U.S. patent application number 11/570420 was filed with the patent office on 2008-11-27 for three dimensional antennas formed using wet conductive materials and methods for production.
This patent application is currently assigned to Galtronics Ltd.. Invention is credited to Izhak Krishtul.
Application Number | 20080291095 11/570420 |
Document ID | / |
Family ID | 35503570 |
Filed Date | 2008-11-27 |
United States Patent
Application |
20080291095 |
Kind Code |
A1 |
Krishtul; Izhak |
November 27, 2008 |
Three Dimensional Antennas Formed Using Wet Conductive Materials
and Methods for Production
Abstract
A method for manufacturing antennas including providing a
substrate having at least one surface lying in three dimensions and
applying a conductive coating to the at least one surface lying in
three dimensions, thereby defining an antenna on the at least one
surface and an antenna including a conductive coating applied to a
three-dimensional surface of a substrate.
Inventors: |
Krishtul; Izhak;
(Kiryat-Yawm, IL) |
Correspondence
Address: |
DARBY & DARBY P.C.
P.O. BOX 770, Church Street Station
New York
NY
10008-0770
US
|
Assignee: |
Galtronics Ltd.
Tiberias
IL
|
Family ID: |
35503570 |
Appl. No.: |
11/570420 |
Filed: |
June 9, 2005 |
PCT Filed: |
June 9, 2005 |
PCT NO: |
PCT/IL05/00611 |
371 Date: |
April 13, 2007 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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60579173 |
Jun 10, 2004 |
|
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60631968 |
Nov 29, 2004 |
|
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60676471 |
Apr 28, 2005 |
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Current U.S.
Class: |
343/702 ; 29/600;
343/700MS |
Current CPC
Class: |
H01Q 9/0421 20130101;
H01Q 1/243 20130101; Y10T 29/49016 20150115; H01Q 1/24
20130101 |
Class at
Publication: |
343/702 ; 29/600;
343/700.MS |
International
Class: |
H01Q 1/24 20060101
H01Q001/24; H01P 11/00 20060101 H01P011/00; H01Q 9/04 20060101
H01Q009/04 |
Claims
1. A method for manufacturing antennas comprising: providing a
substrate having at least one surface lying in three dimensions;
and applying a conductive coating to said at least one surface
lying in three dimensions, thereby defining an antenna on said at
least one surface.
2. A method according to claim 1 wherein said substrate defines at
least one of a housing portion and a carrier element of a mobile
communicator.
3. A method according to claim 1 and wherein said applying a
conductive coating includes applying said coating in a
predetermined pattern which corresponds to the configuration of
said antenna.
4. A method according to claim 1 and wherein said applying a
conductive coating comprises applying a conductive polymer
coating.
5. A method according to claim 4 and wherein said applying a
conductive polymer coating comprises applying at least one of
silver and nanoparticles.
6. A method according to claim 1 and wherein said applying a
conductive coating comprises spraying said conductive coating onto
a pre-masked substrate.
7. A method according to claim 1 and wherein said applying a
conductive coating comprises: spraying said conductive coating onto
said substrate; and thereafter patterning said conductive
coating.
8. A method according to claim 1 and wherein said applying a
conductive coating comprises microdispensing said conductive
coating onto said surface.
9. A method according to claim 1 and wherein said applying a
conductive coating comprises: dipping the surface in a conductive
coating bath; and thereafter patterning said conductive
coating.
10. A method according to claim 1 and wherein said applying a
conductive coating comprises at least one of chemical vapor
deposition, physical vapor deposition and electroless plating of a
pre-patterned three-dimensional substrate.
11. A method according to claim 1 and wherein said applying a
conductive coating comprises: pad printing at least one of interior
portions and non-highly angled portions of said three-dimensional
substrate; and applying sub-micron conductive particles to at least
one of peripheral portions and highly angled portions of said
three-dimensional substrate.
12. A method according to claim 1 and wherein said antenna is an
embedded antenna.
