U.S. patent application number 11/757196 was filed with the patent office on 2008-12-04 for heat dissipation apparatus with heat pipes.
This patent application is currently assigned to FOXCONN TECHNOLOGY CO., LTD.. Invention is credited to CHUN-CHI CHEN, YONG-DONG CHEN, SHIH-HSUN WUNG, GUANG YU.
Application Number | 20080295993 11/757196 |
Document ID | / |
Family ID | 40086819 |
Filed Date | 2008-12-04 |
United States Patent
Application |
20080295993 |
Kind Code |
A1 |
CHEN; YONG-DONG ; et
al. |
December 4, 2008 |
HEAT DISSIPATION APPARATUS WITH HEAT PIPES
Abstract
A heat dissipation apparatus adapted for removing heat from a
heat-generating electronic component, includes a conducting core, a
plurality of conducting arms, a plurality of fins and a heat pipe
assembly. The conducting core comprises a heat-absorbing portion
contacting with the heat-generating electronic component. The
conducting arms extend radially and outwardly from the conducting
core. The fins extend outwardly from the respective conducting
arms. Each of the heat pipes comprises an evaporating section
thermally attached to the heat-absorbing portion of the conducting
core and at least one condensing section thermally coupled to the
respective conducting arm.
Inventors: |
CHEN; YONG-DONG; (Shenzhen,
CN) ; YU; GUANG; (Shenzhen, CN) ; WUNG;
SHIH-HSUN; (Tu-Cheng, TW) ; CHEN; CHUN-CHI;
(Tu-Cheng, TW) |
Correspondence
Address: |
PCE INDUSTRY, INC.;ATT. CHENG-JU CHIANG
458 E. LAMBERT ROAD
FULLERTON
CA
92835
US
|
Assignee: |
FOXCONN TECHNOLOGY CO.,
LTD.
Tu-Cheng
TW
|
Family ID: |
40086819 |
Appl. No.: |
11/757196 |
Filed: |
June 1, 2007 |
Current U.S.
Class: |
165/80.3 ;
165/104.33; 361/700 |
Current CPC
Class: |
H01L 23/467 20130101;
F28F 1/12 20130101; H01L 23/427 20130101; F28D 15/0266 20130101;
F28F 2215/10 20130101; H01L 2924/0002 20130101; F28D 15/0275
20130101; H01L 2924/00 20130101; F28F 3/02 20130101; H01L 2924/0002
20130101 |
Class at
Publication: |
165/80.3 ;
165/104.33; 361/700 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Claims
1. A heat dissipation apparatus adapted for removing heat from a
heat-generating electronic component, comprising: a conducting core
having a heat-absorbing portion contacting with the heat-generating
electronic component; a plurality of conducting arms extending
radially and outwardly from the conducting core; a plurality of
fins extending outwardly from the respective conducting arms; and a
heat pipe assembly comprising a plurality of heat pipes each having
an evaporating section thermally attached to the heat-absorbing
portion of the conducting core and at least one condensing section
thermally coupled to the respective conducting arm.
2. The heat dissipation apparatus as claimed in claim 1, wherein
the conducting arms each define a channel therein, and the at least
one condensing section of each of the heat pipes thermally engages
in the channel.
3. The heat dissipation apparatus as claimed in claim 2, wherein
the heat-absorbing portion of the conducting core is a
heat-absorbing block.
4. The heat dissipation apparatus as claimed in claim 3, wherein
the conducting core comprises a conducting member detachably and
thermally attached to the heat-absorbing block.
5. The heat dissipation apparatus as claimed in claim 4, wherein
the conducting member is a hollow prism formed by four spreaders
standing on the heat-absorbing block.
6. The heat dissipation apparatus as claimed in claim 5, wherein
the spreaders each have two conducting wings extending outwardly
from two opposite ends thereof, each of the conducting arms is made
up of two adjoining conducting wings.
7. The heat dissipation apparatus as claimed in claim 6, wherein
the two adjoining conducting wings that forming the conducting arm
respectively define two corresponding receiving grooves for forming
the channel of the conducting arm.
8. The heat dissipation apparatus as claimed in claim 4, wherein
the conducting member is a hollow cylinder, the heat-absorbing
block is received in the cylinder with a bottom surface thereof
leveling with a bottom of the cylinder.
9. The heat dissipation apparatus as claimed in claim 8, wherein
the cylinder defines a plurality of recesses in an inner wall
thereof, the conducting arms extend outwardly from a circumference
of the cylinder and are aligned with the respective recesses of the
cylinder.
10. The heat dissipation apparatus as claimed in claim 9, wherein
the channel is vertically located in the conducting arm and
adjacent to a distal end of the conducting arm.
