Heat-dissipating Device With High Heat-dissipating Efficiency

Abstract

A heat-dissipating device includes a planar plate, a cap-like cover, a finned structure, and a discharge pipe. The cap-like cover includes a base wall, and a surrounding wall that interconnects the planar plate and the base wall, that cooperates with the planar plate and the base wall to define an inner space thereamong, and that defines an inlet. The finned structure includes a plurality of partitioning plates that form a continuous meandering fluid path, and a plurality of heat-dissipating fins that are disposed in the meandering fluid path. The discharge pipe is connected to the surrounding wall of the cap-like cover, is in fluid communication with the second compartment, and has an open end disposed adjacent to the base wall of the cap-like cover.

Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] This invention relates to a heat-dissipating device, more particularly to a heat-dissipating device that has a high heat-dissipating efficiency.

[0003] 2. Description of the Related Art

[0004] FIG. 1 illustrates a conventional heat-dissipating device 11 that includes a planar plate 111, a plurality of heat-dissipating fins 112, and a fan unit 113. The planar plate 111 has top and bottom surfaces. The heat-dissipating fins 112 are formed on a right end portion of the top surface of the planar plate 111. The fan unit 113 is mounted on a left end portion of the top surface of the planar plate 111.

[0005] During assembly, as illustrated in FIG. 2, the bottom surface of the planar plate 111 is first disposed on a heat source, such as a graphics processing unit (GPU) 13 of a video graphics array (VGA) card 1. Thereafter, the fan unit 113 is connected to a power source.

[0006] During a cooling operation, heat generated by the heat source is conducted through the planar plate 111 to the heat-dissipating fins 112, and, at the same time, the fan unit 113 generates airflow to cool the heat-dissipating fins 112, thereby removing the heat conducted by the heat-dissipating fins 112.

[0007] Although the aforementioned conventional heat-dissipating device 11 achieves its intended purpose, the conventional heat-dissipating device 11 has a low heat-dissipating efficiency.

SUMMARY OF THE INVENTION

[0008] Therefore, the object of the present invention is to provide a heat-dissipating device that has a high heat-dissipating efficiency.

[0009] According to the present invention, a heat-dissipating device comprises a planar plate, a cap-like cover, a finned structure, and a discharge pipe. The cap-like cover includes a base wall and a surrounding wall. The base wall of the cap-like cover is spaced apart from the planar plate. The surrounding wall of the cap-like cover interconnects the planar plate and the base wall, cooperates with the planar plate and the base wall to define an inner space thereamong, and defines an inlet. The inner space is divided into first and second compartments. The finned structure includes a plurality of partitioning plates and a plurality of heat-dissipating fins. The partitioning plates of the finned structure are disposed in the first compartment so as to divide the first compartment into a plurality of partitioned sections that are connected to form a continuous meandering fluid path for permitting fluid communication between the first and second compartments. The meandering fluid path has first and second ends that are respectively connected to the inlet and the second compartment. The heat-dissipating fins of the finned structure are disposed in each of the partitioned sections. The discharge pipe is connected to the surrounding wall of the cap-like cover, is in fluid communication with the second compartment, and has an open end disposed adjacent to the base wall of the cap-like cover.

BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments with reference to the accompanying drawings, of which:

[0011] FIG. 1 is a schematic view of a conventional heat-dissipating device;

[0012] FIG. 2 is a schematic view of the conventional heat-dissipating device in a state of use;

[0013] FIG. 3 is an exploded perspective view of the first preferred embodiment of a heat-dissipating device according to this invention;

[0014] FIG. 4 is a schematic sectional view of the first preferred embodiment in an assembled state;

[0015] FIG. 5 is a schematic sectional view illustrating a finned structure of the first preferred embodiment;

[0016] FIGS. 6 to 9 are schematic views of modified embodiments of the first preferred embodiment;

[0017] FIG. 10 is a schematic sectional of the second preferred embodiment of a heat-dissipating device according to this invention;

[0018] FIG. 11 is a perspective view of the third preferred embodiment of a heat-dissipating device according to this invention; and

[0019] FIG. 12 is a schematic sectional view of the third preferred embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Before the present invention is described in greater detail, it should be noted that like elements are denoted by the same reference numerals throughout the disclosure.

