U.S. patent application number 12/166172 was filed with the patent office on 2008-10-30 for high density power distribution unit.
This patent application is currently assigned to Emerson Network Power - Embedded Computing, Inc.. Invention is credited to Irena Borucki, John H. Kelly, Naufel C. Naufel, Eugene R. Pilat, Markus Tegethoff.
Application Number | 20080266759 12/166172 |
Document ID | / |
Family ID | 37073909 |
Filed Date | 2008-10-30 |
United States Patent
Application |
20080266759 |
Kind Code |
A1 |
Kelly; John H. ; et
al. |
October 30, 2008 |
HIGH DENSITY POWER DISTRIBUTION UNIT
Abstract
A power distribution unit may include a power distribution unit
frame, where the power distribution unit frame has a 2U form
factor, and where the power distribution unit frame is coupled to
mount in an embedded computer frame. A plurality of power ingress
sites may be coupled to a rear portion of the power distribution
unit frame, where each of the plurality of power ingress sites has
a current capacity of at least 100 amperes, where each of the
plurality of power ingress sites includes an ingress pin coupled to
interface with an ingress in-line, hyperboloid radial socket, and
where the power distribution unit has a current capacity density of
the plurality of power ingress sites of at least 600 amperes per
power distribution unit.
Inventors: |
Kelly; John H.; (Phoenix,
AZ) ; Naufel; Naufel C.; (Tempe, AZ) ;
Borucki; Irena; (Mount Prospect, IL) ; Pilat; Eugene
R.; (Barrington, IL) ; Tegethoff; Markus;
(Algonquin, IL) |
Correspondence
Address: |
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 828
BLOOMFIELD HILLS
MI
48303
US
|
Assignee: |
Emerson Network Power - Embedded
Computing, Inc.
Madison
WI
|
Family ID: |
37073909 |
Appl. No.: |
12/166172 |
Filed: |
July 1, 2008 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
11093628 |
Mar 30, 2005 |
7394667 |
|
|
12166172 |
|
|
|
|
Current U.S.
Class: |
361/627 |
Current CPC
Class: |
G06F 1/189 20130101;
H05K 7/1492 20130101 |
Class at
Publication: |
361/627 |
International
Class: |
H02B 1/01 20060101
H02B001/01 |
Claims
1. A method of supplying power to an embedded computer frame,
comprising: providing a power distribution unit frame, wherein the
power distribution unit frame has a 2U form factor, and wherein the
power distribution unit frame is coupled to mount in the embedded
computer frame; and providing a plurality of power ingress sites
coupled to a rear portion of the power distribution unit frame,
wherein each of the plurality of power ingress sites has a current
capacity of at least one hundred amperes, wherein each of the
plurality of power ingress sites includes an ingress pin coupled to
interface with an ingress in-line, hyperboloid radial socket, and
wherein the power distribution unit has a current capacity density
of the plurality of power ingress sites of at least six hundred
amperes per power distribution unit.
2. The method of claim 1, further comprising providing a plurality
of power egress sites coupled to the rear portion, wherein at least
a portion of the plurality of power egress sites has a current
capacity of at least 100 amperes, and wherein each of the portion
of the plurality of power egress sites includes an egress pin
coupled to interface with an egress in-line, hyperboloid radial
socket.
3. The method of claim 3 further comprising: providing a computing
blade coupled to the embedded computer frame; and at least one of
the plurality of power egress sites providing power to the
computing blade, wherein the computing blade requires at least 200
Watts.
4. The method of claim 1, further comprising the power distribution
unit providing power to an AdvancedTCA.TM. embedded computer
frame.
5. The method of claim 1, further comprising interposing at least
one circuit breaker site between a power ingress site and a power
egress site.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a division of U.S. patent application
Ser. No. 11/093,628 filed on Mar. 30, 2005. The disclosure of the
above application is incorporated herein by reference.
RELATED APPLICATIONS
[0002] Related subject matter is disclosed in U.S. patent
application entitled "METHOD OF MONITORING A POWER DISTRIBUTION
UNIT" having application Ser. No. 11/093,855 and filed on Mar. 30,
2005 and assigned to the same assignee.
