U.S. patent application number 11/742998 was filed with the patent office on 2008-11-06 for sensor for monitoring a condition of a patient.
Invention is credited to Harvey B. Buck, Steven Gray, Ulrich Haueter, Fritz Hindelang, Christian Hof, Ulrike Kamecke, Joachim Kasielke, Timon Kasielke, Michael Loukine, Matthew Reynolds.
Application Number | 20080275326 11/742998 |
Document ID | / |
Family ID | 39592000 |
Filed Date | 2008-11-06 |
United States Patent
Application |
20080275326 |
Kind Code |
A1 |
Kasielke; Joachim ; et
al. |
November 6, 2008 |
SENSOR FOR MONITORING A CONDITION OF A PATIENT
Abstract
A sensor may include a substrate having a sensing portion
defining a sensor thereon and a circuit mounting portion defining
at least one electrically conductive pad that is electrically
connected to the sensor. The sensor may be configured to produce a
signal indicative of a condition of the patient. An anisotropic
medium may be disposed on the circuit mounting portion and may be
electrically conductive in a direction through the medium and
electrically insulating in directions along the medium. An
electrical circuit may be mechanically mounted to the circuit
mounting portion of the first substrate via the anisotropic medium
with at least one electrically conductive terminal juxtaposed over
the at least one electrically conductive pad. The anisotropic
medium may establish local electrical contact between the at least
one electrically conductive terminal and the at least one
electrically conductive pad.
Inventors: |
Kasielke; Joachim; (Bruhl
Deutschland, DE) ; Haueter; Ulrich;
(Grosshochstetten, CH) ; Kamecke; Ulrike;
(Mannheim, DE) ; Hof; Christian; (Bern, CH)
; Reynolds; Matthew; (Cambridge, MA) ; Kasielke;
Timon; (Karlsruhe, DE) ; Gray; Steven;
(Charlotte, NC) ; Buck; Harvey B.; (Indianapolis,
IN) ; Loukine; Michael; (Hertfordshire, GB) ;
Hindelang; Fritz; (Carlsberg, DE) |
Correspondence
Address: |
BARNES & THORNBURG LLP (Roche)
11 SOUTH MERIDAN STREET
INDIANAPOLIS
IN
46204
US
|
Family ID: |
39592000 |
Appl. No.: |
11/742998 |
Filed: |
May 1, 2007 |
Current U.S.
Class: |
600/373 |
Current CPC
Class: |
H05K 2201/10151
20130101; A61B 5/7455 20130101; H05K 1/028 20130101; A61B 5/0002
20130101; A61B 5/1473 20130101; H05K 2201/042 20130101; A61B 5/746
20130101; A61B 5/6846 20130101; H05K 1/147 20130101; A61B 5/742
20130101; H05K 3/323 20130101; A61B 5/7405 20130101; H05K 1/144
20130101; H05K 3/361 20130101; A61B 5/14865 20130101; H05K 1/189
20130101; H05K 2201/10098 20130101; A61B 5/24 20210101; A61B 5/05
20130101 |
Class at
Publication: |
600/373 |
International
Class: |
A61B 5/00 20060101
A61B005/00 |
Claims
1. A sensor comprising: a first substrate having a sensing portion
configured to be percutaneously inserted into a patient and an
extracorporeal circuit mounting portion, the sensing portion
defining a sensor thereon and the circuit mounting portion having
at least one electrically conductive pad formed thereon that is
electrically connected to the sensor, the sensor configured to
produce a signal indicative of a condition of the patient, an
anisotropic medium disposed on the circuit mounting portion, the
medium configured to be electrically conductive in a direction
through the medium and electrically insulating in directions along
the medium, an electrical circuit having at least one electrically
conductive terminal, the circuit being mechanically mounted to the
circuit mounting portion of the first substrate via the anisotropic
medium with the at least one electrically conductive terminal
juxtaposed over the at least one electrically conductive pad, the
anisotropic medium establishing local electrical contact between
the at least one electrically conductive terminal and the at least
one electrically conductive pad.
2. The sensor of claim 1 wherein the first substrate is one of a
flexible substrate and a rigid substrate.
3. The sensor of claim 1 wherein the anisotropic medium is an
anisotropic adhesive tape, the tape being configured to
mechanically bond the electrical circuit to the circuit mounting
portion of the first substrate, the tape further being electrically
insulating along a plane of the tape and electrically conductive
through the tape in a direction generally perpendicular to the
plane of the tape.
4. The sensor of claim 1 wherein the anisotropic medium is an
anisotropic elastomer configured to mechanically bond the circuit
to the circuit mounting portion of the first substrate, the
anisotropic elastomer being electrically insulating along a plane
generally parallel to opposing surfaces of the electrical circuit
and the circuit mounting portion of the first substrate, and
electrically conductive through the elastomer in a direction
generally perpendicular to the plane.
5. The sensor of claim 1 wherein the first substrate defines a
first number of electrically conductive pads on the circuit
mounting portion thereof, and the electrical circuit has a second
number of electrical terminals, and wherein at least some of the
second number of electrical terminals align with at least some of
the number of electrically conductive pads when the electrical
circuit is mounted to the circuit mounting portion of the first
substrate.
6. The sensor of claim 1 wherein the electrical circuit comprises:
a second substrate defining the at least one electrical terminal,
and a number of electrical components mounted to the second
substrate and electrically interconnected to form a sensor control
circuit, the sensor control circuit being electrically connected to
the at least one electrical terminal.
7. The sensor of claim 6 wherein the sensor control circuit
includes a sensor operating circuit configured to operate the
sensor.
8. The sensor of claim 6 wherein the sensor control circuit
includes a telemetry circuit configured to transmit or receive
communication signals to or from a remote electronic device.
9. The sensor of claim 6 wherein the sensor control circuit
includes a notification circuit configured to produce any of a
visual, audible and tactile indication of a predefined event.
10. The sensor of claim 9 wherein the sensor control circuit
includes an acknowledgement circuit responsive to user activation
thereof to acknowledge production of the visual, audible or tactile
indication of the predefined event.
11. The sensor of claim 9 wherein the sensor control circuit is
configured to determine the predefined event from the signal
produced by the sensor.
12. The sensor of claim 11 wherein the sensor control circuit
further includes a telemetry circuit configured to transmit or
receive wireless communication signals to or from a first remote
electronic device, and wherein the first remote electronic device
includes a first telemetry circuit configured to transmit or
receive wireless communication signals to or from the telemetry
system of the sensor control circuit.
13. The sensor of claim 12 wherein the telemetry circuit of the
sensor control circuit is configured to transmit a wireless signal
indicative of the predefined event to the first telemetry circuit
of the first remote electronic device, and wherein the first remote
electronic device includes means for providing any of a visual,
audible and tactile indication of the predefined event.
14. The sensor of claim 12 wherein the first remote electronic
device further includes a second telemetry circuit configured to
transmit or receive wireless communication signals to or from a
second remote electronic device.
15. The sensor of claim 12 further including: a second remote
electronic device, and means for establishing communications
between the first and second remote electronic devices.
16. The sensor of claim 6 wherein the second substrate is one of a
flexible substrate and a rigid substrate.
17. The sensor of claim 1 wherein the electrical circuit defines an
outer periphery that is contained within an outer periphery of the
circuit mounting portion of the first substrate when the electrical
circuit is mounted thereto.
18. A sensor comprising: a first substrate having a sensing portion
configured to be percutaneously inserted into a patient and an
extracorporeal circuit mounting portion, the sensing portion
defining a sensor thereon and the circuit mounting portion having
at least one electrically conductive pad defined thereon that is
electrically connected to the sensor, the sensor configured to
produce a signal indicative of a condition of the patient, a second
substrate mounted to the first substrate and defining therethrough
at least one passageway that is aligned with the at least one
electrically conductive pad defined on the first substrate, a third
substrate mounted to the second substrate and defining thereon at
least one electrical terminal, the at least one electrical terminal
being aligned with at least one passageway defined on the second
substrate and with the at least one electrically conductive pad
defined on the first substrate, a first number of electrical
components mounted to the third substrate and electrically
interconnected to form a sensor control circuit, the sensor control
circuit being electrically connected to the at least one electrical
terminal defined on the third substrate, and means for establishing
electrical contact through the at least one passageway between the
at least one electrically conductive pad defined on the first
substrate and the at least one electrical terminal defined on the
third substrate, the sensor being thereby electrically connected to
the sensor control circuit.
19. The sensor of claim 18 wherein the sensor control circuit
includes a telemetry circuit configured to transmit or receive
communication signals to or from a remote electronic device.
20. The sensor of claim 18 wherein the sensor control circuit
includes a notification circuit configured to produce any of a
visual, audible and tactile indication of a predefined event.
21. The sensor of claim 20 wherein the sensor control circuit
includes an acknowledgement circuit responsive to user activation
thereof to acknowledge production of the visual, audible or tactile
indication of the predefined event.
22. The sensor of claim 20 wherein the sensor control circuit is
configured to determine the predefined event from the signal
produced by the sensor.
23. The sensor of claim 22 wherein the sensor control circuit
further includes a telemetry circuit configured to transmit or
receive communication signals to or from a first remote electronic
device, and wherein the first remote electronic device includes a
first telemetry circuit configured to transmit or receive
communication signals to or from the telemetry system of the sensor
control circuit.
24. The sensor of claim 23 wherein the telemetry circuit of the
sensor control circuit is configured to transmit a wireless signal
indicative of the predefined event to the first telemetry circuit
of the remote electronic device, and wherein the first remote
electronic device includes means for providing any of a visual,
audible and tactile indication of the predefined event.
