U.S. patent application number 11/899731 was filed with the patent office on 2008-10-16 for device having a casing containing a potting material for transmitting signals between electronic components.
Invention is credited to Harbans Dhadwal, Jahangir S. Rastegar, Thomas Spinelli.
Application Number | 20080253774 11/899731 |
Document ID | / |
Family ID | 34135782 |
Filed Date | 2008-10-16 |
United States Patent
Application |
20080253774 |
Kind Code |
A1 |
Rastegar; Jahangir S. ; et
al. |
October 16, 2008 |
Device having a casing containing a potting material for
transmitting signals between electronic components
Abstract
A device including: at least two electronic/electrical
components; and a casing, the casing having at least a portion
thereof acting as a communication bus for connecting the at least
two electronic/electrical components.
Inventors: |
Rastegar; Jahangir S.;
(Stony Brook, NY) ; Dhadwal; Harbans; (Setauket,
NY) ; Spinelli; Thomas; (East Northport, NY) |
Correspondence
Address: |
Thomas Spinelli
2 Sipala Court
East Northport
NY
11731
US
|
Family ID: |
34135782 |
Appl. No.: |
11/899731 |
Filed: |
September 7, 2007 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10639001 |
Aug 12, 2003 |
7272293 |
|
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11899731 |
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Current U.S.
Class: |
398/142 |
Current CPC
Class: |
H04M 1/0202 20130101;
G06F 1/182 20130101; G02B 6/4298 20130101; H05K 1/0284 20130101;
H05K 2201/0999 20130101 |
Class at
Publication: |
398/142 |
International
Class: |
H04B 10/12 20060101
H04B010/12 |
Claims
1-41. (canceled)
38. A device comprising: a casing, at least a portion of which
contains a potting material; first and second electronic/electrical
components, at least one of which is at least partially disposed in
the potting material; a transmitter disposed on the first
electronic/electrical component for transmitting a signal from the
first electronic/electrical component and at least partially
through the potting material; and a receiver disposed on the second
electronic/electrical component for receiving the signal and
transmitting the signal or representative of the signal to the
second electronic/electrical component.
39. The device of claim 38, wherein the potting material is
selected from a group consisting of a solid, a gel, and a
liquid.
40. The device of claim 39, wherein the potting material is the
solid and the solid is an epoxy resin.
41. The device of claim 38, wherein the signal is an infrared
signal.
42. The device of claim 38, wherein the casing includes a window
through which an input signal is transmitted from an exterior of
the casing to at least one of the potting material, first
electronic/electrical component, and second electronic/electrical
component.
43-45. (canceled)
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates generally to devices, and more
particularly, to devices having a casing and/or interior that act
as a communication bus between at least two components of the
device. For purposes of this disclosure, a device is any article
having a casing which houses two or more electrical/electronic
components. Also for purposes of this disclosure, a communication
bus is anything that transmits one or more signals between two or
more components. Such transmission may be one-way or two-way. Thus,
the transmission may be a simple point-to-point link between two
components or a point to many links between several components.
Furthermore, the transmission may be such that the transmitted
signal(s) are available to any components on the communication bus.
Still further, the communication bus may be more than one media,
such as a waveguide, potting material, and/or free space in the
casing (including the casing itself).
[0003] 2. Prior Art
[0004] Electronic devices typically have a casing or shell in which
electronic/electrical components are housed. The
electronic/electrical (collectively referred to hereinafter as
"electronic" or "electronics") components interact with each other
and/or other devices via internal wiring (which includes printed
circuit boards). While the wiring has its advantages, it suffers
from certain disadvantages such as susceptibility to noise,
brittleness, potential for high bit error, takes up a large amount
of space in the interior of the casing or shell, can suffer from
poor connections, and may be susceptible to impact and shock. These
disadvantages are amplified in certain devices that house
electronic components and operate in harsh environments.
SUMMARY OF THE INVENTION
[0005] It is an object of the present invention to provide methods
and devices that overcome the disadvantages of the wiring used to
link components in devices having electronic components.
[0006] Accordingly, a device is provided which comprises: at least
two electronic/electrical components; and a casing, the casing
having at least a portion thereof acting as a communication bus for
connecting the at least two electronic/electrical components.
[0007] At least a portion of the casing can be an optical waveguide
where one of the at least two electronic/electrical components
comprises a transmitter operatively connected to the optical
waveguide for transmitting optical signals into the optical
waveguide, the other of the at least two electronic/electrical
components comprises a detector for detecting the optical signals
from the waveguide.
