U.S. patent application number 12/186394 was filed with the patent office on 2008-11-20 for method for thermal conduction interfacing.
This patent application is currently assigned to International Business Machines Corporation. Invention is credited to Timothy Samuel Farrow, Dean Frederick Herring.
Application Number | 20080286502 12/186394 |
Document ID | / |
Family ID | 38322401 |
Filed Date | 2008-11-20 |
United States Patent
Application |
20080286502 |
Kind Code |
A1 |
Farrow; Timothy Samuel ; et
al. |
November 20, 2008 |
METHOD FOR THERMAL CONDUCTION INTERFACING
Abstract
A method is disclosed for thermal conduction interfacing. The
method for thermal conduction interfacing includes providing with a
first layer formed substantially of a pliable thermally conductive
material. The method includes coupling a second layer formed
substantially of a pliable thermally conductive material and
coupled at the edges to the first layer forming a pliable packet,
wherein the first layer and the second layer conform to a set of
thermal interface surfaces. Additionally, the method includes
inserting a plurality of thermally conductive particles within the
packet, wherein thermal energy is transferred from the first layer
to the second layer through the thermally conductive particles.
Beneficially, such a method would provide effective thermal
coupling between a heat generating device and a heat dissipating
device.
Inventors: |
Farrow; Timothy Samuel;
(Cary, NC) ; Herring; Dean Frederick;
(Youngsville, NC) |
Correspondence
Address: |
KUNZLER & ASSOCIATES
8 EAST BROADWAY, SUITE 600
SALT LAKE CITY
UT
84111
US
|
Assignee: |
International Business Machines
Corporation
Armonk
NY
|
Family ID: |
38322401 |
Appl. No.: |
12/186394 |
Filed: |
August 5, 2008 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
11343673 |
Jan 31, 2006 |
|
|
|
12186394 |
|
|
|
|
Current U.S.
Class: |
428/32.69 ;
257/E23.09 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 23/433 20130101; H01L 2924/0002 20130101; H01L 2924/00
20130101 |
Class at
Publication: |
428/32.69 |
International
Class: |
B41M 5/40 20060101
B41M005/40 |
Claims
1. A method for thermal conduction interfacing, the method
comprising: providing a first layer formed substantially of a
pliable thermally conductive material; coupling a second layer,
formed substantially of a pliable thermally conductive material, to
the edges of the first layer forming a pliable packet, wherein the
first layer and the second layer conform to a set of thermal
interface surfaces; and inserting a plurality of solid thermally
conductive particles into the packet and substantially filling the
packet, the packet being substantially free of liquid, wherein the
particles compress and distort to the surfaces of the other
particles when force is applied to the packet, and wherein thermal
energy is transferred from the first layer to the second layer
through the thermally conductive particles.
2. The method of claim 1, wherein the method further comprises
providing rounded packet edges to act as a spring member for
facilitating the application of force on the thermal interface
surfaces and the packet.
3. The method of claim 1, wherein the method further comprises
placing the packet between the thermal interface surfaces of an
electronic component package and a heat sink.
4. The method of claim 1, wherein the method further comprises
applying a perpendicular force to the thermal interface surfaces
and the packet, wherein the first and the second layer are further
configured to conform to an uneven interface surface and
substantially fill air gaps between the thermal interface surfaces
when force is applied, wherein compression and distortion of the
thermal conductive particles reduces an amount of empty space
between the particles providing increased thermal conduction
between the first and second layers.
5. The method of claim 4, wherein the method further comprises
transferring thermal energy through a semisolid thermally
conductive structure formed within the packet when force is
applied.
6. The method of claim 1, wherein the method further comprises
reusing the packet to facilitate efficient thermal conduction
between a plurality of sets of thermal interface surfaces, wherein
the thermally conductive particles uncompress when force is
relinquished.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional application and claims
priority to U.S. patent application Ser. No. 11/343,673 entitled
"Apparatus, System, and Method for Thermal Conduction Interfacing"
and filed on Jan. 31, 2006 for Timothy S. Farrow, et al., which is
incorporated herein by reference.