25. The sensor of claim 23 wherein the first remote electronic
device further includes a second telemetry circuit configured to
transmit or receive wireless communication signals to or from a
second remote electronic device.
26. The sensor of claim 23 further including: a second remote
electronic device, and means for establishing communications
between the first and second remote electronic devices.
27. The sensor of claim 18 wherein the first substrate is one of a
flexible substrate and a rigid substrate.
28. The sensor of claim 18 wherein the second substrate is one of a
flexible substrate and a rigid substrate.
29. The sensor of claim 18 wherein the third substrate is one of a
flexible substrate and a rigid substrate.
30. The sensor of claim 18 further including: a second number of
electrical components mounted to the second substrate, the second
number of electrical components and the first number of electrical
components together forming the sensor control circuit, and means
for electrically connecting the second number of electrical
components to the first number of electrical components.
31. The sensor of claim 30 wherein the second number of electrical
components includes a sensor operating circuit configured to
operate the sensor.
32. The sensor of claim 30 wherein the second number of electrical
components includes a telemetry circuit configured to transmit or
receive communication signals to or from a remote electronic
device.
33. The sensor of claim 30 wherein the second number of electrical
components includes a notification circuit configured to produce
any of a visual, audible and tactile indication of a predefined
event.
34. The sensor of claim 30 wherein the second number of electrical
components includes an acknowledgement circuit responsive to user
activation thereof to acknowledge production of the visual, audible
or tactile indication of the predefined event.
35. The sensor of claim 30 wherein the second number of electrical
components includes a sensor operating circuit configured to
operate the sensor, and wherein the first number of electrical
components includes a telemetry circuit configured to transmit or
receive communication signals to or from a remote electronic
device.
36. The sensor of claim 35 wherein the second number of electrical
components includes a notification circuit configured to produce
any of a visual, audible and tactile indication of a predefined
event.
37. The sensor of claim 35 wherein the second number of electrical
components includes an acknowledgement circuit responsive to user
activation thereof to acknowledge production of the visual, audible
or tactile indication of the predefined event.
38. The sensor of claim 18 wherein the first substrate defines a
first number of electrically conductive pads on the circuit
mounting portion thereof, the third substrate defines a second
number of electrical terminals thereon and the second substrate
defines a corresponding second number of passageways therethrough,
and wherein at least some of the second number of electrical
terminals align with at least some of the first number of
electrically conductive pads through corresponding ones of the
second number of passageways defined through the second substrate
when the second substrate is mounted to the first substrate and the
third substrate is mounted to the second substrate.
39. A sensor comprising: a first substrate having a sensing portion
configured to be percutaneously inserted into a patient and an
extracorporeal circuit mounting portion, the sensing portion
defining a sensor thereon and the circuit mounting portion having
at least one electrically conductive pad defined thereon that is
electrically connected to the sensor, the sensor configured to
produce a signal indicative of a condition of the patient, a second
substrate mounted to the first substrate and defining thereon a
first number of electrically conductive pads, at least one of the
first number of electrically conductive pads being aligned with the
at least one electrically conductive pad defined on the first
substrate and at least another of the first number of electrically
conductive pads defined on the second substrate being electrically
connected to the at least one of the first number of electrically
conductive pads defined on the second substrate means for
establishing electrical contact between the at least one
electrically conductive pad defined on the first substrate and the
at least one of the first number of electrically conductive pads
defined on the second substrate, a third substrate mounted to the
second substrate and defining thereon the at least one electrical
terminal, a first number of electrical components mounted to the
third substrate and electrically interconnected to form a sensor
control circuit, the sensor control circuit being electrically
connected to the at least one electrical terminal defined on the
third substrate, and means for establishing electrical contact
between the at least another of the first number of electrically
conductive pads defined on the second substrate and the at least
one electrical terminal defined on the third substrate, the sensor
being thereby electrically connected to the sensor control
circuit.
40. The sensor of claim 39 wherein the sensor control circuit
includes a telemetry circuit configured to transmit or receive
communication signals to or from a remote electronic device.
41. The sensor of claim 39 wherein the sensor control circuit
includes a notification circuit configured to produce any of a
visual, audible and tactile indication of a predefined event.
42. The sensor of claim 41 wherein the sensor control circuit
includes an acknowledgement circuit responsive to user activation
thereof to acknowledge production of the visual, audible or tactile
indication of the predefined event.
43. The sensor of claim 41 wherein the sensor control circuit is
configured to determine the predefined event from the signal
produced by the sensor.
44. The sensor of claim 43 wherein the sensor control circuit
further includes a telemetry circuit configured to transmit or
receive communication signals to or from a first remote electronic
device, and wherein the first remote electronic device includes a
first telemetry circuit configured to transmit or receive
communication signals to or from the telemetry system of the sensor
control circuit.
45. The sensor of claim 44 wherein the telemetry circuit of the
sensor control circuit is configured to transmit a signal
indicative of the predefined event to the first telemetry circuit
of the remote electronic device, and wherein the first remote
electronic device includes means for providing any of a visual,
audible and tactile indication of the predefined event.
46. The sensor of claim 44 wherein the first remote electronic
device further includes a second telemetry circuit configured to
transmit or receive wireless communication signals to or from a
second remote electronic device.
47. The sensor of claim 44 further including: a second remote
electronic device, and means for establishing communications
between the first and second remote electronic devices.
48. The sensor of claim 39 wherein the first substrate is one of a
flexible substrate and a rigid substrate.
49. The sensor of claim 39 wherein the second substrate is one of a
flexible substrate and a rigid substrate.
50. The sensor of claim 39 wherein the third substrate is one of a
flexible substrate and a rigid substrate.
51. The sensor of claim 39 further including: a second number of
electrical components mounted to the second substrate, the second
number of electrical components and the first number of electrical
components together forming the sensor control circuit, and means
for electrically connecting the second number of electrical
components to the first number of electrical components.
52. The sensor of claim 51 wherein the second number of electrical
components includes a sensor operating circuit configured to
operate the sensor.
53. The sensor of claim 51 wherein the second number of electrical
components includes a telemetry circuit configured to transmit or
receive communication signals to or from a remote electronic
device.
54. The sensor of claim 51 wherein the second number of electrical
components includes a notification circuit configured to produce
any of a visual, audible and tactile indication of a predefined
event.
55. The sensor of claim 51 wherein the second number of electrical
components includes an acknowledgement circuit responsive to user
activation thereof to acknowledge production of the visual, audible
or tactile indication of the predefined event.
56. The sensor of claim 51 wherein the second number of electrical
components includes a sensor operating circuit configured to
operate the sensor, and wherein the first number of electrical
components includes a telemetry circuit configured to transmit or
receive communication signals to or from a remote electronic
device.
57. The sensor of claim 56 wherein the second number of electrical
components includes a notification circuit configured to produce
any of a visual, audible and tactile indication of a predefined
event.
58. The sensor of claim 56 wherein the second number of electrical
components includes an acknowledgement circuit responsive to user
activation thereof to acknowledge production of the visual, audible
or tactile indication of the predefined event.
59. The sensor of claim 39 wherein the first substrate defines a
second number of electrically conductive pads on the circuit
mounting portion thereof, and wherein at least some of the first
number of electrically conductive pads defined on the second
substrate align with corresponding ones of the second number of
electrically conductive pads defined on the circuit mounting
portion of the first substrate when the second substrate is mounted
to the first substrate.
60. The sensor of claim 59 wherein the third substrate defines a
third number of electrical terminals thereon, and wherein at least
others of the first number of electrically conductive pads defined
on the second substrate align with corresponding ones of the third
number of electrical terminals defined on the third substrate.
61. The sensor of claim 59 wherein the third substrate defines a
third number of electrical terminals thereon, and further including
means for electrically connecting at least others of the first
number of electrically conductive pads defined on the second
substrate to corresponding ones of the third number of electrical
terminals defined on the third substrate.
Description
FIELD OF THE INVENTION
[0001] The present invention relates generally to sensors for
determining a condition of a patient, and more specifically to
techniques for mating sensors of this type with electrical
circuitry.
BACKGROUND
[0002] It is generally known to use one or more sensors to monitor
a condition of a patient. It is desirable to mount electrical
circuitry to such sensors to control sensor operation and/or
perform other functions.
SUMMARY
[0003] The present invention may comprise one or more of the
features recited in the attached claims, and/or one or more of the
following features and combinations thereof. One embodiment of a
sensor may comprise a first substrate, an anisotropic medium and an
electrical circuit. The first substrate may have a sensing portion
configured to be percutaneously inserted into a patient and an
extracorporeal circuit mounting portion. The sensing portion may
define a sensor thereon. The sensor may be configured to produce a
signal indicative of a condition of the patient. The circuit
mounting portion may have at least one electrically conductive pad
formed thereon that is electrically connected to the sensor. The
anisotropic medium may be disposed on the circuit mounting portion
of the first substrate. The medium may be configured to be
electrically conductive in a direction through the medium and
electrically insulating in directions along the medium. The
electrical circuit may have at least one electrically conductive
terminal. The circuit may be mechanically mounted to the circuit
mounting portion of the first substrate via the anisotropic medium
with the at least one electrically conductive terminal juxtaposed
over the at least one electrically conductive pad. The anisotropic
medium may establish local electrical contact between the at least
one electrically conductive terminal and the at least one
electrically conductive pad. The first substrate may be a flexible
substrate or a rigid substrate.