[0008] Alternatively, at least a portion of the casing can be an
ultrasonic waveguide where one of the at least two
electronic/electrical components comprises an ultrasonic generator
operatively connected to the ultrasonic waveguide for transmitting
ultrasound signals into the ultrasonic waveguide, the other of the
at least two electronic/electrical components comprises a detector
for detecting the ultrasonic signals from the waveguide.
[0009] The portion of the casing acting as a communication bus can
comprise a waveguide for transmitting signals between the at least
two electronic/electrical components. The waveguide can comprise an
entirety of the casing. Alternatively, the casing can comprise an
outer portion where the waveguide is formed on an inner surface of
the outer portion. The waveguide can be formed on a majority of the
inner surface of the outer portion. Alternatively, the waveguide
can be formed in one or more strips on the inner surface of the
outer portion. At least one of the one or more strips can be formed
in a channel on the inner surface of the outer portion.
[0010] Where at least a portion of the casing is an optical
waveguide, at least one of the at least two electronic/electrical
components comprises a transmitter operatively connected to the
waveguide for transmitting at least one signal through the
waveguide. Alternatively, at least one of the at least two
electronic/electrical components comprises a detector operatively
connected to the waveguide for detecting the at least one
signal.
[0011] The device can further comprise means for directly adhering
at least one of the at least two electronic/electrical components
to the waveguide. Where the waveguide is an optical waveguide, the
means for directly adhering can comprise an optical quality
adhesive for adhering the one of the at least two
electronic/electrical components directly to the waveguide.
Alternatively, the device can further comprise fastening means for
mechanically fastening at least one of the at least two
electronic/electrical components on the waveguide. The fastening
means can comprise a bracket having the at least one of the at
least two electronic/electrical components fastened to a first
portion and the waveguide fastened to another portion.
[0012] Also provided is a device comprising: means for housing at
least two internal electronic/electrical components; and means for
communicating a signal between the at least two internal
electronic/electrical components through at least a portion of the
means for housing the at least two internal electronic/electrical
components.
[0013] Still provided is a device comprising: a casing for holding
two or more electronic/electrical components; and a communication
bus formed at least in part by the casing; wherein the two or more
electrical/electronic components are operatively connected to the
communication bus and capable of transmitting and detecting a
signal on the communication bus.
[0014] Still provided is a method for communicating a signal
between two or more electronic/electrical components in a device
having a casing. The method comprising: providing the casing with
at least a portion acting as a communication bus; and operatively
connecting the two or more electronic/electrical components to the
communication bus.
[0015] The method can further comprise transmitting a signal on the
communication bus for detection by at least one of the two or more
electronic/electrical components. The transmitting can comprise
transmitting an optical or ultrasound signal on the communication
bus.
[0016] The providing can comprise fabricating at least a portion of
the casing from a material that acts as the communication bus.
[0017] The operatively connecting can comprise adhering at least
one of the two or more electronic/electrical components to the at
least a portion of the casing acting as a communication bus.
Alternatively, the operatively connecting comprises fastening at
least one of the two or more electronic/electrical components to
the at least a portion of the casing acting as a communication
bus.
[0018] Still provided is a computer comprising: a casing, at least
a portion of which has a communication bus formed therein; and two
or more components operatively connected to the communication bus
for at least one of transmitting and detecting a signal on the
communication bus. At least one of the two or more components can
be a transmitter for transmitting a signal on the communication
bus. At least one of the two or more components can be a detector
for detecting a signal transmitted on the communication bus.
[0019] Still provided is a cell phone comprising: a casing having
at least a display formed thereon, at least a portion of the casing
having a communication bus formed therein; and two or more
components operatively connected to the communication bus for at
least one of transmitting and detecting a signal on the
communication bus. At least one of the two or more components can
be a transmitter for transmitting a signal on the communication
bus. At least one of the two or more components can be a detector
for detecting a signal transmitted on the communication bus.
[0020] Still provided is a device comprising: a casing, the casing
having at least a portion thereof acting as a communication bus;
and a transmitter operatively connected to the communication bus
for transmitting a signal on the communication bus. The device can
further comprise a detector operatively connected to the
communication bus for detecting the signal on the communication
bus.
[0021] Still provided is a device comprising: a casing, the casing
having at least a portion thereof acting as a communication bus;
and a detector operatively connected to the communication bus for
detecting a signal on the communication bus. The device can further
comprise a transmitter operatively connected to the communication
bus for transmitting the signal on the communication bus.
