between the chamber and an exterior environment. The cooling device
also includes a pair of flexible plates, each said plate being
disposed within one of the pair of grooves.
[0008] In accordance with another aspect of the invention, a
cooling device is provided. The cooling device includes a
supporting frame, including an inner surface defining a chamber and
at least one opening facilitating fluid communication between the
chamber and an exterior environment. The cooling device also
includes a pair of suspended jet plates, each suspended jet plate
attached to the supporting frame.
[0009] In accordance with another aspect of the invention, a
cooling device is provided. The cooling device includes a cup
shaped supporting structure that has an inner surface defining a
chamber, an orientation plate attached to a base and configured to
provide angular orientation, and at least one opening facilitating
fluid communication between the chamber and an exterior
environment. The cooling device also includes a pair of flexible
plates, each said plate being attached to the cup shaped supporting
structure via an attachment.
[0010] In accordance with another aspect of the invention, a
modular cooling device is provided. The modular cooling device
includes a pair of flexible discs having at least one opening
facilitating fluid communication between the chamber and an
exterior environment, and a pair of electrical terminals configured
to provide a parallel electrical connection to a second cooling
device.
[0011] In accordance with another aspect of the invention, a method
of mounting a cooling device on a printed circuit board is
provided. The method includes disposing a plurality of mounting
posts on the cooling device to orient the cooling device at an
angle relative to the circuit board and forming a region under the
cooling device. The method also includes disposing a plurality of
electronic components that do not require cooling in the region
under the cooling device.
[0012] These and other advantages and features will be more readily
understood from the following detailed description of preferred
embodiments of the invention that is provided in connection with
the accompanying drawings.
DRAWINGS
[0013] FIG. 1 is a diagrammatic illustration of a mounting
apparatus including tendons for mounting a cooling device in
accordance with an embodiment of the invention.
[0014] FIG. 2 is a diagrammatic illustration of another mounting
apparatus including tendons for mounting a cooling device in a
different orientation than the mounting apparatus of FIG. 1.
[0015] FIG. 3 is a diagrammatic illustration of a mounting
apparatus including tabs for mounting a cooling device in
accordance with an embodiment of the invention.
[0016] FIG. 4 is a diagrammatic illustration of another mounting
apparatus including tabs for mounting a cooling device in a
different orientation than the mounting apparatus of FIG. 3.
[0017] FIG. 5 is a diagrammatic illustration of a mounting
apparatus including an E-clip for mounting a cooling device in
accordance with an embodiment of the invention.
[0018] FIG. 6 is a schematic illustration of the E-clip in FIG.
5.
[0019] FIG. 7 is a schematic top view of an exemplary cooling
device in accordance with an embodiment of the invention.
[0020] FIG. 8 is a cross-sectional view of the cooling device in
FIG. 6.
[0021] FIG. 9 is a cross-sectional view of another cooling device
including a layer of adhesive in accordance with an embodiment of
the invention.
[0022] FIG. 10 is a cross-sectional view of another cooling device
including a pressure sensitive tape in accordance with an
embodiment of the invention.
[0023] FIG. 11 is a cross-sectional view of another cooling device
having a mechanical structure attached to a plate in accordance
with an embodiment of the invention.
[0024] FIG. 12 is a cross-sectional view of another cooling device
in accordance with an embodiment of the invention.
[0025] FIG. 13 is a cross-sectional view of another cooling device
in accordance with an embodiment of the invention.
[0026] FIG. 14 is a diagrammatic illustration of another cooling
device in accordance with an embodiment of the invention.
[0027] FIG. 15 is a diagrammatic illustration of another cooling
device in accordance with an embodiment of the invention.
[0028] FIG. 16 is a cross-sectional view of another mounting
configuration in accordance with an embodiment of the
invention.
[0029] FIG. 17 is a cross-sectional view of another mounting
configuration in accordance with an embodiment of the
invention.
[0030] FIG. 18 is a cross-sectional view of another mounting
configuration including mounting posts in accordance with an
embodiment of the invention.