FIELD OF THE INVENTION
[0002] This invention relates to dissipation of thermal energy
generated by an electronic component and more particularly relates
to thermal conduction interfacing.
BACKGROUND
[0003] One of the primary problems encountered in electronics
design is excess thermal energy generated by inefficiencies in the
electronic components. For example, as current flows through
electric circuitry, some of the electric energy is converted to
thermal energy through inefficiencies in the circuit components.
Unless the excess thermal energy is dissipated, the electronic
components may become increasingly inefficient. The increased
inefficiency generates additional thermal energy, and the cycle
continues until the component fails.
[0004] For example, in an electrical transistor, heat is generated
as current flows from one gate of the transistor to another. The
heat is generated by inefficiencies in the transistor. Such
inefficiencies may include impurities in the silicon, imperfect
electron doping, and certain inefficiencies are unavoidably
inherent in the device structure and material. As heat is
generated, the transistor becomes more and more inefficient, and
may eventually fail due to a thermally induced current
run-away.
[0005] Heat issues are particularly critical in microelectronic
circuit packages, such as computer processor chip packages. These
microelectronic circuit packages may contain thousands of
transistors and other electronic components within a confined
space. Additionally, these circuits are typically enclosed in a
single chip package for protection and modularity. Consequently,
these processor chip packages may reach temperatures of well over
100 degrees Fahrenheit within minutes of operation. Obviously,
without a highly efficient method of dissipating the heat generated
in such circuits, these microelectronic chip packages would fail to
operate properly.
[0006] Electronics designers have implemented several different
methods of heat dissipation in electronic components. These methods
include the use of fans and enclosure venting, heatsink devices,
liquid cooling, and the like. However, improvements in electronic
technology make possible higher processing speeds and more
components within a smaller space. These improvements, while
beneficial, complicate the task of heat dissipation. Many of the
smaller components are more sensitive to heat. Since more
components can be placed in a smaller space, the heat generated is
greater. Therefore, the need for improved heat dissipation is ever
increasing.
[0007] Certain of the methods described above, such as heatsinks,
can dissipate heat effectively, but only when installed properly
and used in combination with efficient thermal coupling products.
For example, a heatsink coupled directly to a processor package
will not adequately dissipate heat unless thermal grease is spread
between the heatsink and the processor package. Thermal grease
fills the gaps between the thermal interface surfaces on the
heatsink and the processor package formed by irregularities in
those surfaces. Even slight irregularities in these surfaces may
result in air gaps which may significantly reduce thermal coupling
between the processor package and the heatsink.
[0008] The major drawback with thermal grease is that it is very
messy. The grease is difficult to contain once placed in the
thermal interface. The grease may run when the temperature is
elevated because the viscosity of grease decreases with increased
temperature. Additionally, thermal grease does not have an
indefinite shelf life. Thermal grease may crust over, or become
runny or separated, or become soiled by dust. Any changes in the
physical properties of the thermal grease may decrease its
effectiveness.
[0009] If the thermal grease spoils it must be replaced to insure
the protection and proper operation of the processor. Typically,
only trained technicians are able to properly change thermal
grease. In general, thermal grease is not an optimal solution,
because it is messy and costly to regularly replace.
[0010] From the foregoing discussion, it should be apparent that a
need exists for an apparatus, system, and method that facilitate a
more efficient thermal conduction interface between an electronic
component and a heat dissipating device such as a heatsink.
Beneficially, such an apparatus, system, and method would provide
effective thermal coupling between a heat generating device and a
heat dissipating device. Additionally, the apparatus, system, and
method would be modular, reusable, and easy to install or replace
without a significant mess.
SUMMARY OF THE INVENTION
[0011] The present invention has been developed in response to the
present state of the art, and in particular, in response to the
problems and needs in the art that have not yet been fully solved
by currently available thermal interface products. Accordingly, the
present invention has been developed to provide an apparatus,
system, and method for thermal conduction interfacing that overcome
many or all of the above-discussed shortcomings in the art.