13. A method for manufacturing a precision three-dimensional
conductive layer comprising: providing a substrate having at least
one surface having at least a first generally two-dimensional
surface portion and at least a second generally three-dimensional
surface portion; applying a conductive coating to said at least a
first generally two-dimensional surface portion; and applying
sub-micron conductive particles to said at least a second generally
three-dimensional surface portion, wherein said conductive coating
on said at least a first generally two-dimensional surface portion
and said sub-micron conductive particles on said at least a second
generally three-dimensional surface portion together define said
precision three-dimensional conductive layer.
14. A method for manufacturing a precision three-dimensional
conductive layer according to claim 13 and wherein said applying
sub-micron conductive particles includes applying said submicron
conductive particles in a predetermined pattern, the outer extent
of which corresponds to the configuration of said precision
three-dimensional conductive layer.
15. A method for manufacturing a precision three-dimensional
conductive layer according to claim 13 and wherein said applying a
conductive coating comprises applying a conductive polymer
coating.
16. A method for manufacturing a precision three-dimensional
conductive layer according to claim 15 and wherein said applying a
conductive polymer coating comprises applying at least one of
silver and nanoparticles.
17. A method for manufacturing a precision three-dimensional
conductive layer according to claim 13 and wherein said applying a
conductive coating utilizes pad printing.
18. A method for manufacturing a precision three-dimensional
conductive layer according to claim 13 and wherein said precision
three-dimensional conductive layer is formed on a plastic support
element, which forms part of a mobile communicator.
19. An antenna comprising a conductive coating applied as a wet
conductive material to at least one three-dimensional surface.
20. An antenna comprising a conductive coating applied to a
three-dimensional surface of a substrate.
21. An antenna according to claim 20 and wherein said conductive
coating is a polymer.
22. An antenna according to claim 21 and wherein said polymer
comprises at least one of silver and nanoparticles.
23. A mobile communicator comprising: a housing portion; a carrier
element, at least one of said housing portion and said carrier
element defining a substrate having at least one surface lying in
three dimensions; and an antenna, said antenna defined by a
conductive coating applied to said at, least one surface lying in
three dimensions.
24. A mobile communicator according to claim 23 and wherein said
conductive coating includes a predetermined pattern, which
corresponds to the configuration of said antenna.
25. A mobile communicator according to claim 23 and wherein said
antenna is embedded in said housing portion.
26. A mobile communicator according to claim 23 and wherein said
conductive coating is a polymer.
27. A mobile communicator according to claim 26 and wherein said
polymer comprises at least one of silver and nanoparticles.
28. A precision three-dimensional conductive layer, said conductive
layer being applied to at least one support surface having at lest
a first generally two-dimensional surface portion and at least a
second generally three-dimensional surface portion, said conductive
layer comprising; a conductive coating applied to said at least a
first generally two-dimensional surface portion; and sub-micron
conductive particles applied to said at least a second generally
three-dimensional surface portion.
29. A precision three-dimensional conductive layer according to
claim 28 and wherein said sub-micron conductive particles are
applied in a predetermined pattern extending at least generally
along the periphery of said precision three-dimensional conductive
layer.
30. A precision three-dimensional conductive layer according to
claim 28 and wherein said conductive coating is a polymer.
31. A precision three-dimensional conductive layer according to
claim 30 and wherein said polymer comprises at least one of silver
and nanoparticles.
32. A method for manufacturing mobile communicators comprising:
providing a substrate having at least one surface lying in three
dimensions, said substrate defining at least one of a housing
portion and a carrier element of a mobile communicator; and
applying a conductive coating to said at least one surface lying in
three dimensions, thereby defining an antenna on said at least one
surface.
Description
REFERENCE TO RELATED APPLICATIONS
[0001] Reference is made to U.S. Provisional Patent Application
60/579,173 filed Jun. 10, 2004 entitled "THREE DIMENSIONAL CPA
(CONDUCTIVE POLYMER ANTENNA)", to U.S. Provisional Patent
Application filed Nov. 29, 2004 and entitled "THREE DIMENSIONAL CPA
(CONDUCTIVE POLYMER ANTENNA)", and to U.S. Provisional Patent
Application, filed Apr. 28, 2005 entitled "METHOD FOR APPLYING WET
CONDUCTIVE MATERIALS ON A 3D SUBSTRATE", the disclosures of which
are hereby incorporated by reference and priority of which is
hereby claimed pursuant to 37 CFR 1.78(a) (4) and (5)(i).