BACKGROUND
[0003] Prior art power distribution units for rack-mounted embedded
computer systems are limited, due to spatial constraints, in the
power they can supply to individual computing blades. For example,
the number of circuit breakers and power connections to a prior art
power distribution unit is limited by the projected area of the
front or rear portions. Further, the limited space in the rear of
the power distribution unit prevents the use of larger connectors
required of higher-powered inputs and outputs.
[0004] There is a need, not met in the prior art, for a high power
density power distribution unit. Accordingly, there is a
significant need for an apparatus and method that overcomes the
deficiencies of the prior art outlined above.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] Representative elements, operational features, applications
and/or advantages reside inter alia in the details of construction
and operation as more fully hereafter depicted, described and
claimed--reference being made to the accompanying drawings forming
a part hereof, wherein like numerals refer to like parts
throughout. Other elements, operational features, applications
and/or advantages will become apparent in light of certain
exemplary embodiments recited in the Detailed Description,
wherein:
[0006] FIG. 1 representatively illustrates embedded computer system
in accordance with an exemplary embodiment;
[0007] FIG. 2 representatively illustrates a power distribution
unit in accordance with an exemplary embodiment; and
[0008] FIG. 3 representatively illustrates a power distribution
unit in accordance with an exemplary embodiment.
[0009] Elements in the Figures are illustrated for simplicity and
clarity and have not necessarily been drawn to scale. For example,
the dimensions of some of the elements in the Figures may be
exaggerated relative to other elements to help improve
understanding of various embodiments. Furthermore, the terms
"first", "second", and the like herein, if any, are used inter alia
for distinguishing between similar elements and not necessarily for
describing a sequential or chronological order. Moreover, the terms
"front", "back", "top", "bottom", "over", "under", and the like in
the Description and/or in the Claims, if any, are generally
employed for descriptive purposes and not necessarily for
comprehensively describing exclusive relative position. Any of the
preceding terms so used may be interchanged under appropriate
circumstances such that various embodiments described herein may be
capable of operation in other configurations and/or orientations
than those explicitly illustrated or otherwise described.
DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS
[0010] The following representative descriptions generally relate
to exemplary embodiments and the inventor's conception of the best
mode, and are not intended to limit the applicability or
configuration of the disclosure in any way. Rather, the following
description is intended to provide convenient illustrations for
implementing various embodiments. As will become apparent, changes
may be made in the function and/or arrangement of any of the
elements described in the disclosed exemplary embodiments without
departing from the spirit and scope of the disclosure.
[0011] A detailed description of an exemplary application, namely a
dynamically configurable, high power density power distribution
unit, is provided as a specific enabling disclosure that may be
generalized to any application of the disclosed system, in
accordance with various embodiments.
[0012] FIG. 1 representatively illustrates embedded computer system
100 in accordance with an exemplary embodiment. As shown in FIG. 1,
embedded computer system 100 may include an embedded computer frame
102, backplane 104, shelf 109 with software and a plurality of
slots for inserting computing blade 108, power distribution units
106, and the like. Backplane 104 may be used for coupling blades
placed in plurality of slots and power distribution.
[0013] In an embodiment, a computing blade 108 may comprise a
switch blade, payload blade, and the like, coupled to any number of
other computing blades via backplane 104. Backplane 104 may
accommodate any combination of a packet switched backplane
including a distributed switched fabric or a multi-drop bus type
backplane. Backplanes may support AdvancedTCA.TM., CompactPCI.RTM.,
CompactTCA.TM., and the like. Computing blade 108 may add
functionality to embedded computer system 100 through the addition
of processors, memory, storage devices, I/O elements, and the like.
In other words, a computing blade 108 may include any combination
of processors, memory, storage devices, I/O elements, and the like,
to give embedded computer system 100 any functionality desired by a
user. In the embodiment shown, there are sixteen slots to
accommodate any combination of power distribution units 106 and
computing blades 108. However, an embedded computer frame 102 with
any number of shelves 109 or slots may be included in the scope of
the disclosure.
[0014] In an embodiment, embedded computer system 100 can use a
switch blade as a central switching hub with any number of payload
blades coupled to the switch blade. Embedded computer system 100
may support a point-to-point, switched input/output (I/O) fabric.