[0004] The anisotropic medium may be an anisotropic tape configured
to mechanically bond the electrical circuit to the circuit mounting
portion of the first substrate. The anisotropic tape may be
electrically insulating along a plane of the tape and electrically
conductive through the tape in a direction generally perpendicular
to the plane of the tape. The anisotropic medium may alternatively
or additionally be an anisotropic elastomer configured to
mechanically bond the circuit to the circuit mounting portion of
the first substrate. The anisotropic elastomer may be electrically
insulating along a plane generally parallel to opposing surfaces of
the electrical circuit and the circuit mounting portion of the
first substrate, and electrically conductive through the elastomer
in a direction generally perpendicular to the plane.
[0005] The first substrate may define a first number of
electrically conductive pads on the circuit mounting portion
thereof, and the electrical circuit may have a second number of
electrical terminals. At least some of the second number of
electrical terminals may align with at least some of the number of
electrically conductive pads when the electrical circuit is mounted
to the circuit mounting portion of the first substrate.
[0006] The electrical circuit may comprise a second substrate
defining the at least one electrical terminal. The second substrate
may be a flexible substrate or a rigid substrate. A number of
electrical components may be mounted to the second substrate and
electrically interconnected to form a sensor control circuit. The
sensor control circuit may be electrically connected to the at
least one electrical terminal. The sensor control circuit may
include a sensor operating circuit configured to operate the
sensor. The sensor control circuit may additionally include a
telemetry circuit configured to transmit or receive communication
signals to or from a first remote electronic device. The sensor
control circuit may alternatively or additionally include a
notification circuit configured to produce any of a visual, audible
and tactile indication of a predefined event. The sensor control
circuit may be configured to determine the predefined event from
the signal produced by the sensor. In such embodiments, the first
remote electronic device may include a first telemetry circuit
configured to transmit or receive wireless communication signals to
or from the telemetry system of the sensor control circuit. The
telemetry circuit of the sensor control circuit may be configured
to transmit a wireless signal indicative of the predefined event to
the first telemetry circuit of the first remote electronic device.
The sensor control circuit may alternatively or additionally
include an acknowledgement circuit responsive to user activation
thereof to acknowledge production of the visual, audible or tactile
indication of the predefined event. A second remote electronic
device may be further included, as well as a means for establishing
communications between the first and second remote electronic
devices. For example, the first remote electronic device may
include a second telemetry circuit configured to transmit or
receive wireless communication signals to or from a second remote
electronic device.
[0007] The electrical circuit may define an outer periphery that is
contained within an outer periphery of the circuit mounting portion
of the first substrate when the electrical circuit is mounted
thereto.
[0008] Another embodiment of a sensor may comprise first, second
and third substrates. The first substrate may have a sensing
portion configured to be percutaneously inserted into a patient and
an extracorporeal circuit mounting portion. The sensing portion may
define a sensor thereon. The sensor may be configured to produce a
signal indicative of a condition of the patient. The circuit
mounting portion may have at least one electrically conductive pad
defined thereon that is electrically connected to the sensor. The
second substrate may be mounted to the first substrate and may
define therethrough at least one passageway that is aligned with
the at least one electrically conductive pad defined on the first
substrate. The third substrate may be mounted to the second
substrate and may define thereon at least one electrical terminal.
The at least one electrical terminal may align with at least one
passageway defined on the second substrate and with the at least
one electrically conductive pad defined on the first substrate. A
first number of electrical components may be mounted to the third
substrate and may be electrically interconnected to form a sensor
control circuit. The sensor control circuit may be electrically
connected to the at least one electrical terminal defined on the
third substrate. Means may be provided for establishing electrical
contact through the at least one passageway between the at least
one electrically conductive pad defined on the first substrate and
the at least one electrical terminal defined on the third
substrate, to thereby electrically connect the sensor to the sensor
control circuit.
[0009] The sensor control circuit may include a telemetry circuit
configured to transmit or receive communication signals to or from
a first remote electronic device. Alternatively or additionally,
the sensor control circuit may include a notification circuit
configured to produce any of a visual, audible and tactile
indication of a predefined event. In such embodiments, the sensor
control circuit may be configured to determine the predefined event
from the signal produced by the sensor. Alternatively or
additionally, the sensor control circuit may include an
acknowledgement circuit responsive to user activation thereof to
acknowledge production of the visual, audible or tactile indication
of the predefined event.
[0010] In embodiments wherein the sensor control circuit includes a
telemetry circuit, the first remote electronic device may include a
first telemetry circuit configured to transmit or receive
communication signals to or from the telemetry system of the sensor
control circuit. The telemetry circuit of the sensor control
circuit may be configured to transmit a signal indicative of the
predefined event to the first telemetry circuit of the first remote
electronic device. A second remote electronic device may be further
included, as well as a means for establishing communications
between the first and second remote electronic devices. For
example, the first remote electronic device may include a second
telemetry circuit configured to transmit or receive wireless
communication signals to or from a second remote electronic
device.
[0011] The first substrate may define a first number of
electrically conductive pads on the circuit mounting portion
thereof. The third substrate may define a second number of
electrical terminals thereon. The second substrate may define a
corresponding second number of passageways therethrough. At least
some of the second number of electrical terminals may align with at
least some of the first number of electrically conductive pads
through corresponding ones of the second number of passageways
defined through the second substrate when the second substrate is
mounted to the first substrate and the third substrate is mounted
to the second substrate.
[0012] The first substrate may be a flexible substrate or a rigid
substrate. The second substrate may be a flexible substrate or a
rigid substrate. The third substrate may be a flexible substrate or
a rigid substrate.
[0013] A second number of electrical components may be mounted to
the second substrate. The second number of electrical components
and the first number of electrical components may together form the
sensor control circuit. Means may be provided for electrically
connecting the second number of electrical components to the first
number of electrical components. The second number of electrical
components may include a sensor operating circuit configured to
operate the sensor. Alternatively or additionally, the second
number of electrical components may include a telemetry circuit
configured to transmit or receive communication signals to or from
a remote electronic device. Alternatively or additionally, the
second number of electrical components may include a notification
circuit configured to produce any of a visual, audible and tactile
indication of a predefined event. Alternatively or additionally,
the second number of electrical components may include an
acknowledgement circuit responsive to user activation thereof to
acknowledge production of the visual, audible or tactile indication
of the predefined event. In one example embodiment, the second
number of electrical components may include a sensor operating
circuit configured to operate the sensor, and the first number of
electrical components may include a telemetry circuit configured to
transmit or receive communication signals to or from a remote
electronic device. In this embodiment, the second number of
electrical components may include a notification circuit configured
to produce any of a visual, audible and tactile indication of a
predefined event. In this embodiment, the second number of
electrical components may alternatively or additionally include an
acknowledgement circuit responsive to user activation thereof to
acknowledge production of the visual, audible or tactile indication
of the predefined event.
[0014] Yet another embodiment of a sensor may comprise first,
second and third substrates. The first substrate may have a sensing
portion configured to be percutaneously inserted into a patient and
an extracorporeal circuit mounting portion. The sensing portion may
define a sensor thereon. The sensor may be configured to produce a
signal indicative of a condition of the patient. The circuit
mounting portion may have at least one electrically conductive pad
defined thereon that is electrically connected to the sensor. The
second substrate may be mounted to the first substrate and may
define thereon a first number of electrically conductive pads. At
least one of the first number of electrically conductive pads may
be aligned with the at least one electrically conductive pad
defined on the first substrate and at least another of the first
number of electrically conductive pads defined on the second
substrate may be electrically connected to the at least one of the
first number of electrically conductive pads defined on the second
substrate. Means may be provided for establishing electrical
contact between the at least one electrically conductive pad
defined on the first substrate and the at least one of the first
number of electrically conductive pads defined on the second
substrate. The third substrate may be mounted to the second
substrate and may define thereon the at least one electrical
terminal. A first number of electrical components may be mounted to
the third substrate and may be electrically interconnected to form
a sensor control circuit. The sensor control circuit may be
electrically connected to the at least one electrical terminal
defined on the third substrate. Means may be provided for
establishing electrical contact between the at least another of the
first number of electrically conductive pads defined on the second
substrate and the at least one electrical terminal defined on the
third substrate to thereby electrically connect the sensor to the
sensor control circuit.
[0015] The sensor control circuit may include a telemetry circuit
configured to transmit or receive communication signals to or from
a first remote electronic device. Alternatively or additionally,
the sensor control circuit may include a notification circuit
configured to produce any of a visual, audible and tactile
indication of a predefined event. In such embodiments, the sensor
control circuit may be configured to determine the predefined event
from the signal produced by the sensor. Alternatively or
additionally, the sensor control circuit may include an
acknowledgement circuit responsive to user activation thereof to
acknowledge production of the visual, audible or tactile indication
of the predefined event.
[0016] In embodiments wherein the sensor control circuit includes a
telemetry circuit, the first remote electronic device may include a
first telemetry circuit configured to transmit or receive
communication signals to or from the telemetry system of the sensor
control circuit. The telemetry circuit of the sensor control
circuit may be configured to transmit a signal indicative of the
predefined event to the first telemetry circuit of the remote
electronic device. A second remote electronic device may be further
included, as well as a means for establishing communications
between the first and second remote electronic devices. For
example, the first remote electronic device may include a second
telemetry circuit configured to transmit or receive wireless
communication signals to or from a second remote electronic
device.
[0017] The first substrate may be a flexible substrate or a rigid
substrate. The second substrate may be a flexible substrate or a
rigid substrate. The third substrate may be a flexible substrate or
a rigid substrate.
[0018] The first substrate may define a second number of
electrically conductive pads on the circuit mounting portion
thereof. At least some of the first number of electrically
conductive pads defined on the second substrate may align with
corresponding ones of the second number of electrically conductive
pads defined on the circuit mounting portion of the first substrate
when the second substrate is mounted to the first substrate. The
third substrate may define a third number of electrical terminals
thereon. At least others of the first number of electrically
conductive pads defined on the second substrate may align with
corresponding ones of the third number of electrical terminals
defined on the third substrate. Alternatively or additionally,
means may be provided for electrically connecting at least others
of the first number of electrically conductive pads defined on the
second substrate to corresponding ones of the third number of
electrical terminals defined on the third substrate.