[0031] FIG. 19 illustrates process steps for mounting a cooling
device on a substrate in accordance with an embodiment of the
invention.
DETAILED DESCRIPTION
[0032] As discussed in detail below, embodiments of the invention
include a system and method for mounting a cooling device and a
method of fabricating the cooling device. As used herein, the term
`cooling device` refers to a device blowing jet streams into
systems such as, but not limited to, a microelectronic assembly and
a printed circuit board assembly.
[0033] Turning now to the drawings, FIG. 1 is a schematic
illustration of a mounting apparatus 10 for a cooling device 12.
The mounting apparatus 10 includes multiple connectors 14 extending
outwardly from the cooling device 12. The mounting apparatus 10
also includes at least one mounting post 16 coupled to the multiple
connectors 14. In FIG. 1, two mounting posts 16 are depicted. In a
particular embodiment, the mounting posts 16 are stiff and
unmovable. The mounting posts 16 enable mounting of the cooling
device 12 on a substrate 18. In a particular embodiment, the
connectors 14 include a compliant material. In an example, the
compliant material includes an elastomeric material. In the
illustrated embodiment, the connectors 14 include multiple
elastomeric tendons. The connectors 14 may be configured to orient
the cooling device 12 at an angle to the substrate 18. The cooling
device 12 blows jet streams through an orifice 21 in a direction 20
toward the substrate 18. In a particular embodiment, the substrate
18 is a printed circuit board assembly. The mounting posts 16 may
be mounted to the substrate 18 via an integrated connector 22. The
cooling device 12 also may include one or more flex connections 24
to provide electrical connection to electronic components.
[0034] FIG. 2 is a schematic illustration of a mounting apparatus
30 for a cooling device 12 in FIG. 1 at a vertical orientation. The
mounting apparatus 30 includes at least one mounting post 32
disposed in a plane perpendicular to a plane of the substrate 18.
Two mounting posts 32 are shown in FIG. 2. Connectors 14 are
attached to the mounting post 32 such that the cooling device 12 is
mounted in a plane perpendicular to a plane of the substrate 18.
This results in jet streams through an orifice 21 blown in a
direction 34 toward the substrate 18.
[0035] FIG. 3 is a schematic illustration of a mounting apparatus
40 for the cooling device 12 in FIG. 1 at an angular orientation
with respect to a plane of the substrate 18. The mounting apparatus
40 includes an elastomeric tab 42 extending outwardly from the
cooling device 12. One or more mounting posts 44 coupled to the
elastomeric tab 42 mount the cooling device 12 at an angle to the
substrate 18. Two mounting posts 44 are shown in FIG. 3. A tab
pinch clip 46 is attached to the mounting post 44 that clips the
elastomeric tab 42 to the mounting post 44. Jet streams are blown
in a direction 48 toward the substrate 18. The mounting post 44 is
mounted to the substrate 18 via an integrated connector 22. The
cooling device 12 also may include one or more flex connections 24
to provide electrical connection to electronic components.
[0036] FIG. 4 is a schematic illustration of a mounting apparatus
60 for the cooling device 12 in FIG. 1 at a vertical orientation
using the elastomeric tab 42 in FIG. 3. The mounting apparatus 60
includes at least one mounting post 62 disposed in a plane
perpendicular to a plane of the substrate 18. Two mounting posts 62
are shown in FIG. 4. The elastomeric tab 42 is attached to the
mounting posts 62 via the tab pinch clips 46 such that the cooling
device 12 is mounted in a plane perpendicular to a plane of the
substrate 18. This results in jet streams blown in a direction 64
toward the substrate 18.
[0037] FIG. 5 schematically illustrates a mounting apparatus 80 for
the cooling device 12 in FIG. 1. The mounting apparatus 80 may
mount the cooling device 12 in a planar orientation with respect to
the substrate 18. The mounting apparatus 80 includes a connector
formed in a shape of an E-clip 82 extending outwardly from the
cooling device 12. A mounting post 86 coupled to the E-clip 82
mounts the cooling device 12 at an angle to the substrate 18. Jet
streams are blown in a direction 88 toward electronic components
disposed on the substrate 18. The mounting post 86 is mounted to
the substrate 18 via an integrated connector 22. The cooling device
12 also may include one or more flex connections 24 to provide
electrical connection to electronic components.