FIELD OF THE INVENTION
[0002] The present invention relates to antennas generally and to
methods of manufacture thereof.
BACKGROUND OF THE INVENTION
[0003] The following patents and published patent applications are
believed to represent the current state of the art:
[0004] U.S. Pat. Nos. 6,404,393; 6,115,762; 6,031,505; 4,100,013;
4,242,369; 4,668,533; 6,658,314; 6,259,962; 6,582,979; 6,765,183;
6,249,261; 6,501,437; 6,575,374; 6,735,183; 6,818,985; 6,251,488;
6,636,676; 6,811,744; 6,823,124; 6,642,893; 6,037,906; 6,351,241;
5,204,687 and 5,943,020.
[0005] Published PCT Patent Application WO2004/068389.
[0006] Published U.S. Patent Applications 2004/0197493;
2004/0179808 and 2005/0046664.
SUMMARY OF THF INVENTION
[0007] The present invention seeks to provide an improved antenna
and methods for manufacturing thereof.
[0008] There is thus provided in accordance with a preferred
embodiment of the present invention a method for manufacturing
antennas including providing a substrate having at least one
surface lying in three dimensions and applying a conductive coating
to the at least one surface lying in three dimensions, thereby
defining an antenna on the at least one surface.
[0009] There is also provided in accordance with another preferred
embodiment of the present invention a method for manufacturing
mobile communicators including providing a substrate having at
least one surface lying in three dimensions, the substrate defining
at least one of a housing portion and a carrier element of a mobile
communicator, and applying a conductive coating to the at least one
surface lying in three dimensions, thereby defining an antenna on
the at least one surface.
[0010] Preferably, the applying a conductive coating includes
applying the conductive coating in a predetermined pattern, which
corresponds to the configuration of the antenna. Additionally or
alternatively, the applying a conductive coating includes applying
a conductive polymer coating. Additionally, the applying a
conductive polymer coating includes applying at least one of silver
and nanoparticles.
[0011] Preferably, the applying a conductive coating includes
spraying the conductive coating onto a pre-masked substrate.
Additionally or alternatively, the applying a conductive coating
includes spraying the conductive coating onto the substrate and
thereafter patterning the conductive coating. Alternatively or
additionally, the applying a conductive coating includes
microdispensing the conductive coating onto the surface.
Additionally or alternatively, the applying a conductive coating
includes dipping the surface in a conductive coating bath and
thereafter patterning the conductive coating.
[0012] Preferably, the applying a conductive coating includes at
least one of chemical vapor deposition, physical vapor deposition
and electroless plating of a pre-patterned three-dimensional
substrate. Alternatively or additionally, the applying a conductive
coating includes pad printing at least one of interior portions and
non-highly angled portions of the three-dimensional substrate and
applying sub-micron conductive particles to at least one of
peripheral portions and highly angled portions of the
three-dimensional substrate.
[0013] Preferably, the antenna is an embedded antenna.
[0014] There is further provided in accordance with yet another
preferred embodiment of the present invention a method for
manufacturing a precision three-dimensional conductive layer
including providing a substrate having at least one surface having
at least a first generally two-dimensional surface portion and at
least a second generally three-dimensional surface portion,
applying a conductive coating to at least a first generally
two-dimensional surface portion and applying sub-micron conductive
particles to at least a second generally three-dimensional surface
portion, wherein the conductive coating on at least a first
generally two-dimensional surface portion and the sub-micron
conductive particles on at least a second generally
three-dimensional surface portion together define the precision
three-dimensional conductive layer.
[0015] Preferably, the applying sub-micron conductive particles
includes applying the sub-micron conductive particles in a
predetermined pattern, the outer extent of which corresponds to the
configuration of the precision three-dimensional conductive layer.
Additionally or alternatively, the applying a conductive coating
includes applying a conductive polymer coating. Additionally, the
applying a conductive polymer coating includes applying at least
one of silver and nanoparticles.