[0019] A second number of electrical components may be mounted to
the second substrate. The second number of electrical components
and the first number of electrical components may together form the
sensor control circuit. Means may be provided for electrically
connecting the second number of electrical components to the first
number of electrical components. The second number of electrical
components may include a sensor operating circuit configured to
operate the sensor. Alternatively or additionally, the second
number of electrical components may include a telemetry circuit
configured to transmit or receive communication signals to or from
a remote electronic device. Alternatively or additionally, the
second number of electrical components may include a notification
circuit configured to produce any of a visual, audible and tactile
indication of a predefined event. Alternatively or additionally,
the second number of electrical components may include an
acknowledgement circuit responsive to user activation thereof to
acknowledge production of the visual, audible or tactile indication
of the predefined event. In one example embodiment, the second
number of electrical components may include a sensor operating
circuit configured to operate the sensor, and the first number of
electrical components may include a telemetry circuit configured to
transmit or receive communication signals to or from a remote
electronic device. In this embodiment, the second number of
electrical components may include a notification circuit configured
to produce any of a visual, audible and tactile indication of a
predefined event. In this embodiment, the second number of
electrical components may alternatively or additionally include an
acknowledgement circuit responsive to user activation thereof to
acknowledge production of the visual, audible or tactile indication
of the predefined event.
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] FIG. 1A is an assembly view of one embodiment of a sensor
module including a sensor and an electrical circuit mountable
thereto.
[0021] FIG. 1B is a cross-sectional view of the sensing portion of
the module of FIG. 1A taken along section lines 1B-1B.
[0022] FIG. 2 is an assembled view of the sensor module of FIGS. 1A
and 1B.
[0023] FIG. 3 is a cross-sectional view of the sensor module of
FIG. 2 taken along section lines 3-3.
[0024] FIG. 4 is a block diagram illustrating one embodiment of the
electrical circuit illustrated generally in FIGS. 1A, 2 and 3.
[0025] FIG. 5 is an assembly view of another embodiment of a sensor
module including a sensor and an electrical circuit mountable
thereto.
[0026] FIG. 6 is an assembled view of the sensor module of FIG.
5.
[0027] FIG. 7 is a cross-sectional view of the sensor module of
FIG. 6 taken along section lines 7-7.
[0028] FIG. 8 is a block diagram illustrating one embodiment of the
electrical circuit illustrated generally in FIGS. 5 and 6.
[0029] FIG. 9 is an assembly view of yet another embodiment of a
sensor module including a sensor and an electrical circuit
mountable thereto.
[0030] FIG. 10 is an assembled view of the sensor module of FIG.
9.
[0031] FIG. 11A is a cross-sectional view of one embodiment of the
sensor module of FIG. 10 taken along section lines 11A,B-11A,B.
[0032] FIG. 11B is a cross-sectional view of another embodiment of
the sensor module of FIG. 10 taken along section lines
11A,B-11A,B.
[0033] FIG. 12 is a block diagram illustrating one embodiment of
the electrical circuit illustrated generally in FIGS. 9, 10, 11A
and 11B.
[0034] FIG. 13 is a block diagram illustrating another embodiment
of the electrical circuit illustrated generally in FIGS. 9, 10, 11A
and 11B.
[0035] FIG. 14 is a block diagram illustrating yet another
embodiment of the electrical circuit illustrated generally in FIGS.
9, 10, 11A and 11B.
DESCRIPTION OF THE ILLUSTRATIVE EMBODIMENTS
[0036] For the purposes of promoting an understanding of the
principles of the invention, reference will now be made to a number
of illustrative embodiments shown in the attached drawings and
specific language will be used to describe the same.
[0037] Referring now to FIGS. 1A, 1B and 2, one illustrative
embodiment of a sensor module 10 is shown that includes a
sensor-carrying substrate 12 having an electrical circuit 32
mountable thereto. In the illustrated embodiment, the substrate 12
includes a sensing portion 14 that is configured for percutaneous
insertion into a patient (e.g., into tissue, vein or artery) and an
extracorporeal circuit mounting portion 16.
[0038] The sensing portion 14 of the substrate 12 includes a sensor
in the form of at least one working electrode 18A and at least one
auxiliary electrode 18B formed thereon adjacent to an insertion tip
15 of the sensing portion 14. The auxiliary electrode 18B may be,
depending upon the application, part of the working electrode 18A,
another working electrode separate from the working electrode 18A,
a counter electrode or a reference electrode. It will be understood
that the sensor 18A,B may alternatively include additional or fewer
electrodes formed on any side of the sensing portion 14 of the
substrate 12, and that any such sensor electrodes may be located
anywhere along the sensing portion 14. Alternatively still, the
auxiliary electrode 18B and/or one or more additional electrodes
associated with the sensor 18A,B may be formed on a different
structure that is implanted within, inserted into or otherwise in
contact with the patient.
[0039] The sensor electrodes 18A and 18B are formed using
electrically conductive traces 20A and 20B respectively that are
disposed on the substrate 12 in a conventional manner. A sensing
layer may be formed on, over or near either electrode 18A or 18B,
or on, over or near both electrodes 18A and 18B, and in the
illustrated embodiment a sensing layer 24A is formed over the
electrode 18A. The sensing end 15 of the sensing portion 14 may be
configured, as illustrated in FIGS. 1A and 2, to facilitate
percutaneous insertion of the sensing portion 14 into a
patient.
[0040] In the illustrated embodiment, the working electrode 18A is
covered near the insertion end 15 of the sensing portion 14 of the
substrate 12 with a sensing layer 24A. The sensing layer 24A may be
formed using conventional materials that facilitate the
electrochemical detection of an analyte or other condition of the
patient's body when the analyte or other condition cannot be
otherwise electrolyzed at a specified rate and/or with a specified
accuracy using only the underlying working electrode 18A.
Illustratively, the sensing layer 24A may include a conventional
electron transfer agent that transfers electrons directly or
indirectly between an analyte and the working electrode 18A. The
sensing layer 24A may also contain a conventional catalyst to
catalyze a reaction of the analyte. In other embodiments, the
working electrode 18A may have a sensing layer 24A that does not
contain either an electron transfer agent.
[0041] In the illustrated embodiment, the sensing layer 24A is
disposed directly on the electrically conductive portion 20A of the
working electrode 18A. In other embodiments, the sensing layer 24A
may be spaced apart from the electrically conductive portion 20A of
the working electrode 18A by one or more conventional separation
layers (not shown). Such separation layers typically include one or
more membranes or films, and in addition to separating the
electrically conductive portion 20A of the working electrode 18A
from the sensing layer 24A, the one or more separation layers may
also act as a conventional mass transport limiting layer or a
conventional interferent eliminating layer. In other embodiments,
the sensing layer 24A may comprise two or more conventional sensing
layers (not shown). The sensing layer or layers 24A may
additionally include other operationally enhancing materials and/or
layers including, but not limited to, a biocompatible layer, and/or
other optional layers and/or components. In still other
embodiments, the working electrode 18A may not include a sensing
layer 24A.
[0042] The auxiliary electrode 18B may be formed using a suitably
conductive material, and example of which may be, but should not be
limited to, silver/silver chloride. Alternatively, the electrode
18B may be coated with or bound to a suitable material, at or near
the insertion end 15 of the sensing portion 14 that enhances
operation of the electrode 18B another working electrode, counter
electrode or reference electrode. It is desirable for the surface
of the electrode 18B to be non-corroding to facilitate accurate
sensor operation.
[0043] The substrate 12 may be formed using any one or combination
of conventional, electrically non-conducting materials that are by
themselves, or that may be further processed to be, suitable for
in-vivo use. In one embodiment, the substrate 12 is flexible, and
in one specific embodiment the substrate 12 is made of Melinex.RTM.
polyester film (e.g., polyethylene terephthalate). Other suitable
materials for a flexible substrate 12 include, for example, but are
not limited to, electrically insulating plastic or polymeric
materials such as polycarbonates, other polyesters such as
Mylar.RTM., polyvinyl chloride, polyurethanes, polyethers,
polyimides, or copolymers of thermoplastics, such as
glycol-modified polyethylene terephthalate, and/or other
electrically non-conducting, flexible, deformable materials. In
other embodiments, the substrate 12 is rigid, and may be made using
conventional electrically non-conducting materials. Examples of
such rigid, electrically non-conducting materials include, but are
not limited to, ceramics, such as aluminum oxide and silicon
dioxide, and the like. Combinations of flexible and non-flexible
materials are also contemplated.
[0044] The substrate 12 is sized so that at least a portion of the
tip 15 of the sensing portion 14 can be percutaneously inserted
into a patient, such that the one or more sensor electrodes, e.g.,
18A and/or 18B, are suitably positioned to monitor a condition,
e.g., an analyte such as blood glucose, temperature, blood
pressure, or the like, of the patient, and while the circuit
mounting portion 16 remains extracorporeal. The circuit mounting
portion 16 is sized to accommodate the mounting of an electrical
circuit 32 thereto as will be described in greater detail
hereinafter. The circuit mounting portion 16 is also sized to
accommodate placement thereon of a number of electrically
conductive pads that are each electrically connected to a
corresponding one of the sensor electrodes. In the illustrated
embodiment, for example, wherein two such sensor electrodes 18A and
18B are shown, two corresponding electrically conductive pads 22A
and 22B are formed on the circuit mounting portion 16 of the
substrate 12. The electrically conductive pad 22A is electrically
connected to the sensor electrode 18A via an electrically
conductive trace 20A formed on the sensing and circuit mounting
portions 14 and 16 respectively, and the electrically conductive
pad 20B is electrically connected to the sensor electrode 18B via
another electrically conductive trace 20B formed on the sensing and
circuit mounting portions 14 and 16 respectively. It will be
understood, however, that the substrate 12 may include more or
fewer sensor electrode, electrically conductive pad and
interconnecting trace combinations.