[0038] FIG. 6 schematically illustrates the E-clip 82, which may be
made of an elastomeric material. The E-clip 82 includes an
angularly extending portion 92 that enables mounting of the cooling
device 12 to the substrate 18. The angularly extending portion 92
has a fixture 94 that provides mechanical connection to the
mounting post 86 (FIG. 5). The angularly extending portion 92
includes inwardly extending clips 93 that receive outwardly
directed extensions 105 of the compliant material 104. The
compliant material 104 includes an orifice 108 that provides a
channel for a jet stream.
[0039] FIG. 7 is a schematic illustration of a top view of an
exemplary cooling device 100. The cooling device 100 includes an
active material 110 bonded to a thin plate or disk 102. In a
particular embodiment, the active material 110 may be electrically
stimulated to cause an out of plane deformation resulting in a jet
of air through an orifice (not shown).
[0040] Examples of a suitable active material 110 include
piezoelectric material, magnetostrictive material (magnetic fields
from coils attract/oppose one another), shape-memory alloy, and
motor imbalance (motor with a mass imbalance creates oscillatory
motion). Within the subset of piezoelectric materials, suitable
active materials include bimorph piezoelectric configurations,
where two piezo layers are energized out of phase to produce
bending; thunder configurations, where one piezo layer is disposed
on a pre-stressed stainless steel shim; buzzer element
configurations, where one piezo layer is disposed on a brass shim;
and MFC configurations, where a piezo fiber composite on a flexible
circuit is bonded to a shim. The active material 110 may also
incorporate a ceramic material.
[0041] FIG. 8 is a cross-sectional view of an exemplary cooling
device 100 in FIG. 7. A compliant material 104 is positioned within
the thin disk or plate 102 and encompasses a chamber 106. In an
example, the compliant material 104 includes an elastomeric
material. An active material 110 as referenced in FIG. 7 is bonded
to at least one of the plates or disks 102. In a particular
embodiment, the active material 110 is bonded to the plate or disk
102 in one assembly step, then the combination of 110 and 102 are
positioned in a pattern via a pick and place automated system. The
compliant material 104 is further dispensed at a controlled rate
onto the plate or disk 102 such that a desirable thickness is
obtained and the cooling device 100 may be tuned to a desired
structural frequency. The compliant material 104 also includes an
orifice or opening 108 (FIG. 6) that provides a channel for a jet
stream between the chamber 106 and an exterior environment. A
stress on the plate or disk 102 created by the active material 110
in response to an electrical stimulus, causes an outward flexing,
resulting in a volume change in the chamber 106 and an influx of
ambient air into the chamber 106, and then inwardly, thereby
ejecting the ambient air from the chamber 106 via the orifice 108.
It should be appreciated that the active material 110 may be
positioned on an inner surface of the plate or disk 102 instead of,
as shown in FIG. 8, an outer surface.
[0042] In another illustrated embodiment of the invention as
described in FIG. 9, a cross-sectional view of a cooling device 120
including a layer of adhesive 122 is depicted. A compliant material
104 as referenced in FIGS. 6 and 8 is positioned within the plate
or disk 102 and encompasses the chamber 106. Active material 110 is
bonded to least one of the plate or disk 102. The compliant
material 104 is attached to the plate or disk 102 through an
adhesive 122. An example of the adhesive 122 includes an epoxy or
pressure sensitive adhesive. In a particular embodiment, the
adhesive 122 is a preformed membrane of material, or a dispensable
material, that is thermally curable with the plate or disk 102. In
another embodiment, the adhesive 122 is a preformed membrane, or a
dispensable material, that is curable by ultraviolet light with the
plate or disk 102. It should be appreciated that the active
material 110 may be positioned on an inner surface of the plate or
disk 102 instead of, as shown in FIG. 9, an outer surface.