[0016] Preferably, the applying a conductive coating utilizes pad
printing. Additionally, the precision three-dimensional conductive
layer is formed on a plastic support element, which forms part of a
mobile communicator.
[0017] There is yet further provided in accordance with still
another preferred embodiment of the present invention an antenna
including a conductive coating applied as a wet conductive material
to at least one three-dimensional surface.
[0018] There is also provided in accordance with yet another
preferred embodiment of the present invention an antenna including
a conductive coating applied to a three-dimensional surface of a
substrate.
[0019] Preferably, the conductive coating is a polymer. More
preferably, the polymer includes at least one of silver and
nanoparticles.
[0020] There is additionally provided in accordance with another
preferred embodiment of the present invention a mobile communicator
including a housing portion, a carrier element, at least one of the
housing portion and the carrier element defining a substrate having
at least one surface lying in three dimensions, and an antenna, the
antenna defined by a conductive coating applied to the at least one
surface lying in three dimensions.
[0021] Preferably, the conductive coating includes a predetermined
pattern, which corresponds to the configuration of the antenna.
Additionally, the antenna is embedded in at least one of the
housing portion and the carrier element.
[0022] Preferably, the conductive coating is a polymer. More
preferably, the polymer includes at least one of silver and
nanoparticles.
[0023] There is yet further provided in accordance with another
preferred embodiment of the present invention, a precision
three-dimensional conductive layer, the conductive layer being
applied to at least one support surface having at least a first
generally two-dimensional surface portion and at least a second
generally three-dimensional surface portion, the conductive layer
including a conductive coating applied to at least a first
generally two-dimensional surface portion and sub-micron conductive
particles applied to at least a second generally three-dimensional
surface portion.
[0024] Preferably, the sub-micron conductive particles are applied
in a predetermined pattern extending at least generally along the
periphery of the precision three-dimensional conductive layer.
Additionally or alternatively, the conductive coating is a polymer.
Preferably, the polymer includes at least one of silver and
nanoparticles.
BRIEF DESCRIPTION OF THE DRAWINGS
[0025] The present invention will be understood and appreciated
more fully from the following detailed description, taken in
conjunction with the drawings in which:
[0026] FIG. 1 is a simplified pictorial illustration of an embedded
antenna formed by a wet conductive coating on a three-dimensional
substrate, forming part of a mobile communicator, constructed and
operative in accordance with a preferred embodiment of the present
invention;
[0027] FIG. 2 is a simplified pictorial illustration of the
embedded antenna of FIG. 1;
[0028] FIGS. 3A and 3B are simplified sectional illustrations of
the embedded antenna of FIGS. 1 & 2, taken along lines
IIIA-IIIA and IIIB-IIIB in FIG. 2;
[0029] FIGS. 4A, 4B, 4C, 4D, 4E and 4F are simplified illustrations
of six alternative methodologies for producing the embedded antenna
of FIGS. 1-3B;
[0030] FIG. 5 is a simplified pictorial illustration of an embedded
antenna formed by a conductive coating on a three-dimensional
plastic support element, forming part of a mobile communicator,
constructed and operative in accordance with a preferred embodiment
of the present invention;
[0031] FIG. 6 is a simplified pictorial illustration of the
embedded antenna of FIG. 5;
[0032] FIG. 7 is a simplified plan view illustration of the
embedded antenna of FIGS. 5 & 6;
[0033] FIGS. 8A and 8B are simplified sectional illustrations of
the embedded antenna of FIGS. 5-7, taken along lines VIIIA-VIIIA
and VIIIB-VIIIM in FIG. 7;
[0034] FIGS. 9A, 9B, 9C, 9D, 9E and 9F are simplified illustrations
of six alternative methodologies for producing the embedded antenna
of FIGS. 5-8B;
[0035] FIG. 10A is a simplified pictorial exploded view
illustration of an external snap-in antenna including a
three-dimensional meander radiating element, constructed in