[0022] Still provided is a device comprising: a casing; a
communication bus disposed in the casing; and a window formed on at
least a portion of the casing through which an input signal is
transmitted from an exterior of the casing to the communication
bus.
[0023] Still provided is a method for inputting a signal to an
interior of a device where the method comprises: inputting a signal
through at least a portion of a casing of the device; and
transmitting at least a portion of the signal to one of a
communication bus or internal component. The signal can be useful
for inputting data to the internal component.
[0024] Still provided is a device comprising: a casing, at least a
portion of which contains a potting material; first and second
electronic/electrical components, at least one of which is at least
partially disposed in the potting material; a transmitter disposed
on the first electronic/electrical component for transmitting a
signal from the first electronic/electrical component and at least
partially through the potting material; and a receiver disposed on
the second electronic/electrical component for receiving the signal
and transmitting the signal or representative of the signal to the
second electronic/electrical component.
[0025] The potting material can be selected from a group consisting
of a solid, a gel, and a liquid. Where the potting material is the
solid, the solid can be an epoxy resin. The signal can be an
infrared signal. The casing can include a window through which an
input signal is transmitted from an exterior of the casing to at
least one of the potting material, first electronic/electrical
component, and second electronic/electrical component.
[0026] Still provided is a method for communicating a signal
between first and second electronic/electrical components contained
in a casing of a device. The method comprising: encasing at least a
portion of one of the first and second electronic/electrical
components in a potting material in the casing; and transmitting
the signal at least partially through the potting material from the
first electronic/electrical component to the second
electronic/electrical component.
[0027] The method can further comprise inputting a signal through
at least a portion of the casing to at least one of the potting
material, first electronic/electrical component, and second
electronic/electrical component.
[0028] Still yet provided is a device comprising: a casing, at
least a portion of which contains a potting material; first and
second electronic/electrical components; a transmitter disposed on
the first electronic/electrical component for transmitting a
signal; and a receiver disposed on the second electronic/electrical
component for receiving the signal; wherein the signal is at least
partially transmitted through the potting material.
BRIEF DESCRIPTION OF THE DRAWINGS
[0029] These and other features, aspects, and advantages of the
apparatus and methods of the present invention will become better
understood with regard to the following description, appended
claims, and accompanying drawings where:
[0030] FIG. 1 illustrates a schematic view of a generic electronic
device having a casing nose and two or more electronic components
according to a first embodiment.
[0031] FIGS. 2A, 2B, and 2C illustrate sectional views of a wall of
the casing of FIG. 1 as taken along line 2-2 in FIG. 2, FIGS. 2A,
2B, and 2C representing three alternative wall/waveguide
configurations.
[0032] FIG. 3 illustrates a sectional view of a computer CPU casing
according to an embodiment.
[0033] FIG. 4 illustrates a partial sectional view of a cellular
telephone according to an embodiment.
[0034] FIG. 5 illustrates a partial sectional view of a cellular
telephone according to another embodiment of the present
invention.
[0035] FIG. 6 illustrates a schematic electrical diagram of an
infrared (IR) transceiver for use with the cellular telephone of
FIG. 5.
[0036] FIG. 7 illustrates a cellular telephone according to another
embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0037] Although the invention is particularly suited to optical
signal communication between electronic components, such is
discussed by way of example only. Those skilled in the art will
appreciate that other communication means can also be utilized,
such as ultrasound. Further, although a generic casing, computer
casing, and cellular phone casing are illustrated and discussed
herein, such are given by way of example only, those skilled in the
art will appreciate that the devices and methods of the present
invention can be utilized in any device having an interior which
houses at least two interconnected electronic components.
[0038] Referring now to FIG. 1, there is shown a generic device
generally referred to by reference numeral 100. The generic device
100 has a casing 102 that defines an interior 104. The casing 102
preferably has a metal, plastic, or composite outer portion 106 and
a communication bus, such as waveguide portion 108. The casing 102
is shown generically as rectangular in shape, however, those
skilled in the art will appreciate that it may have any shape.
Furthermore, the casing 102 is shown having a two-piece
construction, upper shell 106a and lower platform 106b joined
together with screws 107. However, those skilled in the art will
appreciate that the casing 102 can be constructed from one or more
pieces, and if more than one piece, the pieces can be joined or
fastened in any manner known in the art, such as by welding,
gluing, riveting, or with interference or snaps.