[0043] FIG. 10 is a cross-sectional view of an exemplary cooling
device 140 including a pressure sensitive adhesive (PSA) 142. The
compliant material 104 is positioned within the plate or disk 102
and encompasses the chamber 106. The compliant material 104 is a
preformed membrane of material, or a dispensable material, that is
adhered to at least one of the plate or disk 102 by applying a
preformed PSA 142 between the plate or disk 102 and the compliant
material 104. It should be appreciated that the active material 110
may be positioned on an inner surface of the plate or disk 102
instead of, as shown in FIG. 10, an outer surface.
[0044] FIG. 11 is a cross-sectional view of another exemplary
cooling device 160. The cooling device 160 includes at least one
supporting structure 162 having an inner surface 164 defining a
chamber 166. In a particular embodiment, the supporting structure
162 is metallic. In another embodiment, the supporting structure
162 is made of a composite resin. The inner surface 164 also
includes a pair of grooves 168. Further, the supporting structure
162 includes at least one opening or orifice 170 facilitating flow
of jet stream between the chamber 166 and an exterior environment.
A pair of flexible plates 172 is attached to the supporting
structure 162 through the pair of grooves 168. The supporting
structure 162 enables altering a structural dynamic frequency
response of the cooling device 160. The structural frequency of the
cooling device 160 may be optimized and tuned equal to about a
Helmholtz frequency, resulting in a reduction in noise. It should
be appreciated that the active material 110 may be positioned on an
inner surface of the plate or disk 172 instead of, as shown in FIG.
11, an outer surface.
[0045] FIGS. 12 and 13 are cross-sectional views of a cooling
device 180. The cooling device 180 includes an upper suspended jet
plate 182 and a lower suspended jet plate 184 separated by a
chamber 186. In a particular embodiment, the upper jet plate 182 is
bonded to an upper portion 188 of a supporting frame 190 by a
compliant adhesive 192. Similarly, the lower jet plate 184 is
bonded to a lower portion 194 of the supporting frame 190 by the
compliant adhesive 192. The supporting frame 190 includes multiple
orifices 196 that allow a flow of jet. The suspended jet plate
system 180 allows for minimal damping of motion resulting in a free
flow of the jet.
[0046] FIG. 13 is a cross-sectional view of another exemplary
configuration of the cooling device 180 in FIG. 12 including
cantilevers 202. The cantilevers 202 attach the upper jet plate 182
and the lower jet plate 184 to the supporting frame 190 eliminating
a need of an adhesive.
[0047] FIG. 14 is a diagrammatic illustration of another exemplary
cooling device 220. The cooling device 220 includes a cup shaped
supporting structure 222. In a particular embodiment, the cup
shaped supporting structure 222 is made of plastic. The cooling
device 220 includes flexible plates 224 attached to the supporting
structure 222 via an attachment 226. In a particular embodiment,
the plates or disks 224 are metal discs. In another embodiment, the
attachment 226 is a metal attachment. In yet another embodiment,
the attachment 226 may be a V-shaped notch. An active material 228
is disposed on the plate or disks 224. The supporting structure 222
includes multiple leads 230 for electrical connection and support.
In one embodiment, the structure 222 includes two leads for
electrical connection and a lead for support. An orientation plate
232 is attached to a base of the supporting structure 222 to
provide an angular orientation of a jet. An orifice 234 in the
supporting structure 222 is aligned with an orifice in the plates
224 to enable a free flow of jet 236.
[0048] FIG. 15 is a diagrammatic illustration of a modular cooling
device 250. The modular cooling device 250 includes flexible discs
252 with an orifice to allow a flow of jet 254. In a particular
embodiment, the discs 252 are sandwich shaped plastic discs. Leads
256 may be provided for electrical connection to a power source.
Further, a positive terminal 258 and a negative terminal 260 may be
provided for parallel connection to multiple cooling devices. The
modular cooling device 250 provides for a more intense jet
resulting in greater cooling. In a particular embodiment, at least
two cooling devices may be electrically connected in parallel.
