U.S. patent application number 12/125921 was filed with the patent office on 2008-09-18 for adapter for a memory card and a memory card.
This patent application is currently assigned to RENESAS TEACHNOLOGY CORP.. Invention is credited to Hideo Koike, Hirotaka Nishizawa, JUNICHIRO OSAKO, Kenji Osawa.
Application Number | 20080225498 12/125921 |
Document ID | / |
Family ID | 36932487 |
Filed Date | 2008-09-18 |
United States Patent
Application |
20080225498 |
Kind Code |
A1 |
OSAKO; JUNICHIRO ; et
al. |
September 18, 2008 |
ADAPTER FOR A MEMORY CARD AND A MEMORY CARD
Abstract
An adapter for a memory card is disclosed which performs a
change of size so that a memory card smaller in planar size but
almost equal in thickness as compared with a multi-media card can
be used as a multi-media card. A protuberant portion is formed
behind plural external terminals formed on a back side of the
adapter, whereby, while the thickness of a front side of the
adapter is maintained at a standardized thickness of the
multi-media card, a rear side of the adapter is made thicker than
the front side and internal terminals for contact with external
terminals of the memory card are disposed in the interior of the
thick portion of the adapter. The versatility of an extremely
small-sized memory card can be improved.
Inventors: |
OSAKO; JUNICHIRO; (Kodaira,
JP) ; Nishizawa; Hirotaka; (Fuchu, JP) ;
Osawa; Kenji; (Hachioji, JP) ; Koike; Hideo;
(Yokohama, JP) |
Correspondence
Address: |
MILES & STOCKBRIDGE PC
1751 PINNACLE DRIVE, SUITE 500
MCLEAN
VA
22102-3833
US
|
Assignee: |
RENESAS TEACHNOLOGY CORP.
|
Family ID: |
36932487 |
Appl. No.: |
12/125921 |
Filed: |
May 23, 2008 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
11361957 |
Feb 27, 2006 |
|
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|
12125921 |
|
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Current U.S.
Class: |
361/737 |
Current CPC
Class: |
H01L 2224/45144
20130101; H01R 12/7005 20130101; H01L 2224/48091 20130101; H05K
3/326 20130101; H01R 12/714 20130101; H01L 2924/00014 20130101;
H01L 2924/00 20130101; H05K 1/142 20130101; G06K 19/07743 20130101;
H05K 1/117 20130101; H01R 31/06 20130101; H01L 2224/45144 20130101;
G06K 19/07739 20130101; H01L 2225/06562 20130101; H01R 2201/20
20130101; H01R 27/00 20130101; H01L 2224/48091 20130101 |
Class at
Publication: |
361/737 |
International
Class: |
H05K 1/14 20060101
H05K001/14 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 28, 2005 |
JP |
2005-053684 |
Claims
1-15. (canceled)
16. A memory card comprising: a wiring substrate having a first
surface and a second surface which are disposed on mutually
opposite sides in the thickness direction of the wiring substrate;
a semiconductor chip mounted on the first surface of the wiring
substrate and having a memory circuit which contributes to the
storage of information; a first resin sealing body for sealing the
semiconductor chip; a first housing provided on the first surface
side of the wiring substrate so as to cover the first surface of
the wiring substrate and also cover the first resin body; an
electronic part mounted on the second surface of the wiring
substrate; a second resin sealing body for sealing the electronic
part; a plurality of external terminals formed on the second
surface side of the wiring substrate at a position spaced away from
the second resin sealing body and connected electrically to the
semiconductor chip and the electronic part; and a second housing
provided on the second surface of the wiring substrate so as to
cover the second resin sealing body at a position spaced away from
the area where the plurality of the external terminals are disposed
to let the external terminals be exposed to the exterior, wherein
the thickness of the memory card portion where the second housing
is provided is larger than the thickness of the memory card portion
where the plurality of the external terminals are disposed.
17. A memory card according to claim 16, wherein the plurality of
the external terminals are disposed in two rows in a direction of
insertion of the memory card into an electronic device.
18. A memory card according to claim 16, wherein the electronic
part is a semiconductor chip, the semiconductor chip having a
control circuit for controlling the operation of the semiconductor
chip having the memory circuit which contributes to the storage of
information.
19. A memory card according to claim 16, wherein the electronic
part is a passive element.
20. A memory card according to claim 19, wherein the passive
element is a pull-up resistor.
21. A memory card comprising: a wiring substrate having a first
surface and a second surface which are disposed on mutually
opposite sides in the thickness direction of the wiring substrate;
a semiconductor chip mounted on the first surface of the wiring
substrate and having a memory circuit which contributes to the
storage of information; a first resin sealing body for sealing the
semiconductor chip; a first housing provided on the first surface
side of the wiring substrate so as to cover the first surface of
the wiring substrate and also cover the first resin sealing body;
an electronic part mounted on the second surface of the wiring
substrate; a second resin sealing body for sealing the electronic
part, the second resin sealing body being formed in an exposed
state to the exterior; and a plurality of external terminals formed
on the second surface side of the wiring substrate at a position
spaced away from the second resin sealing body and connected
electrically to the semiconductor chip and the electronic part,
wherein the thickness of the memory card portion where the second
resin sealing body is provided is larger than the thickness of the
memory card portion where the plurality of the external terminals
are disposed.
22. A memory card according to claim 21, wherein the plurality of
the external terminals are disposed in two rows in a direction of
insertion of the memory card into an electronic device.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] The present application claims priority from Japanese patent
application No. 2005-053684 filed on Feb. 28, 2005, the content of
which is hereby incorporated by reference into this
application.
BACKGROUND OF THE INVENTION
[0002] The present invention relates to a technique on an adapter
for a memory card and a memory card. Particularly, the present
invention is concerned with a technique applicable effectively to
an adapter for a memory card still smaller than a small-sized
memory card such as a reduced-size MMC, as well as the memory
card.
[0003] Such memory cards as a multi-media card (there is a standard
established by Multi-Media Card Association; hereinafter referred
to as MMC) and an SD card (there is a standard established by SD
Card Association) are one of storage devices which store
information in a semiconductor memory chip disposed in the interior
thereof. In the memory cards in question, an access of information
is made directly and electrically to a non-volatile memory formed
in the semiconductor memory chip and thus there is no control of a
mechanical system, so that the memory cards in question have such
excellent characteristics as the read time being high and the
replacement of a storage medium being easy in comparison with other
storage devices. Besides, since the outline is relatively
small-sized and light-weight, the memory cards in question are used
mainly as auxiliary storage devices in devices required to be
portable such as portable personal computers, portable telephones
and digital cameras.
[0004] An MMC is a small-sized and light-weight memory card having
a weight of 1.5 g, outline dimensions of 32 mm.times.24 mm and a
thickness of 1.4 mm. It is provided with a thin plate-like cap of a
generally quadrangular shape in plan having a largely chamfered
corner portion and is also provided with a memory body fitted in a
recess formed in a parts-accommodating surface. The memory body
includes a wiring substrate, a semiconductor chip mounted on a main
surface of the wiring substrate, and a resin sealing member for
sealing the semiconductor chip. The semiconductor chip is
electrically connected through wiring lines formed on the wiring
substrate to plural external terminals formed on a back surface of
the wiring substrate. The plural external terminals are exposed to
the exterior and are connected electrically to an electronic device
in which the MMC is incorporated.
[0005] A reduced-size MMC (Reduced Size MMC, hereinafter referred
to as RSMMC) is a memory card (weight 0.8 g, outline dimensions 18
mm.times.24 mm, thickness 1.4 mm) of a size about half the size of
the above MMC. An external terminal structure of the RSMMC has
compatibility with the MMC and can be used as an MMC by using an
adapter for a memory card.
[0006] Further, the above SD card is a memory card having a weight
of 3 g, outline dimensions of 32 mm.times.24 mm and a thickness of
2.1 mm. It is the same in shape as the MMC though different in
weight and thickness. The SD card is provided with two thin
plate-like cases of a quadrangular shape in plan having a largely
chamfered corner portion and is also provided with a memory body
sandwiched in between the two cases. Plural apertures are formed in
a back surface of one case in the SD card, plural external
terminals formed on a back surface of the memory body are exposed
from the apertures, and the external terminals of the SD card and
an electronic device in which the SD card is incorporated are
electrically connected with each other through the apertures. The
foregoing MMC is also employable in most of electronic devices
insofar as the electronic devices are configured so as to permit
the use of the SD card.
[0007] As to the adapter for a memory card, a related description
is found, for example, in Japanese Unexamined Patent Publication
No. 2004-348557 (Patent Literature 1), in which there is disclosed
a configuration of an adapter for converting such a small-sized
memory card as RSMMC into an ordinary MMC size.