[0039] The waveguide portion 108 is preferably optical glass having
appropriate cladding as is known in the art. However, the waveguide
portion 108 can also be a synthetic material, such as an acrylic,
polycarbonate, or epoxy. The inner waveguide material can be formed
on the casing 102 by any methods known in the art, such as by
casting, machining, or depositing. The waveguide portion 108 can be
disposed on the entire inner surface of the outer portion 106 of
the casing 102 (or a portion thereof) as shown in FIG. 2A.
Alternatively, the waveguide portion 108 can be arranged in strips
117, formed on the outer portion 106 of the casing 102 as is shown
in FIG. 2C, or in channels 111 formed in the outer portion 106 of
the casing 102 as is shown in FIG. 2B. Alternatively, the waveguide
portion 108 can make up the entire shell 102 (no outer portion 106
is used), which can be uncoated or have a coating, such as an
opaque paint.
[0040] At least one transmitter 110 is arranged on the waveguide
portion 108 or proximate thereto such that a signal 101, such as an
optical signal can be transmitted to the waveguide portion 108. The
transmitter 110 can be integral with a corresponding electronic
component 112 or connected thereto. At another location on the
waveguide portion 108 are located detectors 114 for detecting the
optical signals in the waveguide portion 108. Each detector 114 is
either integral with or connected to another electronic/electrical
component 116. Thus, those skilled in the art will appreciate that
any component can communicate with another component through the
waveguide portion 108, which acts as a communication bus. Of
course, each of the components can have both a transmitter 110 and
detector 114 such that a two-way communication can be achieved.
Furthermore, each of the transmitter and detector can itself be
considered a component operatively connected to the waveguide
portion 108 (communication bus). Although not shown, mutiplexers
and demultiplexers can be used such that certain components can
operate at selected frequencies and/or wavelengths and not
interfere with other components on the bus. Similarly, other
components known in the art for transmission of signals through a
waveguide can be used, such as an amplifier (not shown) for
amplifying a signal between components. The transmitters 110 and
detectors 114 can be mounted to the waveguide portion 108 directly
as is known in the art such as by an optical quality adhesive, as
shown in FIGS. 2A and 2C. Alternatively, the transmitter 110 and
detectors 114 can be mounted to the waveguide portion 108 or the
outer portion 106 of the casing 102 by mechanical means, such as a
bracket 113 and screws 115 as is shown in FIG. 2B. Also, the
transmitters and detectors can be both adhered and mechanically
fastened to the waveguide portion 108. As another alternative, the
components can be connected to the waveguide portion 108 by optical
fibers (not shown) or the like.
[0041] Those skilled in the art will appreciate that the interior
104 is not cluttered with components and internal wiring resulting
in more components being able to occupy a given interior size or
the device 100 being made smaller than a conventional device having
the same number of internal components. In the device shown in FIG.
1, portion 104a of the interior 104 can be used to house additional
components or the device can be reduced in size to eliminate
portion 104a or a portion thereof. Other advantages include:
[0042] The optical transmission provides robust, interference free
channels between physically disconnected components/systems;
[0043] The optical transmission is naturally resistant to very high
g-loads and harsh environments;
[0044] For shorter distances between the transmitter and receiver,
the system is inexpensive and extremely low bit rate error (better
than 10.sup.-12) can be readily achieved; and
[0045] The need for wires and related problems and space
requirements are eliminated.
[0046] Alternatively, ultrasound can be used to communicate between
the internal components 112, 116. In which case, the casing 102 or
a portion thereof needs to be able to carry an ultrasound signal
between components. Such a casing 102, or portion thereof, may be
constructed from a suitable metal. In the case of ultrasound, an
ultrasonic generator is used to place signals on the "bus" (casing
102) and a corresponding ultrasonic detector detects the ultrasonic
signals and relays them to an appropriate component. Of course, the
casing may also be a synthetic material having portions of suitable
materials for carrying an ultrasound signal. As discussed above
with regard to the optical signal configuration, each component can
have both an ultrasonic generator and detector such that two-way
communication between components is possible and mutiplexers and
demultiplexers can be utilized such that certain components can
operate at selected frequencies and/or wavelengths and not
interfere with other components on the bus.
[0047] In another embodiment, the casing 102 is a casing of a CPU
of a computer 200. In yet another implementation, the casing 102 is
a casing of a cellular telephone 300. As discussed above, such
embodiments are given by way of example only and not to limit the
scope or spirit of the present invention.