[0049] FIG. 16 is a cross-sectional view of an exemplary mounting
configuration for a cooling device 270. The cooling device 270 may
be mounted on a printed circuit board 272 having multiple
electronic components 274 via a compliant adhesive 276. In
particular embodiment, the compliant adhesive 276 has a curing
temperature of less than about 85.degree. C.
[0050] FIG. 17 is a cross-sectional view of another exemplary
mounting configuration for a cooling device 280 onto a printed
circuit board 282. The cooling device 280 includes an orifice 284
that allows a jet 286 to flow on an electronic component 288. The
cooling device 280 is mounted using a through board clip 290 on
either side.
[0051] FIG. 18 a cross-sectional view of another exemplary mounting
configuration 298 for a cooling device 300 onto a printed circuit
board 302. Multiple mounting posts 304 are attached to the cooling
device 300 such that the cooling device 300 is aligned at an angle
to the printed circuit board 302 such as to form a region 306 under
the cooling device 300. This enables mounting of electronic
components 308 that do not require cooling in the region 306
resulting in an effective usage of available area on the circuit
board 302. An electronic component 310 that requires cooling is
further mounted on the printed circuit board 302 so as to receive a
jet flow from the cooling device 300.
[0052] FIG. 19 illustrates steps involved in a method for mounting
a cooling device on a substrate. The method includes disposing at
least one mounting post on the substrate in step 320. A cooling
device is mounted on the mounting post via multiple connectors
extending outwardly from the cooling device in step 322. In a
particular embodiment, the multiple connectors are formed by
extending a compliant material outwardly. In one embodiment, the
multiple connectors are formed by extending multiple tendons
outwardly. In another embodiment, the multiple connectors are
formed by extending multiple tabs. In yet another embodiment, the
multiple connectors are formed by extending an E-clip. In an
exemplary embodiment, the cooling device may also be mounted on the
mounting post at an angle transverse to a plane of the
substrate.
[0053] The various embodiments of a system and method for mounting
a cooling device and a method of fabrication described above thus
provide a way to achieve a convenient and efficient means of
installing a cooling device into various applications. These
techniques and systems also allow for highly efficient
microelectronic assemblies due to improved packaging.
[0054] Of course, it is to be understood that not necessarily all
such objects or advantages described above may be achieved in
accordance with any particular embodiment. Thus, for example, those
skilled in the art will recognize that the systems and techniques
described herein may be embodied or carried out in a manner that
achieves or optimizes one advantage or group of advantages as
taught herein without necessarily achieving other objects or
advantages as may be taught or suggested herein.
[0055] Furthermore, the skilled artisan will recognize the
interchangeability of various features from different embodiments.
For example, the use of a PSA tape to attach an elastomeric
material to a plate with respect to one embodiment can be adapted
for use with an elastomeric tab connector described with respect to
another. Similarly, the various features described, as well as
other known equivalents for each feature, can be mixed and matched
by one of ordinary skill in this art to construct additional
systems and techniques in accordance with principles of this
disclosure.
[0056] While the invention has been described in detail in
connection with only a limited number of embodiments, it should be
readily understood that the invention is not limited to such
disclosed embodiments. Rather, the invention can be modified to
incorporate any number of variations, alterations, substitutions or
equivalent arrangements not heretofore described, but which are
commensurate with the spirit and scope of the invention. For
example, while embodiments of the invention describe the use of
multiple mounting posts for use with a single cooling device, it
should be appreciated that a single mounting post with branching
mounting arms may be used. Further, although the mounting posts are
described as being stiff and unmovable, it should be appreciated
that the mounting posts may be stiff but pliable to enable one to
tune particular cooling devices to a specific angle relative to the
plane in which the substrate exists. Alternatively, the mounting
posts may incorporate a mechanism by which the angle for any
particular cooling device can be manually indexed. Additionally,
while various embodiments of the invention have been described, it
is to be understood that aspects of the invention may include only
some of the described embodiments. Accordingly, the invention is
not to be seen as limited by the foregoing description, but is only
limited by the scope of the appended claims.
* * * * *