[0045] The electrically conductive traces, e.g., 20A and 20B, and
the electrically conductive pads, e.g., 22A and 22B, may be formed
on the substrate 12 by any of a variety of conventional techniques.
Examples of conventional techniques for forming such electrically
conductive traces and electrically conductive pads include, but are
not limited to, laser ablation, photolithography, screen printing,
wet or dry etching of deposited conductive material, or other
conventional techniques. Examples of electrically conductive
materials used to form the electrically conductive traces and pads
include, but are not limited to, carbon, e.g., graphite, conductive
polymers, metals or alloys, metallic compounds, or the like. The
formation of films of carbon, conductive polymer, metal, alloy, or
metallic compound are well-known and include, for example, but are
not limited to, chemical vapor deposition (CVD), physical vapor
deposition, sputtering, reactive sputtering, printing, coating, and
painting. It will be understood that the electrically conductive
pads, e.g., 22A and 22B, may, but need not, be formed of the same
material used to form the electrically conductive traces, e.g., 20A
and 20B.
[0046] The electrical circuit 32 defines one or more electrical
terminals that align with one or more corresponding electrically
conductive pads formed on the circuit mounting portion 16 of the
substrate 12 when the electrical circuit 32 is juxtaposed over the
circuit mounting portion 16. The one or more electrical terminals
are electrically connected to sensor control circuitry carried by,
formed on, or otherwise defined by the electrical circuit 32. The
one or more electrical terminals may be variously shaped and/or
sized, and in one embodiment are provided in the form of one or
more electrically conductive pads. In the illustrated embodiment,
for example, the electrical circuit 32 defines two such
electrically conductive pads 34A and 34B which align with the
electrically conductive pads 22A and 22B respectively on the
circuit mounting portion 16 of the substrate 12 when the electrical
circuit 32 is juxtaposed over the circuit mounting portion 16 as
shown in FIGS. 2 and 3. It will be understood that the number of
electrically conductive pads formed on the circuit mounting portion
16 of the substrate 12 may be equal to, less than or greater than
the number of electrical terminals defined by the electrical
circuit 32. In any of these cases, however, at least one of the
electrical terminals defined by the electrical circuit 32 aligns
with at least one of the electrically conductive pads formed on the
circuit mounting portion 16 of the substrate 12 when the electrical
circuit 32 is juxtaposed over the circuit mounting portion 16 so
that electrical connected may be established therebetween. At least
some of the number of electrically conductive pads defined on the
circuit mounting portion 16 of the substrate 12 may be arranged to
form a pattern, e.g., a bit pattern, that contains identification
information and/or other information relating to the sensor 18A,B,
substrate 12 or combination thereof. Such a bit pattern is then
detectable by the electrical circuit 32 when electrical connection
is established between the electrically conductive pads that define
the bit pattern and corresponding ones of the electrical terminals
defined by the electrical circuit 32. In this embodiment, the
electrical circuit 32 may thus determine information relating to
the sensor 18A,B, the substrate 12 and or the combination thereof
based only on the pattern of electrical connections therebetween.
The electrical circuitry 32 may be configured to activate on-board
notification circuitry and/or to wirelessly transmit signals to a
remote electronic device, that are indicative of the information
contained in the bit pattern and/or that are the result of further
processing of this information.
[0047] An anisotropic medium 30 is disposed between the electrical
circuit 32 and the circuit mounting portion 16 of the substrate 12.
The anisotropic medium 30 has adhesive properties which serve to
mechanically attach or mount the electrical circuit 32 to the
circuit mounting portion 16 of the substrate 12. The anisotropic
medium 32 is also electrically conductive in a direction through
the medium but is electrically insulating in a direction along or
across the medium. By suitably positioning the one or more
electrically conductive pads, e.g., pads 22A and 22B on the circuit
mounting portion 16 of the substrate 12 and/or by suitably
positioning the one or more electrical terminals on the electrical
circuit 32 so that one or more of the electrical terminals align
with one or more of the electrically conductive pads when the
circuit 32 is juxtaposed over the circuit mounting portion 16 of
the substrate 12, local electrical contact is established
therebetween when the components 16, 30 and 32 are assembled as
illustrated in FIGS. 2 and 3.
[0048] In one embodiment, the anisotropic medium 30 may be provided
in the form of a conventional anisotropic electrically conductive
adhesive tape. The tape in this embodiment is a flexible adhesive
matrix filled with electrically conductive particles that provide
electrical connectivity in a direction through the plane of the
tape, but which are spaced sufficiently far apart so that the tape
is electrically insulating in directions along the plane of the
tape. The anisotropic adhesive tape 30 is disposed between the
circuit mounting portion 16 of the substrate 12 and the electrical
circuit 32, as shown in FIGS. 2 and 3. When the electrical circuit
32 is pressed into the tape 30 with the electrical terminals 34A
and 34B aligned with the electrically conductive pads 22A and 22B,
local electrical contact is established through the tape 30, in a
direction that is generally perpendicular to the plane of the tape
30, between the electrical terminals 34A, 34B and corresponding
electrically conductive pads 22A, 22B. Alternatively, the
anisotropic medium 30 may be provided in the form of an anisotropic
electrically conductive elastomer, such as an adhesive film, having
the same properties just described with respect to the anisotropic
electrically conductive adhesive tape. In this embodiment, the
elastomer 30 defines a plane generally parallel to opposing
surfaces of the electrical circuit 32 and the circuit mounting
portion 16 of the substrate 12, and the elastomer 30 is
electrically insulating in directions along or parallel to the
plane and electrically conductive in a direction generally
perpendicular to the plane.
[0049] One example of the anisotropic electrically conductive
medium 30 may be or include one or more anisotropic conductive film
adhesives that are commercially available from 3M.TM. Electronics
of St. Paul, Minn. Examples include, but are not limited to, 3M.TM.
products 7303, 7313, 8794, 5460R, 5552R, 7373 and 9703. Some such
products, e.g., 9703, are available in the form of anisotropic,
electrically-conductive adhesive transfer tape, which is a pressure
sensitive tape that does not require thermal bonding. Generally,
9703 is a flexible tape that is randomly loaded with electrically
conductive particles. When force is applied to the tape along its
Z-axis, the conductive particles contact one another in the area of
the force. In the bonding of electrical circuitry, the result is
that the tape becomes electrically conductive along the Z-axis at
the bonding areas, but is electrically insulating along the plane
of the tape. The remaining products described above are available
in the form of anisotropic (electrically) conductive film (ACF)
adhesives, where are heat-bondable, Z-axis conductive films
containing thermoplastic and thermoset adhesives randomly loaded
with electrically conductive particles. Electrical contact is made
in the same manner described with respect to the anisotropic,
electrically-conductive adhesive transfer tape, and the product is
cured to form a permanent bond by applying heat during the bonding
process.
[0050] In one experimental setup, one of the 3M.TM. ACF adhesives
was used to bond FR4 circuit boards 32 of thickness 1.6 mm to
Melinex.RTM. substrates 12 forming part of a sensor as shown in
FIGS. 1 and 2. In this experiment, circuit boards 32 were
successfully bonded to substrates 12, with electrical contact
established between the contacts 22A/34A and 22B/34B, by forcing a
flat surface of a brass block, heated to 135.degree. C.,
perpendicularly onto the Melinex.RTM. film 12 using a linear guide
supported on ball bearings. A spring, k=2 kg/mm, was used to apply
a force of 11.7 kg to the brass block. The spring travel was set to
5.6 mm, and the brass block was forced against the substrate 12 for
approximately 50 seconds, after which the substrate 12 was slightly
displaced, and the brass block was again forced against the
substrate 12 for another 20-30 seconds. It will be understood that
the results of this experiment are provided only for illustrative
purposes, and should not be considered to be limiting in any
way.
[0051] In any case, a substantial portion of the circuit mounting
portion 16 of the substrate 12 and the electrical circuit 32 are
covered by the anisotropic medium 30, thereby resulting in a strong
mechanical attachment of the electrical circuit 32 to the substrate
12. In the illustrated embodiment, for example, the electrical
circuit 32 defines an outer periphery that is contained within an
outer periphery of the circuit mounting portion 16 of the substrate
12 when the electrical circuit 32 is mounted thereto. In this
embodiment, one entire surface of the electrical circuit 32 is thus
covered by the anisotropic medium. The present disclosure
contemplates other embodiments wherein the outer periphery of the
electrical circuit 32 extends to or beyond at least a portion of
the outer periphery of the circuit mounting portion 16 of the
substrate 12.
[0052] Referring now to FIG. 4, a block diagram of one illustrative
embodiment of the electrical circuit 32 is shown. In the
illustrated embodiment, the electrical circuit 32 is a sensor
control circuit that includes a sensor operating circuit 40 having
a conventional memory unit 42. The sensor operating circuit 40
includes a number of inputs that are each electrically connected to
a corresponding one of the number of electrically conductive
terminals defined by the electrical circuit 32. In the illustrated
embodiment, for example, the sensor operating circuit includes two
such inputs. A first input is electrically connected to the
electrically conductive terminal 34A via a signal path 38A, and a
second input is electrically connected to the electrically
conductive terminal 34B via another signal path 38B.