[0008] Further, for example in Japanese Unexamined Patent
Publication No. 2004-133516 (Patent Literature 2) there is
disclosed a configuration wherein a sealing portion which covers an
IC body is provided in the exterior of such a memory card as MMC
and the IC body is held firmly while being sandwiched in between a
memory card case and the sealing portion.
[0009] [Patent Literature 1]
[0010] Japanese Unexamined Patent Publication No. 2004-348557
[0011] [Patent Literature 2]
[0012] Japanese Unexamined Patent Publication No. 2004-133516
SUMMARY OF THE INVENTION
[0013] Recently, with the reduction in size of electronic devices
incorporated into memory cards, an extremely small-sized memory
card somewhat thinner than the foregoing MMC and SD card and
smaller in planar size than the RSMMC has been being
commercialized. In this case, it is an important subject in what
manner such an extremely small-sized memory card is to be made
employable in a corresponding larger-size device such as MMC, SD
card or RSMMC.
[0014] It is an object of the present invention to provide a
technique which can improve the versatility of an extremely
small-sized memory card.
[0015] The above and other objects and novel features of the
present invention will become apparent from the following
description and the accompanying drawings.
[0016] The following is an outline of typical modes of the present
invention as disclosed herein.
[0017] In one aspect of the present invention there is provided an
adapter for a memory card, the adapter having the same planar size
as that of a memory card of a first size and having a space capable
of receiving therein a memory card of a second size smaller than
the first size, wherein the thickness of a region within the space
of the adapter where internal terminals are disposed is made larger
than that of a region of the adapter where plural external
terminals are disposed.
[0018] In another aspect of the present invention there is provided
a memory card comprising a semiconductor chip mounted on a first
surface of a wiring substrate and having a memory circuit which
contributes to the storage of information, an electronic part
mounted on a second surface on the side opposite to the first
surface of the wiring substrate, and a plurality of external
terminals disposed on the second surface of the wiring substrate at
a position spaced away from the electronic part and connected
electrically to both the semiconductor chip and the electronic
part, wherein the thickness of a region of the memory card where
the electronic part is mounted is made larger than that of a region
of the memory card where the plural external terminals are
disposed.
[0019] The following is a brief description of effects obtained by
the typical modes of the present invention as disclosed herein.
[0020] Since the adapter for a memory card has the same planar size
as that of a memory card of a first size and has a space able to
receive therein a memory card of a second size smaller than the
first size and the thickness of a region within the space of the
adapter where internal terminals are disposed is made larger than
that of a region of the adapter where plural external terminals are
disposed, a memory card of an extremely small size can be changed
to a memory card of a larger size and therefore it is possible to
improve the versatility of the extremely small-sized memory
card.
[0021] Since the thickness of the electronic part mounted region of
the memory card is made larger than that of the external
terminals-disposed region of the memory card, it is possible to
improve the performance of the memory card.
BRIEF DESCRIPTION OF THE DRAWINGS
[0022] FIG. 1 is an entire perspective view of an adapter for a
memory card according to an embodiment of the present invention as
seen from an upper surface side;
[0023] FIG. 2 is an entire perspective view of the adapter of FIG.
1 as seen from a back surface side;
[0024] FIG. 3 is an entire plan view of the upper surface of the
adapter;
[0025] FIG. 4 is an entire plan view of the back surface of the
adapter;
[0026] FIG. 5 is a front view of the adapter as seen in the
direction of arrow A in FIG. 3;
[0027] FIG. 6 is a side view of the adapter as seen in the
direction of arrow B in FIG. 3;
[0028] FIG. 7 is a rear view of the adapter as seen in the
direction of arrow C in FIG. 3;
[0029] FIG. 8 is an entire perspective view of the adapter as seen
from the upper surface (first surface) side in a state in which a
memory card of an extremely small size is being loaded into the
adapter;
[0030] FIG. 9 is an entire perspective view of the adapter as seen
from the back surface (second surface) side after loading of the
extremely small-sized memory card;
[0031] FIG. 10 is an entire plan view of an upper surface of the
extremely small-sized memory card shown in FIG. 8;
[0032] FIG. 11 is an entire plan view of a back surface of the
extremely small-sized memory card shown in FIG. 10;
[0033] FIG. 12 is a front view of the extremely small-sized memory
card as seen in the direction of arrow A in FIG. 10;
[0034] FIG. 13 is a side view of the extremely small-sized memory
card as seen in the direction of arrow B in FIG. 10;
[0035] FIG. 14 is a rear view of the extremely small-sized memory
card as seen in the direction of arrow C in FIG. 10;
[0036] FIG. 15 is an entire plan view of the upper surface of the
adapter after loading of the extremely small-sized memory card;
[0037] FIG. 16 is an entire plan view of the back surface of the
adapter after loading of the extremely small-sized memory card;
[0038] FIG. 17 is a sectional view taken on line X1-X1 in FIG.
15;
[0039] FIG. 18 is an explanatory diagram of dimensions in the
thickness direction of the adapter;
[0040] FIG. 19 is an entire plan view of the back surface of the
adapter shown in FIG. 1;
[0041] FIG. 20 is an entire plan view showing an example of an
inserted state of the adapter of FIG. 1 into a socket of an
electronic device;
[0042] FIG. 21 is a side view of the adapter shown in FIG. 20;
[0043] FIG. 22 is an entire plan view of a back surface of an
adapter for a memory card according to another embodiment of the
present invention;
[0044] FIG. 23 is an explanatory diagram of a test work performed
in a state in which a memory card is incorporated into the adapter
of FIG. 22;
[0045] FIG. 24 is a side view of the adapter shown in FIG. 23;
[0046] FIG. 25 is an entire perspective view of an adapter for a
memory card according to a further embodiment of the present
invention as seen from a back surface side;
[0047] FIG. 26 is an entire perspective view of the adapter of FIG.
25 as seen from a rear side;
[0048] FIG. 27 is an entire perspective view of an adapter for a
memory card according to a still further embodiment of the present
invention as seen from a back surface side;
[0049] FIG. 28 is an entire perspective view of an adapter for a
memory card as seen from a back surface side which adapter is a
modification of the adapter of FIG. 27;
[0050] FIG. 29 is an entire perspective view of an adapter for a
memory card according to a still further embodiment of the present
invention as seen from an upper surface side;
[0051] FIG. 30 is an entire perspective view of the adapter of FIG.
29 as seen from the upper surface side after loading of a memory
card thereto;
[0052] FIG. 31 is a rear view thereof;
[0053] FIG. 32 is a sectional view taken on line X2-X2 in FIG.
30;
[0054] FIG. 33 is an entire perspective view of a memory card
according to a still further embodiment of the present invention as
seen from a back surface side;
[0055] FIG. 34 is an entire perspective view of an adapter for a
memory card as seen from a back side of which adapter is a
modification of the adapter of FIG. 33;
[0056] FIG. 35 is a side view on a memory card insertion side of
the adapters of FIGS. 33 and 34;
[0057] FIG. 36 is a side view on a memory card insertion side of
the adapters according to a modification of FIG. 35;
[0058] FIG. 37 is an entire perspective view of an adapter for a
memory card as seen from an upper surface side which adapter is a
modification of the adapters of FIGS. 33 and 34;
[0059] FIG. 38 is an entire perspective view of an adapter for a
memory card as seen from an upper surface side according to a still
further embodiment of the present invention;
[0060] FIG. 39 is an entire perspective view of an adapter for a
memory card as seen from an upper surface side of which adapter is
a modification of the adapter of FIG. 38;
[0061] FIG. 40 is an entire plan view of an upper surface of an
adapter for a memory card according to a still further embodiment
of the present invention;
[0062] FIG. 41 is an entire plan view of a back surface
thereof;
[0063] FIG. 42 is a front view of the adapter as seen in the
direction of arrow A in FIG. 40;
[0064] FIG. 43 is a side view of the adapter as seen in the
direction of arrow B in FIG. 40;
[0065] FIG. 44 is a rear view of the adapter as seen in the
direction of arrow C in FIG. 40;
[0066] FIG. 45 is an entire plan view of the upper surface of the
adapter after loading thereto a memory card of an extremely small
size;
[0067] FIG. 46 is an entire plan view of the back surface of the
adapter after loading thereto the extremely small-sized memory
card;
[0068] FIG. 47 is a sectional view taken on line X3-X3 in FIG.
45;
[0069] FIG. 48 is a plan view of the adapter, showing an example of
layout of connector wiring within the adapter;
[0070] FIG. 49 is an entire perspective view of an adapter for a
memory card as seen from an upper side according to a still further
embodiment of the present invention;
[0071] FIG. 50 is an entire perspective view of the adapter of FIG.