accordance with a preferred embodiment of the present
invention;
[0036] FIG. 10B is a simplified pictorial partially assembled view
illustration of the antenna of FIG. 10A;
[0037] FIG. 10C is a simplified pictorial fully assembled view
illustration of the antenna of FIGS. 10A & 10B;
[0038] FIG. 11 is a simplified illustration of methodology for
producing the antenna of FIGS. 10A-10C;
[0039] FIG. 12A is a simplified pictorial exploded view
illustration of an external retractable top helical antenna having
a three-dimensional coil or meander element, constructed in
accordance with a preferred embodiment of the present
invention;
[0040] FIG. 12B is a simplified pictorial partially assembled view
illustration of the antenna of FIG. 12A;
[0041] FIG. 12C is a simplified pictorial fully assembled view
illustration of the antenna of FIGS. 12A & 12B;
[0042] FIG. 13 is a simplified illustration of a methodology for
producing the antenna of FIGS. 12A-12C;
[0043] FIG. 14A is a simplified pictorial exploded view
illustration of an external retractable base helical antenna having
two three-dimensional coil or meander elements, constructed in
accordance with a preferred embodiment of the present
invention;
[0044] FIG. 14B is a simplified pictorial partially assembled view
illustration of the antenna of FIG. 14A;
[0045] FIG. 14C is a simplified pictorial fully assembled view
illustration of the antenna of FIGS. 14A & 14B; and
[0046] FIG. 15 is a simplified illustration of a methodology for
producing the antenna of FIGS. 14A-14C.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0047] Reference is now made to FIG. 1, which is a simplified
pictorial illustration of an embedded antenna, constructed and
operative in accordance with a preferred embodiment of the present
invention, formed by a conductive coating on a three-dimensional
substrate, forming part of a mobile communicator; FIG. 2, which is
a simplified pictorial illustration of the embedded antenna of FIG.
1, showing an antenna pattern created by applying a wet conductive
polymer to the substrate and FIGS. 3A and 3B which are simplified
sectional illustrations of the embedded antenna of FIGS. 1 & 2,
taken along lines IIIA-IIIA and IIIB-IIIB in FIG. 2.
[0048] As seen in FIGS. 1-3B, an embedded antenna 100 is formed by
coating a three-dimensional substrate, such as part of the back
casing 102 of a mobile telephone 103, with a wet conductive coating
104. The conductive coating 104 preferably comprises silver.
Alternatively, the conductive coating may employ any other suitable
conductor. Generally, wet conductive materials useful in the
present invention preferably comprise conductive polymers, but may
also include conductive ink jet inks, pigmented inks, conductive
nanopastes, hybrid nanopastes, conductive nanoparticles,
microparticles and nanometal powders. Other suitable materials may
include Electronic Band-Gap (EBG) structures and Frequency
Selective Surface (FSS) materials or other suitable types of
metamaterials, such as those described in Research on negative
refraction and backward-wave media: A historical perspective by
Sergei Tretyakov, EPFL Latsis Symposium 2005; Negative refraction:
revisiting electromagnetics from microwaves to optics, Lausanne
28.2-2.03.2005, pp 30-35; On EBG Structures for Cellular Phone
Applications, by Filiberto Bilotti et al AEU International Journal
of Electronics and Communications 57 (2003) No. 6, 403-408; A
Positive Future for Double-Negative Metamaterials, by Nader Engheta
et al, IEEE Transactions on Microwave Theory and Techniques, Vol.
53, NO. 4, pp. 1535-1556, April 2005; Application of double
negative metamaterials to increase the power radiated by
electrically small antennas, by R. W. Aiolkowski et al, IEEE Trans.
Antennas Propag., Vol. 51, NO. 10, pp. 2626-2640, October 2003. The
disclosures of these publications are hereby incorporated by
reference.
[0049] The wet conductive coating may be applied to the
three-dimensional substrate by any suitable technique. Examples of
suitable techniques include spraying the conductive coating onto a
pre-masked substrate as seen in FIG. 4A; spraying the conductive
coating onto a substrate and thereafter patterning the coating on
the substrate as seen in FIG. 4B; a combination of the foregoing
two examples as seen in FIG. 4C; micro-dispensing as seen in FIG.