[0053] The sensor operating circuit 40 includes conventional
circuitry for operating the sensor 18A, 18B such as by, for
example, providing appropriate voltages across the sensor
electrodes 18A and 18B and collecting signals produced by the
sensor 18A, 18B. The sensor control circuit 40 may also be
configured to process the signals produced by the sensor 18A, 18B,
and to then control one or more electrical circuits on-board the
electrical circuit 32 and/or external to the electrical circuit 32.
In one embodiment, the sensor control circuit 40 is
microprocessor-based, and is operable to execute one or more
software algorithms stored in the memory unit 42 to control
operation of the sensor 18A, 18B and/or additional circuitry
on-board and/or external to the electrical circuit 32.
[0054] The sensor control circuit 32 may illustratively include a
conventional telemetry circuit 44 that is electrically connected to
the sensor operating circuit 42. The telemetry circuit 44 may be
configured to wirelessly transmit signals to a remote electronic
device 50, and/or to receive signals from the remote electronic
device 50. The telemetry circuit 44 may be controlled by the sensor
operating circuit 40 to transmit and/or receive specified
information, or may alternatively be controlled by the sensor
operating circuit 40 only to transmit information and to be
responsive to signals transmitted by the remote electronic device
50 to receive information. In any case, the telemetry circuit 44
may be configured to conduct wireless communication using any
conventional wireless communication techniques. Examples of such
conventional wireless communications techniques include, but are
not limited to, infrared (IR) communications, radio frequency (RF)
communications, inductively coupled communications, or the
like.
[0055] The sensor control circuit 32 may also illustratively
include a conventional event notification circuit 46 that is
electrically connected to the sensor operating circuit 42. The
event notification circuit 46 is configured to provide a
notification of a specified event, and may accordingly include any
one or more conventional visual, audible and/or tactile indication
devices. The event notification circuit 46 is configured to be
responsive to an event notification signal to activate the one or
more visual, audible and/or tactile indication devices according to
any desired indication pattern. The event that triggers activation
of the one or more visual, audible and/or tactile indication
devices of the event notification circuit 46 generally results from
information provided by the sensor 18A, 18B. In the illustrated
embodiment, the sensor operating circuit 40 is operable to process
all information produced by the sensor 18A, 18B, and is accordingly
operable to determine the event that triggers activation of the
event notification circuit 46 from the signals produced by the
sensor 18A, 18B. Upon determining such an event, the sensor
operating circuit 40 is then operable to control activation of the
event notification circuit 46. Alternatively, the sensor operating
circuit 40 may be operable, upon determining such an event, to
control the telemetry circuit 44 transmit a wireless event signal,
which may be received by a sensor telemetry circuit 52 that forms
part of the remote electronic device 50.
[0056] The sensor control circuit 32 may also illustratively
include an acknowledge circuit 48 that is electrically connected to
the sensor operating circuit 40. The acknowledge circuit 48 is
configured to be responsive to user activation thereof to produce
an acknowledgement signal, and to provide the acknowledgement
signal to the sensor operating circuit 40. Generally, the
acknowledge circuit 48 is provided as a mechanism for the user to
acknowledge production of the visual, audible or tactile indication
of the predefined event. In this regard, the acknowledge circuit 48
may include any conventional user activation mechanism including,
for example, but not limited to, a user activated button, switch or
the like.
[0057] The sensor control circuit 32 may be implemented in any of a
variety of conventional forms. In one embodiment, for example, the
sensor control circuit 32 may be a single, monolithic integrated
circuit configured to include at least the sensor operating circuit
40, and to optionally include any one or more of the telemetry
circuit 44, the event notification circuit 46 and the
acknowledgement circuit 48. In this embodiment, the one or more
electrical terminals comprise one or more electrically conductive
circuit terminals or leads extending from a hermetically sealed
integrated circuit package containing the integrated circuit. In
this embodiment, the structure 33 thus represents a packaged
integrated circuit. In another embodiment, for example, the sensor
control circuit 32 may include a sensor control circuit substrate
having at least the sensor operating circuit 40, and optionally any
one or more of the telemetry circuit 44, the event notification
circuit 46 and the acknowledgement circuit 48, mounted thereto. In
this embodiment, the structure 33 illustrated in FIG. 4 represents
the sensor control circuit substrate. The substrate 33 may be
flexible or rigid, and the one or more electrical terminals may
take the form of one or more electrically conductive pads formed on
the underside of the substrate 33, one or more circuit traces
formed on the underside of the substrate 33 or one or more
electrical conductors extending from the underside of the substrate
33. In this embodiment, the sensor operating circuit 40, and
optionally any one or more of the telemetry circuit 44, the event
notification circuit 46 and the acknowledgement circuit 48, is
mounted to a top side of the substrate 33, and the one or more
electrical terminals defined on the underside of the substrate 33
are electrically connected to corresponding electrical terminals or
circuit traces defined on the top side of the substrate 33 in a
conventional manner. An example of this is illustrated in FIG. 3
where the electrical terminal 34A defined on the bottom surface of
the sensor control circuit 32 is electrically connected via an
electrical conductor 35 to an electrical terminal 34A' defined on
the top surface of the sensor control circuit 32. The two
electrical terminals 34A and 34A' may be electrically connected
using conventional techniques including, for example, but not
limited to, plated-though hole technology, using multiple layers of
conductors interconnected by vias, wrapping electrically conductive
circuit traces around the substrate from the top surface to the
bottom surface, and the like. Examples of suitable flexible
materials that may be used to implement the substrate 33 in
flexible form include, but are not limited to, Melinex.RTM.
polyester film (e.g., polyethylene terephthalate), other polyesters
such as Mylar.RTM., polyvinyl chloride, electrically insulating
plastic or polymeric materials such as polycarbonates,
polyurethanes, polyethers, polyimides, or copolymers of
thermoplastics, such as glycol-modified polyethylene terephthalate,
and/or other electrically non-conducting, flexible, deformable
materials. Examples of suitable rigid materials that may be used to
implement the substrate 33 in rigid form include, but are not
limited to, ceramics, such as aluminum oxide and silicon dioxide,
conventional printed circuit boards, conventional multi-layer
printed circuit boards, and the like. Combinations of flexible and
non-flexible materials are also contemplated.
[0058] As described hereinabove, a remote electronic device 50 may
include a sensor telemetry circuit 52 configured to wirelessly
transmit signals to and/or receive signals from the telemetry
circuit 44 of the sensor control circuit 32. The remote electronic
device 50 may further include a conventional processor circuit 54,
which may be implemented in the form of a conventional
microprocessor that is electrically connected to the sensor
telemetry circuit 52 and to an input device 56. An input device 56
may be or include a keyboard, key pad, touch screen display device,
voice-activated device or the like, and may be used in a
conventional manner to supply the processor 54 with information
that may include, for example, commands to execute a desired
function or process. A conventional display 57 may be included as
part of the electronic device 50, and may be controlled by the
processor 54 in a conventional manner to display messages, alerts
and/or warnings in the form of one or more of a visual, audible or
tactile form. In embodiments wherein the sensor operating circuit
40 of the electrical circuit 36 is operable to control the
telemetry circuit 44 to transmit a wireless event signal, as
described hereinabove, the telemetry circuit 52 of the electronic
device 50 is operable to receive the wireless event signal and
provide this signal to the processor 54. The processor 54 is, in
turn, responsive to the wireless event signal to activate the
display 57 to display, in visual, audible and/or tactile form, an
indicator of the event.
[0059] The electronic device 50 may further include an auxiliary
telemetry circuit 58 that is configured to transmit and/or receive
wireless signals to and/or from a telemetry circuit 60 of another
remote or auxiliary electronic device 62. Alternatively, the remote
device 50 may include an input/output port 66, the remote or
auxiliary device 62 may also include an input/output port 68, and a
suitable wired connection 69 may electrically connect the
input/output ports 66 and 68. Communication between the remote
electronic device 50 and the remote or auxiliary electronic device
62 may be carried out using any conventional techniques and
according to any conventional communications protocols.
[0060] Referring now to FIGS. 5-8, one illustrative embodiment of
another sensor module 70 is shown. The sensor module 70 includes
some of the same structural components as the sensor module 10 of
FIGS. 1-4, and like numbers are therefore used to identify like
components. In the illustrated embodiment, an intermediate
substrate 80 is introduced between the circuit mounting portion 16
of the substrate 12 and the electrical circuit 32. The intermediate
substrate 80 may be flexible or rigid, and in either case the
substrate 80 defines therethrough one or more passageways that
align with one or more corresponding electrically conductive pads
defined on the circuit mounting portion 16 of the substrate 12 when
the substrate 80 is mounted to the circuit mounting portion 16 of
the substrate 12. In the illustrated embodiment, for example, the
intermediate substrate 80 defines therethrough two such passageways
82A and 82B that align with corresponding electrically conductive
pads 22A and 22B defined on the circuit mounting portion 16 of the
substrate 12, and that are juxtaposed over the corresponding
electrically conductive pads 22A and 22B when the substrate 80 is
mounted to the circuit mounting portion 16 of the substrate 12. The
substrate 80 may be attached to the circuit mounting portion 16 of
the substrate 12 via a conventional attachment medium, and in the
embodiment illustrated in FIG. 7 the substrate 80 is shown being
attached or mounted to the mounting portion 16 of the substrate 12
via a conventional adhesive 84. Examples of other suitable
attachment mechanisms include, but are not limited to, conventional
epoxies or other formable or settable mediums, conventional
adhesives including adhesive tapes, or the like. Examples of
suitable flexible materials that may be used to implement the
substrate 80 in flexible form include, but are not limited to,
Melinex.RTM. polyester film (e.g., polyethylene terephthalate),
other polyesters such as Mylar.RTM., polyvinyl chloride,
electrically insulating plastic or polymeric materials such as
polycarbonates, polyurethanes, polyethers, polyimides, or
copolymers of thermoplastics, such as glycol-modified polyethylene
terephthalate, and/or other electrically non-conducting, flexible,
deformable materials. Examples of suitable rigid materials that may
be used to implement the substrate 80 in rigid form include, but
are not limited to, ceramics, such as aluminum oxide and silicon
dioxide, conventional printed circuit boards, conventional
multi-layer printed circuit boards, and the like. Combinations of
flexible and non-flexible materials are also contemplated.