[0021] Referring to FIGS. 3 and 4, the first preferred embodiment of a heat-dissipating device according to this invention is shown to include a planar plate 31, a cap-like cover 32, a finned structure 33, and a discharge pipe 50.

[0022] The planar plate 31 has top and bottom surfaces 311, 312. In this embodiment, the planar plate 31 is made from a material having a high thermal conductivity.

[0023] The cap-like cover 32 includes a base wall 321 and a surrounding wall 322. The base wall 321 of the cap-like cover 32 is spaced apart from the planar plate 31, and has a left wall portion 3211, a right wall portion 3212, and an intermediate wall portion 3213 that interconnects the left and right wall portions 3211, 3212 thereof. In this embodiment, the left wall portion 3211 of the base wall 321 of the cap-like cover 32 is convex and defines a recess 3210, and the intermediate and right wall portions 3213, 3212 of the base wall 321 of the cap-like cover 32 are flat. The surrounding wall 322 of the cap-like cover 32 interconnects the bottom surface 312 of the planar plate 31 and the base wall 321 and cooperates with the bottom surface 312 of the planar plate 31 and the base wall 321 to define an inner space 30 thereamong. In this embodiment, the surrounding wall 322 of the cap-like cover 32 has left and right wall portions 3221, 3222, and front and rear wall portions 3223, 3224 that interconnect the left and right wall portions 3221, 3222 thereof. The front wall portion 3223 of the surrounding wall 322 of the cap-like cover 32 defines an inlet 40.

[0024] The heat-dissipating device further includes a partitioning member 34 that is disposed in the inner space 30, that extends parallel to the planar plate 31, and that is disposed between and spaced apart from the planar plate 31 and the base wall 321 of the cap-like cover 32. In this embodiment, the partitioning member 34 has a right end connected to the right wall portion 3222 of the surrounding wall 322 of the cap-like cover 32, front and rear ends respectively connected to the front and rear wall portions 3223, 3224 of the surrounding wall 322 of the cap-like cover 32, and a left end spaced apart from the left wall portion 3221 of the surrounding wall 322 of the cap-like cover 32.

[0025] The finned structure 33 includes a plurality of partitioning plates 331 and a plurality of heat-dissipating fins 332.

[0026] The partitioning plates 331 are formed on the bottom surface 312 of the planar plate 31, are disposed in the inner space 30, and abut against the partitioning member 34.

[0027] The partitioning member 34 cooperates with one of the partitioning plates 331 of the finned structure 33, which is disposed farthest from the right wall portion 3222 of the surrounding wall 322 of the cap-like cover 32, to divide the inner space 30 into first and second compartments 301, 302.

[0028] With further reference to FIG. 5, the partitioning plates 331 divides the first compartment 301 into a plurality of partitioned sections 3010 that are connected to form a continuous meandering fluid path for permitting fluid communication between the first and second compartments 301, 302. In this embodiment, the meandering fluid path has a first end that is directly connected to and that is in fluid communication with the inlet 40, and a second end that is directly connected to and that is in fluid communication with the second compartment 302.

[0029] The heat-dissipating fins 332 are formed on the bottom surface 312 of the planar plate 31 and are disposed in each of the partitioned sections 3010 of the first compartment 301.

[0030] The discharge pipe 50 is disposed externally of the inner space 30 and has an open end 501. In this embodiment, the open end 501 of the discharge pipe 50 is connected to an exterior of the front wall portion 3223 of the surrounding wall 322 of the cap-like cover 32, is in fluid communication with the second compartment 302, is disposed adjacent to a junction of the left wall portion 3211 of the base wall 321 of the cap-like cover 32 and the left and front wall portions 3221, 3223 of the surrounding wall 322 of the cap-like cover 32, and is further disposed at least partially adjacent to the recess 3210 defined by the left wall portion 3211 of the base wall 321 of the cap-like cover 32.

[0031] During assembly, as best shown in FIG. 4, the top surface 311 of the planar plate 31 is first disposed on a heat source, such as a graphics processing device (GPU) 21 of a video graphics array (VGA) card 2. Then, the inlet 40 and the discharge pipe 50 are connected to a pump (not shown).