4D, preferably employing equipment and techniques commercially
available from Dick Blick Art Materials P.O. Box 1267, Galesburg,
IL USA, and dipping and subsequent laser patterning as seen in FIG.
4E.
[0050] Other examples of suitable coating techniques include:
chemical vapor deposition, physical vapor deposition and
electroless plating of a pre-patterned three-dimensional
substrate.
[0051] Another preferred technique, illustrated in FIG. 4F, is a
combination of pad printing of interior and non-highly angled
portions, such as portions designated by reference numeral 106, of
the three-dimensional substrate and applying sub-micron conductive
particles to the peripheral and highly angled portions of the
three-dimensional substrate, such as portions designated by
reference numeral 110. Application of sub-micron conductive
particles is preferably effected using equipment, materials and
methodologies commercially available from Optomec, Inc. of
Albuquerque, N. Mex., USA and described in one or more of their
U.S. Pat. Nos. 6,823,124; 6,251,488 and 6,811,744, and published
U.S. Patent Applications 2004/0197493; 2004/0179808 and
2005/0046664, the disclosures of which are hereby incorporated by
reference.
[0052] Additional techniques which may be employed with suitable
adaptations in forming the antennas of FIGS. 1-3B are described in
Published PCT Patent Application WO 2004/068389 A2, a document
entitled Metallizations by Direct-Write Inkjet Printing,
NREL/CP-520-31020, published by the National Renewable Energy
Laboratory, and a document entitled Materials and Processes for
High Speed Printing for Electronic Components, IS & T NIP20:
2004 International Conference on Digital Printing Technologies,
pages 275-278, the contents of which are hereby incorporated by
reference, and in references mentioned therein, the contents of
which are hereby incorporated by reference.
[0053] Reference is now made to FIG. 5, which is a simplified
pictorial illustration of an embedded antenna formed in accordance
with a preferred embodiment of the present invention by applying a
wet conductive coating to a three-dimensional plastic element
support, forming part of a mobile communicator; FIG. 6 which is a
simplified pictorial illustration of the embedded antenna of FIG.
5, showing an antenna pattern created by applying the conductive
polymer to the element support; FIG. 7 which is a simplified plan
view illustration of the embedded antenna of FIGS. 5 & 6 and
FIGS. 8A and 8B which are simplified sectional illustrations of the
embedded antenna of FIGS. 5-7, taken along lines VIIIA-VIIIA and
VIIIB-VIIIB in FIG. 7.
[0054] As seen in FIGS. 5-8B, an embedded antenna 200 is formed by
coating a three-dimensional substrate, such as part of the plastic
element carrier 202 of a mobile telephone 203, with a conductive
coating 204. The conductive coating preferably comprises silver.
Alternatively, the conductive coating may employ any other suitable
conductor. Generally, conductive materials useful in the present
invention preferably comprise conductive polymers but may also
include conductive ink jet inks, pigmented inks, conductive
nanopastes, hybrid nanopastes, conductive nanoparticles,
microparticles and nanometal powders. Other suitable materials may
include Electronic Band-Gap (EBG) structures and Frequency
Selective Surface (FSS) materials or other suitable types of
metamaterials, such as those described in Research on negative
refraction and backward-wave media: A historical perspective by
Sergei Tretyakov, EPFL Latsis Symposium 2005; Negative refraction:
revisiting electromagnetics from microwaves to optics, Lausanne
28.2-2.03.2005, pp 30-35; On EBG Structures for Cellural Phone
Applications, by Filiberto Bilotti et al AEU International Journal
of Electronics and Communications 57 (2003) No. 6, 403-408; A
Positive Future for Double-Negative Metamaterials, by Nader Engheta
et al, IEEE Transactions on Microwave Theory and Techniques, Vol.
53, NO. 4, pp. 1535-1556, April 2005; Application of double
negative metamaterials to increase the power radiated by
electrically small antennas, by R. W. Aiolkowski et al, IEEE Trans.
Antennas Propag., Vol. 51, NO. 10, pp. 2626-2640, October 2003. The
disclosures of these publications are hereby incorporated by
reference.