11. The heat dissipation apparatus as claimed in claim 10, wherein
the conducting arms each define a slot in a bottom thereof, the
slot respectively communicates with the corresponding recess of the
cylinder and the channel of the conducting arm.
12. The heat dissipation apparatus assembly as claimed in claim 11,
wherein the heat pipe assembly comprises four U-shaped heat pipes
each having a first evaporating section and three condensing
sections, the evaporating section thermally engages with the
heat-absorbing block, the three condensing sections are received in
the recesses of the cylinders, the slots and the channels of the
conducting arms respectively.
13. The heat dissipation apparatus assembly as claimed in claim 11,
wherein the conducting core, the conducting arms and the fins are
formed integrally by aluminum extrusion.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to heat dissipation apparatus,
and particularly to a heat dissipation apparatus incorporating heat
pipes for removing heat from a heat-generating electronic
component.
[0003] 2. Description of Related Art
[0004] Computer electronic components, such as central processing
units (CPUs), generate a mass of heat during operation. If the heat
is not removed quickly, it may deteriorate operational stability of
the CPU and damage associated electronic equipment. A heat sink
attached to a top surface of the CPU is required to remove heat
therefrom.
[0005] A conventional heat sink is typically made of a highly
heat-conductive metal, such as copper or aluminum, and generally
includes a base for contacting the electronic component to absorb
heat therefrom and a plurality of fins formed on the base for
dissipating heat. However, as CPU (central processing unit)
operating speeds have been upgraded dramatically, the conventional
heat sinks can no longer meet the heat dissipation requirements of
modern IC packages. In recent years, heat pipes have been widely
used due to their great heat-transfer capability and various types
of heat sinks equipped with heat pipes have been designed.
[0006] A typical heat sink with heat pipes is illustrated in FIG.
7. The heat sink comprises a base 100, two vertical U-shaped heat
pipes 200 (only one shown) installed on the base 100 and a
plurality of parallel fins 300 parallel to the base 100. The heat
pipe 200 has a straight evaporating portion 220 for engaging with
the base 100 and two parallel condensing portions 240 perpendicular
to the evaporating portion 220 and extending upwardly through the
fins 300. The heat sink absorbs heat generated by an IC package
(not shown) through the base 100. The heat is then speedily
transferred, via the heat pipes 200, to the fins 300 for further
heat dissipation.
[0007] However, this design for a heat sink has a disadvantage in
its structure. The fins in this type of heat sink are made of thin
pieces of metal and define a plurality of through holes therein for
engaging with the heat pipes 200, thus the heat sink is complicated
and costly in manufacturing. Additionally, the fins are so thin
that do not have an adequate contact area with the heat pipes, thus
adversely impacting heat transfer performance between the fins and
the heat pipes.
[0008] What is needed is a heat dissipation apparatus with an
enhanced heat dissipation performance whilst still being economical
to manufacture.
SUMMARY OF THE INVENTION
[0009] A heat dissipation apparatus adapted for removing heat from
a heat-generating electronic component, includes a conducting core,
a plurality of conducting arms, a plurality of fins and a heat pipe
assembly. The conducting core comprises a heat-absorbing portion
contacting with the heat-generating electronic component. The
conducting arms extend radially and outwardly from the conducting
core. The fins extend outwardly from the respective conducting
arms. Each of the heat pipes comprises an evaporating section
thermally attached to the heat-absorbing portion of the conducting
core and at least one condensing section thermally coupled to the
respective conducting arm.
[0010] Other advantages and novel features will become more
apparent from the following detailed description of preferred
embodiments when taken in conjunction with the accompanying
drawings, in which:
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Many aspects of the present embodiments can be better
understood with reference to the following drawings. The components
in the drawings are not necessarily drawn to scale, the emphasis
instead being placed upon clearly illustrating the principles of
the present embodiments. Moreover, in the drawings, like reference
numerals designate corresponding parts throughout the several
views.
[0012] FIG. 1 is an isometric view of a heat dissipation apparatus
in accordance with a first preferred embodiment;
[0013] FIG. 2 is an isometric, partial exploded view of FIG. 1;
[0014] FIG. 3 is an isometric, exploded view of FIG. 1;
[0015] FIG. 4 is an isometric view of a heat dissipation device in
accordance with a second preferred embodiment;
[0016] FIG. 5 is an inverted view of FIG. 4;
[0017] FIG. 6 is an isometric, exploded view of FIG. 4; and
[0018] FIG. 7 is a perspective view of a heat sink according to
related art.