Embedded computer system 100 may include both node-to-node (for
example computer systems that support I/O node add-in slots) and
chassis-to-chassis environments (for example interconnecting
computers, external storage systems, external Local Area Network
(LAN) and Wide Area Network (WAN) access devices in a data-center
environment). Embedded computer system 100 may be implemented by
using one or more of a plurality of switched fabric network
standards, for example and without limitation, InfiniBand.TM.,
Serial RapidIO.TM., Ethernet.TM., AdvancedTCA.TM., CompactPCI.RTM.,
CompactTCA.TM., PCI Express.TM., and the like. Embedded computer
system 100 is not limited to the use of these switched fabric
network standards and the use of any switched fabric network
standard is within the scope of the disclosure.
[0015] In one embodiment, backplane 104 can be an embedded packet
switched backplane as is known in the art. In another embodiment,
backplane 104 can be an overlay packet switched backplane that is
overlaid on top of a backplane that does not have packet switched
capability. In any embodiment, computing blades 108 may communicate
with each other via a plurality of links, for example and without
limitation, 100-ohm differential signaling pairs.
[0016] In an embodiment, embedded computer frame 102, shelf 109 and
backplane 104 can use the CompactPCI (CPCI) Serial Mesh Backplane
(CSMB) standard as set forth in PCI Industrial Computer
Manufacturers Group (PICMG.RTM.) specification 2.20, promulgated by
PICMG.RTM., 301 Edgewater Place, Suite 220, Wakefield, Mass. CSMB
provides infrastructure for applications such as Ethernet, Serial
RapidIO, other proprietary or consortium based transport protocols,
and the like. In another embodiment embedded computer frame 102 can
use an Advanced Telecom and Computing Architecture (ATCA.TM.)
standard as set forth by PICMG.RTM.. The embodiment is not limited
to the use of these standards, and the use of other standards is
within the scope of the disclosure.
[0017] In an embodiment, embedded computer frame 102 and/or shelf
109 may provide redundancy in the slot configuration by providing
that each slot has a corresponding slot such that computing blade
108 has a corresponding computing blade in a corresponding slot.
For example, if computing blade 108 were to cease to function, a
corresponding computing blade may assume the functions of computing
blade 108 without interruption of service. This redundancy may hold
for both switch blades and payload blades and provides embedded
computer frame 102 with greater reliability.
[0018] In an embodiment, embedded computer frame 102 may be fed
power by two or more redundant power supplies, for example power
feed A and power feed B. The redundant power supplies may be passed
through power distribution unit 106 to distribute power to shelves
109 and computing blades 108.
[0019] FIG. 2 representatively illustrates a power distribution
unit 206 in accordance with an exemplary embodiment. In an
embodiment, power distribution unit 206 may provide power to
embedded computer frame 102 and computing blades 108 as shown and
described in FIG. 1. Power distribution unit 206 may be modular
within embedded computer frame 102 and coupled to receive power
from an outside source and distribute it to any number of computing
blades 108 in embedded computer frame 102.
[0020] As shown in FIG. 2, power distribution unit (PDU) 206 may
include power distribution unit frame 210 coupled to include a
front portion 217 and a rear portion 220. Front portion 217 may be
coupled to include any number of circuit breakers 216, each coupled
to a circuit breaker connection site 214.
[0021] Power distribution unit frame 210 may also include power
ingress and egress sites located on rear portion 220. In an
embodiment, circuit breaker connection site 214 is interposed
between a power ingress site and a power egress site.
[0022] Power coming into power distribution unit 206 may be
distributed to circuit breaker connection sites 214 by any number
of bus bars 211. After passing through a circuit breaker 216, power
may exit the power distribution unit 206 to be distributed to any
number of computing blades through power cabling 209.
[0023] In an embodiment, power distribution unit 206 may include
alarm module 218, which may function to monitor power distribution
unit 206 and the status of power being distributed by power
distribution unit 206. In an embodiment, alarm module 218 may also
monitor the status of computing blades being supplied by power
distribution unit 206. In another embodiment, alarm module 218 may
function to alert, locally and/or remotely, a system administrator
of any of a set of alert conditions monitored. Alarm module 218 may
be any combination of hardware, software, and the like, including
software running on hardware. Although alarm module 218 is shown as
being contained in power distribution unit frame 210, alarm module
may be distributed among any number of entities, including power
distribution unit 206 and be within the scope of the
disclosure.