49 as seen from the upper surface side after loading of a memory
card thereto;
[0072] FIG. 51 is a sectional view of a memory card according to a
still further embodiment of the present invention as cut in
parallel with a side face thereof;
[0073] FIG. 52 is a sectional view of the memory card of FIG. 51 as
cut in parallel with a rear face thereof;
[0074] FIG. 53 is a sectional view of a memory card according to a
still further embodiment of the present invention as cut in
parallel with a side face thereof;
[0075] FIG. 54 is a sectional view of the memory card of FIG. 53 as
cut in parallel with a rear face thereof;
[0076] FIG. 55 is a sectional view of a memory card according to a
still further embodiment of the present invention as cut in
parallel with a side face thereof;
[0077] FIG. 56 is an enlarged sectional view of a principal part of
a second portion on a back surface side of the memory card of FIG.
55; and
[0078] FIG. 57 is a sectional view of a memory card according to a
still further embodiment of the present invention as cut in
parallel with a side face thereof.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0079] Where required for convenience's sake, the following
embodiments will each be described in a divided manner into plural
sections of embodiments, but unless otherwise mentioned, they are
not unrelated to each other, but are in a relation such that one is
a modification or a detailed or supplementary explanation of part
or the whole of the other. In the following embodiments, when
reference is made to the number of elements (including the number,
numerical value, quantity and range), no limitation is made to the
number referred to, but numerals above and below the number
referred to will do as well unless otherwise mentioned and except
the case where it is basically evident that limitation is made to
the number referred to. Further, it goes without saying that in the
following embodiments their constituent elements (including
constituent steps) are not always essential unless otherwise
mentioned or in the case where they are considered obviously
essential in principle. Likewise, it is to be understood that when
reference is made to the shapes and positional relation of
constituent elements in the following embodiments, those closely
similar to or resembling such shapes, etc. are also included unless
otherwise mentioned or in the case where a negative answer
obviously results in principle. This is also true of the foregoing
numerical value and range. Moreover, in all of the drawings for
illustrating the following embodiments, portions having the same
functions are identified by like reference numerals, and repeated
explanations thereof will be omitted if possible. Embodiments of
the present invention will be described in detail hereinunder with
reference to the accompanying drawings.
First Embodiment
[0080] FIG. 1 is an entire perspective view of an adapter for a
memory card according to a first embodiment of the present
invention as seen from an upper surface (first surface) side, FIG.
2 is an entire perspective view of the adapter of FIG. 1 as seen
from a back surface (second surface) side, FIG. 3 is an entire plan
view of the upper surface of the adapter of FIG. 1, FIG. 4 is an
entire plan view of the back surface of the adapter of FIG. 1, FIG.
5 is a front view of the adapter as seen in the direction of arrow
A in FIG. 3, FIG. 6 is a side view of the adapter as seen in the
direction of arrow B in FIG. 3, and FIG. 7 is a rear view of the
adapter as seen in the direction of arrow C in FIG. 3.
[0081] An adapter for a memory card, (hereinafter referred to
simply as "adapter"), 1A according to a first embodiment of the
present invention is constituted, for example, by a small thin
plate of a rectangular planar shape having a large chamfered
portion CA1 for index formed at one corner, for example. The
adapter 1A has the same planar size (standardized) as that of a
full-size MMC (a memory card of a first size or IC (Integrated
Circuit) card), e.g., 24 mm in width W1 and 32 mm in length L1. The
adapter 1A has a card receiving space able to receive therein a
memory card (a memory card of a second size or IC card) of an
extremely small size to be described later which is smaller than
the MMC. Illustrated is one which functions as an adapter for HS
(High Speed) MMC. When the extremely small-sized memory card is
received into the card receiving space of the adapter 1A, it
becomes possible to use the adapter 1A as an auxiliary storage
device of MMC size in any of various portable electronic devices,
including information processors such as portable computers, image
processors such as digital cameras, and communication devices such
as portable telephones.
[0082] The size (standardized) of the thickness of the adapter 1A
according to the first embodiment is different from the standard of
MMC and the adapter 1A has a first portion which is relatively thin
and a second portion which is relatively thick. The first portion
which is relatively thin has a thickness D1 of, say, 1.4 mm equal
to the ordinary thickness size (standardized) of MMC.
[0083] In the first portion which is relatively thin, a terminal
region and guide rail regions GR are disposed on a back surface of
the adapter 1A. In the terminal region, for example, thirteen
external terminals (first external terminals) 2 are arranged in two
rows in the longitudinal direction of the adapter 1A (in the
longitudinal direction of the extremely small-sized memory card or
in a direction of insertion of the same memory card into the
adapter 1A) in an exposed state to the exterior.
[0084] The guide rail regions GR are regions retreated inwards by a
length L2 (e.g., 0.8 mm or more) from side ends of the adapter 1A
and corresponding to guide rail regions of MMC. That is, when
installing the adapter 1A which incorporates the memory card into
any of the foregoing electronic devices, guide rails for the memory
card provided on the electronic device side are combined with the
guide rail regions GR of the adapter 1A. If the guide rail regions
GR of the adapter 1A are thick, it becomes impossible to install
the adapter 1A which incorporates the memory card into the
electronic device. Therefore, the guide rail regions GR are formed
in the first portion which is relatively thin.
[0085] On the other hand, in the second portion relatively thicker
than the first portion, there is formed a protuberant portion H
somewhat protruding in a direction away from the back surface of
the adapter 1A. The thickness D2 of the second portion which is
relatively thick is set at, say, about 1.6 to 2.1 mm (preferably
1.6 to 1.7 mm). The protuberant portion H in the second portion
which is relatively thick is formed in such a manner that an outer
periphery thereof is spaced by a length of L3 away from an outer
periphery of the external terminals 2. The length L3 is set to at
least, say, 0.8 mm or more, preferably 1.0 mm or so, taking an
overstroke into account when taking out the adapter with the memory
card incorporated therein from the electronic device by a push-push
method. That is, in the adapter 1A of this first embodiment, the
protuberant portion H in the second portion which is relatively
thick is formed up to a rear face of the adapter 1A from the
position spaced by the length L3 from the outer periphery of the
external terminals 2. In the illustrated example, the protuberant
portion H in the second portion which is relatively thick is
present not only behind (toward the rear face of the adapter 1A)
the external terminals 2 arranged in the second row (rear row) from
a front face side of the adapter 1A but also between the adjacent
innermost external terminals 2 in the aforesaid second row (rear
row).
[0086] In the rear face of the adapter 1A is formed an opening
(first opening) 3 for inserting the extremely small-sized memory
card from the exterior into the card receiving space formed in the
interior of the adapter 1A and for taking out the memory card from
the card receiving space to the exterior. The opening 3 is formed
by a slot (recess) formed in the rear face of the adapter 1A. The
opening 3 has a rectangular plane shape and has a width W2 of, say,
about 10 to 15 mm which is larger than the width of the extremely
small-sized memory card and smaller than the width W1 of the
adapter 1A. Further, the opening 3 has a height D3 of, say, about
1.0 to 1.5 mm which is larger than the thickness of the extremely
small-sized memory card and smaller than the thickness D2 of the
adapter 1A. That is, the thickness D2 of the second portion of the
adapter 1A is larger than the thickness D1 of the first portion. As
will be described in detail later, the adapter 1A is formed so that
the thickness of its second portion is such a thickness D2 as to
cover the sum of the thickness of the memory card 5 and the height
of connector lines 10, whereby a space for the memory card
indicated at 5 and the connector lines 10 can be ensured within the
adapter 1A.
[0087] FIG. 8 is an entire perspective view of the adapter as seen
from the upper surface (first surface) side in a state in which the
extremely small-sized memory card is being loaded into the adapter,
FIG. 9 is an entire perspective view of the adapter as seen from
the back surface (second surface) side after loading of the
extremely small-sized memory card, FIG. 10 is an entire plan view
of an upper surface of the extremely small-sized memory card shown
in FIG. 8, FIG. 11 is an entire plan view of a back surface of the
extremely small-sized memory card shown in FIG. 10, FIG. 12 is a
front view of the extremely small-sized memory card as seen in the
direction of arrow A in FIG. 10, FIG. 13 is a side view of the
extremely small-sized memory card as seen in the direction of arrow
B in FIG. 10, and FIG. 14 is a rear view of the extremely
small-sized memory card as seen in the direction of arrow C in FIG.
10.
[0088] As shown in FIGS. 8 and 9, the extremely small-sized memory
card 5 is received in the card receiving space of the adapter 1A
through the opening 3 formed in the rear face of the adapter in a
state in which plural external terminals 6 face the same direction
as the plural external terminals of the adapter. The memory card 5
is smaller in outline size than the so-called RSMMC. For example,
the memory card 5 has a width W3 of 11 mm, a length L4 of 14 mm
which is shorter than half of the length L1 in the longitudinal
direction of the adapter 1A, and a thickness D4 of about 1.0 to 1.2
mm. On a front-side back surface of the memory card 5 are formed,
say, eleven external terminals (second external terminals) 6 in one
row in an exposed state to the exterior.
[0089] FIG. 15 is an entire plan view of the upper surface of the
adapter after loading of the extremely small-sized memory card,
FIG. 16 is an entire plan view of the back surface of the adapter
after loading of the extremely small-sized memory card, and FIG. 17
is a sectional view taken on line X1-X1 in FIG. 15. In FIGS. 15 and
16, the memory card 5 present within the adapter 1A is shown in a
see-through state. Broken lines shown in FIGS. 15 and 16 each
represent the center in the longitudinal direction of the adapter
1A (in the longitudinal direction of the memory card 5, i.e., in
the direction of insertion of the memory card 5 into the adapter
1A).
[0090] The adapter 1A includes a first case (first housing) 8a on
the upper surface side of the adapter 1A and a second case (second
housing) 8b on the back side of the adapter. The first case 8a has
an upper surface (first surface) and a back surface (second
surface) which are positioned on mutually opposite sides in the
thickness direction of the adapter 1A. On the back surface of the
first case 8a, not only the plural external terminals 2 are
disposed, but also the second case 8b is joined to the back surface
by a thermosonic wire bonding method for example.
[0091] As shown in FIG. 17, the portion of the first case 8a alone
in the adapter 1A is the first portion as a relatively thin portion
having the thickness D1, while the joined portion between the first
and second cases 8a, 8b is the second portion as a relatively thick
portion having the thickness D2. That is, the second case 8b forms
the projecting portion H. Concave portions 8a1 and 8b1 formed
respectively in opposed surfaces of the first and second cases 8a,
8b overlap each other in the joined portion between the first and
second cases, whereby the card receiving space 9 is formed. The
card receiving space 9 is positioned centrally in the width
direction (transverse direction) of the adapter 1A. That is, vacant
regions are present right and left of the card receiving space
9.
[0092] From the standpoint of, for example, attaining the reduction
of weight, easiness of machining and flexibility, the first and
second cases 8a, 8b are formed of a thermoplastic resin such as,
for example, polycarbonate, ABS (acrylonitrile butadiene styrene
resin, PBT (polybutylene terephthalate, PPE (polyphenylene ether),
nylon, LCP (liquid crystal polymer), PET (polyethylene
terephthalate), or a mixture thereof. The first and second cases
8a, 8b may each be formed by plural blocks. In this case, all of
the plural blocks may be formed of resin, but a thin block portion
may be formed of metal. By so doing it is possible to improve the
mechanical strength of the thin adapter 1A.
[0093] Each of the external terminals 2 is connected electrically
to one end of the associated connector line (wiring line) 10.
Opposite ends of the connector lines 10 extend into the card
receiving space 9 and are electrically connected to internal
terminals 10a which are integrally formed at extending ends of the
connector lines 10. The internal terminals 10a are disposed within
the card receiving space 9 so as to become electrically connected
to the external terminals 6 of the memory card 5 upon insertion of
the memory card into the card receiving space 9. The connections
between the connector lines 10 and the internal terminals 10a are
formed in a curved shape so as to operate as plate springs. With
the curved connections, when the memory card 5 is inserted into the
card receiving space 9, the internal terminals 10a are urged toward
the external terminals 6 of the memory card 5, press the external
terminals 6 and come into contact firmly with the external
terminals 6.
[0094] FIG. 18 is an explanatory diagram of dimensions in the
thickness direction of the adapter 1A.
[0095] The present inventors have studied fabrication of an adapter
which permits a change in size of the extremely small-sized memory
card 5 into the MMC size. As described above, the thickness of MMC
is 1.4 mm, while that of the memory card 5 is about 1.0 to 1.2 mm,
therefore, it follows that there remains only about 0.2 to 0.4 mm
as the difference between both thicknesses. Assuming that the
adapter is required to have a case thickness of at least 0.1 mm,
the total thickness of upper and lower cases in the adapter
thickness direction is 0.2 mm, thus giving rise to the problem that
a portion for disposing the internal terminals 10a cannot be
ensured within the adapter.
[0096] In this first embodiment, therefore, the adapter 1A is
formed with a second portion thicker than the first portion whose
thickness is equal to the thickness of MMC, as noted above. More
specifically, in the adapter 1A, the thickness of at least the
region where the internal terminals 10a are disposed is made larger
than the thickness of the region where the plural external
terminals 2 are disposed. As a result, a portion where the internal
terminals 10a are to be disposed can be ensured within the adapter
10a and hence it is possible to provide the adapter 1A which
permits a change of the extremely small-sized memory card 5 to MMC.
That, since the extremely small-sized memory card 5 can be changed
to the larger MMC by inserting it into the adapter 1A, it is
possible to improve the versatility of the memory card 5.
[0097] If a projection height D5 of each internal terminal 10a is,
say, about 0.1 mm and a height D6 necessary for constituting the
plate spring of each connector line 10 is, say, about 0.2 to 0.3
mm, a height (thickness of the second case 8b or the height of the
protuberant portion H) D7 necessary for installation of the
internal terminals 10a is equal to height D5+height D6 and is
therefore, say, about 0.3 to 0.4 mm. Given that the thickness D8 of
the first case 8a is 0.1 mm, the thickness D2 of the thick, second
portion of the adapter 1A becomes equal to the thickness D4 (1.2
mm) of the extremely small-sized memory card 5+height D7+thickness
D8 and is, say, about 1.6 to 1.7 mm. Since the socket of the
electronic device for insertion therein of MMC has such dimensions
as permit insertion therein of SD card (thickness 2.1 mm), an upper
limit of the thickness D2 of the thick, second portion in the
adapter 1A is, say, 2.1 mm. That is, the thickness D2 of the thick,
second portion is, say, 1.6 to 2.1 mm. Or, the height (thickness of
the second case 8b or the height of the protuberant portion H) D7
necessary for installation of the internal terminals 10a is, say,
0.3 to 0.7 mm.
Second Embodiment
[0098] FIG. 19 is an entire plan view of the back surface of the
adapter of the previous first embodiment, FIG. 20 is an entire plan
view showing an example of an inserted state of the memory
card-incorporated adapter into a socket of an electronic device,
FIG. 21 is a side view of the adapter shown in FIG. 20, FIG. 22 is
an entire plan view of a back surface of an adapter according to a
second embodiment of the present invention, FIG. 23 is a diagram
showing a state in which a memory card is being tested in an
inserted condition thereof into the adapter shown in FIG. 22, and
FIG. 24 is a side view showing an example in which the adapter of
FIG. 22 with the memory card incorporated therein is installed into
a socket of an electronic device.
[0099] The protuberant portion H described in the first embodiment
has a convex shape in plan constituted by a front-side region RA
and a rear-side region RB of the adapter 1A, as shown in FIG. 19.
In this second embodiment, reference will be made to a case where
the projecting portion has a generally quadrangular shape in plan
with the front-side region RA omitted.
[0100] FIGS. 20 and 21 illustrate an inserted state of the adapter
1A of FIG. 19 into a socket of an electronic device. As shown in
FIG. 20, terminals 12 disposed within the socket of the electronic
device extend from the front to the rear side of the adapter 1A and
come into contact with external terminals 2 of the adapter. FIG. 21
is a sectional view (side view) of FIG. 20, illustrating an
inserted state of the adapter 1A into the socket of the electronic
device. As shown in these figures, it is seen that the front region
RA of the adapter 1A can be omitted.
[0101] FIG. 22 illustrates a case where the front side of the
adapter 1A is omitted. As to a protuberant portion H, it is of the
same structure as that in the first embodiment with respect to the
rear side of the adapter 1A and is present on only the rear side
from the second row of external terminals 2. That is, the
protuberant portion H is not formed in the first and second rows of
external terminals 2. According to this structure, since the shape
of the protuberant portion H is simple, it becomes possible to
simplify the manufacturing process for the adapter 1A.
[0102] The present inventors have made a study about a
configuration which permits the execution of a test work without
taking out the memory card 5 from the adapter 1A in the event of
malfunction of the memory card 5. In more particular terms, the
present inventors have made a study about an adapter structure
which permits the execution of a test work using an existing test
device for MMC in an inserted state of the memory card into the
adapter 1A on the assumption that the test cannot be performed by
the existing test device in case of a change of the memory card 5
into an extremely small-sized one.
[0103] In FIG. 22, plural test terminals TEST are provided in a
space formed by omission of the front-side region RA of the adapter
1A. The plural test terminals TEST are each formed at a position
spaced a distance L3 from the first and second rows of external
terminals 2 so as to avoid contact thereof with the external
terminals 2. Thus, the test terminals TEST are spaced away from the
external terminals lest they should contact the external
terminals.
[0104] For distinction from the external terminals 12, each test
terminal TEST is formed smaller in size than the external terminals
12 and is formed in a different shape from the shape of the
external terminals. As to the layout of the test terminals TEST,
although in the illustrated example the test terminals TEST are
arranged at equal intervals in both the direction of insertion of
the memory card 5 and a direction orthogonal to the card inserting
direction, no limitation is made thereto. For example, they may be
arranged in a zigzag fashion. In this case, it becomes possible to
arrange a larger number of test terminals TEST than in the equally
spaced layout. Further, although in the illustrated example the
test terminals TEST are formed in a circular shape, no limitation
is made thereto. For example, they may be formed in a semicircular,
elliptic or polygonal shape.
[0105] The plural test terminals TEST are electrically connected
(not shown) to the memory card 5 present within the adapter 1A, so
in the event a controller chip mounted within the memory card 5
should become inoperable due to electrostatic breakdown for
example, it is possible to make a direct access control for a
non-volatile memory chip from the exterior through the test
terminals if there remain data in the non-volatile memory chip.
FIG. 23 shows a state in which a test is being conducted by
applying an existing test device to the test terminals TEST.
Although in the drawing a test probe is shown in a simplified form
as the existing test device, no limitation is made thereto. Various
other existing test devices are employable.
[0106] Thus, in this embodiment the manufacturing process can be
simplified by omitting the front-side region RA of the adapter 1A.
Moreover, since the plural test terminals TEST are provided in the
space formed by omission of the front-side region RA, it is
possible to conduct a test work for the memory card 5 with use of
an existing test device.
Third Embodiment
[0107] FIG. 25 is an entire perspective view of an adapter
according to a third embodiment of the present invention as seen
from a back surface side and FIG. 26 is an entire perspective view
of the adapter as seen from a rear side.
[0108] In this third embodiment, guide portions 13 are formed along
both inner side faces of an opening 3 and a card receiving space 9
in an adapter 1C. The guide portions 13 extend from the opening 3
toward the card receiving space 9 and have not only a function of
assisting a horizontal movement of the memory card 5 at the time of
inserting or taking out the memory card into or from the card
receiving space but also a function of preventing insertion in an
erroneous direction (reverse insertion) of the memory card 5. Other
constructional points of the adapter 1C are common to the adapter
1A of the first embodiment. In this third embodiment, the opening 3
of the adapter 1C is formed in a polygonal shape in plan. In the
example shown in FIGS. 25 and 26, the opening 3 is formed so as to
have a region different in width in a direction orthogonal to the
direction of insertion of the memory card 5. More specifically, the
opening 3 is formed so that the width thereof on the back surface
side of the adapter 1C is longer than that on the upper surface
side of the adapter.
[0109] According to this third embodiment, since the opening 3 has
the above structure and the guide portions 13 are provided, it is
possible to prevent reverse insertion of the memory card 5 and
hence possible to prevent damage and deterioration of internal
terminals 10a and connector lines 10 within the adapter 1C which
are caused by the reverse insertion.
[0110] Of course, the contents of this third embodiment may be
combined with the previous second embodiment. In this case, it is
possible to obtain the respective effects of both embodiments.
Fourth Embodiment
[0111] FIG. 27 is an entire perspective view of an adapter
according to a fourth embodiment of the present invention as seen
from a back surface side and FIG. 28 is an entire perspective view
of an adapter as seen from a back surface side which adapter is a
modification of the adapter of FIG. 27.
[0112] In this fourth embodiment a description will be given about
adapters 1D and 1E for the ordinary MMC which is not for HSMMC. For
example, seven external terminals 2 are arranged in one row on a
front back side of each of the adapters 1D and 1E. In the second
portion which is relatively thick, a protuberant portion H is
formed over a rear face of each of the adapter 1D and 1E from a
position which is spaced away by the length L3 from a position
corresponding to the second row in the case of the external
terminals 2 being arranged in two rows. Other constructional points
are the same as those described above in the first to third
embodiments. FIG. 27 shows an example in which the guide rails 13
are not formed, while FIG. 28 shows an example in which the guide
rails 13 are formed. In the latter case it is possible to obtain
the same effects as in the third embodiment.
Fifth Embodiment
[0113] FIG. 29 is an entire perspective view of an adapter
according to a fifth embodiment of the present invention as seen
from an upper surface side, FIG. 30 is an entire perspective view
of the adapter of FIG. 29 as seen from the upper surface side after
loading of a memory card thereto, FIG. 31 is a rear view of the
adapter of FIG. 30, and FIG. 32 is a sectional view taken on line
X2-X2 in FIG. 30.
[0114] In this fifth embodiment, an opening (second opening) 15
extending from the opening 3 toward the card receiving space 9 is
formed in an upper surface of the adapter 1F. As in the first and
second embodiments, the opening 15 is formed by a slot (recess)
formed in an upper surface of the adapter 1F.
[0115] Guide portions 16 are provided at upper positions of both
inner side faces of the opening 15. The guide portions 16 are
formed along side faces of the slot which forms the opening 15 and
are constituted by protruding portions (convex portions) protruding
from the side faces. The protruding portions are formed at
positions closer to the upper surface side of the adapter 1F rather
than the bottom side of the slot.
[0116] The guide portions 16 have not only a function of assisting
a horizontal movement of the memory card 5 at the time of inserting
or taking out the memory card into or from the card receiving space
9 and a function of preventing reverse insertion of the memory card
5 but also a function of pressing the memory card 5 to prevent the
card from moving out of the card receiving space 9. In this case,
as shown in FIG. 30, when the memory card 5 is received into the
card receiving space 9 of the adapter 1F, the upper surface of the
memory card assumes an exposed state to the exterior.
[0117] The guide portions 16 extend continuously from the rear to
the front side of the adapter 1F. Also on side faces of the memory
card 5 there are formed guide portions 5g as portions corresponding
to the guide portions 16. Further formed on the side faces of the
memory card 5 are stopper portions 5s for stopping movement of the
memory card 5 upon insertion of the card into the adapter 1F. Other
constructional points are the same as in the first to fourth
embodiments. The guide portions 5g and the stopper portions 5s are
formed on side faces of the memory card 5 and are constituted by
protruding portions (convex portions) protruding from the side
faces. The guide portions 5g extend from the front face (a face
orthogonal to the direction of insertion of the memory card 5 into
the adapter 1F) of the memory card 5 toward the rear face of the
card. The protruding portions do not extend up to the rear face of
the memory card 5 and thus the stopper portions 5s are free of the
protruding portions in the vicinity of the rear face of the memory
card 5.
[0118] With such a configuration of the memory card 5, as shown in
FIG. 32, the memory card 5 can be disposed upward by an amount
corresponding to an upper surface portion of a first case 8a of the
adapter 1F. That is, a thickness corresponding to the thickness of
the upper surface portion of the first case 8a can be subtracted
from the thickness of the memory card 5, so that the thickness D2
of a relatively thick, second portion of the adapter 1F can be made
smaller than in the first to fourth embodiments.
[0119] In the case of a configuration wherein only the rear side
portion of the memory card 5 is exposed, there sometimes is a case
where it is difficult to take out the memory card 5 because of a
small size of the memory card. On the other hand, in this fifth
embodiment, the memory card 5 can be taken out easily because the
upper surface of the memory card 5 received in the card receiving
space 9 of the adapter 1F is also exposed to the exterior.
Sixth Embodiment
[0120] FIG. 33 is an entire perspective view of an adapter
according to a sixth embodiment of the present invention as seen
from a back surface side thereof, FIG. 34 is an entire perspective
view of an adapter as seen from a back surface side which adapter
is a modification of the adapter of FIG. 33, FIG. 35 is a side view
on a memory card insertion side of the adapters of FIGS. 33 and 34,
FIG. 36 is a side view on a memory card insertion side of the
adapters according to a modification of FIG. 35, and FIG. 37 is an
entire perspective view of an adapter as seen from an upper surface
side which adapter is a modification of the adapters of FIGS. 33
and 34.
[0121] In this sixth embodiment, an opening 3 for inserting and
taking out the memory card 5 into and from the card receiving space
9 is formed in a side face of each of adapters 1G and 1H.
[0122] In the case where an opening 3 is formed in a rear face of
an adapter, the rear face of the adapter is exposed from a card
take-out opening of the associated electronic device and the rear
face of the memory card 5 is also in an exposed state, so there is
a fear that the memory card 5 may be pulled out by mistake.
[0123] In this sixth embodiment, the opening 3 is formed in a side
face of each of the adapters 1G and 1H, so even if the rear face of
each of the adapters 1G and 1H is exposed from the card take-out
opening formed on the associated electronic device side, there is
no fear of the memory card 5 being pulled out by mistake, because
the rear face of the memory card 5 is not exposed.
[0124] FIG. 33 shows an example of an adapter for HSMMC having
thirteen external terminals and FIG. 34 shows an example of an
adapter for the ordinary MMC having seven external terminals 2. In
FIGS. 33 and 34 there is illustrated a memory card 5 in which, say,
twenty external terminals 6 are arranged in two rows. FIG. 35 shows
an example an opening 3 free of guide portions, while FIG. 36 shows
an example of an opening 3 having guide portions 13. The openings 3
are each formed by a slot (recess) formed in a side face of each of
the adapters 1G and 1H. As to the adapter 1G, as shown in FIG. 35,
its sectional and planar shapes are the same as in the first
embodiment. As to the adapter 1H, as shown in FIG. 36, its
sectional and planar shapes are the same as in the third
embodiment. With the guide portions, it is possible to obtain the
same effects as in the third embodiment. Further, FIG. 37 shows an
example in which an opening 15 is formed in an upper surface of
each of the adapters 1G and 1H as in the fifth embodiment. In this
case, it is possible to obtain the same effects as in the fifth
embodiment.
Seventh Embodiment
[0125] FIG. 38 is an entire perspective view of an adapter
according to a seventh embodiment of the present invention as seen
from an upper surface side and FIG. 39 is an entire perspective
view of an adapter as seen from an upper surface side which adapter
is a modification of the adapter of FIG. 38. In the drawings there
is illustrated a memory card 5 in which, say, twenty external
terminals 6 are arranged in two rows.
[0126] In this seventh embodiment, an opening 3 for inserting and
taking out the memory card 5 into and from the card receiving space
9 is formed in an upper surface of each of adapters 1J and 1K. The
opening 3 can be opened and closed with a lid 20. The lid 20 is
formed of resin or metal for example and is supported on the upper
surface side of each of the adapters 1J and 1K in a state in which
it can be opened and closed with a hinge portion.
[0127] In the adapter 1J of FIG. 38, a convex retaining portion 20a
is integrally formed at an end of the lid 20. When the lid 20 is
closed, the retaining portion 20a is positioned on the rear side of
the memory card 5 present within the card receiving space 9 and
functions to prevent the memory card 5 from falling out of the
adapter 1J against the will of the user. With the retaining portion
20a, there is no fear of occurrence of such an inconvenience of the
memory card 5 is pulled out by mistake from the interior of the
adapter 1J. On a side face of a slot which constitutes the opening
3 of the adapter 1J there is formed a protruding portion 3a. The
protruding portion 3a is provided to determine the position (height
from the bottom of the slot which constitutes the opening 3) of the
memory card 5 when the memory card is inserted into the opening 3.
Therefore, the memory card 5 can be fixed stably upon insertion
thereof. Although only one protruding portion 3a is provided in the
illustrated example, plural such protruding portions 3 may be
provided, whereby the memory card 5 can be fixed in a more stable
manner.
[0128] A recess 8b2 is formed in the bottom of the slot which
constitutes the opening 3. Upon insertion of the memory card 5, the
recess 8b2 comes into fitting engagement with the retaining portion
20a of the lid 20, whereby the memory card 5 can be loaded stably
to the adapter 1J.
[0129] The lid 20 has recesses (slots) 20b formed in sides
different from the side where the retaining portion 20a is
provided. Further, protruding portions 3b separate from the
protruding portion 3a are formed on side faces of the slot which
constitutes the opening 3. The protruding portions 3b are each
formed at a position closer to the surface of the adapter 1J with
respect to the protruding portion 3a. When the memory card 5 is
inserted into the adapter, the protruding portions 3a and 3b are
fitted in the memory card, whereby the memory card can be loaded to
the adapter 1J in a more stable manner. Thus, since the retaining
portion 20a and the recesses 20b are formed on different sides of
the lid 20, there are obtained three support points upon insertion
of the lid 20 into the adapter 1J. Consequently, the memory card 5
can be loaded in a much more stable manner than in the case of the
retaining portion 20a alone with only one support point. Although
in the illustrated example the recesses 20b and the protruding
portions 3b are each formed at two positions, it goes without
saying that a more stable loading of the memory card can be
effected by providing each of them in a larger number than two.
[0130] In the adapter 1K of FIG. 39, a retaining plate 21 is
provided on the rear side of the adapter 1K. A recess 21a is formed
centrally in the transverse direction of the retaining plate 21.
When the lid 20 is closed, the retaining portion 20a of the lid 20
is fitted in the recess 21a of the retaining plate 21 in a
satisfactory manner. According to such a configuration, also in the
case of the adapter 1K, there is no fear of occurrence of an
inconvenience such that the memory card 5 present within the
adapter 1K is pulled out by mistake. Like the adapter 1J, the
adapter 1K is also provided with the protruding portions 3a, 3b and
recesses 20b, whereby it is possible to obtain the same effects as
in the case of the adapter 1J described above.
Eighth Embodiment
[0131] FIG. 40 is an entire plan view of an upper surface of an
adapter according to an eighth embodiment present invention, FIG.
41 is an entire plan view of a back surface of the adapter of FIG.
40, FIG. 42 is a front view of the adapter as seen in the direction
of arrow A in FIG. 40, FIG. 43 is a side view of the adapter as
seen in the direction of arrow B in FIG. 40, and FIG. 44 is a rear
view of the adapter as seen in the direction of arrow C in FIG.
40.
[0132] An adapter 1L according to this eighth embodiment has the
same planar size (standardized) as that of the so-called RSMMC (a
memory card of the first size or IC card), e.g., 24 mm in width W1
and 18 mm in length L5 and has a card receiving space which can
receive therein the foregoing extremely small-sized memory card (a
memory card of the second size or IC card) smaller than the RSMMC.
The illustrated adapter is one which functions as an adapter
especially for HSMMC among RSMMCs. By inserting the extremely
small-sized memory card into the card receiving space of the
adapter 1L, the adapter becomes employable as an auxiliary storage
device in any of various portable electronic devices, including the
foregoing information processors, image processors and
communication devices.
[0133] Also in this eighth embodiment the thickness size
(standardized) of the adapter 1L is different from the standardized
size of RSMMC, and the adapter 1L has a first portion which is
relatively thin and a second portion which is relatively thick.
[0134] The first portion which is relatively thin has a thickness
D1 of, say, 1.4 mm which is the same as the thickness size
(standardized) of the ordinary RSMMC. As in the first embodiment, a
terminal region and guide rail regions GR are arranged on a back
surface of the adapter 1L. For example, thirteen external terminals
2 are arranged in two rows in the transverse direction of the
adapter 1L (in the longitudinal direction of the extremely
small-sized memory card or in the direction of insertion of the
extremely small-sized memory card into the adapter 1L) in an
exposed state to the exterior. The guide rail regions GR are the
same as in the first embodiment.
[0135] On the other hand, in the relatively thick, second portion
thicker than the first portion, a protuberant portion H is formed
on the back surface of the adapter 1L. The thickness D2 of the
relatively thick, second portion is the same as in the first
embodiment. A planar layout of the protuberant portion H in the
relatively thick, second portion is the same as in the second
embodiment. That is, in the adapter 1L of this eighth embodiment,
the protuberant portion H in the relatively thick, second portion
is formed over the rear face of the adapter 1L from a position
spaced a length L3 from the outer periphery of the second row (rear
row) of external terminals 2. A planar layout of the protuberant
portion H may be such a layout as in the first embodiment. Further,
an opening 3 is formed in the rear face of the adapter 1L. The
shape and size of the opening 3 are the same as in the first
embodiment.
[0136] Next, FIG. 45 is an entire plan view of the upper surface of
the adapter after loading thereto of an extremely small-sized
memory card, FIG. 46 is an entire plan view of the back surface of
the adapter after loading thereto of the extremely small-sized
memory card, FIG. 47 is a sectional view taken on line X3-X3 in
FIG. 45, and FIG. 48 is a plan view of the adapter, showing an
example of layout of connector wiring within the adapter. In FIGS.
45, 46 and 48, the memory card present within the adapter 1L is
shown in a see-through state. Broken lines in FIGS. 45 and 46 each
represent the center in the transverse direction of the adapter 1L
(in the longitudinal direction of the memory card 5 or in the
direction of insertion of the memory card 5 into the adapter
1L).
[0137] The configuration of the memory card 5 is the same as in the
first to seventh embodiments. In this case, the length in the
longitudinal direction of the memory card 5 is larger than half of
the length in the transverse direction of the adapter 1L. The
memory card 5 is inserted with its rear side ahead into the adapter
1L. The reason is that, in the case of RSMMC, the length in the
direction of insertion of the memory card 5 is shorter than MMC and
that therefore, if the memory card 5 is inserted with its front
side ahead into the adapter 1L, the external terminals 6 of the
memory card 5 are positioned in the layout region (terminal region)
of the external terminals 2 of the adapter 1L, thus making it
impossible to arrange therein the internal terminals 10a of the
adapter 1L.
[0138] The adapter 1L includes a first case (first housing) 8c on
its upper surface side and a second case (second housing) 8d on its
back surface side. The first case 8c has an upper surface (first
surface) and a back surface (second surface) which are positioned
on mutually opposite sides in the thickness direction of the
adapter 1L. The plural external terminals 2 are arranged on the
back surface of the first case 8c and the second case 8d is joined
to the back surface of the first case.
[0139] In the adapter 1L, the portion of only the first case 8c is
the relatively thin, first portion having the thickness D1, while
the joined portion between the first and second cases 8c, 8d is the
relatively thick, second portion having the thickness D2. That is,
the second portion 8d forms the protuberant portion H. Recesses 8c1
and 8d1 formed respectively in the opposed surfaces of the first
and second cases 8c, 8d overlap each other to form the card
receiving space 9. The card receiving space 9 is positioned
centrally in the width direction (longitudinal direction) of the
adapter 1L. The material and configuration of the first and second
cases 8c, 8d are the same as those of the first and second cases
8a, 8b described above.
[0140] The external terminals 2 are electrically connected
respectively to one ends of connector lines (wiring lines) 10.
Opposite ends of the connector lines 10 extend into the card
receiving space 9 and are electrically connected to internal
terminals 10a which are formed integrally at extending ends of the
connector lines 10. The configuration of the connector lines 10 and
that of the internal terminals 10a are the same as those described
in the first embodiment. Of the plural connector lines 10,
predetermined connector lines 10 are disposed in right and left
vacant regions (especially in the relatively thick, second portion)
in the width direction (transverse direction) of the memory card 5,
as shown in FIG. 48, whereby the connector lines 10 can be disposed
within a thin and small area of the adapter 1L. That is, the
thickness of the second portion of the adapter 1L is set to such a
thickness D2 as covers the sum of both thickness of the memory card
5 and height of the connector lines 10, whereby the space for both
memory card 5 and connector lines 10 can be ensured within the
adapter 1A.
Ninth Embodiment
[0141] FIG. 49 is an entire perspective view of an adapter
according to a ninth embodiment of the present invention as seen
from an upper surface side and FIG. 50 is an entire perspective
view of the adapter of FIG. 49 as seen from the upper surface side
after loading of a memory card thereto.
[0142] In this ninth embodiment, as in the fifth embodiment, etc.,
an opening (second opening) 15 is formed in an upper surface of an
adapter 1M for RSMMC so as to extend from the opening 3 toward the
card receiving space 9. The guide portions 16 described above are
formed at upper positions of both inner side faces of the opening
15. Also in this case, as shown in FIG. 50, When a memory card 5 is
inserted into the card receiving space 9, its upper surface assumes
an exposed state to the exterior. Also in this ninth embodiment it
is possible to obtain the same effects as in the fifth
embodiment.
[0143] Since the memory card 5 is inserted in the reverse
direction, the stopper portion described above is not formed on the
rear face of the memory card 5. Other constructional points are the
same as in the first to eighth embodiments.
Tenth Embodiment
[0144] FIG. 51 is a sectional view of a memory card according to a
tenth embodiment of the present invention as cut in parallel with a
side face thereof and FIG. 52 is a sectional view of the memory
card of FIG. 51 as cut in parallel with a rear face thereof.
[0145] A memory card (semiconductor device or IC card) 25A
according to this tenth embodiment is employable as an auxiliary
storage device in any of various portable electronic devices,
including image processors such as digital cameras and
communication devices such as portable telephones.
[0146] The memory card 25A is constituted by a small thin plate of
a rectangular plane shape having a large chamfered portion CA1 for
index at one corner for example. It outline dimensions are, for
example, 24 mm in width W1, 32 mm in length L1, and 1.4 mm in
thickness D1. The memory card 25A has the same planar size and
function as those of the so-called full-size MMC. An upper surface
(first surface) of the memory card 25A is the same as in FIG. 3,
while a back surface (second surface) of the memory card 25A is the
same as in FIGS. 4 and 22. Length L10 is, say, about 6.5 mm and
length L11 is, say, about 24.7 mm.
[0147] However, the thickness size (standardized) of the memory
card 25A of this tenth embodiment is different from the
standardized size of MMC and the memory card 25A includes a first
portion which is relatively thin and a second portion which is
relatively thick.
[0148] In the relatively thin, first portion, a terminal region and
guide rail regions GR are disposed on the back surface of the
memory card 25A. The external terminals 2 described above are
disposed in the terminal region in an exposed state to the
exterior. The layout of the external terminals 2 is the same as in
the first to ninth embodiments. The guide rail regions GR are also
the same as in the first embodiment. On the other hand, in the
relatively thick, second portion which is thicker than the first
portion there is formed a protuberant portion H which protrudes
slightly in a direction away from the back surface of the memory
card 25A. The thickness D2 of the relatively thick, second portion
is set at, say, about 1.6 to 2.1 mm (preferably 1.6 to 1.7 mm).
[0149] The memory card 25A includes a first case (first housing)
8e, a second case (second housing) 8f and a memory body 26.
[0150] The memory body 26 includes a wiring substrate 27, plural
semiconductor chips (hereinafter referred to simply as chips) 28a
mounted on a main surface (first surface) of the wiring substrate
27, a sealing portion (first resin sealing body) 29a which seals
the chips 28a, a chip (electronic part) 28b mounted on a back
surface (second surface) of the wiring substrate 27, and a sealing
portion (second resin sealing body) 29b which seals the chip
28b.
[0151] The wiring substrate 27 which constitutes the memory body 26
includes the main surface (first surface) and the back surface
(second surface) which are opposite to each other in the thickness
direction of the wiring substrate. The wiring substrate 27 is
constituted by, for example, one or two or more multiple metal
wiring layers (wiring lines) disposed within an insulator such as,
for example, glass fabric-based epoxy resin. Wiring lines on the
main surface (first surface) of the wiring substrate 27 are
electrically connected via through holes to the wiring lines on the
back surface (second surface) of the wiring substrate 27 and the
plural external terminals 2. The external terminals 2 are for
electric connection between the memory card 25 and the electronic
device, with terminals of the electronic device being brought into
contact with the external terminals 2.
[0152] Flash memory circuits which contribute to the storage of
information are formed respectively on the plural chips 28a
provided on the main surface of the wiring substrate 27, providing
a total memory capacity of, say, 16 M bytes (128M bits), 32 M bytes
(256M bits), or 64 M bytes (512M bits). In the illustrated example,
the plural chips 28a for memory are stacked in the thickness
direction of the wiring substrate 27, whereby a large capacity can
be ensured at a small occupied area. Of course, a desired memory
capacity may be obtained by arranging the plural chips 28a for
memory on the main surface of the wiring substrate 27. The chips
28a are electrically connected respectively to the wiring lines of
the wiring substrate 27 through bonding wires (hereinafter referred
to simply as wires) 30a and are thereby further connected
electrically to the chip 28b and the external terminals 2. For
example, the wires 30a are gold (Au) wires.
[0153] The sealing portion 29a which seals the plural chips 28a is
formed using a thermosetting resin such as, for example, an
orthocresol novolak type epoxy resin or a biphenyl type epoxy resin
and it is one of principal objects thereof to seal the chips 28a
and the wires 30a in a satisfactory manner. Within the sealing
portion 29a are included plural fine fillers of quartz glass, e.g.,
silicon dioxide (SiO.sub.2), harder than the resin for improving
the mechanical strength, low hygroscopicity and moldability and for
adjusting (lowering) the thermal expansion coefficient with respect
to the sealing portion 29a for example. Further included in the
sealing portion 29a are an accelerator (a catalyst for accelerating
the reaction of the resin), a mold release agent, a flame retardant
and a colorant. As the colorant there are used carbon grains. The
first case 8e is joined over the whole main surface of the wiring
substrate 27 so as to cover the sealing portion 29a. The material
of the first case 8e is the same as that of the first case 8a.
[0154] On the other hand, a controller circuit for controlling the
operation of the flash memory circuit of each of the chips 28a for
example is formed in the chip 28b mounted on the back surface of
the wiring substrate 27. The chip 28b is electrically connected to
wiring lines on the wiring substrate 27 through wires 30b and is
electrically connected through the wiring lines to the chips 28a
for memory and the external terminals 2. The wires 30b are formed
of gold (Au) for example. Since the chip 28b is disposed on the
back surface of the wiring substrate 27, it is possible to dispose
a large number of chips 28a for memory on the main surface side of
the wiring substrate 27. Consequently, the memory capacity can be
increased without changing the planar size of the memory card
25A.
[0155] The chip 28b may be substituted, for example, by a
dielectric antenna, a ferrite part for Blue Tooth, or a chip part
(electronic part) having a passive element such as coil, capacitor
or resistor (e.g., pull-up resistor). In this case, the passive
element can be disposed closer to the flash memory circuit and
control circuit and hence it is possible to improve electrical
characteristics of the memory card 25A.
[0156] The sealing portion 29b which seals the chip 28b is formed
of the same material as that of the sealing portion 29a and it is
one of main objects thereof to seal the chip 28b and the wires 30b
in a satisfactory manner. The case 8f is joined to the back surface
of the wiring substrate 27 at a position spaced a length L3 from
the second row (rear row) of external terminals 2 of the memory
card 29b so as to cover the sealing portion 29b. The protuberant
portion H is formed by the second case 8f. The reason why the
spacing from the second row of external terminals 2 is set at L3 is
the same as that set forth in the first embodiment. The material of
the second case 8f is the same as that of the first case 8a.
Eleventh Embodiment
[0157] FIG. 53 is a sectional view of a memory card according to an
eleventh embodiment of the present invention as cut in parallel
with a side face thereof and FIG. 54 is a sectional view of the
memory card of FIG. 53 as cut in parallel with a rear face
thereof.
[0158] In a memory card 25B of this eleventh embodiment, the second
case 8f described above is not joined to a back surface of the
memory card 25B and a sealing portion 29b is exposed to the
exterior. In this case, a protuberant portion H corresponds to only
the thickness of the sealing portion 29b, so that the thickness D2
of the second portion can be made smaller than in the case of the
memory card 25A of the tenth embodiment. Since the sealing portion
29b is exposed, there is a fear that constituent portions such as
terminals and guide rails of the electronic device may be damaged
or deteriorated by for example fillers contained in the sealing
portion 29b. In this case, it is preferable to make the amount of
fillers contained in the sealing portion 29b smaller than that
contained in the main surface-side sealing portion 29a or use
fillers smaller in particle diameter than the fillers contained in
the sealing portion 29a. Other constructional points are the same
as in the tenth embodiment.
Twelfth Embodiment
[0159] FIG. 55 is a sectional view of a memory card according to a
twelfth embodiment of the present invention as cut in parallel with
a side face thereof and FIG. 56 is an enlarged sectional view of a
principal part of a second portion on a back surface side of the
memory card of FIG. 55.
[0160] A memory card (semiconductor device or IC card) according to
this twelfth embodiment has the same planar size and function as
those of the so-called RSMMC, e.g., 24 mm in width W1 and 18 mm in
length L5. An upper surface (first surface) of the memory card 25C
is the same as in FIG. 40 and a back surface (second surface)
thereof is the same as in FIG. 41. Length L12 is, say, about 10.6
mm.
[0161] Also in the case of the memory card 25C of this embodiment,
its thickness size (standardized) is different from the standard of
RSMMC and the memory card 25C includes a first portion which is
relatively thin and a second portion which is relatively thick. The
relatively thin, first portion has a thickness D1 equal to the
thickness size (standardized) of the ordinary RSMMC, e.g., 1.4
mm.
[0162] In the relatively thin, first portion, a terminal region and
guide rail regions GR are disposed on the back surface of the
memory card 25C. As in the first to eleventh embodiments, external
terminals are arranged in the terminal region in an exposed state
to the exterior. The guide rail regions GR are also the same as in
the first embodiment. On the other hand, in the relatively thick,
second region which is thicker than the first region there is
formed a protuberant portion H which slightly protrudes in a
direction away from the back surface of the memory card 25C. The
relatively thick, second portion has a thickness D2 of, say, about
1.6 to 2.1 mm (preferably 1.6 to 1.7 mm).
[0163] The memory card 25C includes a first case (first housing)
8g, a second case (second housing) 8h, and a memory body 26.
[0164] The memory body 26 includes a wiring substrate 27, plural
chips 28a, 28b mounted on a main surface (first surface) of the
wiring substrate 27, a sealing portion (first resin sealing body)
29a for sealing the chips 28a and 28b, a passive element
(electronic part) 31 mounted on a back surface (second surface) of
the wiring substrate 27, and a sealing portion (second resin
sealing body) 29b for sealing the passive element 31. The wiring
substrate 27, chips 28a, 28b and sealing bodies 29a, 29b are the
same as in the tenth and eleventh embodiments.
[0165] It is one of principal objects of the sealing portion 29b to
seal the passive element 31 in a satisfactory manner. Also in the
memory card 25C, the second case 8h described above is jointed to
the back surface of the wiring substrate 27 so as to cover the
sealing portion 29b at a position spaced a distance L3 from the
second row (rear row) of external terminals 2 of the memory card.
The protuberant portion H is formed by the second case 8h. The
reason why the spacing is set at the length L3 is the same as that
set forth in the first embodiment. The material of the first and
second cases 8g, 8h is the same as that of the first case 8a
described above.
[0166] In the illustrated example, a pull-up resistor is shown as
the passive element 31 which resistor is connected in series with
an external terminal 2 for signal to prevent the occurrence of
ringing waveform of a high-speed signal. The passive element 31
includes electrodes 31a spaced apart a desired distance from each
other and carbon paste 31b which is deposited so as to bridge the
electrodes 31a. The electrodes 31a are formed, for example, by
plating the surface of a copper (Cu) body with silver (Ag) and are
connected electrically to the aforesaid external terminal 2 and
chips 28a, 28b through wiring lines of the wiring substrate 27. A
resistor (pull-up resistor) is formed by the carbon paste 31b
present between the adjacent electrodes 31a. For example, a
printing method is used to form such a pull-up resistor. Thickness
D1 is, say, about 100 .mu.m.
[0167] When the pull-up resistor is formed within a chip, there
occur variations in resistance value due to a heat treatment which
is performed during fabrication of the chip, and thus it is
impossible to form within a chip a pull-up resistor for which a
high accuracy is required. On the other hand, if the pull-up
resistor is disposed on the electronic device side, it may be
impossible to obtain satisfactory electrical characteristics
because of a too long distance between memory circuit and control
circuit. In this twelfth embodiment, it is possible to improve the
resistance value setting accuracy in comparison with the case where
the resistor is formed within a chip. Moreover, since the passive
element 31 for the pull-up resistor is provided on the back surface
of the memory card 25C, it is possible to shorten the distance from
the passive element 31 to the chips 28a for memory and the chip 28b
for control. As a result, it is possible to improve the electrical
characteristics of the memory card 25C. The pull-up resistor may be
substituted by, for example, a dielectric antenna, a ferrite part
for Blue Tooth, or another passive element 31 having a thickness
falling under the range of the thickness D2 such as a coil or a
capacitor.
Thirteenth Embodiment
[0168] FIG. 57 is a sectional view of a memory card according to
thirteenth embodiment of the present invention as cut in parallel
with a side face thereof.
[0169] In a memory card 25D of this thirteenth embodiment, the
second case 8h described above is not joined to a back surface of
the memory card 25D, but a sealing portion 29b is exposed to the
exterior. In this case, a protuberant portion H corresponds to only
the thickness of the sealing portion 29b and therefore it is
possible to make the thickness of the second portion D2 smaller
than in the memory card 25C of the twelfth embodiment. Since the
sealing portion 29b is exposed, there is a fear of damage or
deterioration of terminals of the electronic device or such
components as guide rails by for example fillers contained in the
sealing portion 29b. In this case, it is preferable to make the
amount of fillers contained in the sealing portion 29b smaller than
that of fillers contained in the main surface-side sealing portion
29a or use fillers smaller in particle size than the fillers
contained in the sealing portion 29a. Other constructional points
are the same as in the twelfth embodiment.
[0170] Although the present invention has been described above
concretely by way of embodiments thereof, it goes without saying
that the invention is not limited to the above embodiments, but
that various changes may be made within the scope not departing
from the gist of the invention.
[0171] For example, although in the tenth to thirteenth embodiments
each chip and the wiring substrates are electrically connected with
each other through wires, no limitation is made thereto. The chip
and the wiring substrates may be electrically connected with each
other through bump electrodes. In this case, the chip is mounted on
the wiring substrate through bump electrodes in a state in which
its main surface is opposed to the main surface of the wiring
substrate. Components on the main surface of the chip are connected
to wiring lines of the wiring substrate through bump electrodes and
are further connected electrically to external terminals.
[0172] Although the present invention has been described above
mainly about the case where it is applied to a portable computer, a
digital camera or a portable telephone as a background application
field thereof, no limitation is made thereto. The present invention
is applicable also to other mobile information processors such as,
for example, PDA (Personal Digital Assistants).
INDUSTRIAL APPLICABILITY
[0173] The present invention is applicable to the manufacturing
industry of memory card adapters and memory cards.
* * * * *