[0048] Referring now to FIGS. 3 and 4, there is shown a computer
CPU 200 and cellular telephone 300, respectively, in which similar
number series denote similar features to that of FIG. 1 (i.e.,
casing 102 corresponds with casings 202 and 302, etc.). Those
skilled in the art will appreciate that the casings 202, 302 can be
made smaller than a conventional counterpart device having the same
number of internal components or be able to house more components
in the same size casing. Thus, the present invention can provide a
miniaturization of electronic devices, particularly portable
electronic devices while eliminating the problems associated with
wiring, such as signal speed, poor connections, and failure over
time due to brittleness and other insulation failures. The
waveguide portion 108 also provides for a flexible design and
layout of the electronic components as well as the ability to
easily add a component on the communication bus (waveguide portion
108) of the device. For example, where the waveguide portion 108 is
deposited on a substantial portion of the inner surface of the
casing 102, the electronic components can be distributed or added
on any portion of the casing where the waveguide portion 108 is
deposited.
[0049] Examples of other devices not shown which can benefit from
the methods disclosed herein are PDA's (personal digital
assistants), cordless telephones, VCR's, portable CD and MP3
players, digital cameras, DVD players, and televisions. Such a
listing is given by way of example only and is not intended to be
exhaustive of any other electronic devices. Although discussed as
electronic components, such components can also have a mechanical
or chemical function as well as an electronic/electrical function.
These mechanical and/or chemical functions can be housed in a
portion of the interior of the casing that has been freed up by
having the electronic components distributed on the casing.
[0050] Referring specifically to FIG. 3, there is shown a computer
CPU 200 having a casing 202 defining an interior 204. The casing
has an outer portion 206 and a waveguide portion 208 that carries a
signal 201. Transmitters 210 and detectors 214 are operatively
connected to the waveguide portion 208 and mounted to respective
electronic components 212, 216. Those skilled in the art will
appreciate that the computer CPU 200 can be made smaller,
particularly, thinner in height (H) than conventional CPU's that
utilize conventional wiring between components. Alternatively, the
computer CPU 200 can house more components than would be possible
for a similarly sized CPU of the prior art that utilizes
conventional wiring between components. Furthermore, the CPU 200
has a more versatile design and can be upgraded with additional
components at any place on the waveguide portion.
[0051] Referring specifically to FIG. 4, there is shown a cell
phone 300 having a casing 302 defining an interior 204. The casing
also carries an antenna 305, a display 303, and a keyboard and
other features (not shown). The casing 302 has an outer portion 306
and a waveguide portion 308 that carries a signal 301. Transmitters
310 and detectors 314 are operatively connected to the waveguide
portion 308 and mounted to respective electronic components 312,
316. Those skilled in the art will appreciate that the cell phone
300 can be miniaturized as compared to conventional cell phones
that utilize conventional wiring between components. Alternatively,
the cell phone 300 can house more components than would be possible
for a similarly sized cell phones of the prior art that utilizes
conventional wiring between components. Additionally, the cell
phone 300 is better able to withstand shock, for example from
dropping the cell phone 300 on a hard surface. The increased shock
resistance is due to the elimination of brittle wiring, including
printed circuit boards and wiring harnesses and connecters.
[0052] Referring now to FIGS. 5 and 6, another embodiment of a
device is shown, the device being in the form of a cellular
telephone and referred to generally by reference numeral 400.
Typically, electrical/electronic components of some devices, such
as projectiles, are encased in a potting material, such as an
epoxy, to harden the components against noise and shock due to the
high acceleration and/or impact experienced by the projectile. In
the embodiment of FIGS. 5 and 6, the potting material 402, which
can be a solid, such as an epoxy, a gel, or a liquid is disposed
within a casing 401 of the cellular telephone and is used as a
communication bus between electrical/electronic components 404. The
communication can be wholly within the potting material 402 or may
be partially within the potting material 402 and partially in free
space. Although many devices can be subjected to such noise and/or
shock, a cellular telephone is described by way of example because
of its tendency to be dropped or otherwise subjected to shock.
[0053] The communication through the potting material is carried
out with a transmitter 406, which outputs any wavelength radiation
that can propagate through the potting material 402 and detected by
a receiver 408. It is preferred that the potting material 402 be a
solid, such as an epoxy to provide hardening of the cellular
telephone to shock and noise and it is further preferred that the
radiation used as a communication medium is IR energy, preferably
from a IR diode. In such an example, the epoxy need not be
transparent or substantially transparent as long as it can carry an
IR signal over a required distance, such as several hundred mm or
less. An example of such an epoxy is Dolphon.RTM. CC-1024-A Low
Viscosity Potting and Casting Epoxy Resin with RE-2000 Reactor
mixed at a ratio of 10 parts resin to 1 part reactor, each of which
is distributed by John C. Dolph Company. The same epoxy resin and
reactor can be used for the waveguide portions 108, 208, or 308
discussed above with regard to FIGS. 1, 3, and 4.