[0061] The one or more electrical terminals defined by the
electrical circuit 32 also align with the one or more passageways
defined through the intermediate substrate 80. In the illustrated
embodiment, for example, the electrical terminals 34A and 34B align
with the passageways 82A and 82B respectively so that the terminals
34A and 34B are juxtaposed over the electrically conductive pads
22A and 22B when the electrical circuit 32 is mounted to the
intermediate substrate 80 and the intermediate substrate 80 is also
mounted to the circuit mounting portion 16 of the substrate 12, as
illustrated in FIGS. 6 and 7. Electrical connection between the
electrically conductive terminals 34A and 34B and the corresponding
electrically conductive pads 22A and 22B respectively is made using
conventional electrical interconnection techniques. Examples of
such electrical interconnection techniques include, but are not
limited to, curable solder paste, solder bumps, electrically
conductive adhesive, an electrically conductive formable medium
such as an electrically conductive resin, or the like. In the
illustrated embodiment, the electrical connection is shown as
taking the form of a formable metallic conductor 86, e.g., solder,
that forms an electrical and mechanical bond to the electrically
conductive terminal 34A and to the electrically conductive pad 22A.
This mechanical connection may serve also as the mechanical
attachment mechanism for mounting the electrical circuit 32 to the
intermediate substrate 80, as illustrated in FIG. 7, or a
conventional attachment medium may alternatively be used to attach
or mount the electrical circuit 32 to the substrate 80. Examples of
such conventional attachment mechanisms include, but are not
limited to, conventional epoxies or other formable or settable
mediums, conventional adhesives including adhesive tapes, or the
like.
[0062] The electrical circuit 32 may take any of the forms
described hereinabove with respect to FIG. 4, and may be configured
as described hereinabove to communicate with a remote electronic
device 50. The device 50 may also be configured to communicate with
an auxiliary electronic device 62. Details of the remote electronic
device 50, the auxiliary electronic device 62 and operation thereof
are provided hereinabove. In some embodiments, a portion 32' of the
electrical circuit 32 may be mounted to a suitable flexible or
rigid substrate 88 that is itself attached to the substrate 80, and
a remainder of the electrical circuit 32 may be mounted to and
carried by the substrate 80. In the illustrated embodiment, for
example, the event notification circuit 46 is shown as being
mounted to and carried by the substrate 80 while a remainder 32' of
the sensor control circuitry 40, 43, 44 and 48 is mounted to a
sensor control circuit substrate 88. It will be understood that in
this embodiment, any one or more of the sensor control circuit
components may be mounted to the substrate 80, and that the event
notification circuit 46 is shown mounted to the substrate 80 only
by way of example. In any case, any portion of the sensor control
circuit 32 that is mounted to the substrate 80 is electrically
connected to a remainder of the sensor control circuit 32' that is
mounted to the sensor control circuit substrate 88 using
conventional electrical connection structures and techniques. In
the illustrated embodiment, for example, the substrate 88 defines
an electrically conductive pad or terminal 90 on a top side of
thereof that is electrically connected to the sensor operating
circuit 40 via an electrically conductive trace 92. The substrate
80 likewise defines an electrically conductive pad or terminal 94
on the top side thereof that is electrically connected to the event
notification circuit 46 via an electrically conductive trace 96.
The electrically conductive pads or terminals 90 and 94 are
electrically connected together in a conventional manner to
electrically connect the event notification circuit 46 to the
sensor operating circuit 40.
[0063] In an alternative embodiment, as illustrated in phantom in
FIG. 8, the substrate 88 defines an electrically conductive pad 98
on the bottom surface thereof that aligns with, and is juxtaposed
over, an electrically conductive pad 99 formed on the top surface
of the substrate 80 when the substrate 88 is mounted to the
substrate 80. Electrical interconnection therebetween may be made
using conventional techniques, or by interposing an anisotropic
electrically conductive medium, such as the anisotropic
electrically conductive medium 30 illustrated and described
hereinabove, between the substrates 80 and 88 at least between the
electrically conductive pads 98 and 99. Examples of suitable
flexible materials that may be used to implement the substrate 88
in flexible form include, but are not limited to, Melinex.RTM.
polyester film (e.g., polyethylene terephthalate), other polyesters
such as Mylar.RTM., polyvinyl chloride, electrically insulating
plastic or polymeric materials such as polycarbonates,
polyurethanes, polyethers, polyimides, or copolymers of
thermoplastics, such as glycol-modified polyethylene terephthalate,
and/or other electrically non-conducting, flexible, deformable
materials. Examples of suitable rigid materials that may be used to
implement the substrate 88 in rigid form include, but are not
limited to, ceramics, such as aluminum oxide and silicon dioxide,
conventional printed circuit boards, conventional multi-layer
printed circuit boards, and the like. Combinations of flexible and
non-flexible materials are also contemplated.
[0064] In an alternative embodiment, as another example, the
telemetry circuit 44 may be mounted to and carried by the substrate
88 while the remainder 32' of the sensor control circuitry 40, 43,
44 and/or 46 is mounted to and carried by the substrate 80. In this
embodiment, the telemetry circuit 44 is electrically connected to a
remainder of the sensor control circuit 32' that is mounted to the
substrate 80 using conventional electrical connection structures
and techniques of the type just described.
[0065] Referring now to FIGS. 9-14, one illustrative embodiment of
yet another sensor module 100 is shown. The sensor module 100
includes some of the same structural components as the sensor
module 10 of FIGS. 1-4, and like numbers are therefore used to
identify like components. In the illustrated embodiment, an
intermediate substrate 110 is introduced between the circuit
mounting portion 16 of the substrate 12 and an electrical circuit
132. The intermediate substrate 110 may be flexible or rigid, and
in either case the substrate 110 defines one or more electrically
conductive pads on the bottom surface thereof that align with one
or more of the number of electrically conductive pads defined on
the circuit mounting portion 16 of the substrate 12 when the
substrate 110 is mounted to the circuit mounting portion 16 of the
substrate 12. In the illustrated embodiment, for example, the
intermediate substrate 110 defines two such electrically conductive
pads 112A and 112B on the bottom surface thereof that align with
corresponding electrically conductive pads 22A and 22B defined on
the circuit mounting portion 16 of the substrate 12. In the
illustrated embodiment, the substrate 110 is attached to the
circuit mounting portion 16 of the substrate 12 via an anisotropic
electrically conductive medium 30 as described hereinabove with
respect to FIGS. 1-3. In this embodiment, the anisotropic medium 30
also establishes local electrical connections between the
electrically conductive pads 22A and 112A and between the
electrically conductive pads 22B and 112B as described hereinabove.
Alternatively, the substrate 110 may be attached to the circuit
mounting portion 16 of the substrate 12 via any conventional
attachment medium, and electrical connections between the
electrically conductive pads 22A and 112A and between the
electrically conductive pads 22B and 112B may be established via
any conventional electrical connection structure or technique.
Examples of suitable flexible materials that may be used to
implement the substrate 110 in flexible form include, but are not
limited to, Melinex.RTM. polyester film (e.g., polyethylene
terephthalate), other polyesters such as Mylar.RTM., polyvinyl
chloride, electrically insulating plastic or polymeric materials
such as polycarbonates, polyurethanes, polyethers, polyimides, or
copolymers of thermoplastics, such as glycol-modified polyethylene
terephthalate, and/or other electrically non-conducting, flexible,
deformable materials. Examples of suitable rigid materials that may
be used to implement the substrate 110 in rigid form include, but
are not limited to, ceramics, such as aluminum oxide and silicon
dioxide, conventional printed circuit boards, conventional
multi-layer printed circuit boards, and the like. Combinations of
flexible and non-flexible materials are also contemplated.
[0066] The substrate 110 also defines a number of electrically
conductive pads on the top surface thereof, at least some of which
are electrically connected to corresponding electrically conductive
pads defined on the bottom surface of the substrate 110, and one or
more of which align with a corresponding one or more electrically
conductive pads defined on the bottom surface of the electrical
circuit 132 when the electrical circuit 132 is mounted to the
substrate 110. In the illustrated embodiment, for example, a pair
of electrically conductive pads 114A and 114B are defined on the
top surface of the substrate 110. The electrically conductive pad
11 4A defined on the top surface of the substrate 110 is
electrically connected to the electrically conductive pad 112A
defined on the bottom surface of the substrate 110 by an electrical
conductor or electrically conductive trace 116A, and the
electrically conductive pad 114B defined on the top surface of the
substrate 110 is likewise electrically connected to the
electrically conductive pad 112B defined on the bottom surface of
the substrate 110 by an electrical conductor or electrically
conductive trace 116B. The electrical conductors or electrically
conductive traces 116A and 116B may be formed using conventional
electrical connection technology, examples of which include, but
are not limited to, plated-though hole technology, using multiple
layers of conductors interconnected by vias, wrapping electrically
conductive circuit traces around the substrate from the top surface
to the bottom surface, and the like.