DETAILED DESCRIPTION OF THE INVENTION
[0019] Referring to FIGS. 1 to 3, a heat dissipation apparatus 1 in
accordance with a first preferred embodiment is illustrated. The
heat dissipation apparatus 1 is configured (i.e., structured and
arranged) for removing heat from a heat-generating electronic
component (not shown) and comprises a heat-absorbing block 12, a
plurality of heat pipes 14 thermally attached to the heat-absorbing
block 12 and a plurality of heat sink units alternately
assembled.
[0020] The heat-absorbing block 12 is a rectangular plate and made
of a good material such as copper and aluminum. The heat-absorbing
block 12 defines two spaced receiving grooves 120 in a top surface
thereof. The receiving grooves 120 are parallel to a pair of
opposite edges of the heat-absorbing block 12 and located at a
middle of the heat-absorbing block 12. The receiving grooves 120
each has a contacting protrusion 122 extending inwardly from a
middle portion of an outer sidewall thereof, which defines a
inclined face at a distal end thereof, for maximizing a contacting
area between the heat pipes 14 and the heat-absorbing block 12.
[0021] The heat pipes 14 can be of various numbers in different
embodiments; the number is two in this embodiment. The two heat
pipes 14 are flattened and identical to each other. The heat pipes
14 each comprise an elongated evaporating section 142 and two
condensing sections 144 extending obliquely toward one lateral side
from two opposite ends of the evaporating section 142. The
evaporating sections 142 are thermally engaged in the respective
receiving grooves 120 of the heat-absorbing block 12 and intimately
contact with the contacting protrusions 122 of the receiving
grooves 120.
[0022] The heat sink units include a pair of first heat sink units
16 and a pair of the second heat sink units 18. The first heat sink
units 16 each are formed integrally by aluminum extrusion, comprise
a first spreader 160, two second conducting wings 162 extending
obliquely and outwardly from two opposite edges of the first
spreader 160, and a plurality of parallel first fins 164 extending
outwardly from the first spreader 160 and the first conducting
wings 164. The first spreaders 160 are rectangular plates and stand
vertically on the heat-absorbing block 12. The first conducting
wings 162 each define a first groove 1620 therein, which extends
diagonally and upwardly. The first fins 164 arranged between the
two corresponding first wings 162, are perpendicular to the
corresponding first spreader 160.
[0023] The second heat sink units 18 are similar to the first heat
sink units 16, formed by aluminum extrusion and each comprise a
second spreader 180 standing vertically on the heat-absorbing block
12, two second conducting wings 182 extending slantwise from two
opposite edges of the second spreader 180 and a plurality of second
fins 184 extending outwardly from the second spreader 180 and the
two second conducting wings 182. The second spreader 180 as tall as
that of the first spreader 160 and has a width smaller than that of
the first spreader 160. The second conducting wings 182 each define
a second groove 1820 diagonally therein corresponding to the first
groove 1620 of the first heat sink units 16. Each of the second
conducting wings 182 defines a fixing post 186 with an opening
through hole (not labeled) therein at a distal end thereof, for
mounting a fan (not shown) on the heat dissipation apparatus 1. The
second groove 1820 incorporates the corresponding first groove 1620
to define a channel for receiving the condensing section 144 of the
heat pipe 14 therein.
[0024] Referring to the FIGS. 1 and 2 again, in assembly of the
heat dissipation apparatus 1, the two first heat sink units 16 and
the two second heat sink units 18 are alternately assembled
together and disposed on the heat-absorbing blocks 12. The first
conducting wing 162 of the first heat sink unit 16 co-operates with
a neighboring second conducting wing 182 of the second heat sink
unit 18 to form a conducting arm (not labeled). The first groove
1620 of the first conducting wing 162 co-operates with the second
groove 1820 of the second conducting wing 182 adjoining the first
conducting wing 162 to define the channel in the conducting arm.
The evaporating sections 142 of the heat pipes 14 accommodated in
the respective receiving grooves 120 of the heat-absorbing block 12
engage thermally with the contacting protrusions 122 of the
receiving grooves 120. The condensing sections 144 of the heat
pipes 14 received in the corresponding channels in the conducting
arms are coated with thermal interface material to enhance transfer
efficiency between the heat pipes 14 and the heat sink units 16,
18.
[0025] As description above, the two first spreaders 160 of the
first heat sink units 16 and the two second spreaders 180 of the
second heat sink units 18 vertically standing on the heat-absorbing
block 12, are assembled together to form a conducting member which
is a hollow prism in this embodiment. In some embodiment, the
heat-absorbing block 12 is integrated with the conducting member to
form a conducting core, and the heat-absorbing block 12 serving as
a heat-absorbing portion of the conducting core.