[0054] IR technology is well known in the art, particularly in the
art of remote control of electronic consumer goods. The IR data
association (IrDA.RTM.)has standards for communicating data via
short-range infrared transmission. Transmission rates fall within
three broad categories SIR, MIR and FIR, SIR (Serial Infrared)
speeds cover transmission speeds normally supported by an RS-232
port. MIR (Medium Infrared) usually refers to speeds of 0.576 Mb/s
to 1.152 Mb/s. FIR (Fast Infrared) denotes transmission speeds of
about 4 Mb/s. The standard has been modified for faster
transmission speeds up to 16 Mb/s (referred to as very fast
Infrared VFIR). Although not preferred, visible light, for example
from a laser diode, may also be used to transmit communication
signals through the potting material 402.
[0055] The transmitters 406 may be carried on printed circuit
boards 410 which may also be encased in the potting material 402 or
disposed freely throughout the potting material 402. The printed
circuit boards each 410 preferably carry their own power supply,
such as a battery 412 to eliminate internal wiring. Each of the
electronic/electrical components 404 has a receiver 408 for
communicating with the transmitters 406. As discussed above with
regard to the first embodiment, each of the electrical/electronic
components 404 preferably have a receiver 408 and a transmitter 406
such that they can carry out a two-way communication. An example of
such a transceiver module 500 is shown in the schematic diagram of
FIG. 6. FIG. 6 shows an (IrDA.RTM.)transceiver manufactured by
Sharp Inc. (2P2W1001YP) which is relatively inexpensive and
contains a high speed, high efficiency low power consumption light
emitting diode (LD), a silicon PIN photodiode (PD) and a low power
bipolar integrated circuit. The circuit contains an LED driver
(TRX) and a receiver circuit (RCX) that delivers 4 Mb/s operation
for distances of 1 meter. The LED emitter transmits at a nominal
wavelength of 880 nm with a radiant intensity in the range of 100
to 500 mW.sr.sup.-1, with a radiation angle of +/-15 degrees. The
pin photodiode has an integrated amplifier (AMP) and comparator
(CMP), which provide a fixed voltage output over a broad range of
input optical power levels and data rates. The same or similar
transceiver module 500 can also be used for the other embodiments
described above with regard to FIGS. 1, 3, and 4.
[0056] The casing 402 can also be provided with a window portion
403, as shown in FIG. 5, which can be used to upload or input data
or instructions into components of the cellular telephone through
the potting material 402 (or through the waveguide portions 108,
208, and 308 discussed above). In a preferred implementation, the
window portion 403 is in optical communication with the waveguide
portion 108, 208, 308 or potting material 402 and transmits any
input signals to the appropriate components on the interior of the
cellular telephone. Although described in terms of a transparent
window 403 and signal, the input signal can be any signal that
propagates through the waveguide portion 108, 208, 308 or potting
material 402, such as an IR or ultrasound signal. Furthermore, the
window 403 does not have to be a transparent window but merely a
portion of the casing, which is capable of transmitting a signal
from the exterior of the cellular telephone to one or more
components on the interior of the cellular telephone.
[0057] Referring now to FIG. 7, there is shown a cellular telephone
according to another embodiment of the present invention, in which
similar reference numerals from FIG. 5 denote similar features, the
cellular telephone of FIG. 7 being referred to generally by
reference numeral 600. FIG. 7 is similar to that of FIG. 5 with the
exception that the potting material does not have to completely
encase a portion of the cellular telephone's interior. The interior
of the cellular telephone includes portions of free space 610
(which may be filled with air or other gases or may be evacuated.
Although all of the components 404, 408 are shown encased in the
potting material 402, they can also be provided in the free space
610 or partially in the free space 610. Thus, the communication
between components is not only through the potting material 402 but
can also be done through the free space 610 inside the cellular
telephone.
[0058] While there has been shown and described what is considered
to be preferred embodiments of the invention, it will, of course,
be understood that various modifications and changes in form or
detail could readily be made without departing from the spirit of
the invention. It is therefore intended that the invention be not
limited to the exact forms described and illustrated, but should be
constructed to cover all modifications that may fall within the
scope of the appended claims.
* * * * *