[0032] During a cooling operation, heat generated by the heat source is conducted through the planar plate 31 to the finned structure 33. At the same time, the pump supplies a coolant (not shown) into the first compartment 301 through the inlet 40, and draws the coolant out of the second compartment 302 through the discharge pipe 50. During this operation, the coolant passes through the meandering fluid path and cools the finned structure 33, thereby permitting efficient dissipation of the heat conducted by the finned structure 33.

[0033] It is noted that, during the above-mentioned cooling operation, the amount of coolant is gradually reduced due to evaporation. However, since the open end 501 of the discharge pipe 50 is disposed adjacent to the base wall 321 of the cap-like cover 32 (i.e., at a position closes to the base wall 321 of the cap-like cover 32, it is ensured that the cooling operation of the heat-dissipating device of this embodiment may continue for a relatively long period of time.

[0034] In another embodiment, the heat-dissipating device is provided with a refill mechanism (not shown) for filling the inner space 30 with the coolant at anytime as needed.

[0035] In yet another embodiment, the left wall portion 3211 of the base wall 321 of cap-like cover 32 is flat, one of the intermediate and right wall portions 3213, 3212 of the base wall 321 of cap-like cover 32 is convex, and the other of the intermediate and right wall portions 3213, 3212 is flat.

[0036] FIG. 6 illustrates a modified embodiment of the first preferred embodiment according to this invention. In this embodiment, the discharge pipe 50 is generally L-shaped, and has a first leg 51 that extends through the front wall portion 3223 of the surrounding wall 322 of the cap-like cover 32 and into the second compartment 302, and a second leg 52 that is disposed in the second compartment 302 and that has the open end 501.

[0037] FIG. 7 illustrates another modified embodiment of the first preferred embodiment according to this invention. In this embodiment, the discharge pipe 50 extends along a straight line, through the front wall portion 3223 of the surrounding wall 322 of the cap-like cover 32, and into the second compartment 302. The open end 501 of the discharge pipe 50 is disposed adjacent to a junction of the left wall portion 3211 of the base wall 321 of the cap-like cover 32 and the left and rear wall portions 3221, 3224 of the surrounding wall 322 of the cap-like cover 32.

[0038] FIG. 8 illustrates yet another modified embodiment of the first preferred embodiment according to this invention. In this embodiment, the discharge pipe 50 is disposed externally of the inner space 30, and is connected to an exterior of the left wall portion 3221 of the surrounding wall 322 of the cap-like cover 32. The open end 501 of the discharge pipe 50 is disposed adjacent to a junction of the left wall portion 3211 of the base wall 321 of the cap-like cover 32 and the left and rear wall portions 3221, 3224 of the surrounding wall 322 of the cap-like cover 32.

[0039] FIG. 9 illustrates still yet another modified embodiment of the first preferred embodiment according to this invention. In this embodiment, the discharge pipe 50 is disposed externally of the inner space 30, and is connected to an exterior of the rear wall portion 3224 of the surrounding wall 322 of the cap-like cover 32. The open end 501 of the discharge pipe 50 is disposed adjacent to a junction of the left wall portion 3211 of the base wall 321 of the cap-like cover 32 and the left and rear wall portions 3221, 3224 of the surrounding wall 322 of the cap-like cover 32.

[0040] FIG. 10 illustrates the second preferred embodiment of a heat-dissipating device according to this invention. When compared with the first preferred embodiment, the partitioning member 34 (see FIG. 4) is dispensed with. The partitioning plates 331 of the finned structure 33 abut against the intermediate and right wall portions 3213, 3212 of the base wall 321 of the cap-like cover 32.

[0041] Since the assembly and the cooling operation of the heat-dissipating device of this embodiment are similar to those described hereinabove in connection with the first preferred embodiment, a detailed description of the same will be dispensed with herein for the sake of brevity.

[0042] FIGS. 11 and 12 illustrate the third preferred embodiment of a heat-dissipating device according to this invention. When compared to the first preferred embodiment, the left and right ends and the front and rear ends of the partitioning member 34 (the rear end of the partitioning member 34 is not visible in FIG. 12) are respectively connected to the left and right wall portions 3221, 3222 and front and rear wall portions 3223, 3224 of the surrounding wall 322 of the cap-like cover 32.