[0012] The apparatus for thermal conduction interfacing is provided
with a first layer formed substantially of a pliable thermally
conductive material. The apparatus includes a second layer formed
substantially of a pliable thermally conductive material and
coupled at the edges to the first layer forming a pliable packet,
wherein the first layer and the second layer conform to a set of
thermal interface surfaces. Additionally, the apparatus includes a
plurality of thermally conductive particles disposed within the
packet, wherein thermal energy is transferred from the first layer
to the second layer through the thermally conductive particles.
[0013] In one embodiment, the apparatus further comprises a
mechanism for application of force on the first and second layers,
the thermally conductive particles, and the thermal interface
surfaces. In a certain embodiment, the mechanism further comprises
rounded packet edges to provide a spring member for application of
force. The first and the second layers are further configured to
conform to an uneven interface surface and substantially fill air
gaps between the thermal interface surfaces when force is
applied.
[0014] In a further embodiment, the thermally conductive particles
may be structurally compliant forming a semisolid thermally
conductive structure within the packet when force is applied.
Additionally, the thermally conductive particles may be
structurally resilient making the apparatus reusable. The apparatus
may be further configured to conduct thermal energy between the
thermal interface surfaces of an electronic component package and a
heatsink.
[0015] A system of the present invention is also presented for
thermal conduction interfacing. In one embodiment, the system
includes a heat generating device, a heat dissipating device, and a
thermal conduction interface packet. In a further embodiment, the
thermal conduction interface packet may include a first layer
formed substantially of a pliable thermally conductive material, a
second layer formed substantially of a pliable thermally conductive
material and coupled at the edges to the first layer forming a
pliable packet, and a plurality of thermally conductive particles
disposed within the packet. Additionally, the first layer may
conform to the surface of the heat generating device and the second
layer may conform to the surface of the heat dissipating device.
The system may be further configured to transfer thermal energy
form the first layer to the second layer through the thermally
conductive particles. In a particular embodiment, the heat
generating device may be an electronic component package and the
heat dissipating device may be a heatsink.
[0016] A method of the present invention is also presented for
thermal conduction interfacing. The method in the disclosed
embodiments substantially includes the steps necessary to carry out
the functions presented above with respect to the operation of the
described apparatus and system. In one embodiment, the method
includes providing a first layer formed substantially of a pliable
thermally conductive material, coupling a second layer, formed
substantially of a pliable thermally conductive material, to the
edges of the first layer forming a pliable packet, wherein the
first layer and the second layer conform to a set of thermal
interface surfaces, and inserting a plurality of thermally
conductive particles into the packet, wherein thermal energy is
transferred from the first layer to the second layer through the
thermally conductive particles.
[0017] The method also may include applying a perpendicular force
to the thermal interface surfaces and the packet, wherein the first
and second layer are further configured to conform to an uneven
interface surface and substantially fill air gaps between the
thermal interface surfaces when force is applied. In one
embodiment, the method includes transferring thermal energy through
a semisolid thermally conductive structure formed within the packet
when force is applied. The method may further include reusing the
packet to facilitate efficient thermal conduction between a
plurality of sets of thermal interface surfaces.
[0018] Reference throughout this specification to features,
advantages, or similar language does not imply that all of the
features and advantages that may be realized with the present
invention should be or are in any single embodiment of the
invention. Rather, language referring to the features and
advantages is understood to mean that a specific feature,
advantage, or characteristic described in connection with an
embodiment is included in at least one embodiment of the present
invention. Thus, discussion of the features and advantages, and
similar language, throughout this specification may, but do not
necessarily, refer to the same embodiment.
[0019] Furthermore, the described features, advantages, and
characteristics of the invention may be combined in any suitable
manner in one or more embodiments. One skilled in the relevant art
will recognize that the invention may be practiced without one or
more of the specific features or advantages of a particular
embodiment. In other instances, additional features and advantages
may be recognized in certain embodiments that may not be present in
all embodiments of the invention.
[0020] These features and advantages of the present invention will
become more fully apparent from the following description and
appended claims, or may be learned by the practice of the invention
as set forth hereinafter.
BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order that the advantages of the invention will be
readily understood, a more particular description of the invention
briefly described above will be rendered by reference to specific
embodiments that are illustrated in the appended drawings.