[0026] As shown in the FIGS. 4 to 6, a heat dissipation apparatus 2
according to a second prefer embodiment of the present invention,
comprises a heat-absorbing member 21, four identical heat pipes 23
and a heat sink 25.
[0027] The heat-absorbing member 21 made of a good conducting
material such as copper, is flat-column shaped and defines four
recesses 210 symmetrically in a rim thereof, for engaging with the
heat pipes 23.
[0028] The heat pipes 23 each are circular in cross section, and
U-shaped in profile. Each of the heat pipes 23 comprises an
evaporating section 230 at a turning thereof, a first condensing
section 232 located above the evaporating section 230, a second
condensing section 234 parallel to the first condensing section 232
and a third condensing section 236. The third condensing section
236 is perpendicular to the first condensing section 232 and the
second condensing section 234, and connects the evaporating section
230 and the second condensing section 234 together. The evaporating
section 230 is thus positioned at the turning between the first
condensing section 232 and the third condensing section 236.
[0029] The heat sink 25 is substantially rectangular and integrally
formed by aluminum extrusion. The heat sink 25 comprises a
conducting member, four conducting arms 254 extending outwardly
from the conducting member and a plurality of fins 256 radially
extending from the conducting member and arms 254. The conducting
member is a cylinder 252 with a hollow hole therein and
symmetrically defines four vertical recesses 2520 in inner wall of
the cylinder 252 for thermally engaging with the first condensing
sections 232 of the heat pipes 23. The four conducting arms 254
extend outwardly from a circumference of the cylinder 252 and are
aligned with the four respective recesses 2520 of the cylinder 252.
Each of the conducting arms 254 defines a vertical channel 2540
adjacent to a distal end thereof, for receiving the second
condensing section 234 of one heat pipe 23. Each of the conducting
arms 254 defines a fixing post 2542 with an opening through hole
(not labeled) therein at a distal end thereof, for mounting a fan
(not shown) on the heat dissipation apparatus 2. Each of the
conducting arms 254 defines a slot 2544 in a bottom thereof for
receiving the third condensing section 236 of the heat pipe 23. The
slots 2544 each respectively communicate with the recess 2520 of
the cylinder 252 and the channel 2540 of the conducting arm
254.
[0030] A bottom of the cylinder 252 and portions of the fins 256
around the cylinder 252 defines a circular platform protruding from
remains of the fins 256. The platform and a bottom surface of the
heat-absorbing member 21 that are snugly received in the cylinder
252 are coplanar, so as to form a contacting interface for
thermally contacting with the heat-generating electronic component.
In an alternative embodiment, the conducting member--the cylinder
252 is integrated with the heat-absorbing member 21 to form a
conducting core, wherein the heat-absorbing member 21 acts as a
heat-absorbing portion of the conducting core to contact with the
heat-generating electronic component; the first condensing sections
232 of the heat pipes 23 extend upwardly in the conducting
core.
[0031] Referring to FIGS. 4 and 5 again, in assembly of the heat
dissipation apparatus 2, the heat-absorbing member 21 snugly
received in the cylinder 252 of the heat sink 25 and contacts with
the heat-generating electronic component. The recesses 210 of the
heat-absorbing member 21 incorporate corresponding lower portions
of the recesses 2520 of the cylinder 252 respectively to define
through holes that engagingly receive the evaporating sections 230
of the heat pipes 23. The first condensing sections 232 of the heat
pipes 23 pass through the corresponding through holes formed by
recesses 210 and 2520 to engage in the recesses 2520 of the
cylinder 252 respectively. The second condensing sections 234 and
the third condensing sections 236 of the heat pipes 23 are received
engagingly in the corresponding channels 2540 and the slots 2544 of
the conducting arms 254 respectively.
[0032] According to the aforementioned description, the heat
dissipation apparatus of the present invention by aluminum
extrusion is simple and economical in manufacture, also convenient
in assembling process. In addition, the channels formed by aluminum
extrusion in the conducting arms of the heat dissipation apparatus
thermally and adequately contact with the condensing sections of
heat pipes. Therefore, heat transfer between the heat pipes and the
conducting arms is so dramatically enhanced that heat absorbed by
the heat-absorbing member and the evaporating section of the heat
pipes is conducted to the whole fins symmetrically and promptly for
dissipating to the surrounding atmosphere.
[0033] It is believed that the present embodiments and their
advantages will be understood from the foregoing description, and
it will be apparent that various changes may be made thereto
without departing from the spirit and scope of the invention or
sacrificing all of its material advantages, the examples
hereinbefore described merely being preferred or exemplary
embodiments of the invention.
* * * * *