[0043] The partitioning member 34 is formed with a hole 304 therethrough.

[0044] The left wall portion 3211 of the base wall 321 of the cap-like cover 32, like the intermediate and right wall portions 3213, 3212 of the base wall 321 of the cap-like cover 32, is flat.

[0045] The open end 501 of the discharge pipe 50 is disposed adjacent to a junction of the right wall portion 3212 of the base wall 321 of the cap-like cover 32, and the right and front wall portions 3222, 3223 of the surrounding wall 322 of the cap-like cover 32.

[0046] The second end of the meandering fluid path is connected to and is in fluid communication with the second compartment 302 through the hole 304 in the partitioning member 34.

[0047] Since the assembly and the cooling operation of the heat-dissipating device of this embodiment are similar to those described hereinabove in connection with the first preferred embodiment, a detailed description of the same will be dispensed with herein for the sake of brevity.

[0048] While the present invention has been described in connection with what are considered the most practical and preferred embodiments, it is understood that this invention is not limited to the disclosed embodiments but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.

Claims

1. A heat-dissipating device, comprising: a planar plate; a cap-like cover including a base wall spaced apart from said planar plate, and a surrounding wall that interconnects said planar plate and said base wall, that cooperates with said planar plate and said base wall to define an inner space thereamong, and that defines an inlet, said inner space being divided into first and second compartments; a finned structure including a plurality of partitioning plates disposed in said first compartment so as to divide said first compartment into a plurality of partitioned sections that are connected to form a continuous meandering fluid path for permitting fluid communication between said first and second compartments, said meandering fluid path having first and second ends that are respectively connected to said inlet and said second compartment, and a plurality of heat-dissipating fins disposed in each of said partitioned sections; and a discharge pipe connected to said surrounding wall of said cap-like cover, in fluid communication with said second compartment, and having an open end disposed adjacent to said base wall of said cap-like cover.

2. The heat-dissipating device as claimed in claim 1, wherein said base wall of said cap-like cover has a wall portion that is convex and that defines a recess, and the remainder of said base wall is flat, said discharge pipe being disposed at least partially adjacent to said recess.

3. The heat-dissipating device as claimed in claim 1, further comprising a partitioning member disposed in said inner space so as to cooperate with a portion of said finned structure to divide said inner space into said first and second compartments.

4. The heat-dissipating device as claimed in claim 3, wherein said partitioning member extends parallel to said planar plate, is disposed between and spaced apart from said planar plate and said base wall of said cap-like cover, is connected to said surrounding wall of said cap-like cover, and has an end that is spaced apart from said surrounding wall of said cap-like cover, said partitioning plates of said finned structure being formed on said bottom surface of said planar plate and abutting against said partitioning member.

5. The heat-dissipating device as claimed in claim 1, wherein said discharge pipe is disposed externally of said inner space, said open end of said discharge pipe being connected to an exterior of said surrounding wall of said cap-like cover.

6. The heat-dissipating device as claimed in claim 1, wherein said discharge pipe extends through said surrounding wall of said cap-like cover and into said second compartment.

7. The heat-dissipating device as claimed in claim 6, wherein said discharge pipe is generally L-shaped, and has a first leg that extends through said surrounding wall of said cap-like cover and into said second compartment, and a second leg that is disposed in said second compartment and that has said open end.

8. The heat-dissipating device as claimed in claim 6, wherein said discharge pipe extends along a straight line, through said surrounding wall of said cap-like cover, and into said second compartment.

9. The heat-dissipating device as claimed in claim 1, wherein said partitioning plates of said finned structure are formed on said bottom surface of said planar plate and abut against said base wall of said cap-like cover.

10. The heat-dissipating device as claimed in claim 3, wherein said partitioning member extends parallel to said planar plate, is disposed between and spaced apart from said planar plate and said base wall of said cap-like cover, is connected to said surrounding wall of said cap-like cover, and defines a hole therethrough, said partitioning plates of said finned structure being formed on said bottom surface of said planar plate and abutting against said partitioning member, said second end of said meandering fluid path being connected to and in fluid communication with said second compartment through said hole in said partitioning member.