Understanding that these drawings depict only typical embodiments
of the invention and are not therefore to be considered to be
limiting of its scope, the invention will be described and
explained with additional specificity and detail through the use of
the accompanying drawings, in which:
[0022] FIG. 1A is a cross-section view of an apparatus for thermal
conduction interfacing token through 1-1 of FIG. 1B;
[0023] FIG. 1B is a cross-section view of an apparatus for thermal
conduction interfacing token through 1-1 of FIG. 1B;
[0024] FIG. 2 is a side view of a system for thermal conduction
interfacing;
[0025] FIG. 3A is a partially enlarged cross-section view of an
uncompressed thermal conduction interface packet;
[0026] FIG. 3B is a partially enlarged cross-section view of a
compressed thermal conduction interface packet;
[0027] FIG. 4A is an exaggerated view of thermal interface surfaces
of a heat generating device and a heat dissipating device;
[0028] FIG. 4B is an exaggerated view of a thermal conduction
interface packet implemented at the interface of the heat
generating device and the heat dissipating device;
[0029] FIG. 5 is a schematic flow chart diagram illustrating one
embodiment of a method for thermal conduction interfacing; and
[0030] FIG. 6 is a detailed schematic flow chart diagram
illustrating one embodiment of a method for implementing a thermal
conduction interface packet.
DETAILED DESCRIPTION OF THE INVENTION
[0031] Reference throughout this specification to "one embodiment,"
"an embodiment," or similar language means that a particular
feature, structure, or characteristic described in connection with
the embodiment is included in at least one embodiment of the
present invention. Thus, appearances of the phrases "in one
embodiment," "in an embodiment," and similar language throughout
this specification may, but do not necessarily, all refer to the
same embodiment.
[0032] Furthermore, the described features, structures, or
characteristics of the invention may be combined in any suitable
manner in one or more embodiments. In the following description,
numerous specific details are provided to provide a thorough
understanding of embodiments of the invention. One skilled in the
relevant art will recognize, however, that the invention may be
practiced without one or more of the specific details, or with
other methods, components, materials, and so forth. In other
instances, well-known structures, materials, or operations are not
shown or described in detail to avoid obscuring aspects of the
invention.
[0033] FIG. 1A depicts a cross-section view token through line 1-1
of an apparatus 100 for thermal conduction interfacing. In one
embodiment, the apparatus includes a first layer 102 and a second
layer 104 coupled at the edges 106 and filled with a plurality of
thermally conductive particles 108. The first layer 102 and the
second layer 104 may be coupled at the edges to form a packet.
Alternatively, a packet may be formed of a single layer 102 or bag
and coupled to itself on one edge 106.
[0034] In one embodiment, the first layer 102 and the second layer
104 are formed of a pliable thermally conductive material. In one
embodiment the material is copper foil. Alternatively, the material
may include thin layers of aluminum, gold, or other thermally
conductive metals, and alloys thereof. In these various
embodiments, the first layer 102 and the second layer 104 may be
flexible, pliable, and resilient. In such embodiments, these layers
102, 104 may conform to a set of thermal interface surfaces when
force is applied. The pliability and flexibility of the layers 102,
104 allow the apparatus 100 to substantially fill air gaps created
by irregularities in the thermal interface surfaces. This
characteristic of the apparatus 100 are described in greater detail
with respect to FIG. 4B.
[0035] In one embodiment, the first layer 102 and the second layer
104 are coupled at the edges 106 to form a packet. In one
embodiment, the layers 102, 104 may be coupled with an adhesive.
Alternatively, the layers 102, 104 may be coupled using heat
bonding, ultrasonic welding, current welding, heat welding, or the
like. In an alternative embodiment, the first layer 102 and the
second layer 104 may be replaced by a bag or sack structure for
holding the thermally conductive particles 108.
[0036] In one embodiment, the thermally conductive particles 108
are formed of thermally conductive metal or metal alloy. For
example, the thermally conductive particles 108 may be copper
microspherules. Alternatively, the thermally conductive particles
108 may include gold microspherules. In another alternative
embodiment, the thermally conductive particles 108 may be formed of
diamond. The thermally conductive particles are in one embodiment
sized between one thousandth of an inch and five thousands of an
inch in diameter of course any suitable size may be used. In
another embodiment, the particles are sized in a range of between
about 0.0001 inches and about 0.01 inches in diameter.