[0055] The conductive coating may be applied to the
three-dimensional substrate by any suitable technique. Examples of
suitable techniques include spraying the conductive coating onto a
pre-masked substrate as seen in FIG. 9A; spraying the conductive
coating onto a substrate and thereafter patterning the coating on
the substrate and seen in FIG. 9B; a combination of the foregoing
two examples as seen in FIG. 9C; micro-dispensing as seen in FIG.
9D; dipping and subsequent laser patterning as seen in FIG. 9E.
[0056] Other examples of suitable coating techniques include:
chemical vapor deposition; physical vapor deposition and
electroless plating of a pre-patterned three-dimensional
substrate.
[0057] Another preferred technique, illustrated in FIG. 9F, is a
combination of pad printing of interior and non-highly angled
portions, such as portions designated by reference numeral 206 of
the three-dimensional substrate and applying sub-micron conductive
particles to the peripheral and highly angled portions of the
three-dimensional substrate, such as portions designated by
reference numeral 210. Application of sub-micron conductive
particles is preferably effected using equipment, materials and
methodologies commercially available from Optomec, Inc. of
Albuquerque, N. Mex., USA and described in one or more of their
U.S. Pat. Nos. 6,823,124; 6,251,488 and 6,811,744, and published
U.S. Patent Applications 2004/0197493; 2004/0179808 and
2005/0046664, the disclosures of which are hereby incorporated by
reference.
[0058] Additional techniques which may be employed with suitable
adaptations in forming the antennas of FIGS. 5-7B are described in
Published PCT Patent Application WO 2004/068389 A2, a document
entitled Metallizations by Direct-Write Inkjet Printing,
NREL/CP-520-31020, published by the National Renewable Energy
Laboratory, and a document entitled Materials and Processes for
High Speed Printing for Electronic Components, IS & T NIP20:
2004 International Conference on Digital Printing Technologies,
pages 275-278, the contents of which are hereby incorporated by
reference, and in references mentioned therein, the contents of
which are hereby incorporated by reference.
[0059] Reference is now made to FIGS. 10A, 10B and 10C, which
illustrate an external snap-in antenna including a
three-dimensional meander radiating element 500, constructed in
accordance with a preferred embodiment of the present
invention.
[0060] As seen particularly clearly in FIG. 10A, in accordance with
a preferred embodiment of the present invention, the meander
radiating element 500 is formed by applying a wet conductive
material, preferably a conductive polymer, onto a stubby base
element 502, typically injection molded of plastic and having
attachment prongs 504 and an internal axial bore 506. Application
of the wet conductive material may be carried out in accordance
with any of the methodologies described hereinabove.
[0061] Stubby base element 502 defines a truncated generally
conical shaped antenna support surface 508 having a generally
elliptical cross section and arranged about a longitudinal axis
510. The meander radiating element 500 preferably lies about a
majority of the circumference of antenna support surface 508 and
includes an elongate feed portion 512 which extends to an opening
514, formed in surface 508 and communicating with internal axial
bore 506, and terminates in a conductor portion 516 disposed on an
edge 518 of opening 514.
[0062] A conductive antenna feed shaft 520 is seated within
internal axial bore 506 such that a conductive contact surface 522
thereof is in ohmic contact with conductor portion 516, thereby
establishing electrical contact between feed shaft 520 and meander
radiating element 500. A plurality of circumferential ribs 524
frictionally retain the conductive antenna feed shaft 520 in
conductive engagement with conductor portion 516 within bore 506. A
dielectric cover 530 is preferably snap-fit or press-fit over base
element 502 and meander radiating element 500 printed thereon.
[0063] FIG. 11 illustrates in a simplified manner a methodology for
producing the antenna of FIGS. 10A-10C, preferably employing
application of sub-micron conductive particles to the antenna
support surface 508 to define the meander element 500 thereon.