[0024] In an embodiment, power distribution unit frame 210 may have
a frontal elevation dimension that may be characterized as a form
factor 212. In an embodiment, the form factor 212 may include,
substantially, the frontal elevation dimension. Embedded computer
frame 102 may be designed to accommodate a power distribution unit
frame 210 having a given form factor 212. In an exemplary
embodiment, power distribution unit frame 210 may have a 2U form
factor. As is known in the art, "U" and multiples of "U" can refer
to the height of a module or blade. In an embodiment, "U" can
measure approximately 1.75 inches. Although power distribution unit
frame 210 is shown in a horizontal configuration, this is not
limiting of the disclosure. Power distribution unit frame 210 may
be in a vertical configuration, with form factor 212 being the
width of power distribution unit frame 210, and be within the scope
of the disclosure.
[0025] In an embodiment, power distribution unit frame 210 may have
a frontal length 213. The frontal length may be chosen by a systems
designer, and may correspond to one of several industry standard
frontal lengths. For example, a frontal length 213 of substantially
19'', 23'' and 600 mm are well known. Other frontal lengths are
within the scope of the disclosure. In an embodiment, the frontal
length 213 may be smaller than that accepted by an embedded
computer frame 102. In this embodiment, power distribution unit
frame 210 may include an adaptor module 215 on one or both ends.
Adaptor module 215 may function to allow a power distribution unit
frame 210 with a smaller frontal length to interface with an
embedded computer frame 102 designed to accept a power distribution
unit frame with a larger frontal length. Although power
distribution unit frame 210 is shown in a horizontal configuration,
this is not limiting of the disclosure. Power distribution unit
frame 210 may be in a vertical configuration, with frontal length
213 being the height of power distribution unit frame 210, and be
within the scope of the disclosure.
[0026] FIG. 3 representatively illustrates a power distribution
unit 306 in accordance with an exemplary embodiment. In the
embodiment shown in FIG. 3, power distribution unit 306 has a 2U
form factor 312.
[0027] Rear portion 320 of power distribution unit frame 310 may
include a plurality of power ingress sites 330 where power may
enter power distribution unit 306. Each of plurality of power
ingress sites 330 may include an ingress pin 332 coupled to
interface with an ingress, in-line hyperboloid radial socket 334.
In an exemplary embodiment, each power ingress site 330 may include
two ingress pins 332, a power input pin and a return pin. Each
ingress pin 332 is coupled to interface with an ingress, in-line
hyperboloid radial socket 334.
[0028] In an embodiment, ingress, in-line hyperboloid radial socket
334 may be comprised of multiple contacting elements that are
hyperbolically arrayed around the inner diameter of the socket.
Each of the contact elements may be skewed with respect to the
axial direction of the socket. When the ingress pin 332 is coupled
with the socket, the contacting elements mechanically wrap around
the ingress pin providing a normal force for a positive mechanical
and electrical connection. Coupling ingress, in-line hyperboloid
radial socket 334 to ingress pin 332 does not require mechanical
fasteners. An example of an embodiment of an ingress, in-line
hyperboloid radial socket 334 is the RADSOK.RTM. connector as
described in the "RADSOK.RTM. High Amperage Electrical Terminals,
Technical Brief" May 2001.
[0029] Ingress, in-line hyperboloid radial socket 334 may be
coupled to ingress power conductor 336, wherein ingress power
conductor 336 is coupled to bring power to power distribution unit
306. Radial socket 334 has an in-line configuration such that the
axial direction of both the radial socket 334 and the ingress power
conductor 336 are in substantially the same direction. This is as
opposed to a non-in-line radial socket where the axial direction of
the radial socket 334 and an ingress power conductor 336 are offset
substantially ninety degrees with respect to each other.
[0030] The in-line configuration of radial socket 334 allows more
power ingress sites 330 in the limited space defined by a
projection of the rear portion 320 of power distribution unit 306.
This also allows for a greater current capacity density of the
power distribution unit 306 and plurality of power ingress sites
330, which may be defined as the amount of current input through
the rear portion 320 of a power distribution unit 306.
[0031] In an embodiment, each of power ingress sites 330 may have a
current capacity of at least one hundred amperes. That is to say,
each power ingress site 330 is capable of conducting at least one
hundred amperes into power distribution unit 306. In an embodiment,
power distribution unit 306 may have at least six power ingress
sites 330, giving the power distribution unit 306 and plurality of
power ingress sites 330 a current capacity density of at least six
hundred amperes.