[0037] In another alternative embodiment, the thermally conductive
particles 108 may include a thermally conductive fluid compound
such as thermal grease or a water/helium combination.
[0038] FIG. 1B depicts a cross-sectional view of a thermal
conduction interface packet 110 token through line 1-1 of FIG. 1B.
In one embodiment, the apparatus 100 comprises a thermal conduction
interface packet 110. The thermal conduction interface packet 110
may include a first layer 112 and a second layer 114 coupled at the
edges to form a thermal conduction interface packet 110. In a
further embodiment, the thermal conduction interface packet
includes a plurality of thermally conductive particles 118 disposed
within the packet 110. In certain embodiments, the thermal
conduction interface packet 110 is rectangular. Alternatively, the
thermal conduction interface packet 110 may be square, circular,
oval, or other shape specifically suited for the thermal interface
surfaces with which the packet 110 is intended to be used.
[0039] FIG. 2 illustrates one embodiment of a system 200 for
thermal conduction interfacing. In one embodiment, the system 200
includes a structural support base 202, such as a circuit card.
Additionally, the system 200 may include a heat generating device
204, and a heat dissipating device 208. The heat generating device
204 may include a thermal interface surface 206, and the heat
dissipating device 208 may include a thermal interface surface 210.
Additionally, the system may include a thermal conduction interface
packet 110 as illustrated in FIGS. 1A and 1B. In one further
embodiment, the system 200 may include a mechanism 212, 214 for
applying force on the system components.
[0040] In one embodiment, the heat generating device 204 is an
electronic component package. For example, the heat generating
device 204 may include a computer processor package. In alternative
embodiments, the heat generating device may include high
performance microelectronic circuit packages such as Digital Signal
Processing (DSP) chip packages or MODEM chip packages. In a further
embodiment, the heat generating device 204 may include a large
scale electronic component such as a solid state RF amplifier or an
electronic circuit enclosure or housing.
[0041] In one particular embodiment, the heat dissipating device
208 is a heatsink. The heatsink may include a thermal interface
surface 210 and a plurality of heat dissipating fins for spreading
thermal energy from the thermal interface surface 210 to the
ambient air. In alternative embodiments, the heat dissipating
device 208 may include a heat dissipating device which incorporates
heat pipe or other liquid cooling system.
[0042] In one embodiment, the system 200 further comprises a
mechanism 212,214 for applying force perpendicular to the thermal
interface surface 206 of the heat generating device 204, the
thermal interface surface 210 of the heat dissipating device 208,
and the thermal conduction interface packet 110. In a certain
embodiment, the mechanism includes a threaded screw 212 for
coupling the heat dissipating device 208 to the structural support
base 202 over the area of the heat generating device 204. The
threaded screws 212 may screw into threaded posts attached at
predetermined positions on the structural support base 202.
Additionally, the mechanism may include rounded edges on the
thermal conduction interface packet 110 which may act as a spring
member to facilitate application of force using the screws 212 and
the posts 214. In another alternative embodiment, the screws 212
and the posts 214 may be replaced by a mounted clamp, or the
like.
[0043] In one embodiment, the thermal conduction interface packet
110 may conduct thermal energy from the thermal interface surface
206 of the heat generating device 204 to the thermal interface
surface 210 of the heat dissipating device 208 through a semisolid
structure of thermally conductive particles 108, 118 formed when
force is applied to the components of the system 200. The
characteristics of the thermally conductive particles 108, 118
under force are described in further detail with relation to FIG.
3B.
[0044] FIG. 3A is a partially enlarged cross-sectional view of an
uncompressed thermal conduction interface packet 302. In the
depicted embodiment, the thermal conduction interface packet
includes a first layer 112 and a second layer 114 coupled to form a
packet 110 as depicted in FIG. 1. The thermal conduction interface
packet 302 includes a plurality uncompressed thermally conductive
particles 304. In the embodiment depicted in the exploded view,
each particle 306 may be a microspherule of a substantially
spherical shape. The particles 306 be randomly distributed without
any particular structure and may be loosely packed within the
packet 302.
[0045] FIG. 3B is a partially enlarged cross-sectional view of a
compressed thermal conduction interface packet 312. In one
embodiment, a force 318 is applied to the thermal conduction
interface packet 312 compressing the thermally conductive particles
314. In certain embodiments, the edges 320 of the thermal
conduction interface packet are rounded. The rounded edges allow
the thermal conduction interface packet 312 to expand and retract
slightly. In such an embodiment, the thermal conduction interface
packet 312 acts as a spring member to facilitate application of the
force 318. Some mechanism for facilitating application of the force
318 is required to compress the thermally conductive particles. The
application of pressure on rigid bodies will not result in force
318 on the bodies unless there is some mechanism, such as a spring
member, to facilitate application of the force 318. In an
alternative embodiment, some other mechanism for facilitating
application of the force 318, such as coil springs, or the like may
be provided. In another embodiment, the edges 320 may be thicker
than other portions of the first layer 102, and the second layer
104 to create the spring member for application of the force
318.
[0046] The exploded view of the thermally conductive particles 316
illustrate compressed particles under the force 318. In one
embodiment, the particles 316 are structurally compliant. For
example, the particles 316 may distort to conform to the surfaces
of the other particles 316 when tightly packed. In a further
embodiment, the particles 316 may pack tightly in a lattice type
semisolid structure. In such an embodiment, the semisolid structure
has increased thermal conductivity, because the surfaces are each
conforming, one to another, and the air gaps between particles 316
are reduced. In a further embodiment, the thermally conductive
particles 316 are structurally resilient, substantially returning
to their original shape and distribution, as depicted by the
particles 306 in FIG. 3A, when the force 318 is removed.
Consequently, the thermal conduction interface packet 312 may be
reusable.
[0047] FIG. 4A is an exaggerated illustration of thermal interface
surfaces of a heat generating device 402 and a heat dissipating
device 404. Although the irregularities would typically not be as
clearly visible as depicted in this drawing, some irregularities
may exist in the thermal conduction surfaces of the heat generating
device 402 and the heat dissipating device 404. Irregularities may
include surface bumps or voids, slight variants in the surface
levels, and the like. Consequently, some portions of the conduction
interface surfaces may come into contact before others. The
resulting air gaps 406 may reduce thermal conduction
efficiency.
[0048] FIG. 4B is an exaggerated view of a thermal conduction
interface packet 416 implemented at the interface between a heat
generating device 412 and a heat dissipating device 414. In such an
embodiment, the pliable surfaces of the thermal conduction
interface packet 416 conform to the surfaces of the heat generating
device 412 and the heat dissipating device 414 respectively. In one
embodiment, thermal conduction interface packet is capable of
flexibly conforming to the irregularities in the surfaces of the
heat generating device 412 and the heat dissipating device 414 and
substantially filling air gaps between the surfaces when force is
applied. Consequently, the thermal conduction interface packet 416
may improve thermal conduction between the thermal interface
surfaces of the heat generating device 412 and the heat dissipating
device 414.
[0049] The schematic flow chart diagrams that follow are generally
set forth as logical flow chart diagrams. As such, the depicted
order and labeled steps are indicative of one embodiment of the
presented method. Other steps and methods may be conceived that are
equivalent in function, logic, or effect to one or more steps, or
portions thereof, of the illustrated method. Additionally, the
format and symbols employed are provided to explain the logical
steps of the method and are understood not to limit the scope of
the method. Although various arrow types and line types may be
employed in the flow chart diagrams, they are understood not to
limit the scope of the corresponding method. Indeed, some arrows or
other connectors may be used to indicate only the logical flow of
the method. For instance, an arrow may indicate a waiting or
monitoring period of unspecified duration between enumerated steps
of the depicted method. Additionally, the order in which a
particular method occurs may or may not strictly adhere to the
order of the corresponding steps shown.
[0050] FIG. 5 illustrates one embodiment of a method 500 for
thermal conduction interfacing. In one embodiment, the method
starts 502 with providing 504 a first layer 102. In one particular
embodiment, the first pliable layer 102 is formed substantially of
a pliable thermally conductive material. In one embodiment, a
second layer 104 is coupled 506 to the first layer 102. In a
further embodiment, the second layer 104 is also formed
substantially of a pliable thermally conductive material.
Additionally, the second layer 104 may be coupled to the first
layer 102 at the edges forming a pliable packet 110. The first
layer 102 and the second layer 104 may be configured to conform to
a set of thermal interface surfaces 206, 210. In a further
embodiment, the method 500 includes inserting 508 a plurality of
thermally conductive particles 108 into the packet 110. In an
additional embodiment, thermal energy is transferred from the first
layer 102 to the second layer 104 through the thermally conductive
particles 108, and the method 500 ends 510.
[0051] For example, the method 500 may include providing 504 a
first layer 102 formed substantially of a pliable copper foil. Then
a second layer 104, formed substantially of a pliable copper foil,
is coupled 506 at the edges to the first layer 102 forming a
flexible packet 110. Then, a plurality of copper microspherules are
inserted 508 within the packet 110 forming a pliable thermal
conduction interface packet 110 configured to conform to the edges
of a set of thermal interface surfaces 206, 210, and transfer heat
from the first layer 102 to the second layer 104 through the
thermally conductive particles 108.
[0052] FIG. 6 illustrates one embodiment of a method 600 for
thermal conduction interfacing. In one embodiment, the method 600
starts 602 with forming 500 a thermal conduction interface packet
110. The method 600 may additionally include providing 604 rounded
packet edges 320 for facilitating application of force 318. In a
further embodiment, the method 600 includes placing 606 the thermal
conduction interface packet 110 between the thermal interface
surfaces 206,210 of a heat generating device 204 and a heat
dissipating device 208. In a particular embodiment, the heat
generating device 204 is an electronic component package and the
head dissipating device 208 is a heatsink.
[0053] The method 600 may additionally include applying 608 force
318 to the thermal interface surfaces 206, 210 and the thermal
conduction interface packet 110. Then thermal energy may be
transferred 610 through a semisolid particle structure created by
compressed thermally conductive particles 316 within the thermal
conduction interface packet 110. If it is determined 612 that the
heat generating device 204 or the heat dissipating device 208 is
obsolete or not needed, the thermal conduction interface packet 110
may be removed and reused 614 between a new heat generating device
204 and a new heat dissipating device 208 and the method ends 616.
If it is determined 612 that the electronic components are not
obsolete, the thermal interface packet 110 may remain in use
throughout the lifetime of the heat generating device 204 and the
heat dissipating device 208, and the method ends 616.
[0054] For example, the method 600 may include providing 500 a
thermal conduction interface packet 110 in accordance with the
example described with relation to FIG. 5 above. Additionally, the
method 600 may include providing 604 rounded edges on the thermal
conduction interface packet 110 making the packet 110 act as a
spring member for facilitating the application of force 318 on the
system 200. The copper thermal conduction interface packet 110 may
be placed 606 between a computer system processor 204 and a
heatsink device 208.
[0055] The method 600 may additionally include applying 608 a force
318 to the system 200 by applying pressure with the threaded screws
212 and the threaded posts on the components including the thermal
conduction interface packet 110 with rounded edges 320 configured
to act as a spring member for the system 200. When the processor
chip is powered, it may transfer 610 heat from the thermal
interface surface 206 through the thermal conduction interface
packet 110 to the thermal interface surface 210 of a heatsink 208.
If it is determined 612 that the processor 204 is obsolete or not
needed, the thermal conduction interface packet 110 may be removed
from the system 200 and reused 614 in a new system 200.
[0056] The present invention may be embodied in other specific
forms without departing from its spirit or essential
characteristics. The described embodiments are to be considered in
all respects only as illustrative and not restrictive. The scope of
the invention is, therefore, indicated by the appended claims
rather than by the foregoing description. All changes which come
within the meaning and range of equivalency of the claims are to be
embraced within their scope.
* * * * *