[0067] In the illustrated embodiment, the electrical circuit 132
defines a pair of electrically conductive terminals in the form of
electrically conductive pads 134A and 134B on the bottom surface
thereof, which align with, and are juxtaposed over, corresponding
ones of the electrically conductive pads 114A and 114B defined on
the top surface of the substrate 110 when the electrical circuit
132 is mounted to the substrate 110. In one embodiment, as
illustrated in FIG. 11A, the electrical circuit 132 is attached to
the substrate 110 via a conventional attachment medium 124,
examples of which include, but are not limited to, conventional
epoxies or other formable or settable mediums, conventional
adhesives including adhesive tapes, or the like. Electrical
connection between the electrically conductive terminals 134A and
134B and the corresponding electrically conductive pads 114A and
114B respectively is made using conventional electrical
interconnection techniques. Examples of such electrical
interconnection techniques include, but are not limited to, curable
solder paste, solder bumps, electrically conductive adhesive, an
electrically conductive formable medium such as an electrically
conductive resin, or the like. In the illustrated embodiment, the
electrical connection is shown as taking the form of a formable
metal 126, e.g., solder, that forms an electrical and mechanical
bond to the electrically conductive pad 134B and to the
electrically conductive pad 114B. In some embodiments, this
mechanical connection may serve also as the mechanical attachment
mechanism for mounting the electrical circuit 132 to the substrate
110. In an alternate embodiment, as illustrated in FIG. 11B, the
electrical circuit 132 is attached to the substrate 110 via an
anisotropic electrically conductive medium 130, which may be
identical to the anisotropic electrically conductive medium 30
described hereinabove with respect to FIGS. 1-3. In this
embodiment, the anisotropic medium 130 also establishes local
electrical connections between the electrically conductive pads
134A and 114A and between the electrically conductive pads 134B and
114B as described hereinabove.
[0068] The electrical circuit 132 may take any of the forms
described hereinabove with respect to the description of the
electrical circuit 32, and may be configured as described
hereinabove to communicate with a remote electronic device 50. The
device 50 may also be configured to communicate with an auxiliary
electronic device 62. Details of the remote electronic device 50,
the auxiliary electronic device 62 and operation thereof are
provided hereinabove.
[0069] In one embodiment, as illustrated in FIG. 12, for example,
the sensor operating circuit 40 is mounted to a top surface of a
flexible or rigid substrate 133 that is attached to the substrate
110 as described hereinabove with respect to FIGS. 11A or 11B. The
sensor operating circuit 40 has a first input that is electrically
connected to the electrically conductive pad 134A via an electrical
conductor or electrically conductive trace 138A, and a second input
that is electrically connected to the electrically conductive pad
134B via an electrical conductor or electrically conductive trace
138B. Optionally, a telemetry circuit 44, an event notification
circuit 46 and/or an acknowledge circuit 48 may also be mounted to
the substrate 133 and electrically interconnected as described
hereinabove. In this embodiment, the sensor operating circuit 40,
and optionally any one or more of the telemetry circuit 44, the
event notification circuit 46 and the acknowledgement circuit 48,
is mounted to a top side of the substrate 133, and the one or more
electrical terminals defined on the bottom surface of the substrate
133 are electrically connected to corresponding electrical
terminals or circuit traces defined on the top side of the
substrate 33 in a conventional manner. This is illustrated in FIGS.
11A and 11B where the electrical terminal 134B defined on the
bottom surface of the sensor control circuit 32 is electrically
connected via an electrical conductor 135 to an electrical terminal
134B' defined on the top surface of the sensor control circuit 32.
The two electrical terminals 134B and 134B' may be electrically
connected using conventional techniques including, for example, but
not limited to, plated-though hole technology, using multiple
layers of conductors interconnected by vias, wrapping electrically
conductive circuit traces around the substrate from the top surface
to the bottom surface, and the like.
[0070] In an alternative embodiment, as illustrated in FIG. 13, for
example, a portion 132' of the electrical circuit 132 may be
mounted to a modified substrate 133' that is itself attached to a
modified substrate 110', and a remainder of the electrical circuit
132 may be mounted to and carried by the substrate 110'. In the
illustrated embodiment, for example, the telemetry circuit 44 is
shown as being mounted to and carried by the substrate 110' while a
remainder 132' of the sensor control circuitry 40, 42, 46 and 48 is
mounted to the substrate 133'. It will be understood that in this
embodiment, any one or more of the sensor control circuit
components may be mounted to the substrate 110', and that the
telemetry circuit 44 is shown mounted to the substrate 110' only by
way of example. In any case, any portion of the sensor control
circuit 132 that is mounted to the substrate 110' is electrically
connected to a remainder of the sensor control circuit 132' that is
mounted to the substrate 133' using conventional electrical
connection structures and techniques. In the illustrated
embodiment, for example, the substrate 110' is modified, relative
to the substrate 110 of FIG. 12, to define an electrically
conductive pad 114C on a top side of thereof that is electrically
connected to the telemetry circuit 44 via an electrically
conductive trace 116C. The substrate 133' is likewise modified,
relative to the substrate 133, to define an electrically conductive
pad 134C on the bottom surface thereof that is electrically
connected to an input of the sensor operating circuit 40 via an
electrically conductive trace 138C. The electrically conductive
pads 114C and 134C are electrically connected together as described
hereinabove with respect to FIGS. 11A or 11B. In the embodiment
illustrated in FIG. 13, the electrically conductive pads 112A and
112B defined on the bottom surface of the substrate 110' are shown
offset from the center of the substrate 110' to illustrate that the
electrically conductive pads may be defined anywhere on the bottom
surface of the substrate 110', and this is generally true of any of
the electrically conductive pads and/or electrical terminals
illustrated and described herein.
[0071] In another alternative embodiment, as illustrated in FIG.
14, for example, a portion 132' of the electrical circuit 132 may
again be mounted to another modified substrate 133'' that is itself
attached to another modified substrate 110'', and a remainder of
the electrical circuit 132 may be mounted to and carried by the
substrate 110''. In the illustrated embodiment, for example, the
acknowledge circuit 48 is shown as being mounted to and carried by
the substrate 110'' while a remainder 132' of the sensor control
circuitry 40, 42, 44 and 48 is mounted to the substrate 133''. It
will be understood that in this embodiment, any one or more of the
sensor control circuit components may be mounted to the substrate
110'', and that the acknowledge circuit 48 is shown mounted to the
substrate 110'' only by way of example.
[0072] The substrate 110'' is modified, relative to the substrates
110 and 110' of FIGS. 12 and 13 respectively, to define a number of
electrically conductive terminals 114A', 114B' and 114C' in place
of the electrically conductive pads 114A, 114B and 114C, that may
or may not be implemented in the form of electrically conductive
pads, that may be defined on the top or bottom surface of the
substrate 110'' and that may or may not align with corresponding
electrical terminals defined on the modified substrate 133''. The
electrical terminal 114A' is electrically connected to the
electrically conductive pad 112A via the circuit trace 116A, the
electrical terminal 114B' is electrically connected to the
electrically conductive pad 112B via the circuit trace 116B, and
the electrical terminal 114C' is electrically connected to the
acknowledge circuit 48 via the circuit trace 116C. The substrate
133'' is likewise modified to define a number of electrically
conductive terminals 134A', 134B' and 134C' in place of the
electrically conductive pads 134A, 134B and 134C, that may or may
not be implemented in the form of electrically conductive pads,
that may be defined on the top or bottom surface of the substrate
133'' and that may or may not align with corresponding electrical
terminals defined on the modified substrate 110''. The electrical
terminals 134A', 134B' and 134C' are electrically connected to
separate inputs of the sensor operating circuit 40.
[0073] In the embodiment illustrated in FIG. 14, the electrical
terminals 114A', 114B' and 114C' defined on the substrate 110' are
electrically connected to corresponding ones of the electrical
terminals 134A', 134B' and 134C' defined on the substrate 133'
using electrical connection structures and techniques including,
for example, but not limited to, various soldering techniques,
clamping techniques and the like. In any of the embodiments
illustrated in FIGS. 12-14, examples of suitable flexible materials
that may be used to implement the substrates 110,110', 110'',
133,133' and 133'' in flexible form include, but are not limited
to, Melinex.RTM. polyester film (e.g., polyethylene terephthalate),
other polyesters such as Mylar.RTM., polyvinyl chloride,
electrically insulating plastic or polymeric materials such as
polycarbonates, polyurethanes, polyethers, polyimides, or
copolymers of thermoplastics, such as glycol-modified polyethylene
terephthalate, and/or other electrically non-conducting, flexible,
deformable materials. Examples of suitable rigid materials that may
be used to implement the substrates 110,110', 110'', 133,133' and
133'' in rigid form include, but are not limited to, ceramics, such
as aluminum oxide and silicon dioxide, conventional printed circuit
boards, conventional multi-layer printed circuit boards, and the
like. Combinations of flexible and non-flexible materials are also
contemplated.
[0074] In an alternative embodiment, as another example, the
telemetry circuit 44 may be mounted to and carried by the substrate
133 or 133' while the remainder 132' of the sensor control
circuitry 40, 43, 44 and/or 46 is mounted to and carried by the
substrate 110,110' or 110''. In this embodiment, the telemetry
circuit 44 is electrically connected to a remainder of the sensor
control circuit 132' that is mounted to the substrate 110, 110' or
110'' using conventional electrical connection structures and
techniques of the type just described.
[0075] While the invention has been illustrated and described in
detail in the foregoing drawings and description, the same is to be
considered as illustrative and not restrictive in character, it
being understood that only illustrative embodiments thereof have
been shown and described and that all changes and modifications
that come within the spirit of the invention are desired to be
protected.
* * * * *