[0032] Rear portion 320 of power distribution unit frame 310 may
include a plurality of power egress sites 340 where power may exit
power distribution unit 306. Each of plurality of power egress
sites 340 may include an egress pin 342 coupled to interface with
an egress, in-line hyperboloid radial socket 344. In an exemplary
embodiment, each power egress site 340 may include two egress pins
342, a power output pin and a return pin. Each egress pin 342 is
coupled to interface with an egress, in-line hyperboloid radial
socket 344.
[0033] In an embodiment, egress, in-line hyperboloid radial socket
344 may be comprised of multiple contacting elements that are
hyperbolically arrayed around the inner diameter of the socket.
Each of the contact elements may be skewed with respect to the
axial direction of the socket. When the egress pin 342 is coupled
with the socket, the contacting elements mechanically wrap around
the egress pin providing a normal force for a positive mechanical
and electrical connection. Coupling egress, in-line hyperboloid
radial socket 344 to egress pin 342 does not require mechanical
fasteners. An example of an embodiment of an egress, in-line
hyperboloid radial socket 344 is the RADSOK.RTM.connector as
described in the "RADSOKO.RTM. High Amperage Electrical Terminals,
Technical Brief" May 2001.
[0034] Egress, in-line hyperboloid radial socket 344 may be coupled
to egress power conductor 346, wherein egress power conductor 346
is coupled to distribute power from power distribution unit 306 to
any number of computing blades. Radial socket 344 has an in-line
configuration such that the axial direction of both the radial
socket 344 and the egress power conductor 346 are in substantially
the same direction. This is as opposed to a non-in-line radial
socket where the axial direction of the radial socket 344 and an
egress power conductor 346 are offset substantially ninety degrees
with respect to each other.
[0035] The in-line configuration of radial socket 344 allows more
power egress sites 340 in the limited space defined by a projection
of the rear portion 320 of power distribution unit 306. This also
allows for a greater current capacity density of the power
distribution unit 306 and plurality of power egress sites 340,
which may be defined as the amount of current output through the
rear portion 320 of a power distribution unit 306.
[0036] In an embodiment, at least a portion of the plurality of
power egress sites 340 may have a current capacity of at least one
hundred amperes. That is to say, at least a portion of the
plurality of power egress site 340 is capable of conducting at
least one hundred amperes out of power distribution unit 306. In an
embodiment, power distribution unit 306 may have at least ten power
egress sites 340. In an embodiment, a power egress site 340 may
supply power to a computing blade requiring at least two hundred
Watts.
[0037] In the foregoing specification, the disclosure has been
described with reference to specific exemplary embodiments;
however, it will be appreciated that various modifications and
changes may be made without departing from the scope of the present
disclosure as set forth in the claims below. The specification and
figures are to be regarded in an illustrative manner, rather than a
restrictive one and all such modifications are intended to be
included within the scope of the present disclosure. Accordingly,
the scope of the disclosure should be determined by the claims
appended hereto and their legal equivalents rather than by merely
the examples described above.
[0038] For example, the steps recited in any method or process
claims may be executed in any order and are not limited to the
specific order presented in the claims. Additionally, the
components and/or elements recited in any apparatus claims may be
assembled or otherwise operationally configured in a variety of
permutations to produce substantially the same result as the
present disclosure and are accordingly not limited to the specific
configuration recited in the claims.
[0039] Benefits, other advantages and solutions to problems have
been described above with regard to particular embodiments;
however, any benefit, advantage, solution to problem or any element
that may cause any particular benefit, advantage or solution to
occur or to become more pronounced are not to be construed as
critical, required or essential features or components of any or
all the claims.
[0040] As used herein, the terms "comprise", "comprises",
"comprising", "having", "including", "includes" or any variation
thereof, are intended to reference a non-exclusive inclusion, such
that a process, method, article, composition or apparatus that
comprises a list of elements does not include only those elements
recited, but may also include other elements not expressly listed
or inherent to such process, method, article, composition or
apparatus. Other combinations and/or modifications of the
above-described structures, arrangements, applications,
proportions, elements, materials or components used in the practice
of the present disclosure, in addition to those not specifically
recited, may be varied or otherwise particularly adapted to
specific environments, manufacturing specifications, design
parameters or other operating requirements without departing from
the general principles of the same.
* * * * *