Application of sub-micron conductive particles is preferably
effected using equipment, materials and methodologies commercially
available from Optomec, Inc. of Albuquerque, N. Mex., USA and
described in one or more of their U.S. Pat. Nos. 6,823,124;
6,251,488 and 6,811,744, and published U.S. Patent Applications
2004/0197493; 2004/0179808 and 2005/0046664, the disclosures of
which are hereby incorporated by reference. Alternatively, any
other suitable technique for applying a wet conductive material to
surface 508 may be employed for defining the meander element.
[0064] Reference is now made to FIGS. 12A, 12B and 12C, which
illustrate an external retractable top helical antenna constructed
and operative in accordance with a preferred embodiment of the
present invention and having a three-dimensional coil or meander
element 600, preferably formed by application of sub-micron
conductive particles to an antenna support surface 608. Application
of sub-micron conductive particles is preferably effected using
equipment, materials and methodologies commercially available from
Optomec, Inc. of Albuquerque, N. Mex., USA and described in one or
more of their U.S. Pat. Nos. 6,823,124; 6,251,488 and 6,811,744,
and published U.S. Patent Applications 2004/0197493; 2004/0179808
and 2005/0046664, the disclosures of which are hereby incorporated
by reference. Alternatively, any other suitable technique for
applying a wet conductive material to surface 608 may be employed
for defining the coil or meander element.
[0065] FIG. 13 illustrates in a simplified manner a methodology for
producing the antenna of FIGS. 12A-12C, preferably employing
application of sub-micron conductive particles to the antenna
support surface 608 to define the meander element 600 thereon.
Application of sub-micron conductive particles is preferably
effected using equipment, materials and methodologies commercially
available from Optomec, Inc. of Albuquerque, N. Mex., USA and
described in one or more of their U.S. Pat. Nos. 6,823,124;
6,251,488 and 6,811,744, and published U.S. Patent Applications
2004/0197493; 2004/0179808 and 2005/0046664, the disclosures of
which are hereby incorporated by reference. Alternatively, any
other suitable technique for applying a wet conductive material to
surface 608 may be employed for defining the meander element.
[0066] Reference is now made to FIGS. 14A, 14B and 14C, which
illustrate an external retractable base helical antenna having two
three-dimensional coil or meander elements, constructed in
accordance with a preferred embodiment of the present invention.
The antenna of FIGS. 14A-14C includes a first three-dimensional
coil or meander element 700, preferably formed by application of
sub-micron conductive particles to an antenna support surface 708,
and a second three-dimensional coil or meander element 750,
preferably formed by application of sub-micron conductive particles
to a whip antenna portion support surface 758. Application of
sub-micron conductive particles is preferably effected using
equipment, materials and methodologies commercially available from
Optomec, Inc. of Albuquerque, N. Mex., USA and described in one or
more of their U.S. Pat. Nos. 6,823,124; 6,251,488 and 6,811,744,
and published U.S. Patent Applications 2004/0197493; 2004/0179808
and 2005/0046664, the disclosures of which are hereby incorporated
by reference. Alternatively, any other suitable technique for
applying a wet conductive material to surfaces 708 and 758 may be
employed for defining the coil or meander element.
[0067] FIG. 15 illustrates in a simplified manner a methodology for
producing the antenna of FIGS. 14A-14C, preferably employing
application of sub-micron conductive particles to the antenna
support surfaces 708 and 758 to define the respective coil or
meander elements 700 and 750 printed thereon. Application of
sub-micron conductive particles is preferably effected using
equipment, materials and methodologies commercially available from
Optomec, Inc. of Albuquerque, N. Mex., USA and described in one or
more of their U.S. Pat. Nos. 6,823,124; 6,251,488 and 6,811,744,
and published U.S. Patent Applications 2004/0197493; 2004/0179808
and 2005/0046664, the disclosures of which are hereby incorporated
by reference. Alternatively, any other suitable technique for
applying a wet conductive material to surfaces 708 and 758 may be
employed for defining the meander element.
[0068] It will be appreciated by persons skilled in the art that
the present invention is not limited to what has been particularly
shown and described hereinabove. Rather the scope of the present
invention includes both combinations and subcombinations of various
features described hereinabove as well as modifications thereof
which would occur to persons skilled in the art upon reading the
foregoing specification and which are not in the prior